JP2014072414A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device the chromaticity-oriented characteristics of which do not deteriorate even if a multilayer substrate is used, and the light extraction efficiency of which is excellent.SOLUTION: A light-emitting device 1 comprises: a multilayer substrate 10 having a recess 10a in the center; a metal film 20 patterned to form the wiring on the bottom surface of the recess 10a; a light-emitting element 30 arranged on the metal film 20; a light reflective resin 50 formed around the light-emitting element 30; and a sealing resin 60 filling the recess 10a. The metal film 20 has connections 214, 221, 231 formed under the light-emitting element 30, and round portions 211, 212, 213, 222, 223, 232, 233 formed around the light-emitting element 30. On the bottom surface of the recess 10a, the light reflective resin 50 is dammed by the round portions 211, 212, 213, 222, 223, 232, 233, and formed on the outside thereof.

Description

  The present invention relates to a light emitting device using a light emitting element such as an LED.

  In general, a light-emitting device using a light-emitting element is known to be small, power efficient, and emit bright colors. Since the light-emitting element according to this light-emitting device is a semiconductor element, it has not only less fear of ball breakage but also excellent initial drive characteristics and is resistant to repeated vibration and on / off. Because of such excellent characteristics, light emitting devices using light emitting elements such as light emitting diodes (LEDs) and laser diodes (LDs) are used as various light sources.

  Conventionally, as such a light emitting device, for example, as shown in Patent Document 1, a substrate (case) having a recess, a lead wiring (metal lead) disposed on the bottom surface of the recess, and the lead wiring Proposed is a light-emitting device comprising: a light-emitting element (LED chip) disposed on the substrate; and a light-reflective resin (first sealing layer) provided in a recess of the substrate so as to cover a side surface of the light-emitting element. Has been. This light-emitting device is intended to increase the reflectance of light emitted from the light-emitting element and improve the light extraction efficiency by providing a light-reflective resin in the recess of the substrate.

  However, in the light emitting device proposed in Patent Document 1, since the side surface of the light emitting element is coated with the light reflecting resin, the emission of light from the side surface of the light emitting element is hindered, and the directional chromaticity characteristics are poor. was there. Note that “directional chromaticity characteristics” indicate chromaticity at each angle on the light emitting surface of the light emitting element, and “bad chromaticity characteristics” means, for example, the region on the upper surface of the light emitting element and the others. It is shown that the difference in chromaticity is large between these areas.

  Therefore, in order to solve such a problem, for example, in Patent Document 2, a convex portion is formed on a lead wiring (lead), and a light emitting element (semiconductor light emitting element) is disposed on the convex portion, whereby the light emission. There has been proposed a light-emitting device in which a light-reflective resin (a reflective filler-containing resin layer) is provided in a recess of a substrate (molded body) so as not to contact the element.

JP 2010-232203 A JP 2008-60344 A

  Here, in the light emitting device proposed in Patent Document 2, since the substrate and the lead wiring are integrally formed by insert molding, for example, the lead wiring in which the convex portion is formed is arranged on the bottom surface of the concave portion of the substrate. It was easy to do. On the other hand, when the light emitting device is configured using a laminated substrate in which a plurality of plate-like members are laminated instead of such an integrally formed substrate, the above-described convex portions are formed between the plate-like members. It was difficult to arrange the lead wires. Therefore, when a light emitting device is configured using a laminated substrate, there is no technique for separating the light emitting element and the light reflecting resin, and the above-described problem of deterioration of directional chromaticity characteristics cannot be solved. It was.

  The present invention has been made in view of the above problems, and provides a light-emitting device that does not deteriorate the directional chromaticity characteristics and is excellent in light extraction efficiency even when a laminated substrate is used. The task is to do.

  In order to solve the above problems, a light-emitting device according to the present invention includes a laminated substrate in which a plurality of plate-like members are stacked, a recess formed in the center, and a metal formed as a wiring pattern on the bottom surface of the recess. A film, a light emitting element disposed on the metal film, a light reflective resin formed around the light emitting element in the concave part, and the concave part so as to cover the light emitting element and the light reflective resin A sealing resin filled therein, wherein the metal film has a connection portion formed at a lower portion of the light emitting element and a position spaced apart from a side surface of the light emitting element, The light-reflecting resin is clogged by the peripheral portion of the metal film on the bottom surface of the concave portion of the multilayer substrate, and is formed outside the peripheral portion. It was set as the structure.

  In the light emitting device having such a configuration, a wiring-like metal film is formed so as to surround the light emitting element at a position spaced apart from the side surface of the light emitting element. This prevents the resin material of the light-reflective resin applied at the time of manufacture from proceeding in the center of the concave portion of the laminated substrate, that is, in the direction of the light-emitting element, and allows light to be applied only to the region outside the peripheral part away from the light-emitting element. It can be set as the state in which reflective resin was formed.

  Here, in the light emitting device according to the present invention, the light emitting element includes a P electrode and an N electrode arranged toward the bottom surface of the concave portion of the multilayer substrate, and the metal film is disposed on the bottom surface of the concave portion of the multilayer substrate. The metal is formed so as to enter the lower part of the light emitting element from outside the periphery of the light emitting element, and includes a P side wiring connected to the P electrode and an N side wiring connected to the N electrode, and the metal A connection portion of the film, a part of the P-side wiring connected to the P electrode under the light emitting element, a part of the N side wiring connected to the N electrode under the light emitting element, The surrounding portion of the metal film is formed to branch along the shape of the light emitting element at a position where either the P side wiring or the N side wiring enters the lower part of the light emitting element. It is good also as a structure which is a thing.

  The light-emitting device having such a configuration uses a branching wiring for supplying current to the light-emitting element as a circular portion formed to block the resin material of the light-reflective resin applied at the time of manufacture. Therefore, the resin material of the light reflecting resin applied in the vicinity of the light emitting element is blocked, and the space on the bottom surface of the concave portion of the multilayer substrate can be efficiently used without waste.

  Further, in the light emitting device according to the present invention, the light emitting element includes a P electrode and an N electrode arranged toward the bottom surface of the concave portion of the multilayer substrate, and the metal film is disposed on the bottom surface of the concave portion of the multilayer substrate. The metal film includes a P-side wiring connected to the P electrode and an N-side wiring connected to the N electrode, and is formed so as to enter the lower part of the light emitting element from outside the periphery of the light emitting element. Are connected to the P electrode at the lower part of the light emitting element and part of the N side wiring to be connected to the N electrode at the lower part of the light emitting element. The metal film is formed by branching along the shape of the light emitting element at a position where each of the P side wiring and the N side wiring enters the lower part of the light emitting element. It is good also as a structure.

  The light-emitting device having such a configuration uses a branching wiring for supplying current to the light-emitting element as a circular portion formed to block the resin material of the light-reflective resin applied at the time of manufacture. Therefore, the resin material of the light reflecting resin applied in the vicinity of the light emitting element is blocked, and the space on the bottom surface of the concave portion of the multilayer substrate can be efficiently used without waste.

  In the light emitting device according to the present invention, the light emitting element includes a P electrode and an N electrode arranged toward the bottom surface of the concave portion of the multilayer substrate, and the metal film is disposed on the bottom surface of the concave portion of the multilayer substrate. The light-emitting element is formed so as to enter the lower part of the light-emitting element from the periphery of the light-emitting element, and surrounds the light-emitting element, a P-side wiring connected to the P electrode, an N-side wiring connected to the N electrode, and The metal film connecting portion is connected to a part of the P-side wiring connected to the P electrode at a lower portion of the light emitting element and to the N electrode at a lower portion of the light emitting element. A part of the N-side wiring, and a part of the P-side wiring and a part of the N-side wiring at a position where a surrounding portion of the metal film enters a lower part of the light emitting element, It may be configured with wiring .

