JP2014087733A - Coating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coating device capable of surely preventing flowing-out of coating liquid from the coating area to the coating inhibited area of a coated article.SOLUTION: A coating device includes a first seal member 23 and a second seal member 33 partially contacted when they oppose each other via a semiconductor device to annularly cover the front and rear surfaces of the coating area of the semiconductor device, and gap seals 41 elastically deformed according to pressing of the first seal member 23 by a first mold member 20 and pressing of the second seal member 33 by a second mold member 30. Each of the gap seals 41 is disposed to close a gap S formed between a contact part 40 between the first seal member 23 and the second seal member 33 and the outer edge vicinity of each of terminals 54 and 55 of the semiconductor device.

Description

  The present invention relates to a coating apparatus that applies a coating liquid to an object to be coated.

  2. Description of the Related Art Conventionally, a three-dimensional structure coating apparatus disclosed in Patent Document 1 is known as a coating apparatus that applies a coating liquid to an object to be coated. In this coating apparatus, when a semiconductor device as an object to be coated is sandwiched from above and below by a first mold member and a second mold member, an upper seal member provided on the first mold member and a lower seal provided on the second mold member The member is pressed against a predetermined region of the semiconductor device. Even when the coating agent is supplied into the storage chamber constituted by the first die member and the second die member by sealing the application region by the both sealing members pressed against the semiconductor device in this manner, the coating agent is used. Is prevented from flowing into the coating prohibited area of the semiconductor device.

JP 2012-152682 A

FIG. 12 is a cross-sectional view illustrating a state of the article 100 to which the sealing members 101 and 102 are pressed from above and below, FIG. 12 (A) shows a state before pressing, and FIG. 12 (B) is after pressing. Shows the state.
By the way, as shown in FIG. 12A, for example, in a configuration in which the seal members 101 and 102 are simply pressed from above and below against the thin plate-like object 100, as shown in FIG. In the vicinity of the outer edge 100a of 100, a gap S is formed between the outer edge 100a and the contact portion 103 where the upper seal member 101 and the lower seal member 102 are in direct contact. By forming such a gap S, a space (a space including the application area) where the coating liquid is supplied through the gap S communicates with a space (a space including the application prohibited area) where the application liquid is not supplied. As a result, there is a problem that the coating liquid applied to the application region flows out to the application prohibited region through the gap S.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a coating apparatus that can reliably prevent the coating liquid from flowing from the coating area to the coating prohibited area in the object to be coated. It is to provide.

In order to achieve the above-mentioned object, the invention according to claim 1 of the claims is directed to an application area (except for an application prohibition area (50b, 60b) where application is prohibited to an object (50, 60)). 50a, 60a) a coating apparatus (10) for coating a coating liquid (W) so that one side and the other side of the coating area are annularly surrounded with respect to the object to be coated except for the coating prohibited area. The one-side sealing member (23) and the other-side sealing member (33) that are partially in contact with each other when facing the object to be coated, and one side that presses the one-side sealing member against the object to be coated The pressing tool (20), the other-side pressing tool (30) for pressing the other-side sealing member against the object to be coated, the pressing of the one-side sealing member by the one-side pressing tool, and the above-mentioned by the other-side pressing tool Elastically deforms in response to pressing of the other side seal member A closing member (41, 43), and a supply means (13) for supplying the coating liquid into a space (11a) surrounded by the one-side sealing member and the other-side sealing member, In the elastic deformation, the gap (S) formed between the contact portion (40) between the one-side seal member and the other-side seal member and the object to be coated is closed. Features.
In addition, the code | symbol in the parenthesis of a claim and the said means shows a corresponding relationship with the specific means as described in embodiment mentioned later.

  According to the first aspect of the present invention, the one-side sealing member and the other side that are in contact with each other when facing each other through the coating object so as to enclose one side and the other side of the coating area of the coating object in an annular shape. A sealing member and a closing member that is elastically deformed in response to the pressing of the one-side sealing member by the one-side pressing tool and the pressing of the other-side sealing member by the other-side pressing tool are provided. The closing member is disposed so as to close a gap formed between the contact portion between the one-side seal member and the other-side seal member and the coating object during the elastic deformation.

