JP2014027200A5 - - Google Patents
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- JP2014027200A5 JP2014027200A5 JP2012168191A JP2012168191A JP2014027200A5 JP 2014027200 A5 JP2014027200 A5 JP 2014027200A5 JP 2012168191 A JP2012168191 A JP 2012168191A JP 2012168191 A JP2012168191 A JP 2012168191A JP 2014027200 A5 JP2014027200 A5 JP 2014027200A5
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- JP
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- Prior art keywords
- conductive ink
- producing
- metal source
- substrate
- manufacturing
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 claims description 21
- 239000000126 substance Substances 0.000 claims description 13
- NDVLTYZPCACLMA-UHFFFAOYSA-N Silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 10
- 229910001923 silver oxide Inorganic materials 0.000 claims description 6
- 239000003085 diluting agent Substances 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N Benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 2
- 229960002130 Benzoin Drugs 0.000 claims description 2
- 240000008975 Styrax benzoin Species 0.000 claims description 2
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 2
- INXWLSDYDXPENO-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CO)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C INXWLSDYDXPENO-UHFFFAOYSA-N 0.000 claims description 2
- 235000019382 gum benzoic Nutrition 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 238000000206 photolithography Methods 0.000 claims description 2
- 229920002120 photoresistant polymer Polymers 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 230000001737 promoting Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
- 230000003287 optical Effects 0.000 claims 1
- 239000000976 ink Substances 0.000 description 26
- 238000010304 firing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Description
本発明における請求項１記載の発明は、以下の工程からなる導電性インクの製造方法であり、
（ａ）還元促進剤と光活性物質の混同物質を生成する
（ｂ）前記混合物質に対し、多価アルコールを混合し、中間体Ａを生成する
（ｃ）前記中間体Ａに対し、金属源を添加し導電性インクを精製する
（ｄ）前記導電性インクを撹拌し、金属源の粒径を調整する、
請求項２記載の発明は、光活性物質がベンゾイン型光活性物質であることを特徴とする、請求項１記載の導電性インクの製造方法であり、
請求項３記載の発明は、還元促進剤が、還元促進作用の他、感紫外線物質を併せ持つことを特徴とする請求項１又は２の何れか１項に記載の導電性インクの製造方法であり、
請求項４記載の発明は、還元促進剤が、ジペンタエリスリトールペンタアクリレートであることを特徴とする請求項１乃至３の何れか１項に記載の導電性インクの製造方法であり、
請求項５記載の発明は、還元希釈剤が多価アルコールであることを特徴とする請求項１乃至４の何れか１項に記載の導電性インクの製造方法であり、
請求項６記載の発明は、還元促進剤と光活性物質の重量混合比が１００：０．５乃至１００：５の範囲であることを特徴とする請求項１乃至５の何れか１項に記載の導電性インクの製造方法であり、
請求項７記載の発明は、中間体Ａと金属源の重量混合比が１：３であることを特徴とする請求項１乃至６の何れか１項に記載の導電性インクの製造方法であり、
請求項８記載の発明は、酸化銀を金属源とする導電性インクであって、
前記金属源の他、還元促進剤及び、光活性物質、還元希釈剤を含有することを特徴とする導電性インクであり、
請求項９記載の発明は、含有される金属源粉末の平均直径が３μｍ以下であることを特徴とする請求項１乃至７の何れか１項に記載の製造方法から製造された導電性インク、又は請求項８記載の導電性インクであり、
請求項１０記載の発明は、請求項１乃至７の何れか１項に記載の方法で製造された導電性インク、または請求項８、９の何れか１項に記載の導電性インクにより、回路を製造する方法であって、以下の工程からなることを特徴とする。
（ａ）基板上に所望の回路パターンの開口を有するステンシルを載置する
（ｂ）ステンシルを介して、導電性インクを基板上に転写する
（ｃ）ステンシルを基板上から取り外し、紫外線を照射して導電性インクを硬化させる
（ｄ）光硬化された導電性インクからなる回路パターンを、基板ごと熱焼成し、当該インクを固化させるとともに、含有される酸化銀を銀へと還元させる。
また、請求項１１記載の発明は、請求項１乃至７の何れか１項に記載の方法で製造された導電性インク、または請求項８、９の何れか１項に記載の導電性インクにより、回路を製造する方法であって、以下の工程からなることを特徴とする。
（ａ）フォトリソグラフィ法により、所望の回路パターンのトレンチをフォトレジストにより形成する。
（ｂ）トレンチに当該導電性インクを充填し、平坦化を行う
（ｃ）導電性インクに紫外線を照射して、硬化させる
（ｄ）光硬化された導電性インクからなる回路パターンを、基板ごと熱焼成し、当該インクを固化させるとともに、含有される酸化銀を銀へと還元させる。
また、請求項１２記載の発明は、熱焼成温度が２００℃乃至２５０℃であり、かつ熱焼成時間が１０分乃至１８０分であることを特徴とする、請求項１０又は１１の何れか１項に記載の回路製造方法である。
また、請求項１３記載の発明は、紫外線照射量が２５０ｍＪ以上である請求項１０又は１１の何れか１項に記載の回路製造方法である。
Invention of Claim 1 in this invention is a manufacturing method of the conductive ink which consists of the following processes,
(A) A mixture of a reduction accelerator and a photoactive substance is generated (b) A polyhydric alcohol is mixed with the mixed substance to generate an intermediate A (c) A metal source for the intermediate A (D) stirring the conductive ink to adjust the particle size of the metal source,
The invention according to claim 2 is the method for producing a conductive ink according to claim 1 , wherein the photoactive substance is a benzoin type photoactive substance.
