JP2014089737A - Molding member and translucent type input device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a molding member that can reduce a step in a boundary between members even if a decorative layer is made thick in a molding member formed of a transparent member and a decorative member, and to provide a translucent type input device employing the molding member.SOLUTION: A molding member 10 has: a transparent member 30 that transmits visible light; and a decorative member 40 that does not transmit the visible light. In the molding member, a window-shape translucent area 11 transmitting light in a thickness direction and a non-translucent area 12 surrounding the translucent area are formed. The transparent member 30 is provided across over the translucent area 11 and the non-translucent area 12, and on one face of the translucent area 11, a continuous face of the translucent area 11 and the non-translucent area 12 is formed. The decorative member 40 is provided so as to form a laminate body with the transparent member 30 in the non-translucent area 12, and a thickness of the transparent member 30 in the translucent area 11 in the vicinity of a boundary between the translucent area 11 and the non-translucent area 12 is thicker than that of the translucent member 30 in the non-translucent area 12.

Description

  The present invention relates to a molded member and a translucent input device, and more particularly to a molded member having a translucent region and a translucent input device using the molded member as a surface protection member.

  Currently, a portable electronic device or the like is provided with a translucent input device that is placed over a display device. The translucent input device is mainly configured of a translucent base material, and an input operation can be performed by touching a detection area on the display screen with a finger or the like while visually confirming display contents through the translucent base material.

Input operation detection methods are classified into several methods, such as a resistive film type and a capacitance type. In the capacitance type, a translucent X conductive layer extending in the X direction and a translucent Y conductive layer extending in the Y direction are opposed to each other in the detection region, and the X conductive layer and the Y conductive layer are alternately arranged. A potential is applied. When a person's finger having a substantially ground potential approaches, an electrostatic capacitance is formed between the X conductive layer and the Y conductive layer and the finger, and a voltage or current when a potential is applied to the X conductive layer or the Y conductive layer is increased. Change. By detecting this change, the position where the finger approaches is detected.

Such a capacitance-type translucent input device is integrally provided with a surface protection member in order to protect the sensor unit. One surface of the surface protection member is an input operation surface, and a sensor substrate having a translucent X conductive layer and a Y conductive layer is bonded to the other surface by an adhesive layer. Since the surface protection member is formed of a transparent member so that the screen area of the display device and the translucent input device is a translucent area, the other area including the wiring pattern portion of the sensor substrate is a non-translucent area. Thus, an opaque decorative member is required.

As a method for forming such a transparent member and a decorative member, there is a molding method called two-color molding (double molding) for producing an integrated product made of two kinds of resins. In the two-color molding process, the first material is molded with the primary molding die, the mold is opened once, and then the second material is molded with the secondary molding die to which the primary molded product is fixed. Remove from mold. Since the surface protection member constituted by two-color molding or the like forms a boundary between the members, one surface (outer surface side) or the other surface (inner surface side) of the surface protection member, or both sides thereof, The boundary between members will be exposed.

  On the other hand, since it is desirable that the translucent input device is integrated with the casing of the electronic device, the surface protection member may be manufactured so as to constitute a part of the casing of the electronic device. Since the surface protection member constituted by the two-color molding causes a step between the members, it is difficult to narrow the frame to narrow the outer peripheral portion of the screen region in order to bond the transparent member and the sensor substrate. In Patent Document 1, in a glass insert-molded product with a capacitance sensor in which a capacitive sensor substrate is bonded to a flat glass integrated with a resin frame, an input region of the sensor substrate is bonded to an inner region of the resin frame. In order to match, a narrow frame structure in which the shape of the resin frame is an inclined surface is described.

JP 2009-154479 A

However, as shown in FIGS. 12 and 13, in the molding member 110 having the resin frame 190 having an inclined surface, a narrow frame structure with the inclined surface can be provided only on two opposite sides of the rectangular screen. there were. Since the sensor substrate 20 cannot be deformed corresponding to all the inclined surfaces of the four sides of the rectangle, any one of the two opposing two sides is formed between the outer periphery of the sensor substrate 20 and the resin frame 190. It must be designed to have a planar distance (FIG. 13). Therefore, it was impossible to obtain the molding member 110 having a narrow frame structure on all four sides of the rectangle. Moreover, since it affixed on an inclined surface, there existed concern about the reliability fall of the deformed sensor board | substrate 20, and the deterioration of the affixing strength of the adhesion layer 70.

  Furthermore, in order to make the wiring pattern portion of the sensor substrate 20 a non-light-transmitting region, a decorative member 140 such as decorative printing is required on the flat glass 130 in advance, and thus the resin formed by insert molding with the decorative member 140. The frame 190 was formed by a different member in a separate process. When viewed from the operator, the light-transmitting region is slightly smaller than the resin frame 190, and the decorative member 140 is visible along the four sides of the flat glass 130. Furthermore, the inner-surface-side frame shape of the resin frame 190 is designed to match the decorating member 140 in a planar manner, and must be molded as designed. Moreover, integrally molding members with different linear expansion coefficients, such as glass and resin, has the restriction that resin materials and coloring materials cannot be freely selected. There were many mass production issues. Moreover, since the level | step difference of the decorating member 140 and the plane glass 130 is produced, the decorating member 140 was not able to be thickened.

Then, this invention is for solving the problem of the level | step difference in the boundary between members in the shaping | molding member formed with the transparent member and the decorating member, and even if it makes a decorating member thick, a level | step difference can be reduced. An object of the present invention is to provide a molded member and a translucent input device using the molded member.

The molded member of the present invention has a transparent member that transmits visible light and a decorative member that does not transmit visible light, and has a window-like light transmitting region that transmits light in the thickness direction, and the light transmitting region. And the transparent member is provided across the light-transmitting region and the non-light-transmitting region, and the light-transmitting region and the non-light-transmitting region are provided on one surface of the light-transmitting region. Forming a continuous surface with the translucent region, and the decorative member is provided so as to form a laminate with the transparent member of the non-translucent region, the translucent region and the non-translucent region The thickness of the transparent member in the light-transmitting region in the vicinity of the boundary is larger than the thickness of the transparent member in the non-light-transmitting region.

