JP2014086330A - Small-sized power supply module and semiconductor module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small-sized power generation device and a semiconductor module, capable of reducing thermal deterioration of a secondary battery chip mounted on a small-sized power supply module.SOLUTION: A secondary battery chip having a secondary battery main body part provided on a supporting substrate, and a thermoelectric power generation element are embedded by an embedded resin. A heat shield mechanism having a thermal conductivity lower than that of the embedded resin is provided between a surface contacted with the supporting substrate of the secondary battery main body part and the embedded resin.

Description

  The present invention relates to a small power supply module and a semiconductor module.

  In recent years, along with the sensor network concept, efforts for new energy harvesting technologies have become active. As for energy harvesting technology, watch technology that uses vibration called kinetic was put into practical use in 1988, and technology that uses temperature difference and sunlight was also put into practical use. Has been.

  Furthermore, technologies using electrets, electromagnetic waves, etc. are being developed in the United States, Europe, and Japan, and recently, the application of new systems combining energy harvesting and wireless technologies is being promoted.

  A typical chemical battery for mobile devices is a lithium ion secondary battery. On the other hand, lithium ion secondary batteries also have dangers such as expansion, rupture, and fire for safety. With the aim of improving the safety and adaptability of lithium ion secondary batteries, development of all-solid-state thin film lithium ion secondary batteries that use solid electrolytes instead of organic electrolytes is also underway.

  The all-solid-state thin film lithium ion secondary battery has features such as safety, high heat resistance, light weight, and flexibility. It is expected as an energy source for ultra-compact electronic devices, robots, micro sensors, wireless IC tags, medical implantable devices and the like.

  Such an all-solid-state secondary battery is considered to be integrated with an energy harvesting element to be used as a power source for sensor network equipment. A thermoelectric power generation element that can be produced is prominent (see, for example, Patent Documents 1 to 3).

Japanese Patent Application Laid-Open No. 07-201368 JP-A-11-284235 JP 2011-066976 A

  It is desired that the power source of the sensor network apparatus can be applied in various situations and various scenes, and that it can be applied to various sensor devices and wireless devices as an independent power source device. For this reason, it has been studied to embed and mount a secondary battery or a thermoelectric power generation element to make it smaller and improve environmental adaptability than mounting on a normal printed circuit board.

  When a thermoelectric power generation element is selected as a power supply device, the power obtained by power generation increases as the temperature difference increases. Therefore, one side of the module on which the thermoelectric power generation element is mounted may be exposed to a high temperature. When the thermoelectric generator and the all-solid-state secondary battery are embedded in the mold resin at the same time, the thermoelectric element has a structure in which both sides are exposed on the front and back of the base made of mold resin, by heating on one side and cooling on one side Generate electricity.

  The material used for embedding uses a rigid mold material. The mold material is mainly composed of a resin material such as an epoxy resin and a filler made of an inorganic material such as silica. The filler is mixed in a large amount of 50 to 90 wt% in order to make the thermal expansion coefficient of the silicon chip comparable, so that the thermal conductivity is high. In addition, when only an epoxy resin is used, the thermal conductivity is 0.2 to 0.3 W / Km, but the entire mold resin is 1 W / Km or more.

Here, with reference to FIG. 11, an example of a small power supply module provided with an EH (energy harvesting) power supply will be described. FIG. 11 is an explanatory diagram of a small power supply module, FIG. 11 (a) is a conceptual cross-sectional view, and FIG. 11 (b) is a cross-sectional view in the vicinity of an all-solid-state Li-ion battery. In the small power module, the all-solid-state Li-ion battery 20, the thermoelectric power generation element 41, the solar battery 42, and the chip capacitor 43 are molded with a mold resin 31 containing a silica filler. In the figure, for easy understanding of the configuration, the all-solid-state Li ion battery 20, the thermoelectric power generation element 41, the solar battery 42, and the chip capacitor 43 are shown aligned in a line, but the actual arrangement is arbitrary. Reference numeral 51 _{1-54 2} in the figure is an electrode provided on each of the elements, also reference numeral 53 is a heat transfer plate which is provided to the thermoelectric power generation element 41.

