JP2014041017A - X-ray stress measurement instrument - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an X-ray stress measurement instrument which is capable of measuring residual stress of a measurement object having irregularities on a surface thereof without damaging the surface.SOLUTION: An X-ray stress measurement instrument 1 includes: an X-ray irradiation part 10 which radiates X-rays X1 so that they cross a normal Q of a surface of a measurement object Z, the normal Q passing through a measurement point of the surface; an X-ray reception part 20 which can detect diffracted X-rays resulting from diffraction at the measurement point A of the X-rays X1 and the relative position of which is fixed relative to the X-ray irradiation part 10; a first laser irradiation part 30 which is provided integrally with the X-ray irradiation part 10 and radiate a first laser R1 passing through an intersection B between the X-rays X1 and the normal Q; a second laser irradiation part 40 which is provided integrally with the X-ray reception part 20 and radiates a second laser R2 passing through the intersection B; and a first moving part 50 which moves the X-ray irradiation part 10 and the X-ray reception part 20 toward and away from the measurement point A.

Description

  The present invention relates to an X-ray stress measurement apparatus.

  Conventionally, as a method of measuring the residual stress of a metal material, a measurement object is irradiated with X-rays, diffracted X-rays diffracted by the measurement object are detected, and measurement is performed based on the detected diffraction X-rays The method is known.

As a measuring apparatus using the above-mentioned X-rays, a metal jig placed in contact with the measurement object for positioning the measurement position in the measurement object, and a measurement position positioned by the metal jig Some have an irradiation unit that emits X-rays and a detection unit that detects diffracted X-rays diffracted by the measurement object.
According to such a measuring apparatus, the measurement position is positioned by a metal jig, and then the metal jig is removed, X-rays are irradiated from the irradiation unit toward the measurement position, and the diffracted diffracted X-rays are detected by the detection unit. The residual stress at the measurement position can be measured by detecting and analyzing the diffracted X-ray.

As another apparatus, an X-ray tube that irradiates a measurement object with X-rays, an X-ray detector that detects diffracted X-rays diffracted by the measurement object, and laser light from directly above the measurement object. A device including a light emitting unit that emits light and a light receiving unit that receives a laser beam reflected by the measurement object is known (see Patent Document 1 below).
According to such a measuring apparatus, since the distance to the measurement object can be measured by the laser beam, the residual stress at the measurement location specified by the measured distance can be estimated.

JP-A-8-320264

  However, in the method of placing the metal jig in contact with the measurement object, the tip of the metal jig contacts the measurement object when the measurement position is positioned, and the surface of the measurement object is damaged. For this reason, it is not preferable because it causes corrosion.

  In addition, in the method using the apparatus described in Patent Document 1, if the surface of the measurement object has irregularities, the laser reflected by the irregularities cannot be accurately received by the light receiving unit, and an accurate distance is obtained. May not be measured. In this case, since an error occurs in the measurement value, an accurate measurement location cannot be specified, and there is a problem that an error also occurs in the estimated residual stress.

  The present invention has been made in view of such circumstances, and the X-ray residue that can accurately measure the residual stress of a measurement object having unevenness on the surface of the measurement object without damaging the surface. A stress measuring device is provided.

In order to achieve the above object, the present invention employs the following means.
That is, the X-ray stress measurement apparatus according to the present invention includes an X-ray irradiation unit that irradiates an X-ray so as to intersect with a normal line of the surface passing through a measurement point on the surface of the measurement target, and the X-ray is the measurement A diffracted X-ray diffracted at a point can be detected, and an X-ray light receiving unit whose relative position to the X-ray irradiation unit is fixed, and the X-ray irradiation unit are provided integrally with the X-ray and the normal line. A first laser irradiation unit that irradiates a first laser that passes through the intersection point, a second laser irradiation unit that is provided integrally with the X-ray light receiving unit and that irradiates a second laser beam that passes through the intersection point, and the X-ray irradiation. And a first moving unit that moves the X-ray light receiving unit close to and away from the measurement point.

