JP2014011510A - Imaging apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent deterioration of electrical reliability of an imaging apparatus reduced in thickness while preventing deterioration of strength.SOLUTION: A camera module 20 comprises a bonding wire 5 which electrically connects a terminal 11T disposed on the surface 11a of a cavity board 11 with a terminal 4T disposed on the surface 4a of an imaging device 4. The imaging device 4 is disposed in a recess 15 provided in the cavity board 11, and resin 13 is disposed in the recess 15 so as to be brought into contact with the inner wall of the recess 15 and the imaging device 4 and to expose the terminals 4T and 11T and the bonding wire 5.

Description

  The present invention relates to an imaging apparatus.

  Conventionally, for example, a camera module having a lens and an image sensor as disclosed in Patent Document 1 has been developed.

  A conventional camera module will be described with reference to FIG. FIG. 11 is a cross-sectional view showing a configuration of a conventional camera module.

  As shown in FIG. 11, the camera module includes a holder 101 that holds a lens 102 therein, a substrate 107 that includes an imaging device 104 on an upper surface, a flexible substrate 108 that is bonded to the lower surface of the substrate 107, a lens 102, And an IR cut filter 103 disposed between the image sensors 104. Further, a terminal in the vicinity of the upper end of the image sensor 104 and a terminal on the upper surface of the substrate 107 are connected by a bonding wire 105.

  According to such a camera module, the light imaged by the lens 102 is converted into an electric signal by the image sensor 104. Thereafter, image data can be obtained from the converted electrical signal.

  Here, the distance between the lens 102, which is an optical component, and the image sensor 104 needs to be a distance that is optically determined depending on the specifications of the optical component. For this reason, it becomes difficult to reduce the thickness of the entire camera module.

  In addition, when the entire substrate 107 is thinned, there may be a problem that the substrate 107 is broken in a camera module production process, for example, a test process. In addition, problems such as the need for user handling after shipping occur.

  FIG. 12 is a cross-sectional view illustrating a configuration of a camera module using a conventional die bond sheet.

  As shown in FIG. 12, as a countermeasure against the strength reduction accompanying the thinning of the substrate 107, as shown in FIG. 12, a technique for arranging a die bond sheet 110 between the image sensor 104 and the substrate 107 has been developed. Yes. However, the entire camera module becomes thicker by the thickness of the die bond sheet 110, which is insufficient to achieve both a reduction in the thickness of the camera module and a solution to the problem associated with a decrease in the strength of the substrate. Moreover, it is also a problem that the die bond sheet 110 is expensive.

  Therefore, Patent Document 3 discloses a method of providing a recess in a substrate and supplementing the strength by curing with a resin.

  FIG. 13 is a cross-sectional view illustrating a configuration of a camera module disclosed in Patent Document 3.

  As shown in FIG. 13, the camera module includes a multilayer wiring board 221, a casing 203 that covers the multilayer wiring board 221, and a lens 207 that is stored in the casing 203.

  A recess 215 is formed on the upper surface of the multilayer wiring board 221, and the image sensor 212 is stored in the recess 215. Connection terminal portions 218 a and 218 b are formed on the upper surface of the multilayer wiring board 221 in a region adjacent to the recess 215.

  A light receiving portion 204 is formed on the upper surface of the image sensor 212. The light receiving unit 204 is separated from the lens 207 and is disposed opposite to the lens 207. Terminal portions 219 a and 219 b are formed on the outer periphery of the light receiving portion 204 on the periphery of the upper surface of the image sensor 212.

  The terminal portion 217a and the connection terminal portion 218a are connected by a bonding wire 219a. Further, the terminal portion 217b and the connection terminal portion 218b are connected by a bonding wire 219b.

  The terminal portions 217a and 217b, the connection terminal portions 218a and 218b, the bonding wires 219a and 219b are covered, and a black paste epoxy resin is cured between the multilayer wiring board 221 and the image sensor 212 in the recess 215. Further, a light shielding member 210 is disposed.

  As described above, the camera module of Patent Document 3 covers the peripheral portion of the imaging element 221 including the terminal portions 217a and 217b, the connection terminal portions 218a and 218b, and the bonding wires 219a and 219b, and the concave portion 215 of the multilayer wiring board 221. Filling the inside with a light-shielding member 210 made of an epoxy resin prevents a decrease in strength due to the provision of the recess 215. In addition, by providing the epoxy resin with a light-shielding property, unnecessary external light is prevented from entering the image sensor 212.

