JP2014058016A - Method for manufacturing membrane structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a membrane structure capable of preventing the membrane structure from being broken.SOLUTION: There is provided a method for manufacturing a membrane structure, the method comprising: a step of preparing a substrate having a first main surface and a second main surface paired with the first main surface to prepare a support substrate having a gas inflow part on the first side; a step of bonding the substrate and the support substrate through an adhesive layer of which adhesive force is lowered by applying energy between the first main surface of the substrate and the first side of the support substrate; a step of forming a fixed portion opened to the second main surface side and a thinned part disposed so as to close the opening of the fixed portion by thinning a part of or the entire part of the substrate from the second main surface side of the substrate; and a step of peeling off the support substrate from the first main surface side by applying energy to the adhesive layer, wherein the gas inflow part is formed corresponding to an area which becomes at least the thinned part.

Description

  The present invention relates to a method for manufacturing a membrane structure. Furthermore, the present invention relates to a substrate support member and a substrate support system.

  In recent years, attention has been focused on MEMS (Micro Electro Mechanical Systems), and existing devices have been miniaturized. The MEMS usually includes a fine movable part, but the movable part is very fragile because it is fine, and may be damaged in the manufacturing process.

  In the manufacturing process of a membrane structure including MEMS, conventionally, as a technique for supporting a substrate when the entire substrate is processed thinly by polishing or the like, for example, a semiconductor substrate is provided with a foam layer that reduces the adhesive force by gas foaming. There is a type in which a pressure-sensitive adhesive sheet is bonded and supported, and the surface opposite to the surface on which the pressure-sensitive adhesive sheet is bonded is thinned (for example, see Patent Document 1).

JP 2005-317634 A

  However, the present inventor tried to apply the conventional semiconductor substrate manufacturing method to the membrane structure manufacturing method, and after forming a membrane-like thin portion on the substrate by thin processing, a support substrate for supporting the substrate was formed. In order to exfoliate, when energy such as ultraviolet rays was applied to exfoliate the pressure-sensitive adhesive whose adhesive strength was reduced by gas foaming, a phenomenon was observed in which the thin-walled portion was destroyed by the pressure of the gas generated by the foaming.

  This invention is made | formed in view of the said situation, and it aims at reducing the damage of the membrane structure which may arise when peeling a support substrate.

  A method for manufacturing a membrane structure according to an embodiment of the present invention provides a substrate having a first main surface and a second main surface that is paired with the first main surface, and gas is introduced into the first side. A support substrate having a portion is prepared, and an adhesive layer including a layer whose adhesive force is reduced by applying energy is interposed between the first main surface of the substrate and a surface located on the first side of the support substrate. And fixing the substrate and the support substrate, thinning part or all of the substrate from the second main surface side of the substrate, and opening the second main surface side, Forming a thin wall portion connected to the fixing portion and arranged to close the opening of the fixing portion, applying energy to the adhesive layer, and peeling the support substrate from the first main surface side. The gas inflow part is formed corresponding to at least the region to be the thin part. To.

  The gas inflow portion may be provided by forming a groove on the first side of the support substrate.

  The gas inflow portion may be formed by a porous layer existing at least on the first side of the support substrate.

  As the adhesive layer, a material containing a gas foaming agent that foams gas by applying energy may be used.

  As the adhesive layer, a layer containing an adhesive that swells when energy is applied may be used.

  A concave portion is formed on the first main surface side of the substrate, and at least one of the concave portions may be formed in a region that becomes the thin portion.

  A substrate support member according to an embodiment of the present invention is a substrate support member that supports a substrate, and includes a support substrate having a gas inflow portion on a first side, and a first side of the support substrate. And an adhesive layer including a layer whose adhesive strength is reduced by applying energy.

  The adhesive layer may be configured by laminating at least a light-to-heat conversion layer and an ultraviolet curable resin layer.

  A substrate support system according to an embodiment of the present invention is a substrate before a thinning process, and includes a first main surface and a second main surface that is paired with the first main surface. A substrate storage unit for storing; a support substrate storage unit for storing a support substrate having a gas inflow portion on a first side; and a support substrate stored in the support substrate storage unit, An adhesive layer forming part for forming an adhesive layer including a layer whose adhesive strength is reduced by applying energy to the side, and an adhesive layer formed on a surface located on the first side of the support substrate in the adhesive layer forming part And a bonding portion for bonding the substrate and the support substrate, and an energy applying portion for applying energy to the adhesive layer in order to peel the substrate after the thinning process from the support substrate. .

