JP2014069548A - Transfer molding device and transfer molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer molding device capable of uniformly pressing a stamper on a resin plate to perform a transfer while extruding an air layer.SOLUTION: A transfer molding device including heat treatment parts 30 and 40 for pressing a stamper having an uneven pattern on a resin plate J while heating can transfer-mold the uneven pattern on the resin plate J. The press treatment parts of the heat treatment parts 30 and 40 include press region variable means for varying at least one of a pressing force pressing the stamper on the resin plate J and a transmission starting position of the pressing force by a contact region between the stamper and the resin plate J.

Description

  The present invention relates to a transfer molding apparatus that transfers a concavo-convex pattern to a predetermined resin plate, and more particularly, to a transfer molding apparatus and a transfer molding method having a press process for pressing a stamper having a concavo-convex pattern onto a resin plate.

2. Description of the Related Art There is known a transfer molding apparatus that presses a stamper having a fine concavo-convex pattern onto a primary molded thermoplastic resin plate to transfer and mold the concavo-convex pattern of the stamper onto the resin plate.
In such a transfer molding apparatus, the concavo-convex pattern is transferred to the resin plate through a plurality of processing steps such as heat treatment for heating the resin plate, press treatment for pressing the stamper against the heated resin plate, and cooling treatment for cooling the resin plate. (For example, patent document 1).

JP 2003-109254 A

In such a transfer molding apparatus, the stamper and the press surface do not necessarily have irregularities, and these are not always parallel, so the stamper is not uniformly pressed against the surface of the resin plate in the pressing process. Further, there may occur press unevenness in which a portion where the pressing force is high and a portion where the pressing force is low are distributed in each contact portion between the stamper and the resin plate.
Such press unevenness has been a factor that hinders accurate transfer of the uneven pattern.
Moreover, in the press treatment, although the stamper is surely brought into contact with the resin plate, if it comes into contact with the air layer confined between them, the pressing of the uneven pattern is blocked by the air layer, There was a problem that it was not accurately transferred.

  The present invention has been proposed in order to solve such a conventional problem, and changes the pressing force for pressing the stamper against the resin plate and the transmission start position of the pressing force for each contact portion between the stamper and the resin plate. Accordingly, an object of the present invention is to provide a transfer molding apparatus and a transfer molding method that can eliminate press unevenness and can perform pressing while extruding an air layer interposed between a stamper and a resin plate.

  In order to achieve the above object, a transfer molding apparatus of the present invention is a transfer molding apparatus that includes a press processing unit that presses a stamper having a concavo-convex pattern onto a predetermined resin plate, and transcribes the concavo-convex pattern onto the resin plate. The press processing section changes at least one of a pressing force for pressing the stamper against the resin plate and a transmission start position of the pressing force for each contact portion between the stamper and the resin plate. The variable means is provided.

  The transfer molding method of the present invention is a transfer molding method that includes a press treatment step of pressing a stamper having a concavo-convex pattern onto a predetermined resin plate, and transcribes the concavo-convex pattern onto the resin plate. A pressing portion changing step of changing at least one of a pressing force for pressing the stamper against the resin plate and a transmission start position of the pressing force according to a contact portion between the stamper and the resin plate. As a transfer molding method.

  According to the transfer molding apparatus and the transfer molding method of the present invention, the stamper can be pressed evenly against the resin plate, and the air layer can be pushed out between the stamper and the resin plate. Can be transferred.

1 is a schematic plan view of a transfer molding apparatus according to an embodiment of the present invention. 1 is a schematic side view of a transfer molding apparatus according to an embodiment of the present invention. 1 is a schematic rear view of a transfer molding apparatus according to an embodiment of the present invention. It is a front view of the vacuum processing part of the transfer molding device concerning one embodiment of the present invention, an intermittent rotation part, and a cooling processing part. It is a schematic perspective view of the open state of the bucket which concerns on one Embodiment of this invention. It is a schematic sectional drawing of the closed state of the bucket concerning one embodiment of the present invention. It is a schematic perspective view of the heat processing part which concerns on one Embodiment of this invention. It is a graph which shows the relationship between the setting temperature according to site | part of the heat processing part which concerns on one Embodiment of this invention, and resin temperature, (a) shows the resin temperature when setting the setting temperature according to site | part uniformly. It is a chart and (b) is a chart showing resin temperature when changing preset temperature for every part. It is the schematic of the cooling process part which concerns on one Embodiment of this invention, (a) is a schematic perspective view, (b) is AA sectional drawing.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

As shown in FIGS. 1 to 4, the transfer molding apparatus 1 according to the present embodiment includes 6 of a feeding processing unit 10, a vacuum processing unit 20, heating processing units 30 and 40, a cooling processing unit 50, and a sending processing unit 60. The two processing units, six buckets 80 (80a to 80f), and an intermittent rotation unit 70 that performs intermittent rotation while supporting the bucket 80 are provided.
The intermittent rotation unit 70 is disposed substantially at the center of the apparatus, and alternately rotates and stops about the shaft 71.
The six buckets 80a to 80f are supported on the circumference of a circle centered on the shaft 71 at an interval of about 60 degrees, are driven to rotate by the intermittent rotation unit 70, and are intermittently stopped for a predetermined time every rotation of about 60 degrees. Repeat the rotation.
The infeed processing unit 10, the vacuum processing unit 20, the heating processing units 30 and 40, the cooling processing unit 50, and the sending processing unit 60 are provided as independent devices, respectively, on different normals of a circle around the axis 71, And it is on the circumference used as the movement locus of buckets 80a-80f, and is arranged at intervals of about 60 degrees corresponding to the intermittent stop position of each bucket 80.
In the transfer molding apparatus 1 having such a configuration, each bucket 80 makes a round in order of the feeding processing unit 10, the vacuum processing unit 20, the heating processing units 30, 40, the cooling processing unit 50, and the sending processing unit 60. Thus, the primary molded resin plate J1 is automatically fed, and the resin plate J2, which is a secondary molded product obtained by transfer molding of the concavo-convex pattern, is automatically fed out.
Hereinafter, each part of the transfer molding apparatus 1 will be described in detail.

[Intermittent rotating part]
As shown in FIG. 1, the intermittent rotation unit 70 is disposed substantially at the center of the apparatus and is driven to rotate by a servo motor or the like, and rotates clockwise about 60 degrees in FIG. By alternately performing the stop, each bucket 80 is configured to move across the processing units 10 to 60.
For example, the shaft 71 is formed so as to be rotatable by itself, and has a cylindrical shape as shown in FIG. 4, and includes six support members that extend outward from the outer peripheral surface of the cylinder. The bucket 80 (80a to 80f) is supported.
The intermittent rotation unit 70 detects the rotational position of the shaft 71 by an encoder (rotation detector) function such as a servo motor or an optical sensor that optically detects the position on the circumference of each bucket 80. By alternately rotating and stopping, each bucket 80 is stopped at a position corresponding to each processing unit 10-60, and then rotated, and each bucket 80 is again positioned corresponding to each processing unit 10-60. The operation of stopping at is repeated.

As shown in FIGS. 2 and 4, the six buckets 80 a to 80 f each have a lid portion 81 located on the upper side along the vertical direction and a placement portion 82 located on the lower side.
The lid portion 81 and the placement portion 82 are disposed so as to face each other so that the resin plate J (J1, J2) and the stampers 813 and 823 having the concavo-convex pattern on the surface can be sandwiched therebetween, and the lid portion 81 is placed on the placement portion 82. Opening and closing operations are performed by moving in a vertically movable manner. This opening / closing operation is realized by the following configuration (bucket opening / closing means).

Although the lid portion 81 and the placement portion 82 are supported so as to be rotatable together with the shaft 71, the placement portion 82 is supported so as not to swing with respect to the shaft 71, and one lid portion 81 is attached to the shaft 71. It is supported so as to move up and down, and is connected to driving means such as motors, electromagnetic solenoids, air cylinders, hydraulic cylinders and the like provided in the respective buckets 80a to 80f, and receives the transmission of power from the driving means in the vertical direction. Move to.
With such a configuration, by driving the driving means according to the rotational position of the shaft 71, the lid 81 moves in the vertical direction, and the opening and closing operation of the bucket 80 is realized.

