JP2014017133A - Socket for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for an electronic component with excellent productivity.SOLUTION: A socket 100 for an electronic component comprises: shield plates 1 each made of a metal plate piece; a ground terminal member 2 which can be brought into contact with a ground terminal GT of the electronic component serving as an inspection object and is used for grounding, and which can be connected to a grounding pad of a board; and a signal terminal member 3 which can be brought into contact with a signal terminal ST of the electronic component serving as the inspection object and is not used for grounding, and which can be connected to a signal pad of the board. The shield plates 1 are arranged in a plurality of pieces in such a manner that their surfaces are opposed to one another in parallel. The ground terminal member 2 alone or the signal terminal member 3 alone, or a combination of the ground terminal member 2 and the signal terminal member 3 are aligned in a plurality of pieces in a line so as to form a contact bar 10. The contact bar 10 is arranged between the shield plates 1.

Description

  The present invention relates to an electronic component socket, and more particularly to an electronic component socket with good productivity.

  In recent years, when mounting electronic components such as Central Processing Unit (hereinafter referred to as CPU) and Micro Processing Unit (hereinafter referred to as MPU) on various substrates, the electronic components are not mounted directly on the substrate. In many cases, a component socket is mounted and connected to a board via an electronic component socket. The CPU and MPU have a large number of electrode terminals, and the electronic component socket has a large number of terminal members corresponding to the electrode terminals of the CPU and MPU. Thus, when producing a socket for an electronic component having a large number of terminal members, it is required to efficiently incorporate a large number of terminal members to increase productivity. As such an electronic component socket, an electronic component socket described in Patent Document 1 below is known.

  Hereinafter, the electronic component socket described in Patent Document 1 will be described with reference to FIG. FIG. 14 is a cross-sectional view showing the structure of a socket for electronic components described in Patent Document 1.

  In the socket SO for electronic parts described in Patent Document 1, a plurality of through holes HO penetrating in the thickness direction are provided in the metal block MB, and the contact probe including at least a ground contact probe GC in the through hole HO. CP is provided and fixed by presser plate BO. The through hole HO into which the ground contact probe GC is inserted has a bent portion NS on its side wall, not linear, along the axial direction. At least in the vicinity of the bent portion NS, the through hole HO is connected to the ground contact probe GC. The inner wall of the through hole HO is formed to be directly electrically connected.

JP 2010-237133 A

  However, the socket for electronic parts SO needs to process a plurality of through holes HO one by one in the metal block MB, and further insert a contact probe CP one by one into the plurality of through holes HO. It is a structure that is difficult to improve. This invention solves the subject mentioned above and provides the socket for electronic components with good productivity.

  In the electronic component socket according to claim 1, the shield plate made of a metal plate piece and the ground terminal of the electronic component which is an object to be inspected can be contacted and connected to the ground pad of the substrate. A ground terminal member to be obtained, and a signal terminal member that can contact a signal terminal of an electronic component that is an object to be inspected and that can be connected to a signal pad of a substrate without being grounded, and the shield plate is Plural pieces are arranged in a state where the surfaces face each other in parallel, only the ground terminal member, only the signal terminal member, or a mixture of the ground terminal member and the signal terminal member in a row. A plurality of contact bars are formed side by side, and the contact bars are arranged between the shield plates.

  The electronic component socket according to claim 2 is characterized in that the ground terminal member is electrically connected to the shield plate and grounded.

  4. The electronic component socket according to claim 3, wherein the ground terminal member has a contact portion that can contact a ground terminal of the electronic component on one end side, and a protrusion that can contact the shield plate on the other end side. And the protrusion is grounded by conducting with the shield plate.

  5. The electronic component socket according to claim 4, wherein the signal terminal member has the same shape as the ground terminal member, and a portion of the shield plate corresponding to the protruding portion of the signal terminal member is deleted. A portion is provided, and the protruding portion is not in contact with the shield plate.

  The electronic component socket according to claim 5 is characterized in that the missing portion of the shield plate is a through hole.

  7. The electronic component socket according to claim 6, wherein the signal terminal member has the same shape as the ground terminal member, and the shield plate has an insulation treatment at a position corresponding to the protruding portion of the signal terminal member. And the protrusion is not electrically connected to the shield plate.

  8. The electronic component socket according to claim 7, wherein the ground terminal member includes a first terminal and a second terminal that are electrically connected, and the first terminal is connected to a ground terminal of the electronic component on one end side. A second projecting portion that can contact the shield plate on one end side, and a second projecting portion that can contact the shield plate on one end side. And the first protrusion and the second protrusion are connected to the shield plate and grounded.

  9. The electronic component socket according to claim 8, wherein the second projecting portion has a tip end portion on one end side of the second terminal divided into two branches, and each tip end portion on one end side of the second terminal divided into two branches. Is formed to extend toward the shield plate disposed at the closest position to each, and the distance between the tips in the extending direction is longer than the separation distance between the shield plates. Has characteristics.

  The electronic component socket according to claim 9, wherein the signal terminal member has the same shape as the first terminal, and the shield plate is missing at a position corresponding to the first protrusion of the signal terminal member. A missing portion is provided, and the first protruding portion of the signal terminal member is not in contact with the shield plate.

  The electronic component socket according to claim 10 is characterized in that the missing portion of the shield plate is a through hole.

  12. The electronic component socket according to claim 11, wherein the signal terminal member has the same shape as the first terminal, and the shield plate is insulated at a position corresponding to the first protruding portion of the signal terminal member. Processing is performed, and the first protruding portion of the signal terminal member is not electrically connected to the shield plate.

  The electronic component socket according to claim 12, wherein the shield plate is held in a state of being electrically connected to the frame body in a housing formed by embedding a metallic frame body in a resin, and is interposed through the frame body. And is grounded.

