JP2014032157A - Probe cleaning necessity determination device, probe cleaning system, probe cleaning necessity determination method, and probe cleaning method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe cleaning necessity determination device and the like which can appropriately determine the necessity of probe cleaning.SOLUTION: A probe cleaning system 1 which determines the necessity of cleaning a probe 100 that can be brought into conduction by contacting a pin 150 of a semiconductor device includes: a resistance value measuring unit 11 that measures a resistance value of the probe 100, which varies according to the amount of adhered substances E that are adhered on a contact surface 101 of the probe 100 that contacts the pin 150; and a cleaning necessity determination unit 12 that determines that the cleaning of the probe 100 is necessary if an actual resistance value measured by the resistance value measuring unit 11 is a predetermined resistance value or greater.

Description

  The present invention relates to a probe cleaning necessity determination device, a probe cleaning system, a probe cleaning necessity determination method, and a probe cleaning method.

  Inspecting (testing) whether or not the armature (electronic component) of a semiconductor device is normal, the probe is brought into contact with the pin (input / output terminal) of the semiconductor device, and power is supplied to the semiconductor device from the external power supply via the probe. The response operation (for example, voltage change) of the semiconductor device is confirmed.

  As such a probe is used, an oxide film (attachment) is formed on the contact surface with the pin. The oxide film is formed, for example, by oxidation of the probe itself, or an oxide film formed on the surface of the pin is peeled off by contact with the probe and moved to the probe. And when an oxide film adheres to a probe in this way, there exists a possibility that the test | inspection precision of a semiconductor device may fall.

  Therefore, a technique for cleaning the probe every time the cumulative number of times the probe is brought into contact with the pin increases a predetermined number has been proposed (see Patent Document 1).

JP 2000-187056 A

  Here, since the lifetime of the probe is shortened due to wear or the like when it is cleaned, it is preferable to more appropriately determine the timing of cleaning the probe.

  Therefore, an object of the present invention is to provide a probe cleaning necessity determination device and a cleaning necessity determination method that can appropriately determine whether a probe needs to be cleaned. It is another object of the present invention to provide a probe cleaning system and a cleaning method.

  Here, when the deposit such as an oxide film adheres to the contact surface of the probe, the inventor of the present application increases the resistance value of the tip including the contact surface of the probe, and the inspection accuracy of the armature such as a semiconductor device decreases. The knowledge that there is a fear was acquired. Further, the inventor of the present application has found that the resistance value of the probe varies depending on the amount of deposits, and the resistance value increases as the amount of deposits increases.

  As a means for solving the above-mentioned problems, the present invention provides a probe cleaning necessity determination device for determining whether or not a probe needs to be cleaned by making contact with an input / output terminal of an armature. The resistance value fluctuates depending on the amount of deposits attached to the contact surface of the probe that is in contact with the input / output terminal, and is measured by a resistance value measuring unit that measures the resistance value of the probe and the resistance value measuring unit. A probe cleaning necessity determination device comprising: a cleaning necessity determination unit that determines that the probe needs to be cleaned when the measured resistance value is equal to or greater than a predetermined resistance value.

  As means for solving the above-mentioned problems, the present invention provides a probe cleaning necessity determination method for determining whether or not a probe needs to be cleaned by making contact with an input / output terminal of an armature. The resistance value fluctuates depending on the amount of deposits attached to the contact surface of the probe that contacts the input / output terminal, and is measured in the resistance value measuring step for measuring the resistance value of the probe and the resistance value measuring step. And a cleaning necessity determination step that determines that the probe needs to be cleaned when the measured resistance value is equal to or greater than a predetermined resistance value.

According to such a configuration, when the measured resistance value measured by the resistance value measuring unit is equal to or greater than the predetermined resistance value, the cleaning necessity determining unit determines that the probe needs to be cleaned.
Here, when the measured resistance value is larger than the predetermined resistance value by a preliminary test or simulation, the inspection accuracy of the armature decreases, and the probe should be cleaned by removing the adhered matter attached to the contact surface. Is set to a value determined as
In this way, it is possible to appropriately determine whether or not the probe needs to be cleaned based on the measured resistance value of the probe.

