JP2013516081A - 裏面電極型の太陽電池の製造方法 - Google Patents
裏面電極型の太陽電池の製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 110
- 238000005530 etching Methods 0.000 claims abstract description 43
- 238000009792 diffusion process Methods 0.000 claims abstract description 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 11
- 239000010703 silicon Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 37
- 239000006227 byproduct Substances 0.000 claims description 13
- 238000007650 screen-printing Methods 0.000 claims description 5
- 150000002500 ions Chemical class 0.000 description 10
- 238000002955 isolation Methods 0.000 description 10
- 239000012535 impurity Substances 0.000 description 7
- 238000001039 wet etching Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000005360 phosphosilicate glass Substances 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000004298 light response Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical compound ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
- H01L31/02245—Electrode arrangements specially adapted for back-contact solar cells for metallisation wrap-through [MWT] type solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
- H01L31/022458—Electrode arrangements specially adapted for back-contact solar cells for emitter wrap-through [EWT] type solar cells, e.g. interdigitated emitter-base back-contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
- H01L31/0682—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells back-junction, i.e. rearside emitter, solar cells, e.g. interdigitated base-emitter regions back-junction cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
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- Life Sciences & Earth Sciences (AREA)
- Sustainable Energy (AREA)
- Sustainable Development (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
これとともに、基板101表面のエミッタ層102と基板101裏面のp+領域の電気的短絡、そしてn電極105とp電極106の短絡を防止するために、基板101の表面と裏面とにはそれぞれアイソレーション用トレンチ107が具備される。このようなアイソレーション用トレンチ107は、通常、レーザー照射などにて形成される。
エミッタ層が形成された特定の領域の基板の厚みの一部を一回のエッチング工程にて除去することで、基板の表面と裏面との間のアイソレーションを容易に実現することができ、基板の表面にレーザー照射によるアイソレーショントレンチが設けられないことで、受光面積を極大化させることができるようになる。
先ず、図2及び図3aに示すように、第1の導電型の結晶質シリコン基板301を準備し、基板301を垂直貫通するビアホール302を所定の間隔を隔てて形成する(S201)。次いで、第1の導電型のシリコン基板301の表面に凹凸303が形成されるようにテクスチャリング(texturing)工程を行なう(S202)。前記テクスチャリング工程は、基板301表面における光反射を低減するためのことであり、湿式エッチング方法または反応性イオンエッチングなどの乾式エッチング方法を用いて行なうことができる。ここで、前記第1の導電型はp型またはn型であり、後述する第2の導電型は、第1の導電型の逆であり、以下の説明では、第1の導電型はp型であることを基準にする。
Claims (5)
- ビアホールが設けられたp型のシリコン基板を準備するステップと、
拡散工程を実施して基板の周りに沿って高濃度エミッタ層を形成するステップと、
前記基板の表面及び裏面上に基板の一部を選択的に露出するエッチングマスクを形成するステップと、
前記エッチングマスクから露出した領域の基板の厚みの一部をエッチングして当該領域の高濃度エミッタ層を除去するステップと、
前記基板の表面上に反射防止膜を形成するステップ、及び前記基板の表面にグリッド電極を形成し、前記基板の裏面にn電極及びp電極を形成するステップと
を含むことを特徴とする裏面電極型の太陽電池の製造方法。 - 前記基板の表面のエッチングマスクはグリッド電極が形成される部位に具備され、前記基板の裏面のエッチングマスクはn電極が形成される部位に具備されることを特徴とする請求項1に記載の裏面電極型の太陽電池の製造方法。
- 前記エッチングマスクから露出した領域の基板の一部の厚みをエッチングして当該領域の高濃度エミッタ層を除去するステップにおいて、
前記基板の厚みの一部がエッチングされるとともに拡散副産物層も合わせてエッチングされて除去され、前記基板の表面において前記エッチングマスクによって露出しない領域は、高濃度エミッタ層を保持し、露出して基板の厚みの一部がエッチングされた領域は、低濃度エミッタ層を形成することを特徴とする請求項1に記載の裏面電極型の太陽電池の製造方法。 - ビアホールが設けられたp型のシリコン基板を準備するステップと、
拡散工程を実施して基板周りに沿って高濃度エミッタ層を形成するステップと、
前記基板の表面のグリッド電極が形成される部位及び前記基板の裏面のn電極が形成される部位以外の基板を所定の厚みにエッチングして高濃度エミッタ層を除去するステップと、
前記基板の表面上に反射防止膜を形成するステップ、及び前記基板の表面にグリッド電極を形成し、前記基板の裏面にn電極及びp電極を形成するステップと
を含むことを特徴とする裏面電極型の太陽電池の製造方法。 - 前記基板の表面のグリッド電極が形成される部位及び前記基板の裏面のn電極が形成される部位以外の基板を所定の厚みにエッチングして高濃度エミッタ層を除去するステップにおいて、
