JP2014087870A - Polishing pad - Google Patents
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本発明は、研磨パッドに関し、特にサファイア，シリコンカーバイト，ガリウムナイトライドなどの難削材からなるウェハの精密研磨に適した研磨パッドに関する。 The present invention relates to a polishing pad, and more particularly to a polishing pad suitable for precision polishing of a wafer made of a difficult-to-cut material such as sapphire, silicon carbide, and gallium nitride.
ＬＥＤ等の光デバイスの製造において、合成単結晶サファイア基板は、２０００°Ｃ以上の耐熱性を有し熱的に安定しており、また、耐化学薬品性にも優れ化学的にも安定していることから、基板の素材として良く利用されている。サファイア基板は、光デバイス層が積層される前に、基板の一方面または両面が研削、研磨されて所定の厚みおよび所望の面精度に仕上げられる。この研磨には、研磨面の平坦化を図るために粒子の大きさが均一なコロイダルシリカと研磨パッドとを用いて、化学的に表面層を変質させながら研磨剤とによって被研磨面を機械的に磨くＣＭＰ（Ｃｈｅｍｉｃａｌ Ｍｅｃｈａｎｉｃａｌ Ｐｏｌｉｓｈｉｎｇ：化学機械研磨）が広く用いられている。ＣＭＰに用いられる研磨パッドとしては、不織布フェルトにポリウレタン溶液を含浸湿式凝固処理して得られる多孔質不織布シート（特許文献１）などが開示されている。 In the manufacture of optical devices such as LEDs, the synthetic single crystal sapphire substrate has a heat resistance of 2000 ° C or higher and is thermally stable, and also has excellent chemical resistance and is chemically stable. Therefore, it is often used as a substrate material. The sapphire substrate is finished to a predetermined thickness and desired surface accuracy by grinding and polishing one or both surfaces of the substrate before the optical device layer is laminated. In this polishing, colloidal silica with a uniform particle size and a polishing pad are used to flatten the polishing surface, and the surface to be polished is mechanically modified with an abrasive while chemically modifying the surface layer. CMP (Chemical Mechanical Polishing) is widely used. As a polishing pad used in CMP, a porous nonwoven fabric sheet obtained by impregnating a nonwoven fabric felt with a polyurethane solution and wet coagulation (Patent Document 1) is disclosed.
しかしながら、サファイアは旧モース硬度でダイアモンドに次ぐ硬度を備えていることから研磨が難しく、従来のシリコンウェハやガラス基板の研磨を前提に作製された研磨パッドでは、サファイア基板を高い仕上げ精度を維持しつつ、高い研磨レートで研磨することは困難であった。そのため、サファイアの平坦化仕上げ加工には多くの時間が必要であった。 However, sapphire is difficult to polish because it has the second hardness after diamond with old Mohs hardness, and the polishing pad made on the premise of polishing of conventional silicon wafer or glass substrate maintains high finishing accuracy of sapphire substrate. However, it was difficult to polish at a high polishing rate. Therefore, much time is required for the flattening finishing of sapphire.
請求項１に記載の発明は、ポリエステル樹脂からなる芯成分とナイロン樹脂からなる鞘成分とから構成される芯鞘型繊維を含む繊維集合体に、球状のシリカを熱硬化性合成樹脂系接着剤によって担持させてなることを特徴とする、研磨パッドである。
請求項２に記載の発明は、繊維集合体中に芯鞘型繊維を３０〜１００重量％含む、請求項１に記載の研磨パッドである。
請求項３に記載の発明は、球状のシリカの平均粒子径が、２〜１２μｍの範囲にある請求項１または請求項２に記載の研磨パッドである。
The invention according to claim 1 is a thermosetting synthetic resin adhesive in which spherical silica is added to a fiber assembly including core-sheath fibers composed of a core component made of polyester resin and a sheath component made of nylon resin. It is a polishing pad characterized by being carried by.
The invention according to claim 2 is the polishing pad according to claim 1, wherein the fiber assembly contains 30 to 100% by weight of the core-sheath fiber.
