JP2014034184A - Embossment carrier tape molding die and molding method of embossment carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an embossment carrier tape molding die in which when molding an embossment carrier tape, stress heterogeneity generating in the tape can be dissolved.SOLUTION: An embossment carrier tape molding die includes: a first mold 21 having strippers 21A and two or more draw punches 21B that are supported by the strippers 21A and disposed in parallel in a feed direction with a prescribed pitch, and form recesses 12 in a resin substrate 11; and a second mold 22 that includes dies 22A having first holes 22B in which the draw punches 21B can be inserted. The stripper 21A includes extension parts 21U and 21L extending from a proximity draw punch by at least a prescribed pitch length at respective ends of upstream and downstream sides, the die 22A includes extension parts 22U and 22L extending from a proximity first hole 22B by at least a prescribed pitch length at respective ends of upstream and downstream sides, and a second hole 22C is formed at the extension part 22L to be alienated from the proximity first hole 22B by a prescribed pitch.

Description

  The present invention relates to a mold for forming an embossed carrier tape and a method for forming an embossed carrier tape.

  The embossed carrier tape is used to store a large number of fine and complicated electronic parts, precision parts, and the like for storage or transportation, or for smooth mounting and removal by a mounting machine.

  The embossed carrier tape 10 is configured, for example, as shown in FIG. In FIG.4 (b), the embossed carrier tape 10 consists of the strip | belt-shaped resin base material 11, and the several recessed part 12 is arranged in parallel along the longitudinal direction. The recessed portion 12 is configured as a portion that can store electronic components and precision components. The embossed carrier tape 10 is formed with a plurality of sprocket holes 13 arranged in parallel along the longitudinal direction at a portion close to one longitudinal side.

  And in such an embossed carrier tape 10, when forming the recessed part 12 or the sprocket hole 13 by press molding in the strip-shaped resin base material 11, the resin base material 11 is repeatedly fed by a fixed amount, Each shot is press-molded. FIG. 4 (b) shows each area defined by a dotted line in the drawing along the longitudinal direction of the resin base material 11, and each of these areas corresponds to one shot of press molding and performs press molding. Almost corresponds to the size of the mold.

  Here, the mold (embossed carrier tape molding mold) 20 is configured as shown in FIG. In FIG. 4A, in addition to the mold 20, an embossed carrier tape 10 that is an intermediate process formed by the mold 20 is also drawn. In FIG. 4A, the mold 20 is constituted by a first mold 21 and a second mold 22 which are arranged to face each other with the resin base material 11 therebetween, and the first mold 21 and the second mold 20 are arranged. 22 operates to press the resin base material 11 during press molding. The first mold 21 includes a stripper 21A and a plurality of strips 21A that are supported by the stripper 21A and arranged in parallel in the feed direction (A direction in the figure) of the resin base material 11 to form the recess 12 in the resin base material 11. And a draw punch 21B. A plurality of draw punches 21B are arranged in parallel at a predetermined pitch p, for example. The second mold 22 is configured by a die 22A having a plurality of holes 22B into which the draw punch 21B of the first mold 21 can be inserted.

  Such an embossed carrier tape 10 and a mold 20 for forming the same are disclosed in, for example, Patent Document 1 below.

JP 2006-272952 A

  However, the embossed carrier tape 10 formed as described above has a disadvantage that it is deformed due to uneven stress applied to the resin base material 11 during press molding of the resin base material 11.

  That is, in FIG. 4A, the stress applied to the resin base material 11 during molding of the resin base material 11 is indicated by an arrow, and the embossed carrier tape 10 is deformed by this stress.

  Thus, when a deformation | transformation arises in the embossed carrier tape 10, the storage rate or mounting rate of a product will fall.

  The present invention has been made based on such circumstances, and an object thereof is a mold for forming an embossed carrier tape by molding, and non-uniform stress generated in the embossed carrier tape during the molding. An object of the present invention is to provide a mold for forming an embossed carrier tape that can eliminate the above-mentioned problem.