  Further, in the probe cleaning necessity determination device, the probe cleaning necessity calculation unit includes a cumulative cleaning time calculation unit that calculates a cumulative cleaning time of the probe, and the cleaning necessity determination unit is configured so that the measured resistance value is equal to or greater than the predetermined resistance value. It is preferable to determine that the probe needs to be cleaned when the cumulative cleaning time calculated by the cumulative cleaning time calculator is equal to or shorter than a predetermined time.

  The probe cleaning necessity determination method includes a cumulative cleaning time calculation step for calculating the cumulative cleaning time of the probe, and in the cleaning necessity determination step, when the measured resistance value is equal to or greater than the predetermined resistance value, It is preferable to determine that the probe needs to be cleaned when the cumulative cleaning time calculated in the cumulative cleaning time calculating step is equal to or shorter than a predetermined time.

  Here, the contact surface of the probe has a high conductivity metal such as copper, platinum, gold, etc. in order to prevent the probe body from being oxidized or to increase the conductivity when in contact with the input / output terminals of the armature. A plating layer (conductive layer) made of is formed. This plating layer is worn as the deposits are removed, that is, as the probe is cleaned. Then, when the accumulated cleaning time of the probe becomes a predetermined time or longer and the plating layer disappears due to wear, the deposit is difficult to remove from the contact surface (probe) by a normal cleaning method. Note that the reference predetermined time varies depending on the shape of the contact surface (probe), the material of the plating layer, the type of the cleaning device, and the like, and is obtained by a preliminary test or the like.

  According to such a configuration, when the measured resistance value of the probe is equal to or greater than the predetermined resistance value, the cleaning necessity determination unit determines that the probe needs to be cleaned when the accumulated cleaning time is equal to or shorter than the predetermined time. . That is, when the accumulated cleaning time is less than or equal to the predetermined time and the deposit is easily removed, that is, when the deposit can be removed, it can be appropriately determined that the probe needs to be cleaned.

  Further, in the probe cleaning necessity determination device, the cleaning necessity determination means, when the measured resistance value is equal to or greater than the predetermined resistance value, the cumulative cleaning time calculated by the cumulative cleaning time calculation means is the predetermined time. When exceeding, it is preferable to determine that cleaning of the probe is unnecessary and that the probe needs to be replaced.

  In the probe cleaning necessity determination method, in the cleaning necessity determination step, when the measured resistance value is equal to or greater than the predetermined resistance value, the cumulative cleaning time calculated in the cumulative cleaning time calculation step is set to the predetermined time. When exceeding, it is preferable to determine that cleaning of the probe is unnecessary and that the probe needs to be replaced.

  According to such a configuration, when the measured resistance value of the probe is equal to or greater than the predetermined resistance value, when the cumulative cleaning time exceeds the predetermined time, the cleaning necessity determination unit does not need to clean the probe, It is determined that replacement is necessary. That is, if the accumulated cleaning time is longer than the specified time and it is difficult to remove the deposit, that is, if the deposit cannot be removed, it is determined that the probe needs to be replaced and the probe needs to be replaced. it can.

  Further, as a means for solving the above-mentioned problems, the present invention provides a probe cleaning necessity determination device and a contact surface of the probe so as to remove deposits attached to the contact surface and remove the probe. The deposit removing means for cleaning, the storage means storing the removal time map in which the resistance value of the probe and the minimum removal time necessary for removing the deposit are stored, and the deposit removing means are controlled. Control means, and when the cleaning necessity determination means determines that the probe needs to be cleaned, the control means measures the actually measured resistance value measured by the resistance value measuring means and the removal time map. Based on the above, the probe removal system is characterized in that a target removal time is calculated and the deposit removal means is controlled according to the target removal time.

  Further, as a means for solving the above-described problem, the present invention provides a probe resistance value in the case where it is determined that the probe needs to be cleaned in the cleaning necessity determination step in the probe cleaning necessity determination method. A target removal time based on the removal time map in which the minimum removal time necessary for removing the deposit and the attached matter and the measured resistance value of the probe measured in the resistance value measurement step are calculated. A removal time calculating step, and a deposit removing step for operating the deposit removing means for removing the deposit adhering to the contact surface by cleaning the probe by contacting the contact surface of the probe at the target removal time. And a probe cleaning method characterized by comprising:

Generally, since the amount of deposits increases as the probe resistance value increases, the minimum removal time increases as the probe resistance value increases in the removal time map.
According to such a configuration, when the cleaning necessity determination unit determines that the probe needs to be cleaned, the control unit calculates the target removal time based on the actually measured resistance value and the removal time map, and performs target removal. The deposit removing means is controlled according to time to remove the deposit and wash the probe.