The driving means for moving the lid portion 81 up and down is driven and controlled according to the rotational position of the shaft 71, whereby the bucket 80 is opened and closed according to the position on the circumference.
For example, the lid portion is detected while detecting the rotational position of the shaft 71 by the encoder (rotation detector) function of the servo motor or the like described above, or the optical sensor that optically detects the position on the circumference of each bucket 80. By moving 81 up and down, the bucket 80 can be opened and closed according to the position on the circumference.
In addition, during the period from the sending processing unit 60 to the sending processing unit 10, the bucket 80 rotates in an open state by stopping the cover 81 while moving the lid 81 upward, and reaches the processing units 20 to 50. In the meantime, the bucket 80 is rotated while being closed by stopping the lid 81 while moving the lid 81 downward.
With the configuration as described above, the buckets 80a to 80f perform opening and closing operations according to the positions on the circumference corresponding to the processing units 10 to 60 while repeating the rotation and stop about the shaft 71. . Thereby, since the bucket 80 is conveyed in a state optimal for the processing in each processing unit 10-60, the processing in each processing unit 10-60 is smoothly performed, and the work efficiency is improved.
In the closed state, the lid portion 81 and the placement portion 82 are in contact with each other so that all of the weight of the lid portion 81 is applied to the placement portion 82, and in the open state, the gap in which the resin plate J can be fed and unloaded. (For example, about 250 mm) is set to be formed between the lid portion 81 and the placement portion 82.

[bucket]
The bucket 80 that performs such an opening / closing operation is configured as follows.
The buckets 80a to 80f are formed in a rectangular shape having a long side in the normal direction of a circle centered on the shaft 71, and each of the buckets 80a to 80f includes a lid portion 81 and a placement portion 82, thereby forming a resin plate formed in a rectangular shape. J and stampers 813 and 823 can be stacked and accommodated.
The lid portion 81 and the placement portion 82 have the same material and outer shape (plate shape), and are configured by combining a plurality of members.
Specifically, as shown in FIGS. 5 and 6, the lid portion 81 and the mounting portion 82 cover the frames 811 and 821 having the opening portions 811 a and 821 a in the central portion and the opening portions 811 a and 821 a. Holding plates 812 and 822 attached to the frames 811 and 821, respectively. For example, the frames 811 and 821 are made of aluminum, and the holding plates 812 and 822 are made of brass having high thermal conductivity.

As shown in FIG. 6, elastic seal members 815 and 825 that are brought into contact with each other in the closed state of the bucket 80 are fitted in the outer peripheral edge portions on the opposite surface sides of the frames 811 and 821.
The elastic seal members 815 and 825 are formed of an elastic member such as rubber or silicon. In this embodiment, the elastic seal member 815 is formed of an annular or string-like elastic member having a square cross section, and the elastic seal member 825 is circular in cross section. It consists of an annular or string-like elastic member. In the closed state, the elastic seal members 815 and 825 are more elastically deformed than the elastic seal member 825 when the elastic seal member 815 is closed, and the elastic seal member 825 having a round cross section has an angular cross section. It has the elastic characteristic which carries out surface contact over predetermined length (for example, about half of a surrounding surface) to one side.
As a result, the inner space surrounded by the elastic seal members 815 and 825 in the closed state of the bucket 80 becomes the housing portion 800 in which the resin plate J and the stampers 813 and 823 are housed, and the airtightness in the housing portion 800 is ensured. Will be.
Further, the elastic member 825 having a round cross section can be not only an elastic member having a solid cross section but also a hollow cross section having a space inside. Thus, when the elastic member 825 having a round cross section is an elastic member having a hollow cross section, contrary to the case described above, the elastic seal member 825 is more elastically deformed than the elastic seal member 815 in the closed state, and the cross section It is also possible to select the elastic seal members 815 and 825 having the elastic property that the round elastic seal member 825 is crushed and is in surface contact with one side of the elastic seal member 815 having a square cross section.
The elastic seal member 815 may be an elastic member having a round cross section, and the elastic seal member 825 may be an elastic member having a square cross section.

As shown in FIGS. 4 and 5, an intake hole 827 is formed on the inner side of the frame 821 where the elastic seal member 825 is inserted and closer to the shaft 71.
The suction hole 827 is connected to a vacuum pump via a predetermined tube, and the inside of the bucket 80 continuously sucks air via the suction hole 827 during processing over at least the processing units 20 to 50 in which the bucket 80 is in a closed state. Is done.

A plurality of pilot holes for screwing the clamping plates 812 and 822 and the stampers 813 and 823 with screws 90 are formed in the periphery of the openings 811a and 821a of the frames 811 and 821.
A helicate 91 is screwed into the prepared hole as a means for preventing the screw 90 from loosening. The helisert 91 is a female screw member in which a linear member having a rhombus section is spirally wound, and a screw 90 is screwed into the female screw member. By providing (sandwiching) such a helisert 91 between the screw 90 and the pilot hole, vibration of the intermittent rotation unit 70, vibration of the frame 811 and 821 (preparation hole) due to heating / cooling processing, Looseness is prevented.
Further, the screw 90 and the helisert 91 may be made of the same material as that of the frames 811 and 821 so that the screw 90 and the helisert 91 can be synchronized with the expansion and contraction of the prepared hole.
As a means for preventing loosening, it is preferable to use a helisert 91. However, a wedge member (for example, an elastic member such as metal or rubber) functioning as a wedge is press-fitted between the screw 90 and the pilot hole (screw 90). The adhesive may be injected between the screw 90 and the pilot hole.

As shown in FIG. 6, the sandwiching plates 812 and 822 are arranged to face each other so as to close the openings 811 a and 821 a of the frames 811 and 821, and are screwed to the frames 811 and 821 by screws 90. The sandwiching plates 812 and 822 are opposed to each other so as to sandwich the stampers 813 and 823 and the resin plate J. The openings 811a and 821a and the sandwiching plates 812 and 822 are sealed with a predetermined sealing member.
The exposed surfaces 812a and 822a of the clamping plates 812 and 822 exposed to the outside through the openings 811a and 821a function as a press surface, a heating surface, and a cooling surface in the respective processing units 30 to 50.
As described above, the bucket 80 includes the frames 811 and 821 having the openings 811a and 821a, and the sandwiching plates 812 and 822 that close the openings 811a and 821a and are disposed to face the stampers 813 and 823 and the resin plate J. As a result, the following effects are exhibited.

For example, unlike this embodiment, assuming that the entire bucket (each of the lid portion 81 and the placement portion 82) is composed of a single component, the bucket can be used to heat and cool the resin plate J accommodated in the bucket. It is necessary to heat and cool the whole, and for that purpose, it is preferable that the entire bucket is made of metal such as brass having excellent thermal conductivity while reducing the heat capacity. However, in order to form the whole bucket with a metal such as brass, it is necessary to cut it out from a lump of metal, which is difficult to manufacture and increases the manufacturing cost.
Further, in order to press the stampers 813 and 823 against the resin plate J, it is necessary to press the bucket from the outside. If this happens, metal fatigue occurs due to the press. Becomes higher.
Therefore, in the present embodiment, the bucket 80 is closed between the frames 811 and 821 having the openings 811a and 821a, and the sandwiching plates 812 and 822 that close the openings 811a and 821a and are opposed to the stampers 813 and 823 and the resin plate J. It was decided to consist of. Thus, the resin plate J can be heated and cooled via the exposed surfaces 812a and 822a of the sandwiching plates 812 and 822 exposed to the outside through the openings 811a and 821a, and the exposed surfaces of the sandwiching plates 812 and 822 are exposed. The stampers 813 and 823 can be pressed against the resin plate J via 812a and 822a.
That is, with such a configuration, the entire bucket 80 is not integrally formed of a metal such as brass, but only the sandwiching plates 812 and 822 are formed in a plate shape having a small heat capacity, and brass having excellent thermal conductivity. Therefore, the resin plate J can be efficiently heated and cooled while reducing the manufacturing cost. Further, even when metal fatigue occurs on the sandwiching plates 812 and 822 due to the press, the maintenance costs can be reduced because only the sandwiching plates 812 and 822 need to be replaced while the frames 811 and 821 remain unchanged.
Further, the frames 811 and 821 can be made of a material different from that of the sandwiching plates 812 and 822. For example, since the frame 811 and 821 can be formed of a light metal such as aluminum, the weight of the entire bucket 80 can be reduced. Thereby, since the moment of inertia of the bucket 80 can be reduced, an overrun or the like due to the inertia of the bucket 80 accompanying the rotation of the intermittent rotation unit 70 is suppressed, and the position of the bucket 80 on the circumference can be accurately controlled.

