JP2014054697A - Cutting polishing device of casting piece sample and processing method of casting piece sample using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting polishing device of a casting piece sample and a processing method of the casting piece sample using the same, for uniformly polishing the casting piece sample, after omitting adjustment work of a strict horizontal level of the casting piece sample.SOLUTION: The cutting polishing device comprises a clamp mechanism 11 for gripping and fixing the casting piece sample 16 tried to be cut-polished, one working platform 15 for slidably moving the clamp mechanism 11 for gripping the casting piece sample 16, a cutting machine 13 for cutting an upper surface 18 of the casting piece sample 16 slidably moving together with the clamp mechanism 11 and a polishing machine 14 for polishing the cut upper surface 18 of the casting piece sample 18 slidably moving together with the clamp mechanism 11.

Description

The present invention relates to a slab sample cutting and polishing apparatus for processing a slab sample used for internal quality inspection of a slab, and a slab sample processing method using the same.

Inspection of the internal quality of the slab, that is, inspection of internal defects such as chemical composition, structure and cracks inside the slab and non-metallic inclusions inside the slab is important for quality control of the slab. The internal quality inspection of the slab is performed after the entire inspection surface of the slab sample cross section is polished and smoothed, and a specific example thereof is described in Patent Document 1.
In the polishing apparatus of Patent Document 1, the rotating grindstone is brought into contact with the slab sample (specimen) gripped by the gripping means to polish the inspection surface of the slab sample, so that the operator grips the slab sample. It is only necessary to hold the button and operate a button or the like.
For this reason, an operator's burden can be reduced compared with the case where it grinds by moving the grinder which the operator had in hand along the inspection surface of a slab sample.

In Patent Document 1, a mold for a slab sample is formed by attaching to a mold of a product, and a slab sample is cast together with a slab for a product at the time of casting, and the chemical composition of the slab sample is analyzed. It is described that the chemical component of the product is acquired. This is based on the premise that a mold for a slab sample is provided, but in a continuous casting facility, a slab sample is collected directly from the slab during continuous casting, and the inspection surface of this slab sample is processed. Then, after smoothing, the internal quality inspection of the slab is performed. The internal quality inspection of the slab plays an important role directly related to the action of the casting process in order to evaluate the internal quality of the slab during continuous casting and feed back the evaluation result to the casting process.

JP-A-2-36060

By the way, the extraction of the slab sample from the slab is performed by gas cutting, and one of the two gas-cut surfaces is used as an inspection surface. In this case, since the cut surface of the gas-cut slab sample has a large surface roughness, it is very low in work efficiency to smooth the cut surface only with a polishing machine. Therefore, it is effective from the viewpoint of work efficiency to perform polishing after reducing the unevenness of the cut surface by cutting.

Specifically, the cutting apparatus 102 (see FIG. 5B) in which the cutting machine 101 is attached to the work table 100 and the polishing apparatus 105 (see FIG. 5D in which the polishing machine 104 is attached to the work table 103). It is conceivable to carry out the following procedure using
First, as shown in FIGS. 5A and 5B, the slab sample 106 taken out from the continuous casting machine is placed on the work table 100 of the cutting apparatus 102 by the conveying means 107, and one of the cut surfaces is placed. Clamping is performed by the vise 108 on the work table 100 in a state of being arranged on the upper side. The slab sample 106 clamped by the vice 108 is cut by the cutting machine 101 at the upper cut surface.

As shown in FIGS. 5C and 5D, the slab sample 106 removed from the vise 108 after the cutting is transferred from the work table 100 of the cutting device 102 to the work table 103 of the polishing device 105 by the conveying means 109. Moved to. The slab sample 106 is clamped by the clamp mechanism 110 on the work table 103 in a state where the cut surface is disposed on the upper side, and the upper surface is polished by the polishing machine 104. In this example, the polishing machine 104 moves to polish the slab sample 106. Here, when the slab sample 106 is fixed to the clamp mechanism 110, it is important to accurately adjust the horizontal level of the cut surface. This is because if the horizontal level is not accurate, polishing by the polishing machine 104 becomes non-uniform and correct results cannot be obtained in the internal quality inspection of the slab.

However, it is not easy to fix the slab sample 106 after cutting to the clamp mechanism 110 so that the cut surface is horizontal, and it takes a long time to complete the inspection of the slab sample 106. There are challenges.
The present invention has been made in view of such circumstances, and a slab sample cutting and polishing apparatus for uniformly polishing a slab sample after omitting a strict horizontal level adjustment operation of the slab sample and the same. An object of the present invention is to provide a method for processing a slab sample.