JP 2008-258793 A (released on October 23, 2008) Japanese Patent Laid-Open No. 11-135951 (published on May 21, 1999) JP 2008-187554 A (published August 14, 2008)

  However, in the camera module of Patent Document 3, the bonding wires 219a and 219b are covered with a light shielding member 210 made of an epoxy resin.

  The bonding wires 219a and 219b are for electrically connecting the terminal portion 217a and the connection terminal portion 218a, and the terminal portion 217b and the connection terminal portion 218b, respectively. Accompanies temperature changes.

  Due to the temperature change of the bonding wires 219a and 219b, the light-shielding member 210 that covers the bonding wires 219a and 219b expands and contracts, and may be peeled off from the bonding wires 219a and 219b, the terminal portions 217a and 217b, and the connection terminal portions 218a and 218b. is there.

  And when the light-shielding member 210 peels, the subject that the bonding wires 219a and 219b are disconnected at the connection location arises.

  Further, since the light shielding member 210 directly touches the bonding wires 219a and 219b, when the light shielding member 210 is poured, the bonding wires 219a and 219b arranged in advance are caused to flow downstream by the resin flow of the light shielding member 210. The bonding wires 219a and 219b may come into contact with each other and short-circuit.

  Thus, the camera module disclosed in Patent Document 3 has a problem of low electrical reliability.

  The present invention has been made to solve the above-described problems, and an object thereof is to prevent a reduction in electrical reliability of a thinned imaging apparatus while preventing a reduction in strength.

  In order to solve the above problems, an imaging apparatus of the present invention is an imaging apparatus having a substrate and an imaging element mounted on the substrate, and a first terminal disposed on the surface of the substrate, A wiring for electrically connecting to a second terminal disposed on the surface of the image sensor; the image sensor is disposed in a recess provided in the substrate; and the inner wall of the recess is disposed in the recess. In addition, a resin member is disposed so as to be in contact with the imaging element and to expose the first and second terminals and the wiring.

  According to the above configuration, the imaging element is disposed in the concave portion of the substrate, and the resin member is disposed so as to contact the inner wall of the concave portion and the imaging element. It is possible to reduce the thickness and prevent the strength of the substrate from being lowered due to the provision of the recess.

  Further, since the resin disposed in the recess is disposed so as to expose the first and second terminals and the wiring, the resin is subject to temperature changes of the first and second terminals and the wiring. The accompanying expansion and contraction can be prevented, and as a result, a decrease in electrical reliability due to the placement of the resin can be prevented.

  Moreover, it is preferable that the depth of the said recessed part is deeper than the thickness of the image pick-up element distribute | arranged to the said recessed part. According to the said structure, since the contact area of the inner wall of the said recessed part and the said resin can fully be ensured, the strength improvement effect by arrange | positioning the said resin to the said recessed part can fully be acquired.

  The substrate preferably has a cavity structure in which a space is provided, and circuit components are arranged in the space. With the above configuration, the circuit component can be arranged in the substrate, so that the imaging apparatus as a whole can be thinned.

  Further, it is preferable that an infrared light shielding filter is disposed on the surface of the substrate so as to cover the concave portion. With the above configuration, the strength of the substrate can be improved, and foreign matter can be prevented from adhering to the image sensor in the recess.

  Moreover, it is preferable that the said resin member is distribute | arranged only between the side wall in the said recessed part, and the side wall of the said image pick-up element. According to the said structure, adhesion with the said resin member, the said 1st and 2nd terminal, and the said wiring can be prevented reliably.

  Moreover, it is preferable that a step is formed by at least one of the end portions of the substrate by the recess. According to the said structure, the connection member for connecting the said board | substrate and an external circuit can be inserted in the said level | step-difference part, and the said connection member and the said board | substrate can be electrically connected. Thereby, the said imaging device can be reduced in thickness.

  Also, a lens is arranged inside, a housing that is the surface of the substrate and covers the imaging device is disposed, and the resin member is so covered as to cover a connection portion between the housing and the substrate surface It is preferable that different resin members are arranged. With the above configuration, the strength of the entire imaging apparatus can be improved.

