JP2014060259A - Ceramic laminate cutting method, ceramic laminate cutting device, and method of manufacturing laminated ceramic electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a ceramic laminate cutting method capable of accurately cutting the ceramic laminate, a ceramic laminate cutting device used in the method, and a method of manufacturing a laminated ceramic electronic component.SOLUTION: A ceramic laminate 1 is positioned by making a positioning guide 5 abut on a region in a reference surface 11 formed in the ceramic laminate 1, ranging from the side end of a force-cutting starting main surface 1a forming a main surface into which a force-cutting blade 3 is inserted when forming the reference surface to 1/2 thickness in the thickness direction of the ceramic laminate, and with the ceramic laminate held at a prescribed position, the force-cutting blade 3 is inserted into the ceramic laminate from either one of the main surfaces thereof to force-cut the laminate in the thickness direction. When a ceramic layer 24 for protection is disposed on the force-cutting starting main surface 1a side of an effective layer part 23 of the ceramic laminate, the positioning guide is made to abut on the ceramic layer 24 (24a) for protection that is disposed on the force-cutting starting main surface 1a side.

Description

  The present invention relates to a method for cutting a ceramic laminate, a cutting device for a ceramic laminate, and a method for producing a multilayer ceramic electronic component used in a process for producing a multilayer ceramic electronic component such as a multilayer ceramic capacitor or a multilayer varistor.

  One typical ceramic electronic component is, for example, a multilayer ceramic capacitor having a structure as shown in FIG. As shown in FIG. 7, the multilayer ceramic capacitor has internal electrodes 41a, 41a on both end surfaces of a multilayer ceramic capacitor element 43 in which a plurality of internal electrodes 41a, 41b are laminated via a ceramic layer 42 which is a dielectric layer. It has a structure in which external electrodes 44a and 44b are disposed so as to be electrically connected to 41b.

By the way, when manufacturing such a multilayer ceramic capacitor, usually,
(A) a step of forming an unfired ceramic laminate (mother laminate) having a structure in which a plurality of internal electrode patterns are laminated via an unfired ceramic layer;
(B) cutting the ceramic laminated body at a predetermined position and dividing it into laminated bodies (individual laminated ceramic elements) corresponding to individual laminated ceramic electronic components;
(C) firing the divided individual multilayer ceramic elements;
(D) It is manufactured through a process of forming an external electrode by applying and baking a conductive paste for forming an external electrode on a predetermined position of the fired multilayer ceramic element.

  By the way, as a manufacturing method of such a multilayer ceramic electronic component, as shown in FIG. 8, the ceramic laminated body (mother laminated body) 101 mounted on the table 110 provided with the suction hole 112 which leads to the negative pressure chamber 111. After the end surface 102 of the first electrode 102 is brought into contact with the reference guide 103 and the ceramic laminated body 101 is positioned, the cutting blade 104 is moved downward vertically while moving the cutting blade (push cutting blade) 104 at regular intervals. A method of manufacturing a multilayer ceramic electronic component through a process of cutting and cutting the ceramic laminate 101 in the thickness direction has been proposed (see Patent Document 1).

  However, in the case of the method disclosed in Patent Document 1 described above, one end surface 102 of the ceramic laminate (mother laminate) with which the positioning reference guide 103 abuts corresponds to each multilayer ceramic electronic component by cutting the ceramic laminate. Since it is a cut end face formed by cutting a ceramic laminated body (mother laminated body) at a predetermined position before being divided into laminated bodies, the following problems arise.

(1) For example, when the end face 102 of the ceramic laminated body (mother laminated body) 101 is a cut end face by a push cut using a push cutting blade, the shape accuracy of the tip of the push cutting blade, and the push cutting blade is a ceramic laminated body (mother laminated). The end surface (cut end surface) 102 (see FIG. 9) of the ceramic laminate 101 is formed perpendicular to the main surface of the ceramic laminate, depending on the angle at which it enters the body 101 and the way in which a force is applied during the cut-off cut. In addition, the flatness and linearity of the end face also deteriorate. Further, not only the linearity in the push-cut direction (vertical direction) but also the linearity in the direction parallel to the longitudinal direction of the push-cut blade tends to be lowered.
In particular, the flatness and linearity of the end face are deteriorated in a region away from the press-cut starting main surface (a region where the press cut depth is deep).