  According to the first aspect of the present invention, a plurality of ground terminal members, a plurality of signal terminal members, or a plurality of ground terminal members and signal terminals are integrated by integrating a plurality of ground terminal members or signal terminal members as contact bars. The members can be collectively arranged at a predetermined location. Compared to the conventional configuration in which a plurality of through holes are processed in a metal block and contact probes are individually embedded in each through hole, the assembly work is easier, so productivity can be improved. , Has the effect.

  According to the second aspect of the present invention, the ground terminal member is electrically connected to the shield plate and grounded, whereby the grounding efficiency is increased and the noise is reduced.

  According to the invention of claim 3, since the ground terminal member is electrically connected to the shield plate via the protruding portion and grounded, there is an effect that the grounding efficiency is increased and the noise is reduced.

  According to the invention of claim 4, by making the signal terminal member and the ground terminal member into the same shape, the contact bar can be easily configured without increasing the types of components. Moreover, a shield part and a signal terminal member can be insulated easily by providing a deletion part in the location corresponding to the protrusion part of a signal terminal member of a shield board. Therefore, the contact bar can be easily configured, and the shield plate and the signal terminal member can be easily insulated.

  According to the fifth aspect of the present invention, the shield plate is less likely to be distorted than the case in which the cut-out portion is formed as a through hole so that the cut portion is cut from the end of the shield plate. Therefore, the shield plate and the signal terminal member can be prevented from making undesired contact due to the distortion of the shield plate, and the shield plate and the signal terminal member can be more reliably insulated. .

  According to the invention of claim 6, by making the signal terminal member and the ground terminal member into the same shape, the contact bar can be easily configured without increasing the types of components. In addition, the shield plate and the signal terminal member can be easily insulated by subjecting the shield plate to the portion corresponding to the protruding portion of the signal terminal member. Therefore, the contact bar can be easily configured, and the shield plate and the signal terminal member can be easily insulated.

  According to invention of Claim 7, the 2nd protrusion part provided in the vicinity of the contact part and the 1st protrusion part provided in the position away from the contact part rather than the 2nd protrusion part are connected with a shield board. It was configured to ground. The grounding at the second projecting portion is grounded at a position close to the contact portion that is a signal input portion, and is particularly effective in reducing high-frequency noise when signal transmission is performed at high speed. This grounding configuration can be regarded as being grounded by a circuit connected in parallel when viewed as an electric circuit. Since the electrical resistance of the circuit connected in parallel is smaller than that of the circuit connected in series, it is difficult to pick up noise. Therefore, it is possible to provide an electronic component socket that is compatible with high frequencies and has good shielding properties.

  According to the invention of claim 8, when the second projecting portion comes into contact with the shield plate, the second projecting portion is press-fitted between the shield plate and the shield plate while being bent. The contact becomes stable. Further, even if the electronic component is pressed against the ground terminal member with an excessive force, the second projecting portion can escape in the pressed direction, and a stable contact can be made without deformation of an undesired portion. The effect is obtained.

  According to invention of Claim 9, a contact bar can be comprised easily, without increasing the kind of component by making the signal terminal member and the 1st terminal of a ground terminal member into the same shape. Moreover, a shield part and a signal terminal member can be insulated easily by providing a deletion part in the location corresponding to the protrusion part of a signal terminal member of a shield board. Therefore, the contact bar can be easily configured, and the shield plate and the signal terminal member can be easily insulated.

  According to the tenth aspect of the present invention, the shield plate is less likely to be distorted than the case in which the cut-out portion is formed as a through-hole, as compared with the case where the cut portion is cut from the end of the shield plate. Therefore, the shield plate and the signal terminal member can be prevented from making undesired contact due to the distortion of the shield plate, and the shield plate and the signal terminal member can be more reliably insulated. .

  According to the invention of claim 11, by making the signal terminal member and the first terminal into the same shape, the contact bar can be easily configured without increasing the types of components. In addition, the shield plate and the signal terminal member can be easily insulated by subjecting the shield plate to the portion corresponding to the protruding portion of the signal terminal member. Therefore, the contact bar can be easily configured, and the shield plate and the signal terminal member can be easily insulated.

  According to the twelfth aspect of the present invention, the shield plate is held in the housing in which the metallic frame is resin-molded, so that the ground can be grounded through the frame and the electrical connection with an undesired portion is made. There is an effect that can be prevented.

  As described above, according to the present invention, a highly productive socket for electronic parts can be provided.

It is a figure which shows the socket 100 for electronic components in 1st Embodiment. 2 is a perspective view showing an appearance of a shield plate 1. FIG. It is a perspective view which shows the ground terminal member 2 and the signal terminal member 3 in 1st Embodiment. It is a perspective view which shows the external appearance of the contact bar 10 in 1st Embodiment. It is a figure which shows the housing. It is a figure which shows the positional relationship of the frame 4a and the shield board 1. FIG. It is a figure which shows operation | movement of the ground terminal member 2 in 1st Embodiment. It is a figure which shows the positional relationship of the protrusion part 3b of the signal terminal member 3, and the shield board 1 in 1st Embodiment. It is a figure which shows the socket 200 for electronic components in 2nd Embodiment. It is a figure which shows the ground terminal member 6 in 2nd Embodiment. It is a figure which shows the external appearance of the contact bar 20 in 2nd Embodiment. It is a figure which shows operation | movement of the ground terminal member 6 in 2nd Embodiment. It is a figure which shows the positional relationship of the 1st protrusion part 9b and the shield board 1 of the signal terminal member 9 in 2nd Embodiment. It is sectional drawing which shows the structure of the socket for electronic components of patent document 1.

[First Embodiment]
The electronic component socket 100 according to the first embodiment will be described below.