  In the light emitting device having such a configuration, in addition to the P-side wiring and the N-side wiring, a separate surrounding wiring is used as a circuit portion. Depending on the case, it is possible to provide the circulating portion with a desired size and a desired shape.

  In addition, the light emitting device according to the present invention includes a protection element disposed on the metal film, and the metal film is formed below the protection element and connected to the other electrode of the protection element And one side wiring for the protection element connected to one electrode of the protection element via a wire, and the wire is wired outside the circumferential portion of the metal film. It is preferable to have a configuration.

  In the light emitting device having such a configuration, since the distance between the wire, the light emitting element, and the circulating portion can be increased, the resin material of the light-reflective resin applied at the time of manufacture flows into the circulating portion through the wire. Thus, contact with the side surface of the light emitting element is prevented.

  Moreover, it is preferable that the light emitting device according to the present invention has a configuration in which the protection element other-side wiring is formed at a position lower than a position where the protection element one-side wiring is formed.

  In the light emitting device having such a configuration, when one electrode of the protective element and the other wiring for the protective element are connected by a wire, the angle of the wire becomes steep, so that the light applied at the time of manufacture The resin material of the reflective resin is prevented from traveling to an unintended region such as a region where the light emitting element is installed along the wire.

  The light emitting device according to the present invention further includes a protective element disposed on the metal film, wherein the protective element has one and the other electrodes respectively disposed toward a bottom surface of the concave portion of the multilayer substrate, and the metal A film is formed under one electrode of the protection element and is connected to the other electrode for the protection element connected to the one electrode, and is formed under the other electrode of the protection element, and the other electrode It is preferable to further include a protective element one-side wiring to be connected.

  Since the light emitting device having such a configuration eliminates the need to use a wire by mounting the protective element face down, the resin material of the light-reflective resin applied at the time of manufacture passes through the wire and the light emitting element is installed. Proceeding to an unintended region such as a region that has been made is prevented.

  In the light emitting device according to the present invention, the metal film preferably has a thickness of 5 to 100 μm.

  In a light-emitting device having such a configuration, if the metal film has a thickness within this range, for example, a resin material of a light-reflective resin having a general viscosity proceeds over the metal film in the direction of the light-emitting element. Is sufficiently prevented.

  The light-emitting device according to the present invention preferably has a configuration in which the light-reflective resin is formed using a resin having a viscosity of 1 to 20 Pa · s.

  In a light-emitting device having such a configuration, if the light-reflective resin material has a viscosity in this range, the light-reflective resin resin material sufficiently stops, for example, by a metal film having a general thickness. Will be.

  According to the light emitting device of the present invention, the light reflecting resin can be prevented from coming into contact with the side surface of the light emitting element by the circular portion of the metal film. The degree characteristic is not deteriorated. Further, according to the light emitting device of the present invention, light emission from the side surface of the light emitting element is not hindered, so that the light extraction efficiency is improved.

It is a front view which shows the whole structure of the light-emitting device which concerns on 1st Embodiment of this invention. It is sectional drawing which shows the whole structure of the light-emitting device concerning 1st Embodiment of this invention, Comprising: (a) is AA sectional drawing of FIG. 1, (b) is the B section enlarged view of (a), It is. It is a top view which shows the structure of the metal film with which the light-emitting device which concerns on 1st Embodiment of this invention is provided. It is a top view which shows the structure of the light emitting element with which the light-emitting device which concerns on embodiment of this invention is equipped, Comprising: (a) is a top view which shows the detail of a light emitting element, (b) is a light emitting element which turned the electrode downward. It is a top view which shows the state which mounted the face down on the recessed part and metal film of the board | substrate. BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic for demonstrating the wiring method of the protection element with which the light-emitting device which concerns on embodiment of this invention is equipped, Comprising: (a) is one side or the other electrode of a protection element, one side wiring for protection elements, and protection The top view which shows the state by which the wire which connects either of the other side wiring for elements was wired inside the surrounding part of a metal film, (b) is light-reflective around the light emitting element shown to (a) It is a top view which shows the state in which resin was formed. It is the schematic which shows an example of the manufacturing method of the light-emitting device which concerns on 1st Embodiment of this invention, Comprising: (a) is sectional drawing which shows a laminated substrate creation process, (b) is a cross section which shows a light emitting element arrangement | positioning process. FIG. 4C is a cross-sectional view showing the light-reflective resin forming step, and FIG. 4D is a cross-sectional view showing the sealing resin forming step. It is the schematic which shows the detail of the light reflective resin formation process in an example of the manufacturing method of the light-emitting device which concerns on 1st Embodiment of this invention, Comprising: (a) is light-reflective at two points on the recessed part of a laminated substrate. The top view which shows a mode that the resin material of resin was dripped, (b) is a plane which shows a mode that the resin material of the light-reflective resin dripped on the recessed part of a laminated substrate propagates the inner surface of a recessed part by capillary phenomenon FIG. 4C is a plan view showing a state in which the resin material of the light-reflective resin dropped on the concave portion of the laminated substrate travels along the inner side surface of the concave portion by capillarity and covers all the inner side surface of the concave portion. d) is a plan view showing a state in which a light-reflective resin is formed on the outer side of the circumferential portion of the metal film. It is the schematic which shows the whole structure of the light-emitting device which concerns on 2nd Embodiment of this invention, Comprising: (a) is a top view which shows the whole structure of a light-emitting device, (b) is EE cross section of (a). Figure. It is a top view which shows the whole structure of the light-emitting device which concerns on 3rd Embodiment of this invention. It is a top view which shows the structure of the metal film with which the light-emitting device which concerns on 4th Embodiment of this invention is provided. It is a top view which shows the structure of the metal film with which the light-emitting device which concerns on 5th Embodiment of this invention is provided. It is a top view which shows the structure of the metal film with which the light-emitting device which concerns on 6th Embodiment of this invention is provided.

  Hereinafter, light-emitting devices according to embodiments of the present invention will be described with reference to the drawings. Note that the drawings referred to in the following description schematically show the present invention, and therefore the scale, spacing, positional relationship, etc. of each member may be exaggerated, or some members may be omitted. is there. Moreover, in the following description, the same name and code | symbol are showing the same or the same member in principle, and a detailed description is abbreviate | omitted suitably.

<First Embodiment>
[Configuration of light emitting device]
The configuration of the light emitting device 1 according to the first embodiment of the present invention will be described in detail with reference to FIGS. The light emitting device 1 can be used as a light source of a display device or a lighting device, for example. Here, as shown in FIGS. 1 and 2, the light emitting device 1 includes a laminated substrate 10, a metal film 20, a light emitting element 30, a protective element 40, a light reflecting resin 50, a sealing resin 60, It has.

  The laminated substrate 10 is for installing various members constituting the light emitting device 1. The laminated substrate 10 is formed in a rectangular shape when viewed in plan as shown in FIG. 1, and is formed in a plate shape when viewed in cross section as shown in FIG. Further, as shown in FIG. 2A, a concave portion 10 a for installing various members constituting the light emitting device 1 is formed in the center of the multilayer substrate 10.