  Here, the target removal time is related to the resistance value (amount of deposits) of the probe, and is the minimum removal time required to remove deposits. Don't overdo it. This makes it possible to prolong the lifetime of the probe because the plating layer is difficult to peel off during the cleaning while the probe is cleaned in an appropriate short time.

  According to the present invention, it is possible to provide a probe cleaning necessity determination device and a cleaning necessity determination method capable of appropriately determining whether a probe needs to be cleaned. Moreover, a probe cleaning system and a cleaning method can be provided.

It is a sectional side view of the probe which concerns on this embodiment, (a) is before adhesion of a deposit | attachment, (b) has shown after adhesion of a deposit | attachment. It is a graph which shows the relationship between the amount of deposits, and resistance value. It is a time chart which shows the change of resistance value at the time of removing a deposit. It is a minimum cleaning time map which shows the relationship between resistance value difference (measured resistance value-target resistance value) and minimum cleaning time. It is a map which shows the relationship between accumulation cleaning time and resistance value. It is a figure which shows the structure of the probe washing | cleaning system which concerns on this embodiment. It is a top view of the deposit removal apparatus concerning this embodiment. It is a sectional side view of the deposit removal apparatus which concerns on this embodiment, and is a figure corresponded to the X1-X1 line cross section of FIG. It is a flowchart which shows operation | movement of the probe cleaning system which concerns on this embodiment.

  An embodiment of the present invention will be described with reference to FIGS.

≪Probe≫
First, the probe 100 to be cleaned will be described.
The probe 100 contacts the pin 150 (input / output terminal, see FIG. 1) of the semiconductor device when power is supplied to the semiconductor device from an external power source in order to check the operation of the semiconductor device (armature). This is a probe that allows current to flow between the probe 100 (external power source) and the semiconductor device. A compression coil spring (not shown) is disposed on the proximal end side of the probe 100, and the probe 100 is biased toward the pin 150 by the compression coil spring, and the probe 100 contacts the pin 150 with an appropriate contact pressure. It is supposed to be. The operation check of the semiconductor device is performed in a state where a predetermined operation voltage is applied to the semiconductor device in a state where the probe 100 is in contact with the pin 150.

  For example, as shown in FIG. 1A, the pin 150 has an extremely thin columnar shape or prismatic shape, and its tip is chamfered to have a truncated cone shape or the like, and has an inclined outer peripheral surface. An oxide film is generally formed on the surface of the pin 150.

  The probe 100 has, for example, a cylindrical shape, and the contact surface 101 that comes into contact with the pin 150 is an uneven surface having an inclined slope so as to make good contact with the inclined outer peripheral surface of the pin 150. In other words, a plurality of cusps are formed on the pin 150 side of the probe 100, and the contact surface 101 is configured by the peripheral surfaces of the cusps.

  Specifically, the probe 100 includes a probe main body 111 having a plurality of cusps on the pin 150 side, and a plating layer 112 formed in a thin film on the surface of the plurality of cusps constituting the probe main body 111. ing. The plating layer 112 (1) prevents oxidation of the probe main body 111 and (2) improves the conductivity between the probe main body 111 and the pin 150, and has high conductivity such as copper, platinum, and gold. Formed of material.

  When a plurality of inspections are repeated using the same probe 100, the deposit E adheres to the contact surface 101 as shown in FIG. The deposit E is non-conductive. For example, a carbon-based oxide formed by oxidizing a part of the plating layer 112 or an oxide film of the pin 150 when the probe 100 is brought into contact with the pin 150. It is peeled off and deposited.

  When the amount of the deposit E increases, the resistance value of the probe 100 increases as shown in FIG. That is, the resistance value of the probe 100 varies corresponding to the amount of the deposit E. When the resistance value of the probe 100 is increased, when the output voltage of the external power supply is constant during the inspection of the semiconductor device, the voltage generated by the probe 100 increases, the voltage applied to the semiconductor device decreases, Inspection accuracy is reduced.