  (2) Also, the ceramic laminate (mother laminate) is usually an effective layer in which a plurality of internal electrodes and ceramic green sheets are alternately laminated, and a plurality of ceramic green sheets laminated without interposing the internal electrodes. Since the hardness is different between the effective layer and the protective ceramic layer, the end face is caused by the positional difference in hardness when cut by the above-described pressing method. The (cut end face) is not formed perpendicular to the main surface of the ceramic laminate, and the linearity deteriorates. Further, not only the linearity in the push cutting direction (vertical direction) but also the linearity in the direction parallel to the longitudinal direction of the push cutting blade is reduced.

  For this reason, as shown in FIG. 9, when the thickness of the tip portion 103 a contacting the end surface 102 of the ceramic laminate 101 of the reference guide 103 is thick, the positioning guide is not perpendicular to the end surface 102 of the ceramic laminate 101 and has an inclination. It will be in contact with a portion or a portion with poor linearity. As a result, the position of the reference guide 103 and the position of the ceramic laminated body 101 in contact with the reference guide 103 may not be constant, or the ceramic laminated body 102 may be a laminated body (laminated layer) corresponding to each laminated ceramic electronic component. When dividing into (ceramic elements) (during cutting), there is a problem that the position of the ceramic laminated body 101 is shifted and the cutting position accuracy is lowered.

JP 2000-58404 A

  SUMMARY OF THE INVENTION The present invention solves the above-described problem, and a ceramic laminate cutting method capable of accurately cutting a ceramic laminate at an intended position, a ceramic laminate cutting apparatus used therefor, and reliability It is an object of the present invention to provide a method for manufacturing a multilayer ceramic electronic component capable of efficiently manufacturing a high multilayer ceramic electronic component.

In order to solve the above problems, the method of cutting the ceramic laminate is as follows:
An effective layer portion in which internal electrode patterns are laminated via an unfired ceramic layer, and a protective ceramic layer disposed on at least one side of a pair of main surfaces of the effective layer portion, A method of cutting a ceramic laminate including a reference surface formed by entering a pressing blade from one of the main surfaces and cutting in the thickness direction at a predetermined position,
Positioning guide of the reference surface formed in the ceramic laminate to a region from the end of the press cutting start main surface side that is the main surface into which the press cutting blade enters when forming the reference surface to the thickness direction 1/2. In a state where the ceramic laminated body is held at a predetermined position, a push cutting blade enters from one of the main surfaces of the ceramic laminated body and cuts in the thickness direction. It is characterized by this.

  Further, in the method for cutting a ceramic laminate according to the present invention, when the protective ceramic layer is disposed on the main surface of the press cut when the reference surface is formed, the positioning is performed on the protective ceramic layer. It is preferable to abut the guide.

  In the case where the protective ceramic layer is disposed on the main surface side of the effective layer portion of the ceramic laminate, the positioning guide is brought into contact with the reference ceramic surface by bringing the positioning guide into contact with the protective ceramic layer. Because it is close to the press-cut starting main surface when forming the reference surface, and is in contact with a region having high linearity and flatness and excellent perpendicularity to the press-cut starting main surface, the ceramic laminated body is accurate at the intended position. It becomes possible to cut well, and the present invention can be made more effective.

  In addition, as the positioning guide, it is preferable to use a positioning guide in which the thickness of the front end portion in contact with the reference surface of the ceramic laminate is thinner than the thickness of the protective ceramic layer in contact with the front end portion.

