JP2014035452A - Image display device and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an image display device capable of securing a wiring connection area by suppressing a fillet from being formed due to the protrusion of a sealant into a pit formed in a backside substrate.SOLUTION: In a sealing area between a frontside substrate 1 and a backside substrate 2, a wiring connection part for leading out a wiring in a pixel sealed by both substrates is formed. The wiring is led out through a pit 6 formed as an opening in the backside substrate 2. The pit 6 is formed by a number corresponding to the number of wirings (panel wiring 9) and arranged in the sealing area, but a hollow 10 having a depth on a non-opposite surface side is formed to locate in the vicinity of the pit 6 and between two pits 6, in the plane of the backside substrate 2 being the plane opposite to the frontside substrate 1, thereby making the sealant 8 flow into the hollow 10. Thus, the protrusion of the sealant 8 into the pit 6 is suppressed small.

Description

  The present invention relates to a large-sized image display device configured by arranging a large number of organic electroluminescent display panels (organic EL panels), and more particularly to an image display device constituting the device and a manufacturing method thereof. is there.

  In recent years, a large-scale display has become a mainstream method in which a large number of LEDs (light emitting diodes) are arranged. In such a large display of the LED system, the array density of LEDs is increased with the increase in resolution, and the cost is increased. On the other hand, in order to realize a large display at a low price, a plurality of flat displays (for example, LCD panels, PDPs, EL display panels, etc.) as image display devices (or display units) are arranged in a matrix. The method is effective.

A conventional image display device that constitutes such a large display includes, for example, a front substrate on which an organic EL layer is formed in an organic EL panel, and a back substrate that is bonded to the front substrate. The front substrate and the back substrate are opposed to each other with a predetermined gap, and a plurality of image elements and a plurality of electrode terminals for controlling them are arranged between them, and a light emitting layer is formed to surround the front substrate and the back substrate. Is sealed with a sealant.
The back substrate is subjected to counterbore processing for disposing a hygroscopic material, and the periphery of the panel not subjected to counterbore processing is bonded to the front substrate with a sealant. The sealing width is usually about 1 mm in order to prevent moisture deterioration of the organic EL layer, which is sensitive to moisture, and at the same time the panel strength is maintained.

A control signal including a scanning signal and a data signal is applied to the plurality of electrode terminals from the drive control circuit, and the wiring connection method for applying the control signal to these electrode terminals includes the periphery of the image element unit, That is, a step portion is provided at a joint portion between adjacent image element portions, and an end face wiring connection method in which wiring is connected to an electrode terminal exposed at the step portion, and a back substrate is divided to provide a groove portion in a central portion, and the groove portion is provided. There is a central wiring connection system in which wiring is connected to electrode terminals through provided pits.
As a method for drawing out the wiring from the electrode terminal, there are a method using an anisotropic conductive film, a method using a conductive paste using Ag, Cu, carbon, or the like (for example, see Patent Document 1).

In addition, an example is shown in which a V-shaped groove is formed on the back substrate side serving as a terminal connecting portion of the image display device (see, for example, Patent Document 2 and Cited Document 3).
Furthermore, in the electrode terminal connection part, a moisture-proof coating agent is applied and coated to prevent corrosion of the electrode terminal due to the influence of moisture or electric field, or ion migration of the electrode terminal or wiring formed of a conductive paste, etc. An example in which a heat radiating member is provided in order to suppress an increase in temperature and connection resistance in the connection portion is shown (for example, see Patent Document 4).

JP 2008-191502 A JP 2011-8091 A JP 2011-8095 A JP 2011-113031 A

In an image display device used for a tiling display, it is necessary to narrow a frame around the panel, which is a non-light emitting area, to less than 1 mm. However, there has been a problem that the panel cannot have sufficient resistance to breakage by reducing the width of the sealing portion serving as the frame.
In addition, in the pit provided at the bottom of the groove, the sealant used when the two substrates are bonded may protrude due to manufacturing variation, etc., and the yield is not good because the connection between the conductive paste and the electrode terminal is hindered. In addition to a decrease in reliability leading to a decrease in connection and poor connection, it has been a factor in increasing costs due to inspection.