  An image pickup apparatus according to the present invention is an image pickup apparatus having a substrate and an image pickup device mounted on the substrate, the first terminal arranged on the surface of the substrate, and the surface of the image pickup device. Wiring that electrically connects to the second terminal, the image sensor is disposed in a recess provided in the substrate, the recess is in contact with the inner wall of the recess and the image sensor, A resin member is disposed so as to expose the first and second terminals and the wiring.

  Thereby, there is an effect of preventing a reduction in electrical reliability of the thinned imaging apparatus while preventing a reduction in strength.

It is sectional drawing showing the structure of the camera module which concerns on one Embodiment of this invention. It is the figure which expanded the area | region A shown in FIG. It is a perspective view of the cavity board | substrate which has a recessed part with the circumference | surroundings surrounded by the thick part. It is a perspective view of the cavity board | substrate which has a recessed part by which 2 sides were surrounded by the thick part among 4 sides. It is a perspective view of the conventional board | substrate with which the recessed part is not provided. It is sectional drawing of the principal part of a camera module showing a mode that the surface of a cavity board | substrate is higher than the surface of the image pick-up element stored in the recessed part of a cavity board | substrate. It is sectional drawing of the principal part of a camera module showing a mode that the surface of a cavity board | substrate is lower than the surface of the image pick-up element stored in the recessed part of a cavity board | substrate. It is a figure showing the structure of the camera module which concerns on one Embodiment of this invention. It is a figure showing the structure of the camera module which concerns on one Embodiment of this invention. It is a figure showing the structure of the camera module which concerns on one Embodiment of this invention. It is sectional drawing showing the structure of the conventional camera module. It is sectional drawing showing the structure of the camera module using the conventional die-bonding sheet. It is sectional drawing showing the structure of the conventional camera module.

  Hereinafter, embodiments of the present invention will be described in detail.

  An embodiment of the imaging apparatus according to the present invention will be described below with reference to FIGS.

(Configuration of camera module)
First, the structure of the camera module according to the present embodiment will be described with reference to FIGS.

  FIG. 1 is a cross-sectional view illustrating a configuration of a camera module according to the present embodiment. FIG. 2 is an enlarged view of a region A that is the periphery of the main part shown in FIG.

  The camera module (imaging device) 20 is a camera module that can capture external scene information and obtain an electrical signal for creating image data regardless of whether it is a moving image or a still image. The camera module 20 can be mounted on, for example, a portable terminal such as a communication device that has been reduced in size and thickness.

  The camera module 20 is, for example, a camera module such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). This is merely an example, and the camera module 20 is not particularly limited to CCD / CMOS.

  The camera module 20 includes a cavity substrate (substrate) 11 that is a base substrate, a holder 1 that is a housing and is disposed so as to protrude from the surface (upper surface) 11 a of the cavity substrate 11, The lens 2 that is separated and stored in the holder 1, the image sensor 4 that is mounted on the cavity substrate 11 and converts external scene information into an electrical signal, and the lens 2 and the image sensor 4 are arranged. An IR cut filter (infrared light shielding filter) 3 that shields the infrared light, a bonding wire (wiring) 5 that electrically connects the image sensor 4 and the cavity substrate 11, and the cavity substrate 11. An electrical component 6, a flexible substrate (connecting member) 8 outside the holder 1 and having one end disposed on the surface of the cavity substrate 11, and a flexible substrate A lower surface of and a connector 9 arranged at the other end opposite the one end.

  Further, depending on the product to which the camera module 20 is applied, a DSP (Digital Signal Processing) circuit (not shown) that processes an electrical signal from the image pickup device 4 and peripheral components (not shown) of the image pickup device 4 and the DSP circuit. ) Etc. may be provided.

  The lower surface of the flexible substrate 8 and the vicinity of one end thereof are in contact with the vicinity of the end of the surface 11a of the cavity substrate 11, and the cavity substrate 11 and the flexible substrate 8 are electrically connected by solder or an ACF sheet. It is connected. The connector 9 is a terminal for electrically connecting the camera module 20 to an external circuit through the flexible substrate 8.

  The holder 1 covers the lens 2, the IR cut filter 3, and the image sensor 4, and has an opening at the tip.

