JP2013258219A - Radiator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure that is low cost and small in directivity of heat radiation, satisfying daily advancing requests from small communication terminal devices, home electric appliances, portable medical equipment, etc. in the recent years, because in the field of a relatively low power consumption-type heat sink, an extrusion molding-type heat sink, a corrugated fin, and the like are used, but the structure that is low cost and small in directivity of heat radiation does not exist.SOLUTION: A radiator is formed by stacking and integrating a plurality of cooling plates with the same shape. The cooling plates are stacked and fixed with rotating them by a constant angle centered on one point defined on the cooling plates, and thereby forming an overlapping part and a non-overlapping part between one cooling plate and its adjacent cooling plate. This overlapping part functions as a heat collection part, and the non-overlapping part as a heat radiation part.

Description

The present invention mainly relates to a structure of a cooler for cooling a semiconductor component or the like mounted on a printed wiring board or the like of an electronic device.

In recent years, the degree of integration of semiconductor components used in electronic devices has improved dramatically. On the other hand, downsizing and weight reduction of devices and further cost reduction have been demanded more severely than before. .
Under these circumstances, in the field of relatively low power consumption heat sinks, extrusion-type heat sinks are currently the mainstream, but many are drawn-type heat sinks, and recently, a thin plate is repeatedly bent into a corrugated shape. So-called corrugated fins joined to a base plate are also increasingly used. In addition, since it is costly because there is only a manufacturing method for cutting, so-called disk-type fins in which a thin disk is cut into several layers from a round bar metal material are also employed. In both cases, the principle of heat dissipation is by bringing the fins into contact with the outside air, so it can be said that the basic theme is how to arrange a large surface area in a limited space. .

Japanese Patent No. 3158893 JP 2009-283672 A JP 2003-031743 A

  In other words, it is an electronic component that is inherently vulnerable to heat, but it itself is a heating element, and the installation position and its volume that are allowed to cool this are accelerated and made compact and lightweight. From the environment that has been gradually restricted according to the demands of the past, the old structure has been deceived, a structure that meets the needs of the times has been proposed, a part of it has been implemented, and eventually it will also be deceived There is the present situation.

For example, in the case of the extrusion-type heat sink that is the mainstream, one that is derived from the manufacturing method and basically has one kind of cross-section (there is a part that has been cut off by adding cutting) Therefore, efficient heat dissipation is only possible when installed in a certain direction along the shape of the fin, and the heat dissipation characteristics are effective in devices installed in a certain direction, but recent small communication terminal devices and household appliances In portable medical devices and the like, it has become very difficult for manufacturers to constrain their installation direction with the diversification of user installation conditions. In addition, there is a problem that it is difficult to reduce the weight, so the structure for the next generation is insufficient.
In addition, corrugated fins that have been repeatedly bent into a corrugated shape and joined to the base plate, and offset fins that have been partly offset bent to improve heat dissipation have been developed. Although these have been reduced in weight, like the extruded fins and the like, they have directivity that increases heat dissipation with respect to a certain direction, and places where they can be used are limited.
Furthermore, in the sense of increasing the surface area of the portion in contact with the outside air, a structure in which a large number of thin heat sinks are stacked with a slight gap is very suitable, but this gap distance will be reduced. Then, the air in the gap becomes difficult to circulate, and on the contrary, a sufficient cooling effect may not be obtained.

Various other structures (for example, pin-type fins where this directivity is not remarkable) have been put on the market, but all issues such as heat radiation directivity that restricts installation conditions, securing sufficient space for heat release, etc. The current situation is that there is no ideal structure that has solved this problem, and no proposal has been made.

Accordingly, the present inventors have finally completed the present invention as a result of diligent research in view of the above-mentioned points, and the feature thereof is a cooler formed by stacking and integrating a plurality of cooling plates having the same shape. Then, the cooling plate is stacked and fixed while rotating by a predetermined angle around a predetermined point on the cooling plate, so that an overlapping portion and a non-overlapping portion are provided on one cooling plate and a cooling plate adjacent thereto. Is the point that was formed.
That is, it can be said that the present invention eliminates the disadvantage that the air in the gap is difficult to circulate while retaining the various advantages of the conventional structure in which a large number of thin heat sinks are stacked with a small gap.

