JP2014058013A - Semiconductor element mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor element mounting device that mounts a semiconductor element to a heat sink by soldering, which prevents adhesion when supplying the heat sink and smoothly supplies the heat sink.SOLUTION: The semiconductor element mounting device comprises: a component supplying device for supplying a heat sink; and a conveying device for conveying the heat sink to a solder coating device and to a die mounting device for mounting a die. The semiconductor element mounting device has: a supply stage, arranged in parallel with a direction of conveying the heat sink of the conveying device, on which a heat sink supply path for conveying a heat sink supplied from the component supplying device and a heat sink extrusion path disposed orthogonally to the heat sink supply path are formed; and a pusher that is moved on the heat sink extrusion path and conveyed from the heat sink supply path to extrude a heat sink into a conveying path near the conveying device. In a supply opening of the heat sink on the heat sink extrusion path toward the conveying path is disposed an openable/closable shutter.

Description

  The present invention relates to a semiconductor element mounting apparatus, and more particularly, to an apparatus for mounting a semiconductor element on a heat sink by soldering, which is suitable for smoothly supplying a heat sink.

  As a device for mounting a semiconductor integrated circuit (semiconductor chip, die) on a substrate such as a lead frame or a heat sink, there is a semiconductor element mounting device (die bonder).

  In a semiconductor element mounting apparatus using solder as an adhesive, for example, molten solder is applied on a heat sink in a high temperature atmosphere, and a die cut from the semiconductor wafer is mounted thereon.

  As such a semiconductor element mounting apparatus, for example, there is a semiconductor element mounting apparatus that performs a process of supplying a work, a process of applying solder, a process of mounting a semiconductor element on a work, and a process of discharging a work with a semiconductor element mounted thereon. It is disclosed in Patent Document 1.

JP 2003-133338 A

Hereinafter, the problems associated with the prior art will be described with reference to FIGS. 6 and 7.
FIG. 6 is a view showing a heat sink supply mechanism of a semiconductor device mounting apparatus according to the prior art.
FIG. 7 is a diagram for explaining in detail the state of the heat sink on the supply stage.

  As shown in FIG. 6, a heat sink supply path 15 is connected to the component supply device 11 of the heat sink H. Then, the heat sink H is moved from the left direction of the drawing to the right direction by vibration through the heat sink supply path 15 from the component supply device 11. The heat sink H is about 4 mm to 10 mm square, for example, and the material is a copper body plated with nickel or silver.

  On the supply stage 12, the heat sink supply path 15 and the heat sink extrusion path 16 intersect, and the pusher 13 pushes the heat sink H toward the conveying device 2 at the intersection at an appropriate timing.

  The transport apparatus 2 includes a drive unit, and moves the transfer 3 from the left to the right in the drawing. The transfer 3 has a feed claw 4 at predetermined intervals. A heat sink H is held in the transfer 3 and the heat sink H is intermittently conveyed on the conveyance path 14. Then, the solder S melted on the heat sink H is applied by the solder applying device 6, and the die D cut out from the wafer 10 in the next step is mounted by the die mounting device 7.

  Since it is necessary to melt the solder S in the semiconductor element mounting apparatus, it is maintained in a high-temperature gas atmosphere. In particular, in the vicinity of the solder coating apparatus 6 for applying the solder S and the die mounting apparatus 7 for mounting the die D. It will be about 400 degrees Celsius. Therefore, in the vicinity of the supply stage, it is about 250 to 300 degrees Celsius.

  Here, as shown in FIG. 7, when the heat sink h <b> 1 is pushed out toward the heat sink push-out path 16 by the pusher 13, the heat sink h <b> 0 adjacent to the heat sink supply path 15 and the heat sink h <b> 2 are stuck together. There was a problem that the supply of H stopped. This is presumably because the heat sink H has a part of the adhesive surface due to heat, and the heat sinks adhere to each other due to impact during extrusion.