  Therefore, in the molded member of the present invention, one surface of the translucent region is continuously formed of the transparent member over the non-translucent region, and the thickness of the molded member in the vicinity of the boundary between the translucent region and the non-translucent region is It can be constituted by a transparent member. Thereby, the outer surface as the surface protection member of the translucent input device can be formed only with the transparent resin, and the inner surface can be formed so as to reduce the level difference. Therefore, there is no problem of a step at the boundary between members, and the step can be reduced even if the decorative layer is thickened.

Furthermore, it is desirable that the transparent member is a molding resin made of a translucent material and includes an outer shape having a curved surface in the non-translucent region. If it carries out like this, it can be processed into the free shape according to the housing | casing design, and the frame part required for the outer periphery of a translucent area | region can be made into a narrow frame structure.

In the molded member of the present invention, the other surface of the light-transmitting region has a boundary between the light-transmitting region and the non-light-transmitting region so that the decorative member surrounds the transparent member. In addition, it is preferable that the light-transmitting region is provided in a stepped shape that is convex with respect to the non-light-transmitting region. In this way, when used as a surface protection member of a translucent input device, even if a gap may remain in the adhesive layer in the non-translucent area and air bubbles may be generated, no gap remains in the translucent area. Can be attached so that there is no. Therefore, even if bubbles are generated during the bonding of the sensor substrates, they are not visually recognized by the operator.

In the molded member of the present invention, the decorative member is preferably a molded resin made of a colored material. If it carries out like this, if it is a resin member designed so that it may have moderate intensity | strength, it can serve as a reinforcement member. Accordingly, the strength can be increased even when the molded member is used as a casing having a thin transparent member.

Furthermore, it is desirable that the decorative member is a molded resin having a curved surface shape. If it carries out like this, it can process into the free shape according to the housing | casing design.

Furthermore, the other surface of the translucent region has at least a transparent resin film that covers the translucent region, and the translucent region and the non-translucent region so that the decorative member surrounds the transparent member. And the decorative member and the transparent member may have a structure in which the transparent resin film is provided so as to have a gradual step shape. In this way, even if there is a variation in the formed member during mass production and a step is generated, it is possible to form a gentle inclined shape that does not cause a problem. Therefore, when used as a surface protection member of a translucent input device, it is possible to prevent a void from being left in the adhesive layer when the sensor substrate is bonded, so that a defect in which bubbles are generated can be prevented.

It is desirable that one surface of the translucent region has a hard coat that covers the surface of the transparent member. This can prevent the surface of the transparent member from being damaged.

A translucent input device according to the present invention includes a sensor substrate on which a sensor electrode for detecting an input operation and a wiring pattern for electrical connection are formed, a molded member having one surface as an input operation surface, and the sensor substrate. An adhesive layer that adheres the molded member, and the molded member includes a transparent member that transmits visible light and a decorative member that does not transmit visible light, and transmits light in the thickness direction. A window-like translucent area and a non-translucent area surrounding the translucent area are formed, and the transparent member is provided across the translucent area and the non-translucent area, and the input operation Forming a continuous surface of the translucent region and the non-translucent region on the surface, the decorative member is provided to form a laminate with the transparent member of the non-translucent region,
The thickness of the transparent member in the light-transmitting region in the vicinity of the boundary between the light-transmitting region and the non-light-transmitting region is formed to be thicker than the thickness of the transparent member in the non-light-transmitting region. The other surface of the member has the light transmitting region through the adhesive layer so that the sensor electrode and the light transmitting region overlap in a plane and the wiring pattern and the non-light transmitting region overlap in a plane. The sensor substrate is bonded to a region including a region and the non-light-transmitting region.

Therefore, in the molding member of the translucent input device, the input operation surface is continuously formed of the transparent member over the translucent region and the non-translucent region, and the molding member near the boundary between the translucent region and the non-translucent region is formed. The thickness can be constituted by a transparent member. Thereby, the outer surface as the surface protection member of the translucent input device can be formed only with the transparent resin, and the inner surface can be formed so as to reduce the level difference. Therefore, there is no problem of a step at the boundary between members, and the step can be reduced even if the decorative layer is thickened. In this way, the translucent input device can realize a structure in which the sensor substrate is bonded together without forcibly deforming the sensor substrate.

In the translucent input device, it is preferable that the transparent member is a molded resin made of a translucent material and includes an outer shape having a curved surface in the non-translucent region. By doing so, it is possible to realize a translucent input device that can be processed into a free shape according to the housing design and that has a frame portion that is necessary for the outer periphery of the input region.

Further, in the molded member of the translucent input device, the other surface of the translucent area is formed with a boundary between the translucent area and the non-translucent area so that the decorative member surrounds the transparent member. And is provided in a stepped shape in which the translucent region is convex with respect to the non-translucent region,
Is preferred. If it carries out like this, even if a bubble remains in the said non-light-transmissive area | region as a translucent input device, it can bond together so that the said translucent area | region may not leave a space | gap. Therefore, even if bubbles in the non-translucent area remain, the operator does not see them, so that the problem of generating bubbles that can be visually recognized in the translucent area can be solved.

The decorative member of the translucent input device is preferably a molded resin made of a colored material. Any resin member designed to have an appropriate strength can also serve as a reinforcing member. If it carries out like this, intensity | strength can be increased even if a transparent member is thin as a translucent input device.

The decorative member of the translucent input device is preferably a molded resin having a curved shape. If it carries out like this, as a translucent input device, it can process into the free shape according to the housing | casing design to attach.

The other surface of the molding member of the translucent input device has at least a transparent resin film that covers the translucent region, and the translucent region and the non-transparent so that the decorative member surrounds the transparent member. A structure may be employed in which the transparent resin film is provided so that the decoration member and the transparent member have a gentle step shape while forming a boundary with the light region. In this way, even if there is a variation in molded parts during mass production and a step is created, the step can be made into a gentle slanted shape that does not cause a problem, so the adhesive layer follows and the sensor substrate of the translucent input device is surely secured. It is possible to paste on. Therefore, it is excellent in reliability as a translucent input device.