  Thereby, when the one side sealing member and the other side sealing member are pressed against the object to be coated by the one side pressing tool and the other side pressing tool, the gap formed as described above is closed by the elastically deforming closing member. The Therefore, since the coating liquid does not leak to the coating prohibited area through the gap, it is possible to reliably prevent the coating liquid from flowing from the coating area to the coating prohibited area in the coating object.

It is explanatory drawing which shows schematic structure of the coating device which concerns on 1st Embodiment. 2A is a top view illustrating a detailed shape of the semiconductor device, and FIG. 2B is a cross-sectional view taken along a line 2B-2B in FIG. 2A. It is a top view which shows the positional relationship of a semiconductor device, a sealing member, and a clearance seal. It is explanatory drawing explaining the effect | action of a clearance seal. It is process drawing which shows the flow of an application | coating process. It is explanatory drawing explaining a part of each process in a coating process. It is explanatory drawing explaining a part of each process in a coating process. It is a top view which shows the principal part of the coating device which concerns on the modification of 1st Embodiment. It is sectional drawing which shows the principal part of the coating device which concerns on 2nd Embodiment. It is a perspective view which shows a round bar as a modification of a to-be-coated object. It is explanatory drawing explaining the process of apply | coating a coating liquid to the application | coating area | region of a round bar with a coating device. It is sectional drawing explaining the state of the to-be-coated object with which the sealing member was pressed from the upper and lower sides.

[First Embodiment]
Hereinafter, a first embodiment in which a coating apparatus according to the present invention is embodied will be described with reference to the drawings.
The coating apparatus 10 shown in FIG. 1 removes a coating prohibited area where coating is prohibited for the coating object by supplying the coating liquid W to the supply chamber 11a of the storage tank 11 in which the coating object is stored. It is an apparatus for applying the coating liquid W to the application area. In the present embodiment, as shown in FIGS. 2A and 2B, coating is performed using a coating apparatus 10 on a semiconductor device 50 configured by sandwiching a semiconductor chip 51 between two heat sinks 52 and a heat sink 53. The case where an adhesive liquid is applied as the liquid W will be described.

  As shown in FIG. 1, the coating apparatus 10 mainly includes a storage tank 11, a rotating shaft member 12, a storage tank 13, and a control unit 14 that controls the entire coating apparatus 10. The storage tank 11 includes a first mold member 20 positioned on the upper side and a second mold member 30 positioned on the lower side, and both mold members 20 and 30 are assembled from above and below so as to sandwich the semiconductor device 50 therebetween. Thus, a supply chamber 11a to which the coating liquid W is supplied and a supply prohibition chamber 11b in which the supply of the coating liquid W is prohibited are formed. In the present embodiment, the storage tank 11 is formed of a metal material such as stainless steel or aluminum, but is not limited thereto, and may be formed of other materials such as a resin material. Moreover, the 1st type | mold member 20 and the 2nd type | mold member 30 can correspond to an example of the "one side pressing tool" and the "other side pressing tool" as described in a claim.

  The first mold member 20 is provided with first pressing means (not shown) for pressing the first mold member 20 toward the second mold member 30, and the second mold member 30 includes the second mold member. Second pressing means (not shown) for pressing 30 toward the first mold member 20 is provided. And when the coating liquid W is supplied to the storage tank 11, the 1st type | mold member 20 and the 2nd type | mold member 30 are mutually pressed up and down by the press by these 1st press means and a 2nd press means.

  A first supply recess 21 is formed at the center of the lower surface of the first mold member 20, and a shallow first sealing recess 22 is formed around the first supply recess 21. . Moreover, in order to suppress the outflow of the coating liquid W from the supply chamber 11a to the supply inhibition chamber 11b, an annular boundary surface serving as a boundary between the first supply recess 21 and the first sealing recess 22 The seal member 23 is disposed so as to surround the first supply recess 21 in an annular shape. A part of the first seal member 23 is embedded in the annular boundary surface, and the first mold member 20 and the second mold member 30 that are pressed downward from the annular boundary surface are pressed. It is formed so as to reach the boundary surface. The first seal member 23 corresponds to an example of a “one-side seal member” recited in the claims, and is formed of an elastically deformable seal member such as a silicon material.