  As described above, in a semiconductor element mounting apparatus using solder as an adhesive, in order to melt the solder, when the heat transfer is supplied due to the influence of the high-temperature atmosphere in the work transport path, the heat sinks adhere to each other. As a result, there was a problem that the device stopped.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to prevent adhesion when a heat sink is supplied in a semiconductor element mounting apparatus in which a semiconductor element is mounted on a heat sink by soldering. An object of the present invention is to provide a semiconductor device mounting apparatus that can be supplied.

  A semiconductor element mounting apparatus according to the present invention is a semiconductor element mounting apparatus including a component supply device that supplies a heat sink, and a transport device that transports the heat sink to a solder coating device and a die mounting device for mounting a die. A heat sink supply path for transporting the heat sink supplied from the component supply apparatus to be supplied, and a heat sink extrusion path provided perpendicular to the heat sink supply path are formed on the upper surface. And a pusher that moves on the heat sink extrusion path and pushes the heat sink conveyed from the heat sink supply path to the conveyance path on the conveyance device side.

  And the shutter which can be opened and closed is provided in the heat sink supply port of the said heat sink extrusion path to a conveying apparatus.

  At this time, the shutter is closed except when the heat sink passes through the heat sink supply port of the heat sink extrusion path.

  Also, there are a plurality of heat sink extrusion paths on the supply stage, a plurality of heads that push out the heat sink of the pusher, and a shutter that can be opened and closed at each of the plurality of heat sink supply ports of the heat sink extrusion path to the transport device. May be.

  ADVANTAGE OF THE INVENTION According to this invention, in the semiconductor element mounting apparatus which mounts a semiconductor element to a heat sink with a solder, the adhesion at the time of supply of a heat sink can be prevented, and the semiconductor element mounting apparatus which can supply a heat sink smoothly can be provided. .

1 is a block diagram of a semiconductor element mounting apparatus according to a first embodiment of the present invention. It is a block diagram of the semiconductor element mounting apparatus which concerns on 1st embodiment of this invention. It is the alpha-alpha sectional view of FIG. It is a perspective view of the supply stage 12 of the semiconductor element mounting apparatus which concerns on 2nd embodiment of this invention. It is a perspective view of the supply stage 12 of the semiconductor element mounting apparatus which concerns on 3rd embodiment of this invention. It is a figure which shows the heat sink supply mechanism of the semiconductor element mounting apparatus which concerns on a prior art. It is a figure explaining the heat sink state on a supply stage in detail.

  Hereinafter, a semiconductor element mounting apparatus according to each embodiment of the present invention will be described with reference to FIGS.

Embodiment 1
Hereinafter, a semiconductor element mounting apparatus according to a first embodiment of the present invention will be described with reference to FIGS.

First, the process flow of the semiconductor element mounting apparatus will be described with reference to FIG.
FIG. 1 is a block diagram of a semiconductor element mounting apparatus according to a first embodiment of the present invention.

  In the semiconductor element mounting apparatus, components such as a heat sink / lead frame serving as a workpiece are supplied from the component supply device 11 to the transfer device 2. And the solder S is apply | coated by the solder application | coating apparatus 6 on the workpiece | work which flows through the conveying apparatus 2. FIG.

  On the other hand, the wafer 10 is taken out from the magazine elevator 17, and the diced die D is picked up by the mounting head of the die mounting apparatus 7.

  At the time of mounting, alignment is performed by the CCD camera 21 and the recognition device 20 for recognizing the image thereof, and the die D attracted to the mounting head of the die mounting apparatus 7 is mounted on the workpiece.

  Finally, the heat sink H on which the die D is mounted is accommodated by the unload device 19.

Next, the configuration of the semiconductor element mounting apparatus according to the first embodiment of the present invention will be described with reference to FIGS.
FIG. 2 is a configuration diagram of the semiconductor element mounting apparatus according to the first embodiment of the present invention.
3 is an α-α cross-sectional view of FIG.