It is preferable that the input operation surface of the translucent input device has a hard coat that covers the surface of the transparent member. In this way, when the translucent input device is used as a casing, it is possible to prevent the outer surface from being damaged, so that the aesthetic appearance is not impaired for a long time.

  According to the present invention, the molding member is formed such that one surface of the translucent region is continuously formed of the transparent member over the non-translucent region, and the thickness of the molding member in the vicinity of the boundary between the translucent region and the non-translucent region. Can be constituted by a transparent member. Therefore, there is no problem of a step at the boundary between members, and the step can be reduced even if the decorative layer is thickened.

According to the present invention, in the translucent input device, the input operation surface is continuously formed of the transparent member over the translucent area and the non-translucent area, and the molded member near the boundary between the translucent area and the non-translucent area Can be made of a transparent member. Thereby, the outer surface as the surface protection member of the translucent input device can be formed only with the transparent resin, and the inner surface can be formed so as to reduce the level difference. Therefore, there is no problem of a step at the boundary between members, and the step can be reduced even if the decorative layer is thickened. In this way, the translucent input device can realize a structure in which the sensor substrate is bonded together without forcibly deforming the sensor substrate.

It is a perspective view which shows the translucent input device in the 1st Embodiment of this invention. It is sectional drawing which cut | disconnected the translucent input device in 1st Embodiment by the FIG. 1 II-II line. It is a schematic diagram of the wiring pattern part of the sensor board explaining 1st Embodiment. It is a fragmentary sectional view showing the modification in the forming member of a 1st embodiment. It is a fragmentary sectional view showing the modification in the forming member of a 1st embodiment. It is a fragmentary sectional view showing the modification in the forming member of a 1st embodiment. It is a fragmentary sectional view showing the modification in the forming member of a 1st embodiment. It is the fragmentary sectional view which expanded a part of shaping | molding member which shows 2nd Embodiment. It is a fragmentary sectional view showing the modification in the forming member of a 2nd embodiment. It is sectional drawing which shows the shaping | molding member of 3rd Embodiment. It is sectional drawing which shows the shaping | molding member of 4th Embodiment. It is a schematic cross section which shows the conventional shaping | molding member with an electrostatic capacitance sensor. It is a schematic cross section of the other direction in the conventional shaping | molding member with an electrostatic capacitance sensor.

<First Embodiment>
The translucent input device 1 shown in FIGS. 1 and 2 is mounted on various electronic devices such as a mobile device such as a mobile phone and a portable information terminal, a game device, a camera, and a video photographing device. These electronic devices have a display device, and information necessary for operation is displayed on a display screen. The translucent input device 1 is installed in front of the display screen of the display device so that the input operation can be detected and the display screen can be visually recognized. The display device is a self-luminous type such as a liquid crystal display panel or an electroluminescence panel having an illumination device on the back.

FIG. 1 is a perspective view of a translucent input device 1 and a lower housing 50 of an electronic device into which the translucent input device 1 is fitted. FIG. 2 is a cross-sectional view of the translucent input device 1 taken along the line II-II in FIG. is there. The translucent input device 1 includes a molded member 10, a sensor substrate 20 having an electrode pattern formed on the surface, a flexible printed circuit board (not shown), and the like. The molding member 10 can be molded so as to be fitted to the lower housing 50 of the electronic device, and constitutes a part of the housing of the electronic device. Although omitted in FIG. 1, an electronic circuit board, a display device, a power source (battery), and the like of the electronic device are housed and fixed in the lower housing 50 and connected.

As shown in FIG. 2, the molding member 10 is a surface protection member that protects the sensor substrate 20 and includes a translucent region so that the display screen can be visually recognized. Note that translucency in this specification means that the average transmittance of visible light is 60% or more. As shown in FIG. 1 and FIG. 2, the input operation area is divided into a translucent area 11 and a colored non-translucent area 12 surrounding the translucent area 11. An opaque decorative member 40 is provided in the non-light-transmissive region 12.

  One surface of the molding member 10 as the surface protection member is the input operation surface 10a, and the other substrate is adhered to the sensor substrate 20 including the base member 60 having the translucent upper electrode 23 and the lower electrode 24. The layers 70 are bonded together. The substrate 60 is a film substrate such as polyethylene terephthalate (PET). Each of the upper electrode 23 and the lower electrode 24 is a transparent conductive material such as ITO (Indium Tin Oxide), and is formed on the surface of the substrate 60 by sputtering or vapor deposition.

The translucent input device 1 according to the present embodiment includes an upper electrode 23 and a lower electrode 24 arranged inside the translucent area 11 when the translucent area 11 that is an input operation area is operated with a finger, and the finger. Based on the capacitance change that occurs, the operation coordinate position of the finger is detected.

FIG. 3 is a schematic plan view for explaining the sensor substrate 20 in more detail. In FIG. 3, the upper electrode 23 and the lower electrode 24 disposed inside the light-transmitting region 11 are omitted, the upper wiring pattern 25 is a solid line (surface on the molding member side of the base material 60), and the lower wiring pattern 26 is a dotted line (base material). 60 on the side different from the molded member side). A wiring pattern portion 21 of the sensor substrate 20 is disposed in the non-light-transmitting region 12. In the wiring pattern portion 21, the upper electrode 23 is connected to the upper wiring pattern 25 and the lower electrode 24 is connected to the lower wiring pattern 26. In addition, electrical connection portions 27 between the upper wiring pattern 25 and the lower wiring pattern 26 and the flexible printed circuit board are provided.

The molding member 10 is formed of the transparent member 30 so that the screen area of the display device 80 and the translucent input device 1 is the translucent area 11, but other areas including the wiring pattern portion 21 of the sensor substrate 20 are formed. An opaque decorative member 40 is provided so as to be the non-light-transmitting region 12. Here, the transparent member 30 is a member formed of a non-colored material having a visible light transmittance of 60% or more, and a transparent resin is used. The decorative member 40 is a member having a colored base material or a colored decorative print layer, and a resin is used as the base material.

As shown in FIGS. 2 and 3, the wiring pattern portion 21 of the sensor substrate 20 is bonded via the adhesive layer 70 so as to overlap the non-light-transmitting region 12 formed by the decorative member 40 in a plan view. The adhesive layer 70 is, for example, a translucent acrylic resin-based adhesive tape, and absorbs and adheres to the respective steps of the bonding surfaces of the molded member 10 and the sensor substrate 20.

