JP2014088567A5 - - Google Patents

Claims (17)

A free Mui inkjet ink polyvinyl phenol as the compound (B) characterized by having a dicyclopentadiene type epoxy resin (A) and a phenolic hydroxyl group, of 4cm angle 該I inkjet ink Kapton 50H (trade name: Toray DuPont Co., Ltd.), which is a square polyimide film , is applied to the central portion on the center (thickness : 12.5 μm) to form a 3 cm square coating film. The average value of the warp heights at the four ends of the polyimide film having a cured film (film thickness 10 μm) obtained by curing the film with heat (200 ° C. × 30 minutes) is 3 mm or less. the glass transition temperature of the cured film obtained from an ink is 90 ° C. or higher, Lee inkjet inks. The dicyclopentadiene type epoxy resin (A) is an epoxy resin having a dicyclopentadiene skeleton having at least one glycidyl ether bond and at least one dicyclopentadienyl group in one molecule. Lee ink jet ink according to 1. Dicyclopentadiene type epoxy resin (A) is represented by the following formula (1), b inkjet ink according to claim 1 or 2.

Wherein R ¹ , R ² and R ³ are each independently an organic group having 1 to 10 carbon atoms, and R ⁴ , R ⁵ and R ⁶ are independently hydrogen, alkyl having 1 to 12 carbon atoms. , Or halogen, and n is an integer of 0 or more and 10) Dicyclopentadiene type epoxy resin (A) is represented by the following formula (2), b inkjet ink according to any one of claims 1 to 3.

(Where n is an integer from 0 to 10) Furthermore, it contains a diluent (C), and the inkjet ink is applied to the center of Kapton 50H (trade name: Toray DuPont Co., Ltd.) (thickness 12.5 μm), which is a square polyimide film of 4 cm square. By forming a 3 cm square coating film , performing UV exposure (500 mJ / cm ² ) on the coating film using an ultra-high pressure mercury lamp , and then curing it with heat (200 ° C. × 30 minutes) The average value of the warp heights at the four ends of the polyimide film having the obtained cured film (film thickness: 10 μm) is 3 mm or less, and the glass transition temperature of the cured film obtained from the inkjet ink is 90 ° C. or higher. Lee inkjet ink according to any one of claims 1-4. The viscosity of 25 ° C. diluent (C) is a 0.1~100mPa · s, Lee inkjet ink according to claim 5. Diluent (C) is a monofunctional (meth) acrylate or polyfunctional (meth) acrylate, b inkjet ink according to claim 5 or 6. Lee inkjet ink according to claim 7, further comprising a photopolymerization initiator (D). The photopolymerization initiator (D) is, acylphosphine oxide-based, Lee inkjet ink according to claim 8 is at least one compound selected from the group consisting alkyl phenone compound. The dicyclopentadiene type epoxy resin (A) is an epoxy resin represented by the formula (1), has a phenolic hydroxyl group, contains polyvinyl phenol as a compound (B), and a diluent (C) It is at least one selected from the group consisting of tetrahydrofurfuryl methacrylate and dipropylene glycol diacrylate, the photopolymerization initiator (D) is 2,4,6-trimethylbenzoyldiphenylphosphine oxide, and phenothiazine as a polymerization inhibitor containing, Lee inkjet ink according to any one of claims 5-9. The viscosity of 25 ° C. is 1 to 200 MPa · s, Lee inkjet ink according to any one of claims 1-10. The viscosity of 25 ° C. is 1 to 30 mPa · s, Lee inkjet ink according to any one of claims 1 to 11. Either applying a Lee inkjet ink according to one of claim 1 to 12 is cured by light and / or heat, a cured film forming method. Cured film obtained from Lee inkjet ink according to any one of claims 1 to 12. The cured film of Claim 14 currently formed in pattern shape. An electronic circuit board, wherein the cured film according to claim 14 or 15 is formed on a substrate. An electronic component comprising the electronic circuit board according to claim 16 .