  In addition, an air hole 24 is formed in the center of the first supply recess 21 so as to communicate with the upper wall surface, and the supply amount of the coating liquid W is detected so that the air hole 24 is inserted vertically. A liquid level sensor 25 is provided. The liquid level sensor 25 outputs a detection signal corresponding to the supply amount of the coating liquid W supplied into the supply chamber 11a according to the position of the float 25a arranged inside the first supply recess 21. It is configured. Instead of the liquid level sensor 25, for example, supply amount detection means for detecting the supply amount of the coating liquid W may be employed by an arbitrary method such as an optical displacement meter or a well-known water level meter.

  The liquid level sensor 25 is held by a sensor holding unit 26 that is provided above the first mold member 20 and communicates with the air hole 24 through the inner chamber 26a. The piping member 27 communicating with the inner chamber 26a is provided with a switching valve 27a for switching the inner chamber 26a between the closed state and the open air state. The sensor holding unit 26 is connected to the storage tank 11 so as to be rotatable relative to the central axis of the air hole 24 so as not to rotate with the storage tank 11.

  A second supply recess 31 is formed at the center of the upper surface of the second mold member 30, and a shallow second recess 32 is formed around the second supply recess 31. . Moreover, in order to suppress the outflow of the coating liquid W from the supply chamber 11a to the supply prohibition chamber 11b, an annular boundary surface serving as a boundary between the second supply recess 31 and the second sealing recess 32 is provided. The seal member 33 is disposed so as to surround the second supply recess 31 in an annular shape. The 2nd seal member 33 is formed in the cyclic | annular upper surface so that the cyclic | annular lower surface of the 1st seal member 23 may be cyclically opposed via a to-be-coated material. In addition, the second seal member 33 is partially embedded in the annular boundary surface, and the first mold member 20 and the second mold member 30 whose upward projecting heights from the annular boundary surface are pressed. It is formed to reach the boundary surface. The second seal member 33 corresponds to an example of the “other-side seal member” recited in the claims, and is formed of, for example, an elastically deformable seal member such as a silicon material.

  Accordingly, when the first mold member 20 and the second mold member 30 are pressed by the both pressing means and the portions of the first seal member 23 and the second seal member 33 that are not in contact with the application object contact each other, the first supply The recess 21 for supply and the second recess 31 for supply and the seal members 23, 33 form a supply chamber 11 a, and the first seal recess 22, the second seal recess 32, and both the seal members 23, 33 A supply prohibition chamber 11b is formed.

  A supply / discharge hole 34 is formed at the center of the second supply recess 31 so as to communicate with the lower wall surface. The rotary shaft member 12 is connected to the supply / discharge hole 34 via the rotary shaft pipe 12a. It is provided on the lower wall surface of the mold member 30. The rotating shaft member 12 is configured to rotate by a driving force supplied from driving means such as a motor (not shown), and is arranged so that the rotation center thereof coincides with the central axis of the supply / discharge hole 34. . Thereby, the storage tank 11 is configured to be rotatable together with the rotary shaft member 12. The rotating shaft member 12 and the motor may correspond to an example of “rotating means” described in the claims.

  A relay tank 15 communicating with the rotary shaft pipe 12a is disposed below the rotary shaft member 12. The rotary shaft pipe 12a communicates with the relay tank 15 with a packing (not shown) fixed to the rotary shaft pipe 12a and a packing (not shown) fixed to the relay tank 15 interposed therebetween. Since these two packings are provided so as to be liquid-tight and slidable with respect to each other, the storage tank 11 can rotate relative to the relay tank 15. The piping member 16 communicating with the relay tank 15 is provided with a switching valve 16a for switching the relay tank 15 between a closed state and a suction state by a suction machine (not shown).

  A piping member 17 for communicating with the storage tank 13 is piped on the lower wall of the relay tank 15, and the coating liquid W stored in the storage tank 13 is supplied into the supply chamber 11 a in the piping member 17. A pump 18 for supply is provided. By driving the pump 18, the coating liquid W in the storage tank 13 is supplied into the supply chamber 11 a through the piping member 17 and the relay tank 15. The piping member 19 provided on the upper wall of the storage tank 13 is provided with a switching valve 19a for switching the storage tank 13 between the closed state and the atmospheric release state. In addition, the storage tank 13 and the pump 18 may correspond to an example of a “supply unit” described in the claims.