  Here, in FIG. 2, the predetermined resistance value is an upper limit value of the resistance value of the probe 100 capable of inspecting the semiconductor device, is obtained by a preliminary test or the like, and is stored in the cleaning necessity determination unit 12 (see FIG. 6). ing. That is, the predetermined resistance value varies depending on the operating voltage of the semiconductor device, the type of semiconductor, and the like. If the resistance value of the probe 100 is a resistance value A1 or a resistance value B1 (resistance value A1 <resistance value B1) that is larger than the predetermined resistance value, the inspection accuracy of the semiconductor device may be reduced. Is to be removed, that is, the probe 100 should be cleaned.

  The target resistance value (after cleaning) is a target resistance value when the probe 100 is cleaned to reduce the resistance value. The target resistance value is obtained by a preliminary test or the like, and is set in a range that is greater than or equal to the initial resistance value and less than the predetermined resistance value (initial resistance value ≦ target resistance value <predetermined resistance value). For example, as shown in FIG. The initial resistance value is set to a value slightly larger than the initial resistance value and stored in the control unit 21 (see FIG. 6). The initial resistance value is the resistance value of the probe 100 before the deposit E is attached, that is, before the semiconductor device is inspected.

Therefore, as shown in FIGS. 2 and 3, when “predetermined resistance value <resistance value A1 <resistance value B1” and “resistance value difference A2 <resistance value difference B2”, “minimum cleaning time A3 <minimum Cleaning time B3 ".
Here, the difference in resistance value is the amount of decrease in resistance value (decrease width) that should be reduced to the target resistance value (after cleaning) by cleaning the probe 100 (removal of the deposit E), that is, the current resistance. The difference between the value and the target resistance value. Therefore, the resistance value difference increases as the current resistance value increases.

<Minimum cleaning time map>
The minimum cleaning time is the minimum cleaning time of the probe 100 necessary for reducing the resistance value by the resistance value difference. Therefore, as shown in the minimum cleaning time map (removal time map) in FIG. 4, the minimum cleaning time increases as the resistance value difference increases. That is, the minimum cleaning time map is a map (curve showing a correlation) in which the resistance value of the probe 100 is associated with the minimum cleaning time (minimum removal time). Such a minimum cleaning time map is obtained by a preliminary test or the like, and is stored in the storage unit 22 (see FIG. 6) described later. As shown in FIG. 4, when the resistance value difference is C2 or more, it tends to converge to the minimum cleaning time C3 and become substantially constant.

<Cumulative cleaning time map>
In this way, the probe 100 is repeatedly washed. By the way, as shown in the cumulative cleaning time map of FIG. 5, when the same probe 100 is repeatedly cleaned, the inventor of the present application maintains the resistance value substantially constant within a range where the cumulative cleaning time is a predetermined time or less. It has been found that the resistance value increases rapidly when the cumulative cleaning time is longer than the predetermined time.

  This is because when the plating layer 112 of the probe 100 is slightly worn by the cleaning, and the deposit E adheres to the probe main body 111 after the plating layer 112 disappears due to the wear, the brush 51 used in normal cleaning (see FIG. 8). Then, it is thought that it is difficult to remove. As described above, when the accumulated cleaning time exceeds the predetermined time, it is determined that the probe 100 should be replaced.

  Such a cumulative cleaning time map is obtained by a preliminary test or the like and is stored in the cleaning necessity determination unit 12 (see FIG. 6).

≪Configuration of probe cleaning system≫
Next, the probe cleaning system 1 will be described.
As shown in FIG. 6, the probe cleaning system 1 includes a cleaning necessity determination device 10 and a cleaning device 20.

≪Cleaning necessity device≫
The cleaning necessity determination device 10 is a device that determines whether the probe 100 needs to be cleaned.
The cleaning necessity determination apparatus 10 includes a resistance value measurement unit 11 (resistance value measurement unit), a cleaning necessity determination unit 12 (cleaning necessity determination unit), and an accumulated cleaning time calculation unit 13 (cumulative cleaning time calculation unit). And a lamp 14 (display means). The resistance value measurement unit 11, the cleaning necessity determination unit 12, and the cumulative cleaning time calculation unit 13 include a CPU, a ROM, a RAM, various interfaces, an electronic circuit, and the like.