  The small power supply module is brought into contact with the heat source 39 and heat is converted into electricity by the thermoelectric generator 41 to charge the all-solid-state Li-ion battery 20. The solar cell 42 also charges the all-solid-state Li-ion battery 20 by converting ambient light into electricity. Thus, the weak heat and light that have not been used in the environment can be effectively converted into electric power.

As shown in FIG. 11 (b), the all-solid-state Li ion battery 20 is provided with a positive electrode side current collector 23 and a negative electrode side current collector 24 via a SiO ₂ film 22 on a silicon substrate 21, and a positive electrode side current collector. A positive electrode 25 is provided on the body 23. A solid electrolyte 26 is provided so as to cover the positive electrode 25 and the negative electrode side current collector 24, and a negative electrode 27 is provided so as to cover the solid electrolyte 26. The extraction electrode 28 ₁ is provided on the positive electrode side current collector 23, the extraction electrode 28 ₂ is provided to the negative electrode side current collector 24, molded with the protective resin 29, the exposed lead electrodes ₂₈ 1, 28 ₂ to the electrodes ₅₁ 1, 51 to form a _2. In this case, heat from the heat source 39 is transmitted to the all-solid-state Li-ion battery 20 as indicated by arrows in the drawing.

  However, secondary battery chips, such as all solid lithium ion secondary batteries, are vulnerable to heat, and it is said that the lifetime is halved when the chip temperature rises by 10 ° C. Therefore, when the heating time is sufficiently short, the temperature of the secondary battery chip does not increase so much, but when it is continuously heated, heat is transmitted through the mold resin and the battery life may be deteriorated.

  Therefore, it aims at reducing the thermal deterioration of the secondary battery chip | tip mounted in the small power supply module.

  From one aspect to be disclosed, a secondary battery chip having a support substrate, a secondary battery main body provided on the support substrate, a thermoelectric power generation element, and an embedding in which the secondary battery chip and the thermoelectric power generation element are embedded. Provided is a compact power supply module having a resin and a heat shielding mechanism having a thermal conductivity lower than that of the embedded resin between the embedded resin and a surface of the secondary battery main body contacting the support substrate. Is done.

  From another viewpoint to be disclosed, a secondary battery chip having a support substrate and a secondary battery main body provided on the support substrate, a thermoelectric power generation element, the secondary battery chip or the thermoelectric power generation element are provided. A semiconductor device as a power source, an embedded resin that embeds the secondary battery chip, the thermoelectric generator, and the semiconductor device, and a surface that contacts the support substrate of the secondary battery main body and the embedded resin A semiconductor module having a heat shielding mechanism having a thermal conductivity lower than that of the embedded resin is provided.

  According to the disclosed small power generator and semiconductor module, it is possible to reduce the thermal deterioration of the secondary battery chip mounted on the small power supply module.

It is explanatory drawing of the small power supply module of embodiment of this invention. It is explanatory drawing to the middle of the manufacturing process of the small power supply module of Example 1 of this invention. It is explanatory drawing after FIG. 2 of the manufacturing process of the small power supply module of Example 1 of this invention. It is explanatory drawing of the small power module of Example 2 of this invention. It is explanatory drawing of the small power supply module of Example 3 of this invention. It is explanatory drawing of the slit formation method in Example 3 of this invention. It is explanatory drawing of the slit formation method in Example 4 of this invention. It is explanatory drawing of the slit formation method in Example 5 of this invention. It is explanatory drawing of the small power supply module of Example 6 of this invention. It is a conceptual top view of the vibration sensor module provided with HE power supply of Example 7 of this invention. It is explanatory drawing of a small power supply module.

  Here, with reference to FIG. 1, the small-sized power supply module of embodiment of this invention is demonstrated. FIG. 1 is an explanatory diagram of a small power supply module according to an embodiment of the present invention, and FIG. 1 (a) is a conceptual cross-sectional view of the small power supply module according to the embodiment of the present invention. These are explanatory drawings of a secondary battery chip.

  In the small power module 10, the secondary battery chip 11, the thermoelectric power generation element 15, the power generation element 16, and the electronic device 17 are molded with the embedded resin 18, and a heat shielding mechanism 19 is provided on the bottom surface side of the secondary battery chip 11.

  Examples of the thermoelectric power generation element 15 include photovoltaic elements such as solar cells and MEMS vibration power generation elements. Examples of the electronic device 17 include a semiconductor integrated circuit device, a booster circuit element, a chip capacitor, or a transmitter.