  In the semiconductor element mounting apparatus according to the present embodiment, as shown in FIG. 2, a heat sink supply path 15 is connected to the component supply apparatus 11 for the heat sink H. Then, the heat sink H is moved from the left direction of the drawing to the right direction by vibration through the heat sink supply path 15 from the component supply device 11.

  On the supply stage 12, the heat sink supply path 15 and the heat sink extrusion path 16 intersect each other, and the U-shaped pusher 13 </ b> U pushes the heat sink H toward the conveying device 2 at an appropriate timing. Therefore, in the semiconductor element mounting apparatus of this embodiment, the two heat sinks H can be pushed out to the conveying apparatus 2 side by one pusher operation. Here, the heat sink extruded to the head of the left U-shaped pusher 13U is illustrated as a B system heat sink, and the heat sink extruded to the right head is illustrated as an A system heat sink.

  Accordingly, the heat sink H is held in the order of A, B, A, and B by the feed claws 4, moves on the transport path 14 of the transport device 2, and is sent to the solder coating device 6 and the die mounting device 7 side. .

  The mechanisms and operations of the transport device 2, the solder coating device 6, and the die mounting device 7 are the same as those described in the section of the prior art.

  In the present embodiment, the extrusion port of the heat sink extrusion path 16 is made openable and the shutter 30 (the right side 30A and the left side 30B) is provided as shown in FIG. Although not shown, the shutter 30 includes a support portion and a drive portion, and can be driven in the vertical direction.

  The state shown in FIG. 3A is when the U-shaped pusher 13U tries to push the heat sink H toward the conveying device 2, and the shutter 30B is raised upward, and the heat sink push-out path 16 The extrusion port is opened to the conveying device 2 side, and the heat sink H can pass therethrough.

  The state shown in FIG. 3B is after the U-shaped pusher 13U has pushed the heat sink H toward the conveying device 2, the shutter 30B is lowered, and the extrusion port of the heat sink pushing path 16 is The transfer device 2 is blocked.

  In this way, the extruding port of the heat sink extruding path 16 is always prevented by the shutter except when the heat sink H is extruded, thereby preventing the inflow of high-temperature gas flowing from the conveying device 2 side and supplying stage. The heat sink H on the 12 side is prevented from being heated.

  Thereby, it is possible to prevent the heat sinks H of the supply stage 12 from adhering to each other due to the influence of heat.

  In addition, although this embodiment demonstrated the U-shaped pusher 13U which has two or more heads to extrude as a pusher, one head or three or more may be sufficient, and it is individually set to the extrusion opening of each heat sink extrusion path 16. A shutter may be provided. Moreover, you may make it open and close a some extrusion port simultaneously with one shutter.

[Embodiment 2]
Hereinafter, a second embodiment according to the present invention will be described with reference to FIG.
FIG. 4 is a perspective view of the supply stage 12 of the semiconductor element mounting apparatus according to the second embodiment of the present invention.

  In the first embodiment, in order to prevent the heat sink H from being heated, inflow of high-temperature gas is prevented using a shutter mechanism.

  In this embodiment, another cooling mechanism is provided so that the heat sink H is not heated.

  In the semiconductor element mounting apparatus of the present embodiment, as shown in FIG. 4, a pipe 41 is circulated and installed below the supply stage 12, and a cooling medium 42 cooled by the cooler 40 is circulated there. Thus, the heat sink H is prevented from being heated by lowering the temperature of the supply stage 12.

  Thereby, it is possible to prevent the heat sinks H of the supply stage 12 from adhering to each other due to the influence of heat.

  Here, the cooling medium 42 may be a liquid such as water or a gas such as isobutane for cooling.

[Embodiment 3]
Hereinafter, a third embodiment according to the present invention will be described with reference to FIG.
FIG. 5 is a perspective view of the supply stage 12 of the semiconductor element mounting apparatus according to the third embodiment of the present invention.

  In the second embodiment, in order to prevent the heat sink H from being heated, a cooling medium flowing through the supply stage 12 through the piping is used.

