JP2013542143A5 - - Google Patents

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Publication number
JP2013542143A5
JP2013542143A5 JP2013535217A JP2013535217A JP2013542143A5 JP 2013542143 A5 JP2013542143 A5 JP 2013542143A5 JP 2013535217 A JP2013535217 A JP 2013535217A JP 2013535217 A JP2013535217 A JP 2013535217A JP 2013542143 A5 JP2013542143 A5 JP 2013542143A5
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JP
Japan
Prior art keywords
blister
electronic sensor
sensor monitoring
conductive grid
monitoring tag
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013535217A
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English (en)
Japanese (ja)
Other versions
JP5927620B2 (ja
JP2013542143A (ja
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Publication date
Priority claimed from CA 2719054 external-priority patent/CA2719054A1/en
Application filed filed Critical
Publication of JP2013542143A publication Critical patent/JP2013542143A/ja
Publication of JP2013542143A5 publication Critical patent/JP2013542143A5/ja
Application granted granted Critical
Publication of JP5927620B2 publication Critical patent/JP5927620B2/ja
Active legal-status Critical Current
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JP2013535217A 2010-10-27 2011-10-26 取り外し可能且つ再使用可能な電気回路基板を用いた使い捨て可能な内容物使用観察包装 Active JP5927620B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CA2,719,054 2010-10-27
CA 2719054 CA2719054A1 (en) 2010-10-27 2010-10-27 A disposable content use monitoring package with a removable re-usable electronic circuit board
PCT/CA2011/001189 WO2012055021A1 (en) 2010-10-27 2011-10-26 A disposable content use monitoring package with a removable re-usable electronic circuit board

Publications (3)

Publication Number Publication Date
JP2013542143A JP2013542143A (ja) 2013-11-21
JP2013542143A5 true JP2013542143A5 (cg-RX-API-DMAC7.html) 2015-06-18
JP5927620B2 JP5927620B2 (ja) 2016-06-01

Family

ID=45991492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013535217A Active JP5927620B2 (ja) 2010-10-27 2011-10-26 取り外し可能且つ再使用可能な電気回路基板を用いた使い捨て可能な内容物使用観察包装

Country Status (11)

Country Link
US (1) US9101530B2 (cg-RX-API-DMAC7.html)
EP (1) EP2632819B1 (cg-RX-API-DMAC7.html)
JP (1) JP5927620B2 (cg-RX-API-DMAC7.html)
KR (1) KR101462130B1 (cg-RX-API-DMAC7.html)
CN (1) CN103249653B (cg-RX-API-DMAC7.html)
AU (1) AU2011320064B2 (cg-RX-API-DMAC7.html)
CA (2) CA2719054A1 (cg-RX-API-DMAC7.html)
DE (1) DE112011103562B4 (cg-RX-API-DMAC7.html)
FI (1) FI124605B (cg-RX-API-DMAC7.html)
GB (1) GB2498906B8 (cg-RX-API-DMAC7.html)
WO (1) WO2012055021A1 (cg-RX-API-DMAC7.html)

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FI20145693L (fi) * 2014-07-25 2016-01-26 Nallen Kylpyhuoneet Ja Saunat Oy Järjestelmä ja menetelmä rakenteen kosteuden mittaamiseksi
US10952927B2 (en) 2014-10-10 2021-03-23 QuantaEd, LLC Apparatus for monitoring the content of a container and method therefor
WO2016070272A1 (en) 2014-11-04 2016-05-12 Intelligent Devices Sezc Inc. Means for monitoring compliance, facilitating automatic dispensing and childproofing strip packaged medication
US10930383B2 (en) 2015-07-03 2021-02-23 Cuepath Innovation Inc. Connected sensor substrate for blister packs
AU2016289097B2 (en) * 2015-07-03 2020-10-08 Cuepath Innovation Inc. Connected sensor substrate for blister packs
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WO2019075102A1 (en) 2017-10-10 2019-04-18 QuantaEd, LLC INTELLIGENT PACKAGING FOR ENHANCED MEDICATION REGIME OBSERVANCE
BE1026328B1 (fr) * 2018-05-30 2020-01-13 Aardex Group S A Emballage pour medicaments
CN109044848B (zh) * 2018-07-25 2024-06-21 广东南海启明光大科技有限公司 电子药物包装
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