JP2014022441A - Light emitting device, light emitting module device, lighting device, and package substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device which achieves high heat radiation performance and high luminous efficiency.SOLUTION: A light emitting device includes: at least one light emitting element; a package body having at least one housing opening for housing the light emitting element at the mounting surface side on which the light emitting element is mounted; an electrode part electrically connected with the light emitting element; and heat radiation parts which are formed at the rear surface side positioned at the opposite side of the mounting surface side and radiate heat emitted from the light emitting element. The electrode part and the heat radiation parts are disposed at a peripheral region of an element corresponding region which corresponds to the light emitting element at the rear surface side.

Description

  The present invention relates to a light emitting device including a light emitting diode (LED) light emitting element, a light emitting module device using the light emitting device, an illumination device including the light emitting module device as a light source, and a package substrate used in the light emitting device.

  Conventionally, a light emitting diode module in which a terminal of an LED package that houses a light emitting element such as an LED is electrically connected to a pad of a mounting substrate is widely known. As a light emitting diode module provided with such an LED package, for example, a light emitting diode mounting structure of Patent Document 1 and a light emitting diode package module of Patent Document 2 have been proposed.

  The mounting structure of the light emitting diode of Patent Document 1 includes, for example, a light emitting diode made of a package that houses a light emitting element and a terminal connected to the light emitting element, a metal base member, and an insulation formed on the base member. A hard substrate having a layer and a pad formed on the insulating layer and electrically connected to the terminal. In the light emitting diode mounting structure of Patent Document 1, the terminal is connected to the pad, and a heat conducting member is provided between the back surface of the package and the hard substrate.

  The light emitting diode package module of Patent Document 2 includes, for example, a package substrate, a light emitting diode chip mounted on one surface of the package substrate, and an electrode formed on the other surface of the package substrate and electrically connected to the light emitting diode chip. A pad and a heat dissipating pad formed on the other surface of the package substrate and electrically insulated from the electrode pad are included.

JP 2006-1000068 A JP 2011-119732 A

  However, the mounting structure of the light emitting diode of Patent Document 1 and the light emitting diode package module of Patent Document 2 can dissipate heat generated by the light emitting element by the heat conducting member and the heat dissipation pad, but the light emitted from the light emitting element is the package substrate. And is absorbed by the heat conducting member and the heat dissipating pad, there is a problem that the luminous efficiency of the module is lowered.

  The present invention has been made in view of such problems, and an object thereof is to provide a light emitting device, a light emitting module device, a lighting device, and a package substrate having high heat dissipation and light emission efficiency.

  In order to achieve the above-described object, a light-emitting device of the present invention includes at least one light-emitting element, and a package body having at least one storage opening for storing the light-emitting element on a mounting surface side on which the light-emitting element is mounted. An electrode part electrically connected to the light emitting element, and a heat radiating part formed on the back side opposite to the mounting surface side to dissipate heat generated by the light emitting element. And the heat radiating portion is disposed in a region around a corresponding element corresponding region on the back surface side of the light emitting element.

  In order to achieve the above-described object, a light-emitting module device of the present invention includes any of the light-emitting devices described above, and a substrate on which the light-emitting device is mounted and electrically connected. .

  In order to achieve the above-described object, an illumination device of the present invention includes the above-described light emitting module and a heat sink connected to the light emitting module device.

  In order to achieve the above-described object, a package substrate of the present invention is a package substrate for mounting a light emitting element, and includes a storage opening for storing the light emitting element on a mounting surface side on which the light emitting element is mounted. A package body, an electrode part electrically connected to the light emitting element, and a heat radiating part that is formed on the back side opposite to the mounting surface side and radiates heat generated by the light emitting element, The electrode part and the heat radiating part are arranged in a peripheral area of a corresponding element corresponding area on the back surface side of the mounting area of the light emitting element.

  Therefore, in the light emitting device, the light emitting module device, the lighting device, and the package substrate according to the present invention, the electrode portion and the heat radiating portion are arranged in the peripheral region of the element corresponding region. The probability that the light reaching the back surface without being reflected is absorbed by the electrode portion and the heat radiating portion can be reduced. Moreover, in the light-emitting device, the light-emitting module device, the lighting device, and the package substrate according to the present invention, the heat radiation can be favorably performed since the heat-radiating portion is provided.

  According to the present invention, it is possible to realize a light emitting device, a light emitting module device, a lighting device, and a package substrate that can achieve both high heat dissipation and high light emission efficiency.

1 is a plan view of a light emitting device according to Example 1. FIG. It is a bottom view of the light-emitting device of FIG. It is a front view of the light-emitting device of FIG. It is a side view of the light-emitting device of FIG. It is sectional drawing of the light-emitting device which follows the VV line in FIG. It is sectional drawing of the light-emitting device which follows the VI-VI line in FIG. It is sectional drawing of the light-emitting device which follows the VII-VII line in FIG. It is sectional drawing which shows the light emitting module apparatus which concerns on Example 1 in the state corresponding to FIG. 7 is a bottom view of a light emitting device according to a modification of Example 1. FIG. 7 is a bottom view of a light emitting device according to a modification of Example 1. FIG. 7 is a bottom view of a light emitting device according to a modification of Example 1. FIG. 7 is a bottom view of a light emitting device according to a modification of Example 1. FIG. 7 is a bottom view of a light emitting device according to a modification of Example 1. FIG. 6 is a plan view of a light emitting device according to a modification of Example 1. FIG. It is sectional drawing of the light-emitting device which follows the XIV-XIV line | wire in FIG. 6 is a plan view of a light emitting device according to Example 2. FIG. It is a bottom view of the light-emitting device of FIG. It is a front view of the light-emitting device of FIG. It is a side view of the light-emitting device of FIG. It is sectional drawing of the light-emitting device which follows the XX-XX line in FIG. It is sectional drawing of the light-emitting device which follows the XXI-XXI line | wire in FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings based on the respective examples and modifications. In addition, this invention is not limited to the content demonstrated below, In the range which does not change the summary, it can change arbitrarily and can implement. In addition, the drawings used for explaining each embodiment and modification schematically show a package substrate, a light emitting device, or a light emitting module device according to the present invention, and are partially emphasized and expanded to deepen understanding. , Reduction, omission, and the like are performed, and there is a case where the scale and shape of each component member are not accurately represented. Furthermore, the various numerical values used in each embodiment and modification are only examples, and can be variously changed as necessary.

<Overall structure of light emitting device>
First, the structure of the light emitting device 1 and the package substrate 2 according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a plan view of a light emitting device 1 according to the present embodiment. FIG. 2 is a bottom view of the light emitting device 1 of FIG. FIG. 3 is a front view of the light emitting device 1 of FIG. FIG. 4 is a side view of the light emitting device 1 of FIG. FIG. 5 is a cross-sectional view of the light emitting device 1 taken along the line V-V in FIG. FIG. 6 is a cross-sectional view of the light emitting device 1 taken along the line VI-VI in FIG. FIG. 7 is a cross-sectional view of the light emitting device 1 along the line VII-VII in FIG. 1 to 7, one direction in the plan view (FIG. 1) of the light emitting device 1 is the X direction, the direction orthogonal to the X direction in the plan view is the Y direction, and the height direction of the light emitting device 1 is the Z direction. It is defined as

  As a schematic configuration, the light emitting device 1 includes a package substrate 2, an LED chip 3 that is a light emitting element mounted on the package substrate 2, and a wavelength conversion member 4 that covers the LED chip 3 and has a sealing function. . Therefore, in this embodiment, the light emitting device 1 mixes the light emitted from the LED chip 3 and the light obtained by converting the wavelength of the light emitted from the LED chip 3 to produce pseudo white light. It emits towards the outside.

  Below, each member which comprises the light-emitting device 1 is demonstrated in detail, and the operation | movement and effect of the light-emitting device 1 are demonstrated.