The slab sample cutting and polishing apparatus according to the first aspect of the present invention is configured to slide and move a clamp mechanism that holds and fixes a slab sample to be cut and polished, and the clamp mechanism that holds the slab sample. A working table to be cut, a cutting machine that cuts the upper surface of the slab sample that slides together with the clamp mechanism, and a polishing machine that polishes the cut upper surface of the slab sample that slides together with the clamp mechanism. Have.

In the slab sample cutting and polishing apparatus according to the first invention, it is preferable that the clamp mechanism is directly attached to the work table.

In the slab sample cutting and polishing apparatus according to the first invention, it is preferable that the slab sample has a cassette member to which the clamp mechanism is fixed, and the slab sample is attached to the work table via the cassette member.

In the cutting and polishing apparatus for a slab sample according to the first invention, between the center of the processing portion of the cutting machine pressed against the slab sample and the center of the processing portion of the polishing machine pressed against the slab sample. The distance is preferably 0.5 m or more and 3 m or less.

The slab sample cutting and polishing apparatus according to the second aspect of the present invention comprises a clamp mechanism that holds and fixes a slab sample to be cut and polished, a cassette member to which the clamp mechanism is fixed, and the cassette A work table to which a member is attached, a cutting machine for cutting the upper surface of the slab sample placed on the work table via the cassette member, and the work table placed on the work table via the cassette member A polishing machine for polishing the upper surface of the slab sample, and there are two work tables, the slab sample is cut on one of the work tables, and the slab sample is polished on the other work table. To do.

In the slab sample cutting and polishing apparatus according to the first and second inventions, it is preferable that there are a plurality of the clamp mechanisms, and a plurality of the slab samples are attached to the work table at a time.

A method for processing a slab sample according to the third invention in accordance with the above object is a method for processing a slab sample in which one side of a cut slab sample is cut and further polished, and the slab sample is one side thereof. Is placed on the upper side and gripped by a clamp mechanism, the clamp mechanism that grips the slab sample is slid on a work table to a processing part of a cutting machine, and the casting placed on the work table. A step of cutting one surface of the piece sample, a step of sliding the clamp mechanism holding the cut piece of the slab sample on the work table to a processing part of a polishing machine, and the casting placed on the work table. A step of polishing one surface of the piece sample, and moving the clamp mechanism on one of the work tables to cut and polish the slab sample.

In the method for processing a slab sample according to the third invention, it is preferable that the distance between the center of the processing portion of the cutting machine and the center of the processing portion of the polishing machine is 0.5 m or more and 3 m or less.

According to the slab sample cutting and polishing apparatus according to the first invention and the slab sample processing method according to the third invention, the clamp mechanism that holds the slab sample is slid on one worktable, Since the slab sample is cut and polished, it is not necessary to adjust the horizontal level of the slab sample after cutting the slab sample and before polishing, shortening the time to complete the polishing process and slab sample Can be polished uniformly.

According to the slab sample cutting and polishing apparatus according to the second invention, the clamp mechanism for gripping and fixing the slab sample, the cassette member to which the clamp mechanism is fixed, the work table to which the cassette member is attached, and the work A cutting machine for cutting the upper surface of the slab sample placed on the table via the cassette member, and a polishing machine for polishing the upper surface of the slab sample placed on the work table via the cassette member, There are two work tables, and the slab sample is cut on one work table and the slab sample is polished on the other work table.
Therefore, after cutting the slab sample placed on the work table via the cassette member, the cut slab sample can be placed on another work table in a state of being attached to the cassette member and polished. For this reason, when the slab sample is moved from the cutting work table to the polishing work table, it is not necessary to adjust the horizontal level of the slab sample, and the time to complete the polishing process can be shortened. A piece sample can be polished uniformly.

1 is a side view of a cutting and polishing apparatus according to an embodiment of the present invention. It is a top view of the cutting polishing apparatus. It is explanatory drawing of the slab sample applied to the cutting polishing apparatus. It is the flowchart which compared the processing method of the slab sample which used the cutting polishing apparatus, and the processing method of the slab sample which concerns on a comparative example. (A)-(D) are explanatory drawings which show the processing method of the slab sample using the cutting processing apparatus recalled from a prior art example, and its grinding | polishing processing apparatus.