  In the present embodiment, the supply stage 12 is cooled by another cooling mechanism so that the heat sink H is not heated.

  In the semiconductor element mounting apparatus of the present embodiment, as shown in FIG. 5, a heat radiating plate 51 is attached to the lower side of the supply stage 12 so as to obtain a heat radiating effect, and is provided on one side of the supply stage 12. The fan 50 is arranged.

  The fan 50 desirably takes in cool air outside the semiconductor device mounting and allows it to flow.

  Thereby, the heat sink is cooled by the air flown by the fan 50, and the heat sink H can be prevented from being heated by lowering the temperature of the supply stage 12.

  Thereby, it is possible to prevent the heat sinks H of the supply stage 12 from adhering to each other due to the influence of heat.

H ... heat sink, S ... solder, D ... die,
DESCRIPTION OF SYMBOLS 2 ... Conveyance apparatus, 3 ... Transfer, 4 ... Feeding claw, 6 ... Solder application apparatus, 7 ... Die mounting apparatus, 10 ... Wafer, 11 ... Component supply apparatus, 12 ... Supply stage, 13, 13U ... Pusher, 14 ... Conveyance , 15 ... heat sink supply path, 16 ... heat sink extrusion path, 17 ... magazine elevator, 19 ... unload device, 20 ... recognition device, 21 ... CCD camera, 40 ... cooler, 41 ... piping, 42 ... cooling medium, 50 ... Fan, 51 ... Heat sink.

Claims (6)

A component supply device for supplying a heat sink;
In the semiconductor element mounting apparatus comprising the heat sink, a solder coating apparatus and a transport apparatus that transports the die to a die mounting apparatus for mounting a die.
A heat sink supply path that is provided in parallel with the transport direction of the heat sink of the transport apparatus and that transports the heat sink supplied from the component supply apparatus to be supplied, and a heat sink extrusion path that is provided perpendicular to the heat sink supply path. A supply stage formed on the upper surface;
A heat sink that moves on the heat sink extrusion path and is transported from the heat sink supply path has a pusher that pushes the transport path to the transport path on the transport device side,
A semiconductor element mounting apparatus, wherein an opening / closing mechanism is provided at a heat sink supply port of the heat sink extrusion path to the transport path of the transport apparatus.   2. The semiconductor element mounting apparatus according to claim 1, wherein the opening / closing mechanism is closed except when the heat sink passes through a heat sink supply port of the heat sink extrusion path.   There are a plurality of the heat sink extrusion paths on the supply stage, there are a plurality of heads for extruding the heat sink of the pusher, and a plurality of supply ports of the heat sink of the heat sink extrusion path to the transport device as the opening / closing mechanisms, respectively. 2. The semiconductor element mounting apparatus according to claim 1, further comprising an openable / closable shutter. A component supply device for supplying a heat sink;
In the semiconductor element mounting apparatus comprising the heat sink, a solder coating apparatus and a transport apparatus that transports the die to a die mounting apparatus for mounting a die.
A heat sink supply path that is provided in parallel with the transport direction of the heat sink of the transport apparatus and that transports the heat sink supplied from the component supply apparatus to be supplied, and a heat sink extrusion path that is provided perpendicular to the heat sink supply path. A supply stage formed on the upper surface;
A pusher that moves on the heat sink extrusion path and pushes the heat sink transported from the heat sink supply path to the transport path on the transport device side;
A semiconductor element mounting apparatus comprising a cooling mechanism for cooling the supply stage. As the cooling mechanism,
A pipe for circulating a cooling medium inside the supply stage;
The semiconductor element mounting apparatus according to claim 4, further comprising a cooler connected at an inlet and an outlet of the pipe to cool the cooling medium and circulate the cooling medium inside the pipe. As the cooling mechanism,
Inside the supply stage, a heat radiating plate for radiating the heat of the supply stage,
5. The semiconductor element mounting apparatus according to claim 4, further comprising a fan for blowing air to the heat radiating plate.

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