JP2014026970A5 - - Google Patents

Claims (8)

Having base material particles and a conductive layer disposed on the surface of the base material particles so as to be in contact with the base material particles,
The substrate particles, polymer der with a compound having at least one group of the polymerizable compound and the phosphoric acid group and phosphoric acid ester group Luke, or, the substrate particles, a phosphoric acid group and polymer der of a polymerizable compound having at least one group of the phosphoric acid ester group Ru, conductive particles. The conductive particle according to claim 1, wherein at least one group out of a phosphate group and a phosphate ester group is present inside the base particle.   The conductive particle according to claim 1 or 2, wherein the base particle and the conductive layer are chemically bonded via at least one group out of a phosphate group and a phosphate ester group. The electroconductive particle of any one of Claims 1-3 whose compression elastic modulus when compressed 30% is 1500 N / mm < ² > or more and 8000 N / mm < ² > or less.   The electroconductive particle of any one of Claims 1-4 whose compression recovery rate is 20% or more and 90% or less.   The electroconductive particle of any one of Claims 1-5 in which the said electroconductive layer which contact | connects the said base particle contains 50 weight% or more of nickel in 100 weight% of said electroconductive layers.   The electrically-conductive material containing the electroconductive particle of any one of Claims 1-6, and binder resin. A first connection target member;
A second connection target member;
A connecting portion connecting the first connection target member and the second connection target member;
A connection structure in which the connection portion is formed of the conductive particles according to any one of claims 1 to 6, or is formed of a conductive material including the conductive particles and a binder resin.