JP2014048560A - Liquid crystal display device and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid crystal display device and a manufacturing method of the same that solve the problem in which if a screen fit process is used for manufacturing of liquid crystal display devices, a process for wiping away stray resin is required, thereby resulting in increase in the number of processes.SOLUTION: A liquid crystal display device comprises: a pair of substrates that has a display area 11 and a Chip On Glass (COG) area 12, is adhered via a liquid crystal layer in the display area 11 and has an extended extension part 1a of one substrate of the pair of substrates formed in the COG area 12; a drive IC 5 that is provided in the extension part 1a; a resin frame 7 that is arranged in the extension part 1a along a side of a long side of the extension part 1a; and ultraviolet ray hardening resin 8 that is filled in an area surrounded with a cover panel 9, the resin frame 7, the driver IC 5 and the pair of substrates. The cover panel 9 is adhered to the pair of substrates.

Description

  The present invention relates to a liquid crystal display device and a manufacturing method thereof, and more particularly to a liquid crystal display device having a cover panel bonded to a front surface and a manufacturing method thereof.

  Mobile devices such as mobile phones are becoming lighter, thinner, and smaller, and accordingly, it is necessary to reduce the thickness of display devices such as liquid crystal display devices (hereinafter referred to as LCD modules). In order to reduce the thickness of a display device, in the case of an LCD module, it is common to reduce the thickness of glass.

  On the other hand, the resistance to mechanical stress such as drop strength, bending and vibration required for mobile devices is required to be equal to or better than that of conventional products.

  Since the required strength cannot be secured with a thin glass LCD module, there is a technology to increase rigidity by bonding the LCD module to the touch panel that also serves as the cover panel or cover at the top of the LCD module with resin or optical double-sided tape. To do. This bonding technique is referred to as a screen fit method.

  In the manufacturing method of the LCD module using the screen fit method, the UV curable resin applied between the front-side polarizing plate and the cover panel is applied multiple times so as to spread evenly over the entire display area. Then, when pressurizing the cover panel and the glass of the liquid crystal display device, the COG (Chip On Glass) area is supplied to the COG (Chip On Glass) area so that the UV-curing resin intentionally protrudes, and the gap between the cover panel and the back glass Is filled with resin and cured. Thereby, resistance to mechanical stresses such as drop strength, bending, and vibration can be improved, and damage to the driver IC (Integrated Circuit) or glass around the COG area can be prevented.

  For thinning, the cover panel is preferably made of resin or glass. However, the screen fitting method is limited to a display area that is a flat surface, and it is difficult for the driver IC mounted on the glass of the LCD module outside the display area in the COG format to be bonded. For this reason, when mechanical stress is applied to the mobile device, there is no problem in the display area where the screen fit is performed, but the IC damage of the driver IC without the resin or the optical double-sided tape or the glass damage around the COG area Has become a major issue.

  As a liquid crystal display device to which such a cover panel is bonded, there is one described in Patent Document 1. FIG. 4 is an exploded perspective view of the protection plate integrated liquid crystal display panel of Patent Document 1. The liquid crystal display panel of FIG. 4 includes a liquid crystal display element 100 having an observation side substrate 101, an opposite side substrate 102, a polarizing plate 103, a driver element 104, an observation surface protection plate 108, a surface light source 106, and a light source case 107. It has.

  Further, in the liquid crystal display panel described in Patent Document 1, weir members 109 are provided at both edge portions of the surface on which the driver element 104 of the protruding portion 102a of the liquid crystal display element 100 is mounted. The dam member 109 is made of a belt-like member, for example, a resin tape, and has a length extending from a portion corresponding to the edge of the observation side substrate 101 of the overhanging portion 102a to the edge of the overhanging portion 102a.

