JP2014041897A5 - - Google Patents
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- JP2014041897A5 JP2014041897A5 JP2012182964A JP2012182964A JP2014041897A5 JP 2014041897 A5 JP2014041897 A5 JP 2014041897A5 JP 2012182964 A JP2012182964 A JP 2012182964A JP 2012182964 A JP2012182964 A JP 2012182964A JP 2014041897 A5 JP2014041897 A5 JP 2014041897A5
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- substrate
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- detection roller
- magnet
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本発明の実施形態に係る基板処理装置は、搬送される基板の有無を検出する基板検出装置を有する基板処理装置であって、前記基板検出装置は、基部と、前記基部に対して揺動自在に取り付けられている揺動部材と、前記揺動部材の一端部に設けられ、搬送される前記基板に当てる検出ローラと、前記揺動部材の他端部に設けられているウエイトとマグネットと、搬送される前記基板が前記検出ローラを押し下げて、前記基板が前記検出ローラに当たる前の前記揺動部材の初期位置から前記揺動部材が回転方向へ回転すると、前記マグネットが発生している磁界の変化を検出して前記基板を検出したことを示す検出信号を出す検出センサと、前記揺動部材の前記初期位置では、前記揺動部材を前記基板の搬送方向と交差する垂直線に対して傾斜して保持する揺動ストッパと、を備え、前記揺動部材の揺動支点から上の部分であって、前記検出ローラまでの重量をW1、前記揺動部材の揺動支点から下の部分であって、前記マグネットと前記ウエイトまでの重量をW2、前記検出ローラが前記基板を検出する際に、前記検出ローラが基板から受ける突き上げ反力をW0、前記揺動支点から前記検出ローラの回転中心までの距離をL1、前記揺動支点から前記マグネットまでの距離をL2としたときに、(WO+W1)×L1>W2×L2、かつ、W1×L1<W2×L2であることを特徴とする。 The substrate processing apparatus which concerns on embodiment of this invention is a substrate processing apparatus which has a substrate detection apparatus which detects the presence or absence of the board | substrate conveyed, Comprising: The said substrate detection apparatus is rockable with respect to the said base and the said base. A swing member attached to the swing member, a detection roller that is provided at one end of the swing member and is applied to the substrate to be conveyed, a weight and a magnet that are provided at the other end of the swing member, When the substrate being conveyed pushes down the detection roller and the swinging member rotates in the rotation direction from the initial position of the swinging member before the substrate hits the detection roller, the magnetic field generated by the magnet is reduced. A detection sensor that detects a change and detects a detection of the substrate; and at the initial position of the swing member, the swing member is tilted with respect to a vertical line that intersects the transport direction of the substrate. And a swing stopper for holding and, a portion above the fulcrum of the swinging member, the weight of up to the detection roller W1, in the lower part of the swing fulcrum of the swing member W2 represents the weight between the magnet and the weight, W0 represents the thrust reaction force received by the detection roller from the substrate when the detection roller detects the substrate, and the rotation center of the detection roller from the swing fulcrum the distance to the L1, the distance from the rocking fulcrum to said magnet is taken as L2, and (WO + W1) × L1> W2 × L2 and,, W1 × L1 <W2 × L2 der wherein Rukoto .
