JP2014027213A - Light source unit - Google Patents

Light source unit Download PDF

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Publication number
JP2014027213A
JP2014027213A JP2012168521A JP2012168521A JP2014027213A JP 2014027213 A JP2014027213 A JP 2014027213A JP 2012168521 A JP2012168521 A JP 2012168521A JP 2012168521 A JP2012168521 A JP 2012168521A JP 2014027213 A JP2014027213 A JP 2014027213A
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Japan
Prior art keywords
wiring
strip
led element
light source
source unit
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JP2012168521A
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JP5803835B2 (en
Inventor
Yoshihisa Yokogawa
佳久 横川
Yoshihiro Kanehata
祥寛 金端
Manabu Mori
学 森
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Ushio Denki KK
Ushio Inc
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Ushio Denki KK
Ushio Inc
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Priority to JP2012168521A priority Critical patent/JP5803835B2/en
Priority to EP13826194.6A priority patent/EP2882002B1/en
Priority to PCT/JP2013/067494 priority patent/WO2014021030A1/en
Priority to CN201380035070.4A priority patent/CN104412400B/en
Priority to US14/417,620 priority patent/US9755126B2/en
Publication of JP2014027213A publication Critical patent/JP2014027213A/en
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Publication of JP5803835B2 publication Critical patent/JP5803835B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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Abstract

PROBLEM TO BE SOLVED: To provide a structure in which an LED element can be arranged with high density and effective cooling can be performed without inhibiting heat from being radiated from the LED element, in a light source unit in which a plurality of belt-like wiring conductors are formed in parallel on a substrate, a plurality of LED elements are arranged on the belt-like wiring conductor, the LED element on the same belt-like wiring conductor is electrically connected to the neighboring belt-like wiring conductor via a wire, and the LED element is arranged on the substrate in a zigzag shape as a whole.SOLUTION: A belt-like wiring conductor is characterized in that a large width part and a small width part are formed in the wiring direction and an LED element is arranged on the large width part of a belt-like wiring conductor.

Description

この発明は光源ユニットに関するものであり、特に、基板上に複数のＬＥＤ素子を備えた光源ユニットに係わるものである。   The present invention relates to a light source unit, and particularly to a light source unit having a plurality of LED elements on a substrate.

従来から、印刷業界や電子工業界などにおいては、被処理対象物である保護膜、接着剤、塗料、インキ、フォトレジスト、樹脂、配向膜等に対して、硬化、乾燥、溶融、あるいは軟化、改質処理などを行う光源として紫外線を放射する光源が多用されているが、近年においては、この紫外線領域の光を発光するＬＥＤ素子が利用されてきており、このような紫外線領域の光を放射するＬＥＤ素子を用いた紫外線光源ユニットが開発されている。
上記ＬＥＤ素子を用いた光源ユニットをインクジェットプリンターのインクジェットヘッドと組み合わせた構成が、特開２００４−３５８７６９号公報（特許文献１）に開示されている。 Conventionally, in the printing industry, the electronics industry, etc., the protective film, adhesive, paint, ink, photoresist, resin, alignment film, etc., which are objects to be processed, are cured, dried, melted, or softened. A light source that emits ultraviolet rays is often used as a light source for performing a modification process or the like. In recent years, LED elements that emit light in the ultraviolet region have been used, and such ultraviolet light is emitted. An ultraviolet light source unit using an LED element has been developed.
A configuration in which a light source unit using the LED element is combined with an inkjet head of an inkjet printer is disclosed in Japanese Patent Application Laid-Open No. 2004-358769 (Patent Document 1).

