JP2014042627A - Fan - Google Patents
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- Publication number
- JP2014042627A JP2014042627A JP2012185960A JP2012185960A JP2014042627A JP 2014042627 A JP2014042627 A JP 2014042627A JP 2012185960 A JP2012185960 A JP 2012185960A JP 2012185960 A JP2012185960 A JP 2012185960A JP 2014042627 A JP2014042627 A JP 2014042627A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- bis
- fan
- flat plates
- hydroxyphenyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims abstract description 101
- 239000011347 resin Substances 0.000 claims abstract description 101
- 238000000034 method Methods 0.000 abstract description 25
- 238000000465 moulding Methods 0.000 abstract description 21
- 230000001771 impaired effect Effects 0.000 abstract description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 47
- -1 polypropylene Polymers 0.000 description 44
- 229920001971 elastomer Polymers 0.000 description 23
- 239000003063 flame retardant Substances 0.000 description 21
- 229920001577 copolymer Polymers 0.000 description 20
- 238000002347 injection Methods 0.000 description 19
- 239000007924 injection Substances 0.000 description 19
- 229920005992 thermoplastic resin Polymers 0.000 description 19
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 17
- 229920001955 polyphenylene ether Polymers 0.000 description 17
- 239000005060 rubber Substances 0.000 description 17
- 229920000642 polymer Polymers 0.000 description 16
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 15
- 239000000463 material Substances 0.000 description 14
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 13
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 13
- 229920001230 polyarylate Polymers 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 11
- 239000007789 gas Substances 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- 239000000843 powder Substances 0.000 description 11
- 239000003381 stabilizer Substances 0.000 description 11
- 229920005669 high impact polystyrene Polymers 0.000 description 10
- 239000004797 high-impact polystyrene Substances 0.000 description 10
- 239000000178 monomer Substances 0.000 description 10
- 229920000800 acrylic rubber Polymers 0.000 description 9
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 9
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- 239000000047 product Substances 0.000 description 9
- 150000001336 alkenes Chemical class 0.000 description 8
- 125000003118 aryl group Chemical group 0.000 description 8
- 229920006026 co-polymeric resin Polymers 0.000 description 8
- 239000004088 foaming agent Substances 0.000 description 8
- 238000001746 injection moulding Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229920002959 polymer blend Polymers 0.000 description 8
- 229920001187 thermosetting polymer Polymers 0.000 description 8
- 229930185605 Bisphenol Natural products 0.000 description 7
- 229910019142 PO4 Inorganic materials 0.000 description 7
- 239000004793 Polystyrene Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000010452 phosphate Substances 0.000 description 7
- 229920005668 polycarbonate resin Polymers 0.000 description 7
- 239000004431 polycarbonate resin Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 6
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 6
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 238000005187 foaming Methods 0.000 description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 6
- 229920002223 polystyrene Polymers 0.000 description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 6
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 5
- 239000004709 Chlorinated polyethylene Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 5
- 239000005062 Polybutadiene Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229920003244 diene elastomer Polymers 0.000 description 5
- 239000000806 elastomer Substances 0.000 description 5
- 239000005038 ethylene vinyl acetate Substances 0.000 description 5
- 238000010097 foam moulding Methods 0.000 description 5
- 238000010559 graft polymerization reaction Methods 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 229920006324 polyoxymethylene Polymers 0.000 description 5
- 239000004800 polyvinyl chloride Substances 0.000 description 5
- 229920000915 polyvinyl chloride Polymers 0.000 description 5
- 229920003048 styrene butadiene rubber Polymers 0.000 description 5
- 229920002725 thermoplastic elastomer Polymers 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- 229920002554 vinyl polymer Polymers 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000004711 α-olefin Substances 0.000 description 5
- BSWWXRFVMJHFBN-UHFFFAOYSA-N 2,4,6-tribromophenol Chemical compound OC1=C(Br)C=C(Br)C=C1Br BSWWXRFVMJHFBN-UHFFFAOYSA-N 0.000 description 4
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 4
- ODJUOZPKKHIEOZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3,5-dimethylphenyl)propan-2-yl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=C(C)C=2)=C1 ODJUOZPKKHIEOZ-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000004677 Nylon Substances 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- 150000001335 aliphatic alkanes Chemical class 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 4
- 238000000748 compression moulding Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 150000004820 halides Chemical class 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 229920001778 nylon Polymers 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920000098 polyolefin Polymers 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 229910001868 water Inorganic materials 0.000 description 4
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- 229920001890 Novodur Polymers 0.000 description 3
- 229930040373 Paraformaldehyde Natural products 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- 239000002174 Styrene-butadiene Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 3
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical group 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 239000010445 mica Substances 0.000 description 3
- 229910052618 mica group Inorganic materials 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 3
- 235000011007 phosphoric acid Nutrition 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
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- 239000000454 talc Substances 0.000 description 3
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- QQOMQLYQAXGHSU-UHFFFAOYSA-N 2,3,6-Trimethylphenol Chemical compound CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 2
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- GVLZQVREHWQBJN-UHFFFAOYSA-N 3,5-dimethyl-7-oxabicyclo[2.2.1]hepta-1,3,5-triene Chemical compound CC1=C(O2)C(C)=CC2=C1 GVLZQVREHWQBJN-UHFFFAOYSA-N 0.000 description 2
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- SUCTVKDVODFXFX-UHFFFAOYSA-N 4-(4-hydroxy-3,5-dimethylphenyl)sulfonyl-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(S(=O)(=O)C=2C=C(C)C(O)=C(C)C=2)=C1 SUCTVKDVODFXFX-UHFFFAOYSA-N 0.000 description 2
- OWKRQBRCGMUVNV-UHFFFAOYSA-N 4-[(4-hydroxy-3,5-dimethylphenyl)-phenylmethyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C=2C=CC=CC=2)C=2C=C(C)C(O)=C(C)C=2)=C1 OWKRQBRCGMUVNV-UHFFFAOYSA-N 0.000 description 2
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- BUGLKPUHRTVBDI-UHFFFAOYSA-N 4-[1-(4-hydroxy-3,5-dimethylphenyl)-1-phenylethyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C)(C=2C=CC=CC=2)C=2C=C(C)C(O)=C(C)C=2)=C1 BUGLKPUHRTVBDI-UHFFFAOYSA-N 0.000 description 2
- BWCAVNWKMVHLFW-UHFFFAOYSA-N 4-[1-(4-hydroxy-3,5-dimethylphenyl)cyclohexyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C2(CCCCC2)C=2C=C(C)C(O)=C(C)C=2)=C1 BWCAVNWKMVHLFW-UHFFFAOYSA-N 0.000 description 2
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- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
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- 150000001408 amides Chemical class 0.000 description 2
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- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
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- 230000015572 biosynthetic process Effects 0.000 description 2
- JWAPUVVSOVJCJB-UHFFFAOYSA-N bis(4-hydroxy-3,5-dimethylphenyl)methanone Chemical compound CC1=C(O)C(C)=CC(C(=O)C=2C=C(C)C(O)=C(C)C=2)=C1 JWAPUVVSOVJCJB-UHFFFAOYSA-N 0.000 description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 235000012241 calcium silicate Nutrition 0.000 description 2
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- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
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- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
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- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- VZEGPPPCKHRYGO-UHFFFAOYSA-N diethoxyphosphorylbenzene Chemical compound CCOP(=O)(OCC)C1=CC=CC=C1 VZEGPPPCKHRYGO-UHFFFAOYSA-N 0.000 description 2
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- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 150000002483 hydrogen compounds Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- QPPQHRDVPBTVEV-UHFFFAOYSA-N isopropyl dihydrogen phosphate Chemical compound CC(C)OP(O)(O)=O QPPQHRDVPBTVEV-UHFFFAOYSA-N 0.000 description 1
- 239000011980 kaminsky catalyst Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000005078 molybdenum compound Substances 0.000 description 1
- 150000002752 molybdenum compounds Chemical class 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- ALIFPGGMJDWMJH-UHFFFAOYSA-N n-phenyldiazenylaniline Chemical compound C=1C=CC=CC=1NN=NC1=CC=CC=C1 ALIFPGGMJDWMJH-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 150000002826 nitrites Chemical class 0.000 description 1
- 150000002832 nitroso derivatives Chemical class 0.000 description 1
- CMUOJBJRZUHRMU-UHFFFAOYSA-N nitrourea Chemical compound NC(=O)N[N+]([O-])=O CMUOJBJRZUHRMU-UHFFFAOYSA-N 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
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- 230000001590 oxidative effect Effects 0.000 description 1
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- 239000000123 paper Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- SVHOVVJFOWGYJO-UHFFFAOYSA-N pentabromophenol Chemical compound OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br SVHOVVJFOWGYJO-UHFFFAOYSA-N 0.000 description 1
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- 230000002093 peripheral effect Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920005670 poly(ethylene-vinyl chloride) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
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- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
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- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000008262 pumice Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000004208 shellac Substances 0.000 description 1
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 description 1
- 229940113147 shellac Drugs 0.000 description 1
- 235000013874 shellac Nutrition 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000010454 slate Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910001388 sodium aluminate Inorganic materials 0.000 description 1
- 239000000429 sodium aluminium silicate Substances 0.000 description 1
- 235000012217 sodium aluminium silicate Nutrition 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920006346 thermoplastic polyester elastomer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- NDLIRBZKZSDGSO-UHFFFAOYSA-N tosyl azide Chemical compound CC1=CC=C(S(=O)(=O)[N-][N+]#N)C=C1 NDLIRBZKZSDGSO-UHFFFAOYSA-N 0.000 description 1
- 239000011032 tourmaline Substances 0.000 description 1
- 229940070527 tourmaline Drugs 0.000 description 1
- 229910052613 tourmaline Inorganic materials 0.000 description 1
- 229920003212 trans-1,4-polyisoprene Polymers 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- MNMVKGDEKPPREK-UHFFFAOYSA-N trimethyl(prop-2-enoxy)silane Chemical compound C[Si](C)(C)OCC=C MNMVKGDEKPPREK-UHFFFAOYSA-N 0.000 description 1
- VRRIVXLVXXAHJA-UHFFFAOYSA-N tris(2,3,4-tribromophenyl) phosphate Chemical compound BrC1=C(Br)C(Br)=CC=C1OP(=O)(OC=1C(=C(Br)C(Br)=CC=1)Br)OC1=CC=C(Br)C(Br)=C1Br VRRIVXLVXXAHJA-UHFFFAOYSA-N 0.000 description 1
- LRSNDFOWYYKLHB-UHFFFAOYSA-N tris(2,3-dibromophenyl) phosphate Chemical compound BrC1=CC=CC(OP(=O)(OC=2C(=C(Br)C=CC=2)Br)OC=2C(=C(Br)C=CC=2)Br)=C1Br LRSNDFOWYYKLHB-UHFFFAOYSA-N 0.000 description 1
- RAHOVDYZPHFOSY-UHFFFAOYSA-N tris(3-hydroxypropyl) phosphate Chemical compound OCCCOP(=O)(OCCCO)OCCCO RAHOVDYZPHFOSY-UHFFFAOYSA-N 0.000 description 1
- XHGIFBQQEGRTPB-UHFFFAOYSA-N tris(prop-2-enyl) phosphate Chemical compound C=CCOP(=O)(OCC=C)OCC=C XHGIFBQQEGRTPB-UHFFFAOYSA-N 0.000 description 1
- BHYQWBKCXBXPKM-UHFFFAOYSA-N tris[3-bromo-2,2-bis(bromomethyl)propyl] phosphate Chemical compound BrCC(CBr)(CBr)COP(=O)(OCC(CBr)(CBr)CBr)OCC(CBr)(CBr)CBr BHYQWBKCXBXPKM-UHFFFAOYSA-N 0.000 description 1
- NSBGJRFJIJFMGW-UHFFFAOYSA-N trisodium;stiborate Chemical compound [Na+].[Na+].[Na+].[O-][Sb]([O-])([O-])=O NSBGJRFJIJFMGW-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000005335 volcanic glass Substances 0.000 description 1
- 239000004636 vulcanized rubber Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Walking Sticks, Umbrellas, And Fans (AREA)
Abstract
Description
本発明は、扇子に関するものである。 The present invention relates to a fan.
特開平10−304918号公報には、樹脂板同士を連結部で連結させて、当該連結部で開閉可能にした扇子が記載されている。 Japanese Patent Application Laid-Open No. 10-304918 describes a fan in which resin plates are connected to each other at a connecting portion and can be opened and closed at the connecting portion.
本発明は、製造工程を簡素化できる扇子を提供することを目的とする。 An object of this invention is to provide the fan which can simplify a manufacturing process.
請求項1の扇子は、樹脂からなる複数の長尺な平板と、重ねた複数の前記平板の長手方向の一端部を貫通するように設ける軸と、前記軸を中心として前記平板を回転させたときに、互いに隣り合う前記平板の他端部間に隙間が生じないように、互いに隣り合う前記平板の動きを拘束する線材と、を備え、前記平板および前記線材は、前記樹脂により一体成形されていることを特徴とする。 The fan of claim 1 has a plurality of long flat plates made of resin, a shaft provided so as to pass through one end portion in the longitudinal direction of the plurality of stacked flat plates, and the flat plate rotated about the shaft. A wire rod that restrains the movement of the adjacent flat plates so that no gap is generated between the other end portions of the flat plates adjacent to each other, and the flat plate and the wire rod are integrally formed of the resin. It is characterized by.
請求項2の扇子は、請求項1の扇子において、複数の前記平板の内の1枚と、前記軸が一体成形されていることを特徴とする。 The fan of claim 2 is the fan of claim 1, wherein one of the plurality of flat plates and the shaft are integrally formed.