(Package substrate)
As can be seen from FIGS. 1 to 7, the package substrate 2 includes a package body 11 made of ceramics such as alumina (aluminum oxide). In particular, as shown in FIGS. 1, 5, and 6, the package body 11 has a side wall 11 c in which a storage opening 11 b for storing the LED chip 3 is formed on a flat bottom plate 11 a. Has a two-layer structure. And the storage opening part 11b is arrange | positioned so that it may be located in the mounting surface 11d side in which the LED chip 3 is mounted. The opening surface of the storage opening 11b (that is, the shape in the XY plane) is circular, and the overall shape is cylindrical. Note that the material of the package body 11 is not limited to ceramics, and for example, known package materials such as various resins and glass can be used. Moreover, these materials can be used in combination or in combination.

  In particular, as shown in FIGS. 1 and 6, power supply paths 15 a and 15 b are formed in the package body 11 to supply power to the electrodes of the LED chip 3 from the outside. The power supply paths 15a and 15b are made of a conductive material (for example, gold). Specifically, the power supply path 15a is formed of an internal electrode pad 12a, an external electrode pad 13a, and a wiring pattern 14a that connects the internal electrode pad 12a and the external electrode pad 13a. The power supply path 15b is formed by the internal electrode pad 12b, the external electrode pad 13b, and the wiring pattern 14b that connects the internal electrode pad 12b and the external electrode pad 13b.

  As can be seen from FIGS. 1, 6, and 7, the internal electrode pads 12a and 12b are formed at the interface between the bottom plate portion 11a and the side wall portion 11c, and a part of the internal electrode pads 12a and 12b is exposed at the bottom surface of the storage opening portion 11b. Yes. In the present embodiment, the planar shape of the internal electrode pads 12a and 12b (the shape in the XY plane) is a rectangle, and the number thereof is two, but is not limited to this. The number of chips 3 can be appropriately changed according to the configuration such as the number of chips 3 and the opening area of the storage opening 11b. The internal electrode pads 12a and 12b preferably have an exposed area as small as possible in order not to absorb the light emitted from the LED chip 3.

  As can be seen from FIGS. 2 to 6, the external electrode pads 13 a and 13 b are formed on the back surface 11 e of the package body 11. More specifically, the external electrode pads 13a and 13b are formed along the outer edge of the back surface 11e of the package body 11, and the shape in the XY plane is a rectangle. The shape of the external electrode pads 13a and 13b can be appropriately changed according to the shape of each terminal formed on the mounting substrate 42 (see FIG. 8) on which the light emitting device 1 is mounted.

  From the viewpoint of reducing the resistivity as the power supply paths 15a and 15b, it is preferable to increase the formation area of the external electrode pads 13a and 13b as much as possible. However, when the formation area of the power supply paths 15a and 15b is increased, the formation position of the external electrode pads 13a and 13b and the mounting position of the LED chip 3 are important from the viewpoint of light emission efficiency in the light emitting device 1. The relationship will be described later. Further, the formation positions of the external electrode pads 13 a and 13 b are not limited to the back surface 11 e of the package body 11, and may be formed on the side surface of the package body 11, for example.

  As can be seen from FIGS. 4 to 7, the wiring patterns 14a and 14b are formed between the bottom plate portion 11a and the side wall portion 11c so as to electrically connect the internal electrode pads 12a and 12b and the external electrode pads 13a and 13b. It is formed from the interface to the side surface of the package body 11. As shown in FIG. 4, the width of the wiring patterns 14a and 14b in the Y direction is the same as the width of the external electrode pads 13a and 13b in the Y direction. This is to reduce the resistivity of the power supply paths 15a and 15b.

  Further, as shown in FIGS. 2 to 6, a heat radiation pad 16 corresponding to the heat radiation portion of the present invention is formed on the back surface 11 e of the package body 11. Specifically, the heat dissipating pad 16 is formed so as to extend along the Y direction at the center of the back surface 11e in the X direction, and is parallel to the external electrode pads 13a and 13b. The heat dissipating pad 16 is provided to dissipate heat generated from the LED chip 3 to the outside of the light emitting device 1, and a material having excellent thermal conductivity (for example, gold) is used as the material. Further, in order to efficiently dissipate the heat generated from the LED chip 3 from the heat dissipation pad 16, it is preferable to increase the formation area of the heat dissipation pad 16 as much as possible. However, when the formation area of the heat dissipation pad 16 is increased, the formation position of the heat dissipation pad 16 and the mounting position of the LED chip 3 are important from the viewpoint of light emission efficiency in the light emitting device 1, and the positional relationship will be described later.

  Note that the shape of the heat dissipation pad 16 in the XY plane is not limited to a rectangle as shown in FIG. 2, and if the heat from the LED chip 3 can be sufficiently dissipated, for example, a plurality of heat dissipation pads 16 are provided on the heat dissipation pad 16. An opening may be provided. Such a shape of the heat dissipation pad 16 reduces the possibility that light emitted from the LED chip 3 is absorbed by the heat dissipation pad 16.

  The distance from the storage opening 11b of the package body 11 to the back surface 11e (that is, the thickness of the bottom plate portion 11a constituting the package body 11) is preferably 0.5 mm or more and 1.5 mm or less. The reason for adjusting the thickness of the bottom plate portion 11a within such a range is that when the thickness of the bottom plate portion 11a is 0.5 mm or less, the probability that the light emitted from the LED chip 3 is reflected from the package body 11 decreases. This is because the light emission efficiency of the light emitting device 1 is reduced. In addition, when the thickness of the bottom plate portion 11a is 1.5 mm or more, the heat generated from the LED chip 3 is not sufficiently diffused in the Z direction and does not reach the heat dissipation pad 16.

  From the above configuration, the package substrate 2 includes the package body 11, the power supply paths 15 a and 15 b, and the heat dissipation pad 16. Here, since the internal electrode pads 12a and 12b, the external electrode pads 13a and 13b, and the wiring patterns 14a and 14b of the power supply paths 15a and 15b are made of the same material, an interface is formed between the members. The power supply paths 15a and 15b are formed as one continuous member.

  The manufacturing method of the package substrate 2 is as follows. A ceramic raw material powder whose main raw material is an alumina material is pulverized and mixed together with an organic binder and an organic solvent, and then a plurality of green sheets are formed by casting. On one of the formed green sheets, the power supply paths 15a and 15b and the conductor that is the base of the heat radiation pad 16 are printed, and then gold is deposited on the conductor by a known plating technique or the like, and the power supply path 15a, 15b is formed. At this time, since a plurality of bottom plate portions 11a can be obtained from one green sheet, a plurality of power supply paths 15a and 15b are formed in the green sheet.

  Next, a plurality of openings corresponding to the storage openings 11b are formed in a green sheet different from the green sheet. Subsequently, the green sheet with the openings formed thereon is laminated on the green sheet on which the conductor is printed, and further fired, so that the two green sheets are integrally baked and solidified to form one ceramic body. To do. Then, the plurality of package substrates 2 are formed by dividing the ceramic body in which the power supply paths 15a and 15b are formed.

(LED chip)
In this embodiment, a purple LED chip that emits purple light having a peak wavelength of 410 nm is used as the LED chip 3. Specifically, as such an LED chip, for example, there is a GaN-based LED chip in which an InGaN semiconductor is used for a light emitting layer. Note that the type and emission wavelength characteristics of the LED chip 3 are not limited thereto, and various semiconductor light emitting elements such as LED chips can be used without departing from the gist of the present invention. In this embodiment, the peak wavelength of light emitted from the LED chip 3 is preferably in the wavelength range of 400 nm to 420 nm, and more preferably in the wavelength range of 405 nm to 415 nm. In place of the purple LED chip, another LED chip that emits ultraviolet light or a near-ultraviolet chip may be used.

  As can be seen from FIGS. 1, 5 and 6, four LED chips 3 are mounted in the center of the bottom surface of the storage opening 11b in 2 rows × 2 columns. For example, each LED chip 3 is bonded and fixed to the package body 11 using an adhesive (not shown) or the like. Moreover, as shown in FIG. 1, the p electrode 21 and the n electrode 22 are provided in the surface on the opposite side with respect to the surface which faces the bottom face of the storage opening part 11b of each LED chip 3. As shown in FIG. The two LED chips mounted in the X direction are electrically connected by a metal wire 23. More specifically, of the two LED chips 3 mounted side by side in the X direction, the n electrode 22 of the LED chip 3 positioned on the −X direction side and the LED chip 3 positioned on the + X direction side. The p electrode 21 is connected by a metal wire 23. Further, the four LED chips 3 are electrically connected to any one of the internal electrode pads 12 a and 12 b adjacent to each other through a metal wire 23. More specifically, the p electrode 21 of the LED chip 3 located on the −X direction side and the internal electrode pad 12a are connected by the metal wire 23, and the n electrode 22 and the internal electrode of the LED chip 3 located on the + X direction side. The pad 12a is connected to the metal wire 23.