  Another object of the present invention is to provide a method for forming an embossed carrier tape in which the stress generated in the embossed carrier tape during the forming is made uniform.

  In order to achieve such an object, as shown in FIG. 4 (b), the embossed carrier tape-molding mold of the present invention has portions where stress is applied to the embossed carrier tape at the front and rear portions (resin base In view of the fact that these are portions corresponding to the front and rear portions in the feed direction of the material 11, an extension portion extending to a predetermined length in the feed direction is formed on each of the front and rear portions of the mold 20. The stress applied to the resin base material is made uniform by the existing portion, and deformation of the embossed carrier tape is avoided.

The present invention is grasped by the following composition.
(1) An embossed carrier tape molding die according to the present invention includes a plurality of concave portions arranged in parallel in the feed direction by press molding in each shot for each shot of a resin base material that is repeatedly fed by a certain amount. A mold to be formed, comprising: a stripper; and a plurality of draw punches supported by the stripper and arranged in parallel at a predetermined pitch in the feed direction to form the recessed portion of the resin base material. A second mold constituted by a die and a die having a first hole that is arranged in parallel in the feed direction of the resin base and into which the draw punch of the first mold can be inserted; The stripper has an extending portion extending at a length equal to or greater than the predetermined pitch from an adjacent draw punch at each of the upstream and downstream ends of the feed direction. Has an extending portion extending at a length equal to or greater than the predetermined pitch from the adjacent first hole at each of the upstream and downstream ends of the feed direction, and the downstream of the feed direction. A second hole is formed in the extending portion so as to be separated from the first hole adjacent to the extending portion by the predetermined pitch.

(2) The embossed carrier tape molding die of the present invention is characterized in that, in the configuration of (1), the extending portion exists on the downstream side of the second hole.
(3) The embossed carrier tape molding die according to the present invention is the die having the predetermined pitch from the first hole adjacent to the extension portion on the upstream side in the feed direction in the configuration of (1). A third hole is formed by being spaced apart at a distance, and the extending portion is present on the upstream side of the third hole.
(4) The embossed carrier tape molding die of the present invention is characterized in that, in the configuration of (1), the second hole has the same diameter and the same size as the first hole.
(5) The embossed carrier tape molding die of the present invention is characterized in that, in the configuration of (1), a rib formed of a protrusion is provided on the periphery of the first hole formed in the die.

(6) The embossed carrier tape is molded by repeatedly feeding a resin base material between a first mold and a second mold facing each other by a certain amount, and the first in each shot for each feed. An embossed carrier tape molding method for forming a plurality of recessed portions arranged in parallel at a predetermined pitch along a length direction by press molding with a mold and a second mold, wherein the first mold Comprises a plurality of draw punches arranged side by side in the feed direction at the predetermined pitch and forming the recessed portions of the resin base material, and the respective upstream and downstream ends of the feed direction are adjacent draw punches. The second mold has substantially the same length as the first mold in the feed direction, and the draw punch of the first mold is Insertable first hole Both are configured to have a second hole spaced at a predetermined pitch from the first hole adjacent to the downstream side in the feed direction, and the first mold and the first after the resin base material is fed A step of forming a plurality of recesses in the resin base material by press molding of two molds, and a step of forming the recesses formed on the most upstream side of the resin base material by the next feed of the resin base material. Forming in the second hole of the mold, and forming a plurality of recesses continuous with the plurality of recesses formed in the step by press molding of the first mold and the second mold. It is characterized by providing.

  According to the embossed carrier tape molding die of the present invention configured as described above, it is possible to eliminate the uneven stress generated in the embossed carrier tape during molding.

  In addition, according to the method for molding an embossed carrier tape of the present invention, it is possible to make uniform the stress generated in the embossed carrier tape during molding.