  The stampers 813 and 823 have a rectangular shape along the shape of the bucket 80 and are plate-like members made of nickel, stainless steel or the like, and are fastened together with the clamping plates 812 and 822 by screws 90 to the frames 811 and 821. Screwed.

In addition, the stampers 813 and 823 are screwed to the frames 811 and 821, but are accurately positioned with respect to the frames 811 and 821 so that the stampers 813 and 823 are not displaced due to a pressing force. (Positioning means).
The positioning of the stampers 813 and 823 with respect to the frames 811 and 821 is, for example, on a vertical line provided on the stamper 823 and extending perpendicularly to the long side of the stamper 823 formed in a rectangular shape as shown in FIG. This is realized by fitting positioning holes 823d and 823e formed at positions adjacent to the two long sides and positioning pins 826a and 826b provided in the frame 821 and inserted into the positioning holes 823d and 823e. .
The positional relationship between the positioning holes 823d and 823e and the positioning pins 826a and 826b is the shortest distance connecting the opposite sides of the stamper 823 while sandwiching the central portion of the stamper 823 as a work area.

Since the stamper 823 is exposed to a heating / cooling cycle in which heating and cooling are alternately performed, expansion due to heating and contraction due to cooling are repeated. Due to the heating, the stamper 823 expands as a whole in the surface direction. Then, since the amount of expansion increases as the distance on the stamper 823 increases, it is preferable that the distance between the two points for positioning is as short as possible while sandwiching the central portion of the stamper 823 as a work area. become.
Therefore, the two points to be positioned are on a perpendicular extending perpendicular to the long side of the stamper 823 so as to be the shortest distance connecting the opposite sides while sandwiching the center portion as a work area, and the two long points The position was adjacent to each side. Thus, the influence of expansion due to heating and contraction due to cooling can be minimized while ensuring the central portion of the stamper 823 as a working area to the maximum.
The positioning holes 823d and 823e can be provided in the frame 821, and the positioning pins 826a and 826b can be provided in the stamper 823, respectively.

Further, the stampers 813 and 823 are plate-shaped members, but are formed in a convex shape in cross section.
The top surfaces 813a and 823a of the stampers 813 and 823 are contact surfaces with the resin plate J, and an uneven region R having an uneven pattern is formed.
The uneven region R is thermally transferred to the resin plate J1 which is a primary molded product, whereby the resin plate J2 having the uneven pattern is formed as a secondary molded product.

Further, as shown in FIG. 5, on the top surfaces 813 a and 823 a, a flow path for discharging air between the stampers 813 and 823 and the resin plate J while being in contact with the resin plate J is formed. For example, at least one of the top surfaces 813a and 823a extends to the edge portions (813c and 823c), and a hairline-shaped air escape groove serving as an air escape path when contacting the resin plate J is provided. A plurality of 8231s are recessed.
In the present embodiment, the plurality of air escape grooves 8231 are formed in a straight line and extend to the edge portions 813c and 823c on both sides of the top surfaces 813a and 823a.
As a result, air evacuated between the top surfaces 813a and 823a and the resin plate J is led to the edge portions 813c and 823c via the air escape grooves 8231 and efficiently discharged during evacuation. The degree of vacuum between the surfaces 813a and 823a and the resin plate J can be increased.
Further, in this embodiment, the air escape groove 8231 is formed outside the uneven region R, so that it does not optically affect the uneven pattern forming surface of the resin plate J.
The air escape groove 8231 can also be formed in the uneven region R. In particular, when the molded resin plate J2 is used as a light guide plate, and the concavo-convex pattern is transferred as a light guide pattern when light is incident from the end of the resin plate J to cause surface emission, air escape is generated. The groove 8231 is preferably formed along the light incident direction. Accordingly, light propagates in parallel with the air escape groove 8231, and light attenuation due to the influence of the air escape groove 8231 can be suppressed.

Further, the discharge flow path forming means is not limited to being formed to be concave on the contact surface with the resin plate J like the air escape groove 8231 but may be formed to be convex.
For example, a plurality of holes are melted and formed by irradiating the top surfaces 813a and 823a with a laser, and melted protrusions in which the melted metal (nickel, stainless steel, etc.) rises in a convex shape around each of the holes are formed. You can also By such melting convex portions, the resin plate J is separated from the top surfaces 813a and 823a, and a flow path capable of discharging the air between the resin plate J and the top surfaces 813a and 823a when vacuuming is formed. become.
What is formed to be convex as such a discharge flow path forming means is not limited to the melting convex portion, but may be a plurality of convex portions scattered so as to separate the resin plate J from the top surfaces 813a and 823a. Therefore, although the shape is not limited, it is preferably formed outside the uneven region R in consideration of optical effects.

The lower step surfaces 813b and 823b formed at a position one step lower than the top surfaces 813a and 823a are non-contact surfaces that do not contact at least the resin plate J1 before molding, and include a plurality of screw holes into which the screws 90 are inserted. The positioning holes 823d and 823e function as attachment surfaces.
With respect to the stampers 813 and 823 configured as described above, the resin plate J has a larger outer shape than the top surfaces 813a and 823a.
As a result, gaps are formed between the lower step surfaces 813b and 823b and the resin plate J, as shown in FIG. 6, so that air intervening between the top surfaces 813a and 823a and the resin plate J is evacuated. It will be discharged | emitted efficiently through this clearance gap, and the vacuum degree between top surface 813a, 823a and the resin board J can be raised.

  Further, the stampers 813 and 823 are thus formed to have a convex section, and in particular, by having the concave and convex regions R on the top surfaces 813a and 823a, the pressing force that presses the stampers 813 and 823 against the resin plate J is increased. Since it concentrates on 823a, the concavo-convex pattern formed in the concavo-convex region R is reliably transferred to the resin plate J. In this case, the outer shape of the resin plate J may be larger than the top surfaces 813a and 823a, or may be the same as the top surfaces 813a and 823a or smaller than the top surfaces 813a and 823a.

In this way, the stampers 813 and 823 are formed in a cross-sectional convex shape having the top surfaces 813a and 823a and the lower step surfaces 813b and 823b, so that the vacuum between the stampers 813 and 823 and the resin plate J is applied during vacuuming. Although the degree can be increased and the pressing force can be concentrated on the top surfaces 813a and 823a, the following disadvantages also occur.
By forming the stampers 813 and 823 to have a convex cross section, steps 813c and 823c are formed between the top surfaces 813a and 823a and the lower step surfaces 813b and 823b.
When the boundaries between the steps 813c and 823c and the top surfaces 813a and 823a are connected at right angles or acute angles, the resin plate J has a larger outer shape than the top surfaces 813a and 823a. Edges are formed at portions corresponding to the steps 813c and 823c of the resin plate J due to softening by heating J and solidification by cooling, and cracks are generated when the resin plate J is removed from the stampers 813 and 823 in a solidified state. May occur.
Therefore, in this embodiment, the boundaries between the steps 813c and 823c and the top surfaces 813a and 823a are connected in an arc shape or a tapered shape as shown in FIG. Thereby, a circular arc or an obtuse angle is formed in the part corresponding to the level | step difference 813c, 823c of the resin board J, and generation | occurence | production of a crack can be avoided.

Further, in order to increase the degree of vacuum between the stampers 813 and 823 and the resin plate J during evacuation, a movable body that delays the contact between the resin plate J and the stampers 813 and 823 in the initial stage of evacuation (intake) It is interposed between the resin plate J and the stampers 813 and 823.
Prior to contacting the resin plate J and the stampers 813 and 823, the movable body sufficiently sucks the air interposed therebetween, and when the resin plate J and the stampers 813 and 823 come into contact with each other, For example, when the stamper 823 on the mounting portion 82 side is a stamper having a concavo-convex pattern, the bucket 80 is changed from the open state to the closed state while evacuation is started. When changing, it is sufficient that the movable body operates so as to delay the timing at which the stamper 823 contacts the resin plate J in the initial stage of evacuation. For example, as shown in FIG. A spring 100 that urges J upward so as to separate J from the stamper 823 may be employed as the movable body.
In the process in which the bucket 80 is changed from the open state to the closed state by such a spring 100, immediately before the resin plate J and the stamper 823 come into contact with each other, the air interposed between them is sucked and the resin plate is delayed. Since J and the stampers 813 and 823 come into contact with each other, when the resin plate J and the stampers 813 and 823 come into contact with each other, no air layer is formed between them. The degree of vacuum can be increased (transfer molding method by operation of a movable body).
When the stamper 813 on the lid 81 side is a stamper having a concavo-convex pattern, a spring 100 that urges the resin plate J downward so as to be separated from the stamper 813 may be provided.

