JP2014049470A5

JP2014049470A5 -

Info

Publication number: JP2014049470A5
Application number: JP2012188697A
Authority: JP
Filing date: 2012-08-29
Publication date: 2015-09-03
Anticipated expiration: 2032-08-29

Description

また、その開示の他の観点によれば、周縁側に固定ピンを備えた搬送キャリアと、前記固定ピンに対応する引掛穴と、開口部とを備えたカバープレートとを有し、前記引掛穴の中心は前記固定ピンの中心よりも外側にずれた位置に配置され、前記引掛穴の内側の側壁を前記固定ピンに係止させて固定することを含むテープキャリア搬送治具を用意し、前記搬送キャリアと前記カバープレートの間に、短冊状のテープキャリアを挟んで固定する工程と、前記カバープレートの開口部に露出する前記テープキャリアの接続パッドに電子部品を電気的に接続する工程とを有する電子部品装置の製造方法が提供される。 According to another aspect of the disclosure, the hook includes a carrier having a fixing pin on a peripheral side, a hooking hole corresponding to the fixing pin, and a cover plate having an opening. A center of the fixing pin is disposed at a position shifted from the center of the fixing pin, and a tape carrier conveying jig including fixing the inner side wall of the hooking hole to the fixing pin is prepared, A step of fixing a strip-shaped tape carrier between a transport carrier and the cover plate, and a step of electrically connecting an electronic component to the connection pad of the tape carrier exposed at the opening of the cover plate A method for manufacturing an electronic component device is provided.

Claims

A transport carrier having a fixing pin on the peripheral side;
A cover plate having a hooking hole corresponding to the fixing pin;
The center of the hooking hole is arranged at a position shifted outward from the center of the fixing pin,
A tape carrier transporting jig, wherein a tape carrier is sandwiched and fixed by engaging an inner side wall of the hooking hole with the fixing pin.

2. The cover plate is bent upward, the fixing pin is inserted into the hooking hole, the cover plate is released from bending, and the hooking hole is locked to the fixing pin. The tape carrier conveyance jig described in 1.

The transport carrier and the cover plate have a strip shape, and the fixing pins are arranged on both end sides along the width direction of the transport carrier,
The tape carrier transport jig according to claim 2, wherein the cover plate is bent upward in the length direction.

The transport carrier and the cover plate have a strip shape, and the fixing pins are arranged on both end sides along the length direction of the transport carrier,
The tape carrier transport jig according to claim 2, wherein the cover plate is bent upward in the width direction.

The tape carrier according to any one of claims 1 to 4, wherein the fixing pin is formed by a shaft portion and a large-diameter portion disposed on the shaft portion and having a diameter larger than that of the shaft portion. Transfer jig.

The tape carrier conveying jig according to claim 5, wherein a connecting portion between the shaft portion and the large-diameter portion is an inclined surface.

The said catching hole is formed in the inside of the said cover plate, or is formed in the notch shape inside from the one end of the said cover plate, The Claim 1 thru | or 6 characterized by the above-mentioned. Tape carrier transport jig.

A transport carrier having a fixing pin on the peripheral side;
A cover plate having a hooking hole corresponding to the fixing pin and an opening;
A tape carrier transport jig is provided, wherein the center of the hooking hole is disposed at a position shifted outward from the center of the fixing pin, and the inner side wall of the hooking hole is locked and fixed to the fixing pin. A step of fixing a strip-shaped tape carrier between the transport carrier and the cover plate; and
And a step of electrically connecting the electronic component to the connection pad of the tape carrier exposed at the opening of the cover plate.

After the step of connecting the electronic components,
Sealing the electronic component with resin;
Removing the tape carrier conveying jig from the tape carrier;
The method of manufacturing an electronic component device according to claim 8, further comprising a step of cutting the tape carrier to obtain individual electronic component devices.

The electronic component is an LED chip;
10. The method of manufacturing an electronic component device according to claim 8, wherein in the step of connecting the electronic component, the LED chip is connected to a connection pad of the tape carrier through a gold-tin solder layer.