  In such an X-ray stress measurement apparatus, the first laser and the second laser intersect at the intersection, and the intersection can be moved closer to and away from the measurement target by the first moving unit. Therefore, even when the surface of the measurement target has irregularities, the intersection can be provided on the measurement target. Therefore, since the diffracted X-rays can be obtained by irradiating the surface to be measured with X-rays, the residual stress can be accurately measured based on the diffracted X-rays without damaging the surface.

  Further, the X-ray stress measurement apparatus according to the present invention is a concentric circle centered on the measurement point on the first virtual plane including the normal, the first laser irradiation unit, and the second laser irradiation unit. It is preferable to include a second moving unit that moves the X-ray irradiation unit and the X-ray light receiving unit.

  In such an X-ray stress measurement apparatus, the X-ray can be made incident at a desired incident angle at the measurement point by moving the X-ray irradiation unit and the X-ray light receiving unit concentrically by the second moving unit. Residual stress can be accurately measured based on the diffracted X-rays thus obtained.

  Further, the X-ray stress measurement apparatus according to the present invention is a distance from the second virtual plane including the normal line to the first laser irradiation unit that is orthogonal to the separation direction of the X-ray irradiation unit and the X-ray light receiving unit. And a third moving unit that moves the X-ray irradiation unit and the X-ray light receiving unit while maintaining a distance from the second virtual plane to the second laser irradiation unit, respectively.

  In such an X-ray stress measurement device, the X-ray can be made incident at a desired incident angle at the measurement point by moving the X-ray irradiation unit and the X-ray light receiving unit by the third moving unit. Residual stress can be accurately measured based on the diffracted X-rays thus obtained.

  According to the X-ray stress measuring apparatus according to the present invention, it is possible to accurately measure the residual stress of a measurement object having an uneven surface.

1 is a schematic configuration diagram of an X-ray stress measurement apparatus according to a first embodiment of the present invention. It is a figure which shows the mode of irradiation of the 1st laser and the 2nd laser in the X-ray-stress measuring apparatus which concerns on 1st embodiment of this invention. It is a schematic block diagram of the X-ray stress measuring apparatus which concerns on 2nd embodiment of this invention. It is a schematic block diagram of the X-ray stress measuring apparatus which concerns on 3rd embodiment of this invention.

(First embodiment)
Hereinafter, an X-ray stress measuring apparatus according to a first embodiment of the present invention will be described with reference to the drawings.
The X-ray stress measuring device is for measuring residual stress of a measuring object made of, for example, a metal material. Examples of the measurement target include an inlet / outlet nozzle and a reactor vessel inlet / outlet nozzle in a steam generator provided in a nuclear power plant.

  As shown in FIG. 1, the X-ray stress measurement apparatus 1 includes an X-ray irradiation unit 10 that irradiates a measurement point A of a measurement target Z with X-rays, and an X-ray reception that detects X-rays diffracted at the measurement point A. And a first laser irradiation unit 30 and a second laser irradiation unit 40 that irradiate the measurement target Z with laser.

  Furthermore, the X-ray stress measurement apparatus 1 includes a first moving unit 50 that moves the X-ray irradiation unit 10, the X-ray light receiving unit 20, the first laser irradiation unit 30, and the second laser irradiation unit 40 close to and away from the measurement target Z; A connecting portion 60 that connects the X-ray irradiation unit 10 and the X-ray light receiving unit 20 is provided.

  Here, the vertical direction of the paper surface shown in FIG. 1 is the X direction, the horizontal direction of the paper surface orthogonal to the X direction is the Y direction, and the depth direction of the paper surface orthogonal to the X direction and the Y direction is the P direction.

  The X-ray irradiation unit 10 irradiates the X-ray X1 so as to intersect with the normal line Q of the surface passing through the measurement point A on the surface of the measurement target Z. The X-ray X1 irradiated by the X-ray irradiation unit 10 becomes a diffracted X-ray X2 diffracted at the measurement point A.

  The X-ray light receiving unit 20 can detect the diffracted X-ray X2, and the relative position with the X-ray irradiation unit 10 is fixed. In the present embodiment, the X-ray irradiation unit 10 and the X-ray light receiving unit 20 are in the XY plane, and the distance between them is set to the distance L1.

