JP2013254784A - Chassis structure of electronic apparatus housing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chassis structure of an electronic apparatus housing having a low cost and high mechanical performance and capable of realizing a light-weight structure.SOLUTION: A chassis structure of an electronic apparatus housing comprises: a metal frame 6 including two front side upper and lower bars 2 and 3 and two rear side upper and lower bars 4 and 5; metal board support plates 7 and 8 arranged on both side surfaces of the frame 6 and having protrusions (board holding parts) 11 for holding an electronic circuit board 12; an upper cover 15 disposed on an upper surface of the frame 6; a lower cover 16 disposed on a lower surface of the frame 6; a front panel 17 disposed on a front surface of the frame 6; and a rear panel 18 disposed on a rear surface of the frame 6. The upper cover 15, the lower cover 16, the front panel 17 and the rear panel 18 are formed of a single plate flat panel composed of a composite material.

Description

  Embodiments described herein relate generally to a chassis structure of an electronic device casing.

  In recent years, electronic equipment for aircraft has been required to be smaller and lighter. On the other hand, application to more severe environmental conditions (vibrations, impacts, static loads, etc.) is also demanded due to the increased mobility and the increased mobility associated with unmanned operation.

  On the aircraft body side, advanced composite materials such as CFRP (carbon fiber reinforced resin) are increasingly used in addition to conventional aluminum alloys and titanium alloys. However, such a material is very expensive, and its application to the on-board equipment side has been difficult to realize due to cost problems.

  In addition, many of the electronic devices for aircraft use an indirect air cooling structure. Here, the heat generated from the internal device of the electronic device case is conducted / transmitted to the side plate of the chassis made of aluminum alloy arranged inside the case, and forced to the chassis outside the case. Indirect cooling of the internal equipment of the housing is realized by flowing air.

JP 2010-67962 A

  However, when the chassis of an electronic device casing is made of a composite material, it is difficult to efficiently conduct / transmit heat generated from the internal equipment of the casing to the chassis side plate. It becