JP2014003134A - High heat dissipation type electronic component storing package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high heat dissipation type electronic component storing package, which stores an electronic component in a hollow state, and having the high connection reliability and airtightness reliability of a bonding wire.SOLUTION: In a high heat dissipation type electronic component storing package 10, an electronic component 11 is mounted in a cavity portion 19 of a joint body 18 equipped with a heat sink plate 12, a ceramic frame body 13, and an external connection lead terminal 14, and the electronic component 11 and the external connection lead terminal 14 are electrically conducted through a bonding wire 16. Then, the electronic component 11 is airtightly stored in a hollow state by joining a cover body 21 between the joint body 18 upper surface and the electronic component 11 through resin adhesive 20, and generated heat from that is dissipated through the heat sink plate 12. Except for a part connecting the bonding wire 16 on an upper surface of one terminal portion of the external connection lead terminal 14, at a part to which the cover body 21 is joined through the resin adhesive 20, a plurality of inclined groove-shaped, cross groove-shaped, or a dimple-shaped recessed portions 23 are provided.

Description

  The present invention provides a heat sink plate for dissipating heat generated from a semiconductor element, a ceramic frame on the upper surface of the heat sink plate, and an upper surface of a joined body for brazing and joining external connection lead terminals to the upper surface of the ceramic frame. High heat dissipation that seals and stores electronic components such as semiconductor elements mounted in a cavity formed by a heat sink plate and a ceramic frame in a hollow state by joining a lid to the resin through a resin adhesive The present invention relates to a package for storing type semiconductor elements.

  As shown in FIGS. 3A and 3B, conventionally, a high heat radiation type electronic component storage package 50 is made of, for example, silicon for RF (Radio Frequency) base stations, gallium arsenide field effect transistors, or the like. It is used to house electronic components 51 such as high-frequency, high-power semiconductor elements. In such a high heat dissipation type electronic component storage package 50, the mounted electronic component 51 generates a large amount of heat at a high temperature. Therefore, the heat is quickly dissipated to reduce the function of the electronic component 51. In order to prevent this, the electronic component 51 can be directly mounted on the heat sink plate 52 having high thermal conductivity.

In addition, the high heat dissipation type electronic component storage package 50 has a cavity portion 53 that surrounds the electronic component 51 on the heat sink plate 52 and stores the electronic component 51 in a hollow state. Then, in order to form the cavity portion 53 can suppress the occurrence of warpage due to difference in thermal expansion coefficient between the ceramic, on the upper surface of the heat sink plate 52 made of a metal plate having excellent thermal conductivity, alumina (Al ₂ O ₃ ), And a window frame-shaped ceramic frame body 54 made of ceramic such as aluminum nitride (AlN) is provided by brazing and joining one main surface. The heat sink plate 52 having a high thermal conductivity and having a thermal expansion coefficient close to that of ceramic is, for example, a copper-tungsten composite metal plate formed by impregnating porous tungsten with copper, or copper and molybdenum. The metal plate etc. which clad the copper plate on each of both surfaces of a system metal plate can be used.

  Further, this high heat dissipation type electronic component storage package 50 has a KV (Fe—Ni—) whose thermal expansion coefficient is similar to that of the ceramic for electrically connecting to the outside on the other main surface of the ceramic frame 54. Co-base alloy, trade name “Kovar”) and 42 alloy (Fe—Ni base alloy) metal plate such as 42 external connection lead terminal 55 is brazed to one terminal portion lower surface, external connection lead The other terminal portion of the terminal 55 is provided so as to protrude outward from the outer peripheral edge of the ceramic frame body 54 in a butterfly shape. In this high heat dissipation type electronic component storage package 50, an electronic component 51 is mounted in a cavity portion 53 of a joined body 56 in which a heat sink plate 52, a ceramic frame body 54, and an external connection lead terminal 55 are brazed and joined. The component 51 and the external connection lead terminal 55 are connected by a bonding wire 57 so as to be electrically connected. Then, the high heat dissipation type electronic component storage package 50 in which the electronic component 51 is mounted in the cavity portion 53 is joined to the upper surface of the joined body 56 with a lid 59 via a resin adhesive 58, and the cavity portion 53. The electronic component 51 mounted on the housing is hermetically sealed and accommodated in a hollow state, and heat generated from the electronic component 51 can be radiated to the outside through the heat sink plate 52.