  Further, the movable body is not limited to the spring 100, and various parts can be applied in addition to an elastic member such as a damper for delaying the contact between the resin plate J and the stampers 813 and 823. For example, the resin plate J and the stamper 813 are applicable. , 823 can be provided as a movable member with a rod-like or plate-like member that can move forward and backward. In this case, evacuation is started when the bucket 80 is changed from the open state to the closed state, or when the bucket 80 is in the closed state, and at that timing, the rod-like or plate-like member is moved between the resin plate J and the stampers 813, 823. This can be realized by allowing the rod-like or plate-like member to leave the space between the resin plate J and the stampers 813 and 823 after the air is interposed between them and the air interposed between them is sucked. The rod-like or plate-like member that can move forward and backward can be operated using, for example, an electromagnetic solenoid, an air cylinder, a hydraulic cylinder, or the like as a power source.

As described above, the bucket 80 includes the lid portion 81 and the mounting portion 82, respectively, so that the resin plate J and the stampers 813 and 823 can be accommodated, and the vacuum between the resin plate J and the stampers 813 and 823 is configured. The degree has been increased.
As a result, the stampers 813 and 823 and the resin plate J come into contact with each other without an air layer interposed therebetween, so that the concavo-convex pattern is accurately transferred to the resin plate J.

The bucket 80 is formed in a rectangular shape having a long side in the normal direction of a circle centered on the shaft 71. On the other hand, if the bucket 80 is formed in a rectangular shape whose long side is the tangential direction of the circle, the buckets 80 (80a to 80f) interfere with each other. Therefore, in the present embodiment, the buckets 80 are formed in a rectangular shape having a long side in the normal direction of the circle, and each bucket 80 can be extended as much as possible in the normal direction.
Thereby, the resin plate J accommodated in the bucket 80 can also be formed in a rectangular shape that can be extended in the normal direction, and the number of products (yield) in the normal direction can be improved.
Further, when the processing unit and the bucket 80 are added, the angular interval is narrowed, but the bucket 80 can be extended along the normal direction while avoiding interference between the buckets 80, so that the product can be removed. The number (yield) can be secured.

[Inbound processing section and outbound processing section]
The sending processing unit 10 and the sending processing unit 60 perform a feeding process (feeding process step) for feeding the resin plate J1 into the bucket 80 and a sending process (sending process step) for sending the resin plate J2 from the bucket 80. Each processing unit is provided with transport devices 11 and 61 for transporting the resin plate J and arms 12 and 62 for taking the transported resin plate J into and out of the bucket 80.
The conveyance devices 11 and 61 are constituted by, for example, a belt conveyor, and convey the resin plate J placed on the belt. The transport device 11 transports the resin plate J1 in the direction of the shaft 71, and the transport device 61 transports the resin plate J2 in the direction opposite to the shaft 71.
The arms 12 and 62 are configured to be able to advance and retreat along the conveying direction of the resin plate J, and have a pipe line connected to a predetermined vacuum pump inside. By arranging the suction cups made of silicon at the locations corresponding to the four corners, the resin plates J (J1, J1, J) with respect to the buckets 80a, 80f are moved forward and backward along the transport direction while adsorbing the resin plates J to the suction cups. J2) can be taken in and out.
For example, referring to FIG. 1, the arm 12 sucks the resin plate J1 transported by the transport device 11 to the suction cup, moves to the mounting portion 82 of the bucket 80a in the open state, and sucks after moving. Is released and the resin plate J1 is placed on the placement portion 82. Next, the lid portion 81 is lowered toward the placement portion 82 and the bucket 80 is closed, and the resin plate J1 is accommodated in the bucket 80 so as to overlap with the stampers 813 and 823.
On the other hand, the arm 62 takes out the resin plate J2 from the bucket 80f in the open state. For example, the resin plate J2 placed on the placement portion 82 of the bucket 80 in the open state is attracted to the suction cup and moved as it is to the transport device 61. After the movement, the suction is released and the resin plate J2 is moved to the transport device 61. Put it on.
As described above, the sending processing unit 10 that feeds the resin plate J1 into the bucket 80 and the sending processing unit 60 that sends the resin plate J2 from the bucket 80 are made independent so that each processing step is a separate step. Thus, the processing time (tact time) in each processing unit is shortened, and the number of products (production amount) per unit time can be increased.

[Vacuum processing section]
The vacuum processing unit 20 is a processing unit that performs vacuum processing (vacuum processing step) for sucking (evacuating) the inside of the bucket 80 that is in a closed state, and between the resin plate J and the stampers 813 and 823 by vacuuming. Processing to increase the degree of vacuum is performed.
In the vacuum processing unit 20, evacuation is performed through the intake hole 827 formed in the bucket 80 described above.
As shown in FIG. 4, the vacuum processing unit 20 includes a cover plate 21 (21a, 21b) capable of covering the bucket 80 from above and below, and sandwiches the bucket 80 in the closed state from above and below by the cover plates 21a and 21b. While inhaling. In FIG. 4, for convenience of explaining the opening and closing operation of the bucket 80, the bucket 80 b intermittently stopped at a position facing the cover plates 21 a and 21 b is in an open state. Stops intermittently.
The cover plates 21a and 21b are driven by, for example, an air cylinder so that the cover plate 21a can be raised and lowered with respect to the cover plate 21b.

With such a configuration, when the bucket 80b in the closed state is intermittently stopped at a position facing the cover plates 21a and 21b, the cover plate 21a is lowered and the bucket 80b is sandwiched between the cover plate 21a and the cover plate 21b ( Inhalation via the air intake hole 827 is started while the pressure is supplementally pressed. Further, the aforementioned movable body (for example, the spring 100) operates at this timing.
Thereby, the inside of the accommodating part 800 will be in a vacuum state, and the resin board J and the stampers 813 and 823 will be in the state which contacted without the air layer interposing. Thereafter, the cover plate 21a rises and the bucket 80b in the closed state rotates and moves toward the heat treatment unit 30, but the intake air through the intake holes 827 remains until the bucket 80b is opened (the delivery processing unit 60). To continue).
That is, the vacuum processing unit (vacuum processing step) of this embodiment is not limited to the vacuum processing unit 20 existing between the inflow processing unit 10 and the heat processing unit 30, but also from the vacuum processing unit 20 to the cooling processing unit 50. (The vacuum processing step is continuously performed). In addition, in this case, each processing unit from the heat processing unit 30 to the cooling processing unit 50 is provided with a vacuum processing unit, and the vacuum processing steps are performed in parallel in each processing step.
As a result, the vacuum state between the stampers 813 and 823 and the resin plate J is reliably maintained from the vacuum processing unit 20 in which the bucket 80 is in the closed state to the cooling processing unit 50.
The vacuum processing (vacuum processing step) is preferably performed before the press processing (press processing step) for pressing at least the stampers 813 and 823 against the resin plate J is performed.

[Heat treatment part]
The heat processing units 30 and 40 are processing units that perform in parallel a heating process (heating process) for heating the bucket 80 and a pressing process (pressing process) for pressing the bucket 80, and heat the resin plate J. Then, the stamper 813, 823 is pressed.
That is, the heat processing units 30 and 40 of the present embodiment operate not only as a heat processing unit that heats the bucket 80 but also as a press processing unit that presses the bucket 80.
Further, the heat treatment unit 30 is a first heat treatment unit (first heat treatment step) that performs pressing while heating the resin plate J to a first heating temperature (for example, a surface temperature of the resin plate J of 130 ° C. to 140 ° C.). The heat processing unit 40 heats the resin plate J to a second heating temperature higher than the first heating temperature (for example, a surface temperature of the resin plate J of 170 ° C. to 250 ° C.) following the heat processing unit 30. While operating as a second heat treatment unit (second heat treatment step) for pressing.
In this way, the heating temperature of the resin plate J is different between the heat treatment unit 30 and the heat treatment unit 40 because the heat treatment unit 30 preheats the stampers 813 and 823 while preliminarily heating the resin plate J. This is because the press processing is performed and the heat processing unit 40 performs the main heating / press processing of pressing the stampers 813 and 823 while fully heating the resin plate J.