  By using a positioning guide in which the thickness of the front end portion in contact with the reference surface of the ceramic laminate is thinner than the thickness of the protective ceramic layer of the ceramic laminate, the above-described linearity, flatness, and verticality are high. The positioning guide can be reliably brought into contact with only the protective ceramic layer. As a result, it becomes possible to further improve the positioning accuracy of the ceramic laminate, and also to reduce the positional deviation of the ceramic laminate during the press-cutting, improve the cut position accuracy and improve the desired cut shape. You will be able to get

Moreover, the cutting device of the ceramic laminate of the present invention,
An effective layer portion in which internal electrode patterns are laminated via an unfired ceramic layer, and a protective ceramic layer disposed on at least one side of a pair of main surfaces of the effective layer portion, A ceramic used to cut a ceramic laminate having a reference surface formed at a predetermined position by pushing a cutting blade from any one of the main surfaces and cutting it in the thickness direction. A laminate cutting apparatus,
A table on which the ceramic laminate is placed;
A pressing blade that is pressed against the ceramic laminate and cuts and cuts the ceramic laminate in the thickness direction;
The reference surface formed on the ceramic laminate is in contact with the region from the end of the press-cut starting main surface side, which is the main surface into which the press cutting blade enters when forming the reference surface, to the thickness direction 1/2. Positioning guide for positioning the ceramic laminate,
Table driving means for driving the table;
A cutting blade driving means for operating the cutting blade so that the ceramic laminate is cut and cut;
The positioning guide is in contact with the region of the reference surface, and the ceramic laminate is held in a predetermined position from one of the main surfaces of the ceramic laminate. It is characterized in that the ceramic laminated body is cut and cut at a predetermined position by entering.

  In the ceramic laminated body cutting apparatus of the present invention, when the protective ceramic layer constituting the ceramic laminated body is disposed on the push-cut starting main surface side when the reference surface is formed, the positioning guide It is preferable that a positioning guide is used in which the thickness of the tip of the ceramic laminate that contacts the reference surface is thinner than the thickness of the protective ceramic layer that contacts the tip.

  By providing the above-described configuration, the positioning guide is brought into contact with a higher probability that no large disturbances in linearity, flatness, and verticality occur in the reference plane, and the ceramic laminate is more at the intended position. It becomes possible to cut with high accuracy, and the present invention can be further effectively realized.

In addition, the method for manufacturing the multilayer ceramic electronic component of the present invention includes:
In the case where the protective ceramic layer constituting the ceramic laminate is disposed on the push-cut start main surface side when the reference surface is formed, the protective ceramic layer contacts the reference surface of the ceramic laminate as the positioning guide. A positioning guide is used in which the thickness of the tip portion in contact is thinner than the thickness of the protective ceramic layer with which the tip portion abuts.
In addition, the method for manufacturing the multilayer ceramic electronic component of the present invention includes:
A method for producing a multilayer ceramic electronic component comprising a multilayer ceramic element having a structure in which a plurality of internal electrodes are laminated via a ceramic layer,
(A) forming an unfired ceramic laminate having a structure in which a plurality of internal electrode patterns are laminated via unfired ceramic layers;
(B) cutting the ceramic laminate at a predetermined position and dividing the ceramic laminate into individual multilayer ceramic elements corresponding to individual multilayer ceramic electronic components;
(C) a method of manufacturing a multilayer ceramic electronic component comprising a step of firing individual divided multilayer ceramic elements,
In the step (b), by using the method for cutting a ceramic laminate according to any one of claims 1 to 3, the ceramic laminate is cut to be divided into individual multilayer ceramic elements. It is said.

The method for cutting a ceramic laminate according to the present invention is a method in which the reference surface formed in the ceramic laminate has a thickness direction from the end of the press cutting start main surface, which is the main surface into which the press cutting blade has entered when forming the reference surface. In a state where the positioning guide is brought into contact with the region up to 2 and the ceramic laminated body is held in a predetermined position, a push cutting blade is made to enter from one of the main faces of the ceramic laminated body. Since the cut-off cut is made in the thickness direction, the positioning guide is close to the cut-off start main surface at the time of forming the reference surface on the reference surface, and has high linearity and flatness, and is perpendicular to the cut-off start main surface. Since it abuts on a region having excellent properties, the ceramic laminate can be cut with high precision at the intended position.
It should be noted that not only the linearity in the direction of cutting (vertical direction) but also the linearity in the longitudinal direction of the cutting blade is high near the main surface of the cutting surface when forming the reference surface, so that it is parallel to the longitudinal direction of the cutting blade. Since the linearity of the direction is also improved, the ceramic laminate can be cut with high accuracy in this respect.