  With the connection configuration described above, of the four LED chips 3, two LED chips juxtaposed in the X direction are connected in series between the internal electrode pads 12a and 12b. Also, the two LED chips connected in series on the + Y direction side and the two LED chips connected in series on the −Y direction side should be connected in parallel between the internal electrode pads 12a and 12b. become. The connection of the LED chip 3 is not limited to such a connection method, and a connection method such as only series connection or only parallel connection may be used.

  Here, the method of mounting the LED chip 3 on the package body 11 is not limited to the above-described method, and an appropriate method can be selected according to the type and structure of the LED chip 3. For example, the p electrode 21 and the n electrode 22 of the LED chip 3 may be bonded to the internal electrode pads 12a and 12b by metal bumps or soldering. In such a case, the LED chip 3 is placed so that the p-electrode 21 and the n-electrode 22 of the LED chip 3 face the bottom surface of the storage opening 11b.

(Wavelength conversion member)
As can be seen from FIGS. 1, 5, and 6, the wavelength conversion member 4 is formed in the storage opening 11 b of the package body 11 so as to fill the opening. The wavelength conversion member 4 is provided for wavelength conversion of violet light emitted from the LED chip 3. In the light emitting device 1 of the present embodiment, the violet light emitted from the LED chip 3 and the light emitted from the violet light after being wavelength-converted by the wavelength conversion member 4 are combined to produce a pseudo light that is a combined light. White light is emitted. The wavelength conversion member 4 is not limited to be provided so as to fill the storage opening 11b. For example, the wavelength conversion member 4 may be provided on any surface of a transparent substrate such as a glass plate installed in the opening of the storage opening 11b. The wavelength conversion member 4 may be applied, and the phosphor may be mixed with an organic substance such as a resin or an inorganic substance such as glass and solidified by heating or the like. The shape of the wavelength conversion member may be selected according to the purpose, but may be, for example, a plate shape or a dome shape.

  5 and 6, the wavelength conversion member 4 absorbs at least part of the violet light incident from the LED chip 3 and emits emitted light having a wavelength different from that of the violet light. And a base material 25 that holds the phosphor 24. In the light emitting device 1 of the present embodiment, the LED chip 3 that emits violet light is used as a light emitting element. Therefore, the violet light is wavelength-converted into blue light, green light, and red light to synthesize white light. Is possible. Therefore, the phosphor 24 in this embodiment absorbs violet light and excites it, and when returning to the ground state, the phosphor 24 emits blue light having a wavelength different from that of the violet light, the green phosphor that emits green light, and A red phosphor that emits red light is used.

  The emission peak wavelength of a specific blue phosphor is usually 420 nm or more, preferably 430 nm or more, more preferably 440 nm or more, usually less than 500 nm, preferably 490 nm or less, more preferably 480 nm or less, and even more preferably 470 nm or less. Particularly preferred are those in the wavelength range of 460 nm or less.

  The emission peak wavelength of a specific green phosphor is usually 500 nm or more, preferably 510 nm or more, more preferably 515 nm or more, and usually less than 550 nm, preferably 542 nm or less, more preferably 535 nm or less. Is preferred.

  The emission peak wavelength of a specific red phosphor is usually 570 nm or more, preferably 580 nm or more, more preferably 585 nm or more, and usually 780 nm or less, preferably 700 nm or less, more preferably 680 nm or less. Is preferred.

  As the base material 25, various resins such as silicone resins, epoxy resins and polycarbonate resins, or materials having translucency such as glass can be used. In this embodiment, for example, silicone resins are used. did. In this embodiment, the wavelength conversion member 4 is formed by kneading a phosphor 24 into a base material 25 that is a resin.

<Positional relationship between LED chip, external electrode pad and heat dissipation pad>
Next, the positional relationship between the LED chip 3, the external electrode pads 13a and 13b, and the heat dissipation pad 16 will be described in detail with reference to FIGS. 2, 5, and 6. FIG. 2 indicate the element corresponding region 31 in which the position of the LED chip 3 mounted on the mounting surface 11d side of the package body 11 is shown on the back surface 11e side, and the position of the storage opening 11b of the package body 11 on the back surface. This is the storage opening corresponding area 32 shown on the 11e side.

  As can be seen from FIG. 2, FIG. 5 and FIG. 6, the external electrode pads 13 a and 13 b and the heat dissipation pad 16 are arranged in a region around the element corresponding region 31. In particular, in the present embodiment, the external electrode pads 13a and 13b and the heat dissipation pad 16 are disposed only in a region outside the element formation region 31, and overlap (overlap) with the LED chip 3 in the Z direction. It is not formed in the position. Furthermore, the heat dissipation pad 16 is disposed between the element formation regions 31 corresponding to the LED chips 3. Due to the positional relationship between the LED chip 3 and the external electrode pads 13a and 13b and the heat dissipation pad 16, the light that is emitted from the LED chip 3 and reaches the back surface 11e without being reflected by the package body 11 is external. The probability of being absorbed by the electrode pads 13a and 13b and the heat radiation pad 16 can be reduced. By reducing such light absorption, the light emission efficiency of the light emitting device 1 can be improved.

  As can be seen from FIGS. 2, 5, and 6, the external electrode pads 13 a and 13 b are arranged in a region around the storage opening corresponding region 32. In particular, in this embodiment, the external electrode pads 13a and 13b are disposed only in the region outside the storage opening corresponding region 32, and are formed at positions overlapping the storage opening 11b in the Z direction. Absent. With such a structure, it is possible to further reduce the probability that light that reaches the back surface 11e without being reflected by the package body 11 is absorbed by the external electrode pads 13a and 13b. By further reducing such light absorption, the light emission efficiency of the light emitting device 1 can be further improved.

<Light emitting module device and lighting device>
Next, a light emitting module device 41 including the light emitting device 1 of the present embodiment will be described with reference to FIG. FIG. 8 is a cross-sectional view of the light emitting module device 41 in a state corresponding to FIG. The X direction and the Z direction in FIG. 8 are the same as those in FIG.

  As shown in FIG. 8, the light emitting module device 41 includes the light emitting device 1 described above and a mounting substrate 42 on which the light emitting device 1 is mounted. The mounting substrate 42 is preferably made of a material that reflects light. For example, the mounting substrate 42 may be composed of a substrate made of various ceramics, resins, glasses, metals such as aluminum, and the like. Further, the mounting substrate 42 can be used by combining or combining these materials. Further, the mounting substrate 42 may be formed of a material that reflects light on the surface of a transparent glass substrate made of a material that does not reflect light. Note that the number of light emitting devices 1 is not limited to one, and a plurality of light emitting devices 1 are normally mounted on the mounting substrate 42.

  The mounting substrate 42 is connected to the external electrode connection terminals 43a and 43b electrically connected to the external electrode pads 13a and 13b of the package substrate 2 and the heat dissipation pad 16 of the package substrate 2 on the mounting surface 42a. A heat dissipating pad terminal 44 is formed. Since the external electrode connection terminals 43a and 43b need to be electrically connected to the LED chip 3 via the external electrode pads 13a and 13b, they are made of a conductive material (for example, gold, silver, copper, or aluminum). Is formed. The heat dissipating pad terminal 44 is preferably made of a material for efficiently dissipating heat conducted from the heat dissipating pad 16 to the mounting substrate 42, and is made of, for example, a metal such as gold.

  In the light emitting module device 41 in a state where the light emitting device 1 is mounted on the mounting substrate 42, pseudo white light is emitted from the mounting surface 11d side of the package body 11. On the other hand, a part of the light based on the light emission of the LED chip 3 is not reflected by the package body 11 and is not absorbed by the external electrode pads 13a and 13b and the heat radiation pad 16, and the back surface 11e of the package body 11 is. Then, it is reflected on the mounting surface 42 a side of the mounting substrate 42, and enters the light emitting device 1 again without being reflected by the package body 11. Thus, part of the light incident on the inside of the light emitting device 1 again reaches the wavelength conversion member 4 and is converted into blue light, green light, or red light by the phosphor 24 constituting the wavelength conversion member 4. The light is converted, or passes through the wavelength conversion member 4 and is emitted from the mounting surface 11 d side of the package body 11.