The invention according to claim 3 is the polishing pad according to claim 1 or 2, wherein the average particle diameter of the spherical silica is in the range of 2 to 12 μm.
本発明にかかる研磨パッドによれば、サファイア等の難削材からなるウェハ等に対しても、高い仕上げ精度を維持しつつ、高い研磨レートでの研磨加工を行うことができるので、ウェハの平坦化加工の時間を削減することができる。 According to the polishing pad of the present invention, a wafer made of a difficult-to-cut material such as sapphire can be polished at a high polishing rate while maintaining high finishing accuracy, so that the flatness of the wafer can be achieved. The processing time can be reduced.
以下、本発明にかかる研磨パッドを構成する各要素について詳述し、併せて本発明が優れている点などについて説明を行う。 Hereinafter, each element which comprises the polishing pad concerning this invention is explained in full detail, and the point etc. which this invention is excellent are demonstrated collectively.
研磨パッドは、繊維集合体を有する。繊維集合体は、合成繊維を構成繊維として形成したウェブである。繊維集合体に用いるウェブは、カード法、エアレイ法、スパンボンド法や抄紙法等の既存のウェブ製造方法により製造されたパラレルウェブ、クロスウェブ、セミランダムウェブおよびランダムウェブのいずれでもよく特に制限されるものではないが、密度を制御出来る点で、カード法またはスパンボンド法により製造されるのが好ましい。なお、ウェブには、高密度化を図るためにニードルパンチやウォーターニードルが施されることが望ましい。 The polishing pad has a fiber assembly. The fiber assembly is a web in which synthetic fibers are formed as constituent fibers. The web used for the fiber assembly may be any of parallel web, cross web, semi-random web and random web produced by existing web production methods such as card method, air lay method, spunbond method and paper making method. Although it is not a thing, it is preferable to manufacture by the card | curd method or the spun bond method at the point which can control a density. The web is preferably provided with a needle punch or a water needle in order to increase the density.
繊維集合体の構成繊維には、ポリエステル樹脂からなる芯成分とナイロン樹脂からなる鞘成分とから構成される芯鞘型繊維が用いられる。芯鞘型繊維の繊維径は、１０μｍ〜２５μｍのものを用いるのが好ましく、この範囲内であれば、同一繊維径又は異なる繊維径のものを組み合わせて使用することができる。 As the constituent fiber of the fiber assembly, a core-sheath fiber composed of a core component made of polyester resin and a sheath component made of nylon resin is used. The fiber diameter of the core-sheath fiber is preferably 10 μm to 25 μm. Within this range, fibers having the same fiber diameter or different fiber diameters can be used in combination.
この芯鞘型繊維を用いることで、繊維表面がナイロン樹脂になることから、シリカと繊維との接着を強固に行える。また、研磨面に露出するナイロン繊維の割合がナイロン樹脂のみからなる繊維で構成された繊維集合体と同様となることから、高い摩擦特性を具備した高研磨レートの研磨パッドを得ることができる。また、芯成分にポリエステル樹脂を用いたことから、ナイロン樹脂のみからなる繊維で作製したものより剛性、耐水性に優れた研磨パッドを得ることができる。 By using this core-sheath fiber, the fiber surface becomes a nylon resin, so that the silica and the fiber can be firmly bonded. In addition, since the ratio of the nylon fibers exposed on the polishing surface is the same as that of the fiber assembly composed of fibers made only of the nylon resin, a polishing pad with a high polishing rate having high friction characteristics can be obtained. In addition, since a polyester resin is used as the core component, a polishing pad that is superior in rigidity and water resistance can be obtained as compared with a fiber made of only a nylon resin.