  In other words, in the part close to the push cutting start main surface where the push cutting blade enters when the reference surface is formed, the linearity, flatness, and verticality deteriorate due to the difference in the shape accuracy of the blade edge, the angle at which the blade enters, and the way the force is applied during cutting. It is difficult to occur, the linearity, flatness, and verticality of the area where the positioning guide abuts are good, it is possible to reduce the positional deviation of the ceramic laminate during push-cutting, and improve the cutting position accuracy, A desired cut shape can be obtained.

  Moreover, the cutting device for a ceramic laminate of the present invention includes a table on which the ceramic laminate is placed, a press cutting blade for cutting the ceramic laminate in the thickness direction, and a reference surface of a reference surface formed on the ceramic laminate. Positioning guide for positioning the ceramic laminate, table driving means, and press cutting blade are operated in contact with the region from the main surface side end where the press cutting blade is introduced to the thickness direction 1/2. A pressing blade driving means for causing the positioning guide to abut against the region of the reference surface, and in a state where the ceramic laminate is held at a predetermined position, one of a pair of main surfaces of the ceramic laminate. The ceramic laminated body is cut and cut at a predetermined position when the push blade enters from the main surface. By reducing the positional deviation of the electrochromic laminate, it becomes possible to improve the cutting position accuracy, it is possible to obtain a desired cut shape.

  The method for manufacturing a multilayer ceramic electronic component according to the present invention includes a method for manufacturing a multilayer ceramic electronic component including a multilayer ceramic element having a structure in which a plurality of internal electrodes are stacked via ceramic layers. A step of forming a fired ceramic laminate, (b) a step of cutting the ceramic laminate at a predetermined position and dividing it into individual multilayer ceramic elements, and (c) a step of firing the obtained individual multilayer ceramic elements. In the step (b), the ceramic laminate is cut using the method for cutting a ceramic laminate of the present invention so as to be divided into individual multilayer ceramic elements. Therefore, the cut position accuracy and cut shape accuracy are high, and the internal electrodes of each multilayer ceramic element are reliable at the desired position. It is possible to efficiently high laminated ceramic electronic component in the manufacturing.

It is a perspective view which shows typically the structure of the cutting apparatus of the ceramic laminated body concerning embodiment of this invention. It is a figure which shows typically the structure of the ceramic laminated body cut with the cutting device of this invention. It is a figure explaining the formation method of the reference surface of a ceramic laminated body, (a) is a figure which shows the state which cuts one side of a ceramic laminated body with a press cutting blade, (b) forms a reference surface by cutting It is a figure which shows the reference plane of the ceramic laminated body after performing. It is a figure for demonstrating the cutting method of the ceramic laminated body concerning embodiment of this invention, Comprising: It is a figure which shows the state which made the positioning guide contact | abut on the reference plane of a ceramic laminated body. It is a figure which shows the state which cuts and cuts the ceramic laminated body in one process of the cutting method of the ceramic laminated body concerning embodiment of this invention. It is a figure which shows the laminated ceramic element obtained by pressing and cutting a ceramic laminated body using the cutting method of the ceramic laminated body concerning embodiment of this invention. It is sectional drawing which shows the structure of the multilayer ceramic electronic component (multilayer ceramic capacitor) manufactured by the manufacturing method of the multilayer ceramic electronic component of this invention. It is a figure which shows the method of cutting a ceramic laminated body at 1 process of the manufacturing method of the conventional multilayer ceramic electronic component. It is a figure explaining the problem of the manufacturing method of the conventional multilayer ceramic electronic component.

  Embodiments of the present invention will be described below to describe the features of the present invention in more detail.

  FIG. 1 is a perspective view schematically showing a configuration of a ceramic laminate cutting apparatus according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing a configuration of a ceramic laminate cut by the cutting apparatus according to an embodiment of the present invention. FIG. 3 is a diagram showing a method of forming a reference surface of a ceramic laminate in an embodiment of the present invention, and FIG. 3A is a diagram showing a state in which one side of the ceramic laminate is cut by a press cutting blade. b) is a diagram showing the reference surface of the ceramic laminate after the reference surface is formed by cutting.