  As described above, in the light emitting module device 41 of the present embodiment, the light emitted from the LED chip 3 and the blue light, the green light, or the red light that has been wavelength-converted by the phosphor 24 of the wavelength conversion member 4 are used. Since the light can be efficiently emitted to the outside, the light emitting module device 41 of the present embodiment has higher light emission efficiency than the conventional one.

  Such a light emitting module device 41 realizes an illuminating device having high luminous efficiency and high heat dissipation by appropriately connecting members constituting the illuminating device such as a heat sink, a reflector, a lens, and a power source (not shown). Can do. For example, as the lighting device, a reflector may be connected to the light emitting surface of the light emitting module device 41 (that is, the mounting surface 11d side of the package body 11), and a heat sink may be connected to the mounting substrate 42 of the light emitting module device 41.

<Effect of Example>
The light emitting device 1 according to the present embodiment includes four LED chips 3, a package body 11 having a storage opening 11b for storing the LED chip 3 on the mounting surface 11d side on which the LED chip 3 is mounted, and a mounting surface 11d side. The external electrode pads 13a and 13b are formed on the back surface 11e side opposite to the LED chip 3 and electrically connected to the LED chip 3, and the heat radiation pads 16 are formed on the back surface 11e side to dissipate heat generated by the LED chip 3. And. In such a light emitting device 1, the external electrode pads 13 a and 13 b and the heat dissipation pad 16 are arranged in a region around the corresponding element corresponding region 31 on the back surface 11 e side of the LED chip 3. Light that is emitted from the LED chip 3 and reaches the back surface 11e without being reflected by the package body 11 can be suppressed from being absorbed by the external electrode pads 13a and 13b and the heat dissipation pad 16. And in the light-emitting device 1 which concerns on a present Example, it becomes possible to thermally radiate the heat | fever which generate | occur | produces in LED chip 3 favorably, aiming at the improvement of luminous efficiency by reducing such light absorption.

  Further, in the light emitting device 1 according to the present embodiment, the external electrode pads 13a and 13b and the heat dissipation pad 16 are disposed only in the region outside the element corresponding region 31, and therefore the external electrode pads 13a and 13b and the heat dissipation pad 16 are disposed. It is possible to further reduce the light absorption in and further improve the light emission efficiency.

  In the light emitting device 1 according to the present embodiment, the distance from the bottom surface of the storage opening 11b of the package body 11 to the back surface 11e of the package body 11 (that is, the thickness of the bottom plate portion 11a of the package body 11) is 0.5 mm or more. It is 1.5 mm or less. By adjusting the thickness of the bottom plate portion 11a in such a range, the heat generated in the LED chip 3 is sufficiently diffused toward the heat radiating pad 16, and can be efficiently radiated through the heat radiating pad 16. And the fall of the luminous efficiency of light-emitting device 1 itself can be suppressed.

  In the light emitting device 1 according to the present embodiment, the external electrode pads 13 a and 13 b are arranged in a region around the corresponding storage opening corresponding region 32 on the back surface 11 e side of the storage opening 11 b of the package body 11. With such a configuration, light emitted from the LED chip 3 and reaching the back surface 11e without being reflected by the package body 11 is further suppressed from being absorbed by the external electrode pads 13a and 13b and the heat radiation pad 16, The luminous efficiency of the light emitting device 1 can be further improved.

  Since the light emitting module device 41 according to the present embodiment and the lighting device using the light emitting module device 41 as a light source include the light emitting device 1 according to the present embodiment, as in the effect of the light emitting device 1 according to the present embodiment, High heat dissipation and luminous efficiency will be provided.

  The package substrate 2 according to the present embodiment includes a package body 11 having a storage opening 11b that stores the LED chip 3 on the mounting surface 11d side on which the LED chip 3 is mounted, and a back surface that is opposite to the mounting surface 11d side. The external electrode pads 13a and 13b that are formed on the 11e side and are electrically connected to the LED chip 3 and the heat dissipation pads 16 that are formed on the back surface 11e side and dissipate heat generated by the LED chip 3 are provided. . In such a package substrate 2, the external electrode pads 13 a and 13 b and the heat radiating pad 16 are arranged in a region around the corresponding element corresponding region 31 on the back surface 11 e side of the mounting region of the LED chip 3. With such a configuration, the package substrate 2 according to the present embodiment can improve the heat dissipation and the light emission efficiency as well as the effect of the light emitting device 1.

<Modification>
The structure of the light-emitting device 1 described above is merely an example, and the structure and shape of various constituent members can be arbitrarily changed without changing the gist of the present invention. Hereinafter, modifications of the light emitting device and its constituent members will be described.

(Modification of LED chip and wavelength conversion member)
In the embodiment described above, the LED chip 3 that emits violet light is used as the light source of the light emitting device 1. However, if the white light can be emitted from the light emitting device 1, it is limited to the LED chip 3 that emits violet light. For example, a blue LED chip that emits blue light may be used. The specific emission peak wavelength of the blue LED chip is usually 430 nm or more, more preferably 440 nm or more, and usually less than 480 nm, more preferably 470 nm or less. In such a case, the wavelength conversion member 4 disperses and holds the yellow phosphor that absorbs light of the wavelength as excitation light and emits yellow light.

  The emission peak wavelength of a specific yellow phosphor is usually 530 nm or more, preferably 540 nm or more, more preferably 550 nm or more, and usually 620 nm or less, preferably 600 nm or less, more preferably 580 nm or less. Is preferred.

  In the above-described modification, the blue light emitted from the LED chip 3 and the yellow light emitted from the phosphor 24 that is a yellow phosphor are synthesized, and pseudo white light is emitted from the light emitting device 1. However, in order to adjust the color temperature of the white light to the low color temperature side, or to improve the color rendering of the white light, the yellow phosphor contained in the wavelength conversion member 4 is replaced with a red phosphor and / or A green phosphor may be added. Further, since yellow light is a combined light of red light and green light, the phosphor contained in the wavelength conversion member 4 may be replaced with a red phosphor and a green phosphor. In such a case, the blue light emitted from the LED chip 3, the red light emitted from the red phosphor, and the green light emitted from the green phosphor are synthesized, and simulated from the light emitting device 1. White light is emitted.

  Specific emission peak wavelengths of the green phosphor and the red phosphor are the same as those described above.

  Furthermore, the light emitted from the light emitting device 1 of the present embodiment is not limited to white light, and may emit colored light such as blue light, red light, and yellow light. In such a case, the light emitting element which radiate | emits each color may be used as the LED chip 3, and you may change a fluorescent substance suitably according to the characteristic of the LED chip 3 used for a light emitting element.

  In the wavelength conversion member 4 of the light emitting device 1 according to the above-described embodiment, only the phosphor 24 is dispersed and held in the base material 25 that is a resin, but the light diffusion member is included in the base material 25. It may be mixed. As the light diffusing member, for example, an inorganic light diffusing material or an organic light diffusing material can be used.

(Modification of heat dissipation pad)
In the above-described embodiment, the shape of the heat dissipation pad 16 in the XY plane is a rectangle, and the formation position extends in the Y direction between the element corresponding regions 31, but is limited to such a shape. Instead, for example, a heat dissipating pad having any one of the shapes shown in FIGS. 9 to 11 may be formed on the back surface 11 e of the package body 11. Below, the modification of the thermal radiation part of this invention is demonstrated, referring FIG. 9 thru | or FIG. 9 to 11 are bottom views of the light emitting device 1 shown in a state corresponding to FIG. In addition, since it is the same as that of the Example mentioned above about structures other than a thermal radiation part, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  In the modification according to FIG. 9, the heat dissipating pad 16a is formed in a mesh shape. The heat dissipation pad 16a does not overlap with the element corresponding region 31 in the XY plane, and the element corresponding region 31 is located in the opening portion of the heat dissipation pad 16a. Further, on the back surface 11e of the package body 11, the heat dissipation pad 16a is located between the external electrode pads 13a and 13b, and the heat dissipation pad 16a and the element corresponding region 31 are also arranged without overlapping. From the above, also in the modified example according to FIG. 9, the external electrode pads 13a and 13b and the heat dissipation pad 16a are disposed only in the region outside the element corresponding region 31, and thus the external electrode pads 13a and 13b and the heat dissipation pad are dissipated. It is possible to favorably dissipate heat generated in the LED chip 3 while further reducing light absorption in the pad 16a and improving light emission efficiency. Specifically, the heat generated in the LED chip 3 can be radiated better than in the first embodiment.