  The embedding resin 18 is typically an epoxy resin containing a filler made of an inorganic material such as silica, but may be a rigid resin. The filler is mixed in a large amount of 50 to 90 wt% in order to make the thermal expansion coefficient with the secondary battery chip 11 comparable, and as a result, the thermal conductivity of the embedded resin 18 becomes 1 W / Km or more.

  As described above, when molding is performed with the embedded resin 18 that has a high thermal conductivity, heat is applied to the bottom surface side of the secondary battery chip 11 in order to reduce thermal degradation of the secondary battery chip 11 that is vulnerable to heat. A shielding mechanism 19 is provided.

  The secondary battery chip 11 is typically an all solid ion battery such as an all solid Li ion battery, an all solid Na ion battery, an all solid Mg ion battery, or an all solid Ca ion battery. Any ion battery using a liquid electrolyte may be used.

FIG. 1A is an explanatory diagram of a secondary battery chip. The secondary battery chip 11 is provided with a secondary battery main body 13 on a support substrate 12, and electrodes 14 ₁ and 14 ₂ on the exposed surface side. Is provided. A heat shielding mechanism 19 is provided on the bottom surface side of the secondary battery chip 11.

  As the heat shielding mechanism 19, a resin layer having a thermal conductivity lower than that of the embedded resin 18 provided on the back surface of the support substrate 12, a hollow filler-containing resin layer containing a hollow filler such as hollow glass beads, or the like. Use it. In addition, when the thermal expansion coefficient of the resin layer is significantly different from that of the support substrate, it is desirable to interpose a filler-containing resin layer.

  As the heat shielding mechanism 19, a slit-shaped recess or hole formed in the support substrate may be used, and since the embedded resin does not enter the slit-shaped recess or hole, it becomes hollow and air acts as a heat insulating material. Become. The thermal conductivity of air with low thermal conductivity is 0.0257 W / Km @ 20 ° C., which is even lower than 0.2 to 0.3 W / Km epoxy resin. Further, a lid member covering the slit-shaped recess or hole may be provided, and the lid member may be an inorganic material such as glass or Si, but it is more effective when a resin film having a lower thermal conductivity is used.

As a method for forming the slit-shaped recess or hole, machining may be performed using a blade, or etching may be used. In the case of forming by etching, deep RIE (reactive ion etching) using SF ₆ + O ₂ may be used, or a Bosch method in which etching is alternately switched between SF ₆ and C ₄ F ₈ may be used.

  In addition, when using a slit-shaped recessed part or a hole, it is desirable to make the minimum diameter of a slit-shaped recessed part or a hole smaller than the average diameter of the filler contained in the embedding resin 18, so that a filler having a high thermal conductivity can be obtained. It does not enter the slit-shaped recess or hole.

  By providing such a small power supply module 10 with a sensor element such as a MEMS vibration sensor or a biological sensor, a semiconductor integrated circuit device that controls the sensor element, and a transmitter that transmits an alarm based on the sensing result of the sensor element, the sensor module Can be configured.

  As described above, in the embodiment of the present invention, since the heat shielding mechanism 19 is provided on the back side of the secondary battery chip, the heat transmitted from the heat source through the embedded resin 18 can be effectively shielded. Thus, thermal degradation of the secondary battery chip can be reduced.

Next, with reference to FIG.2 and FIG.3, the small electric power generation module of Example 1 of this invention is demonstrated. First, as shown in FIG. 2A, a hollow glass bead-containing epoxy sheet 30 having a thickness of 100 μm is attached to the back surface of the all-solid-state Li ion battery 20, and is cured by heating at 150 ° C. for 1 hour. The all-solid-state Li ion battery 20 is formed by forming a Pt film having a thickness of 0.2 μm on a 5 mm × 5 mm silicon substrate 21 via a SiO ₂ film 22 to form a positive current collector 23 and a negative electrode side. A current collector 24 is formed. Next, after depositing LiCoO ₂ having a thickness of 20 μm, crystallization is performed to form the positive electrode 25.