  As shown in FIGS. 4A and 4B, the recent high heat dissipation electronic component storage package 50a is provided with a new external connection lead terminal 55a in addition to the conventional external connection lead terminal 55, so that the number of terminals is increased. There is an increasing number of products that improve the functions in the frequency band used for communication. As in the case of the high heat dissipation type electronic component storage package 50, the heat dissipation plate 52, the ceramic frame body 54, and the external connection lead terminals 55 and 55a are brazed and joined to the high heat dissipation type electronic component storage package 50a. The electronic component 51 is mounted in the cavity portion 53 of the joined body 56a, and the electronic component 51 and the external connection lead terminals 55 and 55a are connected by the bonding wire 57 so as to be electrically connected. Then, the high heat dissipation type electronic component storage package 50a in which the electronic component 51 is mounted in the cavity portion 53 is joined to the upper surface of the joined body 56a with the lid 59 via the resin adhesive 58, and the cavity portion 53. The electronic component 51 mounted on the housing is hermetically sealed and accommodated in a hollow state, and heat generated from the electronic component 51 can be radiated to the outside through the heat sink plate 52.

  The high heat dissipation type electronic component storage packages 50 and 50a as described above are arranged so that the tip of one terminal portion of the external connection lead terminals 55 and 55a does not protrude toward the cavity portion 53 side. One terminal portion lower surface is brazed and joined to most of the narrow frame width portion of the other main surface of the window frame-shaped ceramic frame body 54 to form joined bodies 56 and 56a. Further, the electronic components 51 are mounted on the upper surfaces of the heat sink plate 52 with a brazing material, and the electronic components 51 and the external connection lead terminals 55 and 55a are connected with bonding wires 57 and mounted on the bonded bodies 56 and 56a. Ni plating film and Au plating film are formed on all metal parts exposed on the surface in order to prevent oxidation or sulfuration due to contact with outside air. In the high heat radiation type electronic component storage package 50, 50a in which the electronic component 51 is mounted on the joined body 56, the lid 59 has the upper surface of the ceramic frame 54, and the upper surfaces of the external connection lead terminals 55, 55a. Are formed so as to be filled with a resin adhesive 58 so as to fill the step on the upper surface of the joined body 56 between them.

  The high heat radiation type electronic component storage packages 50 and 50a are formed by rolling a metal plate on which the external connection lead terminals 55 and 55a are formed into a desired shape by punching or etching. It has been. Then, after the external connection lead terminals 55 and 55a are joined bodies 56 and 56a, many portions on the upper surface of the ceramic frame body 54 of the joined bodies 56 and 56a are covered with the external connection lead terminals 55 and 55a. It has become. In particular, in the high heat dissipation electronic component housing package 50a, most of the upper surface of the ceramic frame 54 of the joined body 56a is covered with the external connection lead terminals 55 and 55a.

  A semiconductor element is die-bonded to a die pad of a lead frame, which is a conventional external connection lead terminal, and one terminal portion of the lead frame is connected to the semiconductor element with a bonding wire, and the other terminal portion is exposed to the outside, so that the semiconductor element is A lead frame used in a conventional semiconductor device that melts and seals a sealing resin is subjected to a rough surface processing on a surface in contact with the sealing resin, thereby improving the adhesion and improving the airtight reliability of the semiconductor element. Improvements have been proposed (see, for example, Patent Document 1 and Patent Document 2).