  In the modification according to FIG. 10, the heat radiation pad 16b is formed in a lattice shape. In the modification example shown in FIG. 10, similarly to the modification example shown in FIG. 9, the heat dissipating pad 16 b does not overlap the element corresponding region 31 in the XY plane, and the element corresponding region 31 is located in the opening portion of the heat dissipating pad 16 b. ing. Similarly to the modification according to FIG. 9, the heat radiation pad 16 a is located between the external electrode pads 13 a and 13 b on the back surface 11 e of the package body 11, and the heat radiation pad 16 a and the element corresponding region 31 do not overlap. Has been placed. From the above, also in the modified example in FIG. 10, the external electrode pads 13 a and 13 b and the heat dissipation pad 16 b are disposed only in the region outside the element corresponding region 31. It is possible to favorably dissipate the heat generated in the LED chip 3 while further reducing the light absorption in 16b and improving the light emission efficiency. Specifically, the heat generated in the LED chip 3 can be radiated better than in the first embodiment.

  In the modification according to FIG. 11, the heat dissipation pad 16 c extends between the element formation regions 31 in the X direction and the Y direction, and is formed in a cross shape. Also in the modification according to FIG. 11, the heat dissipation pad 16 c and the external electrode pads 13 a and 13 b are arranged without overlapping the element corresponding region 31 in the XY plane, similarly to the modifications according to FIGS. 9 and 10. From the above, also in the modification in FIG. 11, the external electrode pads 13a and 13b and the heat dissipation pad 16c are disposed only in the region outside the element corresponding region 31, and therefore the external electrode pads 13a and 13b and the heat dissipation pad are disposed. It is possible to favorably dissipate the heat generated in the LED chip 3 while further reducing light absorption at 16c and improving light emission efficiency. Specifically, the heat generated in the LED chip 3 can be radiated better than in the first embodiment.

  Further, in the above-described embodiment, the heat radiation pad 16 is also formed in the storage opening corresponding region 32, but is formed in a region around the storage opening corresponding region 32, similar to the external electrode pads 13 a and 13 b. May be. With reference to FIG. 12, the modification of such a thermal radiation part is demonstrated. FIG. 12 is a bottom view of the light emitting device 1 shown in a state corresponding to FIG. 2, and the configuration other than the heat radiating unit is the same as that of the above-described embodiment, and therefore, the same reference numerals are given. Description is omitted.

  In the modification according to FIG. 12, the two heat dissipating pads 16 d are formed in an arc shape along the outer periphery of the storage opening aspect region 32. Therefore, in the modification according to FIG. 12, the element corresponding region 31 and the storage opening corresponding region 32 are located so as to be surrounded by the external electrode pads 13a and 13b and the heat radiation pad 16d. As described above, when not only the external electrode pads 13a and 13b but also the heat dissipating pad 16 are arranged in the peripheral region of the storage opening corresponding region 32, the light emission efficiency in the light emitting device 1 is further improved as compared with the first embodiment. It becomes possible.

  Further, in the above-described embodiment, the heat radiation pad 16 is disposed only in the region outside the element corresponding region 31, but a part thereof may be disposed in the region inside the element corresponding region 31. With reference to FIG. 13, a modified example of such a heat radiating part will be described. FIG. 13 is a bottom view of the light-emitting device 1 shown in a state corresponding to FIG. 2, and the configuration other than the heat radiating unit is the same as that of the above-described embodiment. Description is omitted.

  In the modification according to FIG. 13, the shape of the heat dissipating pad 16e in the XY plane is substantially rectangular, and the heat dissipating pad 16e extends in the Y direction as a whole. The heat dissipating pad 16e also extends in the X direction near the center of the back surface 11e of the package body 11, and a part of the heat dissipating pad 16e reaches the inner region of the element corresponding region 32. Even in such a case, if light based on light emission of the LED chip 3 is hardly absorbed by the portion disposed in the inner region of the element corresponding region 31, the light emission efficiency is sufficiently higher than that of the conventional light emitting device. The heat generated in the LED chip 3 can be radiated favorably while reducing and improving the light emission efficiency. Specifically, the heat generated in the LED chip 3 can be radiated better than in the first embodiment.

  A part of the external electrode pads 13 a and 13 b as well as the heat radiating pad 16 e may be disposed in a region inside the element corresponding region 31. Similarly, a part of the external electrode pads 13 a and 13 b may be disposed in a region inside the storage opening corresponding region 32. Even in such a case, the light based on the light emission of the LED chip 3 is hardly absorbed by the external electrode pads 13a and 13b disposed in the region corresponding to the element corresponding region 31 or the storage opening corresponding region 32. The luminous efficiency can be sufficiently reduced as compared with the conventional light emitting device.

  And in the Example mentioned above, although the heat radiating part was provided as the heat radiating pad 16 only in the back surface 11e of the package main body 11, the heat radiating part of this invention is not limited to such a form. A modification of the heat dissipating part of the present invention will be described with reference to FIGS. FIG. 14 is a plan view (XY plan view) of a light emitting device 1 ′ according to a modification of the present embodiment. FIG. 15 is a cross-sectional view of the light emitting device 1 ′ taken along line XIV-XIV in FIG. 14. In addition, since it is the same as that of the Example mentioned above about structures other than a thermal radiation part, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  As shown in FIGS. 14 and 15, the light emitting device 1 ′ according to the modification includes a package substrate 2 ′ including a heat radiating body 51 that functions as a heat radiating portion of the present invention. The radiator 51 is formed from the back surface 11e of the package body 11 to the bottom surface of the storage opening 11b. That is, unlike the heat dissipating pad 16 according to the above-described embodiment, the heat dissipating body 51 is formed so as to penetrate the package body 11 and is exposed on the bottom surface of the opening accommodating portion 11b. Therefore, the heat radiator 51 is formed in a rectangular parallelepiped shape.

  In the present modification, since the heat dissipating body 51 that has better heat dissipation than the package body 11 extends to the vicinity of the LED chip 3, the heat generated in the LED chip 3 is further improved outside the light emitting device 1 ′. Can dissipate heat. Further, since the positional relationship between the radiator 51 and the LED chip 3 in the XY plane is the same as that in the above-described embodiment, the light-emitting device 1 ′ also has the same effect as that in the above-described embodiment in terms of light emission efficiency. However, the heat radiation performance is better than that of the light emitting device 1 of the above-described embodiment.

  In the first embodiment, the light emitting device 1 has one storage opening 11b, and the four LED chips 3 are mounted so as to be stored in the one storage opening 11b. The opening 11b may be composed of a plurality of openings. Hereinafter, the light emitting device 101 in the case where the storage opening is composed of two openings will be described as a second embodiment and will be described in detail with reference to FIGS. 16 to 21. FIG. 16 is a plan view of the light emitting device 101 according to the present embodiment. FIG. 17 is a bottom view of the light emitting device 101 of FIG. FIG. 18 is a front view of the light emitting device 101 of FIG. FIG. 19 is a side view of the light emitting device 101 of FIG. 20 is a cross-sectional view of the light-emitting device 101 taken along line XX-XX in FIG. FIG. 21 is a cross-sectional view of the light emitting device 101 taken along line XXI-XXI in FIG. 16 to FIG. 21, one direction in the plan view (FIG. 16) of the light emitting device 101 is the X direction, the direction orthogonal to the X direction in the plan view is the Y direction, and the height direction of the light emitting device 101 is the Z direction. It is defined as

<Overall structure of light emitting device>
As a schematic configuration, the light emitting device 101 includes a package substrate 102, an LED chip 103 that is a light emitting element mounted on the package substrate 102, and wavelength conversion members 104a and 104b that cover the LED chip 103 and have a sealing function. ing. Therefore, similarly to the light emitting device 1 according to the first embodiment, the light emitting device 101 mixes the light emitted from the LED chip 103 and the light obtained by converting the wavelength of the light emitted from the LED chip 103. The pseudo white light is emitted to the outside.