Next, embodiments of the present invention will be described with reference to the accompanying drawings for understanding of the present invention.
As shown in FIGS. 1 and 2, a cutting and polishing apparatus 10 according to an embodiment of the present invention includes a movable body 12 to which a clamp mechanism 11 is fixed, and a work in which a cutting machine 13 and a polishing machine 14 are attached. This is a device for providing a table 15 and holding and fixing a slab sample 16 to be cut and polished by a clamp mechanism 11 to cut and polish. Details will be described below.

As shown in FIG. 3, the slab sample 16 is obtained by gas-cutting a continuously cast slab 17, and the surfaces 18 and 19 which are cut surfaces have large surface roughness and unevenness. Yes. The surface 18 is subjected to a quality inspection after being smoothed by the cutting and polishing apparatus 10, and the operator makes a pass / fail judgment of the quality of the slab based on the result of the quality inspection, and the casting conditions are determined according to the judgment. Change and manage the slab to maintain a predetermined quality level.

As shown in FIGS. 1 and 2, the cutting and polishing apparatus 10 includes one work table 15, and a cutting machine 13 and a polishing machine 14 are attached to the work table 15 with a space therebetween.
In the present embodiment, the cutting machine 13 is a milling machine, and the polishing machine 14 is a belt sander.
The work table 15 is formed long in the front-and-rear direction, is disposed in a state where the upper surface is kept horizontal, and includes a plate-like movable body 12.
A plurality of clamp mechanisms 11 are fixed to the upper surface of the movable body 12 with a space in the front-rear direction, and the movable body 12 advances and retreats along the longitudinal direction of the work table 15 by the operation of a servo motor (not shown) or a hydraulic mechanism. . Therefore, the work table 15 can slide the plurality of clamp mechanisms 11 integrally. Note that only one clamp mechanism 11 may be fixed to the movable body 12 and only one slab sample 16 may be attached to the movable body 12.

Each clamp mechanism 11 is mainly composed of two vices 11a arranged at a distance from each other, and grips and fixes one slab sample 16 to be cut and polished, thereby fixing the slab sample 16 to the movable body 12. Secure to. Each slab sample 16 is gripped by one clamp mechanism 11 with the surface 18 disposed on the upper side and the surface 19 disposed on the lower side.
On the work table 15 along the direction in which the movable body 12 advances, the polishing machine 14 is provided on the downstream side of the cutting machine 13, and the plurality of slab samples 16 are held by the clamp mechanism 11, and the cutting machine 13 slides together with the movable body 12 from the upstream side, and the cutting machine 13 cuts the surface 18 (upper surface). Then, the movable body 12 slides together with the movable body 12 from the arrangement position of the cutting machine 13, so that the cut surfaces 18 of the plurality of slab samples 16 are polished by the polishing machine 14.
By completing the smoothing of the surfaces 18 of the plurality of slab samples 16 at a time, the quality inspection can be performed on the plurality of slab samples 16 at a time. If the time interval for performing the quality inspection becomes long, the inspection environment such as the inspection liquid to be used may change, and the inspection results may vary. For this reason, completing the smoothing of the surfaces 18 of the plurality of slab samples 16 at a time can result in stable inspection results when performing quality inspection of the plurality of slab samples 16. It is valid.

The cutting machine 13 includes a cutter head 20 which is a processing portion, and the surface 18 of the slab sample 16 is cut by pressing the cutter head 20 against the slab sample 16 from above the slab sample 16. Remove unevenness.
The cutting machine 13 is designed so that the cutter head 20 can be moved up and down, and the cutting machine 13 adjusts the height of the cutter head 20 to determine the cutting amount of the surface 18 of the slab sample 16. In the present embodiment, the cutter head 20 can be moved back and forth and left and right in addition to raising and lowering.

The polishing machine 14 includes a plurality of rolls 21, and an endless sanding belt 22 is wound around the plurality of rolls 21. Each roll 21 has a shaft arranged in the left-right direction and is rotatably held by an elevator (not shown), and the sanding belt 22 is rotated by driving the roll 21 to perform polishing.
The sanding belt 22 moves up and down together with a roll support (not shown) that holds the roll 21, and the lower end portion thereof is maintained at a height position where the sanding belt 22 contacts the surface 18 of the slab sample 16. To polish. In the present embodiment, the lower part of the sanding belt 22 that is in contact with the slab sample 16 is used as a processing portion of the polishing machine 14.

