JP2014052330A - Radiation image detector and radiation image detector manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a radiation image detector which has moisture resistance and improved sharpness, and to provide a radiation image detector manufacturing method.SOLUTION: The radiation image detector according to the present invention has a scintillator panel via an optical compensation material on a photoelectric conversion panel having a plurality of photoelectric conversion elements two-dimensionally arrayed on a substrate. The scintillator panel has: a scintillator layer that is composed of a plurality of columnar crystals of a scintillator; and a penetration prevention layer that prevents the optical compensation material from being infiltrated into gaps between the columnar crystals, and an average layer thickness of the penetration prevention layers in tip parts of the columnar crystals is 1/2 or more of a maximum value of gap distances between the columnar crystals and 8 μm or less.

Description

  The present invention relates to a radiation image detector and a method for manufacturing the radiation image detector, and more particularly to a radiation image detector used for medical diagnosis and for converting a radiation image into an electrical signal.

  Conventionally, radiation images such as X-ray images have been widely used for medical diagnosis in medical practice. In particular, radiographic images using intensifying screen-film systems are still the world as an imaging system that combines high reliability and excellent cost performance as a result of high sensitivity and high image quality in the long history. Used in the medical field. However, these pieces of image information are so-called analog image information, and free image processing and instantaneous electric transmission cannot be performed like the digital image information that has been developed in recent years.

  In recent years, digital radiographic image detectors typified by computed radiography (CR), flat panel detectors (FPD) and the like have appeared. Since a digital radiographic image is obtained and an image can be displayed on an image display device such as a cathode tube or a liquid crystal panel, it is not always necessary to form an image on a photographic film. As a result, these digital radiographic image detectors reduce the need for image formation by the silver halide photography method, and greatly improve the convenience of diagnostic work in hospitals and clinics.

  Here, computed radiography (CR) reads and digitizes a radiographic image read by an imaging plate by laser scanning, but requires a reading process, and is not sharp enough and has a spatial resolution. Is not enough.

On the other hand, a radiological image detector developed as a digital radiographic image technology that directly obtains a digital radiographic image is converted into light by a scintillator such as Gd ₂ O ₂ S or CsI, and then the light is converted into an electric signal by a photodiode. There are a scintillator method for converting to X-rays and a method for converting X-rays directly into electrical signals by an X-ray detection element represented by Se. The present invention relates to the former scintillator type radiation image detector.

  A scintillator-type radiation image detector is generally used by combining a scintillator panel that converts radiation into light and a photoelectric conversion panel that converts light into an electrical signal. When a columnar crystal is used as the scintillator of the scintillator panel, a sharp luminescent image can be obtained. However, if there is an air layer between the scintillator panel and the photoelectric conversion panel, the light generated from the scintillator is reflected on the surface of the scintillator or the photoelectric conversion panel. Reflection occurs at the interface between the surface and air, and the light diffuses until it enters the photoelectric conversion panel, so that high image sharpness cannot be obtained.

  As a method for preventing reflection that occurs at the interface with such an air layer, a radiation conversion panel disclosed in Patent Document 1 is known. This radiation image detector has a scintillator panel and a photoelectric conversion panel in which a scintillator layer and a moisture-proof organic layer are sequentially laminated on a support, and the optical compensation material is made so that the moisture-proof organic layer and the photoelectric conversion panel of the scintillator panel face each other. (Smatching oil) is interposed between the scintillator panel and the photoelectric conversion panel, and the side walls of the scintillator panel are fixed with resin.

  In this configuration, light generated from the scintillator panel does not pass through the air layer, but passes through an optical compensation material having a refractive index close to that of the moisture-proof organic layer of the scintillator panel or the surface layer of the photoelectric conversion panel. It is difficult and sharpness improves. However, in order to improve the accuracy of diagnosis, there is a demand for further improvement in sharpness.

  In Patent Document 1, the moisture-proof organic layer is provided to prevent damage to the scintillator and to block the deliquescent scintillator from external water vapor. For example, a polyparaxylylene layer having a thickness of 10 μm is provided. A radiation image detector is described in which a scintillator panel having two layers and a photoelectric conversion panel are overlapped via matching oil. However, as a result of investigations by the present inventors, since this method has a thick moisture-proof organic layer, the light diffuses before the light from the scintillator reaches the photoelectric conversion panel, and the sharpness of the image cannot be further improved. I understood that.

  Therefore, the present inventors have studied to improve the sharpness of the image by reducing the thickness of the moisture-proof organic layer, but the sharpness of the image is not improved even if the thickness is reduced. A sufficient effect could not be obtained.

  The inventors of the present invention examined the radiation image detector with a reduced thickness of the moisture-proof organic layer in detail, and found that bubbles were generated in the optical compensation material.

JP 2000-9845 A

  The present invention has been made in view of the above-described problems and situations, and a solution to the problem is to provide a radiological image detector having no generation of bubbles and having improved sharpness, and a method for manufacturing the radiographic image detector. is there.

  In order to solve the above problems, the present inventor, in the process of examining the cause of the above problems, the layer thickness of the permeation prevention layer is 1/2 or more of the maximum value of the gap distance between the columnar crystals of the scintillator layer. And if it is 8 micrometers or less, it discovered that an optical compensation material did not osmose | permeate the clearance gap between the columnar crystals of a scintillator layer, and sharpness did not fall, and came to this invention.

That is, the said subject which concerns on this invention is solved by the following means.
1. A radiation image detector comprising a photoelectric conversion panel having a plurality of photoelectric conversion elements arranged two-dimensionally on a substrate and a scintillator panel provided via an optical compensation material, wherein the scintillator panel includes a plurality of scintillator panels. A scintillator layer made of columnar crystals and a penetration preventing layer for preventing the optical compensation material from penetrating into the gaps between the columnar crystals, and an average thickness t of the penetration preventing layer at the tip of the columnar crystals and a plurality of thicknesses The maximum value d of the gap distance between the columnar crystals satisfies the following formula (1).
Formula (1) d / 2 <= t <= 8micrometer
[Wherein, t is the average thickness of the permeation preventing layer at the tip of the columnar crystal of the scintillator layer, d is the maximum value of the gap distance between the columnar crystals, and d is 0.5-15.0 μm. Within range. ]
2. The scintillator panel has a scintillator layer and a permeation prevention layer on a support in order, and the photoelectric conversion panel and the scintillator panel are bonded so that the permeation prevention layer faces the photoelectric conversion element, and the support The radiation image detector according to item 1, characterized in that has a glass layer.
3. The scintillator panel has a support on which a scintillator layer is formed leaving the outer periphery of the support, and has an adhesive between the outer periphery of the support and the outer periphery of the photoelectric conversion panel, The radiation image detector according to claim 1 or 2, wherein a scintillator layer is sealed by the support, the photoelectric conversion panel, and the adhesive.
4). The permeation preventing layer is selected from polyparaxylylene, polymonochloroparaxylylene, polydichloroparaxylylene, polytetrachloroparaxylylene, polyfluoroparaxylylene, polydimethylparaxylylene and polydiethylparaxylylene. The radiation image detector according to any one of Items 1 to 3, wherein the radiation image detector includes at least one selected from the group consisting of:
5. It is a manufacturing method of the radiographic image detector which manufactures the radiographic image detector as described in any one of Claim 1 to 4, Comprising: It enclosed with the said board | substrate, the said support body, and the said adhesive agent, and was sealed. A method of manufacturing a radiation image detector, wherein the scintillator panel and the photoelectric conversion panel are bonded and bonded by reducing the internal space from atmospheric pressure.

  By the above-mentioned means of the present invention, it is possible to provide a radiological image detector having no sharp bubbles and improved sharpness, and a method for manufacturing the radiographic image detector.

  The expression mechanism or action mechanism of the effect of the present invention is not clear, but is presumed as follows.

  As shown in FIG. 3, the scintillator is composed of a large number of columnar crystals, and there are voids between the columnar crystals. For sharpness, the thinner the permeation prevention layer, the better, but when the scintillator layer is not provided with a very thin permeation prevention layer, the scintillator panel and the photoelectric conversion panel are bonded via an optical compensation material. Then, bubbles are observed in the layer of the optical compensation material. It is considered that the air bubbles were expelled to the surface due to the penetration of the optical compensation material into the gaps between the columnar crystals of the scintillator. When the thickness of the permeation preventive layer is increased to close the gap between the columnar crystals, the generation of bubbles is prevented. The present inventors have discovered the relationship between the generation of bubbles and the image sharpness, and have found a layer thickness effective for preventing the optical compensation material from penetrating in order not to generate bubbles.

Partially broken perspective view showing a schematic configuration of a radiation image detector Schematic sectional view showing a radiation image detector Schematic sectional view showing the mechanism by which the penetration preventing layer prevents penetration of the optical compensation material (A) is the side view which shows the outline of a vapor deposition apparatus, (b) is the figure which looked at the vapor deposition source and shutter in a vapor deposition apparatus from the support body B side. Schematic of the chamber used in the manufacture of the radiological image detector Schematic sectional view showing adhesive pre-applied to photoelectric conversion panel The figure which shows the photoelectric conversion panel mounted in the base of the chamber The figure which shows the scintillator panel mounted on the photoelectric conversion panel on the stand of a chamber Schematic cross section showing adhesive pre-applied to scintillator panel The figure which shows the state by which the scintillator panel and the photoelectric conversion panel were bonded by pressure reduction Cross section showing scintillator columnar crystals and gaps

  The radiation image detector of the present invention is a radiation image detector in which a scintillator panel is provided on a photoelectric conversion panel having a plurality of photoelectric conversion elements arranged two-dimensionally on a substrate via an optical compensation material. The scintillator panel has a scintillator layer composed of a plurality of columnar crystals of the scintillator and a penetration preventing layer for preventing the optical compensation material from penetrating into the gaps between the columnar crystals, and penetration at the tip of the columnar crystals The average layer thickness t of the prevention layer and the maximum value d of the gap distance between the plurality of columnar crystals satisfy the above formula (1). This feature is a technical feature common to the inventions according to claims 1 to 5.

  As an embodiment of the present invention, the scintillator panel is formed with a scintillator layer in order to prevent the scintillator from absorbing and deteriorating moisture even when a moisture-proof organic layer is not used and a thin permeation prevention layer is used. An outer peripheral portion formed of a non-supporting body, and an adhesive is provided between the outer peripheral portion of the supporting body and the outer peripheral portion of the photoelectric conversion panel, and the scintillator layer includes the support, the photoelectric conversion panel, and the adhesive It is preferably sealed with an agent. In addition, when the support or the substrate of the photoelectric conversion panel has a glass layer, and the adhesive is a photo-curing type, it transmits light for curing the adhesive and has a high water-blocking property. To preferred.

  Further, in the present invention, the permeation preventive layer comprises polyparaxylylene, polymonochloroparaxylylene, polydichloroparaxylylene, polytetrachloroparaxylylene, polyfluoroparaxylylene, polydimethylparaxylylene, poly It preferably contains diethyl paraxylylene. Thereby, the effect of the outstanding penetration prevention is acquired.