エッチングペーストをインクジェット方式またはスクリーン印刷方式にて基板上に塗布して基板を所定の厚みにエッチングし、前記基板の表面においてエッチングされていない領域は、高濃度エミッタ層を保持し、所定の厚みにエッチングされた領域は、低濃度エミッタ層を形成することを特徴とする請求項4に記載の裏面電極型の太陽電池の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090131577A KR101383395B1 (ko) | 2009-12-28 | 2009-12-28 | 후면전극형 태양전지의 제조방법 |
KR10-2009-0131577 | 2009-12-28 | ||
PCT/KR2010/009066 WO2011081336A2 (ko) | 2009-12-28 | 2010-12-17 | 후면전극형 태양전지의 제조방법 |
Publications (1)
Publication Number | Publication Date |
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JP2013516081A true JP2013516081A (ja) | 2013-05-09 |
Family
ID=44226964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012546994A Pending JP2013516081A (ja) | 2009-12-28 | 2010-12-17 | 裏面電極型の太陽電池の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8481356B2 (ja) |
EP (1) | EP2521187A4 (ja) |
JP (1) | JP2013516081A (ja) |
KR (1) | KR101383395B1 (ja) |
CN (1) | CN102770968A (ja) |
WO (1) | WO2011081336A2 (ja) |
Families Citing this family (12)
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US9153713B2 (en) | 2011-04-02 | 2015-10-06 | Csi Cells Co., Ltd | Solar cell modules and methods of manufacturing the same |
US9281435B2 (en) | 2011-05-27 | 2016-03-08 | Csi Cells Co., Ltd | Light to current converter devices and methods of manufacturing the same |
KR101854241B1 (ko) * | 2011-12-13 | 2018-06-15 | 주성엔지니어링(주) | 태양 전지 및 그 제조 방법 |
KR101341831B1 (ko) | 2011-12-23 | 2013-12-17 | 한화케미칼 주식회사 | 후면 전극 태양전지의 제조방법 |
WO2013095010A1 (en) * | 2011-12-23 | 2013-06-27 | Hanwha Chemical Corporation | Manufacturing method of back contact solar cell |
CN102569437B (zh) * | 2012-01-05 | 2014-05-07 | 中山大学 | 一种电场钝化背面点接触晶体硅太阳电池及其制备工艺 |
AP2015008340A0 (en) | 2012-10-10 | 2015-04-30 | Xyleco Inc | Treating biomass |
US8574951B1 (en) * | 2013-02-20 | 2013-11-05 | National Tsing Hua University | Process of manufacturing an interdigitated back-contact solar cell |
CN103337553B (zh) * | 2013-06-04 | 2016-03-23 | 南京日托光伏科技有限公司 | 一种薄膜覆盖正面电极的硅太阳能电池及其制造工艺 |
CN104425651B (zh) * | 2013-09-09 | 2016-08-10 | 上海理想万里晖薄膜设备有限公司 | 一种低温制备正面无栅极的异质结太阳电池的工艺 |
US9716192B2 (en) * | 2014-03-28 | 2017-07-25 | International Business Machines Corporation | Method for fabricating a photovoltaic device by uniform plating on emitter-lined through-wafer vias and interconnects |
CN111843185B (zh) * | 2020-07-22 | 2022-03-11 | 江苏亚威艾欧斯激光科技有限公司 | 一种选择性发射极激光制造装置 |
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- 2009-12-28 KR KR1020090131577A patent/KR101383395B1/ko not_active IP Right Cessation
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2010
- 2010-12-17 WO PCT/KR2010/009066 patent/WO2011081336A2/ko active Application Filing
- 2010-12-17 US US13/519,227 patent/US8481356B2/en not_active Expired - Fee Related
- 2010-12-17 EP EP10841168.7A patent/EP2521187A4/en not_active Withdrawn
- 2010-12-17 CN CN201080064053XA patent/CN102770968A/zh active Pending
- 2010-12-17 JP JP2012546994A patent/JP2013516081A/ja active Pending
Patent Citations (4)
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JP2001044470A (ja) * | 1999-07-30 | 2001-02-16 | Hitachi Ltd | 太陽電池および太陽電池の製造方法並びに集光型太陽電池モジュール |
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Publication number | Publication date |
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CN102770968A (zh) | 2012-11-07 |
US8481356B2 (en) | 2013-07-09 |
KR20110075200A (ko) | 2011-07-06 |
EP2521187A2 (en) | 2012-11-07 |
US20120288980A1 (en) | 2012-11-15 |
WO2011081336A2 (ko) | 2011-07-07 |
EP2521187A4 (en) | 2015-11-04 |
WO2011081336A3 (ko) | 2011-11-17 |
KR101383395B1 (ko) | 2014-04-09 |
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