  In the molding member 10 of the present embodiment, the sensor substrate 20 that overlaps the translucent region 11 formed by the transparent member 30 and the non-translucent region 12 formed by the decorative member 40 in a plan view is bonded with the adhesive layer 70. Therefore, the sensor substrate 20 is bonded together by changing the thickness of the transparent member 30 between the translucent region 11 and the non-translucent region 12 surrounding the translucent region 11 according to the thickness of the decorative member 40. It is characterized in that the region is formed on a substantially flat surface. As a result, a narrow frame structure in which the wiring pattern portion 21 of the sensor substrate 20 is hidden by the decorating member 40 and the non-light-transmitting region 12 is a minimum frame is possible. Moreover, since the decorating member 40 comprises all the non-light-transmissive area | regions 12, the other member for light shielding is not required.

  The molding member 10 that is a part of the casing as shown in FIG. 1 is generally formed by resin molding because the outer shape is designed to have a curved surface. The cross-sectional shape of the molded member 10 is shown in FIGS. 4 to 7 in addition to FIG. The curved shape of the outer shape may be a shape as shown in FIG. 2, or may be an arc shape or other curved surface. It can be processed into a free shape according to the housing design, and the outer periphery of the translucent region 11 can be formed into a narrow frame structure. Therefore, the translucent input device 1 in which the frame portion necessary for the outer periphery of the input region has a narrow frame structure can be realized.

In order to clarify the configuration and the effect in the present embodiment, a description will be given by comparison with a conventional example. As in Patent Document 1, a glass insert molded product in which a flat glass is used for the light-transmitting region 11 that is a screen region and a resin-molded frame is provided around the glass may be used. When the decorative member 40 is formed by insert molding of flat glass without applying the present invention, a step is generated on both the outer surface side and the inner surface side.

Further, the step on the inner surface side and its influence are as follows. The thickness of the molding resin or glass substrate is generally 300 μm to 1100 μm. In the configuration in which the decorative member 40 is laminated on a flat plate, a step of about 10 μm to 20 μm is generated even when the decorative member 40 is made thinner than the thickness of the base material. On the other hand, the acrylic resin-based adhesive tape used for the adhesive layer 70 is generally about 20 μm to 100 μm thick, and it has been found that if a steep step of about 10 μm to 20 μm is generated, it is difficult to cover the adhesive layer with no gap. Yes. The steep step in the configuration in which the decorative member 40 is simply stacked makes it difficult to bond the sensor substrate 20 with the adhesive layer 70, and the translucent input device 1 has an important translucent screen area. This causes generation of bubbles of a size that can be visually recognized. A gap is generated in the adhesive layer 70 that bonds the molding member 10 and the sensor substrate 20, resulting in a visually inferior bubble defect, or the sensor substrate 20 is peeled off, resulting in poor characteristics such as sensor sensitivity and detection position accuracy. Probability is high. Moreover, a defect may become apparent due to changes in the temperature and humidity environment. Therefore, the structure which reduces the level | step difference which is the characteristics of this invention is very important.

Moreover, a translucent film may be insert-molded into a resin-molded frame. However, when glass or a film is used for the transparent member 30, the thickness of the transparent member 30 is usually a member having a constant thickness and the light-transmitting region 11 and the non-light-transmitting region 12 surrounding the light-transmitting region 11. It is not easy to change the height. In order to achieve the effect intended by the present invention, it is easier and desirable to form the transparent member 30 by general resin molding.

In addition, unlike the structure of this invention, after bonding the protective member which printed the decoration layer on the sensor board | substrate 20 side, the case where it bonds to the translucent surface protective member which has a flat surface is considered. In this case, a gap due to the mounting allowance of the sensor substrate 20 is inevitably generated, so that a separate member for blocking light transmitted through the gap is necessary. That is, only the member for having a sufficient effect as a decorating member increases.

Next, the characteristics of the molded member 10 of the present embodiment for integrating the transparent member 30 and the decorative member 40 by two-color molding will be described.

In the two-color molding process, the first material is molded with the primary molding die, the mold is opened once, and then the second material is molded with the secondary molding die to which the primary molded product is fixed. Take out from the mold. Since the molded member 10 formed by two-color molding or the like forms a boundary between the members, the one surface (outer surface side) or the other surface (inner surface side) of the molded member 10, or both sides thereof, The boundary between members will be exposed.

Ideally, the two-color molded resin member is formed as an integrated product without burrs or gaps, and there is no step at the boundary between the members. In color molded products, the difference in molding shrinkage specific to each plastic material (hereinafter simply referred to as shrinkage) becomes a problem. For example, warp deformation may occur due to a difference in shrinkage rate between the primary and secondary molding layers, and a gap may be formed between adjacent peripheral surfaces of the molding layers. Even when a clear warp deformation or the like cannot be confirmed by visual observation, internal stress may remain in the molding layer. Such a molding defect is caused by a difference in shrinkage ratio caused by different materials and different shapes such as glass and different plastic materials, and the countermeasures are extremely difficult. In particular, glass insert molded products are limited in resin material and coloring, and must use expensive materials.

Furthermore, in an actual mass production process, problems such as a step between members occur as a state after molding due to temperature control of mold heating, accuracy of attachment between a mold for secondary molding and a primary molded product, and the like. Therefore, in the cross-sectional shape as shown in FIG. 12, when a gap or a step is generated between the two-color molded members, the outer surface of the housing, which is the design surface, can be easily recognized by the light reflection. And that will miss that beauty.

Therefore, the molding member 10 of the present embodiment is formed by forming the outer surface side of the molding member 10 with a transparent member 30 as shown in FIG. 2 and FIG. 4 as a partial enlarged view of the modification of the first embodiment. The decorative member 40 is formed in two colors in the outer peripheral region surrounding the light transmitting region 11 on the inner surface side of the transparent member 30 to form the non-light transmitting region 12. By so doing, the outer surface side, which is the design surface, is formed only from the primary molded product, so that there is no problem of causing a step on the outer surface side.