Claims (6)
前記基板検出装置は、
基部と、
前記基部に対して揺動自在に取り付けられている揺動部材と、
前記揺動部材の一端部に設けられ、搬送される前記基板に当てる検出ローラと、
前記揺動部材の他端部に設けられているウエイトとマグネットと、
搬送される前記基板が前記検出ローラを押し下げて、前記基板が前記検出ローラに当たる前の前記揺動部材の初期位置から前記揺動部材が回転方向へ回転すると、前記マグネットが発生している磁界の変化を検出して前記基板を検出したことを示す検出信号を出す検出センサと、
前記揺動部材の前記初期位置では、前記揺動部材を前記基板の搬送方向と交差する垂直線に対して傾斜して保持する揺動ストッパと、
を備え、
前記揺動部材の揺動支点から上の部分であって、前記検出ローラまでの重量をW1、
前記揺動部材の揺動支点から下の部分であって、前記マグネットと前記ウエイトまでの重量をW2、
前記検出ローラが前記基板を検出する際に、前記検出ローラが基板から受ける突き上げ反力をW0、
前記揺動支点から前記検出ローラの回転中心までの距離をL1、
前記揺動支点から前記マグネットまでの距離をL2としたときに、
(WO+W1)×L1>W2×L2、かつ、W1×L1<W2×L2であることを特徴とする基板処理装置。 A substrate processing apparatus having a substrate detection device for detecting the presence or absence of a substrate to be transported,
The substrate detection device includes:
The base,
A swinging member that is swingably attached to the base,
A detection roller provided at one end of the swinging member and applied to the substrate to be conveyed;
A weight and a magnet provided at the other end of the swing member;
When the substrate being conveyed pushes down the detection roller and the swinging member rotates in the rotation direction from the initial position of the swinging member before the substrate hits the detection roller, the magnetic field generated by the magnet is reduced. A detection sensor that detects a change and outputs a detection signal indicating that the substrate has been detected;
A rocking stopper that holds the rocking member at an inclination with respect to a vertical line that intersects the transport direction of the substrate at the initial position of the rocking member;
Equipped with a,
The portion above the swing fulcrum of the swing member, the weight to the detection roller is W1,
A portion below the swing fulcrum of the swing member, and the weight between the magnet and the weight is W2,
When the detection roller detects the substrate, the thrust reaction force received by the detection roller from the substrate is W0,
The distance from the swing fulcrum to the rotation center of the detection roller is L1,
When the distance from the swing fulcrum to the magnet is L2,
(WO + W1) × L1> W2 × L2 and,, W1 × L1 <substrate processing apparatus according to claim W2 × L2 der Rukoto.
前記第2部分の端部には前記検出ローラが設けられ、前記第1部分の端部には前記ウエイトと前記マグネットが設けられていることを特徴とする請求項1に記載の基板処理装置。 The swing member has a first portion formed along the vertical line, and a second portion formed so as to be inclined from the first portion to the rotation direction side with respect to the vertical line. And
The substrate processing apparatus according to claim 1, wherein the detection roller is provided at an end of the second portion, and the weight and the magnet are provided at an end of the first portion.
前記検出ローラは、取り付け軸部により前記揺動部材の一端部に設けられており、 The detection roller is provided at one end of the swing member by an attachment shaft portion;
前記取り付け軸部と前記揺動支点部材との間の距離は、前記揺動支点部材と前記マグネットとの間の距離と比べて短く設定されていることを特徴とする請求項1記載の基板処理装置。 2. The substrate processing according to claim 1, wherein a distance between the attachment shaft portion and the swing fulcrum member is set shorter than a distance between the swing fulcrum member and the magnet. apparatus.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012182964A JP6000019B2 (en) | 2012-08-22 | 2012-08-22 | Substrate processing equipment |
KR1020130093094A KR101473107B1 (en) | 2012-08-22 | 2013-08-06 | Substrate processing apparatus |
TW102129802A TWI494260B (en) | 2012-08-22 | 2013-08-20 | Substrate processing device |