The invention according to claim 3 is the method for producing a conductive ink according to any one of claims 1 and 2, wherein the reduction accelerator has an ultraviolet-sensitive substance in addition to the reduction promoting action. ,
Invention of Claim 4 is a manufacturing method of the conductive ink of any one of Claim 1 thru | or 3, wherein a reduction accelerator is dipentaerythritol pentaacrylate,
The invention according to claim 5 is the method for producing a conductive ink according to any one of claims 1 to 4, wherein the reducing diluent is a polyhydric alcohol.
Invention of claim 6, wherein the weight mixing ratio of the reduction promoter and a photoactive substance 100: 0.5 to 100: characterized in that it is a range of 5 according to any one of claims 1 to 5 A conductive ink manufacturing method of
The invention according to claim 7 is the method for producing a conductive ink according to any one of claims 1 to 6 , wherein the weight mixing ratio of the intermediate A and the metal source is 1: 3. ,
The invention according to claim 8 is a conductive ink using silver oxide as a metal source,
In addition to the metal source, a conductive ink characterized by containing a reduction accelerator, a photoactive substance, and a reducing diluent,
The conductive ink produced from the production method according to any one of claims 1 to 7, wherein the metal source powder contained in the invention according to claim 9 has an average diameter of 3 µm or less. Or a conductive ink according to claim 8,
According to a tenth aspect of the present invention, there is provided a circuit using the conductive ink produced by the method according to any one of the first to seventh aspects or the conductive ink according to any one of the eighth or ninth aspects. Is a method comprising the following steps.
(A) A stencil having a desired circuit pattern opening is placed on the substrate. (B) The conductive ink is transferred onto the substrate via the stencil. (C) The stencil is removed from the substrate and irradiated with ultraviolet rays. (D) The circuit pattern made of the photocured conductive ink is thermally baked together with the substrate to solidify the ink, and the contained silver oxide is reduced to silver .
An eleventh aspect of the present invention is based on the conductive ink produced by the method according to any one of the first to seventh aspects, or the conductive ink according to any one of the eighth and ninth aspects. A method of manufacturing a circuit, comprising the following steps.
(A) A trench having a desired circuit pattern is formed of a photoresist by photolithography.
(B) Fill the trench with the conductive ink and perform planarization. (C) Irradiate the conductive ink with ultraviolet rays to cure (d) A circuit pattern made of photocured conductive ink for each substrate. Heat-baking is performed to solidify the ink, and the contained silver oxide is reduced to silver .
The invention of claim 12, wherein is the thermal firing temperature is 200 ° C. to 250 ° C., and wherein the thermal firing time is 10 minutes to 180 minutes, either one of claims 10 or 11 it is a circuit method according to.
The invention according to claim 13 is the circuit manufacturing method according to any one of claims 10 and 11, wherein the ultraviolet irradiation amount is 250 mJ or more.
本発明により製造された導電インクは、厚膜細線を形成でき、その形状保持性に優れ、かつ高い導電性を有することから、プリンテッドエレクトロニクスを初めとした、導電性インクの印刷により電極や回路を形成する分野において、その製品の性能向上と低価格化に対して、格別の効果を有する。
The conductive ink produced according to the present invention can form a thick thin film wire, has excellent shape retention, and has high conductivity. Therefore, the printed ink and other conductive inks can be used to print electrodes and circuits. In the field of forming the product, it has a special effect on the performance improvement and price reduction of the product.