  The first laser irradiation unit 30 is provided integrally with the X-ray irradiation unit 10 and irradiates the first laser R1 passing through the intersection B between the X-ray X1 and the normal line Q. In FIG. 1, the measurement point A and the intersection point B coincide.

  The second laser irradiation unit 40 is provided integrally with the X-ray light receiving unit 20 and irradiates the second laser R2 passing through the intersection B.

  The first moving unit 50 moves in the direction in which the X-ray irradiating unit 10 and the X-ray light receiving unit 20 are moved closer to and away from the measurement point A, in this embodiment, the X direction. For example, the first moving unit 50 can move the X-ray irradiating unit 10, the X-ray receiving unit 20, the first laser irradiating unit 30, the second laser irradiating unit 40, and the connecting unit 60 together by an actuator (not shown). Yes.

  The connecting part 60 connects the X-ray irradiation part 10 and the X-ray light receiving part 20 and is formed in an arc shape in this embodiment.

  Next, a procedure for measuring the residual stress at the measurement point A to be measured using the X-ray stress measurement apparatus 1 configured as described above will be described.

  First, the first laser irradiation unit 30 and the second laser irradiation unit 40 irradiate the first laser R1 and the second laser R2, respectively.

  Here, as shown in FIG. 2 (a), the first irradiation point S1 that is the circular irradiation point of the first laser R1 and the circular irradiation point that is the irradiation point of the second laser R2 on the surface of the measuring object Z. A second irradiation point S2 appears. When the first irradiation point S1 and the second irradiation point S2 are separated from each other, the first moving unit 50 is moved in a direction to be separated from the measurement target Z.

  Then, as shown in FIG. 2B, the first irradiation point S1 and the second irradiation point S2 are partially overlapped. When the first moving unit 50 is further separated from the measurement object Z, as shown in FIG. 2C, the first irradiation point S1 and the second irradiation point S2 are completely coincident with each other, and the coincident point is the measurement point. A. In this state, the first moving unit 50 is fixed.

Then, X-ray X1 is irradiated from the X-ray irradiation unit 10 toward the measurement point A, and the diffracted X-ray X2 diffracted at the measurement point A is detected by the X-ray light receiving unit 20. In addition, based on the diffracted X-ray X2, the residual stress can be calculated by a known method called the sin ² ψ-2θ method.

  In the X-ray stress measuring apparatus 1 configured as described above, the first laser R1 and the second laser R2 intersect at the intersection B, and the intersection B can be moved closer to and away from the measurement target Z by the first moving unit 50. . Therefore, even when the surface of the measurement target Z is uneven, the intersection B can be provided on the measurement target. Therefore, since the X-ray X1 can be irradiated on the surface of the measuring object Z to obtain the diffracted X-ray X2, the residual stress is accurately measured based on the diffracted X-ray X2 without damaging the surface. be able to.

(Second embodiment)
Hereinafter, with reference to the drawings, an X-ray stress measurement apparatus 201 according to a second embodiment of the present invention will be described with reference to FIG.
In this embodiment, the same members as those used in the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  The X-ray stress measurement apparatus 1 according to the first embodiment is movable in the X direction, whereas the X-ray stress measurement apparatus 201 according to the present embodiment is movable on an arc. .

  As shown in FIG. 3, the X-ray stress measurement apparatus 201 measures on the first virtual plane (XY plane in the present embodiment) including the normal Q, the first laser irradiation unit 30, and the second laser irradiation unit 40. A second moving unit 70 that moves the X-ray irradiation unit 10 and the X-ray light receiving unit 20 in a concentric shape with the point A as the center is provided.

  The second moving part 70 is, for example, an arc-shaped rail provided around the measurement point A, and the second moving part 70 supports the connecting part 60 movably in the extending direction. .

  In the X-ray stress measuring apparatus 201 configured as described above, the second moving unit 70 moves the X-ray irradiation unit 10 and the X-ray light receiving unit 20 concentrically around the measurement point A, thereby measuring points. In A, X-rays can be incident at a desired incident angle. Residual stress can be accurately measured based on the diffracted X-rays thus obtained.