JP 61-39556 A Japanese Unexamined Patent Publication No. 63-67662

However, the conventional high heat dissipation electronic component storage package as described above has the following problems.
(1) A conventional high heat dissipation type electronic component storage package is used with a resin adhesive joint used to store an electronic component stored in a cavity in a hollow state so that the electronic component is covered with a lid. Most of the contact surfaces are external connection lead terminals with a gold-plated film surface with extremely excellent surface roughness, and can be firmly bonded to the bonding wire connection, even if the bonding wire is hollow in the cavity Although the connection strength can be maintained, the anchor effect to the external connection lead terminal surface by the resin adhesive is extremely low, and the bonding strength of the lid bonded to the bonded body is reduced, so that the electronic component stored in the cavity part Airtight reliability has been reduced.
(2) A high heat dissipation type electronic component storage package using an external connection lead terminal as disclosed in Japanese Patent Application Laid-Open No. 61-39556 and Japanese Patent Application Laid-Open No. 63-67662 includes an electronic component and a bonding wire. Bonding is performed so as to cover the melted sealing resin including the connected external connection lead terminal portion, and the surface of the external connection lead terminal for connecting the bonding wire is rough and the bonding wire connection strength is weak. However, when this sealing resin is used so that the bonding wire is in a hollow state in the cavity, the connection reliability of the bonding wire to the external connection lead terminal cannot be secured.

  The present invention has been made in view of such circumstances, and provides a package for storing a high heat radiation type electronic component that stores electronic components in a hollow state and has high bonding reliability and airtight reliability. With the goal.

  The high heat dissipation type electronic component storage package according to the present invention that meets the above-described object includes a flat heat sink plate, a ceramic frame body that brazes and joins one main surface of a window frame shape to the upper surface of the heat sink plate, and a ceramic frame. The lower surface of one terminal part is brazed and joined to the other main surface of the body, and the other terminal part is provided with an external connection lead terminal that protrudes to the outside from the outer peripheral edge of the ceramic frame body. An electronic component is mounted on a cavity formed by the upper surface of the heat sink plate of the joined body having a plating film and the inner peripheral side wall surface of the ceramic frame, and the electronic component and the external connection lead terminal are electrically connected via a bonding wire. After making the conductive state, the lid is bonded to the upper surface of the bonded body via a resin adhesive, and the electronic component mounted in the cavity portion is hermetically sealed and stored in a hollow state. And a high heat dissipation type electronic component storage package that dissipates heat from the electronic component through the heat sink plate, except for a portion to which the bonding wire on the upper surface of one terminal portion of the external connection lead terminal is connected. A plurality of concave portions having an inclined groove shape, a cross groove shape, or a dimple shape are provided at a portion to be joined through the resin adhesive.

  The high heat dissipation electronic component storage package includes a flat heat sink plate, a ceramic frame body that brazes and joins one main surface of the window frame shape to the upper surface of the heat sink plate, and the other main surface of the ceramic frame body. A joint body having an external connection lead terminal for brazing the lower surface of one terminal part to the outside and projecting the other terminal part from the outer peripheral edge of the ceramic frame body, and having an Au plating film on a metal part exposed to the outside After mounting an electronic component on the cavity formed by the upper surface of the heat sink plate and the inner peripheral side wall surface of the ceramic frame, and making the electronic component and the external connection lead terminal electrically conductive via a bonding wire, A lid is bonded to the upper surface of the bonded body via a resin adhesive, and the electronic component mounted in the cavity is hermetically sealed and stored in a hollow state. This is a high heat dissipation type electronic component storage package that dissipates heat through a heat sink plate, and the lid body is connected via a resin adhesive except for the part where the bonding wire on the upper surface of one of the external connection lead terminals is connected. Since there are a plurality of recesses in the shape of inclined grooves, cross grooves, or dimples in the parts to be joined, there is a recess that is a part that connects the electronic component and the bonding wire on the upper surface of one terminal part of the external connection lead terminal. The bonding wire can be firmly connected to the Au plating film surface that is not provided, and the connection reliability of the bonding wire can be ensured. Along with this, the high heat radiation type electronic component storage package described above is a part where the lid is joined via a resin adhesive except for the part where the bonding wire on the upper surface of one of the external connection lead terminals is connected. Thus, the lid can be firmly bonded by giving an anchor effect to the adhesive resin between the surface of the Au plating film provided with the concave portions, and the airtight reliability of the electronic component can be secured.