  In plan view, the opening of the holder 1, the lens 2, the IR cut filter 3, and the image sensor 4 overlap. The lens 2 has a structure for connecting an image on the image sensor 4.

  Thereby, the external light that has passed through the opening of the holder 1 passes through the lens 2 and the IR cut filter 3 in order, and enters the light receiving portion (not shown) of the image sensor 4. And the image pick-up element 4 acquires the incident light, ie, images, and converts it into an electrical signal.

  The IR cut filter 3 is fixed to the inner wall of the holder 1 by bonding the peripheral edge. The IR cut filter 3 is arranged away from all of the lens 2, the image sensor 4, and the cavity substrate 11.

  A recess 15 for storing the image pickup device 4 is provided in a region of the surface 11 a of the cavity substrate 11 and covered with the holder 1. The recess 15 stores the image sensor 4 and is filled with resin 13. The resin 13 is disposed between the inner wall of the recess 15 and the end of the image sensor 4.

  As described above, the concave portion 15 is provided on the surface 11a of the cavity substrate 11, and the imaging device 4 is stored and fixed in the concave portion 15, so that the lens 2 and the imaging device 4 are optically required. And the thickness of the entire camera module 20 can be reduced, and the thickness and size can be reduced.

  Moreover, in order to ensure the strength of the camera module, a general substrate needs to have a thickness of 200 μm or more, or a hard material such as ceramic needs to be used.

  On the other hand, the cavity substrate 11 can reinforce the strength of the cavity substrate 11 by being filled with the resin 13 in the recess 15. Thereby, the fall of the intensity | strength as the camera module 20 whole can be prevented.

  That is, the cavity substrate 11 such as a problem that the cavity substrate 11 breaks in a process such as a test of the production process of the camera module 20 and a problem that the convenience of the user needs to be handled after shipping, etc. By providing the recess 15 in the substrate, it is possible to prevent the occurrence of various problems due to the strength of the cavity substrate 11 being lowered.

  As an example, the cavity substrate 11 can ensure the same strength as a substrate on which a normal recess 15 is not formed, even if the lower thickness where the recess 15 is provided is about 100 μm to 150 μm. it can.

  Further, the cavity substrate 11 is not limited to a hard material such as ceramic, and may be formed of, for example, a resin substrate or a glass epoxy substrate. Even with such a material, sufficient strength can be secured, so that the range of material selection can be expanded and the degree of freedom in design can be improved.

  The cavity substrate 11 is a multilayer wiring substrate in which a plurality of layers are stacked. The cavity substrate 11 has a cavity structure in which one or more spaces are provided. The cavity substrate 11 is provided with electrical components (circuit components) 6 in the internal space.

  Thus, by making the cavity board | substrate 11 into a cavity structure, the one or some electrical component 6 can be distribute | arranged in a board | substrate. Thereby, compared with the case where all the electrical components 6 are distribute | arranged to the surface 11a or back surface of the cavity board | substrate 11, the cavity board | substrate 11 can be thinned. As a result, the camera module 20 as a whole can be thinned.

  In addition, by disposing the electrical component 6 in the cavity substrate 11, the strength of the cavity substrate 11 can be ensured while satisfying the electrical function of the cavity substrate 11.

  The cavity substrate 11 only needs to function as a base substrate, and is not limited to a cavity substrate or a multilayer wiring substrate.

  Of the surface 11 a of the cavity substrate 11, a terminal (first terminal) 11 </ b> T for electrical connection with the image sensor 4 is disposed near the outer peripheral edge of the recess 15. A plurality of terminals 11T may be disposed on the surface 11a of the cavity substrate 11 so as to surround the periphery of the recess 15 for one week, or a plurality of terminals 11T may be disposed along two opposing sides of the recess 15, A plurality of the plurality of sides of the recess 15 may be arranged along one side.

  The image sensor 4 is stored in the recess 15. Most of the central portion of the surface (upper surface) 4a of the image sensor 4 is a light receiving portion (not shown). The light receiving unit is disposed in a region overlapping the lens 2 and the IR cut filter 3 in plan view.

  Examples of the image pickup device 4 include a CCD device and a CMOS device, but are not limited thereto.