  As shown in FIGS. 3 and 7, the heat treatment units 30 and 40 include press plates 31 (31 a and 31 b) and 41 (41 a and 41 b) and a support plate 32 (32 a that attaches the press plates 31 and 41 by screwing. , 32b) and 42 (42a, 42b) are stacked, and the pressure bodies 33a, 43a positioned above are positioned below. By being configured to be movable up and down with respect to the pressure bodies 33b and 43b, the bucket 80 is pressed against the bucket 80 while holding the bucket 80 between the pressure bodies 33a and 43a and the pressure bodies 33b and 43b. Heat treatment is performed.

Since the heat treatment units 30 and 40 have the same configuration although the temperatures at which the resin plate J is heated are different, the following description will be given with respect to the heat treatment unit 30.
The press plates 31a and 31b are made of a metal (for example, stainless steel, brass, or the like) plate member having thermal conductivity and flexibility, and as shown in FIG. 7, the exposed surfaces 812a of the sandwiching plates 812 and 822. , 822a and press surfaces 311a and 311b that pressurize and heat, and the press surfaces 311a and 311b are configured as flat surfaces having substantially the same outer shape as the exposed surfaces 812a and 822a, respectively. The press plate 31 is screwed to the support plate 32 via screws 34.

The press plates 31a and 31b are configured as resistance heating plates, and transmit heat generated by energization to the exposed surfaces 812a and 822a via the press surfaces 311a and 311b.
A plurality of heating wires 321 to 325 (for example, nichrome wire) are embedded in the press plate 31, and Joule heat is generated by applying a direct current to heat the entire press plate 31.
The heating wires 321a to 325a and 321b to 325b of the press plates 31a and 31b are formed of independent heating wires and are configured to be able to apply different values of current, and the amount of generated heat is set for each of the heating wires 321a to 325a and 321b to 325b. It can be controlled.
Thereby, press plate 31a, 31b can change heating temperature according to the site | part in which the heating wires 321a-325a, 321b-325b were embed | buried, and the heat processing part 30 makes the heating temperature with respect to the peripheral part of the bucket 80 from a center part. Is also provided with variable means for each set temperature region that can be set to a high temperature.
With such a configuration, the heat generation distribution of the press surfaces 311a and 311b also shows a distribution corresponding to the amount of heat generated by the heating wires 321a to 325a and 321b to 325b.
As described above, by making it possible to adjust the heat generation amount of the press surfaces 311a and 311b for each part, the following effects are exhibited.

When the heat treatment is performed while the bucket 80 is sandwiched between the pressurizing bodies 33 (33a, 33b), if the heat generation distribution of the press surfaces 311a, 311b is made uniform, The temperature is not even.
That is, the press surfaces 311a and 311b come into contact with the exposed surfaces 812a and 822a, and heat is transferred to the resin plate J through the exposed surfaces 812a and 822a, but the frame 811 of the bucket 80 at the peripheral edge of the resin plate J Since heat is taken away by 821 etc., when the heat distribution of the press surfaces 311a and 311b is made uniform, the surface temperature of the resin plate J tends to be lower in the peripheral portion than in the vicinity of the center. FIG. 8 is a chart specifically showing this.

FIG. 8 shows the setting temperature (marked with ◯ in the figure) for each part where the heating wires 321 to 325 of the heat treatment unit 30 are buried and the resin temperature of the resin plate J (marked with Δ in the figure, hereinafter referred to as surface temperature). It is a graph which shows a relationship, (a) is a graph which shows the surface temperature of the resin board J when the preset temperature according to site | part is set uniformly, (b) changed the preset temperature according to site | part. It is a graph which shows the surface temperature of the resin board J at the time.
Looking at this, as shown in FIG. 8A, when the set temperature for each of the portions where the heating wires 321 to 325 are embedded is uniformly set to 200 ° C., for example, the surface temperature of the resin plate J is the center. The peripheral portion (portion corresponding to the heating wires 321 and 325) is lower than the vicinity (portion corresponding to the heating wires 322 to 324).
For example, the surface temperature near the center shows 195 ° C., the peripheral portion corresponding to the heating wire 321 shows 180 ° C., the peripheral portion corresponding to the heating wire 325 shows 170 ° C., and the surface temperature of the peripheral portion is the center. It is 15-25 ° C. lower than the vicinity.
If pressing is performed with such temperature unevenness, bubbles may be generated in some places, or transfer unevenness may occur between the center and the peripheral portion, so that the uneven pattern cannot be accurately transferred. was there.

Therefore, the heat treatment unit 30 includes setting temperature part-specific variable means for varying the set temperature for each of the heating wires 321 to 325, and the heating temperature of the resin plate J is set so that the peripheral portion is higher than the vicinity of the center. .
For example, as shown in FIG. 8B, the set temperature of the heating wires 322 to 324 corresponding to the vicinity of the center of the resin plate J is set to 190 ° C., for example, and the heating wires 321 and 321 corresponding to the peripheral portion of the resin plate J are used. The set temperature of 325 was set higher than this, for example, 215 ° C.
Thereby, the surface temperature near the center of the resin plate J indicates 205 ° C., the surface temperature of the peripheral portion corresponding to the heating wire 321 is 195 ° C., and the surface temperature of the peripheral portion corresponding to the heating wire 325 is 200 ° C. The difference between the surface temperature of the peripheral portion and the surface temperature near the center could be reduced to within 10 ° C.
As a result, the resin plate J is heated evenly, and the uneven pattern can be accurately transferred without causing uneven transfer between the vicinity of the center and the peripheral portion.

As shown in FIG. 3, the heat treatment unit 30 configured in this way is configured such that an upper pressure body 33 a is driven by, for example, a hydraulic cylinder and can be moved up and down with respect to the pressure body 33 b. Thus, when the bucket 80c in the closed state is intermittently stopped at a position facing the pressurizing bodies 33a and 33b, the heating process and the press process are performed while the bucket 80c is sandwiched between the pressurizing body 33a and the pressurizing body 33b. Do.
Specifically, when the bucket 80c, which is evacuated in the vacuum processing unit 20 and is intermittently stopped at a position facing the pressurizing bodies 33a and 33b, is lowered, the pressurizing body 33a is lowered and added to the pressurizing body 33a. For example, pressing is performed at 6 MPa while the bucket 80c is sandwiched between the pressure body 33b. At this time, the press surfaces 311a and 311b press the exposed surfaces 812a and 822a without pressing the frames 811 and 821, respectively. At the same time, heat having a temperature gradient for each region is transmitted to the exposed surfaces 812a and 822a through the press surfaces 311a and 311b.
The resin plate J is heated by heat transmitted through the sandwiching plates 812 and 822 and the stampers 813 and 823, the surface thereof is softened, and the stampers 813 and 823 are pressed by the press.
Thereafter, the pressure body 33a rises and the bucket 80b in the closed state rotates and moves toward the heat treatment unit 40.
The heat processing unit 40 performs the same operation as the heat processing unit 30 although the set temperature of the press plate 41 is different from that of the press plate 31.

Moreover, in the heat treatment part 30, while preliminarily heating the resin plate J to the first heating temperature (for example, the surface temperature of the resin plate J is 130 ° C. to 140 ° C.), pressing is performed for about 30 to 90 seconds, and heating is performed. In the processing unit 40, the resin plate J is pressed for about 30 to 90 seconds while being fully heated to a second heating temperature higher than the first heating temperature (for example, the surface temperature of the resin plate J is 170 ° C to 250 ° C). I do.
These heating temperatures are such that the first heating temperature is lower than the glass transition temperature of the resin plate J (preferably a temperature lower by 5 to 15 ° C. than the glass transition temperature), and the second heating temperature is equal to or higher than the glass transition temperature (preferably glass 25 to 105 ° C. higher than the transition temperature).
For example, when the resin plate J is made of polycarbonate, the glass transition temperature is about 145 ° C., so the first heating temperature is lower than the glass transition temperature (145 ° C.), for example, 130 ° C. to 140 ° C., The second heating temperature is not lower than the glass transition temperature (145 ° C.) and can be set to, for example, 170 ° C. to 250 ° C.
Thereby, at least in the heat treatment unit 40, the resin plate J is heated to a temperature higher than the glass transition temperature and softened into a rubber shape, and the stampers 813 and 823 are pressed in this state, so that the uneven pattern is transferred to the resin plate J. It will be.
By dispersing the heat treatment in this way, the following effects are exhibited.