ナイロン繊維単体やポリエステル繊維単体で構成された繊維集合体に見られる欠点を補うため、ナイロン繊維とポリエステル繊維とを混合する場合が想定されるが、この場合と比べても、本発明にかかる繊維集合体は、構成繊維の外面が全てナイロン樹脂で構成されているので、同じの圧縮率、モジュラスで作製した場合、繊維を混合して作製したものと比べ高い摩擦特性を具備させることができ、高研磨レートの研磨パッドを得ることができる。 Nylon fiber and polyester fiber may be mixed with nylon fiber and polyester fiber in order to make up for the disadvantages found in the fiber aggregate composed of nylon fiber or polyester fiber alone. Since the outer surface of the assembly is composed entirely of nylon resin, when the assembly is made with the same compression rate and modulus, it can have higher friction characteristics than those made by mixing the fibers, A polishing pad having a high polishing rate can be obtained.
なお、繊維集合体への厚みと剛性の付与の観点から、繊維集合体には上述の芯鞘型繊維の他に、ポリエステル繊維を配合されてもよい。また、繊維集合体には潜在捲縮タイプのポリエステル繊維を配合し、熱ロール等で捲縮を発現させ、繊維集合体を高密度化、高モジュラス化させるように構成されてもよい。なお、これらのポリエステル繊維は、潜在捲縮タイプと捲縮を発現しないタイプのものを混合して使用してもよいが、研磨パッドに高い研磨性能を具備させるために、繊維集合体中に少なくとも芯鞘型繊維が３０重量％〜１００重量％（ポリエステル繊維不含）含まれるように構成されるのが好ましい。 In addition, from the viewpoint of imparting thickness and rigidity to the fiber assembly, the fiber assembly may be blended with polyester fiber in addition to the above-described core-sheath fiber. Further, the crimped polyester fiber of the latent crimp type may be blended in the fiber assembly, and crimps may be expressed by a hot roll or the like to increase the density and the modulus of the fiber assembly. These polyester fibers may be used by mixing a latent crimp type and a type that does not develop crimp, but in order to provide a polishing pad with high polishing performance, at least in the fiber assembly. It is preferable that the core-sheath fiber is configured to be contained in an amount of 30% by weight to 100% by weight (without polyester fiber).
熱硬化性合成樹脂系接着剤は、シリカを繊維集合体に固着させるものである。熱硬化性合成樹脂系接着剤には、ウレタン樹脂、フェノール樹脂、エポキシ樹脂等が選択できるが、繊維集合体と球状のシリカとを強固に接着でき、研磨パッドに高い弾性を付与できる点で、ウレタン樹脂が選択されるのが好ましい。 A thermosetting synthetic resin adhesive fixes silica to a fiber assembly. For the thermosetting synthetic resin adhesive, urethane resin, phenol resin, epoxy resin, etc. can be selected, but the fiber aggregate and spherical silica can be firmly bonded, and high elasticity can be given to the polishing pad, A urethane resin is preferably selected.
シリカは、研磨工程において主として研磨助剤としての効果を発揮するもので、繊維集合体に担持させることで、ＣＭＰの研磨スラリー中に含まれるコロイダルシリカに作用し研磨スラリーの保持と排出のバランスを整え、研磨レート、仕上げ精度の向上を図る効果を奏するものである。使用するシリカは、外形状が破砕形状や多面体状のような角を持つ形状ではなく、球状のものが使用されるのが好ましい。なお、球状のシリカには、平面形状が真円のものだけに限られず、楕円状に若干歪んだものも含まれてもよい。シリカの粒子径は、大きくなるにつれて研磨性能が良好となることから、脱落シリカによるスクラッチの危険性を考慮して出来る限り大きくすることが望ましい。具体的にその値を述べると、その平均粒径は、２〜１２μｍの範囲であることが好ましい。これは、シリカの平均粒径が２μｍ以下だと十分な研磨レートが得られず、１２μｍを超えると被研磨物に深い傷を入れやすくなるためである。 Silica mainly exerts an effect as a polishing aid in the polishing process, and by supporting it on the fiber assembly, it acts on colloidal silica contained in the CMP polishing slurry to balance the holding and discharging of the polishing slurry. This has the effect of improving the preparation, polishing rate, and finishing accuracy. As for the silica to be used, it is preferable that the outer shape is not a crushed shape or a polyhedral shape, but a spherical shape. Note that the spherical silica is not limited to a plane shape having a perfect circle, but may include an elliptical shape that is slightly distorted. As the silica particle size increases, the polishing performance improves, so it is desirable to increase the silica particle size as much as possible in consideration of the risk of scratches caused by the falling silica. Specifically, the value is preferably in the range of 2 to 12 μm. This is because if the average particle diameter of silica is 2 μm or less, a sufficient polishing rate cannot be obtained, and if it exceeds 12 μm, it becomes easy to make deep scratches on the object to be polished.