  First, the configuration of the electronic component socket 100 according to the present embodiment will be described with reference to FIGS. 1 is a view showing an electronic component socket 100, FIG. 1 (a) is a perspective view showing the electronic component socket 100, and FIG. 1 (b) is an enlarged view of part A shown in FIG. 1 (a). FIG. 1C is a perspective view showing the state of FIG. 2B viewed from the Z2 direction. In addition, although the ground terminal member 2 and the signal terminal member 3 are shown in FIG. 1, the position changes with specifications. FIG. 2 is a view showing the appearance of the shield plate 1, FIG. 2 (a) is a perspective view showing the shield plate 1, and FIG. 2 (c) shows the appearance seen from the Z1 direction shown in FIG. 2 (a). FIG. 2C is a perspective view showing the shield plate 1 having a shorter length than the shield plate 1 shown in FIG. 2A, and FIG. 2D is shown in FIG. It is the perspective view which expanded the A section of. FIG. 3 is a perspective view showing the ground terminal member 2 and the signal terminal member 3. 4 is a perspective view showing the appearance of the contact bar 10, FIG. 4 (a) is a perspective view showing the contact bar 10 as viewed from above, and FIG. 4 (b) is a view of the contact bar 10 from below. FIG. In FIG. 4, reference numerals of the ground terminal member 2 and the signal terminal member 3 are given for convenience, and the locations of the ground terminal member 2 and the signal terminal member 3 can be changed as necessary. FIG. 5 is a view showing the housing 4, FIG. 5 (a) is a perspective view showing the appearance of the housing 4, and FIG. 5 (b) is a perspective view showing the appearance of the frame 4a. 6 is a diagram showing the positional relationship between the frame 4a and the shield plate 1, FIG. 6 (a) is a perspective view showing the positional relationship between the frame 4a and the shield plate 1, and FIG. It is a top view which shows the positional relationship of the frame 4a and the shield board 1. FIG.

  As shown in FIG. 1, the electronic component socket 100 can contact a shield plate 1 that prevents external noise, a housing 4 that holds a plurality of shield plates 1, and a ground terminal of an electronic component that is not shown. And a ground terminal member 2 that can be connected to a grounding pad of the substrate and a signal terminal ST of an electronic component that is an object to be inspected (not shown) and that is not grounded and is not shown in the figure. And a signal terminal member 3 that can be connected to the signal pad. In the present embodiment, the opening OA is formed at the center of the electronic component socket 100, but it may not be provided and can be changed as necessary.

  As shown in FIG. 2, the shield plate 1 is formed of a metal plate piece. In the present embodiment, as shown in FIG. 2A, the two shield plates 1 are arranged in parallel with the surfaces facing each other, and as shown in FIG. The shield plate 1 is connected to the lower side which is the Z2 direction side shown in FIG. 2A by a crosspiece 1b. Further, from the crosspieces 1b arranged at both ends in the Y1-Y2 direction, connecting portions 1c are provided to extend in the Y1-Y2 direction, respectively. Moreover, as shown in FIG.2 (d), the deletion part 1a formed in the shape of a through-hole as needed is provided in the predetermined position of the shield board 1 at the Z2 direction side. In addition, in this embodiment, since the opening part OA is formed in the center part of the socket 100 for electronic components, the shield board 1 corresponding to the location in which the opening part OA was formed is shown in FIG.2 (c). Thus, the length is shorter than the length of the shield plate 1 where there is no opening OA, and the shape is divided into two parts.

  As shown in FIG. 3, the ground terminal member 2 is formed of a metal plate piece. The ground terminal member 2 includes a base portion 2c formed in a plate shape, has a contact portion 2a on one end side that is the Z1 direction side of the base portion 2c shown in FIG. 3, and the other end that is on the Z2 direction side. A protrusion 2b that can contact the shield plate 1 is provided on the side. Bending is performed in the vicinity of the center of the base material portion 2c. When the contact portion 2a is pressed in the Z2 direction, it can be bent in the Z2 direction. Moreover, the protrusion part 2b protrudes in the X1-X2 direction where the shield board 1 is arrange | positioned, respectively, and is formed in plate spring shape.

  As shown in FIG. 3, the signal terminal member 3 is formed from a metal plate piece. The signal terminal member 3 has the same shape as the ground terminal member 2, and a base material portion 3 c is formed at a location corresponding to the base material portion 2 c of the ground terminal member 2, and corresponds to the contact portion 2 a of the ground terminal member 2. A contact portion 3a is formed at a place to be formed, and a protrusion 3b is formed at a portion corresponding to the protrusion 2b of the ground terminal member 2.

  As described above, the ground terminal member 2 and the signal terminal member 3 have been individually described. Actually, however, the ground terminal member 2 and the signal terminal member 3 are unitized as a contact bar 10 as shown in FIG. Yes. The contact bar 10 is formed by integrating a plurality of ground terminal members 2 and signal terminal members 3 in a row and integrally formed with a base portion 10a made of a synthetic resin material. In the above description, a unit in which the ground terminal member 2 and the signal terminal member 3 are mixed as a contact bar 10 is unitized. However, only the ground terminal member 2 or only the signal terminal member 3 is used as necessary. The contact bar 10 may be unitized. The base portion 10a integrally forms the other end side that is the Z2 direction side of each of the ground terminal member 2 and the signal terminal member 3, but at this time, the protruding portion 2b or the protruding portion 3b extends from the base portion 10a in the X1-X2 direction. 4B, as shown in FIG. 4B, the ends of the ground terminal member 2 and the signal terminal member 3 on the other end side are from the surface on the Z2 direction side which is the bottom surface of the base portion 10a. Exposed.

  As shown in FIG. 5 (b), the housing 4 is made of a metal plate and has a rectangular cross section formed in a cylindrical shape and a synthetic resin material so as to cover the outer periphery of the frame 4a. The insulating case 4b is formed, and the frame 4a is embedded in the insulating case 4b. The housing 4 has an accommodating portion 4c. As shown in FIG. 1, the accommodating portion 4c can be provided with the shield plate 1 and the contact bar 10, and the upper portion in the Z1 direction shown in FIG. It is formed in a concave shape. A through-hole is formed in the inner bottom surface of the accommodating portion 4c at a location corresponding to the other end of the ground terminal member 2 and the signal terminal member 3. In addition, grounding portions 4d are formed to project from the four corners of the frame 4a, and the tip of the grounding portion 4d is exposed from the outer peripheral surface of the insulating case 4b.