図３にその構成が示されている。
インクジェットプリンター２０は、紙などのプリントメディアＭにインクを噴出するインクジェットヘッド２１と、その片側、若しくは、両側に備えられた紫外線光源ユニット２２とを有している。これらのインクジェットヘッド２１および光源ユニット２２は、プリントメディアＭより所定間隔だけ上方に配置され、ガイドレール２３に懸架されてプリントメディアＭに対して横断方向Ｘに走査される。
前記インクジェットヘッド２１から噴射されてプリントメディアＭの表面に付着したＵＶインク滴は、光源ユニット２２から照射される紫外線により硬化される。これにより、インクジェットヘッド２１の走査方向Ｘにおいて、プリントメディアＭ表面にＵＶインクが着色される。
上記のＵＶインク滴の硬化後に、プリントメディアＭは長さ方向Ｙに、決められた距離だけ移動し、上記印刷動作が繰り返される。これにより、プリントメディア表面に絵図又は文字を形成できるものである。 FIG. 3 shows the configuration.
The ink jet printer 20 includes an ink jet head 21 that ejects ink onto a print medium M such as paper, and an ultraviolet light source unit 22 provided on one side or both sides thereof. The inkjet head 21 and the light source unit 22 are disposed above the print medium M by a predetermined distance, suspended on the guide rail 23 and scanned in the transverse direction X with respect to the print medium M.
The UV ink droplets ejected from the inkjet head 21 and attached to the surface of the print medium M are cured by the ultraviolet rays irradiated from the light source unit 22. Thereby, the UV ink is colored on the surface of the print medium M in the scanning direction X of the inkjet head 21.
After the UV ink droplets are cured, the print medium M moves in the length direction Y by a predetermined distance, and the printing operation is repeated. Thereby, a picture or a character can be formed on the surface of the print medium.

ところで、前記特許文献１においては、インクジェットプリンターに備え付けられる紫外線光源ユニットについて、ＬＥＤ素子を千鳥状に配置したものが示されている。図４にその配置構造が示されていて、紫外線光源ユニット２２の光照射面には、ＬＥＤ素子２２１を備えた基板２２２が設けられており、このＬＥＤ素子２２１は基板２２２上で縦横に千鳥格子状に配置されている。このような千鳥配置構造により、紫外線光源ユニット２２を移動させた際、該紫外線光源ユニット２２がたどる移動幅分の範囲に対して、隙間をあけず万遍なく紫外線を照射することができるものとしている。   By the way, in the said patent document 1, what has arrange | positioned the LED element in zigzag form about the ultraviolet light source unit with which an inkjet printer is equipped is shown. The arrangement structure is shown in FIG. 4, and a substrate 222 provided with LED elements 221 is provided on the light irradiation surface of the ultraviolet light source unit 22. The LED elements 221 are staggered vertically and horizontally on the substrate 222. It is arranged in a child shape. With such a staggered arrangement structure, when the ultraviolet light source unit 22 is moved, the ultraviolet light source unit 22 can be uniformly irradiated with ultraviolet rays without leaving a gap with respect to the range of the moving width that the ultraviolet light source unit 22 follows. Yes.

ところで、このようなインクジェットプリンターにおいて、印刷の速度を増して処理スピードをアップしようとする場合、インクジェットおよび光源ユニットを横断方向Ｘに素早く動かすことが必要となる。しかしながら、光源ユニットをＸ方向に素早く動かすと、インクジェットヘッドから噴射されたＵＶインク滴に照射される単位時間当たりの紫外線照射量が少なくなり、インクを十分に硬化させることができなくなる。処理のスピードアップを図ったうえで、インクの硬化を完全にするには、紫外線照射量を増大させることが必要であり、そのためには、基板上の同一面積内に、ＬＥＤ素子を高密度に実装することが必要となってくる。   By the way, in such an ink jet printer, in order to increase the printing speed and increase the processing speed, it is necessary to quickly move the ink jet and the light source unit in the transverse direction X. However, if the light source unit is quickly moved in the X direction, the amount of UV irradiation per unit time irradiated to the UV ink droplets ejected from the inkjet head is reduced, and the ink cannot be sufficiently cured. In order to fully cure the ink while speeding up the processing, it is necessary to increase the amount of UV irradiation. For this purpose, the LED elements are densely arranged in the same area on the substrate. It will be necessary to implement.

