JP2014022406A - Light-emitting device - Google Patents

Light-emitting device Download PDF

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JP2014022406A
JP2014022406A JP2012156783A JP2012156783A JP2014022406A JP 2014022406 A JP2014022406 A JP 2014022406A JP 2012156783 A JP2012156783 A JP 2012156783A JP 2012156783 A JP2012156783 A JP 2012156783A JP 2014022406 A JP2014022406 A JP 2014022406A
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resin
light emitting
emitting device
light
region
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JP6024249B2 (en
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Yuta Oka
祐太 岡
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Nichia Chemical Industries Ltd
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Nichia Chemical Industries Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device which is smaller in size than conventional ones.SOLUTION: The light-emitting device includes a substrate, a plurality of light-emitting elements mounted on the substrate, a first resin surrounding the light-emitting elements, and a second resin separating a region surrounded by the first resin. The substrate has a recess below the first resin. A terminal end of the second resin is housed in the recess and is covered with the first resin.

Description

本発明は、発光装置に関する。   The present invention relates to a light emitting device.

従来、基板上に樹脂性枠を環状に設け、この樹脂性枠に囲まれた部分を樹脂性隔壁で2個以上の区域に仕切り、各区域に発光部をそれぞれ形成した発光装置が提案された(特許文献1参照)。   Conventionally, there has been proposed a light emitting device in which a resin frame is provided in an annular shape on a substrate, a portion surrounded by the resin frame is divided into two or more areas by a resin partition, and a light emitting portion is formed in each area. (See Patent Document 1).

特開2012−4519号公報JP 2012-4519 A

しかしながら、従来の発光装置は、まだまだ大型である。   However, the conventional light emitting device is still large.

そこで、本発明は、従来よりも小型の発光装置を提供することを目的とする。   Therefore, an object of the present invention is to provide a light emitting device that is smaller than the conventional one.

本発明によれば、上記課題は、次の手段により解決される。すなわち、基板と、前記基板上に実装された複数の発光素子と、前記複数の発光素子を囲む第1樹脂と、前記第1樹脂に囲まれた領域を隔てる第2樹脂と、を備えた発光装置であって、前記基板は、前記第1樹脂の下側に凹部を有し、前記第2樹脂は、その終端部が、前記凹部内に収容され且つ前記第1樹脂に被覆されている、ことを特徴とする発光装置である。   According to the present invention, the above problem is solved by the following means. That is, a light emitting device including a substrate, a plurality of light emitting elements mounted on the substrate, a first resin surrounding the plurality of light emitting elements, and a second resin separating a region surrounded by the first resin. In the apparatus, the substrate has a recess on the lower side of the first resin, and the second resin has a terminal portion accommodated in the recess and covered with the first resin. This is a light-emitting device.

本発明の実施形態に係る発光装置の概略斜視図である。1 is a schematic perspective view of a light emitting device according to an embodiment of the present invention. 本発明の実施形態に係る第1樹脂と第2樹脂との形成方法を説明する図である。It is a figure explaining the formation method of 1st resin and 2nd resin which concern on embodiment of this invention. 本発明の実施形態に係る発光装置と比較例に係る発光装置とを比較する図である。It is a figure which compares the light-emitting device which concerns on embodiment of this invention, and the light-emitting device which concerns on a comparative example.

以下に、添付した図面を参照しつつ、本発明を実施するための形態について説明する。   EMBODIMENT OF THE INVENTION Below, the form for implementing this invention is demonstrated, referring attached drawing.

図1は、本発明の実施形態に係る発光装置の概略斜視図である。   FIG. 1 is a schematic perspective view of a light emitting device according to an embodiment of the present invention.