FIGS. 4A and 4B are a plan view and a vertical cross-sectional view taken along line A-A ′ of a high heat dissipation electronic component storage package according to an embodiment of the present invention, respectively. FIGS. FIGS. 7A and 7B are a plan view and a B-B ′ line longitudinal cross-sectional view, respectively, of a modification of the high heat dissipation electronic component storage package. (A) and (B) are a plan view and a C-C 'line longitudinal sectional view of a conventional high heat dissipation electronic component storage package, respectively. (A), (B) is the top view and D-D 'line longitudinal cross-sectional view of the modification of the package for the same high heat dissipation electronic component storage, respectively.

Subsequently, the best mode for carrying out the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
As shown in FIGS. 1A and 1B, a high heat dissipation electronic component storage package 10 according to an embodiment of the present invention is mounted on, for example, silicon or gallium for RF base stations. A heat sink plate 12 having a substantially rectangular flat plate shape having high heat dissipation characteristics for radiating a high temperature and a large amount of heat generated from an electronic component 11 such as a high-frequency, high-power semiconductor element such as an arsenic field effect transistor is provided. The heat sink plate 12 includes, for example, a copper-tungsten composite metal plate formed by impregnating porous tungsten with copper, a laminated metal plate in which a copper plate is clad on both sides of a copper-molybdenum-based metal plate, A high thermal conductivity of a bonded metal plate or the like obtained by brazing a copper plate on both surfaces of an insulating substrate having high thermal conductivity made of aluminum nitride, silicon nitride, etc. The metal plate which can suppress the curvature which generate | occur | produces from can be used.

In the high heat dissipation electronic component storage package 10 described above, one main surface of a window frame shape serving as a lower surface is heated and brazed to the upper surface of the heat sink plate 12 via a brazing material such as Ag-Cu brazing. A ceramic frame 13 is provided. For the ceramic frame 13, a ceramic having high electrical insulation, such as alumina (Al ₂ O ₃ ) or aluminum nitride (AlN), is used. In addition, the ceramic frame 13 before brazing and joining to the heat sink plate 12 is provided with a metallized film formed of a conductive metal such as tungsten or molybdenum on the entire circumference of one main surface of the window frame shape as the lower surface. Further, a first nickel plating film such as nickel or nickel-cobalt is applied thereon. Furthermore, in order to braze and join an external connection lead terminal 14 to be described later to the ceramic frame 13, a conductive metal such as tungsten or molybdenum similar to the above is formed on the other main surface of the window frame shape which is the upper surface. The metallized pattern formed in (1) is provided, and a first nickel plating film such as nickel or nickel-cobalt is further provided thereon.

  The high heat dissipation type electronic component storage package 10 is brazed by heating the lower surface of one terminal portion to the other main surface of the window frame-shaped ceramic frame body 13 via a brazing material such as Ag-Cu brazing. An external connection lead terminal 14 is provided that joins and projects the other terminal portion from the outer peripheral edge of the ceramic frame 13 to the outside. For the external connection lead terminal 14, a metal plate made of an Fe—Ni—Co alloy or a Fe—Ni alloy whose thermal expansion coefficient approximates that of the ceramic of the ceramic frame 13 is used. The external connection lead terminal 14 is directly connected to the electronic component 11 via a bonding wire 15 to be in an electrically conductive state, and a wire bond pad portion 16 for being electrically connected to the outside. A terminal portion 17 is provided, and the external connection lead terminal 14 can perform two functions.

  The high heat dissipation electronic component storage package 10 includes a heat sink plate 12, a ceramic frame 13, and an external connection lead terminal 14, and a second nickel such as nickel or nickel-cobalt is exposed on a metal portion exposed to the outside. A cavity portion 19 is formed by the upper surface of the heat sink plate 12 of the joined body 18 having the plated coating and the Au plated coating thereon, and the inner peripheral side wall surface of the ceramic frame 13. Then, in the high heat dissipation electronic component storage package 10, the electronic component 11 is joined to the upper surface of the heat sink plate 12, which is the bottom surface of the cavity portion 19, by heat scrubbing via an AuSi brazing material. The electronic component 11 is mounted so as to surround the peripheral side wall surface.