  As shown in FIGS. 1 and 2A, a metal film 20 is formed as a wiring pattern on the bottom surface of the concave portion 10a of the multilayer substrate 10, and the light emitting element 30 is disposed on the metal film 20. . In addition, on the bottom surface of the recess 10a, as shown in FIG. 2A, a light reflecting resin 50 is formed around a central region where the light emitting element 30 is installed. The recess 10a is filled with a sealing resin 60 so as to cover a member such as the light emitting element 30 as shown in FIG.

  Specifically, as shown in FIG. 2A, the laminated substrate 10 includes a flat plate-like first substrate 11, a frame-like second substrate 12 having an opening 12a formed at the center, and an opening at the center. The frame-shaped third substrate 13 on which the portion 13a is formed is configured by being laminated in this order. Here, the opening 13a of the third substrate 13 is formed larger than the opening 12a of the second substrate 12, as shown in FIG. Therefore, as shown in FIG. 2A, the concave portion 10a of the multilayer substrate 10 is configured such that the opening increases toward the top, and a step portion 10b is formed on the inner surface of the concave portion 10a. ing.

  The light-emitting device 1 includes such a stepped portion 10b on the inner surface of the recessed portion 10a of the multilayer substrate 10, thereby locking the light-reflecting resin 50 and making it difficult to peel off as shown in FIG. Can do. As shown in FIG. 1, two corners on the third substrate 13 arranged in the uppermost layer of the laminated substrate 10 are used to discriminate the cathode side of the metal film 20 as shown in FIG. A cathode mark CM is formed. The shape and material of the laminated substrate 10 are not particularly limited, and can be formed with an arbitrary shape and material.

  The metal film 20 supplies power from an external power source to the light emitting element 30. As shown in FIGS. 2A and 3, the metal film 20 is formed as a wiring pattern on the first substrate 11 of the multilayer substrate 10, that is, on the bottom surface of the recess 10a. The metal film 20 is exposed on the side surface or the bottom surface of the light emitting device 1, and the exposed portion is connected to an external power source (not shown). 3 shows a state in which the light emitting element 30, the protective element 40, the light reflecting resin 50, the sealing resin 60, and the wire W are removed from the configuration of the light emitting device 1 shown in FIGS. The overall structure of the metal film 20 is shown.

  As shown in FIG. 3, the metal film 20 includes a P-side wiring 21, N-side wirings 22 and 23, a protection element one-side wiring 24, and a protection element other-side wiring 25.

  The P-side wiring 21 is connected to a P electrode 31 of the light emitting element 30 (see FIG. 4A described later). When the light emitting element 30 is mounted as shown in FIG. 1, the P-side wiring 21 is formed on the first substrate 11 of the laminated substrate 10, that is, on the bottom surface of the recess 10 a from the periphery of the light emitting element 30. It is formed so as to enter the lower part. In other words, as shown in FIG. 3, the P-side wiring 21 is a recess in which the light emitting element 30 (see FIG. 1) is disposed on the recess 10 a of the multilayer substrate 10 from the end (here, the right end) of the recess 10 a. It is formed to extend to the central region 10a, and is formed in a shape corresponding to a P electrode 31 (see FIG. 4A described later) of the light emitting element 30 described later in the central region of the recess 10a. Further, as shown in FIG. 3, the P-side wiring 21 is formed to extend from the central region of the recess 10a toward the end of the recess 10a (here, the lower left end).

  More specifically, as shown in FIG. 3, the P-side wiring 21 is composed of circuit portions 211, 212, 213, a connection portion 214, and an extension portion 215. The extending portion 215 serves as a molten solder escape region in the light emitting element installation step (see FIG. 6B described later) in the method of manufacturing the light emitting device 1 described later.

  The N-side wirings 22 and 23 are connected to the N electrodes 32 and 33 (see FIG. 4A described later) of the light emitting element 30. When the light emitting element 30 is mounted as shown in FIG. 1, the N-side wiring portions 22 and 23 emit the light from outside the periphery of the light emitting element 30 on the first substrate 11 of the multilayer substrate 10, that is, on the bottom surface of the recess 10 a. It is formed so as to enter the lower part of the element 30. In other words, as shown in FIG. 3, the N-side wiring 22 has the light emitting element 30 (see FIG. 1) disposed on the recess 10 a of the multilayer substrate 10 from the end of the recess 10 a (here, the lower right end). It is formed by extending to the central region of the recess 10a, and is formed in a shape corresponding to the opening 32a of the N electrode 32 (see FIG. 4A described later) of the light emitting element 30 described later in the central region of the recess 10a. Yes. Further, as shown in FIG. 3, the N-side wiring 23 is formed on the concave portion 10 a of the multilayer substrate 10 from the end (here, the left end) of the concave portion 10 a where the light emitting element 30 (see FIG. 1) is disposed. In the central region of the recess 10a, a shape corresponding to an opening 33a of an N electrode 33 (see FIG. 4A described later) of the light emitting element 30 described later is formed.

  More specifically, the N-side wiring 22 includes a connection portion 221 and surrounding portions 222 and 223, as shown in FIG. More specifically, the N-side wiring 23 includes a connection portion 231 and surrounding portions 232 and 233, as shown in FIG.

  The protective element one-side wiring 24 is provided with a protective element 40 and is connected to the other electrode (N electrode in this case) of the protective element 40. As shown in FIG. It is formed with a predetermined area near the corner in 10a. Specifically, as shown in FIG. 3, the protective element one-side wiring 24 is located outside the peripheral portion 211 of the metal film 20 at a position away from the region where the light emitting element 30 is disposed. . Further, the other wiring 25 for the protective element is connected to one electrode (P electrode in this case) of the protective element 40 through a wire W, and as shown in FIG. It is formed with a predetermined area near the inner corner. Specifically, as shown in FIG. 3, the protection element other-side wiring 25 is located outside the peripheral portion 233 of the metal film 20 at a position away from the region where the light emitting element 30 is disposed. . Here, the protection element one-side wiring 24 functions as a P-side wiring, and the protection element other-side wiring 25 functions as an N-side wiring.

  Here, the connection portions 214, 221, and 231 described above are for connection to the P electrode 31 and the N electrodes 32 and 33 formed in the light emitting element 30 shown in FIG. As shown in FIG. 3, the connection portion 214 constituting a part of the P-side wiring 21 is formed in a shape corresponding to the outer shape of the light emitting element 30, and the N electrode of the light emitting element 30 shown in FIG. The shape corresponding to the extended portions 32b and 33b of 32 and 33 is removed. Note that the outer shape of the connection portion 214 is made to correspond to the light emitting element 30 in the light emitting element installation step (see FIG. 6B described later) in the manufacturing method of the light emitting device 1 described later. This is because the light emitting element 30 is self-aligned by the surface tension of the solder melted by reflow when bonding the solder with solder.

  As shown in FIG. 3, the connection portions 214, 221, and 231 are formed at predetermined intervals from the surrounding portions 211, 212, 213, 222, 223, 232, and 233. And the light emitting element 30 is mounted in the connection part 214,221,231 because the connection part 214,221,231 and the surrounding part 211,212,213,222,223,232,233 are separated in this way. In addition, the resin material of the light-reflecting resin 50 dammed by the rotating portions 211, 212, 213, 222, 223, 232, and 233 does not adhere to the side surface of the light emitting element 30. In the following description, when all the surrounding portions 211, 212, 213, 222, 223, 232, and 233 included in the metal film 20 are indicated, they are simply shown as “around portions 211 to 233”. .