そこで、本発明者は、光源ユニットにおけるＬＥＤ素子の高密度な実装を実現すべく、基板上で高密度に実装可能なＬＥＤ素子の配置及び帯状配線について検討した。
前記特許文献１に開示されたＬＥＤ素子を千鳥配置したものにおいては、該ＬＥＤ素子を基板上に実装する場合には、基板上にその長さ方向に延びる複数の帯状配線を設けて、この各帯状配線上にＬＥＤ素子を配置し、基板全体としてＬＥＤ素子を千鳥配置する構成を採用することが考えられる。 In view of this, the present inventor has examined the arrangement of LED elements and strip-like wiring that can be mounted on a substrate at high density in order to realize high-density mounting of LED elements in the light source unit.
In the case where the LED elements disclosed in Patent Document 1 are arranged in a staggered manner, when the LED elements are mounted on a substrate, a plurality of strip-like wirings extending in the length direction are provided on the substrate. It is conceivable to employ a configuration in which the LED elements are arranged on the band-shaped wiring and the LED elements are arranged in a staggered manner as the entire substrate.

そのような例が図５に示されていて、（Ａ）に示されるように、基板１１上には一方向に沿って伸びる線状の帯状配線１２、１２が複数並列配置されている。そして、この帯状配線１２上に複数のＬＥＤ素子１３、１３が半田付けなどによって接続されていて、基板１１全体としてＬＥＤ素子１３、１３が千鳥状になるよう配置されている。そして、帯状配線１２上の各ＬＥＤ素子１３はワイヤー１６によって隣接する帯状配線１２に電気的に接続されている。
しかして、各ＬＥＤ素子１３の全てが直列配線された場合には、結線が１個所でも断線すると全てのＬＥＤ素子１３が点灯不能となってしまうが、上記のように、帯状配線１２上に複数のＬＥＤ素子１３、１３を並列配置した場合には、これらＬＥＤ素子１３、１３は電気的に並列接続されたことになり、ＬＥＤ素子１３から隣接する帯状配線１２へのワイヤー６結線の１個所が断線しても、それ以外のＬＥＤ素子は点灯可能であって、全てのＬＥＤ素子が不点灯となってしまうことがないという利点がある。 Such an example is shown in FIG. 5. As shown in FIG. 5A, a plurality of linear strip-like wirings 12, 12 extending in one direction are arranged in parallel on the substrate 11. A plurality of LED elements 13 and 13 are connected to the belt-like wiring 12 by soldering or the like, and the LED elements 13 and 13 are arranged in a staggered pattern as the entire substrate 11. Each LED element 13 on the strip-shaped wiring 12 is electrically connected to the adjacent strip-shaped wiring 12 by a wire 16.
Thus, when all of the LED elements 13 are connected in series, all the LED elements 13 cannot be turned on if even one connection is broken. When the LED elements 13 and 13 are arranged in parallel, the LED elements 13 and 13 are electrically connected in parallel, and there is one place of wire 6 connection from the LED element 13 to the adjacent strip-shaped wiring 12. Even if it is disconnected, the other LED elements can be lit, and there is an advantage that all the LED elements are not unlit.

ところで、図５（Ｂ）に示すように、このＬＥＤ素子１３は上面と下面にそれぞれ電極１４、１５を有しており、この下面の電極１５が帯状配線１２上に半田付け等により接続されていて、上面の電極１４がワイヤー１６を介して隣り合う帯状配線１２上のＬＥＤ素子１３間に結線される。
また、各々の帯状配線１２、１２は電気回路的に絶縁されていなければならず、当然その間には所定の絶縁間隔が設けられている。
そして、前記基板１１の下面にはヒートシンク１７が当接されていて、冷却ファンからの冷却風によってヒートシンク１７から放熱し、これにより基板１１が冷却されている。このような構成により、ＬＥＤ素子１３から発生する熱は、下面電極１５−帯状配線１２−基板１１−ヒートシンク１７の経路を経て放熱されている。 As shown in FIG. 5B, the LED element 13 has electrodes 14 and 15 on the upper surface and the lower surface, respectively, and the electrode 15 on the lower surface is connected to the strip-shaped wiring 12 by soldering or the like. Thus, the electrode 14 on the upper surface is connected between the LED elements 13 on the adjacent strip-like wiring 12 via the wire 16.
Further, each of the strip-like wirings 12 and 12 must be insulated in terms of an electric circuit, and of course, a predetermined insulation interval is provided therebetween.
A heat sink 17 is in contact with the lower surface of the substrate 11, and heat is radiated from the heat sink 17 by the cooling air from the cooling fan, whereby the substrate 11 is cooled. With such a configuration, the heat generated from the LED element 13 is dissipated through the path of the lower surface electrode 15 -the strip-like wiring 12 -the substrate 11 -the heat sink 17.