  Resin for bonding the liquid crystal display element 100 and the observation surface protection plate 108 is supplied to the gap between the liquid crystal display element 100 and the observation surface protection plate 108. When the liquid crystal display element 100 and the observation surface protection plate 108 are pressurized, the resin is spread over a region corresponding to the entire outer surface of the observation side substrate 101 of the liquid crystal display element 100 and substantially the entire protruding portion 102a. Further, a resin is filled in a gap between the weir member 109 and the observation surface protection plate 108 provided at both edge portions of the projecting portion 102 a of the liquid crystal display element 100. Patent Document 1 describes that the weir member 109 regulates the spread of the resin layer in both directions of the overhang portion 103a.

JP 2010-79006 A

  However, the liquid crystal display panel of Patent Document 1 described above has the following problems.

  In the liquid crystal display panel described in Patent Document 1, the surplus of the resin that is spread in the gap between the projecting portion 102a and the observation surface protection plate 108 is spread around the gap. The resin spread in the direction of is filled in the gap between the weir member 109 and the observation surface protection plate 108. And in patent document 1, it describes that the resin which protruded from the edge | side of the longitudinal direction of the overhang | projection part 102a in which the dam member 109 is not formed is wiped off.

  In the liquid crystal display panel described in Patent Document 1, since excess resin protrudes over a wide area around the liquid crystal display element 100, a process of wiping out the protruded resin is necessary, which increases the number of processes. It was.

  The object of the present invention is to solve the above-mentioned problem that the problem of increasing the number of processes is required because a process of wiping off the protruding resin is required when the screen fit method is used for the production of the liquid crystal display apparatus, and the liquid crystal display apparatus. It is to provide a manufacturing method.

In order to achieve the above object, a liquid crystal display device according to the present invention comprises:
It has a display area and a COG area
The display area includes a pair of substrates bonded via a liquid crystal layer,
In the COG area, an overhang is formed by extending one of the pair of substrates.
A driver IC is provided on the overhang,
Provided with a resin frame arranged along the long side of the overhanging portion in the overhanging portion,
A resin filled between a cover panel and the resin frame, the driver IC, and the pair of substrates is provided.
The cover panel is bonded to the pair of substrates.

A method for manufacturing a liquid crystal display device according to the present invention includes:
Prepare a pair of substrates and a cover panel bonded via a liquid crystal layer,
A driver IC is mounted on the extended portion where one of the pair of substrates is extended,
Affix the resin frame along the long side of the overhang to the overhang,
A resin containing an amount sufficient to fill the region delimited by the resin frame is applied to the pair of substrates, and the cover panel is pressed to spread the resin to the region delimited by the resin frame, and then The resin is cured.

  According to the liquid crystal display device and the manufacturing method thereof of the present invention, it is possible to suppress the protrusion of the resin and to reduce the number of manufacturing steps.

(A) is a top view of the liquid crystal display device which concerns on 1st Embodiment of this invention, (b) is sectional drawing along the AA of (a). (A) is a top view of the liquid crystal display device which concerns on 2nd Embodiment of this invention, (b) is sectional drawing along the BB line of (a). (A) is a top view of the liquid crystal display device which concerns on 3rd Embodiment of this invention, (b) is sectional drawing along CC line of (a). FIG. 11 is an exploded perspective view for explaining a protection plate integrated liquid crystal display panel of Patent Document 1.

  Preferred embodiments of the present invention will be described in detail with reference to the drawings.

[First Embodiment]
First, a liquid crystal display device according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1A is a plan view of the liquid crystal display device according to the first embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along the line AA of FIG.

  As shown in FIGS. 1A and 1B, the liquid crystal display device according to the present embodiment has a display area 11 and a COG area 12 (driver IC area), and a cover panel 9 is bonded to the front surface. It is a liquid crystal display device. In the display area 11, a back glass substrate 1 and a front glass substrate 2 as an example of a pair of substrates are bonded together via a liquid crystal layer. In the COG area 12, an overhanging portion 1a is formed by extending the back glass substrate 1, and a driver IC 5 is mounted on the overhanging portion 1a. On the surfaces of the back glass substrate 1 and the front glass substrate 2 in the display area 11, a back polarizing plate 3 and a front polarizing plate 4 are attached, respectively. A light shielding tape 6 is attached to the surface of the back glass substrate 1 in the COG area 12.