  The transparent member 30 may be a general molding of a thermosetting resin or a thermoplastic resin.

  Further, the transparent member 30 is desirably formed of a thermoplastic resin. Typical materials for the thermoplastic resin include polycarbonate and polymethyl methacrylate resin-based polymer. If it is a thermoplastic resin, it can be easily molded and a material suitable for the purpose of use can be selected from many materials.

As described above, according to the present embodiment, the transparent member 30 is provided across the light-transmitting region 11 and the non-light-transmitting region 12, and the light-transmitting region 11 and the light-transmitting region 11 are disposed on one surface of the light-transmitting region 11. A continuous surface with the non-translucent region 12 is formed, and the decorative member 40 is provided so as to form a laminate with the transparent member 30 of the non-translucent region 12, and the translucent region 11 and the The thickness of the transparent member 30 in the light transmissive region 11 in the vicinity of the boundary with the non-light transmissive region 12 is larger than the thickness of the transparent member 30 in the non light transmissive region 12. Thereby, in the shaping | molding member 10 of this invention, an outer surface can be formed only by the transparent member 30, and an inner surface can be formed so that a level | step difference can be reduced. When used in the translucent input device 1, the level difference can be reduced on either the input operation surface 10a or the other surface. The sensor substrate 20 can be bonded by the adhesive layer 70 without forcibly deforming the sensor substrate 20.

According to the present embodiment, even when the decorative member 40 is thickened, the thickness of the transparent member 30 in the light-transmitting region 11 and the thickness of the transparent member 30 in the non-light-transmitting region 12 are contracted. Since it can set suitably according to a rate, the level | step difference in the sensor substrate 20 affixing area | region of the shaping | molding member 10 can be reduced to 10 micrometers or less. Therefore, there is no problem of a step at the boundary between members, and the step can be reduced even when the decorative member 40 is thick.

In addition, the conventional decorating member 40 often performs decorative printing on a transparent resin or transparent glass. Even when a decorative layer is formed by printing, a thick decorative layer is formed by alternately stacking a white printed layer and a decorative color printed layer such as black as the decorative printed layer. Is required, resulting in a step of about 15 to 50 μm. When the decorative print layer becomes thick in this way, voids (bubbles) are easily formed in the adhesive layer 70 that bonds the surface base material on which the decorative print layer is formed and the base material therebelow. Therefore, the structure which can reduce the level difference, which is a feature of the present invention, can obtain the same effect even when the decorative member 40 is formed by printing.

In addition to printing, a decoration method by vapor deposition or plating is possible. In these cases, colors and textures that can be colored are limited, but, for example, a metallic luster gold color is possible, and it is not necessary to increase the thickness of the decorative layer. Therefore, the entire structure can be made thinner.

  When using resin for the decorating member 40, if transparent resin is used for the transparent member 30, it is desirable to add a coloring material using the same resin material. By doing so, since the linear expansion coefficient and the shrinkage rate are similar, there is no fear of causing cracks or warping. Moreover, it is desirable that the decorating member 40 is a molded resin having a curved surface shape. If it carries out like this, it can process into the free shape according to the housing | casing design.

In the structure using resin for the decoration member 40, the decoration member 40 can also serve as attachment and fixing of electronic components constituting the electronic device or reinforcement of the casing. Since the thickness of the decoration member 40 does not need to be constant, a portion having a thickness necessary for decoration and a shape portion as reinforcement can be integrally formed. The strength can also be increased when the molded member 10 is used as a casing in which the transparent member 30 is thin. In this way, the assembly process of the electronic device can be simplified, and reliability such as impact resistance can be improved. Even when the transparent member 30 is thin as the translucent input device 1, the strength can be increased.

  In addition, when the transparent member 30 of this Embodiment is used, it is possible to form the planar position of the decorating member 40 in a self-alignment according to the three-dimensional shape. Further, the boundary between the light transmitting region 11 and the non-light transmitting region 12 can be clearly formed. Therefore, there is no misalignment or printing blur which is a problem in general decorative printing.

  As shown in FIG. 4, the thickness of the transparent member 30 and the decorative member 40 in the non-translucent region 12 in the vicinity of the boundary between the translucent region 11 and the non-translucent region 12. Is preferably substantially equal to the thickness of the transparent member 30 in the translucent region 11. By doing so, it is possible to obtain an ideal state with almost no step between the members.

Furthermore, FIGS. 5 to 7 schematically show examples of the molded member 10 according to the first embodiment in consideration of variations in the actual mass production process, as partial modifications, in partial cross-sectional views. Such variation in mass production may be different on the four sides of the rectangular screen of the translucent input device 1, and should be considered in particular as a means for solving the problem.

  FIG. 5 shows the case where the transparent member 30 of the primary molded product is thick or the decorative member 40 of the secondary molded product is thin, and the translucent region 11 is convex. Although FIG. 6 is the same case, it is a case where the decoration member 40 is thin with a gentle inclined surface, and is likely to occur in the case of the decoration member 40 formed by decorative printing. These shapes are preferable as the direction of variation (dimensional tolerance) during mass production because bubbles are not easily generated in the adhesive layer 70 in the transparent region 11 that is a screen region. Even if bubbles are generated when the sensor substrate 20 is bonded to the translucent input device 1, it is not visually recognized by the operator. Even if bubbles remain in the non-light-transmitting region 12, they are not visually recognized, so that the problem that bubbles that can be visually recognized in the light-transmitting region 11 are generated can be solved.

  FIG. 7 shows the case where the transparent member 30 of the primary molded product is thin or the decorative member 40 is thick. When the step is steep, the adhesive layer 70 cannot follow and bubbles are formed in the translucent region 11 which is the screen region. However, if the pressure-sensitive adhesive layer 70 can absorb the step so that the step of the decorating member 40 has a gently inclined surface as in the case of decorative printing, the bubble defect does not occur.

The molded member 10 is not limited to a resin material that can be easily molded, and even if a glass material is used, the same effect as in the present embodiment can be obtained. In addition, although it has been described in detail that it is effective in a transparent resin member having a curved surface so that it can be used as a housing of an electronic device, the outer surface is curved like a conventional surface protection member using flat glass. It may be only a flat plate surface having no. By forming the transparent member 30 so as to reduce the level difference from the decorative member on the inner surface, the effect of the present invention is obtained even if the outer surface is the flat plate-shaped molded member 10.