  The control unit 14 includes a microcomputer having a CPU, a ROM, a RAM, and the like, and is electrically connected to the liquid level sensor 25, the motor, the pump 18, the switching valves 16a, 19a, 27a, and the like. The control unit 14 executes a predetermined computer program stored in a ROM or the like, thereby supplying or discharging the coating liquid W to or from the supply chamber 11a based on a detection signal from the liquid level sensor 25 or the like. In order to implement the above, the pump 18 and the motor, the switching valves 16a, 19a, 27a and the like are driven and controlled.

  Next, a characteristic configuration of the present embodiment will be described with reference to FIGS. FIG. 3 is a top view showing the positional relationship between the semiconductor device 50, the seal members 23 and 33, and the gap seal 41. 4A and 4B are explanatory diagrams for explaining the operation of the gap seal 41. FIG. 4A shows the state before elastic deformation, and FIG. 4B shows the state after elastic deformation.

  As shown in FIGS. 2A and 2B, the semiconductor device 50 includes thin plate-like terminals 55 and 56 formed on the front and rear surfaces 54 a of the thin plate-like terminals 54 formed on the heat sink 52 and the heat sink 53. The area including the front and back surfaces 55a and 56a is the application prohibited area 50b, and the coating liquid W is applied to the application area 50a excluding the application prohibited area 50b. For this reason, as shown in FIG. 3, the first seal member 23 and the second seal member 33 are configured so as to surround the front and back surfaces 54a, 55a, and 56a in a ring shape when the supply chamber 11a is formed. In contact with the front surface side and back surface side, respectively.

  At this time, for example, the terminal 54 may be formed in a thin plate shape, and the contact portion 40 in which the first seal member 23 and the second seal member 33 are in direct contact in the vicinity of the outer edge 54b of the terminal 54; A gap S is formed between the outer edge 54b and the outer edge 54b. The same applies to the terminal 55 and the terminal 56.

  Therefore, in the present embodiment, a gap seal that is elastically deformed so as to be thickened in a direction (horizontal direction) perpendicular to the pressing direction in accordance with the pressing force from the pressed first mold member 20 and second mold member 30. 41 is arranged in the vicinity of the outer edges 54b to 56b of the terminals 54 to 56 where the gap S can be formed. The gap seal 41 can correspond to an example of a “closing member” recited in the claims.

  As shown in FIGS. 3 and 4A, the gap seal 41 has a quadrangular prism shape before elastic deformation, and the length in the vertical direction is the pressed first mold member 20 and second mold member 30. Is formed so as to be crushed from above and below. Since the gap seal 41 formed in this way reliably closes the gap S, the corners of the gap seal 41 are formed by the outer edges 54b to 56b of the terminals 54 to 56 and the outer surfaces of the seal members 23 and 33. The lower end portion is fixed to the bottom surface of the second sealing recess 32 of the second mold member 30 so as to be close to the portion. The upper end of the gap seal 41 is first so that the corner of the gap seal 41 is close to the corner formed by the outer edges 54b to 56b of the terminals 54 to 56 and the outer surfaces of the seal members 23 and 33. The mold member 20 may be fixed to the bottom surface of the first sealing recess 22.

  As a result, as shown in FIG. 4A, the first seal member 23 is placed on the semiconductor device 50 placed on the upper surface of the second seal member 33 so as to be in contact with the back surfaces of the terminals 54 to 56. When the first mold member 20 and the second mold member 30 are pressed so as to be pressed with each other, as shown in FIG. 4B, the gap seals 41 are elastically deformed so as to be thick, and the gaps S are closed. The

  Next, the application | coating process which apply | coats the coating liquid W to the application | coating area | region 50a of the semiconductor device 50 using the coating device 10 which concerns on this embodiment is demonstrated using FIGS. FIG. 5 is a process diagram showing the flow of the coating process. FIGS. 6A and 6B and FIGS. 7A to 7C are explanatory diagrams for explaining each step in the coating process. 6 and 7, the coating liquid W is illustrated with cross hatching.

  When the application process is started by the control unit 14, first, an accommodating process shown in step S1 of FIG. 5 is performed. In this step, the semiconductor device 50 is placed at a predetermined position on the second mold member 30 so as to come into contact with the upper surface of the second seal member 33 on the back surfaces of the terminals 54 to 56. In this state, it is controlled by the control unit 14 so that the first mold member 20 is lowered and assembled to the second mold member 30 and is pressed from above and below by the both pressing means, so that FIG. ), The application region 50a of the semiconductor device 50 is accommodated in the supply chamber 11a, and the application inhibition region 50b is accommodated in the supply inhibition chamber 11b. At this time, the gap S is closed by elastically deforming the gap seals 41 so as to be thick according to the pressing force (see FIG. 4B).