図1に示すように、本発明の実施形態に係る発光装置10は、基板20と、基板20上に実装された複数の発光素子30と(発光素子30は、第1封止部材70及び第2封止部材80によって被覆されているため、図1中には現れていない。)、複数の発光素子30を囲む第1樹脂40と、第1樹脂40に囲まれた領域を隔てる第2樹脂50と、複数の発光素子30を被覆する第1封止部材70及び第2封止部材80と、基板20上に設けられた複数の発光素子30に接続される配線パターン90と、を備えている。第2樹脂50の終端部は、第1樹脂40に被覆されている。   As shown in FIG. 1, a light emitting device 10 according to an embodiment of the present invention includes a substrate 20, a plurality of light emitting elements 30 mounted on the substrate 20 (the light emitting element 30 includes a first sealing member 70 and a first sealing member 70). 2 is not covered in FIG. 1 because it is covered by the sealing member 80.) The first resin 40 surrounding the plurality of light emitting elements 30 and the second resin separating the region surrounded by the first resin 40 50, a first sealing member 70 and a second sealing member 80 covering the plurality of light emitting elements 30, and a wiring pattern 90 connected to the plurality of light emitting elements 30 provided on the substrate 20. Yes. The terminal portion of the second resin 50 is covered with the first resin 40.

ここで、基板20は、第1樹脂40の下側に凹部60を有しており、第2樹脂50の終端部は、凹部60内に収容されている。その理由は、次のとおりである。   Here, the substrate 20 has a recess 60 below the first resin 40, and a terminal portion of the second resin 50 is accommodated in the recess 60. The reason is as follows.

すなわち、一般に樹脂を塗布する場合には、ノズルから樹脂を吐出してこれを基板上に塗布することになる。しかしながら、樹脂は、一定の粘性を有するため、これを所定の位置に塗布し終えても、ノズルから直ちに切り離すことができない。このため、基板には余分な樹脂が付着してしまい、その分だけ、基板上の領域が無駄に使用されてしまう。   That is, in general, when a resin is applied, the resin is discharged from a nozzle and applied onto the substrate. However, since the resin has a certain viscosity, it cannot be immediately separated from the nozzle even after it has been applied in place. For this reason, excess resin adheres to the substrate, and an area on the substrate is wasted correspondingly.

そこで、本発明の実施形態に係る発光装置10では、基板20が第1樹脂40の下側に凹部60を有するものとした。このようにすれば、ノズルからの第2樹脂の吐出を止めた後で、第2樹脂50の終端部を凹部60内に収容させることができる(第2樹脂50の終端部は、凹部60の内面に付着する。)。   Therefore, in the light emitting device 10 according to the embodiment of the present invention, the substrate 20 has the recess 60 below the first resin 40. In this way, after stopping the discharge of the second resin from the nozzle, the terminal portion of the second resin 50 can be accommodated in the concave portion 60 (the terminal portion of the second resin 50 is formed in the concave portion 60). It adheres to the inner surface.)

したがって、従来であれば基板20上に長々と付着していた余分な樹脂を凹部60内に収容することが可能となるため、基板20を小型化して従来よりも小型の発光装置を提供することができる。なお、第2樹脂50の終端部は、凹部60内に収容されている限り、その一部(例えば、最先端部分)が凹部60内からはみ出していてもよい。   Accordingly, it is possible to store the excessive resin that has been adhered to the substrate 20 in the conventional case in the concave portion 60, so that the substrate 20 is downsized to provide a light emitting device that is smaller than the conventional one. be able to. In addition, as long as the terminal part of the 2nd resin 50 is accommodated in the recessed part 60, the one part (for example, most advanced part) may protrude from the inside of the recessed part 60.

以下、各部材の構成について詳細に説明する。   Hereinafter, the configuration of each member will be described in detail.

[基板]
基板20には、例えば、セラミックス(Al、AlN等)、あるいはフェノール樹脂、エポキシ樹脂、ポリイミド樹脂、BT樹脂(bismaleimide triazine resin)、ポリフタルアミド(PPA)樹脂などを用いることができる。
[substrate]
For the substrate 20, for example, ceramics (Al 2 O 3 , AlN, or the like), phenol resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), polyphthalamide (PPA) resin, or the like can be used.