<Second Embodiment>
8 to 9 are partial cross-sectional views showing a second embodiment of the present invention. In the member which produces the steep step mentioned above, it can be set as a gentle inclined surface by apply | coating the transparent resin film 31. FIG. Therefore, it is possible to prevent a defect in which bubbles are generated when the molding member 10 of the translucent input device 1 and the sensor substrate 20 are bonded together. This configuration has no side effect due to the transparent resin film 31 even for a member having no step. Therefore, the mass production yield and reliability can be improved by adding the material of the transparent resin film 31 and the coating process.

  In the molded member 10 in the present embodiment, the step between the members in the attachment region of the sensor substrate 20 can be made 10 μm or less, so the maximum film thickness of the transparent resin film 31 is about 10 μm to 20 μm. As a result, the step after applying the transparent resin film 31 can be formed to be within about ± 5 μm, and the steep step can be eliminated to form a gently inclined surface. Therefore, it is possible for the adhesive layer 70 to follow the inclined surface and securely attach the sensor substrate 20.

The transparent resin film 31 is preferably a translucent UV curable resin. The application process may be general screen printing or the like, but spray coating that can easily cope with the uneven shape is optimal. In particular, it is preferable to apply thickly to the concave region. In this way, the level difference after application can be further reduced.

<Third Embodiment>
FIG. 10 shows a cross section of the molded member 10 according to the third embodiment of the present invention. It has the hard coat 32 which coat | covers the surface of the transparent member 30 in one surface of the translucent area | region 11. It is characterized by the above-mentioned.
For example, when applied to the translucent input device 1, it is preferable because an effect of preventing scratches and dirt on the input operation surface 10a can be obtained. Further, when the translucent input device 1 is used as a casing, it is possible to prevent the outer surface side from being damaged, so that the aesthetic appearance is not impaired for a long time.

In the present embodiment, the hard coat 32 is formed in the light-transmitting region 11 and thus needs to be light-transmitting. The hard coat 32 may be coated with a translucent resin. In this way, the hard coat 32 can be formed by a simple process.

The hard coat 32 is preferably a transparent coating film made of a UV curable coating material. The hard coat 32 can be configured as a coating film applied to the surface of the transparent member 30 by spin coating or the like. After the hard coat 32 is applied, it can be cured by UV irradiation.

Furthermore, it is desirable that the hard coat 32 has an antireflection film effect. A coating film having a smaller refractive index of the hard coat 32 than the refractive index of the transparent member 30 is preferably set to an optimum film thickness. If it carries out like this, it can apply to the translucent input device 1, and the antireflection effect of the translucent area | region 11 can be acquired.

  Moreover, the hard coat 32 can use the same material as the transparent resin film 31 applied to the second embodiment. If it is the same material as the transparent resin film 31, it will become easy to apply to a mass-production process, without increasing the material to add, and it can prevent that the surface of the transparent member 30 is damaged.

<Fourth Embodiment>
Furthermore, the effect of the present invention is not limited to a flat surface. As shown in FIG. 11, the attachment surface side of the sensor substrate 20 is substantially flat, and the input operation function as the translucent input device 1 is impaired. The outer shape of the molded member 10 may be such that the input operation surface 10a is a curved surface in a range that does not exist. In particular, in the first to third embodiments, the shape may be combined with the fourth embodiment.

In the description of the embodiment described above, a modification example of the sensor substrate 20 is not described, but the sensor substrate 20 shown in FIGS. 2 and 3 is not limited to this in the configuration of the electrode pattern and the base material. Needless to say.

As described above in detail, the present invention is extremely effective when applied to the molded member 10 of the translucent input device 1. The non-light-transmitting region 12 of the molded member 10 may be formed with an opening for an electronic component such as a microphone or a speaker as necessary, or may include a camera lens or a light-transmitting window for infrared communication. . In such processing, a member formed by resin molding, which can freely form a curved surface and is relatively easy to drill, is desirable.

The molded member 10 of the present invention can be widely used not only for the translucent input device 1 but also for a part of the housing that fits with the lower housing 50 of the electronic device. In particular, it is suitable for the case where an optical component that is mounted in a plane, such as the display device 80, is mounted on the housing.

Further, the molded member 10 does not prevent the molded member 10 from being configured only by the decorative member 40 in the non-light-transmitting region 12 where the transparent member 30 is not required. If the non-light-transmitting region 12 in the vicinity of the light-transmitting region 11 is provided so as to form a laminate of the transparent member 30 and the decorative member 40, the other non-light-transmitting regions 12 other than the vicinity of the light-transmitting region 11 are decorated. Only the member 40 may be used. Or the structure which has covered both surfaces of the transparent member 30 with the decorating member 40 may be sufficient.

Further, the molded member 10 may be used as a member inside the housing other than the design surface and the outer surface of the housing, and there is no problem when the member of the present invention is applied. In this case, the decorating member 40 may be formed on any surface of the base material surface. For example, it can be used for a lower electrode substrate of a resistive touch panel.

DESCRIPTION OF SYMBOLS 1 Translucent input device 10, 110 Molding member 10a, 110a Input operation surface 11 Translucent area | region 12 Non-translucent area | region 20 Sensor board 21 Wiring pattern part
23 Upper electrode 24 Lower electrode 25 Upper wiring pattern 26 Lower wiring pattern 27 Electrical connection part 30, 130 Transparent member 31 Transparent resin film 32 Hard coat 40, 140 Decorating member 50 Lower housing 60, 61 Base material 70, 71 Adhesive layer 80 Display device 100 Molded member with capacitance sensor 190 Resin frame

The molded member of the present invention has a transparent member that transmits visible light and a decorative member that does not transmit visible light, and has a window-like light transmitting region that transmits light in the thickness direction, and the light transmitting region. And the transparent member is provided across the transparent region and the non-transparent region, and the transparent region and the non-transparent region are provided on one surface of the transparent member. Forming a continuous surface with the light region, and the decorative member is provided so as to form a laminate with the transparent member of the non-light-transmissive region, and the light-transmissive region and the non-light-transmissive region the thickness of the transparent member in the light transmitting region in the vicinity of the boundary is the rather thick than the thickness of the transparent member in a non-transmitting region, the other surface of said transparent member, said transparent of the translucent region The member is provided in a stepped shape that is convex with respect to the decorative member in the non-translucent region. And wherein the are.