  The manufacturing method of the radiographic image detector for manufacturing the radiographic image detector of the present invention is a manufacturing method of an aspect in which the internal space surrounded and sealed by the substrate, the support and the adhesive is depressurized from atmospheric pressure. It is preferable that, when the scintillator panel and the photoelectric conversion panel are brought into close contact with each other through the optical compensation material, air is excluded, so that no voids are formed in the optical compensation material.

  Hereinafter, the present invention, its components, and modes and modes for carrying out the present invention will be described in detail. In addition, in this application, "-" is used in the meaning which includes the numerical value described before and behind that as a lower limit and an upper limit.

  Further, the outer peripheral portion of the support is a region having no scintillator layer surrounding the periphery of the scintillator layer in the surface provided with the scintillator layer in the scintillator panel having the support, the scintillator layer, and the permeation prevention layer. , Refers to the area used as glue margin.

  Further, the “tip portion of the columnar crystal” means a point farthest from the support of each columnar crystal in the columnar crystal of the scintillator panel.

(Radiation image detector)
The radiation image detector of the present invention is a radiation image detector in which a scintillator panel is provided on a photoelectric conversion panel having a plurality of photoelectric conversion elements arranged two-dimensionally on a substrate via an optical compensation material. The scintillator panel has a scintillator layer composed of a plurality of columnar crystals of the scintillator and a penetration preventing layer for preventing the optical compensation material from penetrating into the gaps between the columnar crystals, and penetration at the tip of the columnar crystals The radiation image detector, wherein the average layer thickness t of the prevention layer and the maximum value d of the gap distance between the plurality of columnar crystals satisfy the following formula (1).
Formula (1) d / 2 <= t <= 8micrometer
[Wherein, t is the average thickness of the permeation preventive layer at the tip of the columnar crystal of the scintillator layer, d is the maximum value of the gap distance between the plurality of columnar crystals, and d is 0.5 to 15.0 μm. Is within the range. ]
In the radiation detection system, the radiation generated by the radiation generator is irradiated onto the subject, and the radiation transmitted through the subject is incident on the radiation image detector. The radiation image detector detects radiation information from the subject, converts it into a digital image signal, and outputs it. The radiation used is, for example, an X-ray having a wavelength of about 1 × 10 ⁻¹⁰ m.

  The image signal converted by the radiation image detector is subjected to various types of image processing by an image processing apparatus and is displayed on an image display unit or output onto a medium by various types of printers. Further, the image signal can be stored in a memory or transmitted to another department via a network.

  Hereinafter, the schematic structure of the radiation image detector of the present invention will be described with reference to FIG.

  The radiation image detector 100 includes a scintillator panel 10 that emits fluorescence when irradiated with radiation, and a photoelectric conversion panel 20 that is provided therebelow and photoelectrically converts fluorescence generated by the scintillator panel 10. As shown in FIG. 1, in the photoelectric conversion panel 20, photoelectric conversion elements are two-dimensionally arranged in a lattice shape, and each photoelectric conversion element corresponds to one pixel of a radiation image.

  The photoelectric conversion panel 20 further includes a control circuit 120, a memory unit 130 for storing an image signal converted by the photoelectric conversion element, an operation unit 140 for switching the operation of the radiation image detector 100, a radiographing preparation completion display, A display unit 150 that displays writing of an image signal to the memory unit 130, a power supply unit 160 that supplies power necessary to obtain an image signal from a photoelectric conversion element, and between the radiation image detector 100 and an external image processing unit A communication connector 170 for performing communication is provided.

  The radiation image detector 100 includes a scintillator panel 10, a photoelectric conversion panel 20, and a housing 180 that houses these.

  Here, if the radiation image detector 100 is detachable from an external image processing unit connected via the connector 170, a portable structure in which the radiation image detector 100 can be carried can be obtained.

  The casing 180 is made of a lightweight and durable material such as aluminum or aluminum alloy. The radiation incident surface side of the housing 180 is formed of a material that easily transmits radiation, such as carbon fiber. Further, a radiation absorbing material such as a lead plate is provided on the back surface side opposite to the radiation incident surface, and radiation transmitted through the radiation image detector 100 and constituent materials of the radiation image detector 100 are generated by radiation absorption 2. Prevent leakage of secondary radiation outside the device.

  FIG. 2 is a cross-sectional view showing an example of the layer structure of the main part of the radiation image detector 100 of the present invention. The schematic diagram functionally bound to the left half includes a layer that can be added to the right half. The layer structure is shown.

  First, the functionally layered structure of the left half will be described.

  In FIG. 2, radiation is incident from above. The radiation image detector 100 is roughly composed of a stack of a scintillator panel 10 and a photoelectric conversion panel 20 from the upper radiation incident direction in the figure, and the scintillator panel 10 is a first support in order from the radiation incident direction. It consists of a scintillator sheet 13 having a body 11, a first adhesive layer 12, a second support 14 and a scintillator layer 15, and these are entirely covered by a permeation prevention layer 16. In addition, the photoelectric conversion panel 20 has a configuration in which a planarization layer 21, a photoelectric conversion element layer 22, an output layer 23, and a substrate 24 are stacked in order from the radiation incident direction.

  The scintillator panel 10 and the photoelectric conversion panel 20 are bonded via an optical compensation layer 18 formed of an optical compensation material, and the outer peripheral portion of the first support 11 and the outer peripheral portion of the substrate 24 are bonded with an adhesive 25. It is adhesively bonded through.

(Scintillator panel)
Here, the scintillator panel 10 converts a radiographic image into light. As will be described later in the manufacturing method, the second support 14 is provided as a base of the scintillator layer 15, and both are used as a scintillator sheet. 13 is configured. The scintillator sheet 13 is bonded to the first support 11 with the first adhesive layer 12. The first support 11 has a function of ensuring the strength, flatness, and water vapor blocking properties of the scintillator panel 10. The penetration preventing layer 16 is provided to prevent the optical compensation material from penetrating into the gaps between the columnar crystals of the scintillator.

  Next, a specific layer configuration will be described on the right side of FIG. 2. On the scintillator layer 15 side of the second support 14, the reflection layer 17 a and the scintillator layer 15 for improving reflectance and luminance are protected. For this purpose, an undercoat layer 17b is sequentially laminated. These are additional layers, but it is desirable to add them in order to improve the performance of the device. It is better to provide at least a reflective layer.

(Scintillator layer)
The scintillator layer (also referred to as a phosphor layer) is a layer made of a scintillator (phosphor) that emits fluorescence when irradiated with radiation.

  That is, the scintillator absorbs the energy of incident radiation such as X-rays, and emits electromagnetic waves within a wavelength range of 300 nm to 800 nm, that is, electromagnetic waves (light) ranging from ultraviolet light to infrared light centering on visible light. A phosphor that emits light. In the present invention, columnar crystals are used as the scintillator. The column diameter of the columnar crystal is preferably within a range of 2.0 to 20 μm, and more preferably within a range of 3.0 to 15 μm.

  The scintillator layer includes a plurality of columnar crystals of the scintillator, and is formed side by side so that the long side direction of the plurality of columnar crystals substantially coincides with the normal direction of the second support. There is a gap made of air between them. The layer thickness of the scintillator layer is preferably in the range of 100 to 1000 μm, more preferably in the range of 120 to 800 μm, and particularly preferably in the range of 140 to 600 μm.

  In the present invention, the maximum value d of the gap distance between the columnar crystals is in the range of 0.5 to 15.0 μm. The maximum value d of the gap distance between the columnar crystals can be adjusted by controlling the support temperature during vapor deposition, adjusting the vapor deposition rate, the amount of carrier gas such as Ar, and controlling the degree of vacuum.

  The maximum value d of the gap distance between the columnar crystals is obtained by the following method. A scintillator sheet formed by forming a scintillator layer on the second support is immersed in a curable resin liquid, and the curable resin liquid is infiltrated into the gap of the scintillator. After curing, the scintillator layer is separated from the columnar crystal tip by 30 μm. At the position, it is cut in parallel with the support, and the maximum value of the gap between the columnar crystals is determined from a scanning electron micrograph of a cross section over the imaging region 250 μm × 180 μm.

  In the scanning electron micrograph, when the gap is branched in three directions, as shown in FIG. 11, the points separated by the same distance L from the periphery of the cross-sections of the columnar crystals of the three scintillators. A locus is drawn, L is changed, L is obtained when the three loci overlap, and a value obtained by doubling L is set as the maximum gap distance d.

  In FIG. 11, SC is a cross section of the columnar crystal of the scintillator, G is a gap, R is the locus at a distance L from the periphery of the cross section of the columnar crystal, and three loci R intersect at a point P. Yes.

  The filling rate of the scintillator layer is preferably in the range of 70 to 95%, more preferably in the range of 80 to 94%, and particularly preferably in the range of 85 to 92%. Here, the filling rate means a value obtained by dividing the actual mass of the scintillator layer by the theoretical density and the apparent volume. The degree of filling of the scintillator layer can be controlled by controlling the support temperature at the time of vapor deposition, or controlling the degree of vacuum by adjusting the vapor deposition rate or the amount of introduction of a carrier gas such as Ar.

  Further, the coefficient of variation of the filling rate of the scintillator layer is preferably 20% or less, more preferably 10% or less, and particularly preferably 5% or less. As a result, the brightness and sharpness can be improved, and the occurrence of image defects due to temperature fluctuations can be prevented. The coefficient of variation of the filling rate is preferably as small as possible, but is usually 0.1% or more.

  The variation coefficient of the filling rate is an index value indicating the degree of variation in the filling rate of the scintillator in the scintillator layer. The coefficient of variation of the filling rate is determined by measuring the filling rate in 100 sections generated by dividing the vertical and horizontal into 10 on the scintillator panel, and calculating the average filling rate Dav obtained from the filling rate in each measurement section and the standard deviation Ddev of the filling rate. And calculated by the following formula.

Coefficient of variation of filling degree = Ddev / Dav (%)
Here, Ddev: standard deviation of the filling rate Dav: average filling rate In order to make the variation coefficient of the filling rate 20% or less, it can be performed by controlling the arrangement of the evaporation sources used in the scintillator layer manufacturing apparatus. . For example, it can be performed by arranging a plurality of evaporation sources on the circumference of the circle, but it is more preferable that the evaporation sources are also arranged at the center of the circle. More preferably, the plurality of evaporation sources are arranged on the circumference of a plurality of concentric circles having different radii. Moreover, when forming a scintillator layer by the apply | coating method, it can carry out by controlling the slit shape of the coating device used at the time of application | coating by precision grinding | polishing.

  As a material for forming the scintillator layer, various known scintillator materials can be used, but cesium iodide (CsI) which is a cesium halide scintillator is preferable. Cesium iodide (CsI) has a relatively high conversion rate from X-rays to visible light, and since the scintillator can be easily formed into a columnar crystal structure by vapor deposition, scattering of emitted light within the crystal is suppressed by the light guide effect. The thickness of the scintillator layer (phosphor layer) can be increased.

  However, since CsI alone is not sufficient in luminous efficiency, various activators are added. For example, as shown in Japanese Patent Publication No. 54-35060, a mixture of CsI and sodium iodide (NaI) at an arbitrary molar ratio can be mentioned. Further, for example, activation of indium (In), thallium (Tl), lithium (Li), potassium (K), rubidium (Rb), sodium (Na), etc. as disclosed in JP-A-2001-59899 CsI containing material is preferred.