基板20が有する凹部60の形状は、特に限定されるものではないが、凹部60は、その内面(例えば凹部60の底面)に突起(図示せず)を有することが好ましい。このようにすれば、突起による抵抗により、第2樹脂50の終端部をより確実に凹部60内に付着させることができるため、第1樹脂40の樹脂幅をさらに小さくすることができる。また、凹部60は、第2樹脂の終端部に対応する領域のみに設けることができる。上方からみた凹部60の外縁は、ノズルの外縁よりも大きければよく、その形状としては例えば四角形とすることができる。また、凹部の深さとしては、基板20の強度と第2樹脂の収容量とを考慮して、基板20の全体の厚さの20%以上80%以下、好ましくは30%以上70%以下、さらに好ましくは40%以上60%以下とすることができる。   The shape of the recess 60 included in the substrate 20 is not particularly limited, but the recess 60 preferably has a protrusion (not shown) on its inner surface (for example, the bottom surface of the recess 60). In this way, the end portion of the second resin 50 can be more reliably adhered in the recess 60 due to the resistance caused by the protrusion, so that the resin width of the first resin 40 can be further reduced. Moreover, the recessed part 60 can be provided only in the area | region corresponding to the terminal part of 2nd resin. The outer edge of the recessed part 60 seen from the top should just be larger than the outer edge of a nozzle, and can be made into a square, for example. Further, the depth of the concave portion is 20% or more and 80% or less, preferably 30% or more and 70% or less of the total thickness of the substrate 20 in consideration of the strength of the substrate 20 and the amount of the second resin. More preferably, it can be 40% or more and 60% or less.

[第1樹脂、第2樹脂]
第1樹脂40は、複数の発光素子30を囲む樹脂であり、第2樹脂50は、第1樹脂40に囲まれた領域を隔てる樹脂である。
[First resin, second resin]
The first resin 40 is a resin that surrounds the plurality of light emitting elements 30, and the second resin 50 is a resin that separates a region surrounded by the first resin 40.

第1樹脂40には、例えば、TiO、Al、ZrO、MgOなどの反射部材を含有したフェノール樹脂、エポキシ樹脂、BT樹脂、PPA樹脂、またはシリコン樹脂などの光反射性樹脂を用いることができる。 For the first resin 40, for example, a light-reflective resin such as a phenol resin, an epoxy resin, a BT resin, a PPA resin, or a silicon resin containing a reflective member such as TiO 2 , Al 2 O 3 , ZrO 2 , or MgO is used. Can be used.

第2樹脂50には、例えば、シリコン樹脂、エポキシ樹脂、またはユリア樹脂などの光反射性樹脂や透光性樹脂を用いることができる。   For the second resin 50, for example, a light-reflecting resin or a light-transmitting resin such as a silicon resin, an epoxy resin, or a urea resin can be used.

第2樹脂50に透光性樹脂を用いる場合には、第2樹脂50の終端部から光が漏れないよう、第1樹脂40に光反射性樹脂を用いてこれにより第2樹脂50の終端部を十分に被覆する必要がある。特に、透光性樹脂からなる第2樹脂50で複数の発光素子30の一部が被覆される場合は、発光素子30からの光が第2樹脂50内を伝わり易く、第2樹脂50の終端部が露出していると、駆動時において、そこから光が漏れて見た目を損ねてしまう。しかし、本発明の実施形態に係る発光装置10によれば、従来よりも樹脂幅が小さい第1樹脂40であるにも関わらず、第2樹脂50の終端部を十分に被覆することが可能になるので、見た目にも優れた発光装置10とすることができる。   When a translucent resin is used for the second resin 50, a light-reflective resin is used for the first resin 40 so that light does not leak from the end portion of the second resin 50, thereby the end portion of the second resin 50. Must be sufficiently coated. In particular, when a part of the plurality of light emitting elements 30 is covered with the second resin 50 made of a translucent resin, the light from the light emitting elements 30 is easily transmitted through the second resin 50, and the end of the second resin 50. If the portion is exposed, the light leaks from it and the appearance is impaired during driving. However, according to the light emitting device 10 according to the embodiment of the present invention, it is possible to sufficiently cover the end portion of the second resin 50 in spite of the first resin 40 having a smaller resin width than the conventional one. Therefore, the light emitting device 10 that is excellent in appearance can be obtained.