  ADVANTAGE OF THE INVENTION According to this invention, the damage of a membrane structure at the time of peeling a support substrate can be prevented in the manufacture process of a membrane structure.

It is sectional drawing which shows the manufacturing method of the membrane structure which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the manufacturing process of the membrane structure which concerns on the 2nd Embodiment of this invention. It is sectional drawing which shows the manufacturing process of the membrane structure which concerns on the 3rd Embodiment of this invention. (A)-(e) is a schematic diagram of the top view of the support substrate 203 which concerns on the 1st Embodiment of this invention, (f) shows the support substrate 203 which concerns on the 1st Embodiment of this invention. It is a schematic diagram of the structure at the time of forming with a porous material. 1 is a configuration block diagram of a substrate support system according to an embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited to the following embodiment, In the range which does not deviate from the summary, it can implement in various aspects.

  The membrane structure produced by the production method of the present invention is, for example, a membrane used for MEMS such as microchannels, mechanical quantity sensors, silicon microphones, liquid ejection devices, membrane filters, and dies used for microfabrication. It is a structure.

(First embodiment)
Hereinafter, a manufacturing method according to an embodiment of the present invention will be described with reference to FIG. FIG. 1 is a cross-sectional view showing a manufacturing process according to the first embodiment of the present invention, and a membrane structure 120 can be manufactured.

1. Substrate Preparation Step As shown in FIG. 1A, a substrate 124 for forming the membrane structure 120 is prepared. Hereinafter, a method for manufacturing the membrane structure 120 according to an embodiment of the present invention will be described using an example in which an SOI (Silicon on Insulator) substrate is used as the substrate 124. However, the present invention is not limited to this, and a silicon substrate, a glass substrate, A metal substrate, a resin substrate, etc. may be sufficient. The substrate 124 has a three-layer structure of an active layer 123, a BOX (Buried Oxide) layer 122, and a support layer 121. The active layer 123 is a layer that defines the thickness of the thin portion 126 formed in the process described later, and the thickness is, for example, 7 μm to 50 μm, and preferably 10 μm to 30 μm. Here, the thickness of the active layer 123 is 15 μm, the thickness of the BOX layer 122 is 0.5 μm, and the thickness of the support layer 121 is about 200 μm to 725 μm.

2. Support Substrate Preparation Step The support substrate used in the present invention is characterized by including a gas inflow portion through which gas passes on the side facing the substrate 124. As shown in FIG. 1B, a support substrate 203 having a groove 203 a formed on the side facing the active layer 123, which is the first main surface of the substrate 124, is prepared. The groove 203a may be formed at least in a position facing the thin portion formed on the substrate 124, and may be disposed so as to face only the thin portion, or so as to face the thin portion and the fixed portion. You may arrange. The groove 203a can be formed by etching, grinding, or sand blasting.

  Although there is no restriction | limiting in the shape of the groove part 203a, For example, the polygonal shape of linear shape, circular shape, rectangular shape, pentagon or more may be sufficient. Moreover, you may comprise so that each figure may communicate with a flow path. The groove 203a is preferably continuous from one end edge or one end edge of the support substrate 203 to the other end edge. By forming the groove 203a so as to communicate from one end edge or one end edge of the support substrate 203 to the other end, the groove 203a has a function of exhausting gas generated by thermal decomposition of the functional layer 202. Can be increased. Moreover, the groove part 203a may be configured to penetrate partly or entirely in the thickness direction of the support substrate 203. The volume of the groove 203a may be appropriately set according to the amount of gas generated, the number and density of the grooves 203a, and the like. For example, the depth of the groove 203a may be 5 μm to 500 μm, and the opening size of the groove 203a may be 5 μm to 500 μm. The groove will be described in detail later with reference to FIG.