When the resin plate J is heated from room temperature to the glass transition temperature or higher at a stretch, discoloration due to resin burning or the like, bubbles or the like are generated in the resin plate J. When one heat treatment unit is used, in order to avoid the generation of such bubbles and the like, it is necessary to gradually increase the set temperature, but in that case, the heat treatment unit reciprocates between a plurality of temperatures. A heating / heat dissipation cycle period is required, resulting in a reduction in manufacturing efficiency.
Thus, in the present embodiment, a plurality of heat treatment units 30 and 40 having different heating temperatures are provided, and each of the heat treatment units 30 and 40 is heated while maintaining a constant temperature without performing temperature level control. Processing is performed, and the bucket 80 rotates and moves in the meantime, whereby the resin plate J is gradually heated from the normal temperature to the glass transition temperature or higher.
Thereby, the time required for heat dissipation is saved, and the manufacturing efficiency is improved.
In addition, by dispersing the heat treatment to the plurality of heat treatment units 30 and 40, the processing time (tact time) in each processing unit is shortened, and the number of products (production amount) per unit time can be increased. .

In addition, the dispersion of the heat treatment is not limited to the heat treatment unit 30 and the heat treatment unit 40, and at least one continuous heat treatment unit 30 including the treatment unit immediately before the heat treatment unit 30 is reached. In the other processing section described above, the preheat treatment for preheating the bucket 80 or the resin plate J can be performed in parallel.
For example, in the vacuum processing unit 20 that is a processing unit immediately before the heat processing unit 30, the cover plates 21 a and 21 b are configured as resistance heating plates in the same manner as the press plates 31 and 41, and the air in the bucket 80 is sucked in. In this case, when the bucket 80b is sandwiched between the cover plate 21a and the cover plate 21b, the cover plate 21a and the cover plate 21b are brought into contact with the exposed surfaces 812a and 822a, respectively, so that the resin plate J in the bucket 80 is preliminarily disposed. It is also possible to heat (for example, the surface temperature of the resin plate J is 80 ° C.).
Furthermore, in addition to the vacuum processing unit 20, the resin plate J can be preheated in the infeed processing unit 10. That is, the bucket 80 or the resin plate J is heated in advance in the vacuum processing unit 20 and the infeed processing unit 10 that are two or more other processing units that are continuous up to the heat processing unit 30. In this case, for example, a heater and a resistance heating plate may be provided in the lower part of the transport device 11, and the resin plate J transported in the direction of the axis 71 may be preheated (for example, the surface temperature of the resin plate J is 40 ° C.). .
Thereby, the heating time in the heat processing units 30 and 40 is dispersed in the vacuum processing unit 20 and the infeed processing unit 10, and the processing time (tact time) is further shortened, and the number of productions per unit time (production amount). Can be increased.

In addition, the first heating temperature and the second heating temperature are the respective heating temperatures with the temperature at which the resin plate J is changed to a glass state in the heat treatment unit 30 and a rubber state by slight heating in the heat treatment unit 40 as a reference temperature. Can also be set.
For example, the first heating temperature may be set to glass transition temperature ± X ° C. (for example, X = 30), and the second heating temperature may be set to glass transition temperature + Y ° C. (for example, Y = 50, X <Y). it can.
Thereby, since the state of the resin plate J can be changed from the glass state to the rubber state by a slight temperature difference based on the phase transformation, the heating time in the heat treatment unit 40 can be shortened.

Further, in the press processing for pressing the bucket 80, the heat processing units 30 and 40 use at least one of the pressing force for pressing the stampers 813 and 823 against the resin plate J and the transmission start position of the pressing force as the stamper 813. , 823 and the resin plate J are provided with press part variable means (press part variable step) for changing according to the contact part.
Although the degree of vacuum between the stampers 813 and 823 and the resin plate J is increased in the intake through the vacuum processing unit 20 and then the intake hole 827 while the bucket 80 is closed, the sandwiching plates 812 and 822 and the press surface 311a are increased. , 311b are not necessarily parallel to each other without unevenness, and the stampers 813 and 823 are not evenly pressed against the resin plate J with respect to the surface direction. For each contact portion between the stampers 813 and 823 and the resin plate J In some cases, the press unevenness in which a portion having a high pressing force and a portion having a low pressing force are distributed in a mottled manner may occur.
Therefore, the press plate 31 is screwed to the support plate 32 so that a thin plate 110 (shim plate) made of a metal plate member can be inserted between the press plate 31 and the support plate 32.
Thereby, for example, the screw 34 is loosened and the thin plate 110 is inserted into a location corresponding to the contact portion where the pressing force is insufficient, and the screw 34 is tightened to clamp the thin plate 110 between the press plate 31 and the support plate 32. Then, the thin plate 110 functions as a press part variable means, and due to the flexibility of the press plate 31, the vicinity of the insertion part protrudes compared to other parts, and the pressing force of the contact part can be increased. It is possible to eliminate the press unevenness efficiently (press part variable step). Note that by preparing a plurality of types of thin plates 110 having different thicknesses and sizes (outer shapes), complicated press unevenness can be eliminated.

Further, by inserting the thin plate 110, the press surfaces 311a and 311b corresponding to the insertion locations first come into contact with the exposed surfaces 812a and 822a, so that the transmission start position of the press force can be changed.
As a result, for example, by inserting the thin plate 110 at a position corresponding to the vicinity of the center of the resin plate J, the thin plate 110 is caused to function as a pressing portion variable means, and the pressing force near the center of the resin plate J is first increased. It is also possible to adjust (press part variable step).
As a result, even when an air layer is interposed between the stampers 813 and 823 and the resin plate J, the press force near the center of the resin plate J first increases, so that the air layer is radiated from the center toward the peripheral portion. Therefore, it is possible to completely contact the stamper 813,823 and the resin plate J without interposing an air layer.

Further, such a press treatment is performed in the heat treatment unit 30 while preliminarily heating the resin plate J to a temperature lower than the glass transition temperature (for example, the surface temperature of the resin plate J is 130 ° C. to 140 ° C.). In the part 40, it is carried out while the resin plate J is fully heated to the glass transition temperature or higher (for example, the surface temperature of the resin plate J is 170 ° C to 250 ° C).
As described above, the press operation is performed by the heat treatment unit 30 before the heat treatment is performed by the heat treatment unit 40 in earnest, thereby exhibiting the following effects.

When the glass transition temperature is reached, the resin plate J is softened into a rubber shape by the glass transition. At this time, since the resin plate J is in contact with the stampers 813 and 823 while having fluidity (viscosity), even if an air layer is interposed between the resin plate J and the stampers 813 and 823, the air layer Is moved toward the peripheral edge by the press process, but its escape is blocked by its viscosity, and it is confined without being pushed out between the resin plate J and the stampers 813 and 823. That is, in the heat treatment unit 40, the air layer is interposed between the resin plate J and the stampers 813 and 823, so that the temperature is not less than the glass transition temperature (for example, the surface temperature of the resin plate J is 170 ° C. to 250 ° C.). When heated, the air layer remains confined, and as a result, the air layer acts to inhibit the transfer of the concave / convex pattern.
Therefore, the heat treatment unit 30 performs press processing while preliminarily heating the resin plate J to a temperature lower than the glass transition temperature (for example, the surface temperature of the resin plate J is 130 ° C. to 140 ° C.).
In this heat treatment unit 30, since the resin plate J is in a glass state below the glass transition temperature and has not yet been softened, even if an air layer is interposed between the resin plate J and the stampers 813, 823, Without being confined, it can be driven out by the press process or the above-mentioned press part variable means.
Thereby, before heating the resin plate J in earnest, the air layer can be surely expelled from between the resin plate J and the stampers 813 and 823.
In the present embodiment, the first heat treatment for preliminarily heating the resin plate J is performed as a press treatment (press treatment step) for the purpose of expelling the air layer from between the resin plate J and the stampers 813 and 823. Although performed in parallel with the process, the press process (press process process) for the purpose of expelling the air layer can be performed after the vacuum process (vacuum process process) and before the first heat treatment process. .
In addition, the press process (press process step) for the purpose of transferring the concavo-convex pattern is at least a heat process (heat process step) after heating the resin plate J in earnest, that is, the second heat process as in this embodiment. It can also be performed in parallel with the process, and is a process step after the heat treatment (second heat treatment step) for full-scale heating, and at least before the feed process step (send processing unit 60) (for example, , A cooling process step).