It is sectional drawing which shows Embodiment 1 of the metal mold | die for embossing carrier tape formation of this invention, and a top view of the embossing carrier tape obtained by this metal mold | die. It is sectional drawing which shows Embodiment 2 of the metal mold | die for embossing carrier tape formation of this invention. It is sectional drawing and the enlarged view which show Embodiment 3 of the metal mold | die for embossing carrier tape formation of this invention. (A), (b) is the figure which showed the metal mold | die which forms the conventional embossed carrier tape and this embossed carrier tape by shaping | molding.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as embodiments) will be described in detail with reference to the accompanying drawings. Note that the same number is assigned to the same element throughout the description of the embodiment.
(Embodiment 1)
Fig.1 (a) is sectional drawing which shows Embodiment 1 of the metal mold | die for embossing carrier tape formation of this invention. In FIG. 1A, in addition to the embossed carrier tape forming mold (hereinafter referred to as a mold), an embossed carrier tape in an intermediate process formed by the mold is also drawn.

  In FIG. 1A, an embossed carrier tape 10 is composed of a strip-shaped resin base material 11, and a certain amount of feed is repeatedly performed in the direction A in the figure. The resin base material 11 is formed with depressions 12 arranged in parallel at a predetermined pitch p in the longitudinal direction of the resin base material 11 by press molding in each shot for each feed.

  The resin base 11 is press-molded by a mold 20, and the mold 20 includes a first mold 21 and a second mold that are arranged to face each other with the resin base 11 interposed therebetween. 22.

  The first mold 21 has a stripper 21A, and a plurality of (for example, four in the figure) draw punches 21B arranged in parallel at a predetermined pitch p in the A direction in the figure are supported on the stripper 21A. The stripper 21 </ b> A presses the resin base material 11 together with a die 22 </ b> A of the second mold 22 to be described later, and the draw punch 21 </ b> B can form the recessed portion 12 in the resin base material 11.

  The stripper 21A includes extending portions 21U and 21L extending at a length equal to or greater than a predetermined pitch p from the adjacent draw punch 21B at the upstream and downstream ends of the resin base material 11 in the feed direction. It is configured. In other words, the upstream end of the stripper 21A in the feed direction extends from the adjacent draw punch 21B (indicated by 21B (U) in the figure) to the upstream side by a distance s (> p). The downstream end of the stripper 21A has a length s (> p) from the adjacent draw punch 21B (indicated by 21B (L) in the figure) to the downstream side. The extending portion 21L is configured to be extended.

  The second mold 22 is constituted by a die 22A in which a plurality of holes 22B (sometimes referred to as first holes in this specification) into which the draw punch 21B of the first mold 21 can be inserted are formed. The die 22A can press the resin base material 11 together with the stripper 21A.

  The die 22A has extending portions 22U and 22L extending at a length equal to or greater than a predetermined pitch p from the adjacent holes 22B at the upstream and downstream ends of the resin base material 11 in the feed direction. Configured. That is, the upstream end of the die 22A in the feed direction extends from the adjacent hole 22B (indicated by 22B (U) in the figure) to the upstream side by a distance s (> p). It has an existing portion 22U, and extends downstream from the adjacent hole 22B (indicated by 22B (L) in the figure) at a distance s (> p) at the downstream end of the die 22A. It has an extending portion 22L.

  Further, in the die, holes 22C (denoted at the predetermined pitch p from holes 22B (indicated by reference numeral 22B (L) in the figure)) adjacent to the surface of the extension 22L on the downstream side facing the stripper 21. In this specification, it may be referred to as a second hole). This hole 22C is formed in order to prevent smooth press molding from being hindered on the resin base material 11 by providing the extending portion 22L on the downstream side of the die 22A. That is, the hole 22C is formed in the same size and shape as the hole 22B, for example, and a plurality of (four in the figure) recessed portions 12 are formed in the resin base 11 by press molding of the mold 20 after the resin base 11 is fed. After the resin base material 11 is formed, the concave portion 12 (indicated by 12 (U) in the figure) formed on the most upstream side of the resin base material 11 by the next feed of the resin base material 11 is the hole of the second mold 22. It is positioned within 22C. Thereby, the stripper 21A of the first mold 21 and the die 22A of the second mold 22 sufficiently press the other region of the resin base material 11 excluding the recessed portion 12 without being obstructed by the recessed portion 12. Will be able to.