3. Functional Layer Arrangement Step As shown in FIG. 1C, a functional layer 202 containing a gas generating agent that generates gas by applying energy at least is formed on the side of the support substrate 203 where the groove 203a is formed. The functional layer 202 can be formed, for example, by applying a material that becomes the functional layer by a known application method. Here, the “functional layer” is a layer containing a gas generating agent that generates a gas by applying energy as long as it can achieve a desired function by applying energy such as light and heat. Not limited to this, it may be a layer containing a light-to-heat conversion material that converts light energy into heat energy, or a layer containing a material that swells when energy is applied, or a material that can realize a plurality of these functions. Good. Furthermore, another adhesive layer 201 such as an ultraviolet curable resin or a thermoplastic resin may be disposed on the functional layer 202. Further, the adhesive layer 201 may have a lower adhesive force due to energy application.

4). Support Substrate Arrangement Step As shown in FIG. 1D, the support substrate 203 is arranged on the active layer 123 side, which is the first main surface of the substrate 124, with the functional layer 202 interposed. The active layer 123 which is the first main surface of the substrate 124 and the adhesive layer 201 are brought into contact with each other, thermocompression bonding is performed as necessary, and the support substrate 203 is disposed on the first main surface side of the substrate 124. To do.

  In addition, although the example which provides the functional layer 202 and the contact bonding layer 201 in the support substrate 203 side was shown, it is not limited to this. For example, the functional layer 202 and the adhesive layer 201 may not be provided on the support substrate 203 but may be provided in advance on the active layer 123 side which is the first main surface of the substrate 124. Alternatively, the functional layer 202 may be provided in advance on the support substrate 203 side, while the adhesive layer 201 may be provided in advance on the active layer 123 side, which is the first main surface of the substrate 124, and then bonded. .

  In any case, energy is generated from the gas generating agent contained in the functional layer 202 when the support substrate 203 is peeled off by applying energy such as ultraviolet rays between the functional layer 202 and the support substrate 203. It is necessary to form a space for releasing the gas to be released.

  As illustrated in FIG. 1D, the groove 203 a of the support substrate 203 exists so that at least a part thereof overlaps with a region corresponding to the thin portion 126. The groove 203a is formed as a gap for having a function of accommodating or exhausting gas generated when energy such as laser light is applied to the functional layer 202 in order to peel the support substrate 203 from the substrate 124. .

  Examples of the energy applied to the functional layer 202 include light and heat. The functional layer 202 includes a gas generating agent. As the gas generating agent, a known material can be used, and for example, an azo compound or an azide compound may be used.

  The gas generating agent may be a photothermal conversion material obtained by mixing carbon powder with an adhesive, applying and drying, and absorbing near infrared light or the like to convert it into heat. The photothermal conversion material contains a light absorber and a thermally decomposable resin, and light is absorbed by the carbon powder as the light absorber to turn into heat, and the temperature of the organic binder component that binds the carbon powder rapidly rises due to the heat. Then, as a result of degassing and carbonizing and losing the bonding force, almost all of the light-to-heat conversion material may be changed into disjoint carbon powder or carbon pieces.

  Here, the thickness of the functional layer 202 is not limited as long as the substrate 124 and the support substrate 203 can be separated from each other, but is, for example, 1 μm or more. If the thickness is less than 1 μm, the concentration of the light absorber required for sufficient light absorption increases, thereby resulting in poor film formability, and as a result, there is a possibility of causing poor adhesion with an adjacent layer. It is.

  The support substrate 203 is preferably one that can transmit radiant energy such as laser light. For example, the transmittance is desirably 50% or more. Specifically, a glass substrate, a resin substrate, or the like may be used. The thickness of the support substrate 203 may be about 400 μm to 600 μm.

  At least one surface of the support substrate 203 may be formed of a porous material. When the support substrate 203 is formed of a porous material, the pores constituting the porous material can perform the same function as the groove 203a. As a material for the support substrate 203, porous ceramics such as porous glass and zeolite can be used.

4). Membrane formation step As shown in FIG. 1E, a part or all of the substrate 124 is thinned from the support layer 121 side, which is the second main surface of the substrate 124, and is opened to the second main surface side. The part 127 and the thin part 126 arrange | positioned so that the opening of the fixing | fixed part 127 may be plugged up are formed. The thinning of the substrate 124 can be performed using a known method such as etching or grinding. In general, a part of the substrate 124 is preferably removed by dry etching using the BOX layer 122 as an etching stopper layer.