請求項3の扇子は、請求項1または請求項2の扇子において、前記線材の周りには、前記樹脂が一体成形されていることを特徴とする。 The fan of claim 3 is the fan of claim 1 or 2, wherein the resin is integrally formed around the wire.
請求項4の扇子は、請求項1または請求項2の扇子において、前記線材は、前記樹脂からなる紐部材であることを特徴とする。 The fan of claim 4 is the fan of claim 1 or 2, wherein the wire is a string member made of the resin.
請求項1の扇子は、複数の長尺な平板と平板の動きを拘束する線材が金型内で樹脂により一体成形されていない場合と比較して、製造工程を簡素化できる。 The fan of claim 1 can simplify the manufacturing process as compared with a case where a plurality of long flat plates and a wire rod that restrains the movement of the flat plates are not integrally formed with resin in the mold.
請求項2の扇子は、平板に軸が一体成形されていない場合と比較して、製造工程を簡素化できる。 The fan of claim 2 can simplify the manufacturing process as compared with the case where the shaft is not integrally formed on the flat plate.
請求項3の扇子は、線材の周りに樹脂が一体成形されていない場合と比較して、線材の強度を増すことができる。 The fan of claim 3 can increase the strength of the wire as compared with the case where the resin is not integrally formed around the wire.
請求項4の扇子は、線材が樹脂から構成されていない場合と比較して、製造工程を簡素化することができる。 The fan of Claim 4 can simplify a manufacturing process compared with the case where a wire is not comprised from resin.
図面を用いて本発明を説明する。なお、本発明は、以下の実施例により何ら限定されるものではない。 The present invention will be described with reference to the drawings. In addition, this invention is not limited at all by the following examples.
図1〜図4を用いて本発明に係る一実施例を説明する。
尚、本実施例1では、扇子として一般的な扇形状の扇子を例示して説明する。
また、図3および図4は、説明を簡単にするため、射出成形金型の主要な部分のみ図示し、それ以外の部分の図示を省略している。
An embodiment according to the present invention will be described with reference to FIGS.
In the first embodiment, a general fan-shaped fan will be described as an example.
3 and 4 only show the main part of the injection mold for the sake of simplicity, and the other parts are not shown.
〔扇子〕
図1に示すように、扇子1は、樹脂からなる複数(例えば、16枚)の長尺な平板2と、重ねた複数の平板2の長手方向の一端部41を貫通するように設ける軸4と、軸4を中心として平板2を回転させたときに、互いに隣り合う平板2の他端部42間に隙間が生じないように、互いに隣り合う平板2の動きを拘束する線材3と、を備えている。そして、平板2および線材3は、樹脂により一体成形されている。
尚、線材3の材質は問わないが、線材3と平板3とを一体的に成形するため、線材3の材質は、少なくとも平板3を構成する樹脂の融点よりも高いものを選択する必要がある。
[Folding fan]
As shown in FIG. 1, the fan 1 includes a plurality of (for example, 16) long flat plates 2 made of resin and a shaft 4 provided so as to pass through one end portion 41 in the longitudinal direction of the plurality of stacked flat plates 2. And a wire rod 3 that restrains the movement of the adjacent flat plates 2 so that no gap is generated between the other end portions 42 of the adjacent flat plates 2 when the flat plate 2 is rotated around the axis 4. I have. And the flat plate 2 and the wire 3 are integrally molded with resin.
Although the material of the wire 3 is not limited, it is necessary to select the material of the wire 3 higher than the melting point of the resin constituting the flat plate 3 because the wire 3 and the flat plate 3 are integrally formed. .
軸4は、複数に重ねた平板2の一端部41を貫通するように設けられている。
つまり、平板2の一端部41の所定の位置には、予め貫通穴が形成されており、金属等からなる軸4は、全ての平板2を重ねたときに連通する全ての貫通穴を貫くように挿入される。その後、軸4の両端部を、かしめ等することにより、軸4から平板2が抜けることは無い。
かかる構成により、複数の平板2は、軸4を中心として時計方向または反時計方向に回転させることができる。
The axis | shaft 4 is provided so that the one end part 41 of the flat plate 2 accumulated in multiple numbers may be penetrated.
That is, a through hole is formed in advance at a predetermined position of the one end portion 41 of the flat plate 2, and the shaft 4 made of metal or the like passes through all the through holes that communicate with each other when all the flat plates 2 are stacked. Inserted into. Thereafter, the flat plate 2 does not come off from the shaft 4 by caulking both ends of the shaft 4.
With this configuration, the plurality of flat plates 2 can be rotated clockwise or counterclockwise about the shaft 4.
複数の平板2の他端部42は、図1および図2に示すように、線材3と連結されている。そして、線材3の長さは、互いに隣り合う平板2の他端部42間に隙間が生じない長さに設定されている。このため、複数の平板2を軸4の周りに回転させて開いた時、平板2の他端部42は、線材3によってその動きが拘束されるので、所定の角度しか回転できず、扇形状が形成されるようになっている。 The other end portions 42 of the plurality of flat plates 2 are connected to the wire 3 as shown in FIGS. 1 and 2. The length of the wire 3 is set to a length that does not cause a gap between the other end portions 42 of the adjacent flat plates 2. For this reason, when the plurality of flat plates 2 are rotated around the shaft 4 and opened, the movement of the other end portion 42 of the flat plate 2 is restricted by the wire 3 so that it can only rotate at a predetermined angle, and has a fan shape. Is to be formed.
〔射出成形金型〕
次に、本発明に係る扇子1を成形する為の射出成形金型について説明する。
図3および図4に示すように、本発明に係る扇子1を成形する為の射出成形金型30は、扇子1の平板2と線材3とを一体的に成形(一体成形)するためのキャビティ38を備えた固定側金型31と、可動側金型32が、パーティングライン面39で分割可能に構成されている。
[Injection mold]
Next, an injection mold for molding the fan 1 according to the present invention will be described.
As shown in FIGS. 3 and 4, an injection mold 30 for molding the fan 1 according to the present invention is a cavity for integrally molding (integral molding) the flat plate 2 and the wire 3 of the fan 1. The fixed side mold 31 provided with 38 and the movable side mold 32 are configured to be split by a parting line surface 39.
(入れ子)
固定側金型31には入れ子(固定側入れ子)33、可動側金型32には入れ子(可動側入れ子)34がそれぞれ固定されており、固定側金型31および可動側金型32を型締めすることで、入れ子33および入れ子34が接触し、平板2および線材3を一体成形するためのキャビティ38が形成される。
(Nested)
A nesting (fixed-side nesting) 33 is fixed to the fixed mold 31 and a nesting (movable-side nesting) 34 is fixed to the movable mold 32, and the fixed mold 31 and the movable mold 32 are clamped. As a result, the insert 33 and the insert 34 come into contact with each other, and a cavity 38 for integrally forming the flat plate 2 and the wire 3 is formed.
本実施例1では平板2の枚数は16枚であるため、キャビティ38は、16枚の平板2を成形するための16個の大キャビティ43と、小キャビティ43間に形成された平板2の他端部42同士を連結するための1本の線材3を予め入れる15個の小キャビティ44と、からなる。小キャビティ44の大きさ(直径)は、線材3の直径と略同じ大きさとされており、大キャビティ43に射出された溶融樹脂が小キャビティ44に流入され難くなっている。 In the first embodiment, since the number of the flat plates 2 is 16, the cavity 38 includes 16 large cavities 43 for forming the 16 flat plates 2 and the flat plate 2 formed between the small cavities 43. 15 small cavities 44 into which one wire 3 for connecting the end portions 42 to each other is placed in advance. The size (diameter) of the small cavity 44 is substantially the same as the diameter of the wire 3, and the molten resin injected into the large cavity 43 is difficult to flow into the small cavity 44.
〔扇子の製造方法〕
次に、射出成形金型30を使用して扇子を製造する方法について説明する。
[Folding fan manufacturing method]
Next, a method for manufacturing a fan using the injection mold 30 will be described.
(成形材料)
本実施例1では、扇子の成形材料である樹脂(ペレット)として、熱可塑性樹脂であるポリプロピレン(polypropylene)を用いた。
(Molding material)
In Example 1, polypropylene (polypropylene), which is a thermoplastic resin, was used as a resin (pellet) that is a molding material for a fan.
(製造方法)
まず、図3および図4に示す射出成形金型30を準備し、固定側金型31の入れ子33の15個の小キャビティ44に、あ本の線材3を真っ直ぐにたるまないようにセットする。尚、本実施例1では、線材3の材質として、ナイロンを用いた。
(Production method)
First, the injection mold 30 shown in FIGS. 3 and 4 is prepared, and the wire 3 is set in the fifteen small cavities 44 of the insert 33 of the fixed mold 31 so as not to sag straightly. In Example 1, nylon was used as the material for the wire 3.
次に、射出成形金型30の可動側金型32を固定側金型31へ移動させて型締めし、入れ子33および入れ子34の小キャビティ44により線材3を保持する。そして、図示しない射出成形装置の樹脂注入ノズル(図示せず)から溶融樹脂を射出成形金型30に注入する。溶融樹脂は、固定側金型4に設けられたスプルーブッシュのスプルー35、ランナー36およびゲート37を介して、射キャビティ38に射出される。 Next, the movable mold 32 of the injection mold 30 is moved to the fixed mold 31 and clamped, and the wire 3 is held by the insert 33 and the small cavity 44 of the insert 34. Then, molten resin is injected into the injection mold 30 from a resin injection nozzle (not shown) of an injection molding apparatus (not shown). The molten resin is injected into the injection cavity 38 through the sprue 35 of the sprue bush, the runner 36 and the gate 37 provided in the fixed mold 4.
この点について、より詳細に説明する。溶融樹脂は、ゲート37から1つ目の大キャビティ43に注入され、1つ目の大キャビティ43を満たすとともに、大キャビティ43同士を連通させる流路45を介して1つ目の大キャビティ43に隣接する2つ目の大キャビティ43に流入する。 This point will be described in more detail. The molten resin is injected from the gate 37 into the first large cavity 43, fills the first large cavity 43, and enters the first large cavity 43 via the flow path 45 that allows the large cavities 43 to communicate with each other. It flows into the adjacent second large cavity 43.
同様に、2つ目の大キャビティ43に流入した溶融樹脂は、2つ目の大キャビティ43に注入され、2つ目の大キャビティ43を満たすとともに、2つ目の大キャビティ43に連通する流路45から2つ目の大キャビティ43に隣接する3つ目の大キャビティ43に流入する。このようにして溶融樹脂は、流路45を解して1つ目の大キャビティ43から16個目の大キャビティ43まで順次16個の大キャビティ43を満たす。 Similarly, the molten resin flowing into the second large cavity 43 is injected into the second large cavity 43, fills the second large cavity 43, and communicates with the second large cavity 43. It flows from the passage 45 into the third large cavity 43 adjacent to the second large cavity 43. In this way, the molten resin fills the 16 large cavities 43 sequentially from the first large cavity 43 to the 16th large cavity 43 through the flow path 45.
尚、流路45は、大キャビティ43において、大キャビティ43により成形される平板2の一端部41側に形成されている。また、小キャビティ44は、大キャビティ43において、大キャビティ43により成形される平板2の他端部42側に形成されている。 The channel 45 is formed in the large cavity 43 on the one end 41 side of the flat plate 2 formed by the large cavity 43. The small cavity 44 is formed in the large cavity 43 on the side of the other end portion 42 of the flat plate 2 formed by the large cavity 43.
キャビティ38に溶融樹脂が満たされた後、溶融樹脂を硬化(冷却固化)させることにより、16枚の平板2と、16枚の平板2同士を連結する一本の線材3とが一体的に成形される。 After the cavity 38 is filled with the molten resin, the molten resin is cured (cooled and solidified), whereby the 16 flat plates 2 and the single wire 3 that connects the 16 flat plates 2 to each other are integrally formed. Is done.
その後、型開きをして全ての平板2と線材3を金型30から取り出し、全ての平板2を重ねて、その一端部に形成された貫通孔7に軸4(例えば、銅製のピン)を挿入する。軸4の両端は、かしめ等を行い、平板2から抜けないようにする。 Thereafter, the mold is opened, all the flat plates 2 and the wire rods 3 are taken out from the mold 30, all the flat plates 2 are overlapped, and the shaft 4 (for example, a copper pin) is inserted into the through hole 7 formed at one end thereof. insert. The both ends of the shaft 4 are caulked so as not to come off the flat plate 2.
以上の工程により、図1に示す扇子1を製造することができる。
本実施例1の扇子1の出来上がり寸法は、平板2の長手方向の長さ寸法を200mm、幅寸法を10mm、厚み寸法は0.8mmとした。また、線材4は、薄くて平らな紐帯状であり、幅寸法を5mm、厚み寸法は0.3mmであり、隣り合う平板2同士を連結する線材4の間隔の長さは、9mmとした。
尚、本実施例1では、各平板2の他端部における幅方向の中心に線材4を通した。
The fan 1 shown in FIG. 1 can be manufactured by the above process.
The finished dimensions of the fan 1 of Example 1 were such that the longitudinal dimension of the flat plate 2 was 200 mm, the width dimension was 10 mm, and the thickness dimension was 0.8 mm. Moreover, the wire 4 was thin and flat string-like, the width dimension was 5 mm, the thickness dimension was 0.3 mm, and the length of the space | interval of the wire 4 which connects the adjacent flat plates 2 was 9 mm.
In Example 1, the wire 4 was passed through the center in the width direction at the other end of each flat plate 2.
本発明の他の実施例について説明する。
尚、説明を分かり易くするため、実施例1との相違点のみを説明し、同一の部分は同一の符号を用いて説明を省略する。
Another embodiment of the present invention will be described.