  As shown in FIGS. 1 and 2, this ceramic laminate cutting apparatus 20 is pressed against the table 2 holding the ceramic laminate 1 and the ceramic laminate 1 to cut the ceramic laminate 1 in the thickness direction. Positioning that prevents the ceramic laminate 1 from being displaced in the push-cutting process by contacting the press cutting blade 3, the clamp portion 4 that holds the push-cutting blade 3, and the reference surface 11 formed on the ceramic laminate 1. Guide 5, table driving means 6 for driving the table 1, pressing blade driving means 7 for moving the cutting blade 3 up and down via the clamp portion 4 so that the ceramic laminate 1 is cut and cut, and ceramic laminate The interval between the internal electrode patterns 22 (see FIG. 2) of the body 1, that is, the individual multilayer ceramic elements 31 (see FIG. 2) after the division. Detecting the distance between the internal electrode patterns 22 included in each of the a region, a 8a, the 8b (CCD camera in this embodiment) sensor for determining the position to cut-away press ceramic laminate 1.

  Moreover, the ceramic laminated body 1 cut using this cutting apparatus 20 is formed in the manufacturing process of a laminated ceramic electronic component (in this embodiment, a laminated ceramic capacitor). For example, FIG. As shown, an effective layer portion 23 in which internal electrode patterns 22 are laminated via an unfired ceramic layer 21, and a protective ceramic layer 24 disposed so as to sandwich the effective layer portion 23 from both main surface sides, have. The internal electrode pattern 22 is disposed in each of the regions to be the individual multilayer ceramic elements 31 after being divided via the unfired ceramic layer 22.

  The thickness of the effective layer portion 23 of the ceramic laminate 1 is 1600 μm, and the thickness of the upper and lower protective ceramic layers 24 is 100 μm.

  Moreover, the above-mentioned reference surface 11 of the ceramic laminate 1 is a press cutting blade from one of the main surfaces (upper main surface in this embodiment) 1a of the pair of main surfaces, as shown in FIG. 13 is made to enter and is cut by pushing in the thickness direction.

  In addition, in this embodiment, the same thing as the press cutting blade 3 used in order to cut a ceramic laminated body is used as the press cutting blade 13 at the time of forming the reference plane 11. FIG. However, it is possible to use different push cutting blades.

  Further, as schematically shown in FIG. 3 (b), the reference surface 11 is a region close to the main surface (press cutting start main surface) 1a on which the pressing blade 13 has entered, that is, the press cutting start main surface 1a. To the vicinity of the thickness direction ½, the linearity and flatness are high and excellent in the perpendicularity to the push-cut start main surface 1a, but the region beyond the thickness direction ½ is linearity, The flatness is low, and the region is inferior in perpendicularity to the push-cut start main surface 1a.

  Further, in the positioning guide 5 used in this embodiment, the thickness T (see FIGS. 4 and 5) of the tip 5 a that abuts on the reference surface 11 of the ceramic laminate 1 is used to protect the ceramic laminate 1. It is formed thinner than the thickness of the ceramic layer 24 (24a) (the thickness T of the tip 5a is 50 μm).

  Next, a multilayer ceramic electronic component (multilayer ceramic capacitor is manufactured by using the above-described cutting device 20 to cut and cut the ceramic laminate 1 and individual multilayer ceramic elements 31 obtained by the cut and cut. How to do will be described.

  (1) First, the unfired ceramic laminate 1 is placed on the table 2 of the cutting device 20.

  As a method for producing the ceramic laminate 1, for example, a plurality of ceramic green sheets on which internal electrode patterns are printed are stacked, and a ceramic green sheet for a protective layer in which an appropriate number of internal electrode patterns are not printed on the top and bottom The method of laminating is mentioned.

  However, a method of producing an unfired ceramic laminate (unfired mother ceramic laminate) by repeating the steps of printing the internal paste after the ceramic paste is printed and dried can also be employed.