ところで、上記図５の構成によれば、帯状配線１２、１２間に所定の絶縁距離が必要であり、結局このことが障壁となって、この帯状配線１２上のＬＥＤ素子１３を、図５（Ａ）における帯状配線１２と直交するＸ方向において密に配設することが困難となっている。
そこで、上記帯状配線１２の幅をＬＥＤ素子１３よりも小さくして配列し、その上に複数個のＬＥＤ素子１３を設ける構成とすることによって、Ｘ方向でのＬＥＤ素子１３の配設密度を高めることが考えられる。 By the way, according to the configuration of FIG. 5 described above, a predetermined insulation distance is required between the strip-shaped wirings 12 and 12, and this eventually becomes a barrier, and the LED element 13 on the strip-shaped wiring 12 is connected to FIG. It is difficult to arrange them densely in the X direction orthogonal to the strip-shaped wiring 12 in A).
Therefore, the arrangement density of the LED elements 13 in the X direction is increased by arranging the plurality of LED elements 13 thereon by arranging the width of the band-like wiring 12 smaller than that of the LED elements 13. It is possible.

図６にその態様が示されている。同図において、基板１１上に設けられる帯状配線１２は、ＬＥＤ素子１３の幅よりも小幅にされていて、各配線１２上に複数のＬＥＤ素子１３が配列されている。
帯状配線１２の幅を小さくしたことによって、隣接する各配線１２の間に所定の絶縁距離をとったとしても、その間隔を前記図５の構成よりも小さくして配列できて、この配線１２上に配置されるＬＥＤ素子１３を、前記配線１２と直交するＸ方向において密に配置できるものである。
しかしながら、このような構成を採用すると、図６（Ｂ）に示されるように、基板１１上の帯状配線１２の幅Ｌ１が、ＬＥＤ素子１３の幅よりも小さくなり、更に図６（Ａ）におけるＸ方向の実装密度をより小さなものとする場合、その幅Ｌ１は、ＬＥＤ素子１３の下面電極１５の幅Ｌ２よりも小さくなり（Ｌ１＜Ｌ２）、ＬＥＤ素子１３からヒートシンク１７に至る熱の放熱経路が前記帯状配線１２部分で狭くなって放熱機能が妨げられてしまい、ＬＥＤ素子に対して十分な冷却効果が得られず、該ＬＥＤ素子の発光効率が低下するという問題が生じてくる。 The mode is shown in FIG. In the figure, a strip-like wiring 12 provided on the substrate 11 is made smaller than the width of the LED elements 13, and a plurality of LED elements 13 are arranged on each wiring 12.
By reducing the width of the band-like wiring 12, even if a predetermined insulation distance is provided between the adjacent wirings 12, the interval can be arranged smaller than the configuration of FIG. The LED elements 13 arranged in the X direction can be densely arranged in the X direction perpendicular to the wiring 12.
However, when such a configuration is adopted, as shown in FIG. 6B, the width L1 of the strip-like wiring 12 on the substrate 11 becomes smaller than the width of the LED element 13, and further in FIG. When the mounting density in the X direction is made smaller, the width L1 is smaller than the width L2 of the lower surface electrode 15 of the LED element 13 (L1 <L2), and the heat dissipation path from the LED element 13 to the heat sink 17 However, the band-like wiring 12 becomes narrow and the heat dissipation function is hindered, and a sufficient cooling effect cannot be obtained for the LED element, resulting in a problem that the luminous efficiency of the LED element is lowered.