  Furthermore, in this embodiment, the resin frame 7 is affixed along the long side of the overhang | projection part 1a. This resin frame 7 may be further provided on one of the side surfaces of the overhang portion 1a. The resin frame 7 is required to be made of a material that is transparent for allowing ultraviolet rays to pass through and has heat resistance so that it can withstand the heat generated when the resin is cured. For example, a PET material or the like is suitable, but not limited thereto. The material of the cover panel 9 may be either resin or glass, and may be constituted by a touch panel module or the like. Further, an ultraviolet curable resin 8 is filled between the cover panel 9, the resin frame 7, the driver IC 5, the back glass substrate 1, and the front glass substrate 2, and the cover panel 9 is bonded.

  Next, the manufacturing method of the liquid crystal display device according to the present embodiment will be explained. In the manufacturing process of the liquid crystal display device, the ultraviolet curable resin 8 is applied in many ways so as to spread evenly between the front side polarizing plate 4 and the cover panel 9 in the display area 11. Further, when the cover panel 9 and the back side glass substrate 1 are pressurized, an amount of the ultraviolet curable resin 8 aimed at causing the ultraviolet curable resin 8 to protrude into the COG area 12 is supplied. The flow of the ultraviolet curable resin 8 that protrudes into the COG area 12 is restricted by the resin frame 7. Since the ultraviolet curable resin 8 flows preferentially to the driver IC 5 side in the COG area 12, the driver IC 5 is covered with the ultraviolet curable resin 8 without a gap. Further, the UV curable resin 8 is filled in the COG area 12 in a range surrounded by the back glass substrate 1, the cover panel 9, the driver IC 5, and the resin frame 7 without a gap.

  Next, when the cover panel 9 and the back glass substrate 1 are pressurized and irradiated and heated, the UV curable resin 8 filled in the COG area 12 as well as the display area 11 is cured. As a result, the driver IC 5 can be securely fixed to the back glass substrate 1 and there is no gap between the cover panel 9 and the back glass substrate 1, so that mechanical stress such as dropping, bending, and vibration after the resin is cured. In contrast, the damage resistance of the driver IC 5 can be improved.

  In this way, by filling the UV curable resin 8 around the driver IC 5 in the COG area 12 and curing it, the damage resistance of the driver IC 5 against mechanical stress such as dropping, bending, and vibration after the resin is cured. Can be improved.

  Furthermore, in this embodiment, the resin frame 7 is disposed along the long side of the overhanging portion 1a of the COG area 12, as shown in FIG. The ultraviolet curable resin 8 that protrudes into the COG area 12 is restricted in flow by the resin frame 7 disposed on the long side of the overhanging portion 1a of the back glass substrate 1 and flows into the driver IC 5 side. As a result, the driver IC 5 is covered with the ultraviolet curable resin 8, and the ultraviolet curable resin 8 is in a range surrounded by the back glass substrate 1, the cover panel 9, the driver IC 5, and the resin frame 7 in the COG area 12 without gaps. Filled. Next, when the cover panel 9 and the back glass substrate 1 are pressurized and irradiated with ultraviolet rays and heated, not only the display area 11 but also the UV curable resin 8 filled in the COG area 12 is cured. The substrate 1 can be securely fixed, and there is no gap between the cover panel 9 and the back glass substrate 1. Thereby, the damage resistance of the driver IC 5 can be improved against mechanical stress such as dropping, bending, and vibration after the resin is cured, and glass cracking of the COG area 12 can be prevented.