CN201310364328.7A CN103633000B (en) | 2012-08-22 | 2013-08-20 | Substrate board treatment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012182964A JP6000019B2 (en) | 2012-08-22 | 2012-08-22 | Substrate processing equipment |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014184103A Division JP6008917B2 (en) | 2014-09-10 | 2014-09-10 | Substrate detection apparatus and substrate processing apparatus |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014041897A JP2014041897A (en) | 2014-03-06 |
JP2014041897A5 true JP2014041897A5 (en) | 2015-10-01 |
JP6000019B2 JP6000019B2 (en) | 2016-09-28 |
Family
ID=50213886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012182964A Active JP6000019B2 (en) | 2012-08-22 | 2012-08-22 | Substrate processing equipment |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6000019B2 (en) |
KR (1) | KR101473107B1 (en) |
CN (1) | CN103633000B (en) |
TW (1) | TWI494260B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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USD800083S1 (en) | 2015-02-23 | 2017-10-17 | Samsung Electronics Co., Ltd. | Electronic device |
CN105107776B (en) * | 2015-08-24 | 2017-06-27 | 京东方科技集团股份有限公司 | Detection means and cleaning equipment for work-piece |
CN105865495B (en) * | 2016-06-20 | 2017-12-01 | 武汉华星光电技术有限公司 | Position detecting device |
JP7148289B2 (en) * | 2018-06-20 | 2022-10-05 | 芝浦メカトロニクス株式会社 | Substrate detection device and substrate processing device |
CN109142388B (en) * | 2018-08-01 | 2021-04-13 | 京东方科技集团股份有限公司 | Substrate detector, driving device and substrate cleaning equipment |
JP6857682B2 (en) * | 2019-03-29 | 2021-04-14 | 芝浦メカトロニクス株式会社 | Board processing equipment |
USD959424S1 (en) | 2020-02-26 | 2022-08-02 | Samsung Electronics Co., Ltd. | Mobile telephone |
KR102590191B1 (en) * | 2020-06-30 | 2023-10-16 | 시바우라 메카트로닉스 가부시끼가이샤 | Apparatus and method for bonding |
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JPH0737285B2 (en) * | 1993-02-22 | 1995-04-26 | 吉田車輌機器株式会社 | Load detection device |
JPH10265026A (en) * | 1997-03-25 | 1998-10-06 | Hitachi Electron Eng Co Ltd | Passage of work detector |
JPH1111640A (en) * | 1997-06-30 | 1999-01-19 | Okamura Corp | Device for detecting subject to be conveyed by roller conveyor |
JP2001057355A (en) * | 1999-08-19 | 2001-02-27 | Dainippon Screen Mfg Co Ltd | Substrate detector and substrate processor |
JP2002110004A (en) * | 2000-09-29 | 2002-04-12 | Nippon Kentetsu Co Ltd | Passing detection switch |
JP2003128244A (en) * | 2001-10-30 | 2003-05-08 | Sumitomo Precision Prod Co Ltd | Substrate detecting device and substrate processing equipment |
TW200420480A (en) * | 2003-04-04 | 2004-10-16 | Mosel Vitelic Inc | Wafer transmission system with sensor |
TWM259245U (en) * | 2004-05-28 | 2005-03-11 | Jing Bo Technology Co Ltd | Magnetically swinging counting controller and resetting structure |
JP2007066985A (en) * | 2005-08-29 | 2007-03-15 | Shibaura Mechatronics Corp | Substrate detecting apparatus and treatment apparatus |
KR20070048483A (en) * | 2005-11-04 | 2007-05-09 | 세메스 주식회사 | Apparatus and method for treating a substrate |
KR101071174B1 (en) * | 2008-11-26 | 2011-10-10 | 에프엔에스테크 주식회사 | Apparatus for sensing substrate |
JP2010133884A (en) * | 2008-12-08 | 2010-06-17 | Sharp Corp | Pendulum sensor |
CN102253505B (en) * | 2010-05-20 | 2013-04-03 | 北京京东方光电科技有限公司 | Substrate position detecting method and device |
-
2012
- 2012-08-22 JP JP2012182964A patent/JP6000019B2/en active Active
-
2013
- 2013-08-06 KR KR1020130093094A patent/KR101473107B1/en active IP Right Grant
- 2013-08-20 CN CN201310364328.7A patent/CN103633000B/en active Active
- 2013-08-20 TW TW102129802A patent/TWI494260B/en active
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