<Resistance measurement unit>
The resistance value measurement unit 11 is a part that measures an actual resistance value (measured resistance value) of the probe 100. The actually measured resistance value of the probe 100 is calculated based on, for example, the current value of the current passing through the probe 100 and the voltage value applied to the probe 100 in a state where a minute current is passed through the probe 100. The Therefore, for example, the resistance value measurement unit 11 calculates a measured resistance value based on the voltage value and the current value, a power source that generates a minute current, a current sensor that detects the current value, a voltage sensor that detects the voltage value, and the like. An actually measured resistance value calculating unit. The resistance value measurement unit 11 (measured resistance value calculation unit) outputs the measured (calculated) measured resistance value to the cleaning necessity determination unit 12.

<Cleaning necessity determination unit>
The cleaning necessity determination unit 12 has a function of determining whether or not the probe 100 needs to be cleaned, that is, whether or not the probe 100 needs to be cleaned. The cleaning necessity determination unit 12 has a function of determining whether or not the probe 100 needs to be replaced (whether or not it can be used continuously). Specific contents will be described later.

<Cumulative cleaning time calculator>
The cumulative cleaning time calculation unit 13 is a part that calculates the cumulative cleaning time for the same probe 100. Here, the cumulative cleaning time calculation unit 13 assumes that the ON time of the deposit removing device 30 input from the control unit 21 matches the cleaning time in each cleaning process, and adds the ON time. Thus, the cumulative cleaning time is calculated.

<Lamp>
The lamp 14 is controlled to be turned ON / OFF and its color by the necessity determination unit 12 for cleaning, and it is necessary to replace the probe 100 (continuous use) or not (continuous use is impossible). Is displayed. For example, when it is determined that replacement is not necessary, the lamp 14 is configured to be turned on (lit) in green, and when it is determined that replacement is required, the lamp 14 is configured to be turned on (lit) in red. Has been.

≪Cleaning equipment≫
The cleaning device 20 is a device that cleans the probe 100.
The cleaning device 20 includes a control unit 21 (control unit), a storage unit 22 (storage unit), and an attached matter removing device 30 (attached matter removing unit).

<Control unit>
The control unit 21 includes a CPU, a ROM, a RAM, various interfaces, an electronic circuit, and the like. The control unit 21 calculates a target cleaning time (target removal time) based on an actually measured resistance value and the like, and according to the target cleaning time. The deposit removing device 30 is controlled, that is, operated to perform the cleaning of the probe 100. Specific contents will be described later.

<Storage unit>
The storage unit 22 is composed of storage devices such as various memories and HDD devices, and stores the minimum cleaning time map of FIG. 4 therein.

<Adherent removal device>
As shown in FIGS. 7 and 8, the deposit removing device 30 is a device that operates according to a command from the control unit 21 and cleans the probe 100 by removing the deposit E from the probe 100. The deposit removing device 30 includes a housing 40, a brush 51, and a motor 52.

<Adherent removal device-casing>
The housing 40 has a rectangular parallelepiped removal chamber 41 whose upper side is open, and a spiral storage chamber 42 (collection chamber) that communicates with the removal chamber 41 in a side sectional view. The spiral direction of the storage chamber 42 coincides with the rotation direction of the brush 51.

  The removal chamber 41 is a space in which the deposit E is removed from the probe 100. A plate-like lid 43 is detachably attached so as to cover the upper opening of the removal chamber 41. An insertion hole 43a extending in the vertical direction is formed at an appropriate position of the lid 43, and the lower end portion (tip portion) of the probe 100 can be inserted into the removal chamber 41 through the insertion hole 43a.

  An adsorption layer 44 (adhesive layer) is formed on the inner wall surface (inner side surface, bottom surface, etc.) of the removal chamber 41. Thereby, even if the deposit E removed from the probe 100 falls in the removal chamber 41, the fallen deposit E is adsorbed and held by the adsorption layer 44. That is, the deposit E that has been removed from the probe 100 and dropped does not rise due to the rotating air of the brush 51, and does not adhere to the probe 100 again.