  According to the liquid crystal display device according to the present embodiment, the resin that has flowed into the COG area 12 is blocked by the resin frame 7 disposed along the long side of the overhanging portion 1a of the COG area 12. It is possible to prevent the resin from protruding to the periphery of the resin. Thereby, the process of wiping off the protruding resin is unnecessary, and the number of manufacturing processes can be reduced.

[Second Embodiment]
Next, a liquid crystal display device according to a second embodiment of the present invention will be described with reference to the drawings. FIG. 2A is a plan view of a liquid crystal display device according to the second embodiment of the present invention, and FIG. 2B is a cross-sectional view taken along line BB in FIG. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 1A and 1B, the liquid crystal display device according to the present embodiment has a display area 11 and a COG area 12 (driver IC area), and a cover panel 9 is bonded to the front surface. It is a liquid crystal display device. In the display area 11, a back glass substrate 1 and a front glass substrate 2 as an example of a pair of substrates are bonded together via a liquid crystal layer. In the COG area 12, an overhanging portion 1a is formed by extending the back glass substrate 1, and a driver IC 5 is mounted on the overhanging portion 1a. On the surfaces of the back glass substrate 1 and the front glass substrate 2 in the display area 11, a back polarizing plate 3 and a front polarizing plate 4 are attached, respectively. A light shielding tape 6 is attached to the surface of the back glass substrate 1 in the COG area 12.

  Further, in the present embodiment, a substantially U-shaped resin frame 7 is attached so as to correspond to the outer shape of the overhang portion 1a. The resin frame 7 is required to be made of a material that is transparent for allowing ultraviolet rays to pass through and has heat resistance so that it can withstand the heat generated when the resin is cured. For example, a PET material or the like is suitable, but not limited thereto. The material of the cover panel 9 may be either resin or glass, and may be constituted by a touch panel module or the like. Further, an ultraviolet curable resin 8 is filled between the cover panel 9, the resin frame 7, the driver IC 5, the back glass substrate 1, and the front glass substrate 2, and the cover panel 9 is bonded.

  Next, the manufacturing method of the liquid crystal display device according to the present embodiment will be explained. Similarly to the first embodiment, in the manufacturing process of the liquid crystal display device, the ultraviolet curable resin 8 is applied in a multiple manner so as to spread evenly between the front polarizing plate 4 and the cover panel 9 in the display area 11. Further, when the cover panel 9 and the back glass substrate 1 are pressurized, an amount of the ultraviolet curable resin 8 intended to protrude from the ultraviolet curable resin 8 is supplied to the COG area 12. The flow of the ultraviolet curable resin 8 that protrudes into the COG area 12 is restricted by the resin frame 7 arranged so that the peripheral portion of the COG area 12 is along the side of the back glass substrate 1. Since the ultraviolet curable resin 8 flows preferentially to the driver IC 5 side in the COG area 12, the driver IC 5 is covered with the ultraviolet curable resin 8 without a gap. Further, the UV curable resin 8 is filled in the COG area 12 in a range surrounded by the back glass substrate 1, the cover panel 9, the driver IC 5, and the resin frame 7 without a gap.

  Next, when the cover panel 9 and the back glass substrate 1 are pressurized and irradiated and heated, the UV curable resin 8 filled in the COG area 12 as well as the display area 11 is cured. As a result, the driver IC 5 can be securely fixed to the back glass substrate 1 and there is no gap between the cover panel 9 and the back glass substrate 1, so that mechanical stress such as dropping, bending, and vibration after the resin is cured. In contrast, the damage resistance of the driver IC 5 can be improved.

  In this way, the UV curable resin 8 is mainly filled around the driver IC 5 in the COG area 12 and cured, so that the driver IC 5 can be protected against mechanical stress such as dropping, bending, and vibration after the resin is cured. Damage resistance can be improved.