  In addition, the scintillator may be a columnar crystal whose tip is flattened. In that case, the unevenness of the surface of the penetration preventing layer is reduced, and there is an advantage that the coating uniformity of the optical compensation material is improved.

  Moreover, as a raw material for forming a CsI scintillator layer containing thallium, an additive containing one or more types of thallium compounds and cesium iodide are preferably used. Thallium activated cesium iodide (CsI: Tl) is preferable because it has a broad emission wavelength from 400 nm to 750 nm.

As the thallium compound containing one or more types of thallium compounds, various thallium compounds (compounds having oxidation numbers of + I and + III) can be used. Preferred thallium compounds are thallium iodide (TlI), thallium bromide (TlBr), thallium chloride (TlCl), or thallium fluoride (TlF, TlF ₃ ).

  Further, the melting point of the thallium compound (melting point under normal temperature and normal pressure) is preferably in the range of 400 to 700 ° C. from the viewpoint of luminous efficiency. Moreover, it is preferable that the molecular weight of a thallium compound exists in the range of 206-300.

  In the scintillator layer, it is desirable that the content of the activator is an optimal amount according to the target performance, but it is within a range of 0.01 to 20 mol% with respect to the content of cesium iodide. Is preferable, and it is more preferable that it is in the range of 0.05 to 5 mol%.

Furthermore, in the present invention, various types other than the above-described CsI: Tl can be used. As another example,
Basic Composition Formula (I): M (I) X · aM (II) X ′ ₂ · bM (III) X ″ ₃ : zA
An alkali metal halide scintillator represented by the following can be used.

  In the above formula, M (I) represents at least one alkali metal selected from the group consisting of Li, Na, K, Rb and Cs, and M (II) represents Be, Mg, Ca, Sr, Ba, Ni, It represents at least one alkaline earth metal or divalent metal selected from the group consisting of Cu, Zn and Cd, and M (III) is Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd. Represents at least one rare earth element or trivalent metal selected from the group consisting of Tb, Dy, Ho, Er, Tm, Yb, Lu, Al, Ga and In.

  X, X ′ and X ″ each represent at least one halogen selected from the group consisting of F, Cl, Br and I, and A represents Y, Ce, Pr, Nd, Sm, Eu, Gd, Represents at least one rare earth element or metal selected from the group consisting of Tb, Dy, Ho, Er, Tm, Yb, Lu, Na, Mg, Cu, Ag, Tl, and Bi. Respective numerical values are in the range of 0 ≦ a <0.5, 0 ≦ b <0.5, and 0 <z <1.0.

Further, MI in the basic composition formula (I) preferably contains at least Cs, X preferably contains at least I, and A is particularly preferably Tl or Na. z is preferably a numerical value within the range of 1 × 10 ⁻⁴ ≦ z ≦ 0.1.

Also,
Basic composition formula (II): MIIFX: zLn
A rare earth activated alkaline earth metal fluoride halide scintillator represented by

  In the above formula, MII represents at least one alkaline earth metal selected from the group consisting of Ba, Sr and Ca, Ln is Ce, Pr, Sm, Eu, Tb, Dy, Ho, Nd, Er, Tm and It represents at least one rare earth element selected from the group consisting of Yb. X represents at least one halogen selected from the group consisting of Cl, Br and I. Z represents a numerical value within a range of 0 <z ≦ 0.2. In addition, as MII in said formula, it is preferable that Ba accounts for half or more. Ln is particularly preferably Eu or Ce.

In addition, LnTaO ₄ : (Nb, Gd), Ln ₂ SiO ₅ : Ce, LnOX: Tm (Ln is a rare earth element), Gd ₂ O ₂ S: Tb, Gd ₂ O ₂ S: Pr, Ce, ZnWO ₄ , LuAlO ₃ : Ce, Gd ₃ Ga ₅ O ₁₂ : Cr, Ce, HfO _{2 and the} like can be mentioned.

(Penetration prevention layer)
When the photoelectric conversion panel and the scintillator panel are bonded, the space between them is filled with an optical compensation material. This improves the sharpness of the image. However, when the optical compensation material penetrates between the columnar crystals of the scintillator, air pushed out from the gap between the columnar crystals generates bubbles in the optical compensation material between the photoelectric conversion panel and the scintillator panel, and sharpness is remarkably high. descend. Even if the optical compensation material is a room temperature curable resin or a thermosetting resin, bubbles are generated because the fluidity is high immediately after the photoelectric conversion panel and the scintillator panel are bonded.

  The penetration preventing layer prevents the optical compensation material from penetrating between the columnar crystals of the scintillator. The permeation prevention layer has a function of preventing the scintillator layer from being damaged by receiving external force and a function of preventing corrosion of the photoelectric conversion element caused by contact between the scintillator and the photoelectric conversion panel.

The average layer thickness t of the permeation preventing layer at the tip of the columnar crystal of the scintillator layer and the maximum value d of the gap distance between the columnar crystals satisfy the following formula (1).
Formula (1) d / 2 <= t <= 8micrometer
[Wherein, t is the average layer thickness of the permeation preventing layer at the tip of the columnar crystal of the scintillator layer, d is the maximum value of the gap distance between the columnar crystals, and is in the range of 0.5 to 15.0 μm. is there. ]
When the average layer thickness t is 8 μm or less, the distance between the scintillator and the photoelectric conversion element is short, and it is possible to prevent the light from diffusing before reaching the photoelectric conversion element and reducing sharpness.

  By setting the average layer thickness t to d / 2 or more, as shown in FIG. 3, it is possible to cover the gap near the tip of the columnar crystal and prevent the optical compensation material from penetrating into the gap. .

  The permeation prevention layer can be formed using various materials, such as a metal oxide vapor deposition layer, a metal vapor deposition layer, an organic thin layer by a CVD method, etc. An organic thin layer by a CVD method is preferable because a uniform layer is formed along the unevenness.

  Examples of the organic thin layer include polyparaxylylene, polymonochloroparaxylylene, polydichloroparaxylylene, polytetrachloroparaxylylene, polyfluoroparaxylylene, polydimethylparaxylylene, and polydiethylparaxylylene. Preferably used.

  Most preferably, the polyparaxylylene layer is formed by a CVD method. That is, as shown in FIG. 2, a polyparaxylylene layer can be formed on the entire surface of the scintillator sheet 13 and the first support 11 to form the permeation prevention layer 16. The polyparaxylylene layer formed by the CVD method is suitable as the penetration preventing layer according to the present invention because it has an excellent ability to prevent penetration of the optical compensation material.

  Further, among the organic thin layers formed by the CVD method, the polyparaxylylene layer can form a layer having a uniform thickness even when the deposition surface has irregularities. FIG. 3A shows a state in which the permeation preventing layer (organic thin layer) 2 having a thickness t covers the columnar crystal 3 of the scintillator with a uniform layer thickness at the tip. The optical compensation material 1 is in contact with the columnar crystal covered with the organic thin layer. The thickness of the permeation preventive layer is substantially the same at the tip of the columnar crystal and the side portion of the columnar crystal (within a range of ± 30% with respect to the tip or side portion), so that t is between the adjacent columnar crystals. When it reaches 1/2 of the maximum value d of the gap distance, the gap between the columnar crystals is closed.

  When the thickness t of the permeation preventing layer is larger than ½ of the maximum value d of the gap distance between adjacent columnar crystals, as shown in FIG. 3B, the vicinity of the tip portion far from the columnar crystal support Only the thickness t increases. Two or more layers of the same material may be laminated, or different types of materials may be laminated.

  If the average layer thickness t of the permeation preventing layer at the tip of the columnar crystal of the scintillator layer is 8 μm or less, good sharpness is obtained, but if it is 5 μm or less, the sharpness of the image is further improved, which is preferable. If d is 15 μm or less, good sharpness can be obtained. If d is 10 μm or less, it is preferable for further improving the sharpness of the image.

  The average layer thickness t of the permeation preventive layer at the tip of the columnar crystal is a value determined by the following method.

  A scintillator sheet produced by forming a scintillator layer on the second support is immersed in the curable resin liquid, and the curable resin liquid is infiltrated into the gaps of the scintillator. After curing, the scintillator layer is placed perpendicular to the support. After cutting, the average layer thickness t of the penetration preventing layer is determined from a scanning electron micrograph.

  The columnar crystal is a crystal grown substantially perpendicular to the surface of the support, and the side surface of the columnar crystal is perpendicular to the surface of the support. Here, the tip of the columnar crystal refers to a portion farthest from the support of each columnar crystal in a scanning electron micrograph of a cross section perpendicular to the support.

In addition to the CVD method, the permeation prevention layer may be formed by laminating inorganic substances such as SiC, SiO ₂ , SiN, Al ₂ O ₃ by a vapor deposition method or a sputtering method. Epoxy-based, polyimide-based, silicone-based, and polyparaxylylene-based materials may be used.

(Filler)
Further, when the permeation preventing layer itself penetrates deeply between the columnar crystals, light is diffused between the columnar crystals via the permeation preventing layer and sharpness is lowered. In such a case, before coating the penetration preventing layer, a filler may be dispersed on the scintillator or a fiber sheet may be attached. Sharpness can be further improved by blocking the gap between the columnar crystals by the filler or fiber sheet fiber and preventing the penetration preventing layer from penetrating deeply into the gap between the columnar crystals.

As the filler used in the present invention, a known inorganic powder or organic powder can be appropriately selected and used. Examples of the inorganic powder include titanium oxide, boron nitride, SnO ₂ , SiO ₂ , Cr ₂ O ₃ , α-Al ₂ O ₃ , α-Fe ₂ O ₃ , α-FeOOH, SiC, cerium oxide, corundum, artificial diamond, Examples include aragonite, garnet, mica, silica, silicon nitride, and silicon carbide. Examples of the organic powder include powders such as three-dimensionally crosslinked polymethyl methacrylate, polystyrene, and Teflon (registered trademark). These inorganic powders may be surface-treated.

  The average particle size of the organic or inorganic powder used as the filler is usually in the range of 0.5 to 8.0 μm, preferably in the range of 1.0 to 6.0 μm, more preferably 2.0 to It is in the range of 5.0 μm. Moreover, when adding several types of powder, you may use both methods together.

(Fiber sheet)
As the fiber sheet used in the present invention, a known thin fiber sheet can be appropriately selected and used. For example, a cellulose nanofiber sheet may be used.

  The film thickness of the fiber sheet is usually in the range of 0.5 to 100 μm, preferably in the range of 2.0 to 50 μm, and more preferably in the range of 5.0 to 30 μm. The wire diameter of the fiber sheet is usually within a range of 0.003 to 5.0 μm, preferably within a range of 0.01 to 1.0 μm, and more preferably within a range of 0.05 to 0.2 μm. .

  The haze ratio of the penetration preventing layer is preferably 3% or more and 40% or less, and more preferably 3% or more and 10% or less in consideration of sharpness, radiation image unevenness, manufacturing stability, workability, and the like. It is more preferable. The haze ratio is an index representing the degree of cloudiness (the larger the numerical value, the greater the degree of cloudiness), and is a value represented by the ratio (%) of the scattered light transmittance to the total light transmittance.

  The light transmittance of the permeation prevention layer is preferably in the range of 70 to 99%. In consideration of photoelectric conversion efficiency, scintillator emission wavelength, etc., it is preferably 70% or more at 550 nm, and can be easily realized industrially if it is 99% or less.

(Optical compensation material)
The photoelectric conversion panel 20 is attached to the scintillator layer 15 side of the scintillator panel 10 via an optical compensation material (matching oil). Specifically, the scintillator layer 15 of the photoelectric conversion panel is covered with the penetration preventing layer 16, and the planarization layer 21 is provided on the surface of the photoelectric conversion panel, and the optical compensation material is the penetration preventing layer 16 and the planarization layer. The optical compensation layer 18 is formed so as to fill the gap between the optical compensation layer 21 and the optical compensation layer 21.

  When the optical compensation material does not fill the gap, the difference in refractive index between the permeation prevention layer and air is large, so that the light reaching the permeation prevention layer from the scintillator is reflected or scattered at the interface between the permeation prevention layer and air. Arise. Further, the light emitted from the penetration preventing layer to the gap is reflected at the interface because the difference in refractive index between the air and the flattening layer is large.

  The optical compensation material has a refractive index close to the refractive index of the penetration preventing layer of the scintillator and the refractive index of the flattening layer of the photoelectric conversion panel, and the light generated by the scintillator is reflected or scattered at the interface with the air layer. And is taken into the photoelectric conversion panel with high efficiency and has an effect of improving the sharpness of the image.

  The optical compensation material is preferably made of a thermosetting or room temperature curable resin. As the thermosetting or room temperature curable resin, for example, an acrylic resin, an epoxy resin, a silicone resin, or the like is preferably used.

  Further, the optical compensation layer can be formed of a transparent liquid or a gel substance instead of being formed of a solid such as a cured resin. Also in this case, the optical compensation layer made of a liquid or a gel substance can be formed in close contact with at least the permeation prevention layer of the scintillator plate and the surface of the planarization layer of the photoelectric conversion panel.

  In particular, a rubber-based adhesive can be used as a material for forming the adhesive resin optical compensation layer having elasticity. As the resin of the rubber adhesive, for example, a block copolymer such as styrene-isoprene-styrene, a synthetic rubber adhesive such as polybutadiene or polybutylene, natural rubber, or the like can be used. As a commercially available rubber-based adhesive, for example, one-pack RTV rubber KE420 (manufactured by Shin-Etsu Chemical Co., Ltd.) is suitable.

  Also, adhesive optical grease or the like can be used for the scintillator plate and the planar light receiving element. Any known material can be used as long as it is highly transparent and sticky. As the commercially available optical grease, for example, silicone oil KF96H (1 million CS: manufactured by Shin-Etsu Chemical Co., Ltd.) is suitable.

  On the other hand, the optical compensation layer has a refractive index that is greater than or equal to the smaller refractive index of the refractive index of the permeation prevention layer of the scintillator plate and the refractive index of the planarization layer of the photoelectric conversion panel. It is preferable to form so that it may become a rate. In the above, the refractive index of the penetration preventing layer is preferably smaller than the refractive index of the scintillator.

  In the present invention, as described above, polyparaxylylene is used as a preferable penetration preventing layer, and its refractive index is 1.6. An acrylic resin is preferably used as the resin for forming the planarization layer, but its refractive index is about 1.5. Therefore, in the present invention, the optical compensation layer is preferably formed so that its refractive index n is in the range of 1.5 to 1.7.

  The light emitted from the scintillator layer of the scintillator plate by radiation irradiation reaches the photoelectric conversion element through the optical compensation layer together with the permeation prevention layer and the planarization layer, so the optical compensation layer is transparent and transmits light. It is preferable that the transmittance is 90% or higher.

  In addition, when the optical compensation material forming the optical compensation layer is, for example, a material that easily shrinks when cured, or a material that easily expands at a high temperature, the optical compensation layer shrinks or expands. In this case, a force is applied in the plane direction to the phosphor columnar crystal of the scintillator plate. And the possibility that a columnar crystal will be destroyed by the force arises. Therefore, it is preferable to use a material having a low curing shrinkage rate and a low linear expansion coefficient as the optical compensation material for forming the optical compensation layer.

(Support)
The scintillator panel support according to the present invention preferably includes a first support and a second support, and the two supports are bonded to each other with an adhesive or an adhesive. Examples of the material constituting the second support include, for example, (1) carbon (amorphous carbon, charcoal and paper hardened by carbonization, etc.), (2) resin (carbon fiber reinforced plastic [CFRP: Carbon Fiber Reinforced Plastics, Glass Fiber Reinforced Plastics, etc.) (3) Glass, (4) Metal, (5) A foamed resin formed from the above (1) to (4) thinly. However, a resin is preferable from the viewpoint of X-ray transmittance, and polyimide is particularly preferable from the viewpoint of heat resistance. These may be used alone or in layers.

  A scintillator sheet having a scintillator layer formed on a second support is called a scintillator sheet. The first support is bonded to the surface of the scintillator sheet where the scintillator layer is not formed (the surface of the second support), and the scintillator layer is formed on the support having the second support and the first support. It is preferable to produce a scintillator sheet laminate having the formed structure.

  The first support is provided to reinforce the scintillator panel or to block external water vapor, and the material constituting the first support is the same material as the material listed as the material constituting the second support. In particular, a glass plate is preferably used, and the glass plate forms a glass layer of the support.

  Further, the first support body is made larger than the scintillator sheet, and the scintillator sheet is bonded to the center portion of the first support body, whereby the first support body (the outer peripheral portion of the support body) around the outside of the scintillator sheet ) Can be used as glue margin for application of adhesive.

  In the scintillator panel having a support, a scintillator layer, and a permeation preventive layer, the outer peripheral portion refers to a region having no scintillator layer surrounding the scintillator layer in the surface provided with the scintillator layer.

(Undercoat layer / reflective layer)
In order to improve the adhesion between the support and the scintillator layer, an undercoat layer is preferably provided between the second support and the scintillator layer. Furthermore, when providing a reflective layer, it is preferable to provide a reflective layer between the undercoat layer and the second support. One layer may serve as both the undercoat layer and the reflective layer.

  The binder constituting the undercoat layer may be an easily adhesive polymer such as polyurethane, vinyl chloride copolymer, vinyl chloride-vinyl acetate copolymer, vinyl chloride-vinylidene chloride copolymer, vinyl chloride-acrylonitrile copolymer. Polymer, butadiene-acrylonitrile copolymer, polyamide resin, polyvinyl butyral, polyester, cellulose derivative (nitrocellulose, etc.), styrene-butadiene copolymer, various synthetic rubber resins, phenol resin, epoxy resin, urea resin, melamine resin , Phenoxy resin, silicone resin, acrylic resin, urea formamide resin and the like. Among them, it is preferable to use polyurethane, polyester, silicone resin, acrylic resin or polyvinyl butyral. Moreover, these binders can also be used in mixture of 2 or more types.

  The glass transition temperature (Tg) of the binder is preferably 100 ° C. or less from the viewpoint of improving the adhesion between the support and the scintillator layer.

  In the present invention, the undercoat layer may be formed by applying and drying a binder dissolved or dispersed in a solvent, and may form a polyparaxylylene resin layer by a CVD method. Although there is no restriction | limiting in particular about the application | coating system of an undercoat layer, For example, general systems, such as a gravure, die | dye, comma, bar, dip, spray, spin, can be used.

  Solvents that can be used to prepare the undercoat layer include lower alcohols such as methanol, ethanol, n-propanol and n-butanol, hydrocarbons containing chlorine atoms such as methylene chloride and ethylene chloride, acetone, methyl ethyl ketone, and methyl isobutyl ketone. Such as ketones, toluene, benzene, cyclohexane, cyclohexanone, xylene and other aromatic compounds, methyl acetate, ethyl acetate, butyl acetate and other lower fatty acid and lower alcohol esters, dioxane, ethylene glycol monoethyl ester, ethylene glycol monomethyl ester , Ethers such as methoxypropanol propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate and mixtures thereof. .

  The thickness of the undercoat layer is preferably in the range of 0.1 to 10 μm, and more preferably in the range of 0.5 to 5 μm. When the thickness of the undercoat layer is 0.5 μm or more, the adhesion to the scintillator is improved, and when the thickness of the undercoat layer is 5 μm or less, light scattering in the undercoat layer is suppressed and sharpness is improved. Will improve. The undercoat layer may contain a pigment or a dye to prevent scattering of light emitted from the phosphor (scintillator) and improve sharpness and the like.

  It is preferable to have a reflective layer on at least the surface of the support on which the scintillator layer is deposited. By providing the reflective layer, the light emitted from the scintillator can be taken out very efficiently, and the luminance is dramatically improved. The surface reflectance of the reflective layer is preferably 80% or more, more preferably 90% or more.

The material constituting the reflective layer contains a metal material such as aluminum, silver, platinum, palladium, gold, copper, iron, nickel, chromium, cobalt, stainless steel or a metal oxide such as SiO ₂ or TiO ₂ . It is preferable. Of these, aluminum, silver or TiO ₂ is the main component from the viewpoints of reflectance and corrosion resistance. Two or more such reflective layers may be formed.

  The method of coating the metal on the support is not particularly limited, such as vapor deposition, sputtering, or bonding of metal foil, but sputtering is most preferable from the viewpoint of adhesion.

  In order to improve the adhesion between the support and the reflective layer, an intermediate layer can be provided between the support and the reflective layer. As a material constituting the intermediate layer, a different metal layer different from the reflective layer may be provided in addition to a general easy-adhesive polymer. As the dissimilar metal layer, for example, it is preferable to use at least one kind of metal selected from nickel, cobalt, chromium, palladium, titanium, zirconium, molybdenum and tungsten, and among them, nickel or chromium is used alone or in combination. More preferably it is used.

  The thickness of the reflective layer is preferably in the range of 0.005 to 0.3 μm, more preferably in the range of 0.01 to 0.2 μm, from the viewpoint of the emission light extraction efficiency.

In the present invention, an enhanced reflection layer made of a metal oxide such as SiO ₂ or TiO ₂ may be provided for improving the reflectance. In the present invention, the coating type reflective layer comprises at least light scattering particles and a binder.

Examples of the light scattering particles include TiO ₂ (anatase type, rutile type), MgO, PbCO ₃ .Pb (OH) ₂ , BaSO ₄ , Al ₂ O ₃ , M (II) FX (however, M (II) is At least one atom selected from Ba, Sr, and Ca atoms, and X is a Cl atom or a Br atom.), CaCO ₃ , ZnO, Sb ₂ O ₃ , SiO ₂ , ZrO ₂ , lithopone (BaSO ₄ -White pigments such as ZnS), magnesium silicate, basic silicate, basic lead phosphate, aluminum silicate can be used. Of these white pigments, TiO ₂ has a strong hiding power and a high refractive index, so it reflects light and refracts, thereby easily scattering the light emitted from the scintillator and significantly improving the sensitivity of the resulting radiation image conversion panel. Can be made.

  These substances may be used alone or in combination.