  The present invention has been made to solve such a problem, and the sealant around the pit, which is the wiring connection portion of the image display device, protrudes from the outer periphery of the pit toward the center, and the electrode terminal. Reducing the connection area between the conductive paste and the conductive paste, ensuring a connection area between the electrode terminal and the conductive paste to prevent an increase in connection resistance, and ensuring reliable wiring connection through stable wiring connection An object of the present invention is to provide an image display device and a method for manufacturing the same.

  An image display device according to the present invention includes a front substrate, a back substrate facing the front substrate and subjected to a counterbore process for disposing a hygroscopic agent, and a sealant sandwiched between the front substrate and the back substrate. A plurality of image elements that are sealed with, an electrode terminal portion that is connected to the image element via a wiring and disposed on a facing surface of the front substrate, and an opening that penetrates the back substrate on the electrode terminal portion A metal film wiring is provided that is filled and connected to the electrode terminal portion and extends to the back side of the back substrate, and the back substrate has a recess in the vicinity of the opening on the side facing the front substrate. The recess is substantially filled with the sealing agent.

  A manufacturing method of an image display device according to the present invention is a manufacturing method of manufacturing the above-described image display device, and a counterbore process for forming an opening and a recess is performed on the back substrate from the side facing the front substrate. A step of bonding the back substrate to the opposing surface of the front substrate on which the electrode terminal portion is formed using a sealant, and substantially filling the concave portion with the sealant; a non-facing surface of the back substrate Etching from the side, passing through the opening, exposing the electrode terminal portion from the opening, filling the opening with the conductive paste, and curing the conductive paste to obtain a metal film wiring Is included.

  According to the image display device of the present invention, since the concave portion is provided on the back substrate, a configuration in which the concave portion is substantially filled with the sealing agent when the substrates are bonded together is obtained, and the sealing agent to the opening serving as the electrode connecting portion is obtained. It is possible to suppress the protrusion of.

  According to the manufacturing method of the image display device according to the present invention, since the recess can be formed by etching at the same time as etching a part of the opening by one counterbore processing, the number of steps can be increased for forming the recess. In addition, the manufacturing cost can be reduced.

It is a perspective view for demonstrating the fundamental structure of the image display apparatus by Embodiment 1 of this invention. It is the perspective view which expanded the principal part of the image display apparatus by Embodiment 1 of this invention. It is a figure required for description of the subject of this invention, and is an enlarged view of the cross section along the aa line of FIG.1 and FIG.2. It is a figure required for description of the subject of this invention, and is an enlarged view of the cross section along the bb line of FIG.1 and FIG.2. FIG. 3 is an enlarged view of a cross section taken along the line aa in FIGS. 1 and 2 according to the first embodiment of the present invention. FIG. 3 is an enlarged view of a cross section taken along line bb of FIGS. 1 and 2 according to the first embodiment of the present invention. FIG. 3 is an enlarged view of a cross section taken along the line cc of FIGS. 1 and 2 according to the first embodiment of the present invention. It is a top view which shows the example of a masking pattern used at the time of counterboring in Embodiment 1 of this invention. It is a block diagram which shows the center taking-out method of an electrode terminal. It is a block diagram which shows the edge part taking-out system of an electrode terminal.

Embodiment 1 FIG.
An image display apparatus according to Embodiment 1 of the present invention will be described with reference to FIGS. Here, a method of connecting wiring from a bottom emission type organic EL panel by a center extraction method will be described.
FIG. 1 is a perspective view for explaining a basic configuration of an organic EL panel as an image display device, and FIG. 2 explains a characteristic structure of the organic EL panel according to Embodiment 1 of FIG. For this reason, it is the perspective view which expanded the principal part, and has shown the structure of the wiring extraction part of a display. 3 is an enlarged view of a cross section taken along the line aa in FIGS. 1 and 2, and FIG. 4 is an enlarged view of a cross section taken along the line bb in FIGS. 1 and 2.
A large number of organic EL panels as shown in FIG. 1 are arranged in a matrix to form a large tiling display. As will be described later, the front substrate is the lower side in FIG.

  In general, an organic EL panel (image display device) includes a front substrate 1 made of a glass plate, a back substrate 2 facing the front substrate 1 also made of a glass plate, and a matrix between the front substrate 1 and the back substrate 2. A plurality of image elements (not shown) which are arranged in a shape and selected to be in a display or non-display state, a plurality of panel wirings 9 for transmitting electrical signals for controlling the image elements, and a plurality of panel wirings 9 It has a plurality of electrode terminal portions 7 connected to each other and a light emitting layer (not shown) composed of a plurality of layers. The front substrate 1 and the back substrate 2 are bonded to each other with the image element, the electrode terminal portions 7 and the like sandwiched therebetween. ing.