Next, after forming the solid electrolyte 26 made of LiPON having a thickness of 1.5 μm, In having a thickness of 10 μm is deposited to form the negative electrode 27. Next, the extraction electrodes 28 ₁ and 28 ₂ are formed, and then molded with the protective resin 29. At this time, the thickness of the silicon substrate 21 is adjusted so that the total thickness of the all-solid-state Li-ion battery 20 becomes 200 μm.

  Next, as shown in FIG. 2B, the all-solid-state Li-ion battery 20, the thermoelectric power generation element 41, the solar battery 42, and the chip capacitor 43 are fixed face-down on the adhesive surface of the UV peeling tape (not shown). In the figure, each element is aligned for easy understanding, but the arrangement is arbitrary.

  Next, a mold resin 31 made of an epoxy resin containing 80% silica filler is applied, pressurized with 100 kN while degassing, heated and molded at 110 ° C., and molded by heating and curing after molding. The thermal conductivity of the mold resin 31 is about 1 W / K.

  Next, as shown in FIG. 3A, the back surface of the thermoelectric generator 41 is exposed by grinding the back surface with the electrode exposed surface as the front surface. At this time, the back surface of the all-solid-state Li ion battery 20 is not exposed, the thickness of the mold resin 31 on the back surface of the all-solid-state Li-ion battery 20 is 200 μm, and the total thickness is 500 μm.

Then, as shown in FIG. 3 (b), after peeling off the UV peelable tape, thereby forming the electrodes 51 ₁ to 54 ₂ to each element, by forming the heat transfer plate 53 to the back of the thermoelectric power generating device 41 The basic configuration of the small power supply module according to the first embodiment of the present invention is completed.

  In Example 1 of the present invention, since the epoxy resin containing hollow glass beads having the same thermal conductivity as air is used as the heat shielding mechanism, the thermal conductivity of the hollow glass bead-containing epoxy sheet 30 is It becomes 0.1 W / K or less and has a high heat insulating effect. In addition, what is necessary is just to contain the content of a hollow glass bead so that it may become close to the thermal expansion coefficient of the silicon substrate 21 according to the kind of hollow glass bead.

  Next, the small power generation module according to the second embodiment of the present invention will be described with reference to FIG. 4. Since the basic manufacturing process is the same as that of the first embodiment, only the structure will be described. FIG. 4 is an explanatory diagram of a small power module according to Embodiment 2 of the present invention, FIG. 4 (a) is a cross-sectional view of an all-solid-state Li-ion battery, and FIG. 4 (b) is a conceptual cross section of the small power module. FIG.

As shown in FIG. 4A, in Example 2 of the present invention, an epoxy sheet 33 having a thickness of 100 μm is provided on the back surface of the all-solid-state Li ion battery 20. However, the thermal expansion coefficient of the epoxy resin is 62 × 10 ⁻⁶ K ⁻¹ , which is greatly different from 2.4 ×× 10 ⁻⁶ K ^{−1 of} Si. Therefore, when the epoxy sheet 33 is heated in contact with the back surface of the all-solid-state Li-ion battery 20, there is a possibility that the all-solid-state Li-ion battery 20 may be damaged such as cracks.

Therefore, a filler-containing epoxy sheet 32 having a thickness of 100 μm and containing a silicon filler similar to the mold resin 31 is interposed between the back surface of the all-solid-state Li-ion battery 20 and the epoxy sheet 33. These sheets are laminated on the back surface of the all-solid-state Li ion battery 20 and then cured by heating. Note that the thermal expansion coefficient of the filler-containing epoxy sheet 32 is 10 × 10 ⁻⁶ K ⁻¹ which is the same as that of the mold resin 31.

  FIG. 4B is a cross-sectional view of the small power supply module molded with the mold resin 31. Since the overall thickness is 500 μm as in the first embodiment, the mold on the back side of the all-solid-state Li ion battery 20 is shown. The thickness of the resin 31 is 100 μm.

  In Example 2 of this invention, the epoxy sheet which does not contain a filler is used as a heat shielding mechanism, and since the thermal conductivity of an epoxy resin is 0.2 W / K, it has a high heat insulation effect. Thereby, thermal degradation of the all-solid-state Li ion battery 20 can be reduced.