  (2) Then, the four sides of the ceramic laminate 1 are cut by the cutting blade 13 (3) as described above to form the reference surface 11. In this embodiment, as the press cutting blade 13 for forming the reference surface, the same one as the press cutting blade 3 used for dividing the ceramic laminated body into the individual multilayer ceramic elements 31 is used. However, it is also possible to cut the ceramic laminate on another table using another pressing blade to form the reference surface.

(3) Then, as shown in FIG. 4, the tip portion 5a of the positioning guide 5 is brought into contact with the protective ceramic layer 24 (24a) on the upper side of the predetermined reference surface 11 of the ceramic laminate 1 to thereby laminate the ceramic laminate. The body 1 is positioned.
In this embodiment, the contact position of the positioning guide 5 with the reference surface 11 of the ceramic laminated body 1 is 0 to 50 μm below the upper main surface 1a of the ceramic laminated body 1, and the distal end portion of the positioning guide 5 It is set so that the upper end of 5a is located.

  (4) Next, a predetermined cutting position of the ceramic laminated body 1 is detected by the sensors 8a and 8b, and the ceramic laminated body 1 is positioned at a predetermined position by the positioning guide 5, and the pressing blade driving means 7 By operating the press cutting blade 3 via the clamp part 4, as shown in FIG. 5, the press cutting blade 3 is made to enter the ceramic laminate 1, and is cut in the thickness direction.

  Thereafter, the table 2 is moved by the table driving means 6, and the ceramic laminate 1 is cut and cut by a similar method at a plurality of predetermined positions parallel to the previous cut line, and then the table 2 is rotated by 90 °. Then, the ceramic laminate 1 is cut and cut at a plurality of parallel predetermined positions by the same method as described above, and the ceramic laminate 1 is divided into individual multilayer ceramic elements 31 (see FIG. 6).

In this embodiment, the thickness T (50 μm) of the distal end portion 5a of the positioning guide 4 is greater than the thickness (100 μm) of the protective ceramic layer 24 (24a) with which the distal end portion 5a abuts. The reference surface 11 is a region having high linearity and flatness and excellent perpendicularity to the press-cut starting main surface 1a (the end surface of the protective ceramic layer 24 (24a) on the press-cut starting main surface 1a side). Therefore, it is possible to improve the cut misalignment defect due to the positional deviation of the ceramic laminate 1 and to divide the ceramic laminate 1 reliably at a predetermined position, so that the shape accuracy and the position accuracy of the internal electrode pattern are excellent. Individual laminated ceramic elements 31 can be obtained.
In addition, since the area | region close | similar to the press-cut start main surface 1a of the reference surface 11 has high linearity of the longitudinal direction of not only the push cutting direction (vertical direction) but the longitudinal direction of the push cutting blade 3, the press cutting blade of the reference surface 11 The linearity in the direction parallel to 3 is also improved, and the ceramic laminate 1 can be cut with high accuracy in this respect.

  Further, in this embodiment, when the ceramic laminate 1 is cut by the cutting method according to the embodiment of the present invention using a positioning guide having a thickness of 50 μm at the tip portion that contacts the reference surface 11 of the ceramic laminate 1, When the ceramic laminate is cut by the cutting method of the comparative example using a positioning guide having a thickness of 1000 μm at the tip portion contacting the reference surface 11 of the ceramic laminate 1 and exceeding 1/2 of the thickness of the ceramic laminate, The incidence of cut position error was examined.

  Here, the distance (side gap) G between the end of the internal electrode 22 and the end face 31a of the multilayer ceramic element 31 in each multilayer ceramic element 31 (see FIG. 6) obtained by cutting the ceramic laminate 1. When the target value of 220 μm is determined, a sample having a side gap G of less than 70 μm is determined as a sample in which a defective cut position deviation has occurred, and the ratio of the number of defective samples to the number of samples subjected to the test is examined. The occurrence rates were compared between the embodiment and the comparative example.

  As a result, in the case of the cutting method according to the embodiment of the present invention, it was possible to reduce the occurrence rate of the cut position deviation failure to about 20% in the case of the cutting method of the comparative example.