  As the crystal structure of titanium oxide, either a rutile type or an anatase type can be used, but a rutile type is preferable because it has a large ratio to the refractive index of the resin and can achieve high luminance.

  Specific examples of titanium oxide include CR-50, CR-50-2, CR-57, CR-80, CR-90, CR-93, CR-95, and CR-97 manufactured by the hydrochloric acid method. , CR-60-2, CR-63, CR-67, CR-58, CR-58-2, CR-85, R-820, R-830, R-930, R-550 manufactured by the sulfuric acid method , R-630, R-680, R-670, R-580, R-780, R-780-2, R-850, R-855, A-100, A-220, W-10 : Ishihara Sangyo Co., Ltd.).

  The primary particle size of titanium oxide is preferably in the range of 0.1 to 0.5 μm, and more preferably in the range of 0.2 to 0.3 μm. Further, as titanium oxide, those that have been surface-treated with oxides such as Al, Si, Zr, and Zn for improving the affinity and dispersibility with the polymer and suppressing deterioration of the polymer are particularly preferable.

  As a material constituting the reflective layer by mixing with light scattering particles, an easily adhesive polymer such as polyurethane, vinyl chloride copolymer, vinyl chloride-vinyl acetate copolymer, vinyl chloride-vinylidene chloride copolymer, Vinyl chloride-acrylonitrile copolymer, butadiene-acrylonitrile copolymer, polyamide resin, polyvinyl butyral, polyester, cellulose derivative (nitrocellulose, etc.), styrene-butadiene copolymer, various synthetic rubber resins, phenol resin, epoxy resin , Urea resin, melamine resin, phenoxy resin, silicone resin, acrylic resin, urea formamide resin, and the like.

  Among them, it is preferable to use polyurethane, polyester, silicone resin, acrylic resin or polyvinyl butyral. Moreover, these binders can also be used in mixture of 2 or more types.

  In the present invention, the coating-type reflective layer can be formed by coating and drying a composition containing at least light scattering particles, a binder, and a solvent. Although there is no restriction | limiting in particular about an application | coating system, For example, general systems, such as a gravure, die | dye, comma, bar, dip, spray, spin, can be used.

  Solvents used for preparing the reflective layer include lower alcohols such as methanol, ethanol, n-propanol and n-butanol, hydrocarbons containing chlorine atoms such as methylene chloride and ethylene chloride, ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone, toluene , Aromatic compounds such as benzene, cyclohexane, cyclohexanone, xylene, esters of lower fatty acids and lower alcohols such as methyl acetate, ethyl acetate, butyl acetate, dioxane, ethylene glycol monoethyl ester, ethylene glycol monomethyl ester, methoxypropanol propylene glycol Mention may be made of ethers such as monomethyl ether, propylene glycol monomethyl ether acetate and mixtures thereof.

  A dispersant may be used to improve the dispersibility of titanium oxide. As the dispersant, for example, polyhydric alcohols, amines, silicones, or surfactants can be used.

  The thickness of the reflective layer is preferably in the range of 10 to 500 μm. If the thickness of the reflective layer is 10 μm or more, high luminance can be obtained, and if it is 500 μm or less, the smoothness of the reflective layer surface is excellent.

  Titanium oxide is preferably included in the reflective layer in the range of 40 to 95% by mass, and particularly preferably in the range of 60 to 90% by mass. If it is 40% by mass or more, the luminance is high, and if it is 95% by mass or less, the adhesion to the support or the scintillator layer is good.

(Production method of scintillator panel)
A specific example of a manufacturing method for manufacturing the scintillator panel 10 of the present invention will be described with reference to the drawings.

  First, as a preparation step, a reflective layer 17a, an undercoat layer 17b, and the like are sequentially formed on the second support 14 as necessary. The material and manufacturing method of each layer are as described above.

  Next, a scintillator layer is formed. Prior to the description, a vapor deposition apparatus for forming the scintillator layer will be described.

  FIG. 4 is a diagram showing a schematic configuration of the vapor deposition apparatus 61. As shown in FIG. 4, the vapor deposition apparatus 61 includes a vacuum container 62, and the vacuum container 62 includes a vacuum pump 66 that exhausts the inside of the vacuum container 62 and introduces the atmosphere.

  A substrate holder 64 for holding the support B (second support 14 shown in FIG. 2) is provided near the upper surface inside the vacuum vessel 62.

  A scintillator layer is formed on the surface of the support B by a vapor deposition method. As the vapor deposition method, a vapor deposition method, a sputtering method, a CVD method, an ion plating method, or the like can be used. In the present invention, the vapor deposition method is particularly preferable.

  The substrate holder 64 is configured to hold the support B so that the surface of the support B on which the scintillator layer is formed faces the bottom surface of the vacuum vessel 62 and is parallel to the bottom surface of the vacuum vessel 62. .

  The substrate holder 64 is preferably provided with a heater (not shown) for heating the support B. By heating the support B with this heater, the adhesion of the support B to the substrate holder 64 is enhanced and the layer quality of the scintillator layer is adjusted. Further, the adsorbate on the surface of the support B is removed and removed, and an impurity layer is prevented from being generated between the surface of the support B and a scintillator layer described later.

  Moreover, you may have a mechanism (not shown) for circulating a heating medium or a heating medium as a heating means. This means is suitable for the case where vapor deposition is performed while maintaining the temperature of the support B at a relatively low temperature such as within the range of 50 to 150 ° C. during the vapor deposition of the phosphor.

  Moreover, you may have a halogen lamp (not shown) as a heating means. This means is suitable for the case where vapor deposition is performed while maintaining the temperature of the support B at a relatively high temperature such as 150 ° C. or higher during the vapor deposition of the phosphor.

  Further, the substrate holder 64 is provided with a substrate rotation mechanism 65 that rotates the support B in the horizontal direction. The substrate rotation mechanism 65 includes a substrate rotation shaft 67 that supports the substrate holder 64 and rotates the support B, and a motor (not shown) that is disposed outside the vacuum vessel 62 and serves as a drive source for the substrate rotation shaft 67. Has been.

  Further, near the bottom surface inside the vacuum vessel 62, evaporation sources 63 a and 63 b are arranged at positions facing each other on the circumference of a circle centering on the center line perpendicular to the support B. In this case, the distance between the support B and the evaporation sources 63a and 63b is preferably in the range of 100 to 1500 mm, and more preferably in the range of 200 to 1000 mm. Further, the distance between the center line perpendicular to the support B and the evaporation sources 63a and 63b is preferably in the range of 100 to 1500 mm, more preferably in the range of 200 to 1000 mm.

  In the vapor deposition apparatus of the present invention, it is possible to provide three or more evaporation sources, and each evaporation source may be arranged at equal intervals or at different intervals. Further, the radius of a circle centered on the center line perpendicular to the support B can be arbitrarily determined. In the present invention, it is preferable that a plurality of evaporation sources are arranged on the circumference of a circle. However, the evaporation source 63c is also arranged at the center of the circle, and a plurality of evaporation sources are arranged on a plurality of concentric circles. Thus, even when used for a large panel such as an FPD, the coefficient of variation of the scintillator filling rate of the scintillator layer can be 20% or less, and impact resistance and moisture resistance can be improved.

  The evaporation sources 63a and 63b contain phosphors and are heated by a resistance heating method. Therefore, the evaporation sources 63a and 63b may be composed of an alumina crucible around which a heater is wound, or a boat or a heater made of a refractory metal. Also good. In addition to the resistance heating method, the method of heating the phosphor may be a method such as heating by an electron beam or heating by high frequency induction, but in the present invention, it is easy to handle with a relatively simple configuration, is inexpensive, and is extremely In view of the fact that it can be applied to many substances, a method in which a current is directly applied and resistance heating is performed, and a method in which a crucible is indirectly resistance heated with a surrounding heater is preferable. Further, the evaporation sources 63a and 63b may be molecular beam sources by a molecular source epitaxial method.

  Further, a shutter 68 that blocks the space from the evaporation sources 63a and 63b to the support B is provided between the evaporation sources 63a and 63b and the support B so as to be openable and closable in the horizontal direction. In the evaporation sources 63a and 63b, substances other than the target attached to the surface of the phosphor can be prevented from evaporating at the initial stage of vapor deposition and adhering to the support B.

  According to the manufacturing method using the vapor deposition apparatus 61 described above, by providing a plurality of evaporation sources 63a and 63b, the overlapping portions of the vapor flows of the evaporation sources 63a and 63b are rectified and vapor deposited on the surface of the support B, which will be described later. The crystallinity of the scintillator can be made uniform. At this time, as the number of evaporation sources is increased, the vapor flow is rectified at more locations, so that the crystallinity of the scintillator can be made uniform in a wider range. In addition, by disposing the evaporation sources 63a and 63b on the circumference of a circle centering on the center line perpendicular to the support B, the effect that the crystallinity becomes uniform due to the rectification of the vapor flow can be obtained. Can be obtained isotropically on the surface.

  Further, the phosphor can be uniformly deposited on the surface of the support B by performing vapor deposition of the phosphor described later while rotating the support B by the substrate rotating mechanism 65.

  A scintillator layer is formed by the vapor deposition apparatus 61 described above. First, the second support 14 (having the reflective layer 17a, the undercoat layer 17b, etc.) prepared in the preparation step is attached to the substrate holder 64. Further, in the vicinity of the bottom surface of the vacuum vessel 62, evaporation sources 63a and 63b are arranged on the circumference of a circle centering on the center line perpendicular to the second support 14, and the phosphors (cesium iodide and cesium iodide) to be evaporated are arranged. A mixture containing thallium iodide).

  Next, the vacuum pump 66 is operated to evacuate the inside of the vacuum vessel 62, and the inside of the vacuum vessel 62 is brought to a vacuum atmosphere of 0.1 Pa or less. Here, “under vacuum atmosphere” means under a pressure atmosphere of 100 Pa or less, and preferably under a pressure atmosphere of 0.1 Pa or less.

  Thereafter, an inert gas such as argon is introduced into the vacuum vessel 62, and the inside of the vacuum vessel 62 is maintained in a vacuum atmosphere within a range of 0.1 Pa to 5 Pa. Then, the heater of the substrate holder 64 and the motor of the substrate rotation mechanism 65 are driven to heat the second support 14 as the support B attached to the substrate holder 64 in a state of facing the evaporation source 63. Rotate.

  In this state, a current is passed from the electrode to the evaporation source 63, and the mixture containing cesium iodide and thallium iodide is heated within a range of 700 to 800 ° C. for a predetermined time to evaporate the mixture. As a result, innumerable columnar crystals are sequentially grown on the surface of the second support 14 to form the scintillator layer 15 having a desired thickness.

  As temperature which heats a vapor deposition source, the inside of the range of 500-800 degreeC is preferable, and especially the inside of the range of 630-750 degreeC is preferable. The support temperature is preferably within the range of 100 to 250 ° C, and particularly preferably within the range of 150 to 250 ° C. By setting the support temperature within this range, the shape of the columnar crystal is improved and the luminance characteristics are improved.