  Such an adsorption layer 44 is formed by, for example, a sheet having an adsorptive (adhesive) surface or an adhesive, and a layer having an adsorbent (adhesive) surface after curing. Composed.

  The storage chamber 42 is a space for collecting and temporarily storing the removed deposit E. As shown in FIG. 8, the storage chamber 42 opens into the removal chamber 41 on a substantially tangent line of the brush 51 that rotates clockwise in a side sectional view. As a result, the deposit E removed from the tip of the probe 100 by the brush 51 and scattered in the tangential direction (rightward in FIG. 8) is well taken into the storage chamber 42.

  As shown in FIG. 8, the storage chamber 42 has a clockwise spiral shape that is the same as that of the brush 51 from the opening toward the downstream in a side sectional view. Then, the deposit E that has jumped into the storage chamber 42 advances clockwise inside the storage chamber 42 along the spiral inner surface, and is temporarily stored in the downstream portion of the storage chamber 42.

<Adherent removal device-brush>
The brush 51 peels off the deposit E from the probe 100 by removing contact with the probe 100 while rotating. The brush 51 is cantilevered by a motor 52 (see FIG. 7), and a rotation axis thereof extends in a horizontal direction (a direction perpendicular to the paper surface of FIG. 8) slightly above the bottom surface of the removal chamber 41. However, the motion of the brush 51 is not limited to the rotational motion, and may be, for example, a reciprocating rotational motion within a predetermined arc range or a reciprocating motion on a predetermined straight line.

<Adherent removal device-motor>
The motor 52 is an electric motor that operates according to a command from the control unit 21, and is a power source that rotates the brush 51. Here, the case where it is assumed that the ON time (operation time) of the motor 52 coincides with the cleaning time of the probe 100 is illustrated.
However, the present invention is not limited to this. For example, a probe insertion sensor for detecting whether or not the probe 100 has been inserted to a predetermined position where it contacts the brush 51 is attached to the lid 43, and the probe 100 is attached to the brush 51 via the probe insertion sensor. It may be configured to determine that the ON time of the motor 52 is the cleaning time in the contact state.

≪Operation of probe cleaning system≫
A probe cleaning method (probe cleaning necessity determination method) will be described together with the operation of the probe cleaning system 1 with reference to FIG.
In the probe cleaning method, a resistance value measuring step (S101) for measuring the resistance value of the probe 100, a cumulative cleaning time calculating step (S103) for calculating the cumulative cleaning time of the probe 100, and the necessity of cleaning of the probe 100 are determined. A cleaning necessity determination step (S102, S103), a target cleaning time calculation step (S104) for calculating a target cleaning time (target removal time), and a deposit removal step (S104) for removing the deposit E and cleaning the probe 100. S105).
The probe cleaning method is executed for each inspection of the semiconductor device using the probe 100 or for each of a plurality of inspections.

  In step S <b> 101, the resistance value measuring unit 11 measures the actually measured resistance value of the probe 100. Then, the resistance value measurement unit 11 outputs the actually measured resistance value to the cleaning necessity determination unit 12.

In step S102, the cleaning necessity determination unit 12 determines whether or not the actually measured resistance value is greater than or equal to a predetermined resistance value (see FIGS. 2 and 3).
If it is determined that the measured resistance value is equal to or greater than the predetermined resistance value (S102 / Yes), the process proceeds to step S103. When it is determined that the actually measured resistance value is not equal to or greater than the predetermined resistance value (No in S102), the process proceeds to step S111.

In step S103, the cleaning necessity determination unit 12 reads the cumulative cleaning time from the cumulative cleaning time calculation unit 13, and determines whether the cumulative cleaning time is equal to or shorter than a predetermined time (see FIG. 5).
When it is determined that the accumulated cleaning time is equal to or shorter than the predetermined time (S103 / Yes), the process proceeds to step S104. The cleaning necessity determination unit 12 outputs a signal indicating that cleaning is necessary and an actually measured resistance value to the control unit 21.

  If it is determined that the cumulative cleaning time is not less than the predetermined time (S103, No), that is, if it is determined that the cumulative cleaning time exceeds the predetermined time, the process proceeds to step S121.

