JP2013258175A5 - - Google Patents

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Publication number
JP2013258175A5
JP2013258175A5 JP2012131691A JP2012131691A JP2013258175A5 JP 2013258175 A5 JP2013258175 A5 JP 2013258175A5 JP 2012131691 A JP2012131691 A JP 2012131691A JP 2012131691 A JP2012131691 A JP 2012131691A JP 2013258175 A5 JP2013258175 A5 JP 2013258175A5
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JP
Japan
Prior art keywords
groove
emitting device
sealing member
semiconductor light
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012131691A
Other languages
English (en)
Japanese (ja)
Other versions
JP5976406B2 (ja
JP2013258175A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012131691A priority Critical patent/JP5976406B2/ja
Priority claimed from JP2012131691A external-priority patent/JP5976406B2/ja
Publication of JP2013258175A publication Critical patent/JP2013258175A/ja
Publication of JP2013258175A5 publication Critical patent/JP2013258175A5/ja
Application granted granted Critical
Publication of JP5976406B2 publication Critical patent/JP5976406B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012131691A 2012-06-11 2012-06-11 半導体発光装置 Expired - Fee Related JP5976406B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012131691A JP5976406B2 (ja) 2012-06-11 2012-06-11 半導体発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012131691A JP5976406B2 (ja) 2012-06-11 2012-06-11 半導体発光装置

Publications (3)

Publication Number Publication Date
JP2013258175A JP2013258175A (ja) 2013-12-26
JP2013258175A5 true JP2013258175A5 (cg-RX-API-DMAC10.html) 2014-12-18
JP5976406B2 JP5976406B2 (ja) 2016-08-23

Family

ID=49954394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012131691A Expired - Fee Related JP5976406B2 (ja) 2012-06-11 2012-06-11 半導体発光装置

Country Status (1)

Country Link
JP (1) JP5976406B2 (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013104840A1 (de) * 2013-05-10 2014-11-13 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung von strahlungsemittierenden Halbleiterbauelementen
TWI583028B (zh) * 2016-02-05 2017-05-11 行家光電股份有限公司 具有光形調整結構之發光裝置及其製造方法
JP7295437B2 (ja) * 2019-11-29 2023-06-21 日亜化学工業株式会社 発光装置
JP2025146385A (ja) * 2024-03-22 2025-10-03 スタンレー電気株式会社 半導体発光装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002170998A (ja) * 2000-12-01 2002-06-14 Sharp Corp 半導体発光装置およびその製造方法
JP4400786B2 (ja) * 2004-06-11 2010-01-20 シチズン電子株式会社 発光ダイオード
TW200943590A (en) * 2008-01-22 2009-10-16 Alps Electric Co Ltd Led package and manufacturing method therefor
JP2009246353A (ja) * 2008-03-10 2009-10-22 Opt Link Co Ltd Ｌｅｄ低背光源装置及びｌｅｄ低背光源装置の製造方法

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