Below, the processing method of the slab sample 16 using the cutting polishing apparatus 10 is demonstrated.
The slab sample 16 cut out from the slab 17 is transported to the work table 15 by transport means (not shown), and is gripped by the clamp mechanism 11 with the surface 18 disposed on the upstream side of the cutting machine 13. The In the present embodiment, the plurality of slab samples 16 are each attached to the movable body 12 by the clamp mechanism 11.
Next, the movable body 12 is advanced, and the clamp mechanism 11 that holds each slab sample 16 is slid to the processing portion of the cutting machine 13 on the work table 15, and a plurality of slabs placed on the work table 15. The surface 18 of the sample 16 is cut.

After the cutting of the surface 18 of the plurality of slab samples 16 by the cutting machine 13 is completed, the movable body 12 is advanced, and the clamp mechanism 11 that grips the plurality of slab samples 16 on the work table 15 is processed by the processing unit of the polishing machine 14. Slide to the end.
As the movable body 12 arranged in the processing portion of the polishing machine 14 repeats advancing and retreating, the entire surface 18 of each of the plurality of slab samples 16 placed on the work table 15 is polished. Therefore, by moving the plurality of slab samples 16 together with the plurality of clamp mechanisms 11 fixed to the movable body 12 on one worktable 15, the surfaces 18 of the plurality of slab samples 16 are cut and stabilized in a stable state. Polishing is performed.

In the present embodiment, as shown in FIG. 1, the distance L between the center of the processing part of the cutting machine 13 and the center of the processing part of the polishing machine 14 is 0.5 m or more and 3 m or less.
This is because it has been confirmed that when the distance L is shorter than 0.5 m, cutting waste generated during the cutting process of the cutting machine 13 scatters to the polishing machine 14 to cause a defect in the polishing machine 14.
The upper limit of the distance L is limited to 3 m because, when the distance L exceeds 3 m, the manufacturing cost of the cutting and polishing apparatus 10 accompanying the increase in the size of the work table 15 to which the cutting machine 13 and the polishing machine 14 are attached. This is because the rate of increase increases. This is due to a decrease in the utilization rate of general-purpose products for parts and members used in the production of the cutting and polishing apparatus 10 and an increase in custom-made products.

Here, the work flow (case 1) of the slab sample processing method according to the first embodiment of the present invention using the cutting and polishing apparatus 10, and the horizontal level adjustment of the slab sample after cutting and before polishing FIG. 4 shows a result of comparison of the work flow (case 2) of the comparative example in which the above is performed.
In Case 2, a working table for the cutting machine and a working table for the polishing machine are prepared, and after the cutting by the cutting machine is finished, the slab sample is removed from the working table for the cutting machine and placed on the working table for the polishing machine. The slab sample is polished after the horizontal level adjustment of the slab sample.
Of the operations shown in FIG. 4, those surrounded by double lines indicate operations that are performed automatically or semi-automatically with the equipment at the center, and are surrounded by a single line. Things represent work performed mainly by human intervention.

In cases 1 and 2, the number of operations centered on human intervention is 4 for case 1 but 6 for case 2 and case 1 completes the entire operation for case 2. Clearly, the time required can be reduced.
Further, in case 2, when the slab sample is attached to the work table for the polishing machine, it is necessary to adjust the horizontal level of the upper surface of the slab sample. If this horizontal level adjustment is insufficient, the polishing process for the slab sample is not uniform, and an accurate inspection result cannot be obtained in the inspection performed after the polishing process. If accurate inspection results cannot be obtained, it is necessary to repeat all steps such as collecting slab samples, cutting, polishing, and pasting photographic paper, so the time until accurate inspection results are obtained is prolonged. As a result, the quality pass / fail feedback is delayed and a quality trouble occurs, resulting in a significant yield.

In the present embodiment, the clamp mechanism 11 is directly fixed to the movable body 12 (that is, to the work table 15). However, the clamp mechanism 11 is fixed to the cassette member, and the cassette member is attached to the movable body 12. Thus, the slab sample 16 may be attached to the work table 15 via a cassette member. By using the cassette member, even if the slab sample 16 held by the clamp mechanism 11 is removed from the work table 15 together with the cassette member, the slab sample 16 is horizontally attached by attaching the cassette member to the movable body 12 again. The level is in the same state as before removal from the work table 15.

So far, the embodiment of cutting and polishing the slab sample on one workbench has been described. However, there are two workbench, and one workbench (hereinafter also referred to as “cutting workbench”). ), And the slab sample can be polished on the other workbench (hereinafter also referred to as “polishing workbench”).
In this case, the cutting machine is attached to the cutting work table, and the polishing machine is attached to the polishing work table.