  In the present embodiment, as shown in FIG. 6, the shield plate 1 is integrally formed with the housing 4 in a state where the connecting portion 1 c is electrically connected to the frame body 4 a.

  Next, the structure of the electronic component socket 100 will be described with reference to FIGS. 7 is a view showing the operation of the ground terminal member 2, and FIG. 7 (a) is a front view showing the ground terminal member 2 of the contact bar 10 shown in FIG. 4 (a) from the Y2 direction side. 7B is a side view showing the ground terminal member 2 of FIG. 7A from the X2 direction side, and FIG. 7C is a state in which the ground terminal member 2 of FIG. 7A is pressed in the Z2 direction. 7 (d) is a side view showing the ground terminal member 2 of FIG. 7 (c) from the X2 direction side. FIG. 8 is a diagram showing the positional relationship between the protruding portion 3b of the signal terminal member 3 and the shield plate 1. FIG. 8A shows the signal terminal member 3 of the contact bar 10 shown in FIG. 8 (b) is a side view showing the signal terminal member 3 of FIG. 8 (a) from the X2 direction side. 7 and 8 are schematic views in which the ground terminal member 2 and the signal terminal member 3 are individually cut out for easy explanation.

  As shown in FIG. 1A, a plurality of shield plates 1 are arranged inside the housing portion 4 c of the housing 4 with the surfaces facing each other in parallel. At this time, the shield plate 1 is electrically connected to a frame body 4a (not shown) disposed in the insulating case 4b of the housing 4 as shown in FIG. The contact bar 10 is disposed between the shield plates 1 such that the contact portion 2a and the contact portion 3a protrude above the shield plate 1. Further, as shown in FIG. 1 (c), from the through holes provided in the bottom surface of the housing 4, the other end sides of the ground terminal member 2 and the signal terminal member 3 arranged corresponding to the respective through holes. The end portion of the semiconductor device is exposed, and for example, it can be electrically connected to a substrate (not shown) on which the electronic component socket 100 is disposed.

  At this time, the distance between the tips of the pair of protrusions 2b of the ground terminal member 2 is longer than the distance between the shield plates 1 as shown in FIG. When disposed in between, the protruding portion 2b is bent in contact with the shield plate 1 and is held in a pressed state. Thus, the projecting portion 2b is electrically connected to the shield plate 1, whereby the ground terminal member 2 is electrically connected to the shield plate 1 and grounded. Further, since the shield plate 1 is held in a conductive state with the frame body 4a, it is grounded via the frame body 4a.

  Further, as shown in FIG. 8, the distance between the tips of the pair of protrusions 3 b of the signal terminal member 3 is longer than the distance between the shield plates 1 as in the protrusion 2 b of the ground terminal member 2. However, in the shield plate 1, since the deletion portion 1a is provided at a position corresponding to the protrusion portion 3b of the signal terminal member 3, the protrusion portion 2b is inserted into the deletion portion 1a, and the protrusion portion 2b is shielded. No contact with the plate 1. Therefore, the signal terminal member 3 is not grounded via the shield plate 1. In this way, the electronic component socket 100 is formed.

  Next, the operation of the electronic component socket 100 will be described with reference to FIG. Since the movement of the ground terminal member 2 and the movement of the signal terminal member 3 are the same, only the movement of the ground terminal member 2 is illustrated, and the movement of the signal terminal member 3 is not illustrated.

  The electronic component socket 100 is disposed on a substrate (not shown), and is used in a state where the ground terminal member 2 and the signal terminal member 3 are electrically connected to the substrate. In the electronic component socket 100, the grounding portion 4d is also electrically connected to the substrate and grounded. As shown in FIGS. 7 (a) and 7 (b), the electronic component socket 100 is in an initial state in which an unillustrated electronic component that can be connected is not inserted, and the contact portion 2a of the ground terminal member 2 and In this state, the contact portion 3 a of the signal terminal member 3 protrudes above the shield plate 1. Next, when the electronic component is inserted into the electronic component socket 100, as shown in FIGS. 7C and 7D, the contact portion 2a of the ground terminal member 2 contacts the ground terminal GT of the electronic component. And pressed in the Z2 direction. Similarly, although not shown, the contact portion 3a of the signal terminal member 3 comes into contact with the signal terminal ST of the electronic component and is pressed in the Z2 direction. The pressed ground terminal member 2 and signal terminal member 3 are pressed and electrically connected to the electronic component while being bent in the Z2 direction. As a result, the ground terminal GT of the electronic component is grounded to the shield plate 1 via the ground terminal member 2, and the shield plate 1 is grounded to the substrate via the housing 4. Therefore, the electronic component is electrically connected to the substrate via the electronic component socket 100 and is also grounded. When the electronic component is removed from the electronic component socket 100, the ground terminal member 2 and the signal terminal member 3 return to the initial state.

  Hereinafter, the effect by having set it as this embodiment is demonstrated.

  In the electronic component socket 100 of the present embodiment, the shield plate 1 made of a metal plate piece and the grounding terminal GT of the electronic component that is the object to be inspected can be contacted and used for grounding and connected to the grounding pad of the substrate. A ground terminal member 2 to be obtained, and a signal terminal member 3 that can be contacted with a signal terminal ST of an electronic component that is an object to be inspected and that can be connected to a signal pad on a substrate without being grounded, A plurality of plates 1 are arranged in a state where the surfaces face each other in parallel, and only the ground terminal member 2 or only the signal terminal member 3 or a mixture of the ground terminal member 2 and the signal terminal member 3 is used. A plurality of contact bars 10 are formed in a row, and the contact bars 10 are arranged between the shield plates 1.