  On the opposite surface side of the back substrate 2 to the front substrate 1, a counterbore process is performed for disposing a hygroscopic material (not shown) and the like, and a counterbore part (not shown. Formed by counterbore. Another recess is formed. And is attached to the front substrate 1 by the sealant 8 around the panel that has not been counterbored. On the electrode terminal portion 7, a pit 6, which is an opening penetrating the back substrate 2, is provided. The metal film is filled in the pit 6 and connected to the electrode terminal portion 7 and extends to the back side of the back substrate 2. A wiring 5 is formed.

The back substrate 2 is formed with a substantially V-shaped groove 3 between a plurality of adjacent image element rows (not shown) by cutting (dicing) using a dicing blade as shown in FIG. Is divided into a plurality of regions.
Metal film wiring is provided on the back surface of the back substrate 2 (the back flat surface 2a of the back substrate 2, the back inclined surface 2b of the back substrate 2, and the surface portion including the flat portion of the groove 3. The surface portion not facing the front substrate 1). 5 is formed, one end serves as a connection portion of the electrode terminal portion 7 disposed on the opposite surface side of the front substrate 1, and the other end is connected to the connector 4.
In addition, the surface where the front substrate 1 and the back substrate 2 face each other is the facing surface, the back surface of the facing surface of the front substrate 1 is the front surface of the back substrate 2, and the back surface of the facing surface of the back substrate 2 (non-facing surface). Are referred to as the back.

A pit (opening) 6 penetrating the back substrate 2 is formed in the flat portion at the bottom of the groove 3 of the back substrate 2, and the electrode terminal portion 7 is located on the opposing surface of the front substrate 1 that is the bottom of the pit 6. Then, the metal film wiring 5 is filled in the pits 6 to form connection portions.
In FIG. 2, the groove portion 3 is enlarged and displayed for easy understanding, but in actuality, the groove portion 3 is processed with a minute width. Further, as described above, the cross-sectional shape of the groove portion 3 is an approximate shape in which the upper portion is wider than the bottom portion by being dug down so that the opening size becomes smaller from the back side of the back substrate 2 toward the surface facing the front substrate 1. It is formed in a V shape, and a flat portion having a groove opening width indicated by reference numeral 3a is formed at the bottom.

  As shown in FIG. 3 (cross section perpendicular to the direction in which the groove 3 extends) and FIG. 4 (cross section in the direction in which the groove 3 extends), panel wiring is provided on the opposing surface side of the front substrate 1 located in the groove 3. 9 is formed, and an electrode terminal portion 7 connected thereto is provided. The electrode terminal portion 7 is formed simultaneously with the same material as the panel wiring 9 connected to the image element, for example, and the groove portion 3 is formed on the back substrate 2 at a position corresponding to the electrode terminal portion 7, and the electrode terminal portion 7 is also formed. A pit 6 is formed as an opening that exposes. Further, the back flat portion 2 a of the back substrate 2 and the back inclined portion 2 b of the back substrate 2 that is the inclined surface constituting the groove portion 3 are filled with pits 6 and electrically connected to the electrode terminal portions 7. A wiring 5 is formed. A connector 4 is connected to the end of the metal film wiring 5 on the back flat portion 2 a of the back substrate 2, and the metal film wiring 5 is connected to an external drive circuit via the connector 4.

In addition, although the pit 6 is provided in the bottom plane part of the groove part 3, as shown in FIG. 2, is the groove part opening width 3a the same as the opening dimension (dimension in the direction along the aa line) of the pit 6? Or wider than that.
The method for forming the pits 6 is not particularly defined, but for example, before bonding to the front substrate 1, the positions corresponding to the electrode terminal portions 7 on the opposite surface of the back substrate 2 are pre-curved, and after bonding, There is a method of forming by dicing from the back side to the counterbore depth.