Each of the cutting work table and the polishing work table includes a movable body, and a cassette member to which a clamp mechanism is fixed can be fixed to each movable body.
The slab sample is placed on the movable body of the cutting work table via the cassette member in a state of being held and fixed by the clamp mechanism. At this time, the cassette member is fixed to the movable body of the cutting work table.
The slab sample is slid and moved together with the movable body and the cassette member, so that the upper surface is cut by a cutting machine.

The cut slab sample is removed from the cutting work table together with the cassette member while being held by the clamp mechanism, and placed on the movable body of the polishing work table via the cassette member. . At this time, the cassette member is fixed to the movable body of the polishing work table.
The slab sample placed on the polishing work table slides together with the movable body and the cassette member, so that the upper surface is polished by a polishing machine.

The cutting workbench and the polishing workbench may be provided with one cutting workbench and one polishing workbench, but a plurality of cutting worktables may be provided for one polishing workbench. It is.
Since the cutting operation of the slab sample by the cutting machine takes time compared to the polishing operation of the slab sample by the polishing machine, this configuration shortens the time to stop the polishing machine and cuts the slab sample. And polishing can be performed efficiently. When it is necessary to cut and polish many slab samples per unit time, the horizontal level adjustment can be omitted when moving the slab sample from the cutting workbench to the polishing workbench. This brings about a remarkable effect in terms of

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and all changes in conditions and the like that do not depart from the gist are within the scope of the present invention.
For example, the cutting machine is not limited to a milling machine.
Further, the polishing machine is not limited to the belt sander, and may be, for example, a type in which a disk-shaped polishing member is rotated.
Then, the cutting machine and the polishing machine may be attached to things other than the work table.

10: Cutting polishing apparatus, 11: Clamp mechanism, 11a: Vise, 12: Movable body, 13: Cutting machine, 14: Polishing machine, 15: Work table, 16: Slab sample, 17: Slab, 18, 19: Surface, 20: cutter head, 21: roll, 22: sanding belt

Claims (8)

A clamp mechanism for gripping and fixing a slab sample to be cut and polished, a work table for slidingly moving the clamp mechanism for gripping the slab sample, and a slab sample that slides together with the clamp mechanism A cutting and polishing apparatus comprising: a cutting machine that cuts an upper surface; and a polishing machine that polishes the cut upper surface of the slab sample that slides together with the clamp mechanism. 2. The cutting and polishing apparatus according to claim 1, wherein the clamp mechanism is directly attached to the work table. The cutting and polishing apparatus for a cast sample according to claim 1, further comprising a cassette member to which the clamp mechanism is fixed, and the cast sample is attached to the work table via the cassette member. apparatus. The slab sample cutting and polishing apparatus according to any one of claims 1 to 3, wherein a center of a processing portion of the cutting machine pressed against the slab sample and processing of the polishing machine pressed against the slab sample. The distance between the centers of the parts is 0.5 m or more and 3 m or less. A clamp mechanism for gripping and fixing a slab sample to be cut and polished, a cassette member to which the clamp mechanism is fixed, a workbench to which the cassette member is attached, and a workbench mounted on the workbench via the cassette member. A cutting machine for cutting the upper surface of the placed slab sample, and a polishing machine for polishing the upper surface of the slab sample placed on the work table via the cassette member, There is two cutting and polishing apparatuses, wherein the slab sample is cut by one of the work tables and the slab sample is polished by the other work table. The slab sample cutting and polishing apparatus according to any one of claims 1 to 5, wherein there are a plurality of the clamp mechanisms, and a plurality of the slab samples are attached to the work table at one time. Cutting and polishing equipment for slab samples. A method for processing a slab sample, in which one side of a cut slab sample is cut and further polished,
Placing the one side of the slab sample on the upper side and holding it with a clamp mechanism;
A step of sliding the clamp mechanism holding the slab sample on a work table to a processing part of a cutting machine;
Cutting one surface of the slab sample placed on the workbench;
Sliding the clamp mechanism holding the cut slab sample on the work table to a processing part of a polishing machine;
Polishing one surface of the slab sample placed on the workbench,
A method for processing a slab sample, wherein the clamping mechanism is moved on one of the work tables to cut and polish the slab sample. 8. The method for processing a slab sample according to claim 7, wherein a distance between a center of the processing portion of the cutting machine and a center of the processing portion of the polishing machine is 0.5 m or more and 3 m or less. Sample processing method.

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