In order to make the description easy to understand, only differences from the first embodiment will be described, and the same portions are denoted by the same reference numerals and the description thereof will be omitted.
本実施例2と実施例1との相違点は、実施例1では軸4を射出成形金型30から射出成形品を取り出した後、射出成形品の平板2の一端部に取り付けていたのに対し、本実施例2では、軸4を金型内で複数の平板2の内の1枚と樹脂で一体成形する点が異なる。 The difference between the second embodiment and the first embodiment is that in the first embodiment, the shaft 4 is attached to one end portion of the flat plate 2 of the injection molded product after the injection molded product is taken out from the injection mold 30. On the other hand, the second embodiment is different in that the shaft 4 is integrally molded with resin and one of the plurality of flat plates 2 in the mold.
より具体的説明すると、例えば、複数(実施例1では16枚)の平板2の内、射出成形金型30の最も端部にある(扇子1の最も端部にある)平板2(ここでは平板201とする)の一端部に、平板2を構成する樹脂と同一樹脂からなる軸4を一体成形するために、金型30の平板201を成形する大キャビティに円筒状または円柱状の軸4を成形するための凹部を形成する。 More specifically, for example, among a plurality (16 in the first embodiment) of the flat plates 2, the flat plate 2 (here, the flat plate) located at the end of the injection mold 30 (at the end of the fan 1). In order to integrally form the shaft 4 made of the same resin as that constituting the flat plate 2 at one end of the flat plate 201, a cylindrical or columnar shaft 4 is formed in a large cavity for molding the flat plate 201 of the mold 30. A recess for forming is formed.
軸4は、平板201の一方の面から突出するように形成されており、その長さは、他の15枚の平板2のを重ねて形成される連通する15個の貫通穴の深さ以上となっている。別言すると、平板201以外の全て(実施例1では15枚)の平板2の貫通穴に軸4を挿入した後であっても、軸4の先端部は、最後に挿入した平板2の表面から突出する長さに設定されている。このため、この突出した軸4の先端部を最後に加熱して拡径することにより、軸4の周りに全ての平板4が回転可能、かつ、軸4から全ての平板2が抜けないように構成することができる。 The shaft 4 is formed so as to protrude from one surface of the flat plate 201, and the length thereof is equal to or greater than the depth of 15 through-holes formed by overlapping the other 15 flat plates 2. It has become. In other words, even after the shaft 4 is inserted into the through holes of all the flat plates 2 other than the flat plate 201 (15 in the first embodiment), the tip of the shaft 4 is the surface of the last inserted flat plate 2. It is set to the length that protrudes from. For this reason, by heating the end portion of the protruding shaft 4 lastly to expand the diameter, all the flat plates 4 can rotate around the shaft 4 and all the flat plates 2 cannot be removed from the shaft 4. Can be configured.
尚、樹脂からなる軸4を一体的に成形する平板2は、どの平板2であっても良い。例えば、平板201には軸4を一体成形せず、その隣りの平板202に軸4を一体成形しても良い。この場合は、平板201には、平板202以外の他の平板と同様、一端部には貫通穴を形成する。そして、平板202の一端部の両面には軸4を構成する円筒形状または円柱形状の突起を形成する。平板202の一方の面から突出する突起の長さは、平板201の貫通穴に挿入した際に、先端部が突出し、かつ、当該先端部を溶融して拡径部を形成できる長さである。また、平板202の他方の面から突出する突起の長さは、平板201および202以外の平板2の貫通穴に挿入した際に、先端部が突出し、かつ、当該先端部を溶融して拡径部を形成できる長さである。このように、軸4は、どの平板2に形成しても良い。 The flat plate 2 that integrally molds the shaft 4 made of resin may be any flat plate 2. For example, the shaft 4 may not be integrally formed with the flat plate 201 but may be integrally formed with the flat plate 202 adjacent thereto. In this case, a through hole is formed in one end of the flat plate 201 as in the case of flat plates other than the flat plate 202. Then, cylindrical or columnar protrusions constituting the shaft 4 are formed on both surfaces of one end of the flat plate 202. The length of the protrusion protruding from one surface of the flat plate 202 is such a length that, when inserted into the through hole of the flat plate 201, the tip portion protrudes and the tip portion can be melted to form the enlarged diameter portion. . Further, the length of the protrusion protruding from the other surface of the flat plate 202 is such that when inserted into the through hole of the flat plate 2 other than the flat plates 201 and 202, the tip portion protrudes and the tip portion is melted to expand the diameter. It is the length which can form a part. Thus, the shaft 4 may be formed on any flat plate 2.
また、軸4は、平板2を構成する樹脂よりも融点が高い熱可塑性樹脂、熱硬化性樹脂、金属またはガラスから構成されており、予め前記した金型30の凹部に当該軸4を挿入するインサート成形により、平板2の1枚と軸4とを一体的に成形しても良い。 The shaft 4 is made of a thermoplastic resin, a thermosetting resin, a metal or glass having a melting point higher than that of the resin constituting the flat plate 2, and the shaft 4 is inserted into the recess of the mold 30 described above in advance. One piece of the flat plate 2 and the shaft 4 may be integrally formed by insert molding.
前記した実施例は、説明のために例示したものであって、本発明としてはそれらに限定されるものではなく、特許請求の範囲および明細書の記載から当業者が認識することができる本発明の技術的思想に反しない限り、変更、削除および付加が可能である。 The above-described embodiments have been illustrated for the purpose of explanation, and the present invention is not limited thereto. The present invention can be recognized by those skilled in the art from the scope of the claims and the description. Modifications, deletions, and additions are possible as long as they are not contrary to the technical idea of the above.
例えば、予めキャビティにセットした1本の線材3の周りに樹脂が付着するように、小キャビティの直径を線材3の直径よりも大きくして良い。この場合は、予め挿入(インサート)した線材に沿って大キャビティに射出した溶融樹脂が小キャビティに流入する。これにより、平板2と線材3を連結する連結部5が補強され、丈夫な扇子1を成形することができる。 For example, the diameter of the small cavity may be larger than the diameter of the wire 3 so that the resin adheres around the one wire 3 set in the cavity in advance. In this case, the molten resin injected into the large cavity along the wire inserted (inserted) in advance flows into the small cavity. Thereby, the connection part 5 which connects the flat plate 2 and the wire 3 is reinforced, and the durable fan 1 can be shape | molded.
また、線材3を予めキャビティに挿入することなく、線材3自体を、平板2を構成する樹脂で形成しても良い。つまり、金型30において、線材3を予めインサートしないため、大キャビティに射出された溶融樹脂は、そのまま小キャビティにも流入する。このため、隣り合う大キャビティで成形される平板2は、小キャビティで成形される樹脂からなる紐部材で連結される。
以上により、本発明により成形された扇子は、隣り合う平板同士の連結部が軟弱化せず、連結が損なわれることはなく、組立工程を簡素化でき、早く、安価に扇子を提供することができる。
Further, the wire 3 itself may be formed of a resin constituting the flat plate 2 without inserting the wire 3 into the cavity in advance. That is, since the wire 3 is not inserted in the mold 30 in advance, the molten resin injected into the large cavity flows into the small cavity as it is. For this reason, the flat plate 2 formed by adjacent large cavities is connected by a string member made of resin formed by a small cavity.
As described above, the fan molded according to the present invention does not weaken the connecting portion between adjacent flat plates, does not impair the connection, can simplify the assembly process, and can provide the fan quickly and inexpensively. it can.
また、前記した実施例1において、固定側金型と可動側金型の開閉方向は、縦方向であっても横方向であっても良い。 In the first embodiment described above, the opening and closing directions of the fixed side mold and the movable side mold may be the vertical direction or the horizontal direction.
また、平板2の表面に装飾を施す成形してもよく、また、金属や宝石等の装飾品をインサートしても良い。装飾として、動物や風景など様々なイラスト(図柄)の他に、企業ロゴマーク、ドメイン、ブランド名、キャッチフレーズなど様々な文字等も採用でき、宣伝広告用とすることも可能である。さらに装飾としての、マイナスイオン効果のあるトルマリン微粒子、竹炭 消臭性材料、白蛇などの芳香性材料を採用しても良い。 Further, the surface of the flat plate 2 may be molded to be decorated, or a decorative item such as metal or jewelry may be inserted. As decoration, in addition to various illustrations (designs) such as animals and landscapes, various characters such as company logo marks, domains, brand names, catchphrases, etc. can be adopted and can be used for advertising purposes. In addition, aromatic materials such as tourmaline fine particles having a negative ion effect, bamboo charcoal deodorant material, and white snake may be used as decorations.
また、金型にインサートする線材は、綿や絹、ナイロン等の糸や、金属等でできたワイヤーをインサートしても良く、また、成形後に線材を扇子から抜糸する成形方法を採用しても問題ない。 In addition, the wire inserted into the mold may be a thread made of cotton, silk, nylon, etc., or a wire made of metal or the like, or a molding method in which the wire is removed from the fan after molding. no problem.
また、実施例1に例示した平板2と紐部材4を連結する連結部5は、平板2の一端に形成することを例示したが、連結でき、扇形状に開き回転できる位置であれば問題としない。例示した位置が、本来の扇子の機能の効果を発揮できるので好ましい。 Moreover, although the connection part 5 which connects the flat plate 2 illustrated in Example 1 and the string member 4 illustrated forming in the end of the flat plate 2, if it can be connected and it can open and rotate in a fan shape, it will be a problem. do not do. The exemplified positions are preferable because the function of the original fan can be exhibited.
また、前記平板の寸法において、実施例1においては、厚み寸法は0.8mmとしたが、0.1mm以上であれば、実施例の同様の効果を奏することができ、望ましい。また、前記紐部材の寸法において、実施例1においては、厚み寸法は0.3mmとしたが、0.1mm以上50mm以下の範囲内であれば、実施例の同様の効果を奏することができ、望ましい。 Moreover, in the dimension of the said flat plate, in Example 1, although the thickness dimension was 0.8 mm, if it is 0.1 mm or more, the same effect of an Example can be produced and it is desirable. Moreover, in the dimension of the said string member, in Example 1, although the thickness dimension was 0.3 mm, if it is in the range of 0.1 mm or more and 50 mm or less, the same effect as the example can be achieved, desirable.
また、実施例1に例示した材質が銅のピンを例示したが、防食効果の高いSUS(ステンレス鋼「Stainless steel」の略。)を使用することにより、ピンの表面の腐食を防ぐことができる。鉄を主成分とする材料の場合は、ニッケル鍍金などの表面処理を施す事で腐食の問題は解決される。 Moreover, although the material illustrated in Example 1 illustrated the pin of copper, corrosion of the surface of a pin can be prevented by using SUS (abbreviation of stainless steel "Stainless steel") with a high anticorrosion effect. . In the case of a material mainly composed of iron, the corrosion problem can be solved by applying a surface treatment such as nickel plating.
また、前記ピンに曲げ強度等を要求する場合、アルミニウムや銅だけでは不足する場合強度の高いもの、例えば、SUSと鉄又は銅との合金とのサンドイッチ構造や、2層構造等に代表される様な複合化をしてもよい。 In addition, when the pin requires bending strength or the like, when aluminum or copper alone is insufficient, the pin has a high strength, for example, a sandwich structure of SUS and an alloy of iron or copper, or a two-layer structure. You may make such a complex.
また、本発明では、熱可塑性樹脂であるポリプロピレンを例示したが、ポリスチレン等その他種々の熱可塑性樹脂や、熱硬化性樹脂、熱可塑性エラストマー等も共に使用可能である。熱硬化性樹脂は耐熱温度が高いこと、後述の熱可塑性樹脂に比べて、幾分かは剛性が高いことなどが特色で、一方熱可塑性樹脂は射出成形加工などに代表される様に大量生産に向く特色がある。 In the present invention, polypropylene which is a thermoplastic resin is exemplified, but various other thermoplastic resins such as polystyrene, thermosetting resins, thermoplastic elastomers, and the like can be used together. Thermosetting resins are characterized by high heat resistance and somewhat higher rigidity than the thermoplastic resins described below, while thermoplastic resins are mass-produced as represented by injection molding. There is a feature suitable for.
ちなみに熱硬化性樹脂としては、一般的に成形に用いられている熱硬化性樹脂であれば種類を問わない。例示すれば、エポキシ樹脂ジアリルフタレートプレポリマー、ジアリルフタレート樹脂、シリコーン樹脂、フェノール樹脂、不飽和ポリエステル樹脂、ポリイミド樹脂、ポリウレタン樹脂、メラミン樹脂、ユリア樹脂が挙げられる。 Incidentally, the thermosetting resin is not limited as long as it is a thermosetting resin generally used for molding. Examples include epoxy resin diallyl phthalate prepolymer, diallyl phthalate resin, silicone resin, phenol resin, unsaturated polyester resin, polyimide resin, polyurethane resin, melamine resin, and urea resin.