  In the high heat dissipation type electronic component storage package 10 in which the electronic component 11 is mounted in the cavity portion 19, each end portion of the bonding wire 15 is connected to a predetermined pad portion of the electronic component 11 and a wire bond pad of the external connection lead terminal 14. Each of the parts 16 is wire-bonded to electrically connect the electronic component 11 and the external connection lead terminal 14 via the bonding wire 15. The high heat dissipation type electronic component storage package 10 has a lid 21 bonded to the upper surface of the bonded body 18 via a resin adhesive 20 so that the electronic component 11 mounted in the cavity portion 19 is in a hollow state. Airtightly sealed and stored. At the same time, the high heat dissipation type electronic component storage package 10 storing the electronic component 11 radiates heat generated by the operation of the electronic component 11 to the outside via the heat sink plate 12. The material of the resin adhesive 20 is not particularly limited, and a heat-resistant adhesive resin such as an epoxy adhesive resin, a silicone adhesive resin, or an olefin adhesive resin can be used. . Moreover, the material and shape of the lid 21 are not particularly limited, and a resin having heat resistance and airtightness, or an insulating substrate such as ceramic can be used.

  The high heat radiation type electronic component storage package 10 described above has a lid 21 except for the wire bond pad portion 16 which is a portion to which the bonding wire 15 on the upper surface of one terminal portion of the external connection lead terminal 14 used for this is connected. Has a plurality of recesses 23 in the lid joint portion 22, which is a portion to be joined via the resin adhesive 20. The plurality of recesses 23 are arranged in an inclined groove shape in which a plurality of recesses 23 are arranged in parallel, in a cross groove shape in which a plurality of crossing each other in a cross-beam shape, or in a plurality of circles, polygons, etc. It is made of dimples. In addition, although the formation method of the recess 23 is not particularly limited, the recess 23 can be formed in the lid joint portion 22 by pressing, etching, sandblasting, or the like after the outer shape of the external connection lead terminal 14 is formed. A plating film is provided after the formation.

  In the high heat dissipation electronic component storage package 10 described above, the concave portion 23 is not formed in the wire bond pad portion 16 which is a portion to which the bonding wire 15 of the external connection lead terminal 14 is connected, and the Au plating film surface is flat. Therefore, the bonding wire 15 can be connected to the external connection lead terminal 14 in a normal state. Further, in the high heat dissipation electronic component housing package 10 described above, a plurality of recesses 23 are formed in the lid joint portion 22 where the lid 21 of the external connection lead terminal 14 is joined via the resin adhesive 20. Since the Au plating film surface is uneven, the anchor effect of the resin adhesive 20 on the external connection lead terminal 14 can be drawn out and the lid 21 can be firmly joined to the external connection lead terminal 14. . In addition, although the recessed part 23 does not specifically limit the magnitude | size of the external shape, the anchor effect of the resin adhesive 20 can be enlarged by providing many in the cover body joining part 22 in which Au plating film was formed, The peeling of the resin adhesive 20 from the external connection lead terminal 14 can be prevented. Further, the depth of the recess 23 is not particularly limited, but the anchor effect of the resin adhesive 20 can be brought out without any problem at about 5 to 50 μm.

  As shown in FIGS. 2A and 2B, a high heat dissipation type electronic component storage package 10a as a modified example of the above high heat dissipation type electronic component storage package 10 includes a high heat dissipation type electronic component storage package 10. In addition to the external connection lead terminals 14 used in the above, there are new external connection lead terminals 14a that increase the number of terminals and improve the function in the frequency band used for communication. As in the case of the high heat dissipation type electronic component storage package 10, the heat dissipation plate 12, the ceramic frame 13, and the external connection lead terminals 14 and 14 a are brazed and joined to the high heat dissipation type electronic component storage package 10 a. The electronic component 11 is mounted in the cavity portion 19 of the joined body 18a, and the electronic component 11 and the wire bond pad portion 16 of the external connection lead terminals 14 and 14a are connected by the bonding wire 15 to be in an electrically conductive state. I am doing so. Then, the high heat radiation type electronic component storage package 10a in which the electronic component 11 is mounted in the cavity part 19 is joined to the upper surface of the joined body 18a with the lid 21 via the resin adhesive 20, and the cavity part 19 is joined. The electronic component 11 mounted on the housing is hermetically sealed and accommodated in a hollow state, and the heat generated from the electronic component 11 can be radiated to the outside through the heat sink plate 12.