  A terminal (second terminal) 4T for electrical connection with the cavity substrate 11 is disposed on the peripheral surface that is the outer surface of the light receiving unit on the surface 4a of the image pickup device 4. A plurality of terminals 4T may be arranged on the surface 4a of the imaging element 4 so as to surround the light receiving portion for one week along the outer periphery of the imaging element 4, or a plurality of terminals 4T are arranged along two opposing sides of the imaging element 4. Alternatively, a plurality of the plurality of sides of the image sensor 4 may be arranged along one side.

  The bonding wire 5 is a wiring that electrically connects the cavity substrate 11 and the image sensor 4 by connecting the terminal 11T on the cavity substrate 11 side and the terminal 4T on the image sensor 4 side. One end 5a of the bonding wire 5 is connected to the terminal 11T, and the other end 5b is connected to the terminal 4T.

  Through this bonding wire 5, electric power or an electric signal may be input from the terminal 11T on the cavity substrate 11 side to the terminal 4T on the imaging device 4 side, or from the terminal 4T on the imaging device 4 side to the cavity substrate. You may make it output the electrical signal etc. which were imaged and converted by the image pick-up element 4, for example to the terminal 11T of 11 side.

  The terminals 4T and 11T and the bonding wire 5 may be any metal material having high conductivity, and the materials generally used as terminals and bonding wires can also be used in this embodiment.

  An example of the constituent material of the terminal 4T is aluminum. Moreover, as an example of the constituent material of the terminal 11T, for example, nickel plated with gold can be used.

  As an example of the constituent material of the bonding wire 5, gold, aluminum, copper, or the like can be given.

  The temperatures of the terminals 4T and 11T and the bonding wire 5 rise rapidly due to the operation of the camera module 20. When the operation of the camera module 20 stops, the temperature returns to room temperature. As described above, the terminals 4T and 11T and the bonding wire 5 are members that frequently change in temperature due to the operation of the camera module 20 and the stop of the operation.

  For this reason, the resin (resin member) 13 is disposed so as to be in contact with the inner wall (side wall / bottom surface) of the recess 15 and the image sensor 4 and to expose the terminals 4T and 11T and the bonding wire 5.

  As described above, the resin 13 is disposed so as to be in contact with the inner wall (side wall / bottom surface) of the recess 15 and the image sensor 4, whereby the strength of the cavity substrate 11 can be reinforced. Thereby, the strength of the cavity substrate 11 can be improved. That is, it is possible to prevent a decrease in strength of the cavity substrate 11 due to the provision of the recess 15 in the cavity substrate 11.

  The resin 13 does not have to touch the terminals 4T and 11T and the bonding wire 5, and from the side wall (ridge line) in the recess 15 and the side wall (ridge line) of the image sensor 4 to the cavity substrate 11 side and the image sensor 4 side, respectively. It may protrude. Further, the resin 13 may enter between the back surface of the recess 15 and the back surface of the image sensor 4.

  However, when the resin 13 is applied, if it protrudes to the cavity substrate 11 side and the image pickup device 4 side, it easily comes into contact with the terminals 4T and 11T and the bonding wire 5, and the back surface of the recess 15 and the back surface of the image pickup device 4 When an amount that is so large as to enter between the two is applied, it is easy to protrude to the cavity substrate 11 side and the image sensor 4 side.

  For this reason, in particular, the resin 13 is preferably disposed only between the side wall (ridge line) in the recess 15 and the side wall (ridge line) of the imaging element 4.

  Thus, when the resin 13 is applied in the recess 15, the resin 13 flows along the side wall (ridge) in the recess 15 and the side wall (ridge) of the image sensor 4. It can prevent that it protrudes on the surface of the board | substrate 11 or the image pick-up element 4, and contacts with the terminal 4T * 11T and the bonding wire 5. FIG. That is, it is possible to reliably prevent the resin 13 from adhering to the terminals 4T and 11T and the bonding wire 5.

  The resin 13 can be formed, for example, by applying various thermosetting, UV curable, or UV thermosetting resin materials and then solidifying.

  An example of the constituent material of the resin 13 is an epoxy resin. Further, the epoxy resin may be blackened to make the resin 13 light-shielding. Thereby, it is possible to prevent unnecessary external light from entering the image sensor 4.