  Here, the “cooling plate” is a structural unit of the cooler of the present invention, and a plurality of these are stacked to form a product. All the cooling plates to be stacked have the same shape, and are stacked while being rotated by a fixed angle around a predetermined point. The cooling plate may be a flat plate when stacked, but a part thereof may be bent or curved in consideration of heat dissipation efficiency. In the case of deformation such as bending or bending, all the cooling plates may be deformed in the same shape, but for example, all the cooling plates that bend only the uppermost layer of the stack have bent portions, but in the upper stage Even if the inclination angle changes so that the inclination approaches a right angle as the time goes, if the shape before the deformation is the same, it belongs to the category of “isomorphic”.

  The center of rotation is provided on the cooling plate. When it is rotated, there is always a portion that overlaps the adjacent cooling plate. Furthermore, in the present invention, it is essential to have a non-overlapping part (non-overlapping part). That is, the present invention is not particularly limited with respect to the overall shape of the cooling plate or the center point of rotation, but it is necessary that both overlapping and non-overlapping portions exist. Therefore, for example, the cooling plate is an equilateral triangle, and the center of the equilateral triangle is set as the center of rotation and the layers are rotated while being rotated by 120 degrees, or the circle is rotated about the center, etc. Since there is no overlapping part, it is excluded from the scope of rights of the present invention. Note that there is no limitation on the rotation angle (the amount of deviation from the adjacent cooling plate). When the size is obtained by dividing 360 by an integer such as 45 degrees, 60 degrees, 90 degrees, etc., it will return to the original position in a state where several sheets are laminated, which is somewhat advantageous in terms of aesthetics or heat dissipation effect. However, there is no special need to return to the original position in a state where several sheets are stacked.

The overlapping part overlaps mainly as a heat collecting part as a cooler, and the non-overlapping part functions as a heat dissipation part. In terms of the cooling function as a whole, it is naturally preferable that both the heat collecting ability and the heat releasing ability are large.
Regarding the heat collecting ability, it can be dealt with by increasing the contact area with the heating element, increasing the volume of the overlapping portion, and increasing the adhesion between the cooling plates during lamination.
Regarding the heat dissipation capability, there are various measures such as enlarging the heat dissipation part itself, decreasing the thickness toward the front end side of the heat dissipation part, and increasing the surface area by making a zigzag cut at the front end.

The material of the cooling plate is preferably aluminum, copper, or titanium as long as the inventor made a prototype experiment. However, the cooling plate may be appropriately selected as long as it meets the purpose of the cooler, and is not limited in the present invention.
The thickness of the cooling plate is practically about 0.15 mm to 1.50 mm, but it may not be a constant thickness as described above. Therefore, the thickness is not limited in the present invention.

  There is no particular limitation on the method of connecting the cooling plates. As far as the inventor has made a prototype experiment, it is preferable to connect them by brazing or caulking. In particular, the linking method of integrating by the burring caulking method comprehensively integrates reliable integration without impairing thermal conductivity, work efficiency, reduction of manufacturing costs by not using separate parts such as eyelets and rivets, etc. As a result, it seemed optimal.

The burring caulking method is originally a method in which the cylindrical projecting portion of the “part subjected to burring treatment” is passed through the hole of the “part with hole” and then subjected to pressure deformation and joined.
When this is applied to the present invention, it is necessary to provide both the above-mentioned “hole” and “projection” on the cooling plate. And, if it is stacked as it is without rotating the cooling plate, the `` holes '' and `` projections '' will be opposed to each other, so that the arrangement of `` holes '' and `` projections '' is reversed, Two types of cooling plates are required. However, in the present invention, each cooling plate is required to be rotated by a certain angle and stacked. Therefore, the installation position of the “hole” and the “projection” is designed so as to match this angle. Is one kind and convenient.