  Here, the problem is the protrusion of the sealant 8 used for bonding the front substrate 1 and the back substrate 2 to the pit 6 opening region. As shown in FIG. 4, the pit 6 serving as the opening is filled with the metal film wiring 5 and is connected to the electrode terminal portion 7 formed on the front substrate 1. Not all of the formation range becomes the connection surface portion, but the sealant 8 enters from the periphery of the pit 6 to a predetermined range to form the fillet formation portion 6b, and the electrode terminal portion 7 and the metal film wiring 5 The substantial connection is performed at the connection surface portion 6a (corresponding to the central portion of the pit 6) obtained by subtracting the fillet forming portion 6b from the formation area of the pit 6. Therefore, it is necessary to suppress the fillet forming portion 6b to be small.

2 shows a state in which the metal film wiring 5 is directly connected to the connector 4. However, the wiring connection method is not particularly limited, and a flexible printed circuit board is provided between the metal film wiring 5 and the connector 4. A wiring material such as can also be used.
Further, as shown in FIG. 2, the metal film wiring 5 on the back inclined portion 2 b of the back substrate 2 contacts the electrode terminal portion 7 on the front substrate 1 side in a state where the back substrate 2 is bonded to the front substrate 1. Thus, the electrode terminal portion 7 and the connection portion of the metal film wiring 5 are formed in alignment.

  Here, the method for forming the metal film wiring 5 is not particularly limited. For example, the metal film wiring 5 is formed by applying a conductive paste (for example, silver paste) with a dispenser and then baking it. In particular, in order to apply the electrode terminal portion 7 and the back surface inclined portion 2 b of the back substrate 2, a processing tool such as a needle or a head is moved close to the back surface including the inclined surface of the back substrate 2. To do. Therefore, in the first embodiment, the divided portion of the back substrate 2 is dug down so that the opening size decreases from the back side of the back substrate 2 to the side facing the front substrate 1, and the upper part is the bottom. Since the groove section 3 having a V-shaped wider section is formed, it is possible to move a tool necessary for a dispenser or the like close to the inclined surface of the back inclined section 2b of the back substrate 2, The metal film wiring 5 can be formed easily and accurately.

  The above is a description of the basic configuration and effects of the organic EL panel according to the present invention. In the present invention, in order to suppress the fillet forming portion 6b shown in FIG. An image display device with a simple structure is proposed. A specific example of the organic EL panel according to the first embodiment will be described below with reference to FIGS. 5 (a) and 5 (b) are views showing an organic EL panel which is the image display device according to the first embodiment of the present invention, and are enlarged cross-sectional views taken along the line aa in FIGS. 6 is an enlarged cross-sectional view taken along line bb in FIGS. 1 and 2, FIG. 7 is an enlarged cross-sectional view taken along line cc in FIG. 2, and FIG. 2 is a plan view of a mask pattern used when counterboring 2 is performed. As shown in FIG. 5, the pit 6 is formed with a small fillet so that the connection surface between the electrode terminal portion 6 and the metal film wiring 5 is larger than in the case of FIG. 3. FIG. 5A shows a case where the opposing surface of the back substrate 2 which is a sealing region located around the pit 6 (near the opening) has a flat shape. ), There may be a case where a recess 10 is provided on the opposing surface of the back substrate 2 around the pit 6. In addition, about the effect of the hollow 10, it shows next.

  In the organic EL panel shown in the first embodiment, as shown in FIGS. 5B, 6, and 7, the portion of the back substrate 2 (the front substrate of the back substrate 2) in contact with the sealant 8 around the pit 6. 1) and the structure of the sealing portion of that portion, and the portion of the back substrate 2 (the back substrate 2 of the back substrate 2) in contact with the sealant 8 around the pit 6 (near the opening). , A surface facing the front substrate 1) is provided with a recess (corresponding to a recess) 10, and the recess 10 is substantially filled with the sealing agent 8 (when the recess 10 is filled with the sealing agent 8). There may be bubbles in. Since the amount of the sealant 8 protruding into the pit 6 can be suppressed by storing the sealant 8 in the recess 10, the fillet forming portion 6 bb has the recess 10 formed as shown in FIG. 6. It can be kept small compared to that of FIG. 4 (fillet forming portion 6b). Therefore, a large connection area between the metal film wiring 5 and the electrode terminal portion 7 can be secured.