Claims (13)
（ａ）還元促進剤と光活性物質の混同物質を生成する
（ｂ）前記混合物質に対し、多価アルコールを混合し、中間体Ａを生成する
（ｃ）前記中間体Ａに対し、金属源を添加し導電性インクを精製する
（ｄ）前記導電性インクを撹拌し、金属源の粒径を調整する (A) Producing a mixed substance of a reduction accelerator and a photoactive substance (b) Mixing the mixed substance with a polyhydric alcohol to produce an intermediate A ( c) A metal source is added to the intermediate A to refine the conductive ink. (d) The conductive ink is stirred to adjust the particle size of the metal source.
前記金属源の他、還元促進剤及び、光活性物質、還元希釈剤を含有することを特徴とする導電性インク。 A conductive ink using silver oxide as a metal source,
A conductive ink containing a reduction accelerator, a photoactive substance, and a reducing diluent in addition to the metal source.
（ａ）基板上に所望の回路パターンの開口を有するステンシルを載置する
（ｂ）ステンシルを介して、導電性インクを基板上に転写する
（ｃ）ステンシルを基板上から取り外し、紫外線を照射して導電性インクを硬化させる
（ｄ）光硬化された導電性インクからなる回路パターンを、基板ごと熱焼成し、当該インクを固化させるとともに、含有される酸化銀を銀へと還元させる。 The conductive ink according to any one of claims 1 to any one the conductive ink produced by the method according to 7 or claim 8, 9, to a method of manufacturing a circuit, It consists of the following processes.
(A) A stencil having a desired circuit pattern opening is placed on the substrate. (B) The conductive ink is transferred onto the substrate via the stencil. (C) The stencil is removed from the substrate and irradiated with ultraviolet rays. (D) The circuit pattern made of the photocured conductive ink is thermally baked together with the substrate to solidify the ink, and the contained silver oxide is reduced to silver.
（ａ）フォトリソグラフィ法により、所望の回路パターンのトレンチをフォトレジストにより形成する。
（ｂ）トレンチに当該導電性インクを充填し、平坦化を行う
（ｃ）導電性インクに紫外線を照射して、硬化させる
（ｄ）光硬化された導電性インクからなる回路パターンを、基板ごと熱焼成し、当該インクを固化させるとともに、含有される酸化銀を銀へと還元させる。 The conductive ink according to any one of claims 1 to any one the conductive ink produced by the method according to 7 or claim 8, 9, to a method of manufacturing a circuit, It consists of the following processes.
(A) A trench having a desired circuit pattern is formed of a photoresist by photolithography.
(B) Fill the trench with the conductive ink and perform planarization. (C) Irradiate the conductive ink with ultraviolet rays to cure (d) A circuit pattern made of photocured conductive ink for each substrate. Heat-baking is performed to solidify the ink, and the contained silver oxide is reduced to silver.
The circuit manufacturing method according to claim 10, wherein the ultraviolet irradiation amount is 250 mJ or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012168191A JP5948583B2 (en) | 2012-07-30 | 2012-07-30 | Ultraviolet curable conductive ink, manufacturing method thereof, and circuit manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012168191A JP5948583B2 (en) | 2012-07-30 | 2012-07-30 | Ultraviolet curable conductive ink, manufacturing method thereof, and circuit manufacturing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014027200A JP2014027200A (en) | 2014-02-06 |
| JP2014027200A5 true JP2014027200A5 (en) | 2015-08-13 |
| JP5948583B2 JP5948583B2 (en) | 2016-07-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012168191A Active JP5948583B2 (en) | 2012-07-30 | 2012-07-30 | Ultraviolet curable conductive ink, manufacturing method thereof, and circuit manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5948583B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108925056A (en) * | 2018-07-31 | 2018-11-30 | 珠海元盛电子科技股份有限公司 | A kind of manufacturing method of multiple light courcess control printing PCB circuit |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4157468B2 (en) * | 2003-12-12 | 2008-10-01 | 日立電線株式会社 | Wiring board |
| JP5286649B2 (en) * | 2006-05-23 | 2013-09-11 | Ｄｉｃ株式会社 | Method for producing conductive film, conductive ink |
| KR100763837B1 (en) * | 2006-07-18 | 2007-10-05 | 삼성전기주식회사 | Manufacturing method of printed circuit board |
| JP5066885B2 (en) * | 2006-10-13 | 2012-11-07 | 東洋インキＳｃホールディングス株式会社 | Conductive ink, conductive circuit and non-contact type media |
| JP2009096962A (en) * | 2007-10-19 | 2009-05-07 | Jsr Corp | Inkjet printing ink, and manufacturing method of electrode |
-
2012
- 2012-07-30 JP JP2012168191A patent/JP5948583B2/en active Active
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