[Cooling processing section]
The cooling processing unit 50 is a processing unit that performs a cooling process (cooling process) for cooling the bucket 80, fixing the uneven pattern thermally transferred in the heating processing unit 40 while taking heat away from the heated resin plate J. Solidify.
As shown in FIGS. 4 and 9, the cooling processing unit 50 includes a cooling body 51 (51 a, 51 b) that cools the bucket 80 while sandwiching the bucket 80 from the vertical direction.
The cooling bodies 51a and 51b have cooling surfaces 519a and 519b facing the sandwiching plates 812 and 822, and are driven by, for example, an air cylinder so that the cooling body 51a can be raised and lowered with respect to the cooling body 51b.
The cooling bodies 51a and 51b are each made of a metal (for example, stainless steel, brass, etc.) thick plate member (for example, 80 mm) having thermal conductivity, and as shown in FIG. A plurality of conduits 511a to 518a and 511b to 518b that can flow in and out are respectively provided.

As shown in FIG. 9B, the pipes 511a to 518a and 511b to 518b are connected to the odd-numbered pipes and the even-numbered pipes inside the cooling bodies 51a and 51b. The water inlet and the even-numbered side are formed as a substantially U-shaped pipe line serving as a cooling water outlet. In this way, by forming the pipes 511a to 518a and 511b to 518b as substantially U-shaped pipes, the cooling water inlet and outlet can be concentrated on one end surface of the cooling bodies 51a and 51b. This makes it easy to check for leakage of cooling water.
Further, the inflow / outflow port is disposed on the side surface opposite to the shaft 71 on one end surface other than the surface facing the shaft 71 so as not to interfere with the rotating bucket 80. In addition, the inflow / outlet is rotationally moved even if it is disposed on one end surface of the cooling bodies 51a and 51b other than the surface facing the shaft 71 and parallel to the normal direction of the circle centering on the shaft 71. It is possible to prevent the bucket 80 from interfering.
The pipes 511a to 518a and 511b to 518b are piped at equal intervals with respect to the cooling surfaces 519a and 519b of the cooling bodies 51a and 51b, respectively, and uniformly cool the cooling surfaces 519a and 519b contacting the exposed surfaces 812a and 822a, respectively. It is supposed to be.
Further, the U-shaped portions 510a to 510d of the pipes 511a to 518a and 511b to 518b are extended outward from the end surfaces (axis side surfaces) of the cooling bodies 51a and 51b.
Accordingly, the pipes 511a to 518a and 511b to 518b in the cooling bodies 51a and 51b can be formed as through holes that can be penetrated by a drill or the like, so that the manufacturing of the cooling bodies 51a and 51b is facilitated. Can be reduced.
In addition, an open / close valve (not shown) may be provided on the inlet side of each of the pipelines 511a to 518a and 511b to 518b so that the flow rate of the cooling water can be adjusted for each pipeline.

With such a configuration, when the bucket 80e in the closed state is intermittently stopped at a position facing the cooling bodies 51a and 51b, the cooling body 51a is lowered and the bucket 80e is sandwiched between the cooling bodies 51a and 51b. While cooling, start. By exposing the exposed surfaces 812a and 822a to the cooling surfaces 519a and 519b, respectively, the heat of the resin plate J is evenly taken from the sandwiching plates 812 and 822 via the stampers 813 and 823, and the resin plate J is cooled. The concavo-convex pattern thermally transferred in the heat treatment unit 40 is fixed and solidified.
At this time, unevenness occurs in the cooling rate with respect to the surface direction of the resin plate J. For example, when there is a difference in the cooling rate, for example, the peripheral portion cools faster than the vicinity of the center of the resin plate J, the opening degree of the opening / closing valve is adjusted. Thus, in this example, the cooling rate can be made uniform by adjusting the flow rate of the pipe line corresponding to the vicinity of the center to be larger than the flow rate of the pipe line corresponding to the peripheral portion.

Further, when the cooling processing unit 50 is integrally provided with a press processing unit to cool the bucket 80e between the cooling body 51a and the cooling body 51b, the clamping plates 812 and 822 may be pressed from above and below. it can. That is, the pressing process can be performed in parallel with the cooling process.
For example, the cooling body 51a and the cooling body 51b are each configured as a press plate, and when the bucket 80e is sandwiched between the cooling body 51a and the cooling body 51b, the cooling surfaces 519a and 519b press the frames 811 and 821. Without any limitation, the exposed surfaces 812a and 822a can be pressed respectively.
Thereby, since the flow of the resin softened in a rubber shape by glass transition in the heat treatment unit 40 is suppressed, the fixability of the uneven pattern is improved.

[Operation of transfer molding apparatus and transfer molding method]
The transfer molding apparatus 1 configured as described above includes a central processing unit (CPU), a ROM, a RAM, an interface circuit, and the like, and a control unit (not shown) operating as a computer performs an infeed processing unit 10 and a vacuum processing unit. 20, the heat processing units 30 and 40, the cooling processing unit 50, the delivery processing unit 60, and the intermittent rotation unit 70 are controlled, and the above-described processes are performed for the different buckets 80a to 80f. Is performed during one stop of the same period, and one bucket 80 makes a round of the processing units 10 to 60 as shown below, so that the primary molded resin plate J1 is automatically fed. At the same time, a transfer molding method is realized in which the resin plate J2 which is a secondary molded product obtained by transfer molding of the concavo-convex pattern is automatically sent out.

The six buckets 80 are respectively supported by the intermittent rotation unit 70, and each process is performed by alternately performing rotation (clockwise) in units of about 60 degrees and stopping while performing an opening / closing operation according to a position on the circumference. It moves over the parts 10-60.
In the infeed processing unit 10, the bucket 80 is intermittently stopped in the open state, and the resin plate J <b> 1 is automatically fed into the bucket 80 by the cooperative operation of the transport device 11 and the arm 12 (infeed processing step).
Accordingly, the resin plate J1 is accommodated in the bucket 80 so as to overlap with the stampers 813 and 823.
The intermittent rotation portion 70 rotates about 60 degrees when the fed resin plate J1 is detected by a detection means such as an optical sensor, and the lid portion 81 is lowered toward the placement portion 82 and the bucket 80 is closed. Then stop. At this time, even if the feeding processing unit 10 detects the feeding of the resin plate J1, the intermittent rotating unit 70 does not rotate unless the processing in the other processing units 20 to 60 is completed. That is, the intermittent rotation unit 70 performs intermittent stop according to the processing time in any of the processing units 10 to 60 that perform the longest processing in time. For example, when the processing time in the heat processing units 30 and 40 is set longer than the processing time of the other processing units, the heat processing units 30 and 40 are detected even after the feeding of the resin plate J1 is detected. Rotation of about 60 degrees is started after intermittent stop according to the processing time. Accordingly, each process in each of the processing units 10 to 60 is reliably performed while performing different processes in a distributed manner, and each processing unit is stopped during the same period when the intermittent rotation unit 70 is stopped. Each processing in 10 to 60 is performed at once for different buckets 80a to 80f.

Next, in the vacuum processing unit 20, the bucket 80 is intermittently stopped in the closed state, and is sucked in through the suction holes 827 while being sandwiched from above and below by the cover plates 21a and 21b (vacuum processing step). Further, in the initial stage of intake, the movable body (for example, the spring 100) operates so as to delay the timing of the stampers 813 and 823 that come into contact with the resin plate J, so that there is a gap between the resin plate J and the stampers 813 and 823. The degree of vacuum can be increased.
Thereafter, the intermittent rotation unit 70 starts rotating at about 60 degrees after a predetermined time has elapsed (for example, after the processing time of the heat processing units 30 and 40 has elapsed), but the intake air through the intake hole 827 does not open the bucket 80. It continues until it reaches a state (until it reaches the sending processing unit 60).

  Subsequently, in the heat treatment unit 30, the bucket 80 is intermittently stopped in the closed state, and is heated and pressed preliminarily (less than the glass transition temperature) while being sandwiched from above and below by the pressure bodies 33a and 33b (first heat treatment). Process). At this time, the resin plate J is preliminarily heated uniformly by the variable means for each set temperature region without causing unevenness in the temperature distribution between the vicinity of the center and the peripheral portion. Further, the press part varying means eliminates press unevenness in which a portion with a high pressing force and a portion with a low pressing force are distributed, and an air layer interposed between the stampers 813 and 823 and the resin plate J is changed from the central portion to the peripheral portion. Therefore, air can be completely eliminated from between the stampers 813 and 823 and the resin plate J. Thereafter, the intermittent rotation unit 70 starts rotating about 60 degrees after a predetermined time has elapsed (for example, after the processing time of the heat processing units 30 and 40 has elapsed).