  In the example in which the depression 10 is not formed as shown in FIG. 3 and FIG. 4 described above, the shape of the surface of the back substrate 2 that is in contact with the sealant 8 facing the front substrate 1 in the sealing portion around the pit 6. However, it was a substantially planar shape parallel to the opposing surface of the front substrate 1. On the other hand, in the first embodiment, the shape of the sealing portion around the pit 6, that is, the shape of the surface of the back substrate 2 in contact with the sealant 8 that faces the front substrate 1 is the back surface of the back substrate 2. A recess (concave portion) 10 having a depth is provided on the (non-opposing surface) side. The recess 10 is substantially filled with the sealant 8 when the substrates are bonded together, and the protrusion of the sealant 8 to the pit 6 side is suppressed.

Next, in order to obtain the structure of the sealing portion around the characteristic pit 6 in the first embodiment as described above, the manufacturing method of the back substrate 2 is devised, and compared with the conventional example. A method for manufacturing without an additional step will be described.
The organic EL panel includes a front substrate 1 on which an organic EL layer is formed, and a back substrate 2 that is bonded to the front substrate 1 so as to face it. The front substrate 1 and the back substrate 2 are opposed to each other with a predetermined interval, and a plurality of image elements and a plurality of electrode terminal portions 7 for controlling them are arranged therebetween, and a light emitting layer is further formed. The periphery is sealed with a sealant 8.
At this time, the back substrate 2 is subjected to a counterbore process for disposing a hygroscopic material or forming pits 6 at a stage before being bonded to the substrate. Is to form.

  Conventionally, the front substrate 1 and the back substrate 2 are bonded to the front substrate 1 with the sealant 8 around the panel where the counterbore processing is not performed by masking. In the same process as the processing, in addition to the conventional example, the counterbore processing is partially performed also on the sealing portion around the pit 6, so that the opposite surface of the back substrate 2 in contact with the sealant 8 (with the front substrate 1). A recess 10 having a depth toward the back surface of the back substrate 2 is provided on the opposite surface), and the sealant 8 is filled in the recess 10.

  FIG. 8 is a plan view of an example of a masking pattern for counterbore processing of the back substrate 2 in the enlarged portion shown in FIG. As shown in FIG. 8, in the masking pattern 11, a plurality of pit portion masking removal patterns 13 are arranged in accordance with the number of electrode terminal portions 7 at a predetermined interval, and a pit recess portion masking is performed in an area between them. A blanking pattern 12 is formed. Further, a blanking pattern is also formed in a portion that becomes a pixel formation region.

The area where the masking pattern 11 exists indicates an area that is not subjected to counterbore processing, and the inter-pit recess masking extraction pattern 12 and the pit portion masking extraction pattern 13, and the region that is the pixel pattern extraction pattern is counterbore processing. It is an area to be done.
As shown in FIG. 8, in order to form the depression 10 in addition to the counterbore processing area for disposing the desiccant in the pixel forming portion and the masking pattern 11 for masking the non-bottled area for forming the pit. Between the pits 6, the recesses between the pits to be counterbored are formed, and the masking removal pattern 12 is formed and isotropically cut by an etching method using a hydrofluoric acid mixed solution, whereby the back substrate 2 has a depth on the back side. A recess 10 is formed.

  Here, the counterbore processing is usually performed by an etching method using an etchant containing hydrofluoric acid, a sandblasting method, a method combining these, or the like, as long as a desired concave shape is obtained, and the method is particularly limited. Although not intended, the depression 10 can be formed with higher accuracy by using an etching method. Further, a halftone mask or the like can be used as the masking pattern 11, but the masking pattern 11 is not particularly limited to this, and any masking pattern that can obtain a desired depressed shape may be used. It is preferable to optimize by the formation region and the amount of the sealing agent 8 on the opposing surface of the back substrate 2 before the front substrate 1 and the back substrate 2 to be bonded are bonded.

  In addition, in order to open the recess 10 deeper than the opening to be the pit 6 at the time of counterboring, in addition to changing the etching amount using the above-described halftone mask, etching is performed in two steps. A method of making a difference in etching depth by performing only one step on the depression 10 side and two steps on the pit 6 side may be used.

  The depth of the recess 10 is preferably at least half the thickness of the back substrate 2 (thickness from the opposing surface to the bottom of the groove) after forming the groove 3 by subsequent dicing. There is no particular limitation. Further, the shape of the recess 10 is not particularly limited, and FIG. 6 and FIG. 7 show an example of a substantially trapezoidal shape. However, the shape gradually becomes deeper as the distance from the pit 6 increases, or becomes substantially stepped as the distance from the pit 6 increases. A deepened shape or a substantially arc shape may be used, and the recesses 10 having various shapes can be formed by appropriately combining the masking pattern 11 and the processing conditions during counterboring.