シリカの配合量は、研磨パッド全体に対して５〜５０重量％が好ましく、より好ましくは、１５〜２５重量％である。配合量が、５重量％以下だと球状のシリカが研磨助剤としての効果を十分に発揮されず、５０重量％以上だと接着剤の接着性を阻害し、研磨パッドの耐久性が低下するためである。 The amount of silica is preferably 5 to 50% by weight, more preferably 15 to 25% by weight, based on the entire polishing pad. When the blending amount is 5% by weight or less, the spherical silica does not sufficiently exhibit the effect as a polishing aid, and when it is 50% by weight or more, the adhesiveness of the adhesive is inhibited and the durability of the polishing pad is lowered. Because.
界面活性剤は、熱硬化性合成樹脂系接着剤を希釈する溶媒中で球状のシリカが凝集させることなく均一に分散させるためのものである。したがって、界面活性剤は、熱硬化性合成樹脂系接着剤を希釈する溶媒に可溶であり、球状のシリカを均一に分散できるものであれば、その種類は特に制限されるものではない。 The surfactant is for uniformly dispersing the spherical silica in the solvent for diluting the thermosetting synthetic resin adhesive without agglomerating. Therefore, the type of the surfactant is not particularly limited as long as it is soluble in the solvent for diluting the thermosetting synthetic resin adhesive and can uniformly disperse the spherical silica.
繊維集合体には、熱硬化性合成樹脂系接着剤とシリカと界面活性剤とが任意の割合で調合されたスラリーを付加して接着剤を硬化させることで、繊維集合体の構成繊維表面上に、熱硬化性合成樹脂系接着剤によりシリカが均一に分散された状態で固着されている。スラリーを繊維集合体に付加する方法としては、浸漬法、スプレー法、コーティング法を単独又はこれらを組み合わせて用いてもよい。スラリーを付加した繊維集合体は、公知の乾燥方法を用いることで、熱硬化性合成樹脂系接着剤を硬化させる。このとき繊維集合体を変質させない温度で、且つ、熱硬化性合成樹脂系接着剤を十分硬化させることができる温度で乾燥させなければならない。 A fiber assembly is added with a slurry prepared by mixing a thermosetting synthetic resin adhesive, silica, and a surfactant in an arbitrary ratio, and the adhesive is cured, so that the surface of the constituent fiber of the fiber assembly is cured. Further, the silica is fixed in a state where the silica is uniformly dispersed by the thermosetting synthetic resin adhesive. As a method of adding the slurry to the fiber assembly, an immersion method, a spray method, or a coating method may be used alone or in combination. The fiber aggregate to which the slurry has been added cures the thermosetting synthetic resin adhesive by using a known drying method. At this time, it must be dried at a temperature at which the fiber aggregate is not denatured and at a temperature at which the thermosetting synthetic resin adhesive can be sufficiently cured.
研磨パッドは、繊維集合体に起因する凹凸を表面に有しているため、両面にサンディング研磨加工を施し、平坦度を向上させる。これにより、所定の厚みと平坦度を備えた研磨パッドを製造することができる。 Since the polishing pad has irregularities due to the fiber assembly on the surface, the polishing pad is subjected to sanding polishing on both surfaces to improve the flatness. Thereby, a polishing pad having a predetermined thickness and flatness can be manufactured.