  Further, as an example, after the support layer 121 as the second main surface is thinned by polishing or the like to be processed to a desired thickness as the membrane structure 120, the support layer 121 is formed using the BOX layer 122 as an etching stopper layer. The thin film portion 126 and the fixing portion 127 may be formed by etching.

5). Support substrate peeling step In order to peel the support substrate 203 from the substrate 124, appropriate energy is applied according to the material of the gas generating agent contained in the functional layer 202. For example, ultraviolet rays are irradiated from the second main surface side of the substrate 124. Along with the ultraviolet irradiation, a gas is generated from the gas generating agent contained in the functional layer 202. At this time, the membrane-like active layer 123 may be pressed by the gas pressure.

  In the present embodiment, the surface of the support substrate 203 on the functional layer 202 side is provided with at least one groove 203a in a region corresponding to the thin portion 126 when the substrate 124 and the support substrate 203 are joined. Since the generated gas is accommodated in the groove portion 203a or exhausted to the outside through the groove portion 203a, the stress applied to the thin portion 126 can be dispersed and damage to the thin portion 126 can be suppressed.

  As described above, according to the present embodiment, the adhesive strength of the functional layer 202 can be reduced without damaging the membrane-like substrate 124, so that the adhesive layer 201, the functional layer 202, and the support substrate are separated from the substrate 124. 203 can be easily peeled off. Thereby, the membrane structure 120 as illustrated in FIG. 1F can be manufactured with high yield. The shape of the membrane structure 120 illustrated in FIG. 1 (f) is one example of a typical membrane structure that can be manufactured by the manufacturing method of the present invention. It is not limited to the shape shown.

(Modification of support substrate 203)
As described above, in the manufacturing method of the present invention, in the process of separating the functional layer and the support substrate, a gap for retaining the gas generated from the functional layer or letting it escape to the outside is formed in the support substrate in advance. It is a feature. The shape of the gap is not particularly limited, and for example, the groove 203a in FIG. 1B can be formed into a dot shape having a predetermined cross-sectional shape and depth as shown in FIG. Alternatively, as another shape of the groove 203a in FIG. 1B, it may be formed in a line shape having a predetermined cross-sectional shape and depth as shown in FIG. 4B. Furthermore, the support substrate in which the groove 203a is formed in a lattice shape (FIG. 4C), a radial shape (FIG. 4D), a concentric shape (FIG. 4E), etc. having a predetermined cross-sectional shape and depth. 203 may be used in the manufacturing method of the first embodiment.

  The support substrate 203 shown in FIGS. 4B and 4C has a structure in which at least a part of the groove 203a communicates with the outside. Therefore, the gas generated in the manufacturing process of the membrane structure can be discharged to the outside as indicated by the arrow in the figure, and thus the function of preventing the thin portion from being damaged by the gas can be enhanced.

  The support substrate 203 can be configured using a porous ceramic material such as zeolite. The porous ceramic material not only has a function of adsorbing gas, but also has a function of releasing gas to the outside depending on the material. Therefore, the support substrate 203 can be composed of only a porous ceramic material. However, depending on manufacturing conditions, the support substrate 203 can also be composed of a material having a relatively higher strength than the porous ceramic material. For example, as shown in FIG. 4 (f), the support substrate 203 includes a porous ceramic material layer 2031 on the side to be bonded to the substrate 124, and a support layer 2032 made of silica glass or the like on the other side. It is good also as a structure provided. In the configuration of FIG. 1 (f), the porous ceramic material layer 2031 has a function as a gas inflow portion, similar to the groove 203a shown in FIGS. 1 (b) to 1 (e). .

(Second Embodiment)
Hereinafter, a method for manufacturing the membrane structure 130 according to the second embodiment of the present invention will be described with reference to FIG. FIG. 2 is a cross-sectional view showing a manufacturing process of the membrane structure 130 according to the second embodiment of the present invention. Hereinafter, when the same process as that of the first embodiment is used, the detailed description is omitted.

1. As shown in FIG. 2A, as the substrate 134 for forming the membrane structure 130, three layers of an active layer 133, a BOX layer 132, and a support layer 131 are formed as in the first embodiment. An SOI substrate having a structure is prepared.