It is possible to form the scintillator layer by performing the process of growing the scintillator on the surface of the second support 14 in a plurality of times. In the vapor deposition method, the vapor deposition target may be cooled or heated as necessary during vapor deposition. Furthermore, the scintillator layer may be heat-treated (annealed) after the vapor deposition. In the vapor deposition method, reactive vapor deposition may be performed in which vapor deposition is performed by introducing a gas such as O ₂ or H ₂ as necessary.

(Photoelectric conversion panel)
The photoelectric conversion panel 20 is provided on the surface opposite to the radiation incident surface of the scintillator panel 10, and in order from the scintillator panel 10 side, a planarization layer 21, a photoelectric conversion element layer 22, an image signal output layer 23, And a substrate 24.

  The planarization layer 21 is a buffer layer when the scintillator panel 10 and the photoelectric conversion panel 20 are in close contact with each other or bonded together.

  Next, a description will be given using the right side of FIG. The photoelectric conversion element layer 22 includes at least a transparent electrode 22a, a charge generation layer 22b that is excited by electromagnetic waves transmitted through the transparent electrode 22a to generate light, and a counter electrode that is a counter electrode for the transparent electrode 22a. The electrodes 22c are arranged in this order from the flattening layer 21 side.

(substrate)
Examples of the substrate of the photoelectric conversion panel include ceramics, glass, and plastic. Among these, a glass plate is particularly preferable from the viewpoints of scintillator protection from external forces, water vapor barrier properties, flatness, and ultraviolet light transmittance. The glass plate knows to form a glass layer of the substrate. If the substrate is a glass plate, and if it is UV transparent, when the photoelectric conversion panel and the scintillator panel are bonded using an ultraviolet curable adhesive, the adhesive is cured by irradiating the photoelectric conversion panel with UV light. can do.

  The thickness of the substrate is preferably in the range of 0.1 to 1.0 mm. Furthermore, 0.2 mm or more is preferable from the viewpoint of scintillator protection and planarity. Moreover, 0.6 mm or less is preferable from a viewpoint of the handleability of a radiographic image detector.

  Next, the operation of the radiation image detector 100 will be described. First, the radiation incident on the radiation image detector 100 enters from the scintillator panel 10 side of the radiation image detector 100 toward the photoelectric conversion panel 20 side. The scintillator layer 15 in the scintillator panel 10 absorbs radiation energy and emits electromagnetic waves (light) corresponding to the intensity. Of the emitted electromagnetic wave, the electromagnetic wave incident on the photoelectric conversion panel 20 passes through the planarization layer 21 and the transparent electrode 22a of the photoelectric conversion panel 20, and reaches the charge generation layer 22b. Then, the electromagnetic wave is absorbed in the charge generation layer 22b, and a hole-electron pair (charge separation state) is formed according to the intensity.

  Thereafter, the generated charges (holes and electrons) are carried to different electrodes (transparent electrode 22a and counter electrode 22c) by an internal electric field generated by application of a bias voltage by the power supply unit 160 of the radiation image detector 100, and photocurrent It flows as.

  Holes carried to the counter electrode 22c side are accumulated in a capacitor provided in the image signal output layer 23, and the accumulated holes drive a transistor connected to the capacitor to output an image signal. The output image signal is stored in the memory unit 130.

(Dampproof means)
The moisture-proof means encloses the scintillator layer and seals the scintillator layer from the outside air. Since the permeation preventive layer is thin, even if the permeation preventive layer alone does not provide sufficient moisture resistance, the provision of the above moisture preventive means prevents external water vapor from entering the scintillator layer. The moisture-proof means may be formed by (1) covering the entire substrate, photoelectric conversion element layer, planarization layer and scintillator panel with an organic thin layer by CVD, or (2) sandwiching the scintillator layer 2 You may form by sealing the outer peripheral part of the sheet | seat of water vapor | steam barrier of a sheet | seat with an adhesive agent.

  In said (2), the said 2 board can use the board which has the material similar to the material mentioned as a material which comprises a said 2nd support body. Furthermore, it is preferable that one of the two plates is a scintillator panel support. The other of the two plates is preferably a photoelectric conversion panel or its substrate. It is preferable to serve as a moisture-proof means and a support or a substrate because the structure of the radiation image detector can be simplified and the manufacturing efficiency can be improved.

  The adhesive used in (2) is preferably a thermosetting adhesive or a photocurable adhesive from the viewpoint of durability. Among these, a photocurable adhesive is preferable because it can be cured and fixed without bonding and moving the scintillator panel and the photoelectric conversion panel, no positional deviation occurs, and there is no deterioration of the scintillator or the photoelectric conversion element.

  Examples of the photocurable adhesive include epoxy adhesives and acrylic adhesives, and acrylic adhesives are preferable because they have high photosensitivity and can shorten the irradiation time.

(Manufacturing method of radiation image detector)
Next, an example of a method for manufacturing the radiation image detector according to the present embodiment will be described below. The radiation image detector 100 is manufactured according to the following (Process 1) and (Process 2).

(Process 1)
S1: Adhesive placement step, S2: Photoelectric conversion panel placement step, S3: Scintillator panel placement step, S4: Film placement step, S5: Decompression bonding step (Process 2)
S1: Adhesive placement step, S2: Photoelectric conversion panel placement step, S3: Scintillator panel placement step, S4: Film placement step, S5: Decompression bonding step, S6: Adhesive curing step, S7: Sealing step There are roughly two methods for manufacturing the radiation image detector 100. First, according to the process 1, the radiation image detector 100 is manufactured by placing the scintillator panel 10 on the photoelectric conversion panel 20. How to do will be described.

  In the following description, an example in which the substrate on the outer peripheral portion of the photoelectric conversion panel and the support on the outer peripheral portion of the scintillator panel are bonded with an adhesive will be described. However, the photoelectric conversion element layer 22 and the planarizing layer 21 have high strength. When the moisture permeability is low, the outer peripheral portion of the photoelectric conversion panel and the support of the outer peripheral portion of the scintillator panel may be bonded instead of the substrate.

  In the present embodiment, in manufacturing the radiation image detector 100, a chamber 30 having a base 31, a film 32, and a lid member 33 as shown in FIG. 5 is used.

  O-ring-shaped seal members 34 a and 34 b are respectively disposed on the side surfaces of the base 31 and the lid member 33 of the chamber 30. The seal members 34 a of the base 31 and the seal member 34 b of the lid member 33 move up and down. The film 32 is hermetically fixed so as to sandwich the film 32.

  The bottom portion of the base 31 is formed in a planar shape, and a decompression pump 35 is attached through an opening (not shown). The film 32 is made of a material that transmits ultraviolet rays and has elasticity. In the present embodiment, an ultraviolet irradiation device 36 is attached inside the lid member 33. Furthermore, in this embodiment, the pump 37 is attached to the lid member 33 through an opening (not shown). Note that the lid member 33 can be configured to provide a simple opening instead of providing the pump 37.

In manufacturing the radiation image detector 100, first, an optical compensation material (not shown) is applied to a region excluding the outer peripheral portion of the photoelectric conversion panel 20 on the photoelectric conversion element side.
As shown in FIG. 6, the adhesive 25 including the spacer S is applied and arranged around the photoelectric conversion element 22 and the planarization layer 21 on the upper surface 24a of the substrate 24 (step S1 of process 1).

  As will be described later, the photoelectric conversion panel 20 and the scintillator panel 10 are placed so that the photoelectric conversion element layer 22 and the scintillator layer 15 face each other, but at this time, the adhesive 25 is not provided with the scintillator layer 15. An adhesive 25 is applied in advance on the upper surface 24a of the substrate 24 so as to be positioned at a portion of the surrounding support. The substrate 24 of the photoelectric conversion panel and the support of the scintillator panel are bonded through an adhesive 25.

  The support may be the first support or the second support of the scintillator panel. Hereinafter, as an example, the substrate 24 of the photoelectric conversion panel is bonded via an adhesive. A mode in which the support to be bonded is the first support will be described.

  Moreover, when the photoelectric conversion panel 20 has an outer peripheral portion made of a substrate on which the photoelectric conversion element layer is not laminated and has two or more substrates, the outer peripheral portion in which the photoelectric conversion element is not disposed on either one of them. The upper surface 24a of the substrate 24 to which the adhesive is applied may be the upper surface of any of the two or more layers.

  Subsequently, as shown in FIG. 7, the photoelectric conversion panel 20 in which the adhesive 25 is arranged in this way is placed on the base 31 of the chamber 30 (step S <b> 2 of the process 1). And an optical compensation material is apply | coated on the planarization layer of a photoelectric conversion panel. As shown in FIG. 8, the scintillator panel 10 is placed on the photoelectric conversion panel 20 from above so that the permeation prevention layer on the scintillator layer side faces the photoelectric conversion panel (S3 of process 1). As shown in FIG. 2, in this embodiment, the first support 11 at the outer peripheral portion of the scintillator panel 10 is placed on the substrate 24 at the outer peripheral portion of the photoelectric conversion panel 20 to which the adhesive 25 is applied in this manner. By overlapping, the adhesive 25 is arranged in the gap between the substrate 24 and the first support 11 and around the scintillator layer 15.

  Instead of placing the adhesive 25 by placing the scintillator panel 10 on the photoelectric conversion panel 20 having the substrate 24 to which the adhesive 25 has been applied in advance as in this embodiment, as shown in FIG. In addition, the adhesive 25 is applied in advance to the first support 11 side of the scintillator panel, and is placed on the photoelectric conversion panel 20, whereby a gap portion between the substrate 24 and the first support 11 is formed. It is also possible to configure so that the adhesive 25 is disposed on the surface. At that time, the adhesive 25 is applied in advance around the scintillator layer 15 of the first support 11.

  In addition, after the photoelectric conversion panel and the scintillator panel are bonded via an optical compensation material, the adhesive 25 is inserted into a gap portion between the substrate 24 of the photoelectric conversion panel and the first support 11 of the scintillator panel. It is also possible to arrange the adhesive 25 in a portion around the scintillator layer 15.

  Subsequent to S3 in Process 1, as shown in FIG. 5, the film 32 is placed on the photoelectric conversion panel 20 and the scintillator panel 20 placed on the base 31 so as to cover them. (Step S4 of Process 1), the lid member 33 of the chamber 30 is attached from above.

  Then, as described above, the air in the internal space partitioned by the substrate 24, the first support 11 and the adhesive 25 is discharged from the outside, and the scintillator panel 10 and the photoelectric conversion panel 20 are interposed via the optical compensation material. In order to achieve close contact, the pressure reducing pump 35 is driven to depressurize a space between the base 31 of the chamber 30 and the film 32 (hereinafter referred to as a lower space R1; see FIG. 5), whereby the internal space is reduced. Is reduced to a pressure lower than atmospheric pressure (for example, within a range of 0.2 to 0.5 atm).

  Since the space between the lid member 33 of the chamber 30 and the film 32 (hereinafter referred to as the upper space R2; see FIG. 5) remains at atmospheric pressure, when the lower space R1 of the chamber 30 is depressurized, FIG. As shown in FIG. 3, the film 32 comes to stick from above the scintillator panel 10, and is pressed from above by the atmospheric pressure of the upper space R2 and the own weight of the second scintillator panel 10 through the film 32, and the photoelectric conversion panel. 20 and the scintillator panel 10 are bonded via an optical compensation material (step S5 of process 1).