  Further, the resin 13 is arranged separately from the terminal 11T on the cavity substrate 11 side, the terminal 4T on the imaging element 4 side, and the bonding wire 5. In other words, the resin 13 is disposed in the recess 15 so that the terminals 4T and 11T and the bonding wire 5 are exposed.

  As described above, the resin 13 is disposed by being separated from the terminals 4T and 11T and the bonding wire 5 that frequently change in temperature, and is exposed, so that the resin 13 that accompanies the temperature change of the terminals 4T and 11T and the bonding wire 5 is provided. Can be prevented from expanding and contracting. Thereby, it is possible to prevent the occurrence of an electrical failure such as a disconnection or a short circuit between the bonding wire 5 and the terminals 4T and 11T due to the expansion and contraction of the resin 13.

  Further, the resin 13 is disposed away from the bonding wire 5, and it is not necessary to directly contact the bonding wire 5 when applying the resin 13 into the recess 15. For this reason, when the resin 13 is applied into the recess 15, there is no inconvenience such as the bonding wire 5 flowing and coming into contact with another bonding wire 5 or short-circuiting.

  In this manner, by disposing the resin 13 away from the terminals 4T and 11T and the bonding wire 5, it is possible to prevent a decrease in electrical reliability due to the resin 13 being disposed in the recess 15.

(Planar shape of recess)
Next, the planar shape of the recess will be described with reference to FIGS.

  The shape of the recess 15 depends on the planar shape of the image sensor 4, but may be any shape that can store at least the image sensor 4. As an example, a shape as shown in FIG. 3 or 4 can be mentioned.

  FIG. 3 is a perspective view of the cavity substrate 11 having a recess 15 surrounded by a thick portion. FIG. 4 is a perspective view of the cavity substrate 11 having a recess 15 in which two of the four sides are surrounded by a thick portion.

  As shown in FIG. 3, when the image sensor 4 is substantially square, the recess 15 also has a one-dimensional shape of the recess 15 around the image sensor 4 as shown in FIG. 3 (the image sensor 4 can be stored). It may be a substantially planar shape which is enlarged to the extent. The concave portion 15 shown in FIG. 3 has a shape surrounded by a thick portion of the cavity substrate 11.

  Or as shown in FIG. 4, the structure where a thick part extends along two opposing sides of the recessed part 15 may be sufficient. In the case of the shape of the concave portion 15 shown in FIG. 4, the thick portion of the cavity substrate 11 is formed on the outer side of the concave portion 15 at the end in the direction intersecting the extending direction of the thick portion of the cavity substrate 11. An end that intersects the inner wall is included.

  In the cavity substrate 11, the thickness of the periphery of the recess 15 can be secured as a thick portion, which greatly contributes to ensuring the strength of the cavity substrate 11.

  For this reason, from the viewpoint of securing the substrate strength, the thick portion is formed along the four sides of the concave portion 15 from the configuration of FIG. 4 formed so that the thick portion extends along the two sides of the concave portion 15. By extending, the shape of the concave portion 15 of FIG. 3 surrounded by a thick portion is preferable. Thereby, the recess 15 can be formed in the cavity substrate 11 while sufficiently ensuring the strength of the cavity substrate 11.

  On the other hand, from the viewpoint of thinning, the structure of FIG. 4 is preferable to the structure of FIG.

  As in the cavity substrate 11 shown in FIG. 4, a step is formed by the recess 15 at two opposite ends of the end portions, so that at least one step portion of the flexible substrate 8 is at least one step portion. The end portion can be inserted to electrically connect the flexible substrate 8 and the cavity substrate 11. Thereby, the camera module 20 can be thinned as a whole. In addition, like the cavity substrate 11 shown in FIG. 4, it is not necessary that the two opposing end portions of the end portions have a step formed by the recess 15, and at least one of the end portions is It is only necessary that a step is formed by the recess 15.

  FIG. 5 is a perspective view of a conventional substrate in which no recess is provided. As shown in FIG. 5, the conventional substrate 16 is not formed with a recess, and has a flat plate shape. When the image pickup device 4 is provided on the surface of the substrate 16, it is necessary to move the lens position upward in order to secure the optical distance by at least the thickness of the image pickup device 4, and it is difficult to reduce the thickness of the camera module. .