2. As shown in FIG. 2B, the recess 135-1 is formed in the active layer 133 formed using the BOX layer 132 as an etching stopper layer on the active layer 133 side which is the first main surface of the substrate 134. , 135-2, 135-3. The recesses 135-1, 135-2, and 135-3 are formed to provide the same function as the groove 203a described in the first embodiment. For example, the recesses 135-1 to 135-3 may be voids having a predetermined cross-sectional shape formed in the active layer 133, or the first main surface side and the second main surface side of the substrate. It is good also as a through-hole which communicates.

3. Support Substrate Preparation Step As shown in FIG. 2C, a support substrate 203 having a groove 203b formed on the surface of the substrate 134 that is to be disposed on the active layer 133 side, which is the first main surface, is prepared. The groove 203b is substantially the same as in the first embodiment, and the description thereof is omitted.

4). Functional Layer Arrangement Step As shown in FIG. 2D, on the side of the support substrate 203 where the groove 203b is formed, at least a functional layer 202 containing a gas generating agent that generates gas by applying energy, an adhesive layer 201 is formed. The functional layer 202 and the adhesive layer 201 are substantially the same as those in the first embodiment, and a description thereof will be omitted.

5). Support substrate placement step As shown in FIG. 2E, the support substrate 203 is placed so that the groove 203b is placed in the vicinity of the position where the thin portion is provided via the functional layer 202 and the adhesive layer 201. 134 and the support substrate 203 are joined.

6). Membrane formation step As shown in FIG. 2 (f), by etching from the support layer 131 side, which is the second main surface of the substrate 134, using the BOX layer 132 as an etching stopper layer, a plurality of convex shapes are formed. A plurality of concave thin portions 136-1 to 136-5 are formed between the fixing portion 137 and the plurality of fixing portions 137. At this time, the concave thin wall is formed on the second main surface side of the substrate 134 so as to face the portion where the concave portions 135-1 to 135-3 are formed on the first main surface side of the substrate 134. Portions 136-2 to 136-4 are formed. Further, similarly to the first embodiment, after the support layer 131 is thinned by polishing or the like and processed to a desired thickness, the concave thin portions 136-1 to 136-5 constituting the predetermined pattern are formed. May be formed.

7). Support substrate peeling step In order to peel the support substrate 203 from the substrate 134, an appropriate energy is applied according to the material of the gas generating agent contained in the functional layer 202. For example, by irradiating laser light from the support substrate 203 side, the functional layer 202 is thermally decomposed to reduce the adhesiveness, and the support substrate 203 is peeled off. At this time, the gas generating agent of the functional layer 202 releases the gas by thermal decomposition, but in this embodiment, the generated gas is accommodated in at least one of the groove 203b and the recesses 135-1 to 135-3. Or is released to the outside through at least one of the groove 203b and the recesses 135-1 to 135-3, so that the stress applied to the thin portion 126 is dispersed and the thin portions 136-1 to 136-5 are damaged. Can be suppressed.

8). Through-hole forming step As shown in FIG. 2G, after the support substrate 203 is peeled off, the BOX layer 132 is removed by etching to form the recesses 135-1 to 135-3 formed in the active layer 133. The through holes penetrating the first main surface and the second main surface of the substrate 134 are formed by communicating the recesses 136-2 to 136-4 formed in the support layer 131 respectively. Further, as shown in FIG. 2G, the active layer 133 may be thinned to a predetermined thickness T by dicing or the like.

  Through the manufacturing process as described above, the membrane structure 130 according to the second embodiment of the present invention illustrated in FIG. According to the method for manufacturing the membrane structure 130 according to the second embodiment of the present invention, the pattern is formed on the first main surface side of the substrate 134 in correspondence with the pattern formed on the second main surface side of the substrate 134. Since the gas released from the functional layer 202 when the support substrate 203 is peeled off can be accommodated, the thin portion of the membrane structure 130 is prevented from being damaged by the pressure of the released gas. can do. Therefore, the yield in the manufacturing process of the membrane structure 130 can be improved.

(Third embodiment)
FIG. 3 is a cross-sectional view illustrating a manufacturing process of the membrane structure according to the third embodiment. A manufacturing process of the membrane structure according to the third embodiment will be described with reference to FIGS. In the present embodiment, the recesses 145-1 to 145-5 formed on the side of the substrate 144 facing the support substrate 203 and formed in the thinned region are formed in a groove shape that does not penetrate the active layer 143. Yes.