また熱可塑性樹脂として、一般的に成形に用いられている熱可塑性樹脂であれば種類を問わない。例示すれば、ポリスチレン樹脂(PS)、ハイイパクトポリスチレン樹脂(HIPS)、スチレン-マレイン酸共重合樹脂、ブタジエン-スチレン共重合樹脂、アクリルニトリロ・スチレン共重合樹脂(AS)、アクリルニトリロ・ブタジエン・スチレン共重合樹脂(ABS)、ポリフェニレンエーテル樹脂(PPE)、変性ポリフェニレンエーテル樹脂、及び変性ポリフェニレンオキサイド樹脂{PP0(E)}等に代表されるスチレン系樹脂、ポリエチレン(PE)、塩素化ポリエチレン、エチエン-αーオレフィン共重合樹脂、変性ポリオレフィン、透明ポリオレフィン等に代表されるオレフィン系樹脂、6-ナイロン(PA6)、6,6-ナイロン(PA66)、強化ポリアミド、PA-MCX、アモルファスポリアミド、芳香族ポリアミド(アラミド)等に代表されるアミド系樹脂、ポリエチレンテレフタレート(PET)、ポリエチレンテレフタレート(PET)等に代表されるポリエステル系樹脂、塩化ビニル樹脂(PVC)、ポリ酢酸ビニル樹脂(PVAc)、アクリル変性ポリ塩化ビニル等に代表されるビニル系樹脂、酢酸セルロース(CA)、酢酪酸セルロース(CAB)、エチルセルロース、セルロイドセロファン等に代表されるセルロース系樹脂(セルロース誘導体)、その他ポリメタクリレート(PMMA,アクリル樹脂,メタクリル樹脂)、ポリ塩化ビニリデン樹脂(PVDC)、ポリテトラフロロエチレン(PTFE)、エチレンポリテトラフロロエチレン共重合樹脂(ETFE)等に代表されるフッ素樹脂、エチレン酢酸ビニル共重合樹脂(EVA)、アイオノマー(IO)、変性ポリカーボネート、ポリカーボネート樹脂(PC)、ポリアリレート(PAR,Uポリマー)、ポリスルフォン(PSU)、ポリエーテルスルフォン(PES)、ポリチオエーテルスルフォン(PTES)、塩素化ポリエーテル、熱可塑性ポリイミド(TPI)、ポリアミノビスマレイミド(PABM)、ポリケトン、ポリアミドイミド(PAI)、ポリエーテルエーテルケトン(PEEK)、ポリエーテルケトン(PEK)、熱可塑性ポリウレタン(PUR)、ポリビニルアセタール、ポリビニルアルコール、ポリ塩化ビニリデン、ポリエーテルニトリル(PECN)、ポリフェニレンスルフィド(PPS)、ポリエーテルイミド(PEI)、アリル樹脂、エチレン-酢ビー塩ビ共重合樹脂、エチレン-塩化ビニル共重合樹脂、フラン樹脂、メタクリル-スチレン共重合樹脂、ニトリル樹脂、キシレン樹脂、ポリメチルペンテン、ポリアリルスルホン(PASF)、ポリベンゾイミダゾール(PBI)、ポリブタジエン樹脂、ポリブチレン、芳香族ポリエステル、オレフィンビニルアルコール共重合樹脂、石油樹脂、ポリオキシメチレン(POM)、ポリアセタール(POM)、液晶ポリエステル(LCP)、スチレン−ブタジエン系(SBC)、ポレオレフィン系(TPO)、ウレタン系(TPU)、ポリエステル系(TPEE)、ポリアミド系(TPAE)、1,2−ポリブタジエン(PB)、ポリ塩化ビニル系(TPVC)、1,2−ポリブタジエン、トランス1,4−ポリイソプレン、塩素化ポリエチレン等に代表されるエラストマー類、上記樹脂をブレンド、共重合、グラフト重合等を行ってして性質の改質したり、或いは変性したりした、PPE/PS、PPE/HIPS、PPE/PA、PC/ABS、PC/HIPS、PPE/PA、PES/LCP等のポリマーアロイ(ブレンドポリマー)、硝子繊維、炭素繊維、タルク等の充填剤、補強剤によって強化された複合材料等が挙げられる。 The thermoplastic resin is not particularly limited as long as it is a thermoplastic resin generally used for molding. For example, polystyrene resin (PS), high impact polystyrene resin (HIPS), styrene-maleic acid copolymer resin, butadiene-styrene copolymer resin, acrylic nitrilo / styrene copolymer resin (AS), acrylic nitrilo / butadiene / styrene. Styrenic resin represented by copolymer resin (ABS), polyphenylene ether resin (PPE), modified polyphenylene ether resin, and modified polyphenylene oxide resin {PP0 (E)}, polyethylene (PE), chlorinated polyethylene, ethylene- Olefin resins such as α-olefin copolymer resin, modified polyolefin, transparent polyolefin, 6-nylon (PA6), 6,6-nylon (PA66), reinforced polyamide, PA-MCX, amorphous polyamide, aromatic polyamide Amide resins such as aramid), polyethylene terephthalate (PET), polyester resins typified by polyethylene terephthalate (PET), vinyl chloride resin (PVC), polyvinyl acetate resin (PVAc), acrylic modified polychlorinated resin Vinyl-based resins typified by vinyl, cellulose acetate (CA), cellulose acetate butyrate (CAB), cellulose-based resins (cellulose derivatives) typified by ethyl cellulose, celluloid cellophane, and other polymethacrylates (PMMA, acrylic resin, methacrylic) Resin), polyvinylidene chloride resin (PVDC), polytetrafluoroethylene (PTFE), ethylene polytetrafluoroethylene copolymer resin (ETFE), and other fluororesins, ethylene vinyl acetate copolymer resin (EVA), eye Onomer (IO), modified polycarbonate, polycarbonate resin (PC), polyarylate (PAR, U polymer), polysulfone (PSU), polyethersulfone (PES), polythioethersulfone (PTES), chlorinated polyether, thermoplastic Polyimide (TPI), polyamino bismaleimide (PABM), polyketone, polyamideimide (PAI), polyetheretherketone (PEEK), polyetherketone (PEK), thermoplastic polyurethane (PUR), polyvinyl acetal, polyvinyl alcohol, polychlorinated Vinylidene, polyethernitrile (PECN), polyphenylene sulfide (PPS), polyetherimide (PEI), allyl resin, ethylene-vinyl acetate copolymer resin, ethylene-vinyl chloride copolymer Copolymer resin, furan resin, methacryl-styrene copolymer resin, nitrile resin, xylene resin, polymethylpentene, polyallylsulfone (PASF), polybenzimidazole (PBI), polybutadiene resin, polybutylene, aromatic polyester, olefin vinyl alcohol Polymer resin, petroleum resin, polyoxymethylene (POM), polyacetal (POM), liquid crystal polyester (LCP), styrene-butadiene (SBC), polyolefin (TPO), urethane (TPU), polyester (TPEE) Elastomers represented by polyamide-based (TPAE), 1,2-polybutadiene (PB), polyvinyl chloride-based (TPVC), 1,2-polybutadiene, trans 1,4-polyisoprene, chlorinated polyethylene, etc. Resin PPE / PS, PPE / HIPS, PPE / PA, PC / ABS, PC / HIPS, PPE / PA, which have been modified by properties such as render, copolymerization, and graft polymerization. Examples thereof include polymer alloys (blend polymers) such as PES / LCP, fillers such as glass fibers, carbon fibers and talc, and composite materials reinforced with reinforcing agents.
前記スチレン系樹脂とは、重合体中にスチレン系単量体を少なくとも25重量%以上含有する樹脂であり、スチレン系単量体の単独重合体又は該スチレン系単量体の二種以上の共重合体、該スチレン系単量体と該スチレン系単量体と共重合可能な他の単量体の一種又は二種以上との共重合体、前記ジエン系ゴムに前記スチレン系単量体の単独もしくは二種以上をグラフト重合せしめたグラフト共重合体、前記スチレン系樹脂と前記ジエン系ゴムとのミクロブレンド或いはポリマーブレンド等が包含される。 The styrenic resin is a resin containing at least 25% by weight or more of a styrenic monomer in a polymer, and is a homopolymer of a styrenic monomer or two or more kinds of styrenic monomers. A polymer, a copolymer of the styrenic monomer and one or more of other monomers copolymerizable with the styrenic monomer, and the diene rubber with the styrenic monomer. A graft copolymer obtained by graft polymerization of one kind or two or more kinds, a micro blend or a polymer blend of the styrene resin and the diene rubber, and the like are included.
前記スチレン系樹脂の代表的なものとしては、スチレン単独重合体であるポリスチレン(PS)、前記ジエン系ゴム、アクリル系ゴム、オレフィン系ゴムにスチレンをグラフト重合したゴム状重合体とポリスチレンとのブレンドポリマーである耐衝撃性ポリスチレン(HIPS)は、樹脂に機械的物性を付与する目的で添加したゴム材料がブタジエンゴム、又はブタジエンゴムを主成分としたモノ),HIPS(、樹脂に機械的物性を付与する目的で添加したゴム材料がオレフィン系ゴム及び又はアクリル系ゴム、又はこれらの飽和のゴムを主成分としたモノ)、アクリロニトリル・スチレン共重合体(AS)、スチレン・ブタジエン共重合体、スチレン・α―メチルスチレン共重合体、スチレン・無水マレイン酸共重合体、スチレン・メチルメタクリレート共重合体、スチレン・エチレン共重合体、スチレン・エチレン・プロピレン・ブタジエン共重合体に、ジエン系ゴム、アクリル系ゴム、オレフィン系ゴムにアクリロニトリル系モノマーとスチレン系モノマーとをグラフト重合したグラフトゴム重合体とアクリロニトリル・スチレン共重合体とのブレンドポリマー、塩素化ポリエチレンとアクリロニトリル・スチレン共重合体との混合樹脂であるACS、オレフィン系ゴムにアクリロニトリルとスチレンとをグラフト重合したオレフィン系ゴム含有のアクリロニトリルとスチレンとの3元共重合体とアクリロニトリル・スチレン共重合体との混合樹脂であるAES(ABS)、アクリル系ゴムにアクリロニトリルとスチレンとをグラフト重合したアクリル系ゴム含有のアクリロニトリルとスチレンとの3元共重合体とアクリロニトリル・スチレン共重合体との混合樹脂であるAAS(AAS,ABS)、アクリロニトリル・ジメチルシロキサン・スチレン共重合体とアクリロニトリル・ブタジエン・スチレン共重合樹脂との混合樹脂であるASIS等がある。此処でABSは、樹脂に機械的物性を付与する目的で添加したゴム材料がブタジエンゴム、又はブタジエンゴムを主成分としたもので、ABSは樹脂に機械的物性を付与する目的で添加したゴム材料がオレフィン系ゴム及びアクリル系ゴム、又はこれらの飽和のゴムを主成分としたものをいう。 Typical examples of the styrenic resin include polystyrene (PS) which is a styrene homopolymer, a blend of a rubbery polymer obtained by graft-polymerizing styrene to the diene rubber, acrylic rubber and olefin rubber and polystyrene. High impact polystyrene (HIPS), which is a polymer, is a rubber material added for the purpose of imparting mechanical properties to the resin. The rubber material added for the purpose of imparting is olefin rubber and / or acrylic rubber, or mono-based materials of these saturated rubbers), acrylonitrile / styrene copolymer (AS), styrene / butadiene copolymer, styrene・ Α-methylstyrene copolymer, styrene / maleic anhydride copolymer, styrene / methyl Graft rubber obtained by graft polymerization of acrylonitrile monomer and styrene monomer to diene rubber, acrylic rubber, and olefin rubber to tacrylate copolymer, styrene / ethylene copolymer, styrene / ethylene / propylene / butadiene copolymer Blend polymer of polymer and acrylonitrile / styrene copolymer, ACS, which is a mixed resin of chlorinated polyethylene and acrylonitrile / styrene copolymer, Acrylonitrile containing olefin rubber by graft polymerization of acrylonitrile and styrene to olefin rubber AES (ABS), which is a mixed resin of terpolymer of styrene and styrene and acrylonitrile / styrene copolymer, and acrylic rubber-containing acrylo by graft polymerization of acrylonitrile and styrene to acrylic rubber AAS (AAS, ABS), which is a mixed resin of a terpolymer of tolyl and styrene and an acrylonitrile / styrene copolymer, an acrylonitrile / dimethylsiloxane / styrene copolymer and an acrylonitrile / butadiene / styrene copolymer resin There is ASIS which is a mixed resin. Here, ABS is a rubber material added for the purpose of imparting mechanical properties to the resin, and butadiene rubber or butadiene rubber as a main component. ABS is a rubber material added for the purpose of imparting mechanical properties to the resin. Means an olefin rubber and an acrylic rubber, or those having a saturated rubber as a main component.
前記ポリフェニレンエーテル(PPE)系樹脂の代表的なものとしては、2,6−キシレノールを銅触媒で酸化重合して得られるポリ(2,6−ジメチル−1,4−フェニレンエーテル)があるが、更に2,6−ジメチル−1,4−フェニレンエーテルと2,3,6−トリメチル−1,4−フェニレンエーテルとの共重合体、2,6−ジメチルフェノールと2,3,6−トリメチルフェノールとの共重合体等がある。又前記PPE系樹脂にスチレン系樹脂及び/又はアミド系樹脂等で変性したものも本発明の変性PPE系,変性PPe系樹脂に含まれる。
変性PPEとは、前記HIPS及びABSとPPEとのポリマーアロイ・ポリマーブレンド、変性PPEとは前記HIPS及びABSとPPEとのポリマーアロイ・ポリマーブレンドをいう。
A typical example of the polyphenylene ether (PPE) resin is poly (2,6-dimethyl-1,4-phenylene ether) obtained by oxidative polymerization of 2,6-xylenol with a copper catalyst. Further, a copolymer of 2,6-dimethyl-1,4-phenylene ether and 2,3,6-trimethyl-1,4-phenylene ether, 2,6-dimethylphenol and 2,3,6-trimethylphenol There are copolymers of In addition, the PPE resin modified with a styrene resin and / or an amide resin is also included in the modified PPE resin and the modified PPe resin of the present invention.
The modified PPE refers to the polymer alloy / polymer blend of HIPS, ABS, and PPE, and the modified PPE refers to the polymer alloy / polymer blend of HIPS, ABS, and PPE.