また、研磨面において研磨スラリーの供給と排出がスムーズに行われるよう、研磨面となる面にエンボス加工、あるいは溝加工を施すことができる。なお、研磨パッドは、研磨機定盤へ固定を用容易に行うために、片面に工業用両面粘着テープを貼付されてもよい。 In addition, the polishing surface can be embossed or grooved so that the polishing slurry can be smoothly supplied and discharged on the polishing surface. The polishing pad may be affixed with an industrial double-sided adhesive tape on one side in order to easily fix the polishing pad to the polishing machine surface plate.
ポリエステル樹脂からなる芯成分と、ナイロン樹脂からなる鞘成分とから構成される単糸繊度１．７ｄｔｅｘの芯鞘型繊維５０重量％、単糸繊度１．７ｄｔｅｘのポリエステル繊維３０重量％、単糸繊度２．８ｄｔｅｘの潜在捲縮性ポリエステル繊維２０重量％で配合された繊維集合体（クロスウェブ）にニードルパンチを施した後、熱ロールにて、潜在捲縮性を発現させ目付量３２０ｇ／ｍ２、厚み２．０ｍｍの不織布を得た。続けて、浸漬法にて熱硬化性ウレタン樹脂と、平均粒径６．５μｍの球状のシリカと、界面活性剤（エステル型非イオン系）とを固形比で１００：４２：４の割合となるように調合したスラリーを乾燥固形分で７８０ｇ／ｍ２となるように繊維集合体に塗布して硬化乾燥させた。次に、両表面を平滑化させるためにサンディング加工して除去し、厚み１．３ｍｍ、密度０．５５ｇ／ｃｍ３、ショアＡ硬度７９の研磨パッドを作製し実施例１を得た。 50% by weight of core-sheath fiber having a single yarn fineness of 1.7 dtex, 30% by weight of polyester fiber having a single yarn fineness of 1.7 dtex, and a single yarn fineness composed of a core component made of polyester resin and a sheath component made of nylon resin After a needle punch is applied to a fiber assembly (cross web) blended with 20% by weight of a 2.8 dtex latent crimpable polyester fiber, the latent crimp is expressed by a hot roll, and the basis weight is 320 g / m 2. A nonwoven fabric having a thickness of 2.0 mm was obtained. Subsequently, the thermosetting urethane resin, the spherical silica having an average particle diameter of 6.5 μm, and the surfactant (ester type nonionic system) are in a ratio of 100: 42: 4 in a solid ratio by an immersion method. The slurry thus prepared was applied to the fiber assembly so as to have a dry solid content of 780 g / m 2 and cured and dried. Next, sanding was performed to smooth both surfaces, and a polishing pad having a thickness of 1.3 mm, a density of 0.55 g / cm 3 , and a Shore A hardness of 79 was produced to obtain Example 1.
シリカの粒子径を６．５μｍから２μｍに変更して、その他の要素・工程を実施例１同様にして研磨パッドを作製し実施例２を得た。 A silica pad was changed from 6.5 μm to 2 μm, and other elements and steps were made in the same manner as in Example 1 to produce a polishing pad, and Example 2 was obtained.
（比較例１）
シリカの粒子径を６．５μｍから１μｍに変更して、その他の要素・工程を実施例１同様にして研磨パッドを作製し比較例１を得た。
(Comparative Example 1)
A comparative example 1 was obtained by changing the silica particle size from 6.5 μm to 1 μm and making other elements and processes in the same manner as in Example 1 to produce a polishing pad.
（比較例２）
シリカの粒子径を６．５μｍから１３μｍに変更して、その他の要素・工程を実施例１同様にして研磨パッドを作製し比較例２を得た。
(Comparative Example 2)
A polishing pad was prepared in the same manner as in Example 1 except that the silica particle size was changed from 6.5 μm to 13 μm, and Comparative Example 2 was obtained.