The cooler according to the present invention is a cooler formed by laminating and integrating a plurality of cooling plates having the same shape, and rotating the cooling plate by a predetermined angle around a predetermined point on the cooling plate. By laminating and fixing, one cooling plate and a cooling plate adjacent to it are characterized in that overlapping portions and non-overlapping portions are formed. It is an invention.
(1) It is not a method of cutting and forming heat radiation fins, but a plurality of identical cooling plates are stacked and fixed to form a cooler, so that the manufacturing cost is low.
(2) In order to improve the heat dissipation efficiency, the heat dissipation portion can be easily bent.

It is a schematic perspective view which shows roughly an example of the cooler concerning this invention. It is a schematic plan view which shows the cooling plate which is a structural unit of the cooler shown in FIG. (A) (b) shows the state which is going to laminate | stack the cooling plate shown in FIG. 2, (a) is a perspective view, (b) is a schematic sectional drawing. (A) thru | or (d) are all schematic plan views which show the other example about the shape of a cooler. (A) and (b) are all schematic perspective views showing still other examples of the shape of the cooling plate. (A) is a top view which shows the further another example about the shape of a cooling plate, (b) is a schematic perspective view which shows the cooler formed by laminating | stacking it. (A) thru | or (c) shows the further another example about the shape of a cooler, The figure (a) (b) is a partially exploded schematic perspective view, The figure (c) is a schematic perspective view. is there.

FIG. 1 shows an example of a cooler 1 according to the present invention (hereinafter referred to as “the present invention cooler 1”). As is apparent from the figure, the cooler 1 of the present example, when observed in a plan view, has a square with each side as one side (in the case of this example, not the square, but the outermost side). The side is an arc).
The cooler 1 of the present invention is formed by laminating a plurality of cooling plates 2 (9 in the illustrated example), and each cooling plate 2 has a shape shown in FIG. The cooling plate 2 of this example has a shape in which two square portions are arranged at point-symmetrical positions, but only one may be provided, or three may be provided at equal intervals (120 degree intervals). It may be (not shown).
In addition, since the aluminum plate about 1.0 mm thick was used for the cooling plate 2 of this example, the thickness of this invention cooler 1 is about 9.0 mm.

As shown in FIG. 2, the cooling plate 2 of this example is provided with two circular holes 21 and two cylindrical protrusions 22 formed by burring in its regular hexagonal portion. And the next cooling plate 2 is laminated | stacked on this, but it is made to become the positional relationship shifted | deviated only 60 degree | times in that case. As a result, the square portion is shaped to move to the adjacent side. That is, it can be said that the circular hole 21 and the cylindrical protrusion 22 are in a positional relationship shifted by a central angle of 60 degrees.
Moreover, in this example, since the process which pressurizes and deforms the cylindrical protrusion 22 which protruded the circular hole 21 is added, in order to prevent this deformation | transformation from changing the substantial thickness of the cooling plate 2, FIG. The countersunk holes shown in are applied. Thereby, the adhesion between the cooling plates 2 is maintained.
In addition, there are various methods for connecting the cooling plates to each other, and a method required by the situation may be adopted as appropriate. In the following drawings, the depiction of the circular hole 21, the cylindrical protrusion 22, and other structural parts for connection is omitted.

In this way, when adjacent cooling plates are stacked while being shifted by a certain angle (60 degrees), the regular hexagonal portions are in close contact with each other to become an overlapping portion A, and the square portion becomes a non-overlapping portion B. The same applies to the case where the third and subsequent sheets are laminated. At the stage where nine sheets are laminated, the thickness of the non-overlapping portion B is 1 mm everywhere, but the thickness of the overlapping portion A is 9 mm. When this is installed in a heat generating electronic component that is a cooling target, the overlapping portion A functions as a heat collecting portion, and the non-overlapping portion B functions as a heat radiating portion.