前記ポリカーボネート樹脂(PC樹脂)は成形(型)用熱可塑性樹脂として単独に使用される事もできるが、主として前記スチレン系樹脂やPPE系樹脂等と混合してポリマーアロイ・ポリマーブレンドとする材料として使用される。芳香族ジヒドロキシ化合物から誘導されたポリ炭酸エステルであれば特に制限はない。 The polycarbonate resin (PC resin) can be used alone as a molding (mold) thermoplastic resin, but as a material mainly mixed with the styrene resin or PPE resin to form a polymer alloy / polymer blend. used. There is no particular limitation as long as it is a polycarbonate derived from an aromatic dihydroxy compound.
前記芳香族ジヒドロキシ化合物として例示すると、2,2−ビス(4−ヒドロキシフェニル)プロパン(ビスフェノールAとも云う)、テトラメチルビスフェノールA、テトラブロムルビスフェノールA、ビス(4−ヒドロキシフェニル)−p−ジイソプロピルベンゼン、ハイドロキノン、レゾルシノール、4,4'−ジヒドロキシジフェニル等を使用する事が出来るが、通常はビス(4−ヒドロキシフェニル)アルカン系ジヒドロキシ化合物が選択され、特にビスフェノールA、又はビスフェノールAと他の芳香族ジヒドロキシ化合物との組み合わせが好ましい。 Examples of the aromatic dihydroxy compound include 2,2-bis (4-hydroxyphenyl) propane (also referred to as bisphenol A), tetramethylbisphenol A, tetrabromobisphenol A, and bis (4-hydroxyphenyl) -p-diisopropyl. Benzene, hydroquinone, resorcinol, 4,4′-dihydroxydiphenyl, etc. can be used, but bis (4-hydroxyphenyl) alkane dihydroxy compounds are usually selected, and bisphenol A or bisphenol A and other fragrances are particularly preferred. Combinations with group dihydroxy compounds are preferred.
前記ポリオレフィン系樹脂とは、α−オレフィンの一種又は二種以上をラジカル開始剤、金属酸化物系触媒、チグラー・ナッタ触媒、カミンスキー触媒等を使用して重合する事によって得られる樹脂であり、前記樹脂は二種以上混合させても良い。 The polyolefin resin is a resin obtained by polymerizing one or more of α-olefin using a radical initiator, a metal oxide catalyst, a Ziegler-Natta catalyst, a Kaminsky catalyst, etc. Two or more kinds of the resins may be mixed.
前記ポリオレフィン系樹脂には、α−オレフィンと共重合可能な他の単量体が共重合されていても良い。代表的なものは、ポリエチレン、ポリプロピレン、エチレン−酢酸ビニル共重合体、エチレン−アクリル酸共重合体等である。単独又は二種以上の混合物の状態で成形材料として使用されるが、更に前記スチレン系樹脂、例えばPS、HIPS、AS、ABS樹脂、PPE系樹脂等の他の熱可塑性樹脂と混合されても良い。 The polyolefin resin may be copolymerized with another monomer copolymerizable with the α-olefin. Typical examples are polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, and the like. Although it is used as a molding material singly or in the form of a mixture of two or more, it may be further mixed with other thermoplastic resins such as the styrene resin, for example, PS, HIPS, AS, ABS resin, PPE resin, etc. .
前記α−オレフィンはα位に重合性の二重結合を有する直鎖状・分岐状或いは環状オレフィンであって、通常炭素数2〜8のものが選ばれる。α−オレフィンの具体例としてエチレン及びプロピレンがある。 The α-olefin is a linear, branched or cyclic olefin having a polymerizable double bond at the α-position, and usually has 2 to 8 carbon atoms. Specific examples of α-olefins include ethylene and propylene.
前記ポリアリレートは、ビスフェノール系化合物とテレフタル酸及びイソフタル酸に代表されるフタル酸化合物との宿重合によって得られる耐熱性が高く、難燃性を持った樹脂で、2,2−ビス(4−ヒドロキシフェニル)プロパン(ビスフェノールAとも云う)、テトラメチルビスフェノールA、テトラブロムルビスフェノールA、ビス(4−ヒドロキシフェニル)−p−ジイソプロピルベンゼン、ハイドロキノン、レゾルシノール、4,4'−ジヒドロキシジフェニル等を使用する事が出来るが、通常はビス(4−ヒドロキシフェニル)アルカン系ジヒドロキシ化合物が選択され、特にビスフェノールA、又はビスフェノールAと他の芳香族ジヒドロキシ化合物との組み合わせが好ましい。 The polyarylate is a resin having high heat resistance and flame retardancy obtained by polymerization of a bisphenol compound and a phthalic acid compound represented by terephthalic acid and isophthalic acid. Hydroxyphenyl) propane (also referred to as bisphenol A), tetramethylbisphenol A, tetrabromobisphenol A, bis (4-hydroxyphenyl) -p-diisopropylbenzene, hydroquinone, resorcinol, 4,4′-dihydroxydiphenyl, etc. are used. However, bis (4-hydroxyphenyl) alkane dihydroxy compounds are usually selected, and bisphenol A or a combination of bisphenol A and other aromatic dihydroxy compounds is particularly preferred.
前記ビスフェノールの代表的な例として、ビス(3,5−ジメチル−4−ヒドロキシフェニル)メタン、ビス(3,5−ジエチル−4−ヒドロキシフェニル)メタン、ビス(3,5−ジブロモ−4−ヒドロキシフェニル)メタン、1,1−ビス(3,5−ジメチル−4−ヒドロキシフェニル)エタン、1,1−ビス(3,5−ジエチル−4−ヒドロキシフェニル)エタン、ビス(3,5−ジブロモ−4−ヒドロキシフェニル)エタン、1,1−ビス(3,5−ジメチル−4−ヒドロキシフェニル)プロパン、2,2−ビス(3,5−ジメチル−4−ヒドロキシフェニル)プロパン、1,1−ビス(3,5−ジエチル−4−ヒドロキシフェニル)プロパン、2,2−ビス(3,5−ジエチル−4−ヒドロキシフェニル)プロパン、1,1−ビス(3,5−ジブロモ−4−ヒドロキシフェニル)プロパン、2,2−ビス(3,5−ジブロモ−4−ヒドロキシフェニル)プロパン、1,1−ビス(3,5−ジメチル−4−ヒドロキシフェニル)ブタン、2,2−ビス(3,5−ジメチル−4−ヒドロキシフェニル)ブタン、1,1−ビス(3,5−ジエチル−4−ヒドロキシフェニル)ブタン、2,2−ビス(3,5−ジエチル−4−ヒドロキシフェニル)ブタン、1,1−ビス(3,5−ジブロモ−4−ヒドロキシフェニル)ブタン、2,2−ビス(3,5−ジブロモ−4−ヒドロキシフェニル)ブタン、1,1−ビス(3,5−ジメチル−4−ヒドロキシフェニル)シクロヘキサン、1,1−ビス(3,5−ジエチル−4−ヒドロキシフェニル)シクロヘキサン、1,1−ビス(3,5−ジブロモ−4−ヒドロキシフェニル)シクロヘキサン、ビス(3,5−ジメチル−4−ヒドロキシフェニル)フェニルメタン、ビス(3,5−ジエチル−4−ヒドロキシフェニル)フェニルメタン、ビス(3,5−ジブロモ−4−ヒドロキシフェニル)フェニルメタン、1,1−ビス(3,5−ジメチル−4−ヒドロキシフェニル)−1−フェニルエタン、1,1−ビス(3,5−ジエチル−4−ヒドロキシフェニル)−1−フェニルエタン、1,1−ビス(3,5−ジブロモ−4−ヒドロキシフェニル)−1−フェニルエタン、ビス(3,5−ジメチル−4−ヒドロキシ)ジフェニルメタン、ビス(3,5−ジエチル−4−ヒドロキシ)ジフェニルメタン、ビス(3,5−ジブロモ−4−ヒドロキシ)ジフェニルメタン、ビス(3,5−ジメチル−4−ヒドロキシフェニル)エーテル、ビス(3,5−ジエチル−4−ヒドロキシフェニル)エーテル、ビス(3,5−ジブロモ−4−ヒドロキシフェニル)エーテル、ビス(3,5−ジメチル−4−ヒドロキシフェニル)サルファイド、ビス(3,5−ジエチル−4−ヒドロキシフェニル)サルファイド、ビス(3,5−ジブロモ−4−ヒドロキシフェニル)サルファイド、ビス(3,5−ジメチル−4−ヒドロキシフェニル)スルホン、ビス(3,5−ジエチル−4−ヒドロキシフェニル)スルホン、ビス(3,5−ジブロモ−4−ヒドロキシフェニル)スルホン、ビス(3,5−ジメチル−4−ヒドロキシフェニル)ケトン、ビス(3,5−ジエチル−4−ヒドロキシフェニル)ケトン、ビス(3,5−ジブロモ−4−ヒドロキシフェニル)ケトンなどが挙げられる。中でも最も好ましいビスフェノールとしてはビス(3,5−ジメチル−4−ヒドロキシフェニル)メタン、2,2−ビス(3,5−ジメチル−4−ヒドロキシフェニル)プロパン、1,1−ビス(3,5−ジメチル−4−ヒドロキシフェニル)シクロヘキサン、1,1−ビス(3,5−ジメチル−4−ヒドロキシフェニル)−1−フェニルエタン、ビス(3,5−ジメチル−4−ヒドロキシフェニル)フェニルメタン、ビス(3,5−ジメチル−4−ヒドロキシフェニル)スルホン、ビス(3,5−ジメチル−4−ヒドロキシフェニル)エーテル、ビス(3,5−ジメチル−4−ヒドロキシフェニル)ケトンなどが挙げられる。また、前記ビスフエノールのうち、ハロゲンが置換したビスフエノールを用いたポリアリレートは難燃性にも優れたものとなる。 Representative examples of the bisphenol include bis (3,5-dimethyl-4-hydroxyphenyl) methane, bis (3,5-diethyl-4-hydroxyphenyl) methane, and bis (3,5-dibromo-4-hydroxy). Phenyl) methane, 1,1-bis (3,5-dimethyl-4-hydroxyphenyl) ethane, 1,1-bis (3,5-diethyl-4-hydroxyphenyl) ethane, bis (3,5-dibromo- 4-hydroxyphenyl) ethane, 1,1-bis (3,5-dimethyl-4-hydroxyphenyl) propane, 2,2-bis (3,5-dimethyl-4-hydroxyphenyl) propane, 1,1-bis (3,5-diethyl-4-hydroxyphenyl) propane, 2,2-bis (3,5-diethyl-4-hydroxyphenyl) propane, 1,1-bis 3,5-dibromo-4-hydroxyphenyl) propane, 2,2-bis (3,5-dibromo-4-hydroxyphenyl) propane, 1,1-bis (3,5-dimethyl-4-hydroxyphenyl) butane 2,2-bis (3,5-dimethyl-4-hydroxyphenyl) butane, 1,1-bis (3,5-diethyl-4-hydroxyphenyl) butane, 2,2-bis (3,5-diethyl) -4-hydroxyphenyl) butane, 1,1-bis (3,5-dibromo-4-hydroxyphenyl) butane, 2,2-bis (3,5-dibromo-4-hydroxyphenyl) butane, 1,1- Bis (3,5-dimethyl-4-hydroxyphenyl) cyclohexane, 1,1-bis (3,5-diethyl-4-hydroxyphenyl) cyclohexane, 1,1-bis (3 -Dibromo-4-hydroxyphenyl) cyclohexane, bis (3,5-dimethyl-4-hydroxyphenyl) phenylmethane, bis (3,5-diethyl-4-hydroxyphenyl) phenylmethane, bis (3,5-dibromo- 4-hydroxyphenyl) phenylmethane, 1,1-bis (3,5-dimethyl-4-hydroxyphenyl) -1-phenylethane, 1,1-bis (3,5-diethyl-4-hydroxyphenyl) -1 -Phenylethane, 1,1-bis (3,5-dibromo-4-hydroxyphenyl) -1-phenylethane, bis (3,5-dimethyl-4-hydroxy) diphenylmethane, bis (3,5-diethyl-4 -Hydroxy) diphenylmethane, bis (3,5-dibromo-4-hydroxy) diphenylmethane, bis (3,5- Dimethyl-4-hydroxyphenyl) ether, bis (3,5-diethyl-4-hydroxyphenyl) ether, bis (3,5-dibromo-4-hydroxyphenyl) ether, bis (3,5-dimethyl-4-hydroxy) Phenyl) sulfide, bis (3,5-diethyl-4-hydroxyphenyl) sulfide, bis (3,5-dibromo-4-hydroxyphenyl) sulfide, bis (3,5-dimethyl-4-hydroxyphenyl) sulfone, bis (3,5-diethyl-4-hydroxyphenyl) sulfone, bis (3,5-dibromo-4-hydroxyphenyl) sulfone, bis (3,5-dimethyl-4-hydroxyphenyl) ketone, bis (3,5- Diethyl-4-hydroxyphenyl) ketone, bis (3,5-dibromo-4-hydro Shifeniru) and ketone, and the like. Among these, bis (3,5-dimethyl-4-hydroxyphenyl) methane, 2,2-bis (3,5-dimethyl-4-hydroxyphenyl) propane, 1,1-bis (3,5- Dimethyl-4-hydroxyphenyl) cyclohexane, 1,1-bis (3,5-dimethyl-4-hydroxyphenyl) -1-phenylethane, bis (3,5-dimethyl-4-hydroxyphenyl) phenylmethane, bis ( 3,5-dimethyl-4-hydroxyphenyl) sulfone, bis (3,5-dimethyl-4-hydroxyphenyl) ether, bis (3,5-dimethyl-4-hydroxyphenyl) ketone and the like. Among the bisphenols, polyarylate using bisphenol substituted with halogen is excellent in flame retardancy.