  For example, even when the space space above the X-ray stress measuring apparatus 201 is small, X-rays can be irradiated obliquely from above the measuring object Z as shown by a two-dot chain line in FIG. Can do.

(Third embodiment)
Hereinafter, with reference to the drawings, an X-ray stress measurement apparatus 301 according to a third embodiment of the present invention will be described with reference to FIG.
In this embodiment, the same members as those used in the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  The X-ray stress measurement apparatus 301 according to the present embodiment includes a distance L2 from the second virtual plane (PX plane in the present embodiment) including the normal line Q to the first laser irradiation unit 30 and a second virtual plane (PX plane). The X-ray irradiation unit 10 and the X-ray light receiving unit 20 are movable while maintaining the distance L3 from the first laser irradiation unit 40 to the second laser irradiation unit 40, respectively.

The second virtual plane (PX plane) is a plane that is perpendicular to the separation direction (Y direction) between the X-ray irradiation unit 10 and the X-ray light receiving unit 20 and includes the normal line Q.
As shown in FIG. 4, the X-ray stress measurement apparatus 301 is configured to measure the distance L2 (see FIG. 1) from the second virtual plane (PX plane) to the first laser irradiation unit 30 and the second virtual plane (PX plane). A third moving unit 80 for moving the X-ray irradiation unit 10 and the X-ray light receiving unit 20 while maintaining the distance L3 (see FIG. 1) to the two laser irradiation units 40 is provided.

  The third moving unit 80 includes an actuator (not shown), and the first moving unit 50 includes the X-ray irradiation unit 10, the X-ray light receiving unit 20, the first laser irradiation unit 30, the second laser irradiation unit 40, and the connection unit 60. It can be moved as a unit.

  In the X-ray stress measurement apparatus 301 configured as described above, the X-ray irradiation unit 10 and the X-ray light receiving unit 20 are moved by the third moving unit 80, so that X-rays are incident at the measurement point A at a desired incident angle. Can be made. Residual stress can be accurately measured based on the diffracted X-rays thus obtained.

  The various shapes and combinations of the constituent members shown in the above-described embodiments are merely examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, in the above-described embodiment, the first moving unit 50, the second moving unit 70, and the third moving unit 80 are provided separately. However, even if the X-ray stress measuring apparatus includes all of them. Good.

DESCRIPTION OF SYMBOLS 10 ... X-ray irradiation part 20 ... X-ray light-receiving part 30 ... 1st laser irradiation part 40 ... 2nd laser irradiation part 50 ... 1st moving part 70 ... 2nd moving part 80 ... 3rd moving part PX plane ... 2nd virtual Plane Q ... Normal XY plane ... First virtual plane Z ... Measurement object

Claims (3)

An X-ray irradiation unit that irradiates X-rays so as to intersect the normal line of the surface passing through the measurement point on the surface of the measurement target;
A diffracted X-ray diffracted by the X-ray at the measurement point can be detected, and an X-ray light receiving unit having a fixed relative position to the X-ray irradiation unit;
A first laser irradiation unit that is provided integrally with the X-ray irradiation unit and irradiates a first laser that passes through an intersection of the X-ray and the normal;
A second laser irradiation unit which is provided integrally with the X-ray light receiving unit and irradiates a second laser passing through the intersection;
An X-ray stress measurement apparatus comprising: a first moving unit that moves the X-ray irradiation unit and the X-ray light receiving unit close to and away from the measurement point.   The X-ray irradiation unit and the X-ray light receiving unit are moved concentrically around the measurement point on a first virtual plane including the normal, the first laser irradiation unit, and the second laser irradiation unit. The X-ray stress measuring apparatus according to claim 1, further comprising a second moving unit to be operated.   The distance from the second virtual plane to the first laser irradiation unit that is orthogonal to the separation direction of the X-ray irradiation unit and the X-ray light receiving unit and includes the normal line, and from the second virtual plane to the second laser irradiation unit The X-ray stress measuring apparatus according to claim 1, further comprising a third moving unit that moves the X-ray irradiating unit and the X-ray light receiving unit while maintaining the respective distances.

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