なお、第2樹脂50には、着色剤、光拡散剤などを含有させてもよい。また、第2樹脂50に透光性樹脂を用いれば、第2樹脂50において、複数の領域(後述する第1領域20a、第2領域20b、第3領域20c、及び第4領域20d)の光を混色させることもできる。   The second resin 50 may contain a colorant, a light diffusing agent, and the like. Further, if a translucent resin is used for the second resin 50, the light in a plurality of regions (a first region 20a, a second region 20b, a third region 20c, and a fourth region 20d, which will be described later) in the second resin 50. Can also be mixed.

第1樹脂40に囲まれた領域は、第2樹脂50によって隔てられた第1領域20a、第2領域20b、第3領域20c、及び第4領域20dを有している。なお、本発明の実施形態では、第1樹脂40で囲まれた領域の形状を円形としているが、四角形、六角形、八角形などの多角形とすることもできる。また、第1樹脂40に囲まれた領域が第2樹脂50により4つの領域に隔てられる形態について説明するが、第1樹脂40に囲まれた領域は、第2樹脂50により、2つの領域や3つの領域に隔てることもでき、また5つ以上の領域に隔てることもできる。   The region surrounded by the first resin 40 includes a first region 20a, a second region 20b, a third region 20c, and a fourth region 20d separated by the second resin 50. In the embodiment of the present invention, the shape of the region surrounded by the first resin 40 is a circle, but it may be a polygon such as a quadrangle, a hexagon, or an octagon. In addition, a mode in which the region surrounded by the first resin 40 is divided into four regions by the second resin 50 will be described. However, the region surrounded by the first resin 40 is divided into two regions by the second resin 50. It can be separated into three regions, or it can be separated into five or more regions.

[発光素子]
発光素子30は、第1領域20a、第2領域20b、第3領域20c、第4領域20d、及びこれらの領域間に生じた間隙(第2樹脂50が設けられた領域)に実装されている。発光素子30には、例えば、青色、青緑色、緑色、赤色などの光を発する各種発光ダイオードを用いることができる。
[Light emitting element]
The light emitting element 30 is mounted in the first region 20a, the second region 20b, the third region 20c, the fourth region 20d, and a gap formed between these regions (a region where the second resin 50 is provided). . As the light emitting element 30, for example, various light emitting diodes that emit light such as blue, blue green, green, and red can be used.

本発明の実施形態では、第1領域20a〜第4領域20dに実装された発光素子30に青色の光を発する発光素子を用い、各領域間に生じた間隙(第2樹脂50が設けられた領域)に実装された発光素子30には青緑色の光を発する発光素子を用いている。   In the embodiment of the present invention, a light-emitting element that emits blue light is used as the light-emitting element 30 mounted in the first region 20a to the fourth region 20d, and a gap (second resin 50 is provided) generated between the regions. A light emitting element that emits blue-green light is used as the light emitting element 30 mounted in the region.

第1領域20a及び第3領域20cに実装された発光素子30は第1封止部材70に含まれる第1蛍光体(図示せず)を励起するためのものであり、第2領域20b及び第4領域20dに実装された発光素子30は第2封止部材80に含まれる第2蛍光体(図示せず)を励起するためのものである。また、各領域間に生じた間隙(第2樹脂50が設けられた領域)に実装された発光素子30は演色性をさらに向上させるためのものである。   The light emitting elements 30 mounted in the first region 20a and the third region 20c are for exciting a first phosphor (not shown) included in the first sealing member 70, and the second region 20b and the second region 20c. The light emitting element 30 mounted in the four regions 20d is for exciting a second phosphor (not shown) included in the second sealing member 80. Further, the light emitting element 30 mounted in the gap (area where the second resin 50 is provided) generated between the areas is for further improving the color rendering properties.