  As shown in FIGS. 3 and 4B, the connection portion 214 is formed below the P electrode 31 of the light emitting element 30 and is connected to the P electrode 31. On the other hand, the connecting portions 221 and 231 constituting a part of the N-side wirings 22 and 23 are connected to the openings 32a and 33a of the N electrodes 32 and 33 of the light emitting element 30, as shown in FIGS. It is formed to extend downward, and is connected to the N electrodes 32 and 33 at the positions of the openings 32a and 33a, respectively.

  Here, the surrounding portions 211 to 233 are used to block the resin material of the light reflective resin 50 applied at the time of manufacture so that the light reflective resin 50 does not come into contact with the light emitting element 30 (see FIG. 1). . The circular portions 211 to 233 are spaced apart from the side surfaces of the light emitting elements 30 (see FIG. 1) in a state where the light emitting elements 30 are installed on the connection portions 214, 221, and 231 as shown in FIG. In position, the light emitting element 30 is intermittently formed so as to surround the periphery.

  Among the surrounding portions 211 to 233, as shown in FIG. 3, the surrounding portions 211, 212, and 213 that constitute a part of the P-side wiring 21 are arranged so that the P-side wiring 21 is outside the periphery of the light emitting element 30 (see FIG. 1). From the position just before entering the lower part of the light emitting element 30, it branches along the shape of the light emitting element 30. That is, as shown in FIG. 3, the P-side wiring 21 extends from the end (here, the right end) of the concave portion 10 a of the multilayer substrate 10 toward the connection portion 214 where the light emitting element 30 is installed. At a position just before entering the lower part, it branches into a wiring toward the connection part 214, a circulation part 213, and a circulation part 211. Further, as shown in FIG. 3, the circulating portion 211 extends along the side surface of the light emitting element 30, and is further branched into a wiring that goes to the connecting portion 214 at an intermediate position of the side surface and the circulating portion 21.

  Further, among the surrounding portions 211 to 233, the surrounding portions 222, 223, 232, and 233 constituting part of the N-side wirings 22 and 23, as shown in FIG. In FIG. 1), the light is branched along the shape of the light emitting element 30 at positions just before entering the lower part of the light emitting element 30 from outside the periphery. That is, as shown in FIG. 3, the N-side wiring 22 extends from the end of the recess 10 a of the laminated substrate 10 (here, the lower right end) in the direction of the connection portion 214 of the P-side wiring 21 where the light emitting element 30 is installed. At a position just before entering the lower part of the light emitting element 30, the branching portion 221 is branched into a connection portion 221, a circulation portion 222, and a circulation portion 223 toward the connection portion 214. Further, as shown in FIG. 3, the N-side wiring 23 extends from the end of the recess 10 a of the laminated substrate 10 (here, the left end) in the direction of the connection portion 214 of the P-side wiring 21 where the light emitting element 30 is installed, At a position just before entering the lower part of the light emitting element 30, it branches into a connection part 231, a circulation part 232, and a circulation part 233 that go to the connection part 214.

  Thus, for example, even when the resin material of the light reflecting resin 50 is filled in the concave portion 10a of the multilayer substrate 10 in the manufacturing process of the light emitting device 1, the light reflecting resin 50 as shown in FIG. The resin material is dammed by the surrounding portions 211 to 233 and formed outside the surrounding portions 211 to 233. That is, the light reflective resin 50 in the light emitting device 1 is formed so as to be in contact with the outer side surface of the rotating portions 211 to 233 (here, the rotating portion 212), as shown in FIG. Therefore, as shown in FIGS. 1 and 2, the light emitting device 1 is in a state where the light reflective resin 50 does not contact the side surface of the light emitting element 30. In addition, as shown in FIG. 1 specifically, “outside of the revolving parts 212 to 233” means that the light emitting element 30 at the center of the recessed part 10a is outside the recessed part 10a away from the side surface of the light emitting element 30. It means that.

  As shown in FIG. 3, a gap is formed between the respective revolving parts 211 to 233. The size of the gap is determined by the resin material of the light-reflecting resin 50 described later by capillary action. It adjusts suitably to the extent which cannot be performed, for example, the size of 5-300 micrometers.

  Specific examples of the material for the metal film 20 include tungsten, molybdenum, nickel, copper, silver, gold, and aluminum. In addition, the metal film 20 is preferably 5 to 100 μm thick, for example, and more preferably 8 to 100 μm thick. In the light emitting device 1, if the thickness of the metal film 20 is within this range, for example, the resin material of the light reflective resin 50 having a general viscosity moves over the metal film 20 and proceeds in the direction of the light emitting element 30. Is sufficiently prevented.

  The light emitting element 30 emits light by applying a voltage, and excites a phosphor as necessary. As shown in FIG. 4A, the light emitting element 30 includes a P electrode 31 and N electrodes 32 and 33. Further, as shown in FIG. 4A, each of the N electrodes 32 and 33 includes openings 32a and 33a and extending portions 32b and 33b for diffusing a current to the entire element. In the light emitting element 30 having such a configuration, as shown in FIG. 4B, the P electrode 31 and the N electrodes 32 and 33 are respectively directed to the first substrate 11, that is, toward the bottom surface of the recess 10 a of the multilayer substrate 10. Arranged and face-down implemented. 4B, the P electrode 31 is connected to the connection part 214 of the P-side wiring 21, the N electrode 32 is connected to the connection part 221 of the N-side wiring 22, and N The electrode 33 is connected to the connection portion 231 of the N-side wiring 23. As shown in FIG. 1, the P electrode 31 and the N electrodes 32 and 33 of the light emitting element 30 cannot actually be observed from the upper part of the light emitting device 1, but in FIG. It is indicated by a broken line.

The light emitting element 30 is specifically an LED chip, and an arbitrary wavelength can be selected according to the application. For example, as a light emitting element 30 of blue (light with a wavelength of 430 nm to 490 nm) and green (light with a wavelength of 490 nm to 570 nm), a nitride-based semiconductor (In _X Al _Y Ga _1-XY N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) can be used.

  The protection element 40 is for protecting the light emitting element 30 from element destruction and performance deterioration by excessive voltage application. As shown in FIG. 1, the protective element 40 is installed on the protective element one-side wiring 24. One electrode (P electrode in this case) of the protection element 40 is connected to the other wiring 25 for the protection element via a wire W as shown in FIG. The other electrode (N electrode in this case) of the protective element 40 is provided on the lower surface side of the protective element 40 and is connected to the protective element one-side wiring 24. Specifically, the protection element 40 includes a Zener diode that is energized when a voltage equal to or higher than a specified voltage is applied.

  Here, as shown in FIG. 1, the wire W that connects the protection element 40 and the protection element other-side wiring 25 is wired outside the surrounding portions 211 to 233 (see FIG. 3) of the metal film 20. It is preferable. For example, as shown in part C of FIG. 5A, the wire W connecting the protection element 40 and the other side wiring 25 for the protection element is inside the surrounding parts 211 to 233 (see FIG. 3) of the metal film 20. When the resin material is filled in the light-reflecting resin forming step (see FIG. 6C described later) in the method for manufacturing the light-emitting device 1, as shown in part D of FIG. In addition, the resin material may flow along the wire W by capillarity and flow into the inside of the revolving parts 211 to 233, and may come into contact with the side surface of the light emitting element 30.