  The cooling plate 2 of the previous example had a shape in which a square having each side as one side was extended to two sides of a regular hexagon. However, the present invention is not limited to this. Depending on the properties of the heating element, restrictions on the installation space, etc., it may be rectangular instead of square, or it may have a shape as shown in FIGS.

  The figure (a) (b) is an example of a figure formed by extending two tangent lines from an arc and concentric with this circle and having a large diameter and this tangent line. Is an example in which the two tangents are almost parallel (the intersection angle is small), and in the case of (b), the intersection angle is large. In both cases, the shape after stacking is contained in a circle having a large diameter when viewed in plan, which is preferable in terms of design, but there is a difference in the form of heat collection and heat dissipation. Both are designed to be stacked by shifting by 60 degrees, but if the rotation angle is increased (for example, 90 degrees), the cooler has a small non-overlapping portion B, and if the angle is decreased (for example, 30 degrees), it is not It becomes a cooler with a large overlapping part B.

FIG. 3C shows an example in which the shape of the cooling plate 2 is a rectangle. This is rotated by 90 degrees to form the cooler 1. In this example, the ratio of the side lengths of the rectangles is 2: 1, and the overlapping portion A and the non-overlapping portion B are both square.
Even if the same rectangle is used, the overall shape of the cooler will change if the center of rotation is changed. An example thereof is shown in FIG.

In order to improve the heat dissipation capability, it is fundamental to design so that the area of the non-overlapping portion B becomes large when laminated as described above, but other than this, for example, as shown in FIGS. Such a method may be used.
FIG. 4A shows an example in which the front end side of the non-overlapping portion B is cut out in a zigzag shape, and FIG. 5B shows an example in which the thickness of the non-overlapping portion B is reduced toward the front end side. In either case, the heat dissipation capability is improved.

The cooling plate 2 has been shown as an example of a flat plate (strictly, FIG. 5B is not a flat plate). When the cooling plate 2 radiates heat, it means that heat energy is transmitted to the contacting air, and heat can be radiated by continuously replacing the air with unwarmed air.
On the other hand, the warmed air tends to move upward.
Therefore, if the heat dissipating part is bent or curved so that the upward movement of air is guided, the air circulation becomes smooth and the heat dissipating effect is increased.

  FIGS. 6A and 6B show an example. The overall shape of the cooling plate 2 is the same as that shown in FIG. 2, but the structure is such that the dividing line between the regular hexagonal part and the square part shown in FIG. Is different. Then, this is laminated and fixed by the method shown in FIG. Then, the cooler 1 as shown in FIG.

FIG. 7A shows an example in which a V-shaped portion is formed by bending instead of a single ridgeline. It is expected that the heat dissipation effect will be further improved by the warmed air being easily dissipated and dissipated.
FIG. 7B is an example in which the planar shape of the heat collecting portion is circular, and this is an example in which a non-overlapping portion is curved although this is due to this. The size and shape of the heat radiating portion and the degree of curvature may be appropriately adjusted according to design requirements, and are not limited to the illustrated shapes.
FIG. 7C shows an example in which the shape of the cooling plate 2 is the same as that in FIG. 1 or FIG. 6 and the number of stacked layers is also nine, but there are three types of bending ridge line positions and inclination angles. is there. This is an example in which the non-overlapping portion B is bent so that the three lower layers have a gentle slope (nearly horizontal), the upper three layers have a tight slope (near a right angle), and the middle three layers have a slope therebetween.

DESCRIPTION OF SYMBOLS 1 Cooler based on this invention 2 Cooling plate 21 Circular hole 22 Cylindrical protrusion A Overlapping part B Non-overlapping part

Claims (1)

  A cooler in which a plurality of cooling plates having the same shape are laminated and integrated, and the cooling plate is laminated and fixed while rotating by a predetermined angle around a predetermined point on the cooling plate, A cooler characterized in that an overlapping portion and a non-overlapping portion are formed on a cooling plate and a cooling plate adjacent thereto.

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