  (5) Then, the individual multilayer ceramic elements 31 are discharged from the cutting device 20, heated to a predetermined temperature and degreased, and then fired to obtain sintered multilayer ceramic elements.

  (6) Next, an external electrode is formed by applying and baking a conductive paste for forming an external electrode on both end faces of the sintered multilayer ceramic element.

  The external electrode is formed by applying a conductive paste for forming an external electrode on both ends of the multilayer ceramic element before firing the multilayer ceramic element of each multilayer ceramic electronic component unit in the firing process of the multilayer ceramic element. At the same time, it can be formed by baking a conductive paste for forming external electrodes.

  As a result, as shown in FIG. 7, the internal electrodes 41a and 41b have a structure in which a plurality of internal electrodes 41a and 41b are stacked via the ceramic layer 42, and the internal electrodes are connected to both ends of the sintered multilayer ceramic element 43 (ceramic capacitor element). A chip-type multilayer ceramic capacitor 40 in which external electrodes 44a and 44b that are electrically connected to 41a and 41b are disposed is obtained. The multilayer ceramic capacitor produced in this embodiment has dimensions of length: 3.2 mm, width: 1.6 mm, and thickness: 1.6 mm.

  In the above embodiment, the case where a multilayer ceramic capacitor is manufactured has been described as an example. However, the present invention can also be applied to manufacturing inductors, piezoelectric parts, thermistors, varistors, and the like.

In particular,
(A) In the case of an inductor, for example, a step of dividing an unfired ceramic laminate using a magnetic ceramic material such as ferrite into individual multilayer ceramic elements;
(B) In the case of a piezoelectric component, for example, a step of dividing an unfired ceramic laminate using a piezoelectric ceramic material such as PZT (lead zirconate titanate) -based ceramics into individual multilayer ceramic elements;
(C) In the case of the thermistor, for example, a step of dividing an unfired ceramic laminate using a semiconductor ceramic material (such as spinel ceramic) into individual laminated ceramic elements,
(D) In the case of a varistor, for example, the ceramic laminate of the present invention is used in a step of dividing an unfired ceramic laminate using a voltage non-linear ceramic material (such as zinc oxide or strontium titanate) into individual laminated ceramic elements. A body cutting method and a cutting apparatus can be used, and the method for manufacturing a multilayer ceramic electronic component of the present invention can be applied.

  In the above embodiment, the formation of the reference surface of the ceramic laminate and the subsequent cut-off cut of the ceramic laminate are performed on the same table using the same push-cut blade, but on another table, The ceramic laminated body is cut using another press cutting blade to form a reference plane, and the ceramic laminated body is placed on a table for dividing the individual laminated ceramic elements to perform the push cutting. It is also possible.

  In another table, the ceramic laminate having the reference surface formed thereon is turned over (that is, the main surface of the cut-off start at the time of forming the reference surface is on the lower side) and divided into individual multilayer ceramic elements. The reference guide is positioned in contact with the protective ceramic layer (lower protective ceramic layer) on the main surface side of the press-cut start when the reference surface is formed. It is also possible.

  The present invention can also be applied when the ceramic laminate is not provided with a protective ceramic layer.

  The present invention is not limited to the above embodiment in other respects as well, and the specific structure of the ceramic laminate (the effective layer portion in which the internal electrode pattern is laminated through the unfired ceramic layer) Thickness, the number of laminated internal electrode patterns constituting the effective layer portion, the thickness of the protective ceramic layer, etc.), the press cutting blade, table, positioning guide, table driving means, press cutting blade driving means, etc. constituting the ceramic laminate cutting device Various applications and modifications can be made within the scope of the invention with respect to the configuration and the like.