  Below, each member which comprises the light-emitting device 101 is demonstrated in detail, and the operation | movement and effect of the light-emitting device 101 are demonstrated.

(Package substrate)
As can be seen from FIGS. 16 to 21, the package substrate 102 includes a package body 111 made of ceramics such as alumina (aluminum oxide). In particular, as shown in FIGS. 16, 20, and 6, the package main body 111 has a side wall 111 c in which a storage opening 111 b is formed for storing the LED chip 103 on a flat bottom plate 111 a. It has a two-layer structure. The storage opening 111b includes a first opening 117 and a second opening 118 which are two openings having the same shape. The first opening 117 and the second opening 118 are juxtaposed on the mounting surface 111d side on which the LED chip 103 is mounted. The opening surfaces of the first opening 117 and the second opening 118 (that is, the shape in the XY plane) are elliptical. Note that various materials and combinations can be used as the material of the package body 111 as in the light emitting device 1 according to the first embodiment.

  As can be seen from FIGS. 16 to 21, the package body 111 is formed with power supply paths 115a, 115b, 115c, and 115d for supplying power to the electrodes of the LED chip 103 from the outside. The power supply path 115 (used when generically referring to 115a to 115d) is made of a conductive material (for example, gold). Specifically, the power supply path 115a is formed of an internal electrode pad 112a, an external electrode pad 113a, and a wiring pattern 114a that connects the internal electrode pad 112a and the external electrode pad 113a. Similarly, the power supply paths 115b to 115d are formed of internal electrode pads 112b to 112d, external electrode pads 113b to 113d, and wiring patterns 114b to 114d. The electrode portion according to the present invention corresponds to the external electrode pad 113 (used when generically referring to 113a to 113d).

  As can be seen from FIGS. 16 and 21, the internal electrode pad 112 (used when generically referring to 112a to 112d) is formed at the interface between the bottom plate portion 111a and the side wall portion 111c, and a part of the internal electrode pad 112b is stored in the storage opening portion 111b. It is exposed on the bottom surface. More specifically, the three internal electrode pads 112a and the three internal electrode pads 112b are exposed at the first opening 117, and the three internal electrode pads 112c and the three internal electrode pads 112d are the second opening 118. Is exposed. In the present embodiment, the planar shape of the internal electrode pad 112 (the shape in the XY plane) is a rectangle, and the total number thereof is 12, but the configuration is similar to the internal electrode pads 12a and 12b according to the first embodiment. It can be changed accordingly. Further, like the internal electrode pads 12a and 12b according to the first embodiment, it is preferable to reduce the exposed area as much as possible.

  As can be seen from FIGS. 17 to 20, the external electrode pad 113 is formed on the back surface 111 e of the package body 111. More specifically, each of the external electrode pads 113 a to 113 d is formed at the four corners of the back surface 111 e of the package body 111. The shape of the external electrode pad 113 on the back surface 111e is generally rectangular, but can be appropriately changed according to the shape of each terminal formed on the mounting substrate on which the light emitting device 101 is to be mounted. From the same viewpoint as the external electrode pads 13a and 13b according to the first embodiment, the position where the external electrode pad 113 is formed and the position where the LED chip 103 is mounted are important. The positional relationship will be described later.

  As can be seen from FIGS. 19 and 21, the wiring pattern 114 is formed from the interface between the bottom plate portion 111 a and the side wall portion 111 c so as to electrically connect the internal electrode pad 112 and the external electrode pad 113. It is formed over the side surface. More specifically, the wiring patterns 114a and 114d extend in the Z direction on the side surface of the package main body 111, and extend in the Y direction on the bottom plate portion 111a of the package main body 111, whereby the internal electrode pads 112a and 112d. Are electrically connected to the external electrode pads 113a and 113d. On the other hand, the wiring patterns 114b and 114c extend in the Z direction on the side surface of the package main body 111, first extend in the X direction on the bottom plate portion 111a of the package main body 111, and extend in the Y direction at the center in the X direction. By being present, the internal electrode pads 112b and 112c and the external electrode pads 113b and 113c are electrically connected. That is, the wiring patterns 114b and 114c are formed in a substantially L shape on the XY plane.

  Further, as shown in FIGS. 17 to 20, a heat radiation pad 116 corresponding to the heat radiation portion of the present invention is formed on the back surface 111 e of the package body 111. Specifically, the heat dissipating pad 116 is formed to extend along the Y direction at the center of the back surface 111e in the X direction. As shown in FIG. 18, the heat dissipating pad 116 is also formed on the side surface of the bottom plate portion 111 a constituting the package body 111. The heat dissipating pad 116 is provided to dissipate heat generated from the LED chip 103 to the outside of the light emitting device 101, and a material having excellent thermal conductivity (for example, gold) is used as the material. Further, from the same viewpoint as the heat dissipating pad 16 according to the first embodiment, the formation position of the heat dissipating pad 116 and the mounting position of the LED chip 103 are important. The positional relationship will be described later.

  Note that the shape of the heat dissipation pad 116 in the XY plane is not limited to a rectangle as shown in FIG. 17. If the heat from the LED chip 103 can be sufficiently dissipated, for example, a plurality of heat dissipation pads 116 are provided on the heat dissipation pad 116. An opening may be provided. With such a shape of the heat dissipation pad 116, the possibility that light emitted from the LED chip 103 is absorbed by the heat dissipation pad 116 is reduced.

  The distance from the storage opening 111b of the package body 111 to the back surface 111e (that is, the thickness of the bottom plate part 111a constituting the package body 111) is 0.5 mm or more and 1.5 mm or less for the same reason as in the first embodiment. Preferably there is.

  With the above configuration, the package substrate 102 includes the package body 111, the power supply path 115, and the heat dissipation pad 116. Since the internal electrode pad 112, the external electrode pad 113, and the wiring pattern 114 of the power supply path 115 are made of the same material as in the power supply path 15 of the first embodiment, there is an interface between the members. They are integrally formed without being formed, and each of the power supply paths 115 is formed as one continuous member.

  The manufacturing method of the package substrate 112 is different from that of the first embodiment only in the pattern for printing the conductor that is the base of the power supply path 115, and other manufacturing steps and manufacturing conditions are the same. Therefore, the description of the manufacturing method of the package substrate 112 is omitted.

(LED chip)
In this embodiment, an LED chip that emits violet light having a peak wavelength of 410 nm is used as the LED chip 103. Since the specific configuration of the LED chip 103 is the same as that of the LED chip 3 according to the first embodiment, the description thereof is omitted.

  Note that the type and emission wavelength characteristics of the LED chip 103 are not limited thereto, and various semiconductor light emitting elements such as LED chips can be used without departing from the gist of the present invention. For example, the LED chip 103 housed in the first opening 117 emits blue light, and the LED chip 103 housed in the second opening 118 emits red light or violet light. The peak wavelength of light emitted from the LED chip 103 accommodated in the 117 and the second opening 118 may be different. The wavelength of the light emitted from the LED chip 103 can be selected as appropriate depending on how the white light pseudo emitted from the light emitting device 101 is synthesized.

  As can be seen from FIGS. 16 and 20, six LED chips 103 are accommodated in each of the first opening 117 and the second opening 118. In each of the first opening 117 and the second opening 118, the three LED chips 103 are juxtaposed in a row in the Y direction, and the two LED chips 103 are not juxtaposed in the X direction. They are shifted in the Y direction. For example, each LED chip 103 is bonded and fixed to the package body 111 using an adhesive (not shown) or the like. In addition, as shown in FIG. 16, a p-electrode 121 and an n-electrode 122 are provided on the surface opposite to the surface facing the bottom surface of the storage opening 111 b of each LED chip 103. The p electrode 121 of the LED chip 103 is connected to the internal electrode pad 112a or the internal electrode pad 112c via the metal wire 123, and the n electrode 122 of the LED chip 103 is connected to the internal electrode pad 112b or the internal electrode pad 112c via the metal wire 123. It is connected to the internal electrode pad 112d.