  From the active layer 143 side of the substrate 144 that is the SOI substrate illustrated in FIG. 3A to one side of the active layer 143 that is the first main surface of the substrate 144 as illustrated in FIG. Recesses 145-1 to 145-3 are formed. You may form the recessed parts 145-1 to 145-5 in the area | region used as the thin part 146-1 to 146-5 formed by the process mentioned later. The recesses 145-1 to 145-5 serve as a storage chamber as a space that can store a gas generated from the gas generating agent included in the functional layer 202 when the support substrate 203, which will be described later, is peeled off. Buffer the pressure. The recesses 145-1 to 145-5 can be formed by etching, for example. Although there is no restriction | limiting in the shape of the recessed parts 145-1 to 145-5, when the stress concerning the thin-walled parts 146-1 to 146-5 is taken into account when the gas is accommodated, the corners of the circle or polygon are rounded The shape is preferable. The volume of the recesses 145-1 to 145-5 may be appropriately set according to the amount of gas generated, the number and density of the recesses 145-1 to 145-5, and the like. In FIG. 3B, five recesses formed in the active layer 143 are described, but the number of the recesses described in FIG. 3B is only an example, and the number is It can be changed as appropriate.

  For example, the depth of the recesses 145-1 to 145-5 may be in the range of 1 μm to 5 μm, and the diameter of the maximum inscribed circle of the openings of the recesses 145-1 to 145-5 may be in the range of 5 μm to 1 mm. As will be described later, a gap is preferably formed between the adhesive layer 201 and the first main surface of the substrate 144 by a recess, but the aspect ratio of the recesses 145-1 to 145-5 is 1 or more. Preferably it is 2 or more. Each of the recesses 145-1 to 145-5 may be independent, or the recesses 145-1 to 145-5 may be connected to each other through a flow path. Although not shown, the recesses 145-1 to 145-5 are arranged more densely than the other regions at the boundary between the region that later becomes the thin-walled portions 146-1 to 146-5 and the region that becomes the fixing portion 147. May be. Thereby, the stress which arises in the boundary of the area | region used as the thin part 146-1 to 146-5 and the area | region used as the fixing | fixed part 147 can be relieved.

  As shown in FIG. 3C, a support substrate 203 having a groove 203 c formed on the surface to be disposed on the active layer 143 side which is the first main surface of the substrate 144 is prepared. The function and structure of the groove 203c are substantially the same as the groove 203a of the first embodiment, and the description thereof is omitted.

  As shown in FIG. 3D, on the side of the support substrate 203 where the groove 203c is formed, a functional layer 202 containing a gas generating agent that generates gas by applying energy at least, and an adhesive layer 201 are formed. The functional layer 202 and the adhesive layer 201 are substantially the same as those in the first embodiment, and a description thereof will be omitted.

  As illustrated in FIG. 3E, a plurality of convex fixing portions 147 are etched from the support layer 141 side, which is the second main surface of the substrate 144, by using the BOX layer 142 as an etching stopper layer. And a plurality of concave thin portions 146-1 to 146-5 are formed. Thereafter, in order to peel the support substrate 203 from the substrate 144, laser light is irradiated from the support substrate 203 side. Then, gas is generated from the functional layer 202, but the generated gas is generated in the recesses 145-1 to 145-5 and the groove 203c by the recesses 145-1 to 145-3 of the substrate 144 and the groove 203c of the support substrate 203. Therefore, the stress applied to the thin portions 146-1 to 146-5 can be dispersed to prevent the thin portions 146-1 to 146-5 from being damaged.

  As shown in FIG. 3F, after the support substrate 203 is peeled off, the BOX layer 142 is removed by etching, the active layer 143 is thinned to a predetermined layer thickness T, and the recesses 146-1 to 146-146 are removed. 5, through holes 148-1 to 148-3 are formed in desired recesses. In this way, the membrane structure 140 can be manufactured.