  On the other hand, as shown in FIG. 1, the distance between the wire W and the light emitting element 30 and the surrounding portions 211 to 233 is provided by routing the wire W outside the surrounding portions 211 to 233 (see FIG. 3) of the metal film 20. Therefore, the resin material of the light-reflective resin 50 applied at the time of manufacture is prevented from flowing into the inside of the surrounding portions 211 to 233 through the wire W and coming into contact with the side surface of the light emitting element 30. .

  The light reflective resin 50 is for reflecting the light emitted from the light emitting element 30. When viewed in plan as shown in FIG. 1, the light-reflecting resin 50 is located at a predetermined distance from the side surface of the light emitting element 30 in a region outside the surrounding portions 211 to 233 (see FIG. 3) of the metal film 20. The light emitting element 30 is formed so as to surround the periphery. Further, the light reflective resin 50 is formed so as to cover the inner surface of the concave portion 10a of the multilayer substrate 10 when viewed in cross section as shown in FIG. 2A, the light-reflecting resin 50 is viewed in cross section, and the peripheral portions 211 to 233 of the metal film 20 from the top of the opening 13a of the third substrate 13, that is, the top of the recess 10a (see FIG. 3), and is inclined toward the center of the recess 10a so that the inner diameter decreases stepwise. Further, as shown in FIG. 1, the light-reflecting resin 50 is dammed by the surrounding portions 211 to 233 of the metal film 20 and is formed outside these.

As a specific material of the light reflective resin 50, an insulating material is preferably used, and in order to ensure a predetermined strength, for example, a thermosetting resin, a thermoplastic resin, or the like is preferably used. Examples of the light reflecting resin 50 include epoxy resin, silicone resin, modified silicone, urethane resin, oxetane resin, fluororesin, acrylic resin, polycarbonate, polyimide, polyphthalamide, TiO ₂ , ZrO ₂ , Al ₂ O ₃ , and the like. A material containing SiO ₂ or the like can be used.

  The light-reflecting resin 50 preferably has a liquid resin material before curing in the range of 1 to 20 Pa · s, and more preferably in the range of 3 to 10 Pa · s. If the resin material of the light-reflective resin 50 is in this range, the light-emitting device 1 is a resin of the light-reflective resin 50 that is applied at the time of manufacture due to, for example, a height difference caused by the metal film 20 having a general thickness. The progress of the material will be sufficiently stopped.

  The sealing resin 60 is for protecting a member installed in the concave portion 10a of the multilayer substrate 10 from dust, moisture, external force, and the like. As shown in FIGS. 1 and 2A, the sealing resin 60 is recessed so as to cover the metal film 20, the light emitting element 30, the protective element 40, the light reflecting resin 50, and the wire W. 10a is filled.

  As a specific material of the sealing resin 60, it is preferable to use a light-transmitting material such as a silicone resin or an epoxy resin in order to efficiently emit light from the light emitting element 30 to the outside. The sealing resin 60 may contain a phosphor (not shown), and the phosphor is dispersed in the sealing resin 60 or the phosphor is allowed to settle and adhere to the upper surface and the side surface of the light emitting element 30. It does not matter as a configuration.

  In the light emitting device 1 having the above configuration, since the wiring-like metal film 20 is formed so as to surround the light emitting element 30 at a position spaced apart from the side surface of the light emitting element 30, this metal The film 20 prevents the resin material of the light-reflective resin 50 applied at the time of manufacture from proceeding toward the center of the recess 10 a of the laminated substrate 10, that is, in the direction of the light emitting element 30. It can be set as the state in which the light-reflective resin 50 was formed only in the area | region outside 211-233.

  Therefore, according to the light emitting device 1, the circumferential portions 211 to 233 of the metal film 20 can prevent the light reflective resin 50 from coming into contact with the side surface of the light emitting element 30. Even if it exists, a directivity chromaticity characteristic does not deteriorate. In addition, according to the light emitting device 1 according to the present invention, light emission from the side surface of the light emitting element 30 is not hindered, so that the light extraction efficiency is also improved.

[Method for Manufacturing Light Emitting Device]
Hereinafter, a method for manufacturing the light-emitting device 1 according to the embodiment of the present invention will be described with reference to FIG. 6 (refer to FIGS. 1 to 4 as appropriate). Here, as shown in FIGS. 6A to 6D, the manufacturing method of the light emitting device 1 includes a laminated substrate creating step, a light emitting element installing step, a light reflecting resin forming step, a sealing step, and a sealing step. The resin forming step is performed in this order. In the following, description of the step of installing the protection element 40 shown in FIG. 1 and the step of wire bonding the protection element 40 are omitted.

  The multilayer substrate creation process is a process of creating the multilayer substrate 10. In this laminated substrate creating step, as shown in FIG. 6A, the first substrate 11, the second substrate 12, and the third substrate 13 on which the metal film 20 has been formed in advance by plating or vapor deposition are arranged in this order. The laminated substrate 10 in which the recesses 10a are formed is created by laminating with, bonding with an adhesive material, and firing.

  6A corresponds to the AA cross-sectional view of FIG. 1, and as the metal film 20 formed on the first substrate 11, only the circulation portions 212 and 223 and the connection portion 214 are illustrated. However, on the first substrate 11, actually, the P-side wiring 21 including the surrounding portions 211, 212, 213, the connecting portion 214 and the extending portion 215, and the connecting portion 221 and the surrounding portions 222 and 223 are included. The N-side wiring 22, the N-side wiring 23 including the connection portion 231 and the surrounding portions 232 and 233, the protection element one-side wiring 24, and the protection element other-side wiring 25 are all formed.

  6A illustrates an example in which the metal film 20 is formed in advance on the first substrate 11, the timing at which the metal film 20 is formed on the first substrate 11 is not particularly limited. For example, the metal film 20 may be formed on the first substrate 11 by plating, vapor deposition, or the like after the laminated substrate creation step is finished.

  The light emitting element installation step is a step of installing the light emitting element 30 on the metal film 20. In this light emitting element installation step, as shown in FIG. 6B, solder is applied on the connection portion 214 of the metal film 20, and the light emitting element 30 is placed on the solder. Then, the solder is heated and melted by reflow, and the light emitting element 30 is self-aligned on the connection portion 214 using the surface tension.

  The light reflecting resin forming step is a step of forming the light reflecting resin 50 on a part of the laminated substrate 10 and the inner side surface of the concave portion 10 a of the laminated substrate 10. In this light-reflective resin forming step, as shown in FIG. 6C, using the resin dropping device (not shown) for dropping the resin material of the light-reflective resin 50, the surrounding portions 211 to 233 of the metal film 20 (FIG. 3), the light reflecting resin 50 is formed so as to surround the periphery of the light emitting element 30 at a position spaced apart from the side surface of the light emitting element 30.

Specifically, in the light reflecting resin forming step, the light reflecting resin 50 is formed in the concave portion 10 a of the laminated substrate 10 by utilizing a capillary phenomenon. That is, in the light-reflective resin forming step, as shown in FIG. 7A, a resin dropping device (not shown) is placed at two corners (here, the upper left corner and the corners in the concave portion 10a of the laminated substrate 10). The lower right corner), and a predetermined amount of the resin material 50a of the light reflective resin 50 is dropped. Further, in the light reflecting resin forming step, as shown in FIG. 7A, the resin material 50 a is dropped onto the surface of the stepped portion 10 b of the laminated substrate 10, that is, on the second substrate 12. Then, as shown in FIG. 7B, the resin material 50a spreads over the entire inner surface of the recess 10a of the multilayer substrate 10 by capillary action. Further, as shown in FIG. 7C, when the resin material 50a reaches the entire inner surface of the recess 10a, that is, the apex of the inner surface of the recess 10a, the resin material 50a stops due to surface tension, and thereafter the center of the recess 10a, that is, light emission. Progress toward the direction of the element 30.