特開２００４−３５８７６９号公報JP 2004-358769 A

この発明は、上記従来技術の問題点に鑑みて、基板上に複数の帯状配線が並列して形成され、該帯状配線上に複数のＬＥＤ素子が配置されていて、同一の前記帯状配線上のＬＥＤ素子は、隣接する帯状配線にワイヤーを介して電気的に接続され、前記ＬＥＤ素子は、基板上で全体として千鳥状に配置されている光源ユニットにおいて、前記基板上での前記ＬＥＤ素子の実装密度を高めるとともに、該ＬＥＤ素子の冷却を十分に行えて発光効率の低下を防止することができる構造を提供せんとするものである。   In the present invention, in view of the above-described problems of the prior art, a plurality of strip wirings are formed in parallel on a substrate, and a plurality of LED elements are arranged on the strip wiring. The LED elements are electrically connected to adjacent strip-shaped wirings via wires, and the LED elements are mounted in a staggered pattern on the substrate as a whole, and the LED elements are mounted on the substrate. An object of the present invention is to provide a structure capable of increasing the density and sufficiently cooling the LED element to prevent a decrease in luminous efficiency.

上記課題を解決するために、この発明の光源ユニットは、前記帯状配線は、配線方向において大幅部と小幅部とが形成されていて、前記ＬＥＤ素子が該帯状配線の大幅部上に配置されていることを特徴とする。
また、前記帯状電極の大幅部は、前記ＬＥＤ素子の下面に設けられて前記帯状配線に当接する下面電極よりも大幅に形成されていることを特徴とする。
また、前記帯状電極の小幅部は、前記ＬＥＤ素子よりも小幅に形成されていることを特徴とする。
また、前記ＬＥＤ素子は正方形状であり、その一辺が、前記帯状配線の配線方向と平行に配置されていることを特徴とする。
また、前記ＬＥＤ素子は正方形状であり、その対角線が前記帯状配線の配線方向に一致するように配置されていることを特徴とする。 In order to solve the above-described problems, in the light source unit of the present invention, the strip-shaped wiring has a large portion and a small width portion formed in the wiring direction, and the LED element is disposed on the large portion of the strip-shaped wiring. It is characterized by being.
Further, the large portion of the strip electrode is formed to be significantly larger than the bottom electrode provided on the bottom surface of the LED element and in contact with the strip wiring.
Further, the narrow portion of the strip electrode is formed to be narrower than the LED element.
Further, the LED element has a square shape, and one side of the LED element is arranged in parallel with the wiring direction of the belt-like wiring.
Further, the LED elements are square-shaped, and are arranged so that diagonal lines thereof coincide with the wiring direction of the strip-shaped wiring.

この発明の光源ユニットによれば、帯状配線に大幅部と小幅部を形成したので、帯状配線相互をより近接させて配置することができて、該帯状配線上のＬＥＤ素子を基板上でより高密度に配置することができるとともに、前記大幅部上にＬＥＤ素子を配置したので、その冷却効果を損なうことなく、発光効率の低下を防止できるという効果を奏するものである。
また、前記大幅部をＬＥＤ素子よりも大幅にすることで、前記ＬＥＤ素子からの熱を効果的に放熱できて、前記ＬＥＤ素子の発熱を抑制し、その発光効率の低下を防止できる。
また、前記小幅部をＬＥＤ素子よりも小幅とすることで、基板上の配線方向と直交する方向で、より一層高密度な実装が実現できる。 According to the light source unit of the present invention, since the large portion and the small width portion are formed in the strip-shaped wiring, the strip-shaped wiring can be arranged closer to each other, and the LED elements on the strip-shaped wiring can be arranged higher on the substrate. While being able to arrange | position to a density, since the LED element has been arrange | positioned on the said large part, there exists an effect that the fall of luminous efficiency can be prevented, without impairing the cooling effect.
Moreover, by making the said large part larger than an LED element, the heat | fever from the said LED element can be thermally radiated effectively, the heat_generation | fever of the said LED element can be suppressed, and the fall of the luminous efficiency can be prevented.
Further, by making the small width portion smaller than the LED element, it is possible to realize mounting with higher density in the direction orthogonal to the wiring direction on the substrate.