その特性を実質的に損なわない範囲で、ビスフェノールの一部をその他のビスフェノール類で置き換えてもよい。このようなビスフェノール類としてはハイドロキノン、レゾルシノール、ジヒドロキシビフェニル、ビス(ヒドロキシフェニル)アルカン、ビス(ヒドロキシフェニル)シクロアルカン、ビス(ヒドロキシフェニル)サルファイド、ビス(ヒドロキシフェニル)スルホン、ビス(ヒドロキシフェニル)エーテル、ビス(ヒドロキシフェニル)ケトンおよびこれらの核ハロゲン化物が挙げられる。 A part of bisphenol may be replaced with other bisphenols as long as the characteristics are not substantially impaired. Such bisphenols include hydroquinone, resorcinol, dihydroxybiphenyl, bis (hydroxyphenyl) alkane, bis (hydroxyphenyl) cycloalkane, bis (hydroxyphenyl) sulfide, bis (hydroxyphenyl) sulfone, bis (hydroxyphenyl) ether, Bis (hydroxyphenyl) ketones and their nuclear halides are mentioned.
テレフタル酸及びイソフタル酸の残基の比は特に制限はなく、目的に応じてその構成成分をそれぞれ単独で用いてもよいし、混合して用いてもよい。その場合テレフタル酸残基が多いほど高い耐熱性を有するポリアリレートが得られる。 The ratio of the residues of terephthalic acid and isophthalic acid is not particularly limited, and the constituent components may be used alone or in combination depending on the purpose. In that case, a polyarylate having higher heat resistance is obtained as the terephthalic acid residue is increased.
また、イソフタル酸の残基を10モル%超える量含むポリアリレートは、靭性が向上する。したがって、エンジニアリングプラスチックとして用いる場合、要求特性に応じてテレフタル酸およびイソフタル酸の残基の比を決めることが好ましい。 Polyarylate containing an amount exceeding 10 mol% of the residue of isophthalic acid has improved toughness. Therefore, when used as an engineering plastic, it is preferable to determine the ratio of terephthalic acid and isophthalic acid residues according to the required properties.
前記ポリアリレートにおいてはその特性を実質的に損なわない範囲でテレフタル酸及びイソフタル酸の一部をその他のジカルボン酸に置き換えてもよい。かかるジカルボン酸としてはナフタレンジカルボン酸、ビス(p−カルボキシフェニル)アルカン、4,4’−ジカルボキシジフェニルエーテルなどの芳香族ジカルボン酸、シクロヘキサンジカルボン酸、アジピン酸、セバシン酸、グルタル酸などの脂環式あるいは脂肪族ジカルボン酸およびこれらのハロゲン化物などが挙げられる。 In the polyarylate, a part of terephthalic acid and isophthalic acid may be replaced with other dicarboxylic acids as long as the properties are not substantially impaired. Examples of the dicarboxylic acid include alicyclic such as naphthalenedicarboxylic acid, bis (p-carboxyphenyl) alkane, aromatic dicarboxylic acid such as 4,4′-dicarboxydiphenyl ether, cyclohexanedicarboxylic acid, adipic acid, sebacic acid, and glutaric acid. Alternatively, aliphatic dicarboxylic acids and halides thereof can be used.
前記テレフタル酸及びイソフタル酸の酸ハロゲン化物としてはテレフタル酸クロライド、テレフタル酸ブロマイド、イソフタル酸クロライド、イソフタル酸ブロマイドなどが挙げられ、テレフタル酸及びイソフタル酸の酸ハロゲン化物を溶解するために用いられる疎水性有機溶媒としては、水と相溶せず、生成するポリアリレートを溶解するものが好ましい。しかし、場合によっては生成するポリアリレートを溶解しない有機溶媒を用いることもでき、この場合にはポリアリレートが一定以上の分子量になると系外に析出する。 Examples of the acid halides of terephthalic acid and isophthalic acid include terephthalic acid chloride, terephthalic acid bromide, isophthalic acid chloride, isophthalic acid bromide, etc., and hydrophobicity used to dissolve acid halides of terephthalic acid and isophthalic acid As the organic solvent, those which are incompatible with water and dissolve the produced polyarylate are preferable. However, in some cases, an organic solvent that does not dissolve the generated polyarylate can be used. In this case, when the polyarylate has a molecular weight of a certain level or more, it precipitates out of the system.
ポリアリレートにはその特性を大きく損なわない限りにおいて顔料、熱安定剤、酸化防止剤、耐候剤、難燃剤、可塑剤、離型剤、強化材などを添加することも可能である。これらの添加剤は重合時に加えてもよいし、ポリアリレートは単離後に加えてもよい。前記熱安定剤や酸化防止剤としてはヒンダードフェノール類、リン化合物、ヒンダードアミン、イオウ化合物、銅化合物あるいはこれらの混合体が挙げられ、特にリン化合物が最も効果的である。かかるリン化合物としては亜リン酸、亜リン酸エステル、正リン酸、正リン酸エステルなどが挙げられる。また、強化材としては、クレー、タルク、炭酸カルシウム、炭酸亜鉛、ワラストナイト、シリカ、アルミナ、酸化マグネシウム、ケイ酸カルシウム、アスベスト、アルミン酸ナトリウム、アルミン酸カルシウム、アルミノ珪酸ナトリウム、珪酸マグネシウム、水酸化アルミニウム、水酸化カルシウム、硫酸バリウム、カリウム明バン、ナトリウム明バン、鉄明バン、ガラスバルーン、カーボンブラック、酸化亜鉛、三酸化アンチモン、ほう酸、ほう砂、ほう酸亜鉛、ゼオライト、ハイドロタルサイド、金属繊維、金属ウイスカー、セラミックウイスカー、チタン酸カリ、チッカホウ素、マイカ、グラファイト、ガラス繊維などが挙げられる。 It is possible to add pigments, heat stabilizers, antioxidants, weathering agents, flame retardants, plasticizers, mold release agents, reinforcing materials and the like to the polyarylate as long as the properties are not significantly impaired. These additives may be added at the time of polymerization, and polyarylate may be added after the isolation. Examples of the heat stabilizer and antioxidant include hindered phenols, phosphorus compounds, hindered amines, sulfur compounds, copper compounds, and mixtures thereof, and phosphorus compounds are particularly effective. Examples of such phosphorus compounds include phosphorous acid, phosphite, orthophosphoric acid, orthophosphoric acid ester and the like. The reinforcing materials include clay, talc, calcium carbonate, zinc carbonate, wollastonite, silica, alumina, magnesium oxide, calcium silicate, asbestos, sodium aluminate, calcium aluminate, sodium aluminosilicate, magnesium silicate, water Aluminum oxide, calcium hydroxide, barium sulfate, potassium light vane, sodium light van, iron light van, glass balloon, carbon black, zinc oxide, antimony trioxide, boric acid, borax, zinc borate, zeolite, hydrotalcide, metal Examples thereof include fiber, metal whisker, ceramic whisker, potassium titanate, ticker boron, mica, graphite, and glass fiber.
さらに、必要に応じて他の重合体をポリアリレートに配合することも可能である。重合体としては、例えば、ポリブタジエン、ブチレン−スチレン共重合体、アクリルゴム、エチレン−プロピレン共重合体、EPDM、天然ゴム、塩素化ブチルゴム、塩素化ポリエチレンなどのゴム状共重合体、スチレン−ブタジエンブロック共重合体、スチレン−ブタジエンブロック共重合体、ブタジエン−スチレンラジアルテレブロック共重合体などのエラストマー、スチレン−無水マレイン酸共重合体、スチレン−フェニルマレイミド共重合体、ナイロン6やナイロン66、ナイロン46、ナイロン12、ナイロン610などのポリアミド、ポリプロピレン、ブタジエン−アクリロニトリル共重合体、ポリ塩化ビニル、PET、PBT、ポリアセタール、ポリフッ化ビニリデン、ポリスルホン、PPS、ポリエーテルスルホン、フェノキシ樹脂、PPO、PMMA、ポリエーテルケトン、ポリカーボネートなどが挙げられる。 Furthermore, it is also possible to mix | blend another polymer with a polyarylate as needed. Examples of the polymer include polybutadiene, butylene-styrene copolymer, acrylic rubber, ethylene-propylene copolymer, EPDM, natural rubber, chlorinated butyl rubber, chlorinated polyethylene, and other rubbery copolymers, styrene-butadiene blocks. Elastomers such as copolymers, styrene-butadiene block copolymers, butadiene-styrene radial teleblock copolymers, styrene-maleic anhydride copolymers, styrene-phenylmaleimide copolymers, nylon 6, nylon 66, nylon 46 , Polyamides such as nylon 12 and nylon 610, polypropylene, butadiene-acrylonitrile copolymer, polyvinyl chloride, PET, PBT, polyacetal, polyvinylidene fluoride, polysulfone, PPS, polyethersulfone, phenol Shi resin, PPO, PMMA, polyether ketones, and polycarbonate.
以上、本発明で使用可能な樹脂について詳細な説明をおこなったが、前記熱可塑性樹脂は二種以上を混合してポリマーブレンド或いはポリマーアロイとされても良い。 The resin that can be used in the present invention has been described in detail above. However, two or more of the thermoplastic resins may be mixed into a polymer blend or a polymer alloy.
前記ポリマーブレンド或いはポリマーアロイは、たとえば押出成形機におけるスクリュー混練等によって製造される。 The polymer blend or polymer alloy is produced, for example, by screw kneading in an extruder.
更に前記熱可塑性樹脂には、耐衝撃性を改良する為に、前記ジエン系ゴム、オレフィン系ゴム、アクリル系ゴム等例えば、NR、BR、SBR、STR、IR、CR、CBR、IBR、IBBR、IIR、アクリルゴム、多硫化ゴム、ウレタンゴム、ポリエーテルゴム、エピクロルヒドリンゴム、クロロブチルゴム、水素化ニトリルゴム、フッ素系ゴム等のゴム類やエチレン−酢酸ビニル共重合体、アクリル樹脂、エチレン−エチルアクリレート共重合体、塩化ビニル等で代表されるビニル系樹脂、ポリノルボリネン等の他の熱可塑性樹脂が混合されても良い。 Furthermore, in order to improve impact resistance, the thermoplastic resin includes the diene rubber, olefin rubber, acrylic rubber, etc., such as NR, BR, SBR, STR, IR, CR, CBR, IBR, IBBR, Rubbers such as IIR, acrylic rubber, polysulfide rubber, urethane rubber, polyether rubber, epichlorohydrin rubber, chlorobutyl rubber, hydrogenated nitrile rubber, fluorine rubber, ethylene-vinyl acetate copolymer, acrylic resin, ethylene-ethyl acrylate Other thermoplastic resins such as a copolymer, a vinyl resin typified by vinyl chloride, and polynorborinene may be mixed.
更に前記熱可塑性樹脂の耐衝撃性を改良する為には、熱可塑性エラストマー(TPE)を添加しても良い。該熱可塑性エラストマーとは常温で加硫ゴムの性質を有するが熱可塑性で熱成形可能なものであり、ハードセグメントとソフトセグメントとによって構成されるものである。 Furthermore, in order to improve the impact resistance of the thermoplastic resin, a thermoplastic elastomer (TPE) may be added. The thermoplastic elastomer has properties of vulcanized rubber at room temperature but is thermoplastic and can be thermoformed, and is composed of a hard segment and a soft segment.
前記TPEとしては、ウレタン系エラストマー、スチレン系エラストマー、ビニル系エラストマー、エステル系エラストマー等がある。 Examples of the TPE include urethane elastomers, styrene elastomers, vinyl elastomers, and ester elastomers.
前記熱硬化性樹脂や熱可塑性樹脂は、難燃剤を添加する事で難燃される。熱可塑性樹脂であるABSとABS、HIPSの難燃化には、PPE系樹脂及びポリカーボネート樹脂とのポリマーアロイとする事に加え難燃剤(材)の添加によって難燃化が可能である。ポリアリレートは元々難燃性を持つ樹脂であるので、難燃剤の添加によって難燃化が容易である。 The thermosetting resin or thermoplastic resin is flame retardant by adding a flame retardant. Flame retardancy of ABS, ABS, and HIPS, which are thermoplastic resins, can be achieved by adding a flame retardant (material) in addition to a polymer alloy of PPE resin and polycarbonate resin. Since polyarylate is originally a flame retardant resin, it can be easily made flame retardant by adding a flame retardant.