A sealant 8 is formed by a printing method or a dispensing method in a region to be a sealing portion of the back substrate 2 manufactured in this way, and is aligned and bonded to the front substrate 1. Since the pit 6 is not a sealing portion, the sealing agent 8 is not applied. Further, the application region of the sealant 8 may include a part or all of the recess 10 around the pit 6. The formed depression 10 is filled with the sealant 8 for the purpose of improving the strength of the panel, but is partially filled with bubbles (substantially filled with the filler) due to manufacturing variations. There is also.
Thereafter, by the same process as in the conventional example, the groove part 3 is formed by cutting from the back surface (non-facing surface) side of the back substrate 2 by dicing, and the opening serving as the pit 6 penetrates the bottom surface of the groove part 3. By forming the metal film wiring 5 and connecting the wiring to the electrode terminal portion 7 through the pits 6, an image display device as shown in FIGS. 1, 2, and 5 to 7 can be obtained.

  In the image display device having the above-described structure, the fillet forming portion 6bb in the pit 6 of the wiring extraction portion is smaller than the conventional fillet forming portion 6b, and the region where the electrode terminal portion 7 is exposed in the pit 6 is increased. Since it can be maintained, a sufficient connection area between the metal film wiring 5 and the electrode terminal portion 7 from which the wiring is taken out can be ensured, and the electrical connection state can be maintained well. This is because the sealing material 8 is likely to spread toward the center of the recess 10 when the front substrate 1 and the back substrate 2 are bonded together. Furthermore, since the area of the fillet forming portion 6bb can be suppressed to a certain amount, the influence of manufacturing variation is small, the overhang inspection of the fillet can be omitted, and the manufacturing cost can be reduced.

  As described above, the organic EL panel (image display device) according to the first embodiment includes the front substrate 1, the back substrate 2 facing the front substrate 1, and the front substrate 1 and the back substrate 2. A plurality of image elements sealed at 8, an electrode terminal portion 7 connected to the image element via wiring (panel wiring 9) and disposed on the opposing surface of the front substrate 1, and a back substrate 2 on the electrode terminal portion 7 A metal film wiring 5 filled in an opening (pit 6) penetrating through the substrate and connected to the electrode terminal portion 7 and extending to the back side of the back substrate 2, and the back substrate 2 is provided on the side facing the front substrate 1. A recess (depression 10) is provided in the vicinity of the pit 6, and the recess 10 is filled with a sealant 8. Such an image display device has a configuration in which the recess 10 is filled with the sealant 8, and can prevent the sealant 8 from protruding into the pits 6, can secure a sufficient wiring connection area, and the sealant protrudes. This inspection step can be omitted.

  Further, since the recess 10 (concave portion) is formed between two pits 6 (opening portions) opened at a predetermined interval, on the substrate bonding surface of the back substrate 2, in the vicinity of the pits 6, The depression 10 can be arranged in a region where a plurality of pits are continuously arranged at a predetermined pitch. In particular, when the interval between the pits 6 is narrow, the protrusion of the sealant 8 to the pits 6 can be effectively suppressed. Become.

  In the manufacturing method for manufacturing the image display device according to the first embodiment of the present invention, the pits 6 (openings) and the recesses 10 (recesses) are formed on the back substrate 2 from the side facing the front substrate 1. A step of counterboring, a step of bonding the back substrate 2 to the opposite surface of the front substrate 1 on which the electrode terminal portions 7 are formed using the sealant 8, and filling the recess 10 with the sealant 8, Etching from the non-facing surface (back surface) side of the substrate 2 to penetrate the pit 6 and expose the electrode terminal portion 7 from the pit 6, filling the pit 6 with conductive paste, curing the conductive paste, and curing the metal film The process of obtaining the wiring 5 is included. The pits 6 and the recesses 10 can be formed by performing etching simultaneously in the process of forming another recess for arranging the moisture absorbent as a moisture-proof measure peculiar to the organic EL panel, thereby suppressing an increase in cost. Is possible.