  Next, the supply process shown in step S2 is performed. In this step, the switching valves 19a and 27a are switched to the atmospheric release state in accordance with a control signal from the control unit 14, and the pump 18 is operated after the switching valve 16a is switched to the closed state. The coating liquid W is supplied into the supply chamber 11a through the piping member 17, the relay tank 15, and the like.

  As shown in FIG. 6B, when the coating liquid W is supplied until it reaches the float 25a, the supply of the specified amount of the coating liquid W is detected by the liquid level sensor 25 and controlled by the control unit 14. The supply of the coating liquid W by the pump 18 is stopped. Thus, the coating liquid W is applied to the coating region 50a of the semiconductor device 50 by supplying (filling) the coating liquid W into the supply chamber 11a. At this time, the gap S in the vicinity of each of the terminals 54 to 56 is closed by elastically deforming the gap seals 41 so that the gap seals 41 are thickened by the pressed first mold member 20 and the second mold member 30, so that the supply chamber 11a The coating liquid W supplied inside does not leak through the gap S and into the supply inhibition chamber 11b.

  When the prescribed amount of coating liquid W is supplied as described above, the discharging process shown in step S3 is performed. In this step, the switching valves 19 a and 27 a are switched to the open state in accordance with a control signal from the control unit 14, whereby the coating liquid W flows down by its own weight and is discharged to the storage tank 13. The reason why the switching valves 19a and 27a are opened is that the coating liquid W is discharged to the storage tank 13 by positively releasing air when the coating liquid W flows down and is discharged to the storage tank 13. This is to improve the speed. Further, in order to further shorten the process time of the discharge process, the suction machine can be operated after the switching valve 16a is switched to the suction state. Thereby, as shown in FIG. 7A, the coating liquid W in the supply chamber 11a is discharged to the storage tank 13 through the piping member 17, the relay tank 15, and the like. Note that even if the coating liquid W is simply discharged downward, even the excessive coating liquid W adheres to the coating region 50 a of the semiconductor device 50.

  When the coating liquid W in the supply chamber 11a is discharged by the suction machine, the liquid draining process shown in step S4 is performed. In this step, as shown in FIG. 7B, the storage tank 11 rotates together with the rotating shaft member 12 by driving the motor in accordance with a control signal from the control unit 14. As a result, the semiconductor device 50 in the supply chamber 11a also rotates, and excess coating liquid W in the coating region 50a is blown out. At this time, since the gap S in the vicinity of each of the terminals 54 to 56 is maintained closed by the elastically deformed gap seals 41, the excess coating liquid W in the coating region 50a is blown outward and the first seal is sealed. Even when sprayed to the member 23 or the second seal member 33, the coating liquid W supplied into the supply chamber 11a does not leak through the gap S and into the supply prohibition chamber 11b.

  When the excess coating liquid W in the coating region 50a is removed by the rotation of the storage tank 11, the extraction process shown in step S5 is performed. In this step, as the first mold member 20 is raised, as shown in FIG. 7C, the semiconductor device 50 in which the application of the coating liquid W has been completed can be taken out. As a result, the coating process by the coating apparatus 10 is completed, and the semiconductor device 50 coated with the coating liquid W is transported to the apparatus for the next process.

  As described above, in the coating apparatus 10 according to the present embodiment, a part of the coating apparatus 50 is opposed to each other through the semiconductor device 50 so as to surround the front surface side and the back surface side of the coating region 50a of the semiconductor device 50 in an annular shape. The first seal member 23 and the second seal member 33 that are in contact with each other, and the gap that is elastically deformed in response to the pressing of the first seal member 23 by the first mold member 20 and the press of the second seal member 33 by the second mold member 30 A seal 41 is provided. The gap seal 41 is formed between the contact portion 40 between the first seal member 23 and the second seal member 33 and the vicinity of the outer edges 54b to 56b of the terminals 54 to 56 of the semiconductor device 50 during the elastic deformation. It arrange | positions so that the clearance gap S may be obstruct | occluded.