  In the heat treatment unit 40, the bucket 80 is intermittently stopped in the closed state, and is heated and pressed in earnest (above the glass transition temperature) while being sandwiched from above and below by the pressurizing bodies 43a and 43b (second heat treatment step). . As a result, the resin plate J is softened into a rubber shape, and the uneven pattern of the stampers 813 and 823 is transferred. Also in this process, similarly to the heat treatment unit 30, uniform heating and pressing in the surface direction and expulsion of the air layer are performed by the variable means for each set temperature portion and the press portion variable means. Thereafter, the intermittent rotation unit 70 starts rotating about 60 degrees after a predetermined time has elapsed (for example, after the processing time of the heat processing units 30 and 40 has elapsed).

In the subsequent cooling processing unit 50, the bucket 80 is intermittently stopped in the closed state, and is cooled while being sandwiched from above and below by the cooling bodies 51a and 51b (cooling processing step). As a result, it is possible to fix and solidify the concavo-convex pattern thermally transferred in the heat treatment unit 40 while removing heat from the resin plate J. Further, at this time, the bucket 80 can be pressed from above and below in order to suppress the flow of the resin softened in a rubber shape.
Thereafter, the intermittent rotation unit 70 starts rotating about 60 degrees after a predetermined time has elapsed (for example, after the processing time of the heat processing units 30 and 40 has elapsed).

  Finally, in the delivery processing unit 60, the bucket 80 is intermittently stopped in the open state, and the resin plate J2 on which the uneven pattern is transferred is automatically delivered from the bucket 80 by the cooperative operation of the transport device 61 and the arm 62 ( Sending process).

As described above, in the transfer molding apparatus 1 and the transfer molding method of the present embodiment, one bucket 80 includes the infeed processing unit 10 (infeed processing step), the vacuum processing unit 20 (vacuum processing step), and the heating processing unit. 30 and 40 (first and second heat treatment steps), the cooling processing unit 50 (cooling processing step), and the delivery processing unit 60 (delivery processing step) make a round so that the primary molded resin plate J1 is automatically The resin plate J2, which is a secondary molded product obtained by transfer molding of the concavo-convex pattern, is automatically sent out, and each of the processing units 10 to 60 (processing steps) has six buckets. Since different processing is performed for each of 80a to 80f during one stop at the same time, one resin plate J2 is manufactured every time the intermittent rotation unit 70 rotates about 60 degrees.
In particular, in the process of heating and cooling cycles in which the resin plate J is heated to perform transfer molding and radiate heat, the time required to heat the resin plate J at room temperature to a certain temperature and then radiate heat is reduced. Since it is difficult to do so, such dispersion of processing leads to shortening of processing time while improving heating and cooling efficiency, and can increase the number of production (production amount) per unit time.

  The preferred embodiments of the transfer molding apparatus and the transfer molding method of the present invention have been described above. However, the transfer molding apparatus and the transfer molding method according to the present invention are not limited to the above-described embodiments, and the scope of the present invention. Needless to say, various modifications can be made.

For example, in this embodiment, the vacuum processing unit 20 is physically provided independently. However, the vacuum processing performed through the intake holes 827 is performed in the processing units of the heating processing units 30 and 40 and the cooling processing unit 50. Since the processes are performed in parallel with the respective processes, the vacuum processing unit 20 can be deleted.
In this case, evacuation is started from the heat treatment unit 30, but a movable body (for example, a spring 100) is provided in the heat treatment unit 30, and the resin plate J and the stampers 813 and 823 It is preferable to perform the heating / pressing treatment after increasing the degree of vacuum.
In the present embodiment, the heat processing units 30 and 40 and the cooling processing unit 50 are provided with the press processing unit, but may be provided only in the cooling processing unit 50.
As described above, the incoming processing unit 10, the heating processing units (30, 40), the cooling processing unit 50, and the outgoing processing unit 60 need to be provided independently of the processing units included therein. The press processing unit and the vacuum processing unit can be provided together with these.

In the present embodiment, a plurality of heat treatment units are provided, but only one heat treatment unit may be provided.
Further, the heating temperature of the heat treatment unit 30 and the heat treatment unit 40 may be the same temperature.
In addition, the stampers 813 and 823 can be provided with the concavo-convex region R on both top surfaces, or can be provided with the concavo-convex region R only on one top surface and a mirror surface on the other top surface.
In the present embodiment, the processing units 10 to 60 are moved clockwise in the order of the incoming processing unit 10, the vacuum processing unit 20, the heating processing unit 30, the heating processing unit 40, the cooling processing unit 50, and the sending processing unit 60. Although arranged, the sending processing unit 60, the cooling processing unit 50, the heating processing unit 40, the heating processing unit 30, the vacuum processing unit 20, and the feeding processing unit 10 are arranged clockwise in this order, and the intermittent rotation unit 70 includes each bucket 80. Can also be rotated counterclockwise.

  Further, in the present embodiment, as the transfer molding apparatus and the transfer molding method, the plurality of buckets in which the stamper having the resin plate and the concave / convex pattern is rotated rotate around the axis, and the stamper is pressed against the resin plate to form the concave / convex pattern. Although a rotary type transfer molding device and transfer molding method for transfer molding to a resin plate are adopted, the transfer molding device and the transfer molding method are not limited to this, and a stamper is pressed against the resin plate to transfer the uneven pattern to the resin plate. Any transfer molding apparatus and transfer molding method having the configuration and method for achieving the above can be included in the transfer molding apparatus and the transfer molding method of the present invention.

  INDUSTRIAL APPLICABILITY The present invention can be suitably used for a transfer molding apparatus and a transfer molding method in which a stamper having a concavo-convex pattern is pressed against a primary molded resin plate, and the concavo-convex pattern of the stamper is transferred to the resin plate.

DESCRIPTION OF SYMBOLS 1 Transfer molding apparatus 10 Infeed processing part 20 Vacuum processing part 30 Heat processing part (1st heat processing part, press processing part)
40 Heat treatment part (second heat treatment part, press treatment part)
50 Cooling Processing Unit 60 Delivery Processing Unit 70 Intermittent Rotation Unit 80 Bucket

Claims (6)

A transfer molding apparatus comprising a press processing unit that presses a stamper having a concavo-convex pattern onto a predetermined resin plate, and transcribes the concavo-convex pattern onto the resin plate;
The press processing unit
A pressing portion variable means for changing at least one of a pressing force for pressing the stamper against the resin plate and a transmission start position of the pressing force for each contact portion between the stamper and the resin plate is provided. Transfer molding device. A plurality of buckets formed to be openable and closable and accommodating the resin plate and the stamper,
An infeed processing unit that feeds the resin plate before molding into the bucket, a vacuum processing unit that sucks the inside of the bucket, a heating processing unit that heats the bucket, the press processing unit that presses the bucket, and the bucket A plurality of processing units including a cooling processing unit that cools the resin plate and a processing unit that sends out the molded resin plate from the bucket;
Intermittently rotating and stopping about a predetermined axis and supporting each bucket so that a plurality of the buckets are arranged at predetermined angular intervals on the circumference of a circle centered on the axis A rotating part;
Bucket opening and closing means for opening and closing each bucket according to the position on the circumference,
The feeding processing unit, the heating processing unit, the cooling processing unit, and the sending processing unit are provided independently for at least the processing units included therein and are respectively disposed on the circumference,
At least the sending processing unit, the heating processing unit, the cooling processing unit, and the sending processing unit perform each processing on different buckets during the one stop of the same period,
The transfer molding apparatus according to claim 1, wherein a process in the plurality of processing units is performed by one rotation of the intermittent rotation unit, and the resin plate to which the uneven pattern is transferred is molded. The transfer molding apparatus according to claim 1, wherein the pressing portion varying means transmits the pressing force so as to spread from a central portion of the resin plate to a peripheral portion. The press processing unit includes a press plate having a press surface in contact with the bucket, and a support unit to which the press plate is attached by screwing.
The press site variable means is:
The transfer molding apparatus according to any one of claims 1 to 3, further comprising a plate-like member that is sandwiched between the press plate and the support portion so that the arrangement can be changed. A press molding step of pressing a stamper having a concavo-convex pattern onto a predetermined resin plate, and a transfer molding method of transferring and molding the concavo-convex pattern onto the resin plate,
In the pressing process,
A pressing portion variable step of changing at least one of a pressing force for pressing the stamper against the resin plate and a transmission start position of the pressing force for each contact portion between the stamper and the resin plate. A transfer molding method. The transfer molding method according to claim 5, wherein, in the pressing part changing step, the pressing force is transmitted so as to spread from a central part of the resin plate to a peripheral part.

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