  Further, in the step of counterboring, the pit 6 is adjusted so as to be etched deeper than the recess 10, and is then cut from the back side that is the non-facing surface side of the back substrate 2 by subsequent dicing. When the groove portion 3 is obtained, only the pit 6 is used as a through hole, and the recess 10 can be processed so as not to be cut.

  In this way, the two substrates are bonded together by the sealing agent 8 formed in the peripheral part of the substrate and the peripheral part of the electrode terminal part 7, and the opposite surface of the back substrate 2 in contact with the sealing agent 8 around the pit 6. Is provided with a recess 10 having a depth toward the back side of the back substrate 2, and the recess 10 is configured to be substantially filled with a sealant 8, thereby performing wiring extraction. 5 and the electrode terminal portion 7 can be reduced in electrical connection failure, and an organic EL panel having high reliability can be provided. Moreover, the breaking strength of the organic EL panel, which is reduced by narrowing the frame, can be improved. Since a panel structure that can control the formation region of the sealing agent 8 in the sealing portion with high accuracy can be realized, an organic EL panel having high reliability can be provided. In addition, since the fillet area can be suppressed to a certain amount, the fillet protrusion inspection can be omitted, and the effect of reducing the manufacturing cost can be obtained.

  In the above example, the case where the back substrate 2 is divided into two by a line passing through the central portion of the front substrate 1 is shown, but the number of divisions and the division position are not limited to this. For example, the back substrate 2 may be divided into three or more parts, and may be at other positions as long as the dividing position is between image elements. For example, as shown in FIG. 9, the back substrate 2 is divided into four by a cross-shaped groove 3, and the structure can be applied to a center extraction type structure in which electrodes are extracted from the center of the organic EL panel. Further, the present invention can be applied to the case of taking out the electrode terminal portion 7 from the outer peripheral edge of the front substrate 1 or the structure of the edge taking-out method in which the electrode is taken out from both horizontal and vertical ends of the organic EL panel as shown in FIG. can do. The same applies to the organic EL panel of the second embodiment described later.

Embodiment 2. FIG.
In the above-described first embodiment, when the back surface of the back substrate 2 facing the front substrate 1 is subjected to counterboring, at the same time, the recess 10 is formed in the vicinity of the pit 6 to thereby seal the pit 6. The technique for suppressing the protrusion of No. 8 has been described.
In the second embodiment, the conditions when the front substrate 1 and the back substrate 2 are bonded using the sealant 8 will be described in more detail.
As described above, on the surface of the back substrate 2 facing the front substrate 1, an opening that becomes a pit 6 and a recess (concave portion) 10 are formed by counterboring. Here, in order to facilitate the inflow of the sealant 8 into the recess 10, the volume of the recess 10 is made larger than that of the pit 6, and the sealant 8 enters the recess 10 rather than the pit 6 due to the difference in internal pressure. It is effective for suppressing the formation of fillets to be configured to easily flow in.

  When the volume of the depression 10 is made larger than that of the pit 6, the outline of the depression 10 has a curved shape so that the size of the opening that becomes the pit 6 can be seen in the counterbore processing and the sectional shape of the depression 10 can be seen. The exact volume is difficult to grasp. Therefore, in the second embodiment, the areas of the depression 10 and the pit 6 on the substrate facing surface are compared, and the depression 10 has a larger area than the pit 6 so that the depression 10 is sealed. It is proposed to obtain a state where the flow of the stopper 8 is easy.

  Strictly speaking, as described above, there is a difference in the depth at the end of the counterbore processing of the opening to be the depression 10 and the pit 6 and the difference in the opening (dent) shape. Although it is impossible to compare the volume of the recess 10 and the opening to be the pit 6, if the recess 10 is wider than the pit 6 by comparing their plane areas, the volume of the recess 10 is Either the state where it is larger than the volume of the opening which becomes the pit 6, the state where both volumes are balanced, or the state where the opening which becomes the pit 6 has a slightly larger volume than the depression 10. This can be eliminated when the volume of the depression 10 becomes extremely small such that the effect of suppressing the fillet formation cannot be obtained.