(Depth of recess)
Next, a preferable depth of the recess 15 will be described with reference to FIGS. It is preferable that the recess 15 is deeper than the thickness of the image sensor 4 housed inside.

  FIG. 6 is a cross-sectional view of the main part of the camera module showing that the surface of the cavity substrate 11 is higher than the surface of the imaging element 4 stored in the recess 15 of the cavity substrate 11.

  FIG. 7 is a cross-sectional view of the main part of the camera module showing that the surface of the cavity substrate 11 is lower than the surface of the imaging element 4 stored in the recess 15 of the cavity substrate 11.

  In the cavity substrate 11 shown in FIG. 6, a recess 15 is formed with a depth that allows the image pickup device 4 stored therein to be completely stored in the recess 15. That is, the cavity substrate 11 shown in FIG. 6 is formed with a recess 15 that is deeper than the thickness of the image sensor 4 housed inside.

  Since the image sensor 4 is stored in the recess 15, the surface (upper surface) 11 a of the cavity substrate 11 is higher than the surface (upper surface) 4 a of the image sensor 4. Further, a resin 13 is disposed between the inner wall of the recess 15 and the end of the image sensor 4.

  For this reason, a sufficient bonding area between the inner wall of the recess 15 and the resin 13 can be secured, and a sufficient bonding strength can be secured. Thereby, the strength improvement effect of the cavity substrate 11 by filling the resin 13 in the recesses can be sufficiently obtained.

  On the other hand, in the cavity substrate 11 shown in FIG. 7, a recess 15 </ b> B shallower than the recess 15 is formed instead of the recess 15. That is, the cavity substrate 11 shown in FIG. 7 is formed with a recess 15B that is shallower than the thickness of the imaging element 4 housed inside.

  The image sensor 4 is housed in the recess 15 </ b> B, and the resin 13 is disposed between the inner wall of the recess 15 </ b> B and the end of the image sensor 4. The recess 15B is shallower than the recess 15, and the surface (upper surface) 11a of the cavity substrate 11 shown in FIG. 7 is lower than the surface (upper surface) 4a of the image sensor 4.

  When the depth is shallow like the recess 15B, the bonding area between the inner wall of the recess 15B and the resin 13 is small, and the bonding strength is insufficient. For this reason, the effect of improving the strength of the cavity substrate 11 by filling the resin 15 in the recess 15B cannot be sufficiently obtained.

  For this reason, the depth of the recess 15 is formed deeper than the thickness of the image sensor 4 stored in the recess 15, the image sensor 4 is stored in the recess 15, and the gap between the inner wall of the recess 15 and the image sensor 4 is further increased. Is filled with resin 13. Thereby, a sufficient adhesion area between the inner wall of the recess 15 and the resin 13 can be secured, and the strength of the cavity substrate 11 can be sufficiently improved.

(Modification of camera module)
Next, modified examples of the camera module 20 will be described with reference to FIGS.

  FIG. 8 is a diagram illustrating a configuration of the camera module 21 according to an embodiment. The camera module 21 has a configuration in which an electrical component 14 is further added to the camera module 20. Other configurations of the camera module 21 are the same as those of the camera module 20.

  The electrical component 14 is disposed on the surface 11 a of the cavity substrate 11 and around the recess 15. The electrical component 14 is disposed in the holder 1.

  The electrical component 14 may be connected to an external circuit through various circuits arranged on the cavity substrate 11, the electrical component 6 stored in the cavity in the cavity substrate 11, or the flexible substrate 8.

  As described above, by providing the electrical component 14, the multifunctional camera module 21 can be obtained.

  FIG. 9 is a diagram illustrating a configuration of the camera module 22 according to an embodiment. The camera module 22 has a configuration in which a resin (resin member) 33 is further added to the camera module 20. Other configurations of the camera module 22 are the same as those of the camera module 20.

  The resin 33 is disposed on the outside of the holder 1 and on the surface of the cavity substrate 11 so as to cover the contact portion between the holder 1 and the cavity substrate 11. Thereby, the contact strength between the holder 1 and the cavity substrate 11 can be improved, and the strength of the entire camera module 21 can be improved.

  The resin 33 can be made of the same material as the resin 13.

  The resin 33 may be arranged along the holder 1 so as to go around the holder 1 or may be arranged in a part of the circumference of the holder 1.