  Further, in the present embodiment, the resin frame 7 is arranged so that the peripheral portion of the COG area 12 is along the side of the back glass substrate 1 as shown in FIG. The shape of the resin frame 7 is a shape that covers three sides of the back glass substrate 1. In FIG. 1, the resin frame 7 is substantially U-shaped. The resin frame may be divided into a plurality of parts as in a third embodiment described later.

  In the present embodiment, the flow of the ultraviolet curable resin 8 that protrudes into the COG area 12 is restricted by the resin frame 7 having a shape that covers three sides of the back glass substrate 1. Therefore, the ultraviolet curable resin 8 does not protrude outside the back glass substrate 1 in the COG area 12 (both in the left and right directions) and flows into the driver IC 5 side. As a result, the driver IC 5 is covered with the UV curable resin 8 without a gap, and the UV curable resin 8 is covered in the COG area 12 within the range surrounded by the back glass substrate 1, the cover panel 9, the driver IC 5, and the resin frame 7. Fills without gaps. In addition, the ultraviolet curable resin 8 does not protrude beyond the back glass substrate 1 (both left and right and downward). Next, when the cover panel 9 and the back glass substrate 1 are pressurized and irradiated with ultraviolet rays and heated, not only the display area 11 but also the ultraviolet curable resin 8 filled in the COG area 12 is cured. Therefore, the driver IC 5 can be securely fixed to the back glass substrate 1 and there is no gap between the cover panel 9 and the back glass substrate 1. Thereby, the damage resistance of the driver IC 5 can be improved against mechanical stress such as dropping, bending, and vibration after the resin is cured, and glass cracking of the COG area 12 can be prevented.

  According to the liquid crystal display device according to the present embodiment, the resin that has flowed out into the COG area 12 has a substantially U-shaped resin frame 7 arranged so that the peripheral portion of the COG area 12 is along the side of the back glass substrate 1. Is blocked by Therefore, the protrusion of the resin around the liquid crystal display device can be suppressed. Thereby, the process of wiping off the protruding resin is unnecessary, and the number of manufacturing processes can be reduced.

[Third Embodiment]
Next, a liquid crystal display device according to a third embodiment of the present invention will be described with reference to the drawings. FIG. 3A is a plan view of a liquid crystal display device according to a third embodiment of the present invention, and FIG. 3B is a cross-sectional view taken along line CC in FIG. The same components as those in the second embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In this embodiment, the resin frame 7 of the liquid crystal display device according to the second embodiment is composed of a plurality of resin frame pieces. Specifically, as shown in FIGS. 2A and 2B, the liquid crystal display device according to the embodiment of the present embodiment has a display area 11 and a COG area 12, and a cover panel 9 on the front surface. It is a bonded liquid crystal display device. As in the second embodiment, in the display area 11, the back glass substrate 1 and the front glass substrate 2 as an example of a pair of substrates are bonded together via a liquid crystal layer. In the COG area 12, an overhanging portion 1a is formed by extending the back glass substrate 1, and a driver IC 5 is mounted on the overhanging portion 1a. Similar to the second embodiment, the back-side polarizing plate 3 and the front-side polarizing plate 4 are attached to the surfaces of the back-side glass substrate 1 and the front-side glass substrate 2 in the display area 11, respectively. A light shielding tape 6 is attached to the surface of the back glass substrate 1 in the COG area 12.

  In the present embodiment, a plurality of resin frame pieces 7a, 7b and 7c are attached so as to correspond to the outer shape of the overhanging portion 1a so that the peripheral portion of the COG area 12 is along the side of the back glass substrate 1. The plurality of resin frame pieces 7a, 7b and 7c as a whole are substantially U-shaped. Further, an ultraviolet curable resin 8 is filled between the cover panel 9 and the plurality of resin frame pieces 7a, 7b and 7c, the driver IC 5, the back glass substrate 1 and the front glass substrate 2, and the cover panel 9 is bonded together. ing.