  Accordingly, when the first seal member 23 and the second seal member 33 are pressed against the terminals 54 to 56 of the semiconductor device 50 by the first mold member 20 and the second mold member 30, the elastically deformed gap seal 41 is used. The gap S formed as described above is closed. Therefore, since the coating liquid W does not leak to the coating prohibited area 50b through the gap S, the outflow of the coating liquid W from the coating area 50a to the coating prohibited area 50b in the semiconductor device 50 is surely prevented. Can do.

  In particular, in the present embodiment, the first semiconductor device 50 is blown out toward the first seal member 23 and the second seal member 33 so that at least a part of the excess coating liquid W applied to the application region 50a is blown outward. A rotating shaft member 12 that rotates together with the seal member 23 and the second seal member 33 is provided.

  As described above, when the semiconductor device 50 is rotated in accordance with the rotation of the rotating shaft member 12, the excess coating liquid W in the coating region 50 a is blown out and sprayed to the first seal member 23 and the second seal member 33. Even in this case, since the gap S in the vicinity of each of the terminals 54 to 56 is maintained closed by the elastically deformed gap seals 41, the application liquid W from the application area 50a to the application inhibition area 50b in the semiconductor device 50 is maintained. The outflow can be reliably prevented.

FIG. 8 is a top view showing a main part of the coating apparatus 10 according to a modification of the first embodiment.
As shown in FIG. 8, the gap seal 41 may be integrally formed with either one of the first seal member 23 and the second seal member 33 via a connecting portion 42. Accordingly, the gap seal 41 and the seal member connected to the seal member are not displaced, and the gap seal 41 and the contact portion 40 are prevented from being displaced, so that the gap S can be more reliably closed. it can.

[Second Embodiment]
Next, a coating apparatus according to a second embodiment of the present invention will be described with reference to FIG. FIG. 9 is a cross-sectional view illustrating a main part of the coating apparatus 10 according to the second embodiment, in which FIG. 9A shows before elastic deformation, and FIG. 9B shows after elastic deformation.
The coating apparatus 10 according to the second embodiment differs from the semiconductor device according to the first embodiment in that a gap seal 43 is used instead of the gap seal 41 described above in order to more reliably close the gap S. . Therefore, substantially the same components as those of the semiconductor device of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIG. 9A, the gap seal 43 is formed to bend so that the intermediate portion 43a in the pressing direction (vertical direction) approaches the gap S. Thereby, when the first mold member 20 and the second mold member 30 are pressed against the semiconductor device 50 placed on the upper surface of the second seal member 33 so as to be pressed by the first seal member 23, As shown in FIG. 9B, the gap S is closed by elastic deformation so that the intermediate portion 43a of the gap seal 43 is bent toward the gap S.

  In particular, since the intermediate portion 43a is bent in advance so as to approach the gap S, the intermediate portion 43a is greatly displaced toward the gap S even with a slight vertical displacement. Even when the shape of the gap seal 43 itself varies to some extent as well as 33, the gap S can be reliably closed.

  Note that the gap seal 43 may be formed integrally with either the first seal member 23 or the second seal member 33 via a connecting portion, similarly to the gap seal 41 described above (see FIG. 8). Accordingly, the gap seal 43 and the seal member connected to the seal member are not displaced, and the gap between the gap seal 43 and the contact portion 40 is suppressed, so that the gap S can be more reliably closed. it can.

In addition, this invention is not limited to said each embodiment and modification, For example, you may actualize as follows.
(1) FIG. 10 is a perspective view showing a round bar 60 as a modification of the object to be coated. FIG. 11 is an explanatory view for explaining a process of applying the coating liquid W to the coating region 60a of the round bar 60 by the coating apparatus 10, and FIG. 11 (A) shows a state before the supply chamber 11a is formed. (B) shows after the supply chamber 11a is formed, and FIG. 11 (C) shows the gap seal 41 that is elastically deformed in an enlarged manner.
In the coating apparatus 10, the semiconductor device 50 is used as an object to be applied, and the application liquid W is not applied to the application area 50 a, but the application liquid W is applied to an application area of another object to be applied different from the semiconductor device 50. Also good.