本発明の光源ユニットの平面図（Ａ）とＡ−Ａ部分断面図（Ｂ）。The top view (A) and AA fragmentary sectional view (B) of the light source unit of this invention. 他の実施例の平面図。The top view of another Example. 従来技術の斜視図。The perspective view of a prior art. 従来技術の光源ユニットの説明図。Explanatory drawing of the light source unit of a prior art. 中間例の平面図（Ａ）と部分断面図（Ｂ）。The top view (A) and partial sectional view (B) of an intermediate example. 別の中間例の平面図（Ａ）と部分断面図（Ｂ）。The top view (A) and partial sectional view (B) of another intermediate example.

図１において、（Ａ）は平面図であり、（Ｂ）はＡ−Ａ部分拡大断面図である。
図１（Ａ）に示されるように、例えば窒化アルミニウム等の絶縁性かつ熱伝導率の高い物質からなる基板１上には、金属からなる複数の帯状配線２、２が所定の絶縁間隔をもって配置されている。該帯状配線２を構成する金属は、例えば銅や金などの熱伝導率の高い材料が用いられる。
前記帯状配線２は、その配線方向に沿って、大幅部２ａと小幅部２ｂとが繰り返し形成されており、隣接する帯状配線２、２ではその大幅部２ａが一定間隔だけずれるように配置されていて、隣接する帯状配線２、２間では互いに大幅部２ａと小幅部２ｂとが対向するように配置されている。
これら帯状配線２、２の大幅部２ａ上にＬＥＤ素子３、３が接続されることにより、基板１全体でＬＥＤ素子３、３は千鳥状に配置される。
なお、この例では、前記ＬＥＤ素子３は正方形状であって、その一辺が前記帯状配線２の配線方向と平行に配置されている。 In FIG. 1, (A) is a plan view, and (B) is an AA partial enlarged sectional view.
As shown in FIG. 1A, a plurality of strip-like wirings 2 and 2 made of metal are arranged with a predetermined insulation interval on a substrate 1 made of an insulating and high thermal conductivity material such as aluminum nitride. Has been. As the metal constituting the strip-like wiring 2, a material having high thermal conductivity such as copper or gold is used.
The strip-like wiring 2 has a large portion 2a and a small-width portion 2b repeatedly formed along the wiring direction, and the adjacent strip-like wirings 2 and 2 are arranged so that the large portion 2a is shifted by a constant interval. Thus, between the adjacent strip-like wirings 2 and 2, the large portion 2a and the small width portion 2b are arranged so as to face each other.
By connecting the LED elements 3 and 3 on the large portions 2a of the strip-like wirings 2 and 2, the LED elements 3 and 3 are arranged in a staggered manner on the entire substrate 1.
In this example, the LED element 3 has a square shape, and one side thereof is arranged in parallel with the wiring direction of the belt-like wiring 2.