なお、上記は一例であって、どの領域に何色の光を発する発光素子を実装するかは、発光装置全体としての輝度や演色性などを総合的に考慮して決めればよい。   Note that the above is an example, and in what region the light emitting element that emits light of which color may be mounted may be determined by comprehensively considering luminance, color rendering, and the like of the entire light emitting device.

[蛍光体、封止部材]
第1領域20a及び第3領域20cに実装された発光素子30は、第1蛍光体(図示せず)を含有する第1封止部材70によって封止され、第2領域20b及び第4領域20dに実装された発光素子30は、第2蛍光体(図示せず)を含有する第2封止部材80によって封止される。
[Phosphor, sealing member]
The light emitting elements 30 mounted in the first region 20a and the third region 20c are sealed by a first sealing member 70 containing a first phosphor (not shown), and the second region 20b and the fourth region 20d. The light emitting element 30 mounted on is sealed with a second sealing member 80 containing a second phosphor (not shown).

なお、例えば、第1蛍光体(図示せず)としては黄色に発光するYAG系蛍光体を用い、第2蛍光体(図示せず)としては赤色に発光するCASN系蛍光体を用いることができる。このようにすれば、一領域に発光色の異なる複数の蛍光体を混在しないため、蛍光体の二重励起が抑制され、輝度の高い発光装置を提供することが可能となる。また、発光装置全体として発光色の異なる2種の蛍光体(黄色と赤色)を用いているので、一定以上の演色性を得ることができる発光装置を提供することができる。   For example, a YAG phosphor that emits yellow light can be used as the first phosphor (not shown), and a CASN phosphor that emits red light can be used as the second phosphor (not shown). . In this way, since a plurality of phosphors having different emission colors are not mixed in one region, double excitation of the phosphors is suppressed, and a light emitting device with high luminance can be provided. Further, since two types of phosphors (yellow and red) having different emission colors are used as the entire light emitting device, it is possible to provide a light emitting device capable of obtaining a certain color rendering property.

第1封止部材70や第2封止部材80の封止部材には、シリコン樹脂、エポキシ樹脂、またはユリア樹脂などを用いることができる。なお、これらの封止部材には、着色剤、光拡散剤などを含有させてもよい。また、第1封止部材70と第2封止部材80とには、異なる種類の封止部材を用いてもよい。   Silicon resin, epoxy resin, urea resin, or the like can be used as the sealing member of the first sealing member 70 or the second sealing member 80. In addition, you may make these sealing members contain a coloring agent, a light-diffusion agent, etc. Different types of sealing members may be used for the first sealing member 70 and the second sealing member 80.

[配線パターン]
配線パターン90としては、Auなどを用いることができる。
[Wiring pattern]
As the wiring pattern 90, Au or the like can be used.

[製造方法]
図2は、本発明の実施形態に係る第1樹脂と第2樹脂との形成方法を説明する図である。
[Production method]
FIG. 2 is a diagram illustrating a method for forming the first resin and the second resin according to the embodiment of the present invention.

(第1工程)
まず、図2(1)で示すように、第2樹脂50を吐出するノズル100を、第1樹脂40で囲まれる予定の領域の内側から外側に向かって、基板20から一定の距離を保ちつつ移動させる。これにより、第2樹脂50が第1樹脂40で囲まれる予定の領域の内側から外側に向かって塗布される。
(First step)
First, as shown in FIG. 2A, the nozzle 100 that discharges the second resin 50 is kept at a certain distance from the substrate 20 from the inside to the outside of the region that is to be surrounded by the first resin 40. Move. As a result, the second resin 50 is applied from the inside to the outside of the region that is to be surrounded by the first resin 40.