Therefore, in the molded member of the present invention, one surface of the translucent region is continuously formed with the transparent member over the non-translucent region, and the thickness of the molded member near the boundary between the translucent region and the non-translucent region is It can be constituted by a transparent member. Thereby, the outer surface as the surface protection member of the translucent input device can be formed only with the transparent resin, and the inner surface can be formed so as to reduce the level difference. Therefore, there is no problem of a step at the boundary between members, and the step can be reduced even if the decorative layer is thickened. Moreover, the transparent member of the translucent area | region is provided in the level | step difference shape which becomes convex with respect to the decorating member of a non-translucent area | region. In this way, when used as a surface protection member of a translucent input device, even if a gap may remain in the adhesive layer in the non-translucent area and air bubbles may be generated, no gap remains in the translucent area. Can be attached so that there is no. Therefore, even if bubbles are generated during the bonding of the sensor substrates, they are not visually recognized by the operator.

The other surface of the transparent region has a transparent resin film that covers at least the light transmitting region, and the transparent resin film is provided so that the decorative member and the transparent member have a gentle step shape. It is preferable. In this way, even if there is a variation in the formed member during mass production and a step is generated, it is possible to form a gentle inclined shape that does not cause a problem. Therefore, when used as a surface protection member of a translucent input device, it is possible to prevent a void from being left in the adhesive layer when the sensor substrate is bonded, so that a defect in which bubbles are generated can be prevented.

  It is preferable that the transparent resin film form an inclined surface that is inclined from the vicinity of the boundary toward the outer periphery of the non-light-transmitting region. According to this, when used as a surface protection member of a translucent input device, the adhesive layer can follow the inclined surface and the sensor substrate can be reliably attached, and the generation of bubbles can be prevented.

The transparent member is a molding resin made of a translucent material, and preferably includes an outer shape having a curved surface in the non-translucent region. If it carries out like this, it can be processed into the free shape according to the housing | casing design, and the frame part required for the outer periphery of a translucent area | region can be made into a narrow frame structure.

  The decorative member is preferably a molded resin made of a colored material. If it carries out like this, if it is a resin member designed so that it may have moderate intensity | strength, it can serve as a reinforcement member. Accordingly, the strength can be increased even when the molded member is used as a casing having a thin transparent member.

  The decorating member is preferably a molded resin having a curved shape. If it carries out like this, it can process into the free shape according to the housing | casing design.

A translucent input device according to the present invention includes a sensor substrate on which a sensor electrode for detecting an input operation and a wiring pattern for electrical connection are formed, a molded member having one surface as an input operation surface, and the sensor substrate. An adhesive layer that adheres the molded member, and the molded member includes a transparent member that transmits visible light and a decorative member that does not transmit visible light, and transmits light in the thickness direction. A window-like translucent area and a non-translucent area surrounding the translucent area are formed, and the transparent member is provided across the translucent area and the non-translucent area, and the input operation Forming a continuous surface of the translucent region and the non-translucent region on the surface, the decorative member is provided so as to form a laminate with the transparent member of the non-translucent region, The translucent area in the vicinity of the boundary between the translucent area and the non-translucent area The thickness of the transparent member, the non-light-transmitting area of the formed thicker than the thickness of the transparent member Rutotomoni, the other surface of said transparent member, said transparent member of the light transmission region, wherein the non It provided the stepped shape which is convex relative to the decorative member for transmitting region, wherein the other surface of the molded part, together with the sensor electrode and the light transmissive region planarly overlapping, the wiring The sensor substrate is bonded to a region including the light-transmitting region and the non-light-transmitting region through the adhesive layer so that the pattern and the light-transmitting region overlap in a plane. To do.

Therefore, in the molding member of the translucent input device, the input operation surface is continuously formed of the transparent member over the translucent region and the non-translucent region, and the molding member near the boundary between the translucent region and the non-translucent region. The thickness can be constituted by a transparent member. Thereby, the outer surface as the surface protection member of the translucent input device can be formed only with the transparent resin, and the inner surface can be formed so as to reduce the level difference. Therefore, there is no problem of a step at the boundary between members, and the step can be reduced even if the decorative layer is thickened. In this way, the translucent input device can realize a structure in which the sensor substrate is bonded together without forcibly deforming the sensor substrate. Moreover, the transparent member of the translucent area | region is provided in the level | step difference shape which becomes convex with respect to the decorating member of a non-translucent area | region. If it carries out like this, even if a bubble remains in the said non-light-transmissive area | region as a translucent input device, it can bond together so that the said translucent area | region may not leave a space | gap. Therefore, even if bubbles in the non-translucent area remain, the operator does not see them, so that the problem of generating bubbles that can be visually recognized in the translucent area can be solved.

It is preferable that the other surface of the transparent member is provided with a transparent resin film covering at least the light-transmitting region, and the transparent resin film is provided across the transparent member and the decorating member. In this way, since the step between the transparent member and the decorative member can be gently inclined so as not to cause a problem, the adhesive layer can follow and the sensor substrate of the translucent input device can be securely attached. is there. Therefore, it is excellent in reliability as a translucent input device.

It is preferable that the transparent resin film form an inclined surface that is inclined from the vicinity of the boundary toward the outer periphery of the non-light-transmitting region. According to this, the adhesive layer can follow the inclined surface and the sensor substrate can be securely attached, and the generation of bubbles can be prevented.

The transparent member is a molded resin made of a translucent material, and preferably includes an outer shape having a curved surface in the non-translucent region. By doing so, it is possible to realize a translucent input device that can be processed into a free shape according to the housing design and that has a frame portion that is necessary for the outer periphery of the input region.

The decoration member of the translucent input device is preferably a molded resin made of a colored material. Any resin member designed to have an appropriate strength can also serve as a reinforcing member. If it carries out like this, intensity | strength can be increased even if a transparent member is thin as a translucent input device.