  In step S104, the control unit 21 reads the target resistance value stored therein, and calculates a resistance value difference that is a difference between the actually measured resistance value and the target resistance value (see FIGS. 2 and 3). Next, the control unit 21 determines a target cleaning time to be targeted in the current cleaning based on the resistance value difference and the minimum cleaning time map (see FIG. 4) stored in the storage unit 22.

  In step S105, the control unit 21 controls the deposit removing device 30 according to the target cleaning time determined in step S104, that is, drives the motor 52 of the deposit removing device 30. Then, the brush 51 rotates, the deposit E is removed from the probe 100, and the probe 100 is washed.

  While driving the motor 52, the control unit 21 outputs a signal indicating that the deposit removal device 30 is operating to the cumulative cleaning time calculation unit 13. Then, the cumulative cleaning time calculation unit 13 calculates the current cleaning time corresponding to the time when the motor 52 (adherent removal device 30) is driven (actuated) based on the signal from the control unit 21. In addition, the control unit 21 may output the target cleaning time calculated in step S104 to the cumulative cleaning time calculation unit 13, and the cumulative cleaning time calculation unit 13 may set the target cleaning time as the current cleaning time.

In step S106, the cumulative cleaning time calculation unit 13 adds the current cleaning time to the previous cumulative cleaning time, and updates the cumulative cleaning time.
Thereafter, the process proceeds to step S101.

Step S111 which advances to No in step S102 will be described.
In step S111, the cleaning necessity determination unit 12 determines that the inspection of the semiconductor device can be continued using the probe 100 continuously, and the lamp 14 is lit in a color (for example, green) corresponding to the fact that the inspection can be continued. To do.
Thereafter, the process proceeds to step S101.

Step S121 which advances to No in step S103 will be described.
In step S121, the cleaning necessity determination unit 12 determines that the inspection of the semiconductor device cannot be continued using the probe 100 continuously. That is, the cleaning necessity determination unit 12 determines (determines) that the probe 100 needs to be replaced.

  In step S122, the cleaning necessity determination unit 12 lights the lamp 14 with a color (for example, red) corresponding to the probe 100 replacement request in order to notify the operator that the probe 100 should be replaced.

Thereafter, the processing proceeds to step END.
After that, when the probe 100 is replaced, the cumulative cleaning time calculation unit 13 resets (0) the cumulative cleaning time stored therein.

≪Effect of probe cleaning system≫
According to such a probe cleaning system 1, the following effects are obtained.
When the measured resistance value is equal to or greater than the predetermined resistance value that is the upper limit value that can be inspected by the probe 100 (S102 / Yes), the probe 100 is washed (S105), and thus the probe 100 is not wasted and the probe 100 is omitted. The lifetime of 100 can be extended.

  Since the probe 100 is cleaned only when the cumulative cleaning time is equal to or shorter than the predetermined time (Yes in S103), that is, when the resistance value of the probe 100 is expected to decrease due to the cleaning (S105), the probe 100 is wasted. The lifetime of the probe 100 can be extended while omitting unnecessary cleaning. In addition, since it is determined whether or not the probe 100 needs to be cleaned, that is, whether or not the probe 100 needs to be replaced based on the accumulated cleaning time, inspection defects due to a sudden increase in the deposit E (a rapid increase in resistance value) during the next inspection are determined. Can be prevented.

  Further, when cleaning the probe 100, the minimum cleaning time is calculated based on the resistance value difference that is the difference between the actually measured resistance value and the target resistance value (S104), and the cleaning is performed accordingly (S105). While optimizing, peeling of the plating layer 112 due to excessive cleaning can be prevented, and the life of the probe 100 can be extended. Further, the wear of the brush 51 due to excessive cleaning can be prevented, and the life of the brush 51 is extended.

≪Modification≫
As mentioned above, although embodiment of this invention was described, this invention is not limited to this, For example, it can change as follows.

  In the above-described embodiment, the deposit E is removed by bringing the rotating brush 51 into contact with the probe 100, but the configuration of the deposit removing device is not limited to this. For example, it is good also as a structure which removes the deposit | attachment E by contacting the probe 100 with the sponge-like removal sponge which has moderate elasticity, and making sliding contact.