難燃剤の代表的な物を例示すると、三酸化アンチモン、アンチモン系難燃剤、五酸化アンチモン、アンチモン酸ソーダ、水酸化マグネシウム、水酸化アルミニウム、硼酸亜鉛、グァニジン系難燃剤としてスルファミン酸グァニジン、燐酸グァニジン、燐酸グァニール尿素、ジルコニウム系難燃剤、錫化合物、モリブデン化合物、赤燐等、燐酸エステル、及び燐化合物として、トリス(クロロエチル)ホスフェート、トリス(モノクロロプロピル)ホスフェート、トリス・β−クロロプロピルホスフェート、トリス(ジブロモフェニル)ホスフェート、トリス(トリブロモネオペンチル)ホスフェート、ジメチルメチルホスフェート、トリス(ジクロロプロピル)ホスフェート、トリアリルホスフェート、トリス(3−ヒドリシキプロピル)ホスフィンオキシド、トリス(トリブロモフェニル)ホスフェート、テトラキス(2−クロルエチル)エチレン・ジホスフェート、グリシジル−α−メチル−β−ジ(ブトキシ)ホスフェニル・プロピオネート、ジブチルヒドロオキシメチルホスフォネート、ジ(ブトキシ)ホスフィニル・プロピルアニド、ジメチルメチルホスフォネート、トリス(2−クロロエチル)オルト燐酸エステル、芳香族縮合燐酸エステル、含ハロゲン縮合有機燐酸エステル、エチレン・ビス・トリス(2−シアノエチル)ホスフォニウム・ブロミド、ジー(ポリオキシエチレン)−ヒドロキシメチル・ホスフォネート、燐・塩素含有オリゴマー、ポリ燐酸アンモニウム、β−クロロエチルアシッドホスフェート、β−クロロプロピルホスフェート、ブチルピロホスフェート、ブチルアシッドホスフェート、ブトキシエチルアシッドホスフェート、2−エチルヘキシルアシッドホスフェート、メラミン燐酸塩、燐−塩素系、有機燐系、ホスフェート系、赤燐系難燃剤等がある。 Typical examples of flame retardants include antimony trioxide, antimony flame retardant, antimony pentoxide, sodium antimonate, magnesium hydroxide, aluminum hydroxide, zinc borate, guanidine guanidine guanidine phosphate, and guanidine phosphate. , Phosphoric acid guanylurea, zirconium flame retardant, tin compound, molybdenum compound, red phosphorus, etc., phosphoric acid ester, and phosphorus compound, tris (chloroethyl) phosphate, tris (monochloropropyl) phosphate, tris-β-chloropropyl phosphate, tris (Dibromophenyl) phosphate, tris (tribromoneopentyl) phosphate, dimethylmethyl phosphate, tris (dichloropropyl) phosphate, triallyl phosphate, tris (3-hydroxypropyl) phosphate Finoxide, tris (tribromophenyl) phosphate, tetrakis (2-chloroethyl) ethylene diphosphate, glycidyl-α-methyl-β-di (butoxy) phosphenyl propionate, dibutylhydroxymethylphosphonate, di (butoxy) Phosphinyl propyl anide, dimethyl methyl phosphonate, tris (2-chloroethyl) orthophosphate, aromatic condensed phosphate, halogen-containing condensed organic phosphate, ethylene bis-tris (2-cyanoethyl) phosphonium bromide, Gee (poly Oxyethylene) -hydroxymethyl phosphonate, phosphorus / chlorine-containing oligomer, ammonium polyphosphate, β-chloroethyl acid phosphate, β-chloropropyl phosphate, butyl pyrophosphate DOO, butyl acid phosphate, butoxyethyl acid phosphate, 2-ethylhexyl acid phosphate, melamine phosphate, phosphorus - chlorine, organic phosphorus, phosphate-based, there is a red phosphorus-based flame retardants.
塩素系難燃剤の代表的なものは、塩素化パラフィン、塩素化ポリオレフィン、塩素化ポリエチレン、パークロロシクロペンタデカン、塩素化パラフィンと三酸化アンモチンの混合品等がある。 Typical examples of the chlorinated flame retardant include chlorinated paraffin, chlorinated polyolefin, chlorinated polyethylene, perchlorocyclopentadecane, and a mixture of chlorinated paraffin and anamottin trioxide.
臭素系難燃剤の代表的な物は、臭素化エポキシ、臭素化ポリカーボネート、ヘキサブロモベンゼン、デカブロモジフォニルオキシド、ポリジブロモフェニレンオキシド、ビス(トリブロモフェノキシ)エタン、エチレンビス・ジブロモノルボルナンジカルボキシイミド、エチレンビス・テトラブロモフタルイミド、ジブロモエチル・ジブロモシクロヘキサン、ジプロモネオペンチルグリコール、2,4,6−トリブロムフェノール、トリブロモフェノールアリルエーテル、テトラブロモ・ビスフェノールA、及びテトラブロモ・ビスフェノールA誘導体、テトラブロモ・ビスフェノールS、テトラデカブロム・ジフェニキシベンゼン、トリス−(2,3−ジブロモプロピル−1)−イソサヌレート、2,2−ビス(4−ヒドロキシ−3,5ジブロモフェニル)プロパン、2,2−ビス(4−ヒドロキシエトキシ−3,5−ジブロモフェニル)プロパン、ポリ(ペンタブロモベンジル・アクリレート)、トリブロモスチレン、ペンタブロモフェノール、臭素化ポリエチレン、ジブロモネオペンチルグリコールテトラカルボナート、ビス(トリブロモフェニル)フマルアニド、N−メチルヘキサブロモジフェニルアミン、含ハロゲンポリホスフェ−ト、芳香族臭素化合物臭素化エポキシ樹脂、臭素化ポリスチレン、臭素系難燃剤(商品名:スイス、サンド
Sandoflam5071 等)ペンタブロモトルエン、ペンタブロモフェニルオキシド、ペンタブロモフェニルオキシドと燐酸エステル、安定剤の混合物、ヘキサブロモシクロドデカン、ヘキサブロモフェニルエーテル、ヘキサブロモフェニルエーテル、ヘキサブロモジフェニルエーテル、オクタブロモジフェニルオキシド、マグネシウムヒドロキシド等がある。
Typical brominated flame retardants are brominated epoxy, brominated polycarbonate, hexabromobenzene, decabromodiphenyl oxide, polydibromophenylene oxide, bis (tribromophenoxy) ethane, ethylene bis-dibromonorbornane dicarboximide , Ethylenebis-tetrabromophthalimide, dibromoethyl-dibromocyclohexane, dipromoneopentyl glycol, 2,4,6-tribromophenol, tribromophenol allyl ether, tetrabromo-bisphenol A, and tetrabromo-bisphenol A derivatives, tetrabromo- Bisphenol S, tetradecabromo diphenoxybenzene, tris- (2,3-dibromopropyl-1) -isosanurate, 2,2-bis (4-hydroxy-3,5 di Lomophenyl) propane, 2,2-bis (4-hydroxyethoxy-3,5-dibromophenyl) propane, poly (pentabromobenzyl acrylate), tribromostyrene, pentabromophenol, brominated polyethylene, dibromoneopentyl glycol tetra Carbonate, bis (tribromophenyl) fumaranide, N-methylhexabromodiphenylamine, halogen-containing polyphosphate, aromatic bromine brominated epoxy resin, brominated polystyrene, brominated flame retardant (trade name: Switzerland, Sand Sandoflam 5071 etc.) Pentabromotoluene, pentabromophenyl oxide, pentabromophenyl oxide and phosphate ester, mixture of stabilizers, hexabromocyclododecane, hexabromophenyl ether, hexabu Mo phenyl ether, hexabromodiphenyl ether, octabromodiphenyl oxide, there are magnesium hydroxide and the like.
反応型難燃剤の代表的な物は、無水クレインド酸、テトラブロモ無水フタル酸、テトラブロモ・ビスフェノールA、ジエトキシ−ビス−(2−ヒドロキシエチル)−アミノエチル・ホスフェート、ジブロモ・クレジル・グリシジルエーテル、ジブロモフェノール、ジブロモクレゾール、トリブロモフェノール、フェニル・ホスフォン酸、フェニル・ホスフォン酸ジクロリド、ジエチルフェニル・ホスフォネート、ジアリル=クロレンデート、反応難燃ポリオール、ジ(イソプロピル)N,N−ビス(2−ヒドロキシエチル)アミノメチル・ホスフォネート、ジブチルビス(2−ヒドロキシプロピル)ピロホスフェート、ジエチルフェニル・ホスフォネート及びジメチルフェニル・ホスフォネート等がある。その他、シリコン樹脂、シリコンオイル、フッ素樹脂、フッ素系のオイル等がある。 Typical examples of reactive flame retardants are: Creinic anhydride, tetrabromophthalic anhydride, tetrabromo-bisphenol A, diethoxy-bis- (2-hydroxyethyl) -aminoethyl phosphate, dibromo-cresyl-glycidyl ether, dibromophenol , Dibromocresol, tribromophenol, phenyl phosphonic acid, phenyl phosphonic acid dichloride, diethyl phenyl phosphonate, diallyl chlorendate, reaction flame retardant polyol, di (isopropyl) N, N-bis (2-hydroxyethyl) aminomethyl -Phosphonate, dibutylbis (2-hydroxypropyl) pyrophosphate, diethylphenyl phosphonate and dimethylphenyl phosphonate. In addition, there are silicone resin, silicone oil, fluorine resin, fluorine-based oil, and the like.
また難燃化安定剤としての代表的なものとして、エポキシ系安定剤(アデカ・アーガス化学の製品:Mark EP−13、EP−17、EP−22、Mark273)、組成不明の難燃化安定剤(アデカ・アーガス化学の製品:Mark−ZS−66、ZS−506)、ABS−PVC系ポリマーブレンド用安定剤(三共有機合成の製品:StanBM(N)、−RC−200S)、ABS、PS系難燃剤添加型安定剤)等がある。 As typical flame retardant stabilizers, epoxy stabilizers (Products of Adeka Argus Chemical: Mark EP-13, EP-17, EP-22, Mark 273), flame retardant stabilizers of unknown composition (Products of Adeka Argus Chemical: Mark-ZS-66, ZS-506), ABS-PVC-based polymer blend stabilizers (Products of three-sharing machine synthesis: StanBM (N), -RC-200S), ABS, PS Type flame retardant added type stabilizer).
難燃化用安定剤としては、エポキシ系の安定剤、例えば旭電化の製品、商品名、及びグレード;アデカ・サイザーEPー13,アデカ・サイザーEPー17,アデカ・サイザーEPー22、組成不明の難燃化用安定剤としては、例えば旭電化の製品、商品名、及びグレード;アデカ・スタブZS−66,アデカ・スタブZS−506、ABS−PVC系ポリマーブレンド用安定剤としては、ブチル・錫・マレート系、オクチル・錫・マレート系、ブチル・錫・含硫黄系、オクチル・錫・含硫黄系、例えば三共有機合成の製品、商品名、及びグレード;Stan
BM(N),Stan OMF,Stan JF−9B,Stan JF−95B,Stan BKー1100L,Stan JF−95B,Stan BK−1100L,Stan
ONZ−20,Stan ONZ−22,Stan ONZ−22P,StanMMS、MC、その他の難燃化用安定剤としては、協和化学の製品、商品名、及びグレード;DHT−4A−2等がある。
Flame retardant stabilizers include epoxy stabilizers such as Asahi Denka products, trade names, and grades; Adeka Sizer EP-13, Adeka Sizer EP-17, Adeka Sizer EP-22, composition unknown Examples of flame retardant stabilizers include Asahi Denka's products, trade names, and grades; Adeka Stub ZS-66, Adeka Stub ZS-506, ABS-PVC polymer blend stabilizers such as butyl Tin / malate series, octyl / tin / malate series, butyl / tin / sulfur-containing series, octyl / tin / sulfur-containing series, for example, three-share machine synthesis products, trade names and grades; Stan
BM (N), Stan OMF, Stan JF-9B, Stan JF-95B, Stan BK-1100L, Stan JF-95B, Stan BK-1100L, Stan
ONZ-20, Stan ONZ-22, Stan ONZ-22P, StanMMS, MC, and other flame retardant stabilizers include Kyowa Chemical's products, trade names, and grades; DHT-4A-2, and the like.
前記熱硬化性樹脂や、熱可塑性樹脂には、ガラス繊維、ガラスビーズ、カーボン繊維、セラミック繊維、金属繊維、マイカ、タルク、炭酸カルシウム、珪酸アルミニウム、カオリン、シリカ、メタ珪酸カルシウム、瀝青質微粉末、ゼオライト、珪藻土、ケイ砂、軽石粉、スレート粉、アルミナ、酸化鉄、硫酸アルミニウム、硫酸バリウム、リトポン、硫酸カルシウム、酸化マグネシウム、二硫化モリブデン、ゴム粉末、エボナイト粉末、セラック、木粉、ココナット椰子殻粉、コルク粉末、セルロースパウダー、木材パルプ、紙、布や、雲母粉、グラファイト、硝子球(GB)、火山硝子中空体、炭素中空球、無煙炭粉末、人造水晶石、シリコーン樹脂微粉末、シリカ球状微粒子等の充填剤や、その他可塑剤、老化防止剤、紫外線吸収剤、難燃剤等が添加されてもよい。 The thermosetting resin and thermoplastic resin include glass fiber, glass bead, carbon fiber, ceramic fiber, metal fiber, mica, talc, calcium carbonate, aluminum silicate, kaolin, silica, calcium metasilicate, and bituminous fine powder. , Zeolite, diatomaceous earth, silica sand, pumice powder, slate powder, alumina, iron oxide, aluminum sulfate, barium sulfate, lithopone, calcium sulfate, magnesium oxide, molybdenum disulfide, rubber powder, ebonite powder, shellac, wood powder, coconut palm Shell powder, cork powder, cellulose powder, wood pulp, paper, cloth, mica powder, graphite, glass sphere (GB), volcanic glass hollow body, carbon hollow sphere, anthracite powder, artificial quartz stone, silicone resin fine powder, silica Fillers such as spherical fine particles, other plasticizers, anti-aging agents, UV absorbers, difficult Agents and the like may be added.