(第2工程)
次に、図2(2)で示すように、ノズル100からの第2樹脂50の吐出を凹部60の上方で止める。
(Second step)
Next, as shown in FIG. 2B, the discharge of the second resin 50 from the nozzle 100 is stopped above the recess 60.

(第3工程)
次に、図2(3)、(4)、(5)で示すように、余分な第2樹脂50を凹部60内に収容せしめ(余分な第2樹脂50は、凹部60の内面に付着する。)、第2樹脂50をノズル100から切り離す。この際、第2樹脂50が凹部60内に付着しやすいように、ノズルを一旦凹部底面付近まで降下させることが好ましい。なお、凹部60の外側の側面が傾斜面61を有するものとすれば、基板20に反りなどが生じてノズル100が凹部60の側面に接触した場合においても、ノズル100の変形や破損などを緩和することができる。
(Third step)
Next, as shown in FIGS. 2 (3), (4), and (5), the excess second resin 50 is accommodated in the recess 60 (the excess second resin 50 adheres to the inner surface of the recess 60). ), The second resin 50 is separated from the nozzle 100. At this time, it is preferable that the nozzle is once lowered to the vicinity of the bottom surface of the recess so that the second resin 50 easily adheres to the recess 60. If the outer side surface of the recess 60 has the inclined surface 61, even when the substrate 20 is warped and the nozzle 100 contacts the side surface of the recess 60, the deformation or breakage of the nozzle 100 is alleviated. can do.

(第4工程)
そして、第1工程から第3工程を繰り返すことによって複数の第2樹脂50を基板20上に塗布した後(この際、複数の第2樹脂50の始端部は繋げる。)、図2(6)で示すように、第1樹脂40を基板20上に塗布して、第1樹脂40により第2樹脂50の終端部を被覆する。
(4th process)
And after apply | coating the several 2nd resin 50 on the board | substrate 20 by repeating a 3rd process from a 1st process (At this time, the start end part of the several 2nd resin 50 is connected), FIG. 2 (6). As shown, the first resin 40 is applied onto the substrate 20, and the terminal portion of the second resin 50 is covered with the first resin 40.

[比較]
図3は、本発明の実施形態に係る発光装置と比較例に係る発光装置とを比較する図であり、図3(a)は本発明の実施形態に係る発光装置を示し、図3(b)は比較例に係る発光装置を示す。
[Comparison]
FIG. 3 is a diagram comparing the light emitting device according to the embodiment of the present invention and the light emitting device according to the comparative example, and FIG. 3A shows the light emitting device according to the embodiment of the present invention, and FIG. ) Shows a light emitting device according to a comparative example.

図3で示すように、本発明の実施形態に係る発光装置(a)では、第2樹脂50の終端部が凹部60内に収容されているのに対し、比較例に係る発光装置(b)では、第2樹脂50の終端部が基板20上に長々と付着されている。   As shown in FIG. 3, in the light emitting device (a) according to the embodiment of the present invention, the terminal portion of the second resin 50 is accommodated in the recess 60, whereas the light emitting device (b) according to the comparative example. Then, the terminal portion of the second resin 50 is adhered to the substrate 20 for a long time.

本発明の実施形態に係る発光装置(a)によれば、比較例に係る発光装置(b)において余分な樹脂が長々と付着している領域Sを削減することができるため、基板20を小型化して小型の発光装置を提供することができる。   According to the light emitting device (a) according to the embodiment of the present invention, it is possible to reduce the region S where excessive resin is adhered to the light emitting device (b) according to the comparative example. A small light-emitting device can be provided by downsizing.

以上、本発明の実施形態について説明したが、これらの説明は、本発明の一例に関するものであり、本発明は、これらの説明によって何ら限定されるものではない。   As mentioned above, although embodiment of this invention was described, these description is related with an example of this invention, and this invention is not limited at all by these description.