  Further, the resin 33 may be disposed so as to cover a connection portion between one end of the flexible substrate 8 and the cavity substrate 11. Thereby, the connection strength between the flexible substrate 8 and the cavity substrate 11 can be improved, and the strength of the camera module 22 as a whole can be improved.

  As the cavity substrate 11, as shown in FIG. 4, when the thick portion is disposed only along the two sides of the recess 15, the lower end portion of the holder 1 and the surface of the thick portion of the cavity substrate 11. The bottom end of the holder 1 and the surface of the recess 15 (ie, the bottom surface of the recess 15) are separated from each other, and a space is provided.

  Therefore, as described above, the flexible substrate 8 may be inserted into this space. That is, one end portion of the flexible substrate 8 is inserted into the step portion of the end portion where the step portion is formed by the recess 15 among the four end portions of the cavity substrate 11. As a result, one end of the flexible substrate 8 is disposed in the recess 15.

  Then, the resin 33 is disposed on the stepped portion, that is, the recess 15 so as to cover one end of the flexible substrate 8 inserted into the recess 15.

  Thereby, while improving the connection strength of the cavity board | substrate 11 and the flexible substrate 8, the thickness of the connection part of the cavity board | substrate 11 and the flexible substrate 8 can be made thin. In this case, the resin 33 and the resin 13 may be used together.

  FIG. 10 is a diagram illustrating a configuration of the camera module 23 according to an embodiment. The camera module 23 is different from the camera module 20 in the position where the IR cut filter 3 of the camera module 20 is arranged. Other configurations of the camera module 23 are the same as those of the camera module 20.

  In the camera module 23, the IR cut filter 3 is not fixed to the inner wall of the holder 1, but is disposed on the surface of the cavity substrate 11 so as to cover the recess 15. The IR cut filter 3 has an opening for exposing the terminals 4T and 11T. Through the opening of the IR cut filter 3, the bonding wire 5 electrically connects the terminal 4T and the terminal 11T.

  As described above, the IR cut filter 3 is arranged on the surface of the cavity substrate 11 so as to cover the recess 15, thereby improving the strength of the cavity substrate 11 and improving the strength of the entire camera module 23. It is possible to prevent dust and foreign matter from adhering to the image sensor 4 stored in the recess 15.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The present invention can be used in an imaging apparatus.

1 Holder (housing)
2 Lens 3 IR cut filter (infrared shading filter)
4 Image sensor 4T terminal (second terminal)
4a Surface 5 Bonding wire (wiring)
6 Electrical parts (circuit parts)
8 Flexible substrate (connection member)
11 Cavity substrate (substrate)
11T terminal (first terminal)
11a Surface 13 Resin (resin member)
14 electrical component 15 recess 15 in recess 15B recess 16 substrate 20 camera module (imaging device)
21 Camera module (imaging device)
22 Camera module (imaging device)
23 Camera module (imaging device)
33 Resin (resin member)

Claims (7)

An imaging apparatus having a substrate and an image sensor mounted on the substrate,
A wiring for electrically connecting the first terminal disposed on the surface of the substrate and the second terminal disposed on the surface of the imaging element;
The image sensor is arranged in a recess provided in the substrate,
An image pickup apparatus, wherein a resin member is arranged in the recess so as to be in contact with the inner wall of the recess and the image sensor and to expose the first and second terminals and the wiring.   The imaging apparatus according to claim 1, wherein a depth of the concave portion is deeper than a thickness of an imaging element arranged in the concave portion.   The imaging apparatus according to claim 1, wherein the substrate has a cavity structure in which a space is provided, and circuit components are disposed in the space.   The imaging apparatus according to claim 1, wherein an infrared light shielding filter is disposed on the surface of the substrate so as to cover the concave portion.   5. The imaging apparatus according to claim 1, wherein the resin member is disposed only between a side wall in the recess and a side wall of the imaging element.   The imaging apparatus according to claim 1, wherein a step is formed by at least one of the end portions of the substrate by the concave portion. A lens is arranged inside, a housing that is the surface of the substrate and covers the imaging element is arranged,
The imaging apparatus according to claim 1, wherein a resin member different from the resin member is disposed so as to cover a connection portion between the housing and the substrate surface. .