  In the method for manufacturing the membrane structures 120, 130, and 140 according to the first to third embodiments of the present invention described above, the substrates 124, 134 using the functional layer 202 containing a gas generating agent. However, the present invention is not limited to this. For example, the substrates 124, 134, and 144 are formed using an adhesive that can be peeled off by thermal swelling when heat is applied as energy. And the support substrate 203 may be bonded and separated. Even when an adhesive that peels off due to thermal swelling is used, the membrane structures 120, 130, and 140 become thin portions as in the manufacturing methods according to the first to third embodiments of the present invention described above. One or more recesses are formed in the first main surface of the substrates 124, 134, and 144 that are in contact with the adhesive, and at least grooves or holes along at least one of the regions corresponding to the thin-walled regions. By forming one on the support substrate 203 in advance, when the support substrate 203 is peeled off, the pressure of the adhesive expanded by heat can be dispersed, so that the membrane structures 120, 130 and 140 can be prevented from being damaged. Can do.

  As described above, according to the method for manufacturing a membrane structure according to an embodiment of the present invention, when the support substrate 203 is peeled off in the process of manufacturing the membrane structure 120, 130, 140, the membrane structure 120, 130. , 140, for example, 126, 136-1, 136-5, 146-1, 146-5, etc. can be prevented from being damaged.

(Substrate support material)
Furthermore, the board | substrate support member which concerns on one Embodiment of this invention is demonstrated. The substrate support member including the functional layer 202, the adhesive layer 201, and the support substrate 203 used in the method for manufacturing the membrane structure can be used in various applications. That is, the substrate support member includes a support substrate having a gas inflow portion on a first side, and an adhesive layer including a layer that is disposed on the first side of the support substrate and has a lower adhesive force due to energy application. It is prepared for. Such a support member can be used not only for supporting the substrate during dry etching but also for supporting the substrate in a thinning process by wafer polishing. The groove may be continuously formed up to the edge of the substrate support member so that the gas generated in the support substrate can be discharged to the outside. Alternatively, the groove may be formed of a porous body so that the gas generated in the support substrate can be accommodated or discharged to the outside.

  As a preferred embodiment of the substrate support member, the adhesive layer can include a configuration in which at least a photothermal conversion layer and an ultraviolet curable resin layer are laminated.

(Board support system)
With reference to FIG. 5, the board | substrate support system 300 which concerns on one Embodiment of this invention is demonstrated. The substrate support system 300 is a substrate before a thinning process, and includes a substrate storage unit 310 that stores a substrate having a first main surface and a second main surface that is paired with the first main surface. The support substrate storage unit 320 for storing the support substrate having a gas inflow portion such as a groove formed on the first side, and the support substrate stored in the support substrate storage unit 320 are transported, and an adhesive force is obtained by applying energy. An adhesive layer forming portion 330 for forming an adhesive layer including a lowering layer, and an adhesive layer formed on a surface located on the first side of the support substrate in the adhesive layer forming portion 330, the substrate and the support substrate are connected to each other. A bonding portion 340 for manufacturing a substrate support member by bonding, a thinning processing portion 350 for thinning the substrate side of the substrate support member, and a substrate after the thinning processing is performed as a support substrate Adhesive layer to peel from An energy applying portion 360 that performs energy imparted, characterized by comprising a. In addition, the arrow in a figure shows the moving destination of the object processed.

  The substrate stored in the substrate storage unit 310 is composed of a plurality of substrates and / or a plurality of layers, the layer side bonded to the support substrate is the first main surface, and the substrate on which the membrane structure is formed. The second main surface is the side or the layer side on which the thinning process is performed. The substrate storage unit 310 has a function of storing a substrate on which the first main surface and the second main surface are formed, and a plurality of types of substrates and / or a plurality of layers constituting the substrate are used as starting materials. As described above, the substrate may be carried into the substrate storage unit 310 and the substrate may be manufactured in the substrate storage unit 310. Alternatively, the substrate storage portion 310 may be configured so that a gas inflow portion having a predetermined shape can be formed on the first main surface side.

  The support substrate stored in the support substrate storage unit 320 has a gas inflow portion formed on the side to be bonded to the first main surface side of the substrate stored in the substrate storage unit 310. The support substrate storage unit 320 may be configured to have a function of forming a gas inflow portion having a desired length and a cross-sectional shape by carrying a support substrate in a state where no gas inflow portion is formed. .