The decorative member of the translucent input device is preferably a molded resin having a curved shape.
In this way, as a translucent input device, it can be processed into a free shape according to the housing design to be installed.
Yes.

It is a perspective view which shows the translucent input device in the 1st Embodiment of this invention. It is sectional drawing which cut | disconnected the translucent input device in 1st Embodiment by the FIG. 1 II-II line. It is a schematic diagram of the wiring pattern part of the sensor board explaining 1st Embodiment. It is a fragmentary sectional view showing the reference example in the forming member of a 1st embodiment. It is a fragmentary sectional view showing the forming member of a 1st embodiment. It is a fragmentary sectional view showing the modification in the forming member of a 1st embodiment. It is a fragmentary sectional view showing the forming member of the 1st comparative example . It is the fragmentary sectional view which expanded a part of shaping | molding member which shows 2nd Embodiment. It is a fragmentary sectional view showing the forming member of the 2nd comparative example . It is sectional drawing which shows the shaping | molding member of 3rd Embodiment. It is sectional drawing which shows the shaping | molding member of 4th Embodiment. It is a schematic cross section which shows the conventional shaping | molding member with an electrostatic capacitance sensor. It is a schematic cross section of the other direction in the conventional shaping | molding member with an electrostatic capacitance sensor.

Further, FIGS. 5 and 6 schematically show examples of the molded member 10 according to the first embodiment in consideration of variations in an actual mass production process in partial cross-sectional views. Such variation in mass production may be different on the four sides of the rectangular screen of the translucent input device 1, and should be considered in particular as a means for solving the problem.

<Second Embodiment>
FIG. 8 is a partial cross-sectional view showing a second embodiment of the present invention. In the member which produces the steep step mentioned above, it can be set as a gentle inclined surface by apply | coating the transparent resin film 31. FIG. Therefore, it is possible to prevent a defect in which bubbles are generated when the molding member 10 of the translucent input device 1 and the sensor substrate 20 are bonded together. This configuration has no side effect due to the transparent resin film 31 even for a member having no step. Therefore, the mass production yield and reliability can be improved by adding the material of the transparent resin film 31 and the coating process.

Claims (14)

A transparent member that transmits visible light, and a decorative member that does not transmit visible light,
A window-shaped light-transmitting region that transmits light in the thickness direction and a non-light-transmitting region surrounding the light-transmitting region are formed,
The transparent member is provided over the translucent area and the non-translucent area, and forms a continuous surface of the translucent area and the non-translucent area on one surface of the translucent area. ,
The decorative member is provided so as to form a laminate with the transparent member in the non-light-transmitting region,
The thickness of the transparent member in the light-transmitting region in the vicinity of the boundary between the light-transmitting region and the non-light-transmitting region is thicker than the thickness of the transparent member in the non-light-transmitting region,
A molded member characterized by that. The transparent member is
It is a molded resin made of a translucent material, including an outer shape having a curved surface in the non-translucent region,
The molded member according to claim 1. The other surface of the translucent region is
A step between the translucent area and the non-translucent area is formed so that the decorative member surrounds the transparent member, and the translucent area is convex with respect to the non-translucent area Provided in the shape,
The molded member according to claim 1 or 2, characterized in that The decorative member is a molded resin made of a colored material.
The molded member according to any one of claims 1 to 3, characterized in that: The decorative member is a molded resin having a curved shape,
The molded member according to any one of claims 1 to 4, characterized in that: The other surface of the translucent region is
Having a transparent resin film covering at least the light-transmitting region;
As the decorative member surrounds the transparent member, a boundary between the translucent area and the non-translucent area is formed,
The transparent resin film is provided so that the decorative member and the transparent member have a gentle step shape,
The molded member according to any one of claims 1 to 5, characterized in that: One surface of the translucent region has a hard coat that covers the surface of the transparent member.
The molded member according to any one of claims 1 to 6, characterized in that: A sensor substrate on which a sensor electrode for detecting an input operation and a wiring pattern for electrical connection are formed;
A molded member whose one surface is an input operation surface;
An adhesive layer for fixing the sensor substrate and the molded member;
Have
The molding member includes a transparent member that transmits visible light and a decorative member that does not transmit visible light, and surrounds the light-transmitting region, a window-like light-transmitting region that transmits light in the thickness direction. A non-translucent region is formed,
The transparent member is provided across the translucent region and the non-translucent region, and forms a continuous surface of the translucent region and the non-translucent region on the input operation surface,
The decorative member is provided so as to form a laminate with the transparent member in the non-light-transmitting region,
The thickness of the transparent member in the light-transmitting region in the vicinity of the boundary between the light-transmitting region and the non-light-transmitting region is formed thicker than the thickness of the transparent member in the non-light-transmitting region,
The other surface of the molded member has the sensor electrode and the light-transmitting region overlapped in a plane, and the wiring pattern and the non-light-transmitting region overlapped in a plane via the adhesive layer. The sensor substrate was bonded to a region including a light transmitting region and the non-light transmitting region.
A translucent input device characterized by that. The transparent member is
It is a molded resin made of a translucent material, including an outer shape having a curved surface in the non-translucent region,
The translucent input device according to claim 8. The other surface of the molded member is
A step between the translucent area and the non-translucent area is formed so that the decorative member surrounds the transparent member, and the translucent area is convex with respect to the non-translucent area Provided in the shape,
The translucent input device according to claim 8 or 9, characterized by the above. The decorative member is a molded resin made of a colored material.
The translucent input device according to claim 8, wherein the translucent input device is provided. The decorative member is a molded resin having a curved shape,
The translucent input device according to any one of claims 8 to 11, wherein: The other surface of the molded member is
Having a transparent resin film covering at least the light-transmitting region;
While forming the boundary between the translucent region and the non-translucent region so that the decorative member surrounds the transparent member,
The transparent resin film is provided so that the decorative member and the transparent member have a gentle step shape,
The translucent input device according to any one of claims 8 to 12, characterized in that: The input operation surface has a hard coat that covers the surface of the transparent member.
The translucent input device according to claim 8, wherein the translucent input device is provided.