（比較例３）
芯鞘型繊維を用いずに単糸繊度１．７ｄｔｅｘのポリエステル繊維８０重量％、単糸繊度２．８ｄｔｅｘの潜在捲縮性ポリエステル繊維２０重量％の配合で繊維集合体を作製して、その他の要素・工程を実施例１同様にして研磨パッドを作製し比較例３を得た。
(Comparative Example 3)
A fiber assembly is prepared by blending 80% by weight of polyester fiber having a single yarn fineness of 1.7 dtex and 20% by weight of latent crimpable polyester fiber having a single yarn fineness of 2.8 dtex without using a core-sheath fiber. A polishing pad was produced in the same manner as in Example 1, and the comparative example 3 was obtained.
（比較例４）
シリカの粒子径を６．５μｍから１μｍに変更し、芯鞘型繊維を用いずに単糸繊度１．７ｄｔｅｘのポリエステル繊維８０％、単糸繊度２．８ｄｔｅｘの潜在捲縮性ポリエステル繊維２０％の配合で繊維集合体を作製して、その他の要素・工程を実施例１同様にして研磨パッドを作製し比較例３を得た。なお、この比較例４は従来品として相対評価の基準とした。
(Comparative Example 4)
The silica particle size was changed from 6.5 μm to 1 μm, and 80% polyester fiber having a single yarn fineness of 1.7 dtex and 20% latent crimpable polyester fiber having a single yarn fineness of 2.8 dtex without using a core-sheath fiber. A fiber assembly was prepared by blending, and a polishing pad was prepared in the same manner as in Example 1 with respect to other elements and steps, and Comparative Example 3 was obtained. In addition, this comparative example 4 was used as a standard for relative evaluation as a conventional product.
（比較例５）
球状のシリカの代わりに、平均粒子径１μｍの球状アルミナを使用し、その他の要素・工程を実施例１同様にして研磨パッドを作製し比較例５を得た。
(Comparative Example 5)
Instead of spherical silica, spherical alumina having an average particle diameter of 1 μm was used, and other elements and steps were made in the same manner as in Example 1 to produce a polishing pad, and Comparative Example 5 was obtained.
（比較例６）
球状のシリカの代わりに、平均粒子径１μｍの破砕形状シリカを用い、その他の要素・工程を実施例１同様にして研磨パッドを作製し比較例６を得た。
(Comparative Example 6)
Instead of spherical silica, crushed silica having an average particle diameter of 1 μm was used, and other elements and steps were made in the same manner as in Example 1 to produce a polishing pad, and Comparative Example 6 was obtained.
（研磨方法） それぞれの研磨パッドの裏面に工業用両面テープを貼付し、ポリッシングマシン（光永産業社製精密研磨機ＭＦＬＮ４．３Ｂ（両面研磨））に装着して、被研磨物として２０ｍｍ×２０ｍｍ×２ｍｍのソーダガラス（青板）をそれぞれの例について６枚ずつ研磨した。研磨液としては酸化セリウム研磨剤７％水分散液を使用し、加工荷重１．９ｋＰａ、定盤回転数７０ｒｐｍの条件下で実施した。 (Polishing method) A double-sided industrial tape is attached to the back of each polishing pad, and mounted on a polishing machine (precision polishing machine MFLN 4.3B (double-side polishing) manufactured by Mitsunaga Sangyo). Six pieces of 2 mm soda glass (blue plate) were polished for each example. As the polishing liquid, a 7% aqueous dispersion of cerium oxide abrasive was used, and the processing was performed under conditions of a processing load of 1.9 kPa and a platen rotation speed of 70 rpm.