FIG.1 (b) is a top view of the embossed carrier tape 10 formed using the metal mold | die 20 mentioned above. As shown in the figure, the embossed carrier tape 10 is formed by arranging a plurality of recessed portions 12 in parallel in the longitudinal direction at intervals of a predetermined pitch p. In this case, conventionally, as shown in FIG. 4B, the vicinity of the boundary portion (shown by a dotted line in the figure) corresponding to one shot of press molding and corresponding to the size of the mold for press molding. The stress (indicated by arrows in the figure) generated in the first mold 21 is distributed by the extension parts 21U and 21L formed on the stripper 21A of the first mold 21 and the extension parts 22U and 22L formed on the die 22A of the second mold 22. And become relaxed. For this reason, the embossed carrier tape 10 which reduced the deformation | transformation of the resin base material 11 comes to be obtained.
(Embodiment 2)
FIG. 2 is a cross-sectional view showing a second embodiment of the embossed carrier tape forming mold of the present invention, and is drawn in correspondence with FIG.

  In FIG. 2, the structure different from the case of FIG. 1A is that, first, in the stripper 21A of the first mold 21, a draw punch 21B (see FIG. 2) adjacent to the surface of the upstream extending portion 21U facing the die. A draw punch 21B (indicated by 21B (L) in the figure) adjacent to the surface facing the die 22A of the holes 22D and the downstream extending portion 21L, which are spaced at a predetermined pitch p from the center 21B (U). ) Are formed at a predetermined pitch p. The hole 22E formed in the extending portion 21L of the stripper 21A is formed at a position opposite to the hole 22C formed in the die 22A of the second mold 22. In this case, the extending portion 21U exists on the upstream side of the hole 22D, and the extending portion 21L exists on the downstream side of the hole 22E.

  Then, in the die 22A of the second mold 22, the surface of the upstream extending portion 22U facing the stripper 21A is spaced from the adjacent holes 22B (indicated by 22B (U) in the figure) at a predetermined pitch p. A hole 22F (may be referred to as a third hole in this specification) is formed. In this case, the extending portion 22U exists upstream of the hole 22F.

Also in the embossed carrier tape 10 molded using the mold 20 formed as described above, as in the first embodiment, a resin in which the deformation of the resin base material 11 is reduced can be obtained.
(Embodiment 3)
Fig.3 (a) is sectional drawing which shows Embodiment 3 of the metal mold | die for embossing carrier tape formation of this invention, and is drawn corresponding to Fig.1 (a).

  In FIG. 3A, the structure different from that in FIG. 1A is that the hole 22C formed in the extending portion 22L is formed on the surface of the second mold 22 facing the stripper 21A of the die 22A. The rib 25 which consists of protrusions is provided in the edge part in front and back of the A direction in the figure among the peripheral edges of the other holes 22B to be excluded.

  When comprised in this way, when the resin base material 11 of the embossed carrier tape 10 is shape | molded by the said rib 25, there exists an effect which makes the stress concerning this resin base material 11 uniform.

Note that FIG. 3B is an enlarged view of the portion of the dotted frame B in FIG. As apparent from FIG. 3B, the rib 25 forms a groove around the protrusion 12 </ b> A on the opposite side of the opening of each recess 12 of the resin base material 11.
(Embodiment 4)
In the third embodiment, ribs 25 are formed on the surface of the die 22A of the second mold 22 in the configuration shown in FIG. However, the present invention is not limited to this, and it is a matter of course that the rib 25 may be formed on the surface of the die 22A of the second mold 22 in the configuration shown in FIG. This is because the same effect as shown in the third embodiment can be obtained.