DESCRIPTION OF SYMBOLS 1 Probe cleaning system 10 Cleaning necessity determination apparatus 11 Resistance value measurement part (resistance value measurement means)
12 Cleaning necessity determination unit (cleaning necessity determination means)
13 Cumulative cleaning time calculation unit (cumulative cleaning time calculation means)
20 Cleaning device 21 Control part (control means)
22 Storage unit (storage means)
30 Deposit removal device (attachment removal means)
100 probe 101 contact surface 150 pin (input / output terminal)
E Deposit

Claims (8)

A probe cleaning necessity determination device that determines whether or not a probe needs to be cleaned by making contact with an input / output terminal of an armature,
The resistance value of the probe varies depending on the amount of deposits attached to the contact surface of the probe that contacts the input / output terminal,
Resistance value measuring means for measuring the resistance value of the probe;
When the measured resistance value measured by the resistance value measuring unit is equal to or greater than a predetermined resistance value, a cleaning necessity determination unit that determines that the probe needs to be cleaned;
A probe cleaning necessity determination device comprising: A cumulative cleaning time calculating means for calculating the cumulative cleaning time of the probe;
The cleaning necessity determination unit needs to clean the probe when the measured resistance value is equal to or greater than the predetermined resistance value and the cumulative cleaning time calculated by the cumulative cleaning time calculation unit is equal to or less than a predetermined time. It is determined that there is a probe cleaning necessity determination device according to claim 1. When the measured resistance value is equal to or greater than the predetermined resistance value, the cleaning necessity determination unit does not need to clean the probe when the cumulative cleaning time calculated by the cumulative cleaning time calculation unit exceeds the predetermined time. It is determined that the probe needs to be replaced. The probe cleaning necessity determination device according to claim 2, wherein the probe needs to be replaced. The probe cleaning necessity determination device according to any one of claims 1 to 3,
A deposit removing means for cleaning the probe by removing the deposit adhering to the contact surface by contacting the contact surface of the probe;
Storage means for storing a removal time map in which a resistance value of the probe and a minimum removal time necessary for removing the deposit are associated with each other;
Control means for controlling the deposit removal means;
With
When the cleaning necessity determination means determines that the probe needs to be cleaned,
The control means includes
Based on the measured resistance value measured by the resistance value measuring means and the removal time map, the target removal time is calculated,
The probe cleaning system, wherein the deposit removing means is controlled according to the target removal time. A probe cleaning necessity determination method for determining whether or not a probe needs to be made conductive by contacting an input / output terminal of an armature,
The resistance value of the probe varies depending on the amount of deposits attached to the contact surface of the probe that contacts the input / output terminal,
A resistance value measuring step for measuring the resistance value of the probe;
When the measured resistance value measured in the resistance value measurement step is equal to or greater than a predetermined resistance value, a cleaning necessity determination step that determines that the probe needs to be cleaned;
A method for determining whether or not a probe needs to be cleaned. A cumulative cleaning time calculating step of calculating a cumulative cleaning time of the probe,
In the cleaning necessity determination step, when the measured resistance value is equal to or greater than the predetermined resistance value, the probe needs to be cleaned when the cumulative cleaning time calculated in the cumulative cleaning time calculation step is equal to or less than a predetermined time. It is determined that there is a probe cleaning necessity determination method according to claim 5. In the cleaning necessity determination step, when the measured resistance value is greater than or equal to the predetermined resistance value, the cleaning of the probe is not required when the cumulative cleaning time calculated in the cumulative cleaning time calculation step exceeds the predetermined time. It is determined that the probe needs to be replaced. The method for determining whether or not the probe needs to be cleaned according to claim 6. In the cleaning necessity determination step in the probe cleaning necessity determination method according to any one of claims 5 to 7, when it is determined that the probe needs to be cleaned,
Based on the removal time map in which the resistance value of the probe and the minimum removal time necessary for removing the deposit are associated with each other, and the measured resistance value of the probe measured in the resistance value measurement step, target removal is performed. A target removal time calculating step for calculating time;
The deposit removing step of operating the deposit removing means for removing the deposit adhering to the contact surface by contacting the probe contact surface and cleaning the probe at the target removal time;
A probe cleaning method characterized by comprising:

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