  Specifically, a round bar-like member (hereinafter, referred to as a round bar member 60) as shown in FIG. 10 can be employed as another object to be coated. The round bar 60 has an application prohibited area 60b at both ends and an application area 60a at the center. When the coating liquid W is applied to the application region 60a of the round bar 60 formed in this way, the application prohibition regions 60b at both ends are both more than the second seal member 33, as shown in FIG. The round bar 60 is disposed on the second seal member 33 so as to be located outside and sandwiched by the gap seals 41.

  Then, as shown in FIG. 11B, when the first mold member 20 and the second mold member 30 are pressed so as to press the round bar 60 with the first seal member 23, FIG. As shown, the supply chamber 11a is formed in a state where the gap seals 41 are elastically deformed so that the gap seals 41 are thick and the gap S is closed. By supplying the coating liquid W into the supply chamber 11a, the coating liquid W can be applied to the coating region 60a of the round bar 60.

  At this time, the gap S near the round bar 60 is closed by elastically deforming the gap seals 41 so that each gap seal 41 is thickened by the pressed first mold member 20 and the second mold member 30. It is possible to prevent the coating liquid W supplied to the liquid from leaking through the gap S. In particular, since both ends of the round bar 60 are sandwiched between the gap seals 41, even an object to be coated that is easy to roll and difficult to position, such as the round bar 60, is reliably positioned and applied to the coating region 60a. The coating liquid W can be applied.

(2) In the above-described embodiment, the gap seals 41 and 43 are not limited to being formed in a quadrangular prism shape, but are formed by the outer edges of the terminals 54 to 56 and the outer surfaces of both the seal members 23 and 33. Depending on the shape of the corner, etc., for example, it may be formed in a polygonal column shape such as a triangular prism, or may be formed in a columnar shape.

(3) Further, in the above embodiment, the coating apparatus 10 does not need to rotate the storage tank 11 when it is unnecessary to remove the excess coating liquid W or to eliminate the excess coating liquid W by other means. Good. In this case, a mechanism relating to rotation such as the rotating shaft member 12 and the motor can be eliminated.

DESCRIPTION OF SYMBOLS 10 ... Coating apparatus 11 ... Storage tank 11a ... Supply chamber 11b ... Supply prohibition chamber 12 ... Rotating shaft member (rotating means) 13 ... Storage tank (supply means)
20 ... 1st type | mold member (one side pressing tool)
23. First seal member (one-side seal member)
30 ... Second mold member (other-side pressing tool)
33 ... Second seal member (other side seal member)
40 ... contact part 41, 43 ... gap seal (blocking member)
DESCRIPTION OF SYMBOLS 50 ... Semiconductor device (to-be-applied object) 50a ... Application | coating area | region 50b ... Application | coating prohibition area | region 60 ... Round bar material (to-be-applied object) 60a ... Application | coating area 60b ... Application | coating prohibition area | region S ... Gap W ... Application | coating liquid

Claims (4)

A coating apparatus (10) for coating a coating liquid (W) on a coating area (50a, 60a) excluding a coating prohibited area (50b, 60b) where coating is prohibited on an object (50, 60). ,
One-side sealing member that is partly in contact with each other when facing the coating object so as to surround one side and the other side of the coating area in a ring shape except for the coating-prohibited area with respect to the coating object (23) and the other side sealing member (33);
A one-side pressing tool (20) for pressing the one-side seal member against the object to be coated;
The other side pressing member (30) for pressing the other side sealing member against the object to be coated;
A closing member (41, 43) that is elastically deformed in response to the pressing of the one-side sealing member by the one-side pressing tool and the pressing of the other-side sealing member by the other-side pressing tool;
Supply means (13) for supplying the coating liquid into a space (11a) surrounded by the one-side seal member and the other-side seal member;
With
The closing member is disposed so as to close a gap (S) formed between the contact portion (40) between the one-side seal member and the other-side seal member and the coating object during the elastic deformation. An applicator characterized by being made.   The coating device according to claim 1, wherein the closing member (43) is formed to bend so that an intermediate portion (43a) in the pressing direction approaches the gap.   The coating device according to claim 1, wherein the closing member is formed integrally with one of the one-side seal member and the other-side seal member.   The one-side seal member and the other-side seal are arranged so that at least a part of the excess coating liquid applied to the application region is blown toward the one-side seal member and the other-side seal member. The coating device according to any one of claims 1 to 3, further comprising a rotating means (12) that rotates together with the member.

Images