（研磨評価） 評価は、平均研磨レートと仕上げ精度を比較して行った。平均研磨レートは、３０分間×２回処理後（初期）と×１５〜１６回処理（中期）を実施した際の被研磨物厚さ平均摩耗量を求め、単位時間（分）当たりの厚み減少量（μｍ／分）で算出した。仕上がり精度は、Ｚｙｇｏ社製「ＮｅｗＶｉｅｗ２００」（ＮｅｗＶｉｅｗ：Ｚｙｇｏ社登録商標）を用いて、３０分間×５回処理後（初期）と×１６回処理後の被研磨物仕上げ精度（端部表面状態及びスクラッチの有無及び表面粗さ）を測定した。各例の諸元と評価結果を表１に示す。 (Polishing evaluation) Evaluation was performed by comparing the average polishing rate and finishing accuracy. Average polishing rate is 30 minutes x 2 times after treatment (initial) and x15 to 16 times treatment (medium term). The average thickness of the object to be polished is calculated, and the thickness decreases per unit time (min). The amount was calculated (μm / min). Finishing accuracy was determined by using “NewView 200” manufactured by Zygo (NewView: registered trademark of Zygo) for 30 minutes x 5 times (initial) and x16 times after polishing (end surface condition and The presence or absence of scratches and the surface roughness) were measured. Table 1 shows the specifications and evaluation results of each example.
評価は、◎（非常に良好）、○ （良好、従来品一部劣る、一部悪い）、△（不良に近い）、× （不良、劣る）の４段階で相対評価した。 The evaluation was made in four stages: ◎ (very good), ○ (good, some of the conventional products were inferior, some bad), Δ (nearly defective), and × (bad, inferior).
表１から明らかなように、実施例１と実施例２では、研磨レート、仕上げ精度共に従来品より優れた結果を得ることが確認できた。比較例１では、シリカの粒子径が小さすぎるため、十分な研磨レートが得られず、他方、比較例２では粒子径が大きすぎるため研磨レートは得られるが、仕上げ精度が劣る結果となった。比較例３では、構成繊維をポリエステル繊維だけとしたためか十分な研磨レートが得られないうえ、仕上げ精度も優れた結果が得られなかった。比較例５では、シリカをアルミナに変更したため研磨レート、仕上げ精度共に優れた結果は得られず、比較例６についてもシリカを破砕形状のものに変更したために研磨レート、仕上げ精度共に優れた結果は得られなかった。 As is apparent from Table 1, it was confirmed that Example 1 and Example 2 obtained results superior to conventional products in both polishing rate and finishing accuracy. In Comparative Example 1, since the silica particle size is too small, a sufficient polishing rate cannot be obtained. On the other hand, in Comparative Example 2, since the particle size is too large, the polishing rate is obtained, but the finishing accuracy is poor. . In Comparative Example 3, a sufficient polishing rate could not be obtained because the constituent fibers were only polyester fibers, and excellent finishing accuracy could not be obtained. In Comparative Example 5, because silica was changed to alumina, results with excellent polishing rate and finishing accuracy were not obtained, and with Comparative Example 6 as well, since silica was changed to a crushed shape, excellent results in both polishing rate and finishing accuracy were It was not obtained.
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| US5605749A (en) * | 1994-12-22 | 1997-02-25 | Kimberly-Clark Corporation | Nonwoven pad for applying active agents |
| JP2002001649A (en) * | 2000-06-21 | 2002-01-08 | Toray Ind Inc | Polishing pad, and polishing device and polishing method using the same |
| JP2009083093A (en) * | 2007-09-13 | 2009-04-23 | Toray Ind Inc | Polishing cloth |
| JP2010029995A (en) * | 2008-07-30 | 2010-02-12 | Toray Ind Inc | Polishing pad |
| JP2010099771A (en) * | 2008-10-23 | 2010-05-06 | Kanai Hiroaki | Polishing pad for glass |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5605749A (en) * | 1994-12-22 | 1997-02-25 | Kimberly-Clark Corporation | Nonwoven pad for applying active agents |
| JP2002001649A (en) * | 2000-06-21 | 2002-01-08 | Toray Ind Inc | Polishing pad, and polishing device and polishing method using the same |
| JP2009083093A (en) * | 2007-09-13 | 2009-04-23 | Toray Ind Inc | Polishing cloth |
| JP2010029995A (en) * | 2008-07-30 | 2010-02-12 | Toray Ind Inc | Polishing pad |
| JP2010099771A (en) * | 2008-10-23 | 2010-05-06 | Kanai Hiroaki | Polishing pad for glass |
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