  In this case, in FIG. 2, the ribs 25 are formed on the periphery of the hole 22B, and need not be formed on the periphery of the other holes 22C and 22F.

  As mentioned above, although this invention was demonstrated using embodiment, it cannot be overemphasized that the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiments. Further, it is apparent from the description of the scope of claims that embodiments with such changes or improvements can also be included in the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 10 ... Embossed carrier tape, 11 ... Resin base material, 12 ... Recessed part, 12A ... Projection body, 13 ... Sprocket hole, 20 ... Mold, 21 ... First mold, 21A ... Stripper , 21B... Draw punch, 21U... Extension (on the upstream side of the first mold), 21L... Extension (on the downstream side of the first mold), 22. ... Die, 22B ... Hole (first hole), 22C ... Hole (second hole), 22D, 22E, 22F ... Hole, 22U ... Extension part (on the upstream side of the second mold), 22L: Extension part (downstream of the second mold), 25 ... Rib.

Claims (6)

A mold that forms a plurality of recessed portions arranged in parallel in the direction of the feed by press molding in each shot for each shot of the resin base material that is repeatedly fed a certain amount,
A first mold composed of a stripper and a plurality of draw punches supported by the stripper and arranged in parallel at a predetermined pitch in the feed direction to form the recessed portion of the resin base material,
A plurality of second molds arranged in parallel in the feed direction of the resin base material and constituted by a die having a first hole into which the draw punch of the first mold can be inserted;
The stripper has an extended portion extending at a length equal to or greater than the predetermined pitch from an adjacent draw punch at each of the upstream and downstream ends in the feed direction,
The die has an extending portion extending at a length equal to or longer than the predetermined pitch from the adjacent first hole at each of the upstream and downstream ends in the feed direction,
A mold for embossing carrier tape molding, wherein a second hole is formed in the extending portion on the downstream side in the feed direction, spaced apart from the adjacent first hole at the predetermined pitch.   2. The embossed carrier tape molding die according to claim 1, wherein the extending portion exists downstream of the second hole.   The die is spaced apart from the first hole adjacent to the extension portion on the upstream side in the feed direction at the predetermined pitch to form a third hole, and the extension extends upstream from the third hole. The embossed carrier tape molding die according to claim 1, wherein a portion is present.   2. The embossed carrier tape molding die according to claim 1, wherein the second hole has the same diameter and the same size as the first hole.   The embossed carrier tape molding die according to claim 1, wherein a rib made of a protrusion is provided on a peripheral edge of the first hole formed in the die. The resin base material is repeatedly fed by a fixed amount between the first mold and the second mold facing each other, and press molding is performed by the first mold and the second mold in each shot for each feed. An embossed carrier tape molding method for forming a plurality of recessed portions arranged in parallel at a predetermined pitch along the length direction,
The first mold includes a plurality of draw punches arranged in parallel at the predetermined pitch in the feed direction to form the recessed portions of the resin base material, and the respective upstream and downstream ends of the feed direction are adjacent to each other. The draw punch is configured to have a length equal to or longer than the predetermined pitch,
The second mold has substantially the same length as the first mold in the feed direction, and close to the downstream side in the feed direction together with the first hole into which the draw punch of the first mold can be inserted. A second hole spaced from the first hole by the predetermined pitch,
Forming a plurality of recesses in the resin substrate by press molding of the first mold and the second mold after feeding the resin substrate;
The recessed portion formed on the most upstream side of the resin base material by the next feed of the resin base material is positioned in the second hole of the second mold, and the first mold and the second mold Forming a plurality of concavities that are continuous with the plurality of concavities formed in the step by press molding.

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