  Thereby, the plurality of ground terminal members 2 or the plurality of signal terminal members 3 or the plurality of ground terminal members 2 and the signal terminals are integrated by integrating the plurality of ground terminal members 2 or the signal terminal members 3 as the contact bars 10. The member 3 can be collectively arranged at a predetermined location. Compared to the conventional configuration in which a plurality of through holes are processed in a metal block and contact probes are individually embedded in each through hole, the assembly work is easier, so productivity can be improved. There is an effect. Further, since the assembling work becomes easy, it can be assembled at a lower cost. Further, since the contact bar 10 can be collectively arranged at a predetermined location, the ground terminal member 2 and the signal terminal member can be assembled by assembly work as compared with the case where the ground terminal members 2 are arranged one by one as in the prior art. 3 or the like can be reduced, and a socket for an electronic component with stable contact with an electrode terminal of the electronic component can be provided.

  In the electronic component socket 100 of the present embodiment, the ground terminal member 2 is electrically connected to the shield plate 1 and grounded.

  As a result, the ground terminal member 2 is electrically connected to the shield plate 1 and grounded, whereby the grounding efficiency is increased and the noise is reduced.

  In the electronic component socket 100 of the present embodiment, the ground terminal member 2 has a contact portion 2a that can contact the ground terminal GT of the electronic component on one end side, and can contact the shield plate 1 on the other end side. It has the structure which has the protrusion part 2b and is grounded when the protrusion part 2b conduct | electrically_connects with the shield board 1. FIG.

  As a result, the ground terminal member 2 is electrically connected to the shield plate 1 through the protruding portion 2b and grounded, so that the grounding efficiency is increased and the noise is reduced.

  Further, in the electronic component socket 100 of the present embodiment, the signal terminal member 3 has the same shape as the ground terminal member 2, and the shield plate 1 is deleted at a location corresponding to the protruding portion 3 b of the signal terminal member 3. A portion 1 a is provided, and the protruding portion 2 b does not contact the shield plate 1.

  Thereby, the contact bar 10 can be easily comprised, without increasing the kind of component by making the signal terminal member 3 and the ground terminal member 2 into the same shape. In addition, the shield plate 1 and the signal terminal member 3 can be easily insulated by providing the missing portion 1 a at a location corresponding to the protruding portion 2 b of the signal terminal member 3 of the shield plate 1. Therefore, the contact bar 10 can be easily configured, and the shield plate 1 and the signal terminal member 3 can be easily insulated.

  Moreover, in the socket 100 for electronic components of this embodiment, the deletion part 1a of the shield board 1 was set as the structure which is a through-hole.

  Thereby, the shield part 1 becomes difficult to be distorted compared with the case where it makes the shape which cut | incised from the edge part of the shield board 1 by making the deletion part 1a into the through-hole. Therefore, it is possible to prevent the shield plate 1 and the signal terminal member 3 from making undesired contact due to the distortion of the shield plate 1 and to more reliably insulate the shield plate 1 and the signal terminal member 3 from each other. , Has the effect.

  In the electronic component socket 100 of the present embodiment, the shield plate 1 is held in a state where it is electrically connected to the frame body 4a in the housing 4 formed by embedding the metallic frame body 4a in the resin, and the frame body 4a. It was set as the structure grounded through.

  Thereby, by holding the shield plate 1 in the housing 4 in which the metallic frame 4a is resin-molded, it is possible to ground through the frame 4a and to prevent electrical connection with an undesired portion. There is an effect that can be done.

[Second Embodiment]
Hereinafter, the electronic component socket 200 according to the second embodiment will be described. The electronic component socket 200 is obtained by changing the configuration of the ground terminal member 2 of the electronic component socket 100 in the first embodiment. In the following description, a detailed description of the parts having the same configuration as that of the electronic component socket 100 in the first embodiment is omitted, and the member name, location name, and reference numerals are for the electronic component in the first embodiment. The same socket 100 is used.

  First, the configuration of the electronic component socket 200 according to the present embodiment will be described with reference to FIGS. FIG. 9 is a view showing an electronic component socket 200 according to the second embodiment, FIG. 9A is a perspective view showing an appearance of the electronic component socket 200, and FIG. 9B is a view showing FIG. It is the figure which expanded the B section shown in FIG. FIG. 10 is a view showing the ground terminal member 6, FIG. 10A is a perspective view showing the appearance of the ground terminal member 6, and FIG. 10B shows the ground terminal member 6 as the first terminal 7 and the second terminal. FIG. FIG. 11 is a view showing the appearance of the contact bar 20, FIG. 11 (a) is a perspective view showing the appearance of the contact bar 20, and FIG. 11 (b) shows the contact bar 20 shown in the contact 11 (a). It is the perspective view shown from the Z2 direction side, FIG.11 (c) is the side view which showed the C section shown to Fig.11 (a) from the X1 direction side.

  As shown in FIG. 9, the electronic component socket 200 is in contact with the shield plate 1 that prevents external noise, the housing 4 that holds the plurality of shield plates 1, and the grounding terminal GT of the electronic component that is not shown. It is possible to contact the ground terminal member 6 that can be connected to the grounding pad of the substrate and to be connected to the grounding pad of the substrate and the signal terminal ST of the electronic component that is the object to be inspected. And a signal terminal member 9 that can be connected to the pad. The shield plate 1, the housing 4, and the signal terminal member 9 are the same as the components of the electronic component socket 100 in the first embodiment. However, the signal terminal member 3 in the first embodiment is the same as the signal terminal member 9 although the numbering is changed and the signal terminal member 9 is used in the second embodiment.