  Next, with reference to FIG. 5 and FIG. 6, the small power supply module according to the third embodiment of the present invention will be described. The manufacturing process, basic size, and the like are the same as those of the first embodiment. FIG. 5 is an explanatory view of a small power module according to Embodiment 3 of the present invention, FIG. 5 (a) is a cross-sectional view of an all-solid-state Li-ion battery, and FIG. 5 (b) is a conceptual cross-sectional view of the small power module. It is.

  As shown in FIG. 5A, a slit 34 having a width of 40 μm is formed on the back side of the silicon substrate 21 to a depth of 3/4 of the thickness of the silicon substrate 21, and the L & S (line and space) becomes 1: 1. To form.

FIG. 5B is a cross-sectional view after molding with a mold resin in the same manner as in the first embodiment. Since the silica filler 35 has a diameter of 50 μm or more, it does not enter the slit 34 having a width of 40 μm. In addition, the epoxy resin which is a component of the mold resin 31 enters up to about 1/3 of the depth of the slit 34 and becomes the remaining 2/3 air layer. The thermal resistance up to the depth of the slit 34 is 3.5 × 10 ⁻⁴ K / W, which is lower than the thermal resistance 8.9 × 10 ⁻⁵ K / W of the silicon substrate 21 where the slit 34 is not formed. It is improved by an order of magnitude and heat insulation is improved.

  In the third embodiment of the present invention, the slit 34 is formed in the silicon substrate 21 as a heat shielding mechanism, and the air layer in the slit 34 is used as a heat insulating mechanism. Can be reduced.

  6A and 6B are explanatory diagrams of a slit forming method according to the third embodiment of the present invention. FIG. 6A is a cross-sectional view in the middle of processing, and FIG. 6B is a cross-sectional view after processing. As shown in FIG. 6A, slits 34 having a width of 40 μm and a depth of 3/4 of the thickness of the silicon substrate 21 are sequentially formed at a pitch of 80 μm using a blade 36.

  Next, Embodiment 4 of the present invention will be described with reference to FIG. 7, but only the slit forming method is different because the other conditions are the same as in Embodiment 3 except that the slit forming method is different. Will be explained.

  FIG. 7 is an explanatory view of a slit forming process in Example 4 of the present invention. As shown in FIG. 7A, resist patterns 37 having a width of 20 μm are provided at a pitch of 40 μm and L & S is 1: 1. A resist pattern 37 is formed.

Next, as shown in FIG. 7B, a slit 34 having a depth of 4/5 of the thickness of the silicon substrate 21 is formed by using deep RIE using SF ₆ + O ₂ with the resist pattern 37 as a mask. . Next, the resist pattern 37 is peeled off to complete the all-solid-state Li ion battery 20 having a heat shielding mechanism.

Next, Embodiment 5 of the present invention will be described with reference to FIG. 8 except that the slit forming method is different and the other conditions are the same as in Embodiment 3 above, so that only the slit forming method is used. Will be explained. Here, etching is performed using a Bosch method in which SF ₆ and C ₄ F ₈ are alternately switched and etched.

FIG. 8 is an explanatory diagram of a slit forming process in Example 5 of the present invention. As shown in FIG. 8A, resist patterns 37 having a width of 20 μm are provided at a pitch of 40 μm and L & S is 1: 1. A resist pattern 37 is formed. Next, a shallow slit 34 is formed by etching in an etching mode by RIE using SF ₆ with the resist pattern 37 as a mask.

Then, as shown in FIG. A passivation mode etching is performed by RIE using C ₄ F ₄ to form a SiO ₂ film 38 on the surface of the slit 34. Next, as shown in FIG. 8C, etching in the etching mode is performed again by RIE using SF ₆ to deepen the slit 34. This process is repeated until the depth of the slit 34 becomes 4/5 of the thickness of the silicon substrate 21.

  Next, with reference to FIG. 9, the small power supply module according to the sixth embodiment of the present invention will be described. The basic configuration is the same as that of the third embodiment described above, but here, a lid member covering the slit is used. While providing, the all-solid-state Na ion battery is used as a secondary battery. FIG. 9A is a cross-sectional view of an all-solid Na ion battery, and FIG. 8B is a conceptual cross-sectional view of a small power supply module.

As shown in FIG. 9A, the all-solid-state Na ion battery 60 is formed by forming a Pt film having a thickness of 0.2 μm on a 5 mm × 5 mm silicon substrate 61 with a SiO ₂ film 62 interposed therebetween. The side current collector 63 and the negative electrode side current collector 64 are formed. Next, a TiS ₂ crystal having a thickness of 20 μm is formed as the positive electrode 65.