  In the present embodiment, the flow of the ultraviolet curable resin 8 that protrudes into the COG area 12 is restricted by a plurality of resin frame pieces 7 a, 7 b, and 7 c that cover three sides of the back glass substrate 1. Therefore, the ultraviolet curable resin 8 does not protrude outside the back glass substrate 1 in the COG area 12 (both in the left and right directions) and flows into the driver IC 5 side. As a result, the driver IC 5 is covered with the ultraviolet curable resin 8 without a gap, and the COG area 12 is surrounded by the back glass substrate 1, the cover panel 9, the driver IC 5, and the resin frame pieces 7a, 7b, and 7c. The ultraviolet curable resin 8 is filled without a gap. In addition, the ultraviolet curable resin 8 does not protrude beyond the back glass substrate 1 (both left and right and downward). Next, when the cover panel 9 and the back glass substrate 1 are pressed and irradiated with ultraviolet rays and heated, not only the display area 11 but also the ultraviolet curable resin 8 filled in the COG area 12 is cured. As a result, the driver IC 5 can be securely fixed to the back glass substrate 1 and there is no gap between the cover panel 9 and the back glass substrate 1. As a result, the damage resistance of the driver IC 5 can be improved against mechanical stress such as dropping, bending, and vibration after the resin is cured, and glass cracking in the COG area 12 can be prevented.

  According to the liquid crystal display device according to the present embodiment, as in the second embodiment, the resin that has flowed into the COG area 12 is blocked by the plurality of resin frame pieces 7a, 7b, and 7c. Can be prevented from protruding. Thereby, the process of wiping off the protruding resin is unnecessary, and the number of manufacturing processes can be reduced. Furthermore, since the arrangement of the plurality of resin frame pieces 7a, 7b and 7c has the same function as in the second embodiment, the resin frame can be prepared in a simple shape, and the resin frame itself is procured. The number of manufacturing processes can be reduced while reducing costs.

  Although preferred embodiments have been described with reference to the drawings, the present invention is not limited to these embodiments. For example, in the above-described embodiment, the case where the present invention is applied to a liquid crystal display device has been described. However, the present invention may be applied to an organic electroluminescence (OLED) device.

  The present invention is not limited to the above-described embodiment, and various modifications are possible within the scope of the invention described in the claims, and it goes without saying that these are also included in the scope of the present invention. Yes.

DESCRIPTION OF SYMBOLS 1 Back side glass substrate 1a Overhang | projection part 2 Front side glass substrate 3 Back side polarizing plate 4 Front side polarizing plate 5 Driver IC
6 Light shielding tape 7 Resin frame 7a, 7b, 7c Resin frame piece 8 UV curable resin 9 Cover panel 11 Display area 12 COG area

Claims (5)

It has a display area and a COG area
The display area includes a pair of substrates bonded via a liquid crystal layer,
In the COG area, an overhang is formed by extending one of the pair of substrates.
A driver IC is provided on the overhang portion,
A resin frame disposed along the long side of the overhanging portion on the overhanging portion,
Comprising a resin filled between a cover panel and the resin frame, the driver IC and the pair of substrates;
The liquid crystal display device, wherein the cover panel is bonded to the pair of substrates.   The liquid crystal display device according to claim 1, wherein the resin frame is further arranged along at least one of side surfaces of the overhanging portion.   The liquid crystal display device according to claim 2, wherein the resin frame is substantially U-shaped.   The liquid crystal display device according to claim 1, wherein the resin frame includes a plurality of resin frame pieces. Prepare a pair of substrates and a cover panel bonded via a liquid crystal layer,
A driver IC is mounted on the extended portion where one of the pair of substrates is extended,
Affixing a resin frame along the long side of the overhang to the overhang,
A resin containing an amount sufficient to fill the region delimited by the resin frame is applied to the pair of substrates, and the cover panel is pressed to spread the resin to the region delimited by the resin frame, and then A method of manufacturing a liquid crystal display device, wherein the resin is cured.

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