図１（Ｂ）に示されるように、前記ＬＥＤ素子３には、その上下面に上面電極４と下面電極５が設けられていて、前記下面電極４が前記帯状配線２の大幅部２ａ上に当接されてハンダ付け等により接続され、前記ＬＥＤ素子３と帯状配線２が電気的に接続されている。
そして、上面電極４には、例えば金からなるワイヤー６の一端が結線され、該ワイヤー６の他端は隣設する帯状配線２の小幅部２ｂに結線されている。
これにより、各帯状電極２は、その上に設けられたＬＥＤ素子２およびワイヤー６を介して、隣接する帯状電極２と電気的に接続されている。
そして、基板１の下面にはヒートシンク７が当接されており、ＬＥＤ素子３からの熱は基板１を介して該ヒートシンク７から放熱される。 As shown in FIG. 1B, the LED element 3 is provided with an upper surface electrode 4 and a lower surface electrode 5 on the upper and lower surfaces thereof, and the lower surface electrode 4 is disposed on the large portion 2 a of the strip-like wiring 2. The LED element 3 and the belt-like wiring 2 are electrically connected by abutting and connected by soldering or the like.
Then, one end of a wire 6 made of, for example, gold is connected to the upper surface electrode 4, and the other end of the wire 6 is connected to the narrow portion 2 b of the adjacent strip-like wiring 2.
Thereby, each strip | belt-shaped electrode 2 is electrically connected with the strip | belt-shaped electrode 2 which adjoins via the LED element 2 and wire 6 which were provided on it.
A heat sink 7 is in contact with the lower surface of the substrate 1, and heat from the LED element 3 is radiated from the heat sink 7 through the substrate 1.

前記構成において、前記帯状配線２の大幅部２ａは、ＬＥＤ素子３との接続強度、および基板１を介したヒートシンク７への熱伝導性の観点から、図１（Ｂ）に示されるように、その幅Ｌ１が、少なくとも、ＬＥＤ素子３の下面電極５の幅Ｌ２よりも大きい（Ｌ１＞Ｌ２）ことが望ましい。
また、帯状配線２の小幅部２ｂの幅は、ＬＥＤ素子３の幅よりも小さくすれば、隣接する配線２、２の間隔をより一層小さくして配置することができ、基板１上でのＬＥＤ素子３、３の実装密度、特に、配線２と直行するＸ方向での密度を高めることができる。 In the above configuration, the large portion 2a of the belt-like wiring 2 has a connection strength with the LED element 3 and a thermal conductivity to the heat sink 7 via the substrate 1, as shown in FIG. The width L1 is desirably at least larger than the width L2 of the lower surface electrode 5 of the LED element 3 (L1> L2).
Further, if the width of the narrow portion 2b of the belt-like wiring 2 is made smaller than the width of the LED element 3, the distance between the adjacent wirings 2 and 2 can be further reduced, and the LED on the substrate 1 can be arranged. The mounting density of the elements 3 and 3, particularly the density in the X direction perpendicular to the wiring 2 can be increased.

図２に他の実施例が示されている。この実施例では、図１の実施例と比較して、帯状配線２上に配置されるＬＥＤ素子３の向きが異なっている。ＬＥＤ素子３は正方形状であり、その対角線が帯状配線２の配線方向と一致するように配置されている。この場合、帯状配線２の大幅部２ａもその対角線が配線方向に一致するように傾けられている。
上記構成により、図１の実施例との比較において、ＬＥＤ素子３は、帯状配線２の配線方向でも高密度に配置でき、帯状配線２の配線方向およびこれと直行する方向の両方向で高密度に実装することができる。 Another embodiment is shown in FIG. In this embodiment, the direction of the LED elements 3 arranged on the strip-like wiring 2 is different from that in the embodiment of FIG. The LED element 3 has a square shape and is arranged so that the diagonal line thereof coincides with the wiring direction of the strip-like wiring 2. In this case, the large portion 2a of the belt-like wiring 2 is also inclined so that the diagonal line coincides with the wiring direction.
With the above configuration, in comparison with the embodiment of FIG. 1, the LED elements 3 can be arranged with high density in the wiring direction of the belt-like wiring 2 and with high density in both the wiring direction of the belt-like wiring 2 and the direction perpendicular thereto. Can be implemented.

なお、上記実施例においては、基板にヒートシンクを当接させて冷却するものとしたが、基板に冷却風を当てるのみでＬＥＤ素子の冷却が図られる場合には、必ずしもヒートシンクを必要とはしない。   In the above embodiment, the heat sink is brought into contact with the substrate for cooling. However, when the LED element is cooled only by applying cooling air to the substrate, the heat sink is not necessarily required.