  As shown in FIG. 10, the ground terminal member 6 includes a first terminal 7 and a second terminal 8 that are formed of a metal plate piece and are electrically connected. The first terminal 7 includes a base material portion 7c formed in a plate shape, has a contact portion 7a on one end side that is the Z1 direction side of the base material portion 7c shown in FIG. 10, and the other end that is on the Z2 direction side. It has the 1st protrusion part 7b which can contact the shield board 1 in the side. Bending is performed in the vicinity of the center of the base material portion 7c, and when the contact portion 7a is pressed in the Z2 direction, it can be bent in the Z2 direction. Moreover, the 1st protrusion part 7b protrudes in the X1-X2 direction where the shield board 1 is arrange | positioned, respectively, and is formed in leaf | plate spring shape. The second terminal 8 includes a base material portion 8b formed in a plate shape, and has a second protrusion 8a that can contact the shield plate 1 on one end side of the base material portion 8b on the Z1 direction side shown in FIG. doing. The second projecting portion 8a has a first extending portion 8c and a second extending portion 8d formed by bifurcating a tip portion on one end side of the second terminal 8. The first extending portion 8c and the second extending portion 8d extend in opposite directions, and the tip side is folded. Note that the opposite directions in which the first extending portion 8c and the second extending portion 8d are extended are the X1-X2 directions shown in FIG. 10, and the first extending portion 8c and the second extending portion. 8d is a direction toward the shield plate 1 disposed at a position closest to each other. In addition, the distance between the turn-back portion 8f of the first extension portion 8c and the turn-back portion 8g of the second extension portion 8d, which is the tip in the extending direction of the first extension portion 8c and the second extension portion 8d. D is longer than the separation distance between the shield plates 1. In addition, a connecting portion 8e is formed by bending the base material portion 8b on the other end side which is the Z2 direction side of the second terminal 8 shown in FIG. As shown in FIG. 10A, the first terminal 7 and the second terminal 8 are electrically connected with the connecting portion 8 e of the second terminal 8 always in contact with the other end of the first terminal 7. Yes.

  The signal terminal member 9 is made of a metal plate and has the same shape as that of the first terminal 7. The contact portion 7 a, the first protrusion 7 b, and the contact portion 9 a corresponding to the base portion 7 c and the first protrusion in the first terminal 7. A part 9b and a base part 9c are provided.

  Further, the ground terminal member 6 and the signal terminal member 9 are used in a unitized state as the contact bar 20 as shown in FIG. 11A, like the contact bar 10 in the first embodiment. The contact bar 20 is formed by integrating a plurality of ground terminal members 6 and signal terminal members 9 in a row and integrally formed with a base portion 20a made of a synthetic resin material. In the above description, a unit in which the ground terminal member 6 and the signal terminal member 9 are mixed as a contact bar 20 is unitized. However, if necessary, only the ground terminal member 6 or only the signal terminal member 9 is used. The contact bar 10 may be unitized. The base portion 20a is integrally formed with the first terminal 7 of the ground terminal member 6 and the other end side of the signal terminal member 9 on the Z2 direction side. At this time, the first protruding portion 7b or the first protruding portion 9b is formed. Are formed to project from the base portion 20a in the X1-X2 direction. Further, the end portions on the other end side of the first terminal 7 and the signal terminal member 9 of the ground terminal member 6 are exposed from the surface on the Z2 direction side, which is the bottom surface of the base portion 20a, as shown in FIG. ing. Moreover, as shown in FIG.11 (c), the slit part 20b which can insert the 2nd terminal 8 is formed in the base of the location which the 1st terminal 7 of the base part 20a exposed. The slit portion 20b has a width that allows the connecting portion 8e of the second terminal 8 to be press-fitted. A part of the first terminal 7 is exposed inside the slit portion 20b that is an E portion shown in FIG. By inserting the side on which the connecting portion 8e of the second terminal 8 is formed into the slit portion 20b, the connecting portion 8e and the first terminal 7 are in pressure contact and electrically connected. In the above description, for convenience, the slit portion 20b is formed at the root of the portion where the first terminal 7 is exposed. However, in practice, the root of the portion where the first terminal 7 is exposed and the signal terminal member 9 are formed. It is formed at the root of the exposed part. Since the first terminal 7 and the signal terminal member 9 have the same shape, it functions as the ground terminal member 6 by inserting the second terminal 8 into the slit portion 20b where it is desired to function as the ground terminal member 6. Then, the portion where the second terminal 8 is not inserted functions as the signal terminal member 9.

  Next, the structure of the electronic component socket 200 will be described with reference to FIGS. 9, 12, and 13. 12 is a view showing the operation of the ground terminal member 6, and FIG. 12 (a) is a front view showing the ground terminal member 6 of the contact bar 20 shown in FIG. 11 (a) from the Y2 direction side. FIG. 12B is a side view showing the ground terminal member 6 of FIG. 11A from the X2 direction side, and FIG. 12C is a state where the ground terminal member 6 of FIG. 12A is pressed in the Z2 direction. 12 (d) is a side view showing the ground terminal member 2 of FIG. 12 (c) from the X2 direction side. FIG. 13 is a view showing the positional relationship between the first projecting portion 9b of the signal terminal member 9 and the shield plate 1, and FIG. 13A shows the signal terminal member 9 of the contact bar 20 shown in FIG. It is the front view shown from the direction side, FIG.13 (b) is the side view which showed the signal terminal member 9 of Fig.11 (a) from the X2 direction side.

  Like the electronic component socket 100 in the first embodiment, the electronic component socket 200 has an inner surface of the housing portion 4c of the housing 4 with the shield plate 1 facing each other in parallel, as shown in FIG. A plurality of sheets are arranged. The contact bar 20 is disposed between the shield plate 1 and the shield plate 1 with the contact portion 7 a, the contact portion 9 a, and the second protruding portion 8 a protruding above the shield plate 1. From the through holes provided in the bottom surface of the housing 4, the end portions on the other end side of the first terminals 7 and the signal terminal members 3 arranged corresponding to the respective through holes are exposed. It can be electrically connected to a substrate (not shown) on which the socket 200 is disposed.

  At this time, as shown in FIG. 12, the pair of first projecting portions 7 b of the first terminal 7 of the ground terminal member 6 is bent in contact with the shield plate 1 and held in pressure contact. In this way, the ground terminal member 6 is grounded via the shield plate 1 and the frame body 4a.