熱硬化性樹脂の成形加工は、圧縮成形法、トランスファー成形、射出成形法、射出圧縮成形が一般的であり、熱可塑性樹脂の場合には、射出成形が一般的には適用され、公知の中実成形法(ソリッド成形法)や、射出圧縮成形法、日本の旭化成工業(株)のAGI、GPI、CGM、出光石油化学(株)のGIM、新日鉄化学(株)のPFP、英国のシンプレス社、米国のGAIN Technology 独国のエアーモールド,コンツールなどに代表されるガスアシスト成形法(中空射出成形法)、及び米国のUCC法、USM法、あるいは、東芝機械と旭ダウとが開発したTAF法、EX−CELL-O社法、ヘッティンガーの発泡成形や、New−SF、GCP法、アライドケミカル社の技法等、更に超臨界状態の気態(体)を用いた米国 トレクセル社のMuCell(ミューセル)や旭化成工業(株)のAMOTECに代表される発泡成形法(発泡射出成形法)や、発泡成形法と前記ガスアシスト成形法と融合された方法、更には(株)住友化学のSPモールド、射出圧縮成形法との前記ガスアシスト成形法及び/又は発泡成形法とを融合させた方法にも適用される。
場合によっては真空成形、或いは圧空成形、キャタリスト(注型)によっても可能である。
The molding process of thermosetting resins is generally compression molding, transfer molding, injection molding, or injection compression molding. In the case of thermoplastic resins, injection molding is generally applied, Actual molding method (solid molding method), injection compression molding method, AGI, GPI, CGM of Asahi Kasei Kogyo Co., Ltd., GIM of Idemitsu Petrochemical Co., Ltd., PFP of Nippon Steel Chemical Co., Ltd., UK , US GAIN Technology Developed by gas assisted molding method (hollow injection molding method) represented by German air mold, contool, etc., and UCC method, USM method, or Toshiba Machine and Asahi Dow TAF method, EX-CELL-O company method, Hettinger foam molding, New-SF, GCP method, Allied Chemical technique, etc. A foam molding method (foam injection molding method) represented by Amutec of Mucell of Asahi Kasei Kogyo Co., Ltd., a method fused with the foam molding method and the gas assist molding method, and The present invention is also applied to a method in which the gas assist molding method and / or the foam molding method are combined with Sumitomo Chemical's SP mold, injection compression molding method.
In some cases, vacuum forming, pressure forming, or catalyst (casting) is also possible.
発泡性樹脂を製造するに当たり発泡の方法は、物理的な方法と化学的な方法とに大別され、物理的な発泡の方法の例としては、機械的な撹拌によって発泡させたり、溶融樹脂中に揮発性の溶剤を注入し、加熱することで気化させて発泡させる方法で、一方化学的な発泡の例は、化学反応を起こさせ、発生してくるガスを利用する方法などがある。一般的には、取り扱いやすさの観点から、発泡剤を用いる場合が多い。 In producing foamable resins, foaming methods are broadly divided into physical methods and chemical methods. Examples of physical foaming methods include foaming by mechanical stirring or in molten resin. A method of injecting a volatile solvent into the gas and evaporating it by heating to cause foaming. On the other hand, examples of chemical foaming include a method of causing a chemical reaction and utilizing the generated gas. In general, a foaming agent is often used from the viewpoint of ease of handling.
発泡剤は、物理発泡剤と化学発泡剤とに分類され、前者の物理発泡剤の例としては、上述した超臨界状態の炭酸ガスや、気体の炭酸ガス、窒素ガス、空気、水蒸気、水などに代表される無機系の液体や気体、ジクロルエタン、メチレンクロライド、フロンガスなどのハロゲン化炭化水素、ペンタン、ヘキサン、ヘプタン、シクロヘキサン、オクタン、ガソリンなどの炭化水素、エタノール、エタノール、プロパノールなどのアルコール類、エチルエーテル、メチルエチルエーテル等のエーテル類などの代表されるの低沸点溶剤、あるいは上記低沸点溶剤を熱可塑性樹脂シェル内に封入した発泡性カプセルなど有機系の液体や気体がある。 Foaming agents are classified into physical foaming agents and chemical foaming agents. Examples of the former physical foaming agents include the above-mentioned supercritical carbon dioxide gas, gaseous carbon dioxide gas, nitrogen gas, air, water vapor, and water. Inorganic liquids and gases typified by, halogenated hydrocarbons such as dichloroethane, methylene chloride, and flon gas, hydrocarbons such as pentane, hexane, heptane, cyclohexane, octane, gasoline, alcohols such as ethanol, ethanol, propanol, There are organic liquids and gases such as low-boiling solvents typified by ethers such as ethyl ether and methyl ethyl ether, or foamable capsules in which the low-boiling solvent is enclosed in a thermoplastic resin shell.
後者の化学発泡剤の例としては、重炭酸ナトリウム、重炭酸アンモニウムなどに代表される重炭酸塩、炭酸アンモニウムなどに代表される炭酸塩、亜硝酸アンモニウムなどに代表される亜硝酸塩、Ca(N3)2などに代表されるアジド化合物、ホウ水素化ナトリウムなどに代表される水素化合物、Mg,Alなどの軽金属に水や酸、アルカリを作用させて水素ガスを発生させる組み合わせなどは、無機系化合物の発泡剤である。 Examples of the latter chemical blowing agent include bicarbonates typified by sodium bicarbonate and ammonium bicarbonate, carbonates typified by ammonium carbonate and the like, nitrites typified by ammonium nitrite and the like, Ca (N 3 ) Inorganic compounds such as azide compounds typified by 2 and the like, hydrogen compounds typified by sodium borohydride, etc., and combinations of light metals such as Mg and Al that react with water, acid and alkali to generate hydrogen gas It is a foaming agent.
一方、有機化合物の発泡剤としては、アゾジカルボンアミド、アゾビスイソブチロニトリル、バリウムアゾジカルボシキレート、ジニトロソペンタメチレンテトラミン、P、P’−オキシビス(ベンゼンスルホニルヒドラジッド)、パラトルエンスルホニルヒドラジッド、ジアゾアミノベンゼン、N、N’−ジメチルN、N’−ジニトロソテレフタルアミド、ニトロウレア、アセトン−P−トルエンスルホニルヒドラゾン、P−トルエンスルホニルアジド、2,4−トルエンスルホニルヒドラジド、P−メチルウレタンベンゼンスルホニルヒドラジド、トリニトロソメチレントリアミン、P−トルエンスルホニルセミカルバジド、オキザリルヒドラジド、ニトログアニジン、ヒドラジカルボンアミド、トリヒドラジノトリアジンなど、アゾ化合物、ヒドラジン誘導体、セミカルバジド化合物、アジ化物、ニトロソ化物、トリアゾール化合物などが例示される。 On the other hand, as foaming agents for organic compounds, azodicarbonamide, azobisisobutyronitrile, barium azodicarboxylate, dinitrosopentamethylenetetramine, P, P′-oxybis (benzenesulfonylhydrazide), paratoluenesulfonylhydra Zid, diazoaminobenzene, N, N′-dimethyl N, N′-dinitrosotephthalamide, nitrourea, acetone-P-toluenesulfonyl hydrazone, P-toluenesulfonyl azide, 2,4-toluenesulfonyl hydrazide, P-methylurethane Azolation such as benzenesulfonyl hydrazide, trinitrosomethylene triamine, P-toluenesulfonyl semicarbazide, oxalyl hydrazide, nitroguanidine, hydradicarbonamide, trihydrazinotriazine Things, hydrazine derivatives, semicarbazide compound, azide, nitroso compound, triazole compounds.
射出成形での発泡成形には、発泡剤を熱分解等をさせて起泡させることで、溶融樹脂の圧力が高くなってくること、また溶融樹脂内に発泡ガスを加圧溶解させること、即ち高背圧で可塑化する必要がある。特に超臨界のガスを溶解させる場合、圧力と温度によって超臨界状態を作り出す場合などには、成形機加熱筒先端のノズル部から溶融樹脂が漏れるので、これを防止する目的で、シャットオフノズルをもちいる方が良い。 In foam molding in injection molding, the foaming agent is foamed by pyrolysis or the like, so that the pressure of the molten resin is increased, and the foaming gas is dissolved under pressure in the molten resin. It is necessary to plasticize with high back pressure. In particular, when supercritical gas is dissolved, or when a supercritical state is created by pressure and temperature, the molten resin leaks from the nozzle at the tip of the molding machine heating cylinder. It is better to use.
シャットオフノズルは、油圧作動式のシャットオフノズル、空気圧作動式のシャットオフノズル、油圧作動式のロータリーノズル、空気圧作動式のロータリーノズル、バネ方式のシャットオフノズルや、油圧作動式のホットランナーバルブゲート、空気圧作動式のホットランナーバルブゲート、バネ方式のホットランナーバルブゲートなどが使用可能である。 Shut-off nozzles include hydraulically operated shutoff nozzles, pneumatically operated shutoff nozzles, hydraulically operated rotary nozzles, pneumatically operated rotary nozzles, spring-operated shutoff nozzles, and hydraulically operated hot runner valves. A gate, a pneumatically operated hot runner valve gate, a spring type hot runner valve gate, etc. can be used.
他の単量体としてはアクリル酸、メタクリル酸、マレイン酸、イタコン酸、アクリル酸メチル、アクリル酸エチル、メタクリル酸メチル、無水マレイン酸、アリールマレイン酸イミド、アルキルマレイン酸イミド等のα−β不飽和有機酸又はその誘導体;酢酸ビニル、酪酸ビニル等のビニルエステル;スチレン、メチルスチレン等の芳香族ビニル化合物;ビニルトリメチルメトキシシラン、γ−メタクリロイルオキシプロピルトリメトキシシラン等のビニルシランがあり、更に1,4−ヘキサジエン、4−メチル−1,4−ヘキサジエン、5−4−メチル−1,4−ヘキサジエン、ジシクロペンタジエン、エチリデンノルボルネン(4−エチリデン−2−ノンボルネン)等の非共役ジエンを少量共重合させても良い。 Examples of other monomers include α-β-insoluble monomers such as acrylic acid, methacrylic acid, maleic acid, itaconic acid, methyl acrylate, ethyl acrylate, methyl methacrylate, maleic anhydride, arylmaleimide, and alkylmaleimide. Saturated organic acids or derivatives thereof; vinyl esters such as vinyl acetate and vinyl butyrate; aromatic vinyl compounds such as styrene and methylstyrene; vinyl silanes such as vinyltrimethylmethoxysilane and γ-methacryloyloxypropyltrimethoxysilane; Small amounts of non-conjugated dienes such as 4-hexadiene, 4-methyl-1,4-hexadiene, 5-4-methyl-1,4-hexadiene, dicyclopentadiene, and ethylidene norbornene (4-ethylidene-2-nonbornene). You may let them.
1…扇子、2…平板、3…紐部材、4…軸、5…連結部、6…貫通孔、
30…射出成形機、31…固定側金型、32…可動側金型、33…固定側入れ子、34…可動側入れ子、35…スプルー、36…ランナー、37…ゲート、
38…キャビティ、39…パーティングライン(P/L)
DESCRIPTION OF SYMBOLS 1 ... Fan, 2 ... Flat plate, 3 ... String member, 4 ... Axis, 5 ... Connection part, 6 ... Through-hole,
DESCRIPTION OF SYMBOLS 30 ... Injection molding machine, 31 ... Fixed side mold, 32 ... Movable side mold, 33 ... Fixed side nesting, 34 ... Movable side nesting, 35 ... Sprue, 36 ... Runner, 37 ... Gate,
38 ... cavity, 39 ... parting line (P / L)
Claims (4)
重ねた複数の前記平板の長手方向の一端部を貫通するように設ける軸と、
前記軸を中心として前記平板を回転させたときに、互いに隣り合う前記平板の他端部間に隙間が生じないように、互いに隣り合う前記平板の動きを拘束する線材と、を備え、
前記平板および前記線材は、前記樹脂により一体成形されていることを特徴とする扇子。 A plurality of long flat plates made of resin;
A shaft provided so as to pass through one end in the longitudinal direction of the plurality of stacked flat plates;
A wire rod that restrains movement of the adjacent flat plates so that no gap is generated between the other end portions of the adjacent flat plates when the flat plate is rotated about the axis, and
The fan, wherein the flat plate and the wire are integrally formed of the resin.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111978601A (en) * | 2019-05-23 | 2020-11-24 | 斯沃奇集团研究及开发有限公司 | Jewellery made of natural elastomer material |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1420496A (en) * | 1921-06-09 | 1922-06-20 | Herman C Ohm | Folding fan |
JPS62136814U (en) * | 1986-02-24 | 1987-08-28 | ||
JP3072035U (en) * | 2000-03-27 | 2000-09-29 | 株式会社 プリンクス | Paper folding fan |
JP2003000318A (en) * | 2001-06-25 | 2003-01-07 | Kuniko Hishida | Spreding fan |
JP2007301330A (en) * | 2006-05-11 | 2007-11-22 | Hokkaido Jiki Insatsu Kk | Manufacturing method of folding fan |
JP2010115373A (en) * | 2008-11-13 | 2010-05-27 | Morito Co Ltd | Knock-down folding fan |
-
2012
- 2012-08-25 JP JP2012185960A patent/JP6022856B2/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1420496A (en) * | 1921-06-09 | 1922-06-20 | Herman C Ohm | Folding fan |
JPS62136814U (en) * | 1986-02-24 | 1987-08-28 | ||
JP3072035U (en) * | 2000-03-27 | 2000-09-29 | 株式会社 プリンクス | Paper folding fan |
JP2003000318A (en) * | 2001-06-25 | 2003-01-07 | Kuniko Hishida | Spreding fan |
JP2007301330A (en) * | 2006-05-11 | 2007-11-22 | Hokkaido Jiki Insatsu Kk | Manufacturing method of folding fan |
JP2010115373A (en) * | 2008-11-13 | 2010-05-27 | Morito Co Ltd | Knock-down folding fan |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111978601A (en) * | 2019-05-23 | 2020-11-24 | 斯沃奇集团研究及开发有限公司 | Jewellery made of natural elastomer material |
EP3741247A1 (en) * | 2019-05-23 | 2020-11-25 | The Swatch Group Research and Development Ltd | Piece of jewellery made from natural elastomer material |
US11672313B2 (en) | 2019-05-23 | 2023-06-13 | The Swatch Group Research And Development Ltd | Piece of jewellery made of natural elastomer material |
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