  Another pattern will be described. In this case, the opening to be the pit 6 and the recess 10 are etched to the same depth by counterboring, and the recess 10 side is formed wider than the pit 6 side. If the openings have the same depth, the volume can be easily compared from the plane area. For example, after the back surface substrate 2 is counterbored, the front substrate 1 and the back surface substrate 2 are bonded together by the sealant 8, and then the groove portion 3 is formed by dicing from the back surface side of the back surface substrate 2 to form the pit 6. The part penetrates. At this time, in the case where the sealant 8 is filled into the recess 10 in the previous substrate bonding step, the pit 6 and the recess 10 can be formed to the same depth during the counterboring process. . Here, by performing dicing to obtain the groove portion 3, the pit 6 penetrates, and at the same time, the bottom portion of the recess 10 is also removed by etching, and the sealant 8 cured after filling is exposed. As described above, since the sealant 8 is not applied to the region that becomes the pit 6 when the substrates are bonded together, there is no influence on the formation of the opening that becomes the pit 6, and the seal that has hardened from the recess 10 is formed. Even if the stopper 8 is exposed, there is no problem in wiring connection performance.

Thus, when the pits 6 and the depressions 10 are etched in the back substrate 2 to the same depth by the counterboring process and bonded to the front substrate 1 using the sealant 8, the pits 6 and the depressions 10 at that time Since the depth is the same, the volume can be known by simply comparing the opening areas. Therefore, by forming the recess 10 larger than the pit 6 at the time of counterboring, it is possible to prevent the sealant 8 from protruding into the pit 6 due to the internal pressure difference when the substrates are bonded together. It becomes.
However, when the sealing agent 8 is not sufficiently filled in the recess 10 and is cured in a state where large bubbles are contained, if bubbles appear when the sealing agent 8 is exposed in the subsequent dicing process. In this case, an extreme dent is generated on the processed surface, and it is considered that foreign matter enters during the next conductive paste patterning. At this time, if the sealant 8 is reliably filled into the recess 10, the recess does not occur, and inconvenience is less likely to occur in the subsequent manufacturing process.

In the image display device according to the second embodiment of the present invention, in addition to the effects of the first embodiment described above, the recess 10 (concave portion) has the pit 6 (opening portion) on the surface of the back substrate 2 facing the front substrate 1. Since it is formed so as to have a larger area, the amount of the sealing agent 8 that can be filled in the recess 10 can be made a sufficient amount, and a sufficient effect of protruding the sealing agent 8 into the pit 6 can be obtained. Is possible.
It should be noted that the present invention can be freely combined with each other within the scope of the invention, and each embodiment can be appropriately modified or omitted.

1 Front substrate
2 Back substrate 2a Back flat part 2b Back inclined part 3 Groove part 3a Groove part opening width 4 Connector 5 Metal film wiring 6 Pit (opening part)
6a Connection surface part 6b, 6bb Fillet forming part 7 Electrode terminal part 8 Sealant 9 Panel wiring 10 Recess (recessed part)
11 Masking pattern 12 Pit recess masking pattern 13 Pit masking pattern

Claims (6)

  A front substrate, a back substrate facing the front substrate, a plurality of image elements sandwiched between the front substrate and the back substrate and sealed with a sealant, and connected to the image elements via wiring, the front substrate An electrode terminal portion disposed on the opposite surface of the substrate, a metal film wiring that fills an opening that penetrates the back substrate on the electrode terminal portion, is connected to the electrode terminal portion, and extends to the back side of the back substrate. The back substrate has a recess in the vicinity of the opening on the side facing the front substrate, and the recess is substantially filled with the sealing agent. Display device.   The image display device according to claim 1, wherein the concave portion is formed to have a larger area than the opening on a surface of the back substrate facing the front substrate.   3. The image display device according to claim 1, wherein the recess is formed between the two openings that are opened at a predetermined interval.   It is a manufacturing method which manufactures the image display apparatus of Claim 1, Comprising: The process which performs the counterbore process for an opening part and a recessed part formation from the opposing surface side with respect to a front substrate with respect to a back substrate, The electrode terminal part of the said front substrate Bonding the back substrate using a sealant to the opposing surface on which is formed, filling the concave portion with the sealant substantially, etching from the non-opposing surface side of the back substrate, and opening the opening A method of exposing the electrode terminal portion from the opening, filling the opening with the conductive paste, and curing the conductive paste to obtain a metal film wiring.   The method for manufacturing an image display device according to claim 4, wherein, in the step of performing the counterbore processing, the opening is etched deeper than the recess. 5. The method for manufacturing an image display device according to claim 4, wherein, in the step of performing the counterboring process, another recess for arranging a hygroscopic agent is formed on the back substrate at the same time.