  Further, as shown in FIG. 13, the pair of first protrusions 9b of the signal terminal member 9 are shield plates in the same manner as the protrusions 3b of the signal terminal member 3 of the electronic component socket 100 in the first embodiment. 1, since a deletion portion 1 a which is a through hole is provided at a location corresponding to the first protrusion 9 b of the signal terminal member 9, the first protrusion 9 b is inserted into the deletion 1 a, The one protruding portion 9 b does not contact the shield plate 1. Therefore, the signal terminal member 9 is not grounded via the shield plate 1. In this way, the electronic component socket 200 is formed.

  Next, the operation of the electronic component socket 200 will be described with reference to FIG. The electronic component socket 200 is disposed on a substrate (not shown), and is used in a state where the ground terminal member 6 and the signal terminal member 9 are electrically connected to the substrate. In the electronic component socket 200, the grounding portion 4d is also electrically connected to the substrate and grounded. As shown in FIGS. 12 (a) and 12 (b), the electronic component socket 200 is in the initial state in which an unillustrated electronic component that can be connected is not inserted, as shown in FIGS. The contact portion 7a, the second projecting portion 8a of the second terminal 8, and the contact portion 9a of the signal terminal member 9 are projected above the shield plate 1. Note that the second protrusion 8 a is not in contact with the shield plate 1. Next, the operation when the electronic component is inserted into the electronic component socket 200 will be described. Since the operation of the signal terminal member 9 is the same as the operation of the signal terminal member 3 in the first embodiment, a detailed description will be given. Only the operation of the ground terminal member 6 will be described. When the electronic component is inserted into the electronic component socket 200, as shown in FIGS. 12A and 12B, the contact portion 7a of the first terminal 7 of the ground terminal member 6 is connected to the ground terminal GT of the electronic component. And pressed in the Z2 direction. The pressed first terminal 7 is pressed and electrically connected to the electronic component while being bent in the Z2 direction. When the first terminal 7 is further pressed and tilted, as shown in FIGS. 12 (c) and 12 (d), the first terminal 7 is further tilted to come into contact with the second terminal 8, and the second terminal 8 is moved. Tilt in the pressed direction. When the first terminal 7 is further pressed, the first terminal 7 is further tilted together with the second terminal 8, and the second protruding portion 8 a of the second terminal 8 comes into contact with the shield plate 1 and is electrically connected. As a result, the ground terminal member 6 is grounded to the shield plate 1 at two locations of the first projecting portion 7 b and the second projecting portion 8 a, and the shield plate 1 is grounded to the substrate via the housing 4. When the first terminal 7 is further pressed, the pair of second projecting portions 8a are inserted between the shield plate 1 and the shield plate 1 while being bent in the direction in which they approach each other, and the second projecting portion 8a is pressed against the shield plate 1. To do. Therefore, the electronic component is electrically connected to the substrate via the electronic component socket 200 and is also grounded. When the electronic component is removed from the electronic component socket 200, the ground terminal member 6 and the signal terminal member 9 return to the initial state.

  Hereinafter, the effect by having set it as this embodiment is demonstrated.

  In the electronic component socket 200 of the present embodiment, the ground terminal member 6 includes a first terminal 7 and a second terminal 8 that are electrically connected, and the first terminal 7 has a ground terminal GT of the electronic component on one end side. A second projecting portion that can come into contact with the shield plate 1 at one end side, and a second projecting portion that can come into contact with the shield plate 1 at one end side. The first projecting portion 7b and the second projecting portion 8a are connected to the shield plate 1 to be grounded.

  Thereby, the 2nd protrusion part 8a provided in the vicinity of the contact part 7a and the 1st protrusion part 7b provided in the position farther from the contact part 7a than the 2nd protrusion part 8a conduct | electrically_connect with the shield board 1. It was configured to ground. The grounding at the second projecting portion is grounded at a position close to the contact portion that is a signal input portion, and is particularly effective in reducing high-frequency noise when signal transmission is performed at high speed. This grounding configuration can be regarded as being grounded by a circuit connected in parallel when viewed as an electric circuit. Since the electrical resistance of the circuit connected in parallel is smaller than that of the circuit connected in series, it is difficult to pick up noise. That is, it is possible to provide an electronic component socket that is compatible with high frequencies and has good shielding properties.

  In the electronic component socket 200 according to the present embodiment, the second projecting portion 8a has a tip portion on one end side of the second terminal 8 divided into two branches, and each tip portion on one end side of the second terminal 8 divided into two branches. Is formed to extend toward the shield plate 1 disposed at the closest position to each, and is a distance between the turn-back point 8f and the turn-back point 8g, which is the distance between the tips in the extending direction. Is longer than the distance between the shield plates 1.

  Thereby, after the 2nd protrusion part 8a contacts the shield board 1, since the 2nd protrusion part 8a is press-fitted between the shield board 1 and the shield board 1 while bending, the shield board 1 and the 1st grounding part The contact is stable. Further, even if the electronic component is pressed against the ground terminal member 6 with an excessive force, the second protruding portion 8a can escape in the pressed direction, and the undesired portion is stable without being deformed. There is an effect that contact can be obtained.

  In the electronic component socket 200 of the present embodiment, the signal terminal member 9 has the same shape as the first terminal 7, and the shield plate 1 has a portion corresponding to the first protrusion 9 b of the signal terminal member 9. It was set as the structure by which the deletion part 1a was provided and the 1st protrusion part 7b did not contact with the shield board 1. FIG.

  Thereby, the contact bar 20 can be easily comprised, without increasing the kind of component by making the signal terminal member 9 and the 1st terminal 7 into the same shape. Further, the shield plate 1 and the signal terminal member 9 can be easily insulated by providing the deletion portion 1a at a location corresponding to the first protrusion 9b of the signal terminal member 9 of the shield plate 1. Therefore, the contact bar 20 can be easily configured, and the shield plate 1 and the signal terminal member 9 can be easily insulated.

  Moreover, in the electronic component socket 200 of the present embodiment, the missing portion 1a of the shield plate 1 is a through hole.