  At that time, if the spacer 25 as described above is included in the adhesive 25, the sharp-angled tip of the scintillator of the scintillator layer 15 is strongly pressed against the planarization layer 21 and the like through the permeation preventive layer by an external force due to external pressure. It is possible to prevent damage due to damage.

  At this time, the pump 37 on the lid member 33 side of the chamber 30 is driven to pressurize the upper space R2 of the chamber 30 appropriately, and the substrate 24 of the photoelectric conversion panel 20 and the first support 11 of the scintillator panel Can be configured to be bonded together, and pressure adjustment in the upper space R2 of the chamber 30 is appropriately performed.

  In the present embodiment, basically, as described above, the substrate 24 and the first support 11 are bonded through the adhesive 25 under a reduced pressure environment, and the substrate 24 and the first support 11 are bonded together. An internal space partitioned from the outside is formed by the support 11 and the adhesive 25. Then, the radiation image detector 100 includes the photoelectric conversion element layer 22 formed on the substrate 24 of the photoelectric conversion panel or the planarization layer 21 covering the photoelectric conversion element layer 22 through the optical compensation material. It can form in the state contact | abutted on the surface.

  In this embodiment, the scintillator panel 10 and the photoelectric conversion panel 20 bonded in the state of FIG. 10 are further irradiated with ultraviolet rays from the ultraviolet irradiation device 36 provided on the lid member 33 of the chamber 30 to form an adhesive. 25 is cured and the substrate 24 and the first support 11 are securely bonded (step S6 of process 2). Therefore, in this embodiment, it is preferable to use a photo-curing adhesive, particularly an ultraviolet-curing adhesive, as the adhesive 25, and the first support 11 is made of a material that transmits light, particularly ultraviolet light. Preferably it is.

  In addition, in order to prevent the ultraviolet rays transmitted through the first support 11 from adversely affecting the scintillator layer 15, the photoelectric conversion element 15, etc., light ( It is preferable to form a light shielding layer that shields ultraviolet rays. The light shielding layer may be a second support. In addition, the light shielding layer may be formed not only between the first support 11 and the scintillator layer 15 but also on the surface of the first support 11 opposite to the surface on which the scintillator layer 15 is provided. Is possible.

  On the other hand, as described above, in the support placing step (step S3 of the processes 1 and 2), the entire space around the scintillator layer 15 is initially set in the atmospheric pressure where the lower space R1 of the chamber 30 is not decompressed yet. When the adhesive 25 is disposed over the circumference, the pressure inside the internal space partitioned and sealed by the substrate 24, the first support 11 and the adhesive 25 becomes atmospheric pressure.

  In this state, when the pressure in the lower space R1 of the chamber 30 is reduced in the pressure reduction bonding step (step S5), the air in the internal space (or dry air or inert gas; the same applies hereinafter) is not drawn out well, and the internal space May remain atmospheric pressure, or the seal with the soft adhesive 25 may be broken and air may be ejected from the internal space to the lower space R1, and the seal with the adhesive 25 may be broken.

  In these cases, when at least the radiation image detector 100 is taken out from the chamber 30 into the atmospheric pressure, the internal space partitioned from the outside by the substrate 24, the first support 11 and the adhesive 25 remains unsealed, The moisture-proof function may not be achieved.

  Therefore, in the present embodiment, the adhesive 25 is disposed in the gap portion between the substrate 24 of the photoelectric conversion panel and the first support 11 of the scintillator panel, but the adhesive 25 is disposed over the entire circumference of the scintillator layer 15. Instead, the adhesive 25 is preliminarily disposed on the substrate 24 and the first support 11 so that one or more openings are formed in the adhesive 25 portion to communicate the internal space and the outer space. It is preferable (step S1).

  In this state, when the decompression bonding step (step S5) is performed to decompress the lower space R1 of the chamber 30, the air in the internal space is drawn out from the opening of the adhesive 25, and the pressure in the internal space is also ensured. The pressure is reduced to And if the size of the opening of the opening is formed in an appropriate size in advance, in the reduced pressure bonding step (step S5), the substrate 24 of the photoelectric conversion panel and the like are pressed by the atmospheric pressure from the upper space R2. When the first support 11 of the scintillator panel approaches each other, the adhesive 25 is thereby spread in the horizontal direction, so that the opening is automatically sealed.

  In this state, as shown in FIG. 10, ultraviolet rays are irradiated from the ultraviolet irradiation device 36 in the chamber 30, and the adhesive 25 is cured (step S <b> 6 of the process 2). By the body 11 being securely bonded, the internal space is sealed in a state of being blocked from the outside air. It is also possible to configure such that the sealing is ensured by newly applying and curing an adhesive to the automatically sealed opening 24 (step S7 of process 2).

  EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto. In addition, although the display of "part" or "%" is used in an Example, unless otherwise indicated, "part by mass" or "mass%" is represented.

[Example 1-1]
(Coating of reflective layer)
A reflective layer was coated on the second support made of a polyimide film having a thickness of 125 μm (UPILEX-125S manufactured by Ube Industries) according to the following procedure.

  After adding 40 parts by mass of rutile titanium dioxide having an average particle size of 0.2 μm, 10 parts by mass of a polyester resin (Byron 630: manufactured by Toyobo Co., Ltd.), 25 parts by mass of toluene and 25 parts by mass of methyl ethyl ketone (MEK) were added as a solvent, and then a sand mill The coating for the reflective layer was prepared by dispersing with This reflective layer coating was applied onto a polyimide film support and dried, and a reflective layer having a thickness of 50 μm was applied to prepare a polyimide film with a reflective layer.

(Formation of scintillator layer)
Phosphor 1 (only CsI) was placed in boat 1 and phosphor 2 (containing 0.03 mol% of Tl with respect to CsI) was placed in boat 2.

  In the vapor deposition apparatus, a polyimide film with a reflective layer was loaded on a support holder equipped with a support rotating mechanism with the reflective layer facing the boat 1 and the boat 2 side. Next, the boat 1 and the boat 2 containing the phosphor material were arranged near the bottom surface inside the vacuum vessel and on the circumference of the same circle with the center line perpendicular to the support as the center. At this time, the distance between the support and the evaporation source was adjusted to 500 mm, and the distance between the center line perpendicular to the support and the evaporation source was adjusted to 300 mm. Further, a shutter (not shown) was provided between each boat and the holder to prevent substances other than the target substance from adhering to the scintillator layer at the start of vapor deposition.

  Subsequently, the inside of the vapor deposition apparatus was once evacuated, Ar gas was introduced and the degree of vacuum was adjusted to 0.5 Pa, and then the temperature of the support was maintained at 30 ° C. while rotating the support at a speed of 10 rpm. Subsequently, the inside of the boat 1 is raised to a predetermined temperature by resistance heating, and the phosphor 1 is started to be deposited. Then, the temperature of the polyimide film is raised to 200 ° C., then the phosphor 2 is deposited, and the layer thickness of the scintillator layer is 200 μm. At that time, the vapor deposition was terminated to obtain a scintillator sheet (sheet having a second support and a scintillator layer) composed of polyimide film / reflective layer / scintillator layer.

  In addition, in the said vapor deposition, in order to adjust the columnar crystal clearance maximum value of a scintillator layer to 0.5 micrometer, the flow volume of Ar gas was controlled.

(Cutting of scintillator sheet consisting of polyimide film / reflective layer / scintillator layer)
The scintillator sheet composed of polyimide film / reflective layer / scintillator layer obtained above was cut into a size of 100 mm length × 100 mm width.

(Bonding of the first support)
A glass plate (first support 110 mm long × 110 mm wide, 0.3 mm thick) on the polyimide film (second support) side of a scintillator sheet made of polyimide film / reflective layer / scintillator layer cut to a predetermined size Body) was bonded with a double-sided PSA sheet. Thus, a scintillator sheet laminate (outer peripheral portion) having an adhesive application region (outer peripheral portion) composed of a glass layer (glass plate) without a scintillator layer having a width of 5 mm on the outer peripheral portion with a polyimide film and a glass layer (glass plate) as a support. A sheet in which a first support was bonded to a scintillator sheet) was produced.

(Formation of permeation prevention layer)
The scintillator sheet laminate obtained above is set in a CVD apparatus, and parylene N (manufactured by Japan Parylene Godo Kaisha) is chemically vapor-deposited on the surface of the scintillator layer to form a permeation prevention layer made of polyparaxylylene, and a scintillator panel Was made. Specifically, by controlling the chemical vapor deposition time, the average layer thickness t of the permeation preventive layer at the tip portion far from the columnar crystal support of the scintillator was adjusted to 0.75 μm.

  The average layer thickness t of the permeation preventive layer at the tip portion far from the columnar crystal support of the scintillator was measured and determined by the following method.

  The scintillator panel in which the permeation preventing layer is formed on the surface of the scintillator layer as described above is immersed in a curable resin solution and cured, and then the scintillator layer is cut perpendicular to the support, and a scanning electron micrograph is taken. Ten columnar crystals were arbitrarily selected, the layer thickness of the permeation prevention layer at the tip thereof was measured, and the average layer thickness t of the permeation prevention layer was determined.

<Measurement of maximum gap distance between columnar crystals>
The scintillator layer of the obtained scintillator panel was cut in parallel with the support at a position 30 μm from the tip of the columnar crystal, and the maximum value of the gap distance between the columnar crystals was obtained from a scanning electron micrograph of the cross section. The imaging area of the cross-sectional scanning electron micrograph was 250 μm × 180 μm.

(Production of photoelectric conversion panel)
The scintillator panel of PaxScan 2520 (Varian's radiation image detector) was peeled off to obtain a photoelectric conversion panel having a photoelectric conversion element layer area of 244.4 mm × 195.4 mm.

(Lamination of photoelectric conversion panel and scintillator panel)
SA-511 (epoxy oil, viscosity 5400 mPa) as an optical compensation material in the region of the central portion 100 mm × 100 mm (same size as the scintillator layer of the scintillator panel to be bonded later) of the photoelectric conversion element layer side surface of the photoelectric conversion panel. S (25 ° C., manufactured by Ajinomoto Finetech Co., Ltd.) was applied at a thickness of 10 μm.

  The following adhesive serving as a sealing material was applied to the outer peripheral portion outside the optical compensation material application region of the photoelectric conversion panel. The photoelectric conversion panel was placed on the base 31 of the chamber 30 shown in FIG. 5 so that the adhesive was on the top. Next, the scintillator panel was placed so that the scintillator layer opposed and overlapped with the position where the optical compensation material of the photoelectric conversion panel was applied.

  Next, the film 32 was placed so as to cover the scintillator panel from above, the lid member 33 was attached from above, and the lower space R1 was decompressed.

  Thereby, the glass plate of the outer peripheral part of a scintillator panel, and the outer peripheral part of a photoelectric conversion panel are bonded through an adhesive agent, and the area | region in which the scintillator layer of the scintillator panel was provided, and a photoelectric conversion panel via an optical compensation material I tried to adhere. The radiation image detector was manufactured by irradiating the outer peripheral portion with ultraviolet rays from the scintillator panel side to cure the adhesive, and sealing the scintillator layer with the glass layer of the scintillator panel, the photoelectric conversion panel, and the adhesive.