10 発光装置
20 基板
20a 第1領域
20b 第2領域
20c 第3領域
20d 第4領域
30 発光素子
40 第1樹脂
50 第2樹脂
60 凹部
61 傾斜面
70 第1封止部材
80 第2封止部材
90 配線パターン
100 ノズル
DESCRIPTION OF SYMBOLS 10 Light-emitting device 20 Board | substrate 20a 1st area | region 20b 2nd area | region 20c 3rd area | region 20d 4th area | region 30 Light-emitting element 40 1st resin 50 2nd resin 60 Recess 61 Inclined surface 70 1st sealing member 80 2nd sealing member 90 Wiring pattern 100 Nozzle

Claims (5)

基板と、前記基板上に実装された複数の発光素子と、前記複数の発光素子を囲む第1樹脂と、前記第1樹脂に囲まれた領域を隔てる第2樹脂と、を備えた発光装置であって、
前記基板は、前記第1樹脂の下側に凹部を有し、
前記第2樹脂は、その終端部が、前記凹部内に収容され且つ前記第1樹脂に被覆されている、
ことを特徴とする発光装置。
A light emitting device comprising: a substrate; a plurality of light emitting elements mounted on the substrate; a first resin that surrounds the plurality of light emitting elements; and a second resin that separates a region surrounded by the first resin. There,
The substrate has a recess on the lower side of the first resin,
The second resin has a terminal portion housed in the recess and covered with the first resin.
A light emitting device characterized by that.
前記第1樹脂は光反射性樹脂であり、前記第2樹脂は透光性樹脂である、ことを特徴とする請求項1に記載の発光装置。   2. The light emitting device according to claim 1, wherein the first resin is a light reflecting resin, and the second resin is a light transmitting resin. 前記複数の発光素子の一部は、前記第2樹脂によって被覆される、ことを特徴とする請求項2に記載の発光装置。   3. The light emitting device according to claim 2, wherein a part of the plurality of light emitting elements is covered with the second resin. 前記凹部は、その内面に突起を有する、ことを特徴とする請求項1〜請求項3のいずれか1項に記載の発光装置。   The light emitting device according to claim 1, wherein the concave portion has a protrusion on an inner surface thereof. 前記第1樹脂に囲まれた領域は、前記第2樹脂によって隔てられた第1領域と第2領域とを有し、
前記第1領域に実装された発光素子は、第1蛍光体を含有する第1封止部材によって封止され、
前記第2領域に実装された発光素子は、第2蛍光体を含有する第2封止部材によって封止される、
ことを特徴とする請求項1〜請求項4のいずれか1項に記載の発光装置。
The region surrounded by the first resin has a first region and a second region separated by the second resin,
The light emitting device mounted in the first region is sealed by a first sealing member containing a first phosphor,
The light emitting device mounted in the second region is sealed by a second sealing member containing a second phosphor.
The light-emitting device according to claim 1, wherein the light-emitting device is a light-emitting device.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011108744A (en) * 2009-11-13 2011-06-02 Sharp Corp Light-emitting device, and method for producing the same
JP2012004519A (en) * 2010-05-17 2012-01-05 Sharp Corp Light emitting device and illumination device
JP2012124364A (en) * 2010-12-09 2012-06-28 Dainippon Printing Co Ltd Lead frame or substrate for led and method of manufacturing the same, and semiconductor device and method of manufacturing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011108744A (en) * 2009-11-13 2011-06-02 Sharp Corp Light-emitting device, and method for producing the same
JP2012004519A (en) * 2010-05-17 2012-01-05 Sharp Corp Light emitting device and illumination device
JP2012124364A (en) * 2010-12-09 2012-06-28 Dainippon Printing Co Ltd Lead frame or substrate for led and method of manufacturing the same, and semiconductor device and method of manufacturing the same

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