  With the connection configuration described above, the LED chips 103 are connected in parallel in each of the first opening 117 and the second opening 118. In addition, the connection of the LED chip 103 is not limited to such a parallel connection, and a connection obtained by combining a series connection or a parallel connection and a series connection can be used.

  Here, as the method of mounting the LED chip 103 on the package body 111, an appropriate method can be selected in accordance with the type and structure of the LED chip 103 as in the light emitting device 1 according to the first embodiment.

(Wavelength conversion member)
As can be seen from FIGS. 16 and 20, the wavelength conversion member 104 a is formed in the first opening 117 of the package body 111 so as to fill the opening, and the wavelength conversion member 104 b is formed in the second opening 118 of the package body 111. Is formed so as to fill the opening. Since the wavelength conversion method, filling method, and installation method of the specific wavelength conversion members 104a and 104b are the same as those of the wavelength conversion member 4 according to the first embodiment, the description thereof is omitted.

  Further, as shown in FIG. 20, the wavelength conversion members 104a and 104b absorb the violet light incident from the LED chip 103 and emit phosphors 124a and 124b that emit outgoing light having a wavelength different from that of the violet light. It consists of base materials 125a and 125b for holding the bodies 124a and 124b. The phosphors 124a and 124b in this example absorb and excite violet light, and when returning to the ground state, the phosphors 124a and 124b emit blue light having a wavelength different from the violet light, the green phosphor that emits green light, and A red phosphor that emits red light is used. Here, the blue phosphor, the green phosphor, and the red phosphor are the same as those in the first embodiment, and the description of the emission peak wavelength and the like is omitted.

  As the base materials 125a and 125b, various resins or materials having translucency such as glass can be used. In the present embodiment, a silicone resin is used as in the first embodiment. Note that one of the base materials 125a and 125b may be a resin and the other may be a glass, and the base materials 125a and 125b may be made of different materials. In this embodiment, the wavelength conversion members 104a and 104b are formed by kneading phosphors 124a and 124b into base materials 125a and 125b that are resins.

  Here, the blending ratio of the blue phosphor, the green phosphor, and the red phosphor in the phosphor 124a is different from the blending ratio of the blue phosphor, the green phosphor, and the red phosphor in the phosphor 124b. Therefore, when violet light is emitted from the LED chip 103, white light having different characteristics such as color or color temperature is emitted from each of the first opening 117 and the second opening 118. Then, by emitting and synthesizing white light having different characteristics, pseudo white light that is synthesized light is emitted from the light emitting device 101. That is, in the light emitting device 101, the mixing ratio of the phosphors of the respective colors in the first opening 117 and the second opening 118 is adjusted to synthesize white light having different characteristics emitted from the storage opening 111b. Then, by adjusting the power supplied to the LED chip 103 housed in each opening, the synthesized light emitted from the light emitting device 101 can be dimmed and toned.

  The light emitted from the first opening 117 and the second opening 118 is not limited to the white light that is the combined light, and is obtained by combining blue light, green light, red light, or these. Colored synthetic light may be used. In such a case, for example, the phosphor 124a is excited by absorbing violet light, and emits blue light having a wavelength different from that of the violet light when returning to the ground state, and a green phosphor emitting green light. As the phosphor 124b, a blue phosphor that emits blue light having a wavelength different from that of the purple light when returning to the ground state by absorbing violet light and a red phosphor that emits red light are used. May be.

  In such a configuration, blue light and green light are emitted from the first opening 117, and blue light and red light are emitted from the second opening 118, and the color of pseudo white light or the like that is a composite light. Therefore, by adjusting the power supplied to the LED chip 103 accommodated in each opening, optical characteristics such as color and chromaticity of white light emitted from the light emitting device 101 can be easily obtained. It becomes possible to change. Further, with the above configuration, desired emitted light such as hue, saturation, and brightness can be easily obtained, and the degree thereof can be adjusted. Note that the light emitted from the first opening 117 and the second opening 118 may have different colors or the same color.

  Similarly to the modification of the first embodiment, when a blue LED chip that emits blue light is used for the LED chip 103, for example, the wavelength conversion member 104a absorbs the blue light as excitation light and emits yellow light. The emitted yellow phosphor is dispersed and held, and the wavelength conversion member 104b disperses and holds the yellow phosphor that emits yellow light by absorbing the blue light as excitation light and the red phosphor that emits red light. May be.

<Positional relationship between LED chip, external electrode pad and heat dissipation pad>
Next, the positional relationship between the LED chip 103, the external electrode pad 113, and the heat dissipation pad 116 will be described in detail with reference to FIGS. 17 indicates the element corresponding region 131 in which the position of the LED chip 103 mounted on the mounting surface 111d side of the package body 111 is shown on the back surface 111e side, and the position of the first opening 117 of the package body 111 on the back surface. The first opening corresponding region 132a shown on the 111e side and the second opening corresponding region 132b showing the position of the second opening 118 of the package body 111 on the back surface 111e side.

  As can be seen from FIG. 17 and FIG. 20, the external electrode pad 113 and the heat dissipation pad 116 are arranged in a region around the element corresponding region 131. In particular, in the present embodiment, the external electrode pad 113 and the heat dissipation pad 116 are disposed only in the region outside the element formation region 131 and are not formed at positions overlapping the LED chip 103 in the Z direction. . Further, the heat dissipation pad 116 is disposed between the element formation region 131 in the first opening corresponding region 132a and the element formation region 131 in the second opening corresponding region 132b. Due to the positional relationship between the LED chip 103, the external electrode pad 113, and the heat dissipation pad 116, the light emitted from the LED chip 103 and reaching the back surface 111e without being reflected by the package body 111 is external electrode pad. Absorption by the heat sink 113 and the heat radiating pad 116 can be suppressed. By reducing such light absorption, the light emission efficiency of the light emitting device 101 can be improved.

  Further, as can be seen from FIGS. 17 and 20, the external electrode pad 113 and the heat dissipation pad 116 are disposed in the area around the first opening corresponding area 132a and the second opening corresponding area 132b. In particular, in this embodiment, the external electrode pad 113 and the heat dissipation pad 116 are only regions outside the first opening corresponding region 132a and the second opening corresponding region 132b, and the first opening corresponding region 132a and the first opening corresponding region 132a. It arrange | positions between 2 opening part corresponding | compatible area | regions 132b. That is, the external electrode pad 113 and the heat dissipation pad 116 are not formed at positions overlapping the first opening 117 and the second opening 118 in the Z direction. With such a structure, it is possible to further suppress the light reaching the back surface 111e without being reflected by the package body 111 from being absorbed by the external electrode pad 113 and the heat dissipation pad 116. By further reducing such light absorption, the light emission efficiency of the light emitting device 101 can be further improved.

  In the present embodiment, the external electrode pad 113 and the heat dissipation pad 116 are disposed only in the region outside the first opening corresponding region 132a and the second opening corresponding region 132b. Similar to the external electrode pads 13 a and 13 b and the heat dissipation pad 16 according to the example (FIG. 13), a part of them may be arranged in the region inside the element corresponding region 131. That is, the external electrode pad 113 and the heat dissipation pad 116 may be formed so as to extend not only in the Y direction but also in the X direction, and a part thereof may be disposed so as to overlap the LED chip 103. Similarly, a part of the external electrode pad 113 and the heat dissipation pad 116 may be disposed in a region inside the first opening corresponding region 132a and the second opening corresponding region 132b. For example, as in the modification of the first embodiment (FIGS. 9 to 11), the external electrode pad 113 has a mesh shape, a lattice shape, or a cross shape, and a part of the heat dissipation pad 116 is the first opening. Although disposed in the region inside the corresponding region 132a and the second opening corresponding region 132b, the heat dissipation pad 116 and the element corresponding region 131 may be disposed so as not to overlap each other. Even in these cases, most of the light emitted from the LED chip 103 is caused by the portion disposed in the inner region of the element corresponding region 131, the first opening corresponding region 132a, or the second opening corresponding region 132b. If it is not absorbed, the light emission efficiency can be sufficiently reduced as compared with the conventional light emitting device.