  On the other hand, since the surrounding portions 211 to 233 of the metal film 20 are formed around the light emitting element 30, the resin material 50a cannot get over the thickness of the surrounding portions 211 to 233, and FIG. As shown to d), it will be dammed by the said surrounding parts 211-233. Moreover, as shown in FIG.7 (d), the resin material 50a will entirely cover the surface of the level | step-difference part 10b of the laminated substrate 10 with the said resin material 50a by capillary action. In the light reflective resin forming step, the light reflective resin 50 is formed so as to surround the periphery of the light emitting element 30 by the procedure as described above.

  In FIG. 7A described above, the example in which the resin material 50a of the light reflective resin 50 is dropped at the two corners at the diagonal positions in the concave portion 10a of the multilayer substrate 10 has been described. The resin material 50a may be dropped at the four corners. In this case, as shown in FIG. 7A described above, the light reflecting resin 50 can be formed more quickly than when the resin material 50a is dropped at the two corners in the recess 10a.

  The sealing resin forming step is a step of forming the sealing resin 60 in the concave portion 10 a of the laminated substrate 10. In the sealing resin forming step, as shown in FIG. 6D, various members provided in the recess 10a of the laminated substrate 10 are used by using a resin dropping device (not shown) that drops the resin material of the sealing resin 60. A sealing resin is formed so as to cover. By performing the procedure as described above, the light emitting device 1 as shown in FIG. 1 can be manufactured.

Second Embodiment
A light emitting device 1A according to a second embodiment of the present invention will be described with reference to FIG. Here, as shown in FIG. 8, the light emitting device 1 </ b> A includes a laminated substrate 10 </ b> A instead of the laminated substrate 10, and includes a protective element other wiring 25 </ b> A instead of the protective element other wiring 25. The light emitting device 1 according to the first embodiment described above has the same configuration (see FIG. 1). Accordingly, in the following description, the description of the same configuration as that of the light emitting device 1 is omitted, and the description of the manufacturing method of the light emitting device 1A is also omitted.

  In the light emitting device 1A, as shown in FIG. 8A, various members are installed on a laminated substrate 10A different from the laminated substrate 10 of the light emitting device 1 described above. As shown in FIG. 8B, the laminated substrate 10A includes a flat plate-like first substrate 11, a fourth substrate 14 having an opening 14a formed at a predetermined position, and a frame having an opening 12a formed at the center. A second substrate 12 having a shape and a third substrate 13 having a frame shape having an opening 13a formed at the center are laminated in this order. That is, in the laminated substrate 10A of the light emitting device 1A, the fourth substrate 14 is additionally provided between the first substrate 11 and the second substrate 12 in the laminated substrate 10 of the light emitting device 1 (see FIG. 2A). Is provided.

  In addition, as shown in FIG. 8B, the light emitting device 1A includes the fourth substrate 14 in which the opening 14a is formed, so that the second recess 10c is further formed on the bottom surface of the recess 10a of the laminated substrate 10A. The protection element other-side wiring 25A is formed on the bottom surface of the second recess 10c. That is, in the light emitting device 1A, unlike the light emitting device 1 described above (see FIG. 1), the protection element one-side wiring 24 and the protection element other-side wiring 25 are not provided at the same height. As shown in (b), the other side wiring 25A for the protection element is formed at a position lower than the position where the one side wiring 24 for the protection element is formed.

  In the light emitting device 1A having the above-described configuration, when one electrode (for example, a P electrode) of the protection element 40 and the other-side wiring for protection element 25A are connected by the wire W, the angle of the wire W is Since it becomes steep, the resin material of the light reflective resin 50 applied at the time of manufacture is prevented from traveling along the wire W to an unintended region such as a region where the light emitting element 30 is installed. Further, in the light emitting device 1A, since the second recess 10c is provided adjacent to the metal film 20 (here, the N-side wiring 23), only the depth of the second recess 10c is shown in FIG. The height difference in the F portion is enlarged, and the resin material of the light-reflecting resin 50 applied at the time of manufacture is less likely to scoop up the metal film 20 (here, the N-side wiring 23).

<Third Embodiment>
A light emitting device 1B according to a third embodiment of the present invention will be described with reference to FIG. Here, as shown in FIG. 9, the light emitting device 1 </ b> B includes a protection element one-side wiring 24 </ b> B instead of the protection element one-side wiring 24, and the protection element other-side wiring 25 instead of the protection element other-side wiring 25. It has the same configuration as the light emitting device 1 according to the first embodiment (see FIG. 1) except that the wiring 25B is provided and the protective element 40A is provided instead of the protective element 40. Therefore, in the following description, the description of the same configuration as that of the light emitting device 1 is omitted, and the description of the manufacturing method of the light emitting device 1B is also omitted.

  As shown in FIG. 9, in the light emitting device 1B, the protective element one-side wiring 24B and the protective element other-side wiring 25B are both formed below the protective element 40A. The one-side wiring 24B is formed below the P electrode (not shown) of the protection element 40A, and the protection-side other wiring 25B is formed below the N electrode (not shown) of the protection element 40A. In the light emitting device 1B, as shown in FIG. 9, the protective element 40A is installed so as to straddle the gap formed between the protective element one-side wiring 24B and the protective element other-side wiring 25B.

  Further, as shown in FIG. 9, the light emitting device 1B has a pair of electrodes (not shown) of the protection element 40A arranged on the first substrate 11, that is, toward the bottom surface of the concave portion 10a of the laminated substrate 10, and face-down. Has been implemented. In the light emitting device 1B, as shown in FIG. 9, the P electrode (not shown) of the protection element 40A is connected to the protection element one-side wiring 24B, and the N electrode (not shown) of the protection element 40A is for the protection element. It is connected to the other side wiring 25B.

  The light emitting device 1B having the above-described configuration is applied at the time of manufacture because it is not necessary to use the wire W as in the above light emitting device 1 (see FIG. 1) by mounting the protective element 40A face down. The resin material of the light reflective resin 50 is prevented from traveling along the wire W to an unintended region such as the region where the light emitting element 30 is installed.

<Fourth embodiment>
A light emitting device 1C according to a fourth embodiment of the present invention will be described with reference to FIG. Here, as shown in FIG. 10, the light emitting device 1C has the same configuration as the light emitting device 1 according to the first embodiment described above (see FIG. 1) except for the shape of the metal film 20A. Accordingly, in the following description, the description of the same configuration as that of the light emitting device 1 is omitted, and the description of the manufacturing method of the light emitting device 1C is also omitted. In FIG. 10, similarly to FIG. 3 described above, the light emitting element 30, the protective element 40, the light reflecting resin 50, the sealing resin 60, and the wire W are removed from the configuration of the light emitting device 1 </ b> C. Shows things.

  As shown in FIG. 10, the light emitting device 1 </ b> C is characterized in that most of the circulating portion is formed by branching the P-side wiring 21 </ b> A. In the light emitting device 1C, as shown in FIG. 10, the metal film 20A includes a P-side wiring 21A, N-side wirings 22A and 23A, a protection element one-side wiring 24, and a protection element other-side wiring 25. Has been. FIG. 10 shows the metal film 20A before the light emitting element 30 is mounted.