  The adhesive layer forming unit 330 has a function of forming an adhesive layer including a layer whose adhesive force is reduced by applying energy on at least one of the first side of the support substrate and the first main surface of the substrate. The “first side of the support substrate” refers to the surface side on which the gas inflow portion is formed. Therefore, at least one of the substrate stored in the substrate storage unit 310 and the support substrate stored in the support substrate storage unit 320 is carried into the adhesive layer forming unit 330.

  The bonding unit 340 attaches the substrate and the support substrate so that the adhesive layer is interposed between the first side of the support substrate stored in the substrate storage unit 310 and the first main surface of the substrate. Match. A substrate support member is manufactured by the bonding process by the bonding portion 340.

  The substrate support member is carried into the thinning processing section 350 and thinned from the second main surface side of the substrate. The thinning processing unit 350 has a function of not only thinning the substrate support member so as to have a predetermined thickness, but also performing a molding process so that the substrate support member has a predetermined membrane structure. You may have.

  The substrate support member that has been subjected to the thinning process or the like in the thinning processing unit 350 is brought into the energy application unit 360 and applies energy to the adhesive layer in order to peel the substrate from the substrate support member. A process is performed. For example, as the step of applying the energy, the thinning processing unit 350 may have a function of irradiating the second side of the support substrate with laser light.

120, 130, 140 Membrane structure 135-1 to 135-3, 145-1 to 145-5 Recessed part 121, 131, 141 Support layer (layer on the second main surface side)
123, 133, 143 Active layer (layer on the first main surface side)
136, 146 Recessed portion 126, 136-1 to 136-5, 146-1 to 146-5 Thin portion 127, 137, 147 Fixing portion 124, 134, 144 Substrate 148-1 to 148-3 Through hole 201 Adhesive layer 202 Functional layer 203 Support substrate 203a-203c Groove part (gas inflow part)
2031 Porous layer 2032 Support layer

Claims (9)

Preparing a substrate having a first main surface and a second main surface paired with the first main surface;
Preparing a support substrate with a gas inlet on the first side;
An adhesive layer including a layer whose adhesive force is reduced by applying energy is interposed between the first main surface of the substrate and a surface located on the first side of the support substrate, and the substrate and the support substrate are interposed. Joined,
A part or the whole of the substrate is thinned from the second main surface side of the substrate, and the fixing portion opened to the second main surface side is connected to the fixing portion, and the opening of the fixing portion is blocked. And form a thin-walled part arranged as
Applying energy to the adhesive layer, and peeling the support substrate from the first main surface side,
The method for manufacturing a membrane structure, wherein the gas inflow portion is formed corresponding to at least the region to be the thin portion.   2. The method for manufacturing a membrane structure according to claim 1, wherein the gas inflow portion is a groove formed on the first side of the support substrate.   The method for manufacturing a membrane structure according to claim 1, wherein the gas inflow portion is a porous layer existing at least on the first side of the support substrate.   The method for manufacturing a membrane structure according to any one of claims 1 to 3, wherein the adhesive layer includes a gas foaming agent that foams a gas by applying energy.   The method for manufacturing a membrane structure according to any one of claims 1 to 3, wherein the adhesive layer includes an adhesive that swells when energy is applied. The first main surface side of the substrate has a recess,
The method for manufacturing a membrane structure according to any one of claims 1 to 5, wherein at least one of the concave portions is formed in a region to be the thin-walled portion. A board support member for supporting a board,
A support substrate with a gas inlet on the first side;
A substrate support member, comprising: an adhesive layer that is disposed on the first side of the support substrate and includes a layer whose adhesive force is reduced by applying energy.   8. The substrate support member according to claim 7, wherein the adhesive layer is formed by laminating at least a light-to-heat conversion layer and an ultraviolet curable resin layer. A substrate storage unit for storing a substrate before the thinning process and having a first main surface and a second main surface paired with the first main surface;
A support substrate storage portion for storing a support substrate having a gas inflow portion on the first side;
An adhesive layer forming unit that forms an adhesive layer that includes a layer in which the support substrate stored in the support substrate storage unit is transported and the adhesive force is reduced by applying energy to the first side of the support substrate;
A bonding portion for bonding the substrate and the support substrate through an adhesive layer formed on a surface located on the first side of the support substrate in the adhesion layer forming portion;
A substrate support system, comprising: an energy applying unit that applies energy to the adhesive layer in order to peel the substrate after the thinning process from the support substrate.