  Similarly to the light emitting device 1 according to the first embodiment, the light emitting module device can be configured by mounting the light emitting device 101 according to the present embodiment on the mounting substrate. In addition, a lighting device can be configured using a light emitting module device including the light emitting device 101 as a light source. Such a light emitting module device and a lighting device can achieve the same effects as the light emitting module device 41 and the lighting device according to the first embodiment.

<Effect of Example>
The light emitting device 101 according to the present embodiment includes a package main body 111 having twelve LED chips 103, a storage opening 111b for storing the LED chip 103 on the mounting surface 111d side on which the LED chip 103 is mounted, and a mounting surface 111d. An external electrode pad 113 formed on the back surface 111e side opposite to the side and electrically connected to the LED chip 103; and a heat dissipation pad 116 formed on the back surface 111e side and radiating heat generated by the LED chip 103; It is equipped with. In such a light emitting device 101, the external electrode pads 113a and 113b and the heat dissipation pad 116 are arranged in the peripheral region of the corresponding element corresponding region 131 on the back surface 111e side of the LED chip 103. With such a configuration, Light that is emitted from the LED chip 103 and reaches the back surface 111e without being reflected by the package body 111 can be suppressed from being absorbed by the external electrode pad 113 and the heat dissipation pad 116. In the light emitting device 101 according to the present embodiment, it is possible to favorably dissipate heat generated in the LED chip 103 while improving light emission efficiency by reducing such light absorption.

  Further, in the light emitting device 101 according to the present embodiment, the external electrode pad 113 and the heat dissipation pad 116 are disposed only in the region outside the element corresponding region 131, and thus light absorption by the external electrode pad 113 and the heat dissipation pad 116 is performed. The emission efficiency can be further reduced and the luminous efficiency can be further improved.

  In the light emitting device 101 according to the present embodiment, the distance from the bottom surface of the storage opening 111b of the package body 111 to the back surface 111e of the package body 111 (that is, the thickness of the bottom plate portion 111a of the package body 111) is 0.5 mm or more. It is 1.5 mm or less. By adjusting the thickness of the bottom plate portion 111a in such a range, it is possible to efficiently dissipate heat generated in the LED chip 103, and to suppress a decrease in light emission efficiency of the light emitting device 101 itself.

  In the light emitting device 101 according to the present embodiment, the storage opening 111b includes a first opening 117 and a second opening 118, and each of the first opening 117 and the second opening 118 has six LED chips. 103 is housed, and the colors of light emitted from the first opening 117 and the second opening 118 are different from each other. In this way, since different colors of light are emitted from the two openings to obtain the pseudo white light that is the combined light, the power supplied to the LED chip 103 accommodated in each opening is adjusted. Thus, it is possible to easily change optical characteristics such as color and chromaticity of white light emitted from the light emitting device 101.

  In the light emitting device 101 according to the present embodiment, the external electrode pads 113 and the heat dissipation pads 116 correspond to the corresponding first opening corresponding regions 132 a on the back surface 111 e side of the first opening 117 of the package main body 111 and the first of the package main body 111. The second opening 118 is disposed in a region around the corresponding second opening corresponding region 132b on the back surface 111e side. With such a configuration, light that is emitted from the LED chip 103 and reaches the back surface 111e without being absorbed by the package body 111 is further suppressed from being absorbed by the external electrode pad 113 and the heat dissipation pad 116, thereby emitting light. The luminous efficiency of the device 101 can be further improved.

  The package substrate 102 according to the present embodiment includes a package main body 111 including a storage opening 111b that stores the LED chip 103 on the mounting surface 111d side on which the LED chip 103 is mounted, and a back surface that is opposite to the mounting surface 111d side. The external electrode pad 113 is formed on the 111e side and is electrically connected to the LED chip 103, and the heat release pad 116 is formed on the back surface 111e side and dissipates heat generated by the LED chip 103. In such a package substrate 102, the external electrode pads 113 and the heat dissipation pads 116 are arranged in a region around the corresponding element corresponding region 131 on the back surface 111 e side of the mounting region of the LED chip 103. With such a configuration, the package substrate 102 according to the present embodiment can improve heat dissipation and light emission efficiency as well as the effect of the light emitting device 101.

1, 1 ', 101 Light emitting device 2, 2', 102 Package substrate 3, 103 LED chip (light emitting element)
4, 104a, 104b Wavelength conversion member 11, 111 Package body 11a, 111a Bottom plate part 11b, 111b Storage opening part 11c, 111c Side wall part 11d, 111d Mounting surface 11e, 111e Back surface 12a, 12b, 112a, 112b, 112c, 112d Inside Electrode pads 13a, 13b, 113a, 113b, 113c, 113d External electrode pads (electrode part)
14a, 14b, 114a, 114b, 114c, 114d Wiring pattern 15a, 15b, 115a, 115b, 115c, 115d Power supply path 16, 16a, 16b, 16c, 16d, 16e, 116 Radiation pad (heat radiation part)
21, 121 p-electrode 22, 122 n-electrode 23, 123 Metal wire 24, 124a, 124b Phosphor 25, 125a, 125b Base material 31, 131 Device-corresponding region 32 Storage opening-corresponding region 41 Light-emitting module device 42 Mounting substrate 42a Mounting Surface 43a, 43b External electrode connection terminal 44 Radiation pad terminal 51 Heat dissipating body 117 First opening 118 Second opening 132a First opening corresponding region 132b Second opening corresponding region

Claims (14)

At least one light emitting element;
A package body having at least one storage opening for storing the light emitting element on a mounting surface side on which the light emitting element is mounted;
An electrode part electrically connected to the light emitting element;
A heat dissipating part that is formed on the back surface side opposite to the mounting surface side and dissipates heat generated by the light emitting element, and
The electrode unit and the heat radiating unit are disposed in a region around a corresponding element corresponding region on the back surface side of the light emitting element. The light emitting device according to claim 1, wherein the electrode portion is formed on the back surface side. The light emitting device according to claim 1, wherein the electrode part and the heat radiating part are disposed only in a region outside the element corresponding region. A plurality of the light emitting elements are stored in the storage opening of the package body,
The light-emitting device according to any one of claims 1 to 3, wherein the heat dissipation portion is disposed between the element corresponding regions. 5. The light emitting device according to claim 1, wherein a shape of the heat radiating portion is a mesh shape or a lattice shape. The said electrode part and the said heat radiating part are arrange | positioned in the area | region of the circumference | surroundings of the corresponding | compatible storage opening corresponding | compatible area | region in the said back surface side of the storage opening of the said package main body. 2. The light emitting device according to item 1. The light emitting device according to claim 6, wherein the electrode portion and the heat radiating portion are disposed only in a region outside the region corresponding to the storage opening. The light emitting device according to any one of claims 1 to 7, wherein the package body is made of ceramics. The light emitting device according to any one of claims 1 to 8, wherein a distance from a bottom surface of the storage opening of the package body to a back surface of the package body is 0.5 mm or more and 1.5 mm or less. . The light emitting device according to any one of claims 1 to 9, wherein the heat radiating portion extends from a back surface of the package body toward a bottom surface of the storage opening. The storage opening stores the light emitting element, and is arranged side by side with the first opening that emits light of a predetermined color based on light emission of the light emitting element, and stores the light emitting element. And a second opening that emits light of a predetermined color based on light emission of the light emitting element,
The heat dissipation portion is disposed between a corresponding first opening corresponding region on the back surface side of the first opening and a corresponding second opening corresponding region on the back surface side of the second opening. The light-emitting device according to claim 1, wherein the light-emitting device is a light-emitting device. A light emitting device according to any one of claims 1 to 11,
A light-emitting module device, comprising: a substrate on which the light-emitting device is mounted and electrically connected thereto. A light emitting module device according to claim 12,
A lighting device comprising: a heat sink connected to the light emitting module device. A package substrate for mounting a light emitting element,
A package body including a storage opening for storing the light emitting element on a mounting surface side on which the light emitting element is mounted;
An electrode part electrically connected to the light emitting element;
A heat dissipating part that is formed on the back surface side opposite to the mounting surface side and dissipates heat generated by the light emitting element, and
The electrode substrate and the heat radiating portion are arranged in a region around a corresponding device corresponding region on the back surface side of the mounting region of the light emitting device.

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