  As shown in FIG. 10, the P-side wiring 21 </ b> A is composed of surrounding parts 211, 212, 213, 216, 217, a connection part 214, and an extension part 215. That is, the P-side wiring 21A is provided with extra peripheral portions 216 and 217 as compared to the P-side wiring 21 (see FIG. 3). As shown in FIG. 10, the circular portions 216 and 217 branch along the shape of the light emitting element 30 at a position before the P-side wiring 21A enters from the lower part of the light emitting element 30 (see FIG. 1). It is formed so as to surround the side surface of the light emitting element 30.

  On the other hand, as shown in FIG. 10, the N-side wiring 22 </ b> A includes a connection portion 221 and circulation portions 222 and 223 </ b> A. That is, the N-side wiring 22A is formed with a shorter surrounding portion 223A than the aforementioned N-side wiring 22 (see FIG. 3). As shown in FIG. 10, the above-described surrounding portion 223 (see FIG. 3). The peripheral portion 216 of the P-side wiring 21A is provided in the place where the Further, as shown in FIG. 10, the N-side wiring 23 </ b> A includes a connection portion 231 and a circulation portion 233. That is, the N-side wiring 23A does not have the surrounding portion 232 as compared with the above-described N-side wiring 23 (see FIG. 3), and the P-side is provided at the place where the surrounding portion 232 is provided as shown in FIG. A surrounding portion 217 of the wiring 21A is provided.

  The light emitting device 1 </ b> C having the above configuration branches a wiring for supplying a current to the light emitting element 30 as a circular portion formed to block the resin material of the light reflecting resin 50 applied at the time of manufacture. Therefore, the light reflecting resin 50 can be damped in the vicinity of the light emitting element 30 and the space on the bottom surface of the concave portion 10a of the multilayer substrate 10 can be efficiently used without waste.

<Fifth Embodiment>
A light-emitting device 1D according to a fifth embodiment of the present invention will be described with reference to FIG. Here, as shown in FIG. 11, the light-emitting device 1D has the same configuration as the light-emitting device 1 (see FIG. 1) according to the first embodiment except for the shape of the metal film 20B. Accordingly, in the following description, the description of the same configuration as that of the light emitting device 1 is omitted, and the description of the manufacturing method of the light emitting device 1D is also omitted. In FIG. 11, similarly to FIG. 3 described above, the light emitting element 30, the protective element 40, the light reflecting resin 50, the sealing resin 60, and the wire W are removed from the configuration of the light emitting device 1 </ b> D. Shows things.

  As shown in FIG. 11, the light emitting device 1 </ b> D is characterized in that most of the circulating portion is formed by branching the N-side wirings 22 </ b> B and 23 </ b> B. In the light emitting device 1D, as shown in FIG. 11, the metal film 20B includes a P-side wiring 21B, N-side wirings 22B and 23B, a protection element one-side wiring 24, and a protection element other-side wiring 25. Has been. FIG. 11 shows the metal film 20B before the light emitting element 30 is mounted.

  As shown in FIG. 11, the P-side wiring 21 </ b> B includes a circulation portion 211, a connection portion 214, and an extension portion 215. That is, the P-side wiring 21B does not have the surrounding portions 212 and 213 as compared to the P-side wiring 21 (see FIG. 3), and the place where the surrounding portions 212 and 213 are provided as shown in FIG. In addition, 233A of the N-side wiring 23B and 222A of the N-side wiring 22B are respectively provided.

  On the other hand, as shown in FIG. 11, the N-side wiring 22 </ b> B includes a connection portion 221 and surrounding portions 222 </ b> A and 223. That is, the N-side wiring 22B is formed with a longer circumference 222A than the N-side wiring 22 (see FIG. 3). As shown in FIG. 11, the circumference 213 of the P-side wiring 21 is formed. The surrounding portion 222A is extended to the place where the (see FIG. 3) was provided. Further, as shown in FIG. 11, the N-side wiring 23 </ b> B includes a connection portion 231 and circulation portions 232 and 233 </ b> A. That is, the N-side wiring 23B is formed with a longer circumferential portion 233A than the N-side wiring 23 (see FIG. 3), and as shown in FIG. 11, the circumferential portion 212 of the P-side wiring 21 described above. The surrounding portion 233 </ b> A is extended to the place where (see FIG. 3) was provided. Then, as shown in FIG. 11, these surrounding portions 222 </ b> A and 233 </ b> A have the shape of the light emitting element 30 at a position before the N-side wirings 22 </ b> B and 23 </ b> B enter from the lower part of the light emitting element 30 (see FIG. 1). The light emitting element 30 is branched so as to surround the side surface of the light emitting element 30.

  The light emitting device 1D having the above-described configuration branches a wiring for supplying a current to the light emitting element 30 as a circular portion formed to block the resin material of the light reflecting resin 50 applied at the time of manufacture. Therefore, the light reflecting resin 50 can be damped in the vicinity of the light emitting element 30 and the space on the bottom surface of the concave portion 10a of the multilayer substrate 10 can be efficiently used without waste.

<Sixth Embodiment>
A light emitting device 1E according to a sixth embodiment of the present invention will be described with reference to FIG. Here, as shown in FIG. 12, the light emitting device 1E has the same configuration as the light emitting device 1 according to the first embodiment (see FIG. 1) except for the shape of the metal film 20C. Therefore, in the following description, the description of the same configuration as that of the light emitting device 1 is omitted, and the description of the method for manufacturing the light emitting device 1E is also omitted. In FIG. 12, similarly to FIG. 3 described above, the light emitting element 30, the protective element 40, the light reflecting resin 50, the sealing resin 60, and the wire W are removed from the configuration of the light emitting device 1 </ b> E. Shows things.

  As shown in FIG. 12, the light emitting device 1E is characterized in that most of the circulating portion is formed using a member other than the P-side wiring 21C and the N-side wirings 22A and 23A. In the light emitting device 1E, as shown in FIG. 12, the metal film 20C includes a P-side wiring 21C, N-side wirings 22A and 23A, a protection element one-side wiring 24, and a protection element other-side wiring 25. Wiring 261,262,263,264,265. FIG. 12 shows the metal film 20C before the light emitting element 30 is mounted. In the following description, when all the surrounding wirings 261, 262, 263, 264, and 265 are indicated, they are simply expressed as “enclosing wirings 261 to 265”.

  As shown in FIG. 12, the P-side wiring 21 </ b> C includes a connection part 214 and an extension part 215. That is, the P-side wiring 21C does not have the surrounding portions 211, 212, and 213 as compared with the P-side wiring 21 (see FIG. 3), and the surrounding portions 211, 212, and 213 are provided as shown in FIG. Surrounding wirings 265, 264, and 261 are provided at the positions where they are provided.

  Further, as shown in FIG. 12, the N-side wiring 22 </ b> A includes a connection portion 221 and circulation portions 222 and 223 </ b> A. The configuration of the N-side wiring 22A is the same as that of the light-emitting device 1C described above. However, as shown in FIG. 12, the surrounding wiring 262 is provided at the place where the circulating portion 223 (see FIG. 3) is provided. Is provided. Further, as shown in FIG. 12, the N-side wiring 23 </ b> A includes a connection portion 231 and a circulation portion 233. The configuration of the N-side wiring 23A is the same as that of the light-emitting device 1C described above. However, as shown in FIG. 12, the surrounding wiring 263 is provided at the place where the circulating portion 232 (see FIG. 3) is provided. Is provided.