以上説明したように、本発明のＬＥＤ素子を用いた光源ユニットでは、基板上の帯状配線に、配線方向において大幅部と小幅部とが形成され、隣接する帯状配線間で前記大幅部と小幅部がそれぞれ対向するように配置されていて、ＬＥＤ素子が該帯状配線の大幅部上に配置されて、基板上の全体で千鳥状に配置されているので、特に、ＬＥＤ素子を帯状配線の配線方向と直交する方向で高密度に実装することができ、また、ＬＥＤ素子からの熱を基板に伝達することを抑制せずに、該ＬＥＤ素子の冷却を効果的に行えてその発光効率の低下を防止できるものである。   As described above, in the light source unit using the LED element of the present invention, the large portion and the small width portion are formed in the wiring direction in the strip-shaped wiring on the substrate, and the large portion and the small width portion are disposed between the adjacent strip-shaped wiring. Are arranged so as to face each other, and the LED elements are arranged on a large portion of the strip-like wiring, and are arranged in a staggered manner on the entire substrate, so that the LED elements are particularly arranged in the wiring direction of the strip-like wiring. The LED element can be effectively cooled without reducing the heat from the LED element being transmitted to the substrate, and the luminous efficiency can be reduced. It can be prevented.

１ 基板
２ 帯状配線
２ａ 大幅部
２ｂ 小幅部
３ ＬＥＤ素子
４ 上面電極
５ 下面電極
６ ワイヤー
７ ヒートシンク


DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Band-like wiring 2a Large part 2b Small width part 3 LED element 4 Upper surface electrode 5 Lower surface electrode 6 Wire 7 Heat sink


Claims (5)

基板上に複数の帯状配線が並列して形成され、
該帯状配線上に複数のＬＥＤ素子が配置されていて、同一の前記帯状配線上のＬＥＤ素子は、隣接する帯状配線にワイヤーを介して電気的に接続され、
前記ＬＥＤ素子は、基板上で全体として千鳥状に配置され、
ている光源ユニットにおいて、
前記帯状配線は、配線方向において大幅部と小幅部とが形成されていて、前記ＬＥＤ素子が該帯状配線の大幅部上に配置されていることを特徴とする光源ユニット。 A plurality of strip-shaped wires are formed in parallel on the substrate,
A plurality of LED elements are arranged on the strip-shaped wiring, and the LED elements on the same strip-shaped wiring are electrically connected to the adjacent strip-shaped wiring via a wire,
The LED elements are arranged in a staggered manner on the substrate as a whole,
In the light source unit
The strip-shaped wiring has a large portion and a small width portion formed in a wiring direction, and the LED element is disposed on the large portion of the strip-shaped wiring. 前記帯状電極の大幅部は、前記ＬＥＤ素子の下面に設けられて前記帯状配線に当接する下面電極よりも大幅に形成されていることを特徴とする請求項１に記載の光源ユニット。   2. The light source unit according to claim 1, wherein a large portion of the strip electrode is formed to be significantly larger than a bottom electrode provided on a bottom surface of the LED element and in contact with the strip wiring. 前記帯状電極の小幅部は、前記ＬＥＤ素子よりも小幅に形成されていることを特徴とする請求項１又は２に記載の光源ユニット。   The light source unit according to claim 1, wherein the narrow portion of the strip electrode is formed to be narrower than the LED element. 前記ＬＥＤ素子は正方形状であり、その一辺が、前記帯状配線の配線方向と平行に配置されていることを特徴とする請求項１〜３のいずれかに記載の光源ユニット。   4. The light source unit according to claim 1, wherein the LED element has a square shape, and one side of the LED element is arranged in parallel to a wiring direction of the strip-shaped wiring. 前記ＬＥＤ素子は正方形状であり、その対角線が前記帯状配線の配線方向に一致するように配置されていることを特徴とする請求項１〜３のいずれかに記載の光源ユニット。


The light source unit according to any one of claims 1 to 3, wherein the LED element has a square shape and is arranged so that a diagonal line thereof coincides with a wiring direction of the belt-like wiring.


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