DESCRIPTION OF SYMBOLS 1 Ceramic laminated body 1a Push cutting start main surface 2 Table 3 Push cutting blade 4 Clamp part 5 Positioning guide 5a The front-end | tip part of a positioning guide 6 Table drive means 7 Push cutting blade drive means 8a, 8b Sensor (CCD camera)
DESCRIPTION OF SYMBOLS 11 Reference surface 20 Cutting apparatus of ceramic laminated body 21 Unbaked ceramic layer 22 Internal electrode pattern 23 Effective layer part 24 Protective ceramic layer 24a Protective ceramic layer on the main surface side of pressing and cutting 31 Multilayer ceramic element 31a obtained after division End face of ceramic element 40 Multilayer ceramic capacitor 41a, 41b Internal electrode 42 Ceramic layer (dielectric ceramic layer)
43 Multilayer ceramic elements (ceramic capacitor elements)
44a, 44b External electrode G Side gap T Thickness of the tip of the positioning guide

Claims (6)

An effective layer portion in which internal electrode patterns are laminated via an unfired ceramic layer, and a protective ceramic layer disposed on at least one side of a pair of main surfaces of the effective layer portion, A method of cutting a ceramic laminate including a reference surface formed by entering a pressing blade from one of the main surfaces and cutting in the thickness direction at a predetermined position,
Positioning guide of the reference surface formed in the ceramic laminate to a region from the end of the press cutting start main surface side that is the main surface into which the press cutting blade enters when forming the reference surface to the thickness direction 1/2. In a state where the ceramic laminated body is held at a predetermined position, a push cutting blade enters from one of the main surfaces of the ceramic laminated body and cuts in the thickness direction. A method for cutting a ceramic laminate, characterized by:   The said positioning guide is made to contact | abut to this protective ceramic layer, when the said ceramic layer for protection is arrange | positioned at the said push-cut start main surface side at the time of the said reference surface formation. Cutting method for ceramic laminates.   The positioning guide is characterized in that a positioning guide is used in which the thickness of the front end portion in contact with the reference surface of the ceramic laminate is thinner than the thickness of the protective ceramic layer in contact with the front end portion. The cutting method of the ceramic laminated body of description. An effective layer portion in which internal electrode patterns are laminated via an unfired ceramic layer, and a protective ceramic layer disposed on at least one side of a pair of main surfaces of the effective layer portion, A ceramic used to cut a ceramic laminate having a reference surface formed at a predetermined position by pushing a cutting blade from any one of the main surfaces and cutting it in the thickness direction. A laminate cutting apparatus,
A table on which the ceramic laminate is placed;
A pressing blade that is pressed against the ceramic laminate and cuts and cuts the ceramic laminate in the thickness direction;
The reference surface formed on the ceramic laminate is in contact with the region from the end of the press-cut starting main surface side, which is the main surface into which the press cutting blade enters when forming the reference surface, to the thickness direction 1/2. Positioning guide for positioning the ceramic laminate,
Table driving means for driving the table;
A cutting blade driving means for operating the cutting blade so that the ceramic laminate is cut and cut;
The positioning guide is in contact with the region of the reference surface, and the ceramic laminate is held in a predetermined position from one of the main surfaces of the ceramic laminate. The ceramic laminated body cutting apparatus is configured such that the ceramic laminated body is pushed and cut at a predetermined position when the ceramic enters.   In the case where the protective ceramic layer constituting the ceramic laminate is disposed on the push-cut start main surface side when the reference surface is formed, the protective ceramic layer contacts the reference surface of the ceramic laminate as the positioning guide. 5. The cutting device for a ceramic laminate according to claim 4, wherein a positioning guide is used in which a thickness of a tip portion in contact with the tip portion is smaller than a thickness of the protective ceramic layer with which the tip portion abuts. A method for producing a multilayer ceramic electronic component comprising a multilayer ceramic element having a structure in which a plurality of internal electrodes are laminated via a ceramic layer,
(A) forming an unfired ceramic laminate having a structure in which a plurality of internal electrode patterns are laminated via unfired ceramic layers;
(B) cutting the ceramic laminate at a predetermined position and dividing the ceramic laminate into individual multilayer ceramic elements corresponding to individual multilayer ceramic electronic components;
(C) a method of manufacturing a multilayer ceramic electronic component comprising a step of firing individual divided multilayer ceramic elements,
In the step (b), by using the method for cutting a ceramic laminate according to any one of claims 1 to 3, the ceramic laminate is cut to be divided into individual multilayer ceramic elements. A method for manufacturing a multilayer ceramic electronic component.

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