  The surrounding wirings 261 to 265 are for surrounding the light emitting element 30. The surrounding wirings 261 to 265 are formed at a predetermined interval from the other wirings constituting the metal film 20 </ b> C, and are configured to intermittently surround the light emitting element 30. Accordingly, the surrounding wirings 261 to 265 are independent metal films that do not contribute to the power supply to the light emitting element 30 and the protection element 40, unlike other wirings constituting the metal film 20 </ b> C. The surrounding wirings 261 to 265 are formed with the same material and the same thickness in the same manufacturing process as other wirings constituting the metal film 20C. In addition, the size of the gap between the surrounding wirings 261 to 265 and the other wirings constituting the metal film 20C is, for example, 5 to 300 μm, such that the resin material of the light reflective resin 50 cannot enter due to capillary action. Adjust accordingly.

  Since the light emitting device 1E having the above-described configuration uses separate surrounding wirings 261 to 265 as a circulating portion in addition to the P-side wiring 21C and the N-side wirings 22A and 23A, for example, the size of the light-emitting element 30 Depending on the shape and the space of the concave portion 10a of the laminated substrate 10, the circumferential portion can be provided with a desired size and a desired shape.

  The light emitting device according to the present invention has been specifically described above with reference to embodiments for carrying out the invention. However, the gist of the present invention is not limited to these descriptions, and is based on the description of the claims. It must be interpreted widely. Needless to say, various changes and modifications based on these descriptions are also included in the spirit of the present invention.

  For example, the light emitting devices 1, 1 </ b> A, 1 </ b> B, 1 </ b> C, 1 </ b> D, and 1 </ b> E described above may include a heat radiating member (heat sink) made of ceramics or metal in a predetermined layer of the laminated substrates 10 and 10 </ b> A.

  Further, the light emitting devices 1, 1A, 1B, 1C, 1D, and 1E described above are formed in a rectangular shape in plan view along the shape of the light emitting element 30 by the metal films 20, 20A, 20B, and 20C. However, the shape of the metal films 20, 20A, 20B, and 20C surrounding the light emitting element 30 is not particularly limited, and may be, for example, a circle, an ellipse, or another polygon.

1, 1A, 1B, 1C, 1D, 1E Light emitting device 10, 10A Laminated substrate 10a Recessed portion 10b Stepped portion 10c Second recessed portion 11 First substrate 12 Second substrate 12a Opening portion 13 Third substrate 13a Opening portion 14 Fourth substrate 14a Opening 20 Metal film 21, 21A, 21B, 21CP P side wiring 211, 212, 213, 216, 217 Circumferential portion 214 Connection portion 215 Extension portion 22, 22A, 22B N side wiring 221 Connection portion 222, 223, 222A, 223A Circumference parts 23, 23A, 23B N-side wiring 231 Connection parts 232, 233, 233A Circulation parts 24, 24B One-side wiring for protection elements 25, 25A, 25B Other-side wirings 261, 262, 263, 264, 265 for protection elements Surrounding wiring 30 Light-emitting element 31 P electrodes 32 and 33 N electrodes 32a and 33a Openings 32b and 33b Extending portions 40 and 4 0A Protection element 50 Light reflecting resin 50a Resin material 60 Sealing resin CM Cathode mark W Wire

Claims (9)

A laminated substrate in which a plurality of plate-like members are laminated, and a concave portion is formed in the center, a metal film formed as a wiring pattern on the bottom surface of the concave portion, a light emitting element disposed on the metal film, A light emitting device comprising: a light reflective resin formed around the light emitting element in the concave portion; and a sealing resin filled in the concave portion so as to cover the light emitting element and the light reflective resin. There,
The metal film has a connection part formed at a lower part of the light emitting element, and a circumferential part formed around the light emitting element at a position spaced apart from a side surface of the light emitting element,
The light-reflecting resin is formed on the bottom surface of the concave portion of the multilayer substrate by the peripheral portion of the metal film and formed outside the peripheral portion. In the light emitting element, a P electrode and an N electrode are respectively arranged toward the bottom surface of the concave portion of the multilayer substrate,
The metal film is formed on the bottom surface of the concave portion of the multilayer substrate so as to enter the lower portion of the light emitting element from outside the periphery of the light emitting element, and includes a P-side wiring connected to the P electrode, and the N electrode N-side wiring connected to
The connection part of the metal film includes a part of the P-side wiring connected to the P electrode under the light emitting element and a part of the N side wiring connected to the N electrode under the light emitting element. And consists of
The peripheral portion of the metal film is formed by branching along the shape of the light emitting element at a position where one of the P side wiring and the N side wiring enters the lower part of the light emitting element. The light-emitting device according to claim 1. In the light emitting element, a P electrode and an N electrode are respectively arranged toward the bottom surface of the concave portion of the multilayer substrate,
The metal film is formed on the bottom surface of the concave portion of the multilayer substrate so as to enter the lower portion of the light emitting element from outside the periphery of the light emitting element, and includes a P-side wiring connected to the P electrode, and the N electrode N-side wiring connected to
The connection part of the metal film includes a part of the P-side wiring connected to the P electrode under the light emitting element and a part of the N side wiring connected to the N electrode under the light emitting element. And consists of
The surrounding portion of the metal film is formed by branching along the shape of the light emitting element at a position where each of the P side wiring and the N side wiring enters the lower part of the light emitting element. The light-emitting device according to claim 1. In the light emitting element, a P electrode and an N electrode are respectively arranged toward the bottom surface of the concave portion of the multilayer substrate,
The metal film is formed on the bottom surface of the concave portion of the multilayer substrate so as to enter the lower portion of the light emitting element from outside the periphery of the light emitting element, and includes a P-side wiring connected to the P electrode, and the N electrode An N-side wiring connected to the light-emitting element, and a surrounding wiring that surrounds the light-emitting element,
The connection part of the metal film includes a part of the P-side wiring connected to the P electrode under the light emitting element and a part of the N side wiring connected to the N electrode under the light emitting element. And consists of
The surrounding portion of the metal film includes a part of the P-side wiring and a part of the N-side wiring at a position entering the lower part of the light emitting element, and the surrounding wiring. The light emitting device according to 1. Comprising a protective element disposed on the metal film;
The metal film is formed under the protection element, and is connected to the other electrode of the protection element and connected to one electrode of the protection element via a wire. And other side wiring,
The light emitting device according to any one of claims 1 to 4, wherein the wire is wired outside a surrounding portion of the metal film.   The light emitting device according to claim 5, wherein the other side wiring for the protection element is formed at a position lower than a position where the one side wiring for the protection element is formed. Comprising a protective element disposed on the metal film;
In the protection element, one and the other electrodes are respectively arranged toward the bottom surface of the concave portion of the multilayer substrate,
The metal film is formed under one of the electrodes of the protective element, formed on the other side of the protective element connected to the one electrode, and below the other electrode of the protective element, 5. The light-emitting device according to claim 1, further comprising a protection element one-side wiring connected to the electrode.   The light emitting device according to claim 1, wherein the metal film has a thickness of 5 to 100 μm.   The light emitting device according to claim 1, wherein the light reflective resin is formed using a resin having a viscosity of 1 to 20 Pa · s.

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