Next, after forming a solid electrolyte 66 made of ceramic glass on which cubic Na ₃ PS ₄ is deposited, a Na—Sn alloy is deposited to form a negative electrode 67. Next, the extraction electrodes 68 ₁ and 68 ₂ are formed and then molded with the protective resin 69. At this time, the thickness of the silicon substrate 61 is adjusted so that the total thickness of the all-solid Na ion battery 60 is 200 μm.

  Also in this case, similarly to the third embodiment, the slits 70 having a width of 40 μm are formed at a pitch of 80 μm so as to be 3/4 of the thickness of the silicon substrate 61 by using a blade. Next, the open end of the slit 70 is covered with a resin sheet 71 made of epoxy resin.

  FIG. 9B is a cross-sectional view after molding with a mold resin in the same manner as in Example 3. Since the open end of the slit 70 is covered with the resin sheet 71, the epoxy resin that is a component of the mold resin 31 does not enter the slit 70. Accordingly, since the entire air layer in the slit 70 becomes a heat insulating material, the heat insulating effect of the slit 70 can be further enhanced.

  Next, with reference to FIG. 10, a vibration sensor module including an EH (energy harvesting) power supply element according to the seventh embodiment of the present invention will be described. FIG. 10 is a conceptual plan view of a vibration sensor module including an EH power supply element according to Example 7 of the present invention. This vibration sensor module includes the all-solid-state Li-ion battery 20, the thermoelectric power generation element 41, and the solar battery 42, as well as the booster circuit elements 44 and 45, the control semiconductor integrated circuit device 46, the MEMS vibration sensor 47, and the transmitter 48. Are integrally molded.

  In this vibration sensor module, environmental energy such as heat and light is converted into electricity by the thermoelectric power generation element 41 and the solar battery 42, the output voltage is boosted by the booster circuit elements 44 and 45, and then the all-solid-state Li ion battery 20 is replaced. Charge. The control semiconductor integrated circuit device 46 uses the all-solid-state Li-ion battery 20 as a power source, and issues a warning to nearby passing vehicles or the like by a transmitter 48 in response to an earthquake or abnormal vibration detected by the MEMS vibration sensor 47.

  Thus, in Example 7 of this invention, since environmental energy is accumulate | stored in the all-solid-state Li ion battery 20, and it is using as a power supply, an external wiring free sensor module is realizable.

Here, the following supplementary notes are attached to the embodiments of the present invention including Examples 1 to 7.
(Supplementary note 1) A secondary battery chip having a support substrate, a secondary battery main body provided on the support substrate, a thermoelectric power generation element, an embedded resin for embedding the secondary battery chip and the thermoelectric power generation element, A compact power supply module having a thermal shielding mechanism having a thermal conductivity lower than that of the embedded resin between a surface of the secondary battery main body contacting the support substrate and the embedded resin.
(Supplementary Note 2) The thermal shielding mechanism is a resin layer provided between the support substrate and the embedded resin, and the thermal conductivity of the resin layer is lower than the thermal conductivity of the embedded resin. The small power supply module according to Supplementary Note 1.
(Additional remark 3) The said heat shielding mechanism consists of a hollow filler containing resin layer provided between the said support substrate and the said embedding resin, The small power module of Additional remark 1 characterized by the above-mentioned.
(Additional remark 4) The said heat shielding mechanism is a slit-shaped recessed part or a hole formed in the said support substrate, and more than half of the inside of the said slit-shaped recessed part or a hole is a space | gap, The additional remark 1 characterized by the above-mentioned. Small power module.
(Supplementary note 5) The small power module according to supplementary note 4, wherein the support substrate is a silicon substrate provided with an insulating film on a side in contact with the secondary battery main body.
(Supplementary note 6) The small power supply module according to supplementary note 4 or supplementary note 5, wherein the embedded resin contains a filler, and a minimum diameter of the slit-shaped recess or hole is smaller than an average diameter of the filler.
(Supplementary note 7) The small power source according to any one of supplementary notes 4 to 6, wherein a lid member that prevents the embedded resin from entering is provided on an open end side of the slit-shaped recess or hole. module.
(Additional remark 8) The said secondary battery chip | tip is an all-solid-state secondary battery provided with the solid electrolyte part, and the ion which shows the conductivity in the said solid electrolyte part is any of lithium ion, sodium ion, magnesium ion, or calcium ion The small power supply module according to any one of supplementary notes 1 to 7, wherein
(Appendix 9) In any one of appendices 1 to 8, wherein at least one of a photovoltaic element or a vibration power generation element that converts vibration energy into electricity is embedded in the embedded resin. Small power supply module as described.
(Supplementary Note 10) A secondary battery chip having a support substrate, a secondary battery main body provided on the support substrate, a thermoelectric power generation element, and a semiconductor device using the secondary battery chip or the thermoelectric power generation element as a power source The embedded resin that embeds the secondary battery chip, the thermoelectric power generation element, and the semiconductor device, and the heat of the embedded resin between the embedded resin and the surface of the secondary battery body that contacts the support substrate. A semiconductor module having a heat shielding mechanism having a thermal conductivity lower than the conductivity.
(Supplementary Note 11) The semiconductor device includes a semiconductor integrated circuit device and a semiconductor sensor, and the semiconductor integrated circuit device boosts an output voltage of the thermoelectric power generation element or the environmental power generation element, and operates the semiconductor sensor. The semiconductor module according to appendix 10, further comprising a control circuit for controlling.
(Supplementary note 12) The semiconductor module according to supplementary note 11, wherein a transmitter is embedded in the embedded resin, and sensor information is transmitted from the transmitter in accordance with a detection output of the semiconductor sensor.