(adhesive)
OP3010P (acrylic adhesive; manufactured by Denki Kagaku Kogyo Co., Ltd.)
(Evaluation of radiation image detector)
About the obtained radiographic image detector, evaluation of a bubble and evaluation of sharpness were performed by the method shown below.

<Evaluation of presence of bubbles>
X-rays having a tube voltage of 40 kVp were irradiated from the support side of the radiographic image detector, and the obtained image on the radiographic image detector was printed out from the output device. The obtained print image was observed to evaluate the presence or absence of bubbles. Table 1 shows the results.

  Whether or not what was observed in the image was due to bubbles was determined by comparison with an image before being bonded with the optical compensation material.

  The diameter of what can be confirmed as bubbles is 200 μm or more.

<Evaluation of sharpness>
X-rays with a tube voltage of 40 kVp were irradiated to the radiation incident surface side of the radiation image detector through a lead MTF chart, and image data was detected and recorded on a hard disk. Thereafter, the recording on the hard disk was analyzed by a computer, and the modulation transfer function MTF (MTF value at a spatial frequency of 1 cycle / mm) of the X-ray image recorded on the hard disk was used as an index of sharpness. The higher the MTF value in the table, the better the sharpness. MTF is an abbreviation for Modulation Transfer Function.

[Examples 1-2 to 1-5 and Comparative Examples 1-1 to 1-6]
In Example 1-1, except that the chemical vapor deposition time of parylene N was changed to adjust t of the permeation preventive layer as shown in Table 1, and the material shown in Table 1 was used as an optical compensation material, Similarly, Examples 1-2 to 1-5 and Comparative Examples 1-1 to 1-6 were carried out. In Comparative Example 1-1, the photoelectric conversion panel and the scintillator panel were bonded without using the optical compensation material.

The optical compensation materials shown in Table 1 are described below.
A: Methyl silicone type JCR6122 manufactured by Toray Dow Corning Co., Ltd. Viscosity 340 mPa · s
B: Epoxy-based SA-511 manufactured by Ajinomoto Finetech Co., Ltd. Viscosity 5400 mPa · s
The optical compensation materials A and B are both heat or room temperature curable resins, and are cured as time passes after bonding.

[Examples 2-1 to 2-5 and Comparative Examples 2-1 to 2-6]
In Example 1-1, the scintillator layer was formed by controlling the flow rate of Ar gas so that the maximum gap distance between columnar crystals was 3.0 μm, and the chemical vapor deposition time of parylene N was changed to penetrate The t of the prevention layer was adjusted as shown in Table 1, and Examples 2-1 to 2-5 and Comparative Examples 2-1 to 2-1 were similarly performed except that the material shown in Table 1 was used as the optical compensation material. 2-6 were performed. In Comparative Example 2-1, a photoelectric conversion panel and a scintillator panel were bonded without using an optical compensation material.

[Example 3-1 and Comparative Examples 3-1 to 3-6]
In Example 1-1, the scintillator layer was formed by controlling the flow rate of Ar gas so that the maximum gap distance between columnar crystals was 14.0 μm, and the chemical vapor deposition time of parylene N was changed to penetrate In the same manner as Example 3-1 and Comparative Examples 3-1 to 3-6, except that t of the prevention layer was adjusted as shown in Table 1 and the material shown in Table 1 was used as the optical compensation material. Carried out. In Comparative Example 3-1, a photoelectric conversion panel and a scintillator panel were bonded without using an optical compensation material.

  Table 1 shows the maximum value d of the gap distance between the columnar crystals, the average layer thickness t of the permeation prevention layer at the tip of the columnar crystals of the scintillator layer, the optical compensation material, the evaluation results of the presence or absence of bubbles, and the evaluation results of sharpness. . The sharpness is shown in Table 1 as a relative value when the MTF value of Comparative Example 1-1 is 1.00.

表１より、１／２ｄより小さなｔを有するパリレン層をコートしたシンチレータパネル（比較例１−２〜４、２−２〜４、３−２〜４）は、光学補償材料を介して光電変換パネルと貼合すると、気泡が発生し、鮮鋭性が低いことが分かる。

From Table 1, the scintillator panels (Comparative Examples 1-2-4, 2-2-4, 3-2-4) coated with a parylene layer having t smaller than 1 / 2d are photoelectrically converted through an optical compensation material. When bonded to the panel, it can be seen that bubbles are generated and the sharpness is low.

  On the other hand, scintillator panels (Examples 1-1 to 1-5, 2-1 to 2-5, 3-1) coated with a parylene layer having t of d / 2 or more and 8 μm or less are provided with an optical compensation material. It can be seen that even when pasted to the photoelectric conversion panel, no bubbles are generated and the sharpness is high.

  However, the scintillator panels (Comparative Examples 1-5 to 6, 2-5 to 6 and 3 to 5 to 6) coated with a parylene layer having t exceeding 8 μm have a low MTF and obtain the effect of an optical compensation material. I can't understand.

[Example 4-1]
In Example 1, a cellulose nanofiber sheet (thickness 15 μm, average fiber diameter 0.05 μm) is placed on the scintillator sheet laminate and inserted into a bag-shaped plastic sheet, and the inside of the plastic sheet is decompressed to form a scintillator layer. Example 4-1 was carried out in the same manner except that the cellulose nanofiber sheet was adhered and laminated, and then the scintillator sheet laminate was taken out to form a penetration preventing layer.

[Examples 4-2, 4-3 and Comparative Examples 4-1 to 4-6]
In Example 4-1, except that the chemical vapor deposition time of parylene N was changed to adjust t of the permeation preventive layer as shown in Table 2, and the material shown in Table 2 was used as the optical compensation material. In the same manner, Examples 4-2 and 4-3 and Comparative Examples 4-1 to 4-6 were performed.

[Examples 5-1 to 5-4 and Comparative Examples 5-1 to 5-6]
In Example 4-1, the scintillator layer was formed by controlling the flow rate of Ar gas so that the maximum gap distance between columnar crystals was 3.0 μm, and the chemical vapor deposition time of parylene N was changed to penetrate In the same manner as in Examples 5-1 to 5-4 and Comparative Examples 5-1 except that t of the prevention layer was adjusted as shown in Table 2 and the material shown in Table 2 was used as the optical compensation material. 5-6 was carried out.

[Example 6-1 and Comparative Examples 6-1 to 6-6]
In Example 4-1, the scintillator layer was formed by controlling the flow rate of Ar gas so that the maximum gap distance between columnar crystals was 14.0 μm, and the chemical vapor deposition time of parylene was changed to prevent permeation. Example 6-1 and Comparative Examples 6-1 to 6-6 were carried out in the same manner except that the layer t was adjusted as shown in Table 2 and the material shown in Table 2 was used as the optical compensation material. did.

  The evaluation results of Examples 4-1 to 6-1 and Comparative Examples 4-1 to 6-6 are shown in Table 2.

表２より、ｄ／２より小さなｔを有するパリレン層をコートしたかパリレン層をコートしていないシンチレータパネル（比較例４−２〜４、５−２〜４、６−２〜４）は、光学補償材料を介して光電変換パネルと貼合すると、気泡が発生し、鮮鋭性が低いことが分かる。

From Table 2, the scintillator panels (Comparative Examples 4-2 to 4, 5-2 to 4, 6-2 to 4) coated with a parylene layer having t smaller than d / 2 or not coated with a parylene layer are as follows. It can be seen that when the photoelectric conversion panel is bonded via an optical compensation material, bubbles are generated and the sharpness is low.

  On the other hand, scintillator panels (Examples 4-1 to 3, 5-1 to 4, 6-1) coated with a parylene layer having t of d / 2 or more and 8 μm or less are photoelectric conversion panels through optical compensation materials. It can be seen that bubbles are not generated and the sharpness is high.

  However, scintillator panels (Comparative Examples 4-5 to 6, 5-5 to 6 and 6 to 5 to 6) coated with a parylene layer having t exceeding 8 μm have low sharpness and obtain the effect of an optical compensation material. I can't understand.

  Moreover, when the Example of Table 2 is compared with the Example corresponding to Table 1, it turns out that the sharpness improved further by having carried out the adhesion | attachment lamination | stacking of the cellulose nanofiber sheet.

DESCRIPTION OF SYMBOLS 1 Optical compensation material 2 Penetration prevention layer 10 Scintillator panel 11 1st support body 12 Adhesive layer 13 Scintillator sheet 14 2nd support body 15 Scintillator layer 16 Penetration prevention layer 17a Reflective layer 17b Undercoat layer 18 Optical compensation layer 20 Photoelectric conversion Panel 21 Flattening layer 22 Photoelectric conversion element layer 22a Transparent electrode 22b Charge generation layer 22c Counter electrode 23 Output layer 24 Substrate 25 Adhesive 61 Vapor deposition apparatus 62 Vacuum vessel 63, 63a, 63b, 63c Evaporation source (filled member)
64 Substrate holder 65 Substrate rotating mechanism 66 Vacuum pump 67 Substrate rotating shaft 68 Shutter 100 Radiation image detector

Claims (5)

A radiation image detector comprising a photoelectric conversion panel having a plurality of photoelectric conversion elements arranged two-dimensionally on a substrate and a scintillator panel provided via an optical compensation material, wherein the scintillator panel includes a plurality of scintillator panels. A scintillator layer made of columnar crystals and a penetration preventing layer for preventing the optical compensation material from penetrating into the gaps between the columnar crystals, and an average thickness t of the penetration preventing layer at the tip of the columnar crystals and a plurality of thicknesses The maximum value d of the gap distance between the columnar crystals satisfies the following formula (1).
Formula (1) d / 2 <= t <= 8micrometer
[Wherein, t is the average thickness of the permeation preventive layer at the tip of the columnar crystal of the scintillator layer, d is the maximum value of the gap distance between the plurality of columnar crystals, and d is 0.5 to 15.0 μm. Is within the range. ]   The scintillator panel has a scintillator layer and a permeation prevention layer on a support in order, and the photoelectric conversion panel and the scintillator panel are bonded so that the permeation prevention layer faces the photoelectric conversion element, and the support The radiation image detector according to claim 1, further comprising a glass layer.   The scintillator panel has a support on which a scintillator layer is formed leaving the outer periphery of the support, and has an adhesive between the outer periphery of the support and the outer periphery of the photoelectric conversion panel, The radiation image detector according to claim 1 or 2, wherein a scintillator layer is sealed with the support, the photoelectric conversion panel, and the adhesive.   The permeation preventing layer is selected from polyparaxylylene, polymonochloroparaxylylene, polydichloroparaxylylene, polytetrachloroparaxylylene, polyfluoroparaxylylene, polydimethylparaxylylene and polydiethylparaxylylene. The radiographic image detector according to claim 1, further comprising at least one selected from the group consisting of:   It is a manufacturing method of the radiographic image detector which manufactures the radiographic image detector as described in any one of Claim 1- 4, Comprising: It enclosed with the said board | substrate, the said support body, and the said adhesive agent, and was sealed. A method of manufacturing a radiation image detector, wherein the scintillator panel and the photoelectric conversion panel are bonded and bonded by reducing the internal space from atmospheric pressure.

Images