  The high heat dissipation type electronic component storage package 10a is similar to the case of the external connection lead terminals 14 used in the high heat dissipation type electronic component storage package 10, and each of the external connection lead terminals 14 and 14a used therein is used. Except for the wire bond pad portion 16 which is a portion to which the bonding wire 15 on the upper surface of one terminal portion is connected, a plurality of recesses are formed in the lid joint portion 22 where the lid body 21 is joined via the resin adhesive 20. 23. The plurality of recesses 23 are arranged in an inclined groove shape in which a plurality of recesses 23 are arranged in parallel, in a cross groove shape in which a plurality of crossing each other in a cross-beam shape, or in a plurality of circles, polygons, etc. It is made of dimples. The formation method of the concave portion 23 is not particularly limited, but is formed in the lid joint portion 22 by forming the outer shape of the external connection lead terminals 14 and 14a by pressing, etching, sandblasting, or the like. The plating film is provided after the formation.

  As in the case of the high heat dissipation electronic component storage package 10, the high heat dissipation electronic component storage package 10 a is a wire bond that is a portion to which the bonding wires 15 of the external connection lead terminals 14 and 14 a are connected. Since the recess portion 23 is not formed in the pad portion 16 and the Au plating film surface is flat, the bonding wire 15 can be connected to the external connection lead terminals 14 and 14a in a normal state. In addition, the high heat dissipation electronic component storage package 10a has a plurality of lid joint portions 22 which are portions to which the lid bodies 21 of the external connection lead terminals 14 and 14a are joined via the resin adhesive 20. Since the recess 23 is formed and the surface of the Au plating film is uneven, the anchor effect of the resin adhesive 20 on the external connection lead terminals 14 and 14a is pulled out to attach the lid 21 to the external connection lead terminals 14 and 14a. Can be firmly bonded to each other. In addition, although the recessed part 23 does not specifically limit the magnitude | size of the external shape, the anchor effect of the resin adhesive 20 can be enlarged by providing many in the cover body joining part 22 in which Au plating film was formed, The peeling of the resin adhesive 20 from the external connection lead terminals 14 and 14a can be prevented. Further, the depth of the recess 23 is not particularly limited, but the anchor effect of the resin adhesive 20 can be brought out without any problem at about 5 to 50 μm.

  The high heat dissipation type electronic component storage package according to the present invention has a high frequency, high output semiconductor element such as silicon or gallium arsenide field effect transistor mounted thereon, for example, for an RF (Radio Frequency) base station. It can be used as an electronic device.

  10, 10a: High heat dissipation type electronic component storage package, 11: Electronic component, 12: Heat sink plate, 13: Ceramic frame, 14, 14a: External connection lead terminal, 15: Bonding wire, 16: Wire bond pad part, 17: terminal part, 18, 18a: joined body, 19: cavity part, 20: resin adhesive, 21: lid body, 22: lid body joining part, 23: recessed part

Claims (1)

A flat heat sink plate, a ceramic frame body that brazes and joins one main surface of the window frame shape to the upper surface of the heat sink plate, and a lower surface of one terminal portion is brazed and joined to the other main surface of the ceramic frame body In addition, an external connection lead terminal for projecting the other terminal portion from the outer peripheral edge of the ceramic frame body to the outside, an upper surface of the heat sink plate of the joined body having an Au plating film on a metal portion exposed to the outside, and the ceramic An electronic component is mounted on a cavity formed on the inner peripheral side wall surface of the frame, and the electronic component and the external connection lead terminal are electrically connected via a bonding wire, and then the upper surface of the bonded body The lid is joined via a resin adhesive, and the electronic component mounted in the cavity is hermetically sealed and stored in a hollow state. The A high heat dissipation type electronic component storing package to dissipate through the heat sink plate,
Except for the portion where the bonding wire on the upper surface of one terminal portion of the external connection lead terminal is connected, the lid is joined to the portion to be joined via the resin adhesive, in the form of an inclined groove, a cross groove, or a dimple. A high heat dissipation type electronic component storage package comprising a plurality of recesses.

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