10 small power modules 11 secondary cell chip 12 support substrate 13 battery main body ₁₄ 1, 14 ₂ electrode 15 thermoelectric power generating element 16 generating element 17 electronic device 18 buried resin 19 heat shielding mechanism 20 all-solid-state Li-ion battery 21, 61 Silicon substrate 22, 62 SiO ₂ film 23, 63 Positive electrode side current collector 24, 64 Negative electrode side current collector 25, 65 Positive electrode 26, 66 Solid electrolyte 27, 67 Negative electrode 28 ₁ , 28 ₂ , 68 ₁ , 68 ₂ Electrodes 29, 69 Protective resin 30 Hollow glass bead-containing epoxy sheet 31 Mold resin 32 Filler-containing epoxy sheet 33 Epoxy sheet 34, 70 Slit 35 Silica filler 36 Blade 37 Resist pattern 38 SiO ₂ film 39 Heat source 41 Thermoelectric power generation element 42 Solar cell 43 Chip capacitors 44, 45 Boost circuit element 4 Controlling semiconductor integrated circuit device 47 MEMS vibration sensor 48 transmitter ₅₁ 1-54 ₂ electrode 53 heat transfer plate 60 all-solid Na ion battery 71 resin sheet

Claims (5)

A secondary battery chip having a support substrate and a secondary battery main body provided on the support substrate;
A thermoelectric generator,
An embedded resin for embedding the secondary battery chip and the thermoelectric power generation element;
A compact power supply module having a thermal shielding mechanism having a thermal conductivity lower than that of the embedded resin between a surface of the secondary battery main body contacting the support substrate and the embedded resin. The heat shielding mechanism is a resin layer provided between the support substrate and the embedded resin;
The small power supply module according to claim 1, wherein the thermal conductivity of the resin layer is lower than the thermal conductivity of the embedded resin.   The small-sized power supply module according to claim 1, wherein the heat shielding mechanism includes a hollow filler-containing resin layer provided between the support substrate and the embedded resin.   2. The small power supply module according to claim 1, wherein the heat shielding mechanism is a slit-shaped recess or hole formed in the support substrate, and at least half of the slit-shaped recess or hole is a space. . A secondary battery chip having a support substrate and a secondary battery main body provided on the support substrate;
A thermoelectric generator,
A semiconductor device using the secondary battery chip or the thermoelectric generator as a power source;
An embedded resin for embedding the secondary battery chip, the thermoelectric generator and the semiconductor device;
A semiconductor module having a thermal shielding mechanism having a thermal conductivity lower than a thermal conductivity of the embedded resin between a surface of the secondary battery main body contacting the support substrate and the embedded resin.

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