  Thereby, the shield part 1 becomes difficult to be distorted compared with the case where it makes the shape which cut | incised from the edge part of the shield board 1 by making the deletion part 1a into the through-hole. Therefore, it is possible to prevent undesired contact between the shield plate 1 and the signal terminal member 9 due to distortion of the shield plate 1, and to more reliably insulate the shield plate 1 and the signal terminal member 9. , Has the effect.

  As described above, the electronic component socket according to the embodiment of the present invention has been specifically described. However, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. Is possible. For example, the present invention can be modified as follows, and these embodiments also belong to the technical scope of the present invention.

  (1) In the first and second embodiments, the shield plate 1 corresponds to the protruding portion 3b of the signal terminal member 3 in the first embodiment and the first protruding portion 9b of the signal terminal member 9 in the second embodiment. However, a configuration in which an insulating process is performed without providing the deletion portion 1a may be employed. For example, the insulation treatment may be performed by painting a paint having an insulating property. As a result, similarly to the case where the deletion portion 1a is provided, the protruding portion 3b of the signal terminal member 3 in the first embodiment and the first protruding portion 9b of the signal terminal member 9 in the second embodiment are different from the shield plate 1. Since it is not electrically conductive, the signal terminal member 3 in the first embodiment and the signal terminal member 9 in the second embodiment and the shield plate 1 can be easily insulated.

(2) In the first embodiment and the second embodiment, the shield plate 1 is configured to be integrally formed with the housing 4 by connecting the two shield plates 1 by the connecting portion 1c, but the connecting portion 1c. The shield plate 1 and the frame body 4a may be electrically connected and grounded by disposing the individual shield plates 1 in the housing portion 4c of the housing 4 without providing them. (3) In the contact bar 10 in the first embodiment and the contact bar 20 in the second embodiment, the total number of the ground terminal members 2 and the signal terminal members 3 arranged in one contact bar 10 and the one contact bar 20 are arranged. Although the total number of the ground terminal members 6 and the signal terminal members 9 is illustrated and described as eight, it may be changed as necessary. For example, it may be increased when the size of the electronic component socket is large and decreased when the socket is small.

DESCRIPTION OF SYMBOLS 1 Shield plate 1a Deletion part 1b Crosspiece 1c Connection part 2 Ground terminal member 2a Contact part 2b Projection part 2c Base part 3 Signal terminal member 3a Contact part 3b Projection part 3c Base part 4 Housing 4a Frame body 4b Insulation case 4c Housing part 4d Grounding part 6 Ground terminal member 7 First terminal 7a Contact part 7b First projecting part 7c Base material part 8 Second terminal 8a Second projecting part 8b Base material part 8c First extending part 8d Second extending part 8e connecting portion 8f folded portion 8g folded portion 9 signal terminal member 9a contact portion 9b first protruding portion 9c base material portion 10 contact bar 10a base member 20 contact bar 20a base member 100 socket for electronic component 200 socket for electronic component

Claims (12)

A shield plate made of a metal plate piece;
A ground terminal member that can contact a ground terminal of an electronic component that is an object to be inspected, and that can be connected to a grounding pad of a substrate,
A signal terminal member that can contact a signal terminal of an electronic component that is an object to be inspected, and that can be connected to a signal pad on a substrate without being grounded,
A plurality of the shield plates are arranged in parallel with the surfaces facing each other, only the ground terminal member, only the signal terminal member, or a mixture of the ground terminal member and the signal terminal member A socket for electronic parts, wherein a plurality of contacts are arranged in a row to form a contact bar, and the contact bar is disposed between the shield plates.   2. The electronic component socket according to claim 1, wherein the ground terminal member is electrically connected to the shield plate and grounded.   The ground terminal member has a contact portion that can contact the ground terminal of the electronic component on one end side, and a protrusion portion that can contact the shield plate on the other end side. 3. The electronic component socket according to claim 1, wherein the electronic component socket is grounded by conduction. The signal terminal member has the same shape as the ground terminal member,
4. The electronic component according to claim 3, wherein in the shield plate, a deletion portion is provided at a position corresponding to the protrusion of the signal terminal member, and the protrusion does not contact the shield plate. socket.   The electronic component socket according to claim 4, wherein the missing portion of the shield plate is a through hole. The signal terminal member has the same shape as the ground terminal member,
4. The electron according to claim 3, wherein in the shield plate, an insulating process is performed on a portion corresponding to the protruding portion of the signal terminal member, and the protruding portion is not electrically connected to the shield plate. Socket for parts. The ground terminal member includes an electrically conductive first terminal and a second terminal,
The first terminal has a contact portion that can contact the ground terminal of the electronic component on one end side, and a first protrusion that can contact the shield plate on the other end side,
The second terminal has a second protrusion that can contact the shield plate on one end side,
3. The electronic component socket according to claim 1, wherein the first projecting portion and the second projecting portion are connected to the shield plate to be grounded. 4.   The second projecting portion has a tip end portion on one end side of the second terminal divided into two branches, and each tip end portion on the one end side of the second terminal divided into two branches is disposed at a position closest to each other. The socket for electronic parts according to claim 7, wherein the distance between the tips in the extending direction is longer than the distance between the shield plates. . The signal terminal member has the same shape as the first terminal,
The said shield board WHEREIN: The deletion part is provided in the location corresponding to the 1st protrusion part of the said signal terminal member, The 1st protrusion part of the said signal terminal member does not contact the said shield board, It is characterized by the above-mentioned. The socket for electronic components of Claim 7 or Claim 8.   The electronic component socket according to claim 9, wherein the missing portion of the shield plate is a through hole. The signal terminal member has the same shape as the first terminal,
In the shield plate, a portion corresponding to the first projecting portion of the signal terminal member is insulated, and the first projecting portion of the signal terminal member is not electrically connected to the shield plate. The electronic component socket according to claim 7 or 8.   The said shield board is hold | maintained in the state which conduct | electrically_connected to the said frame in the housing which embedded the metal frame in resin, and was shape | molded, The ground is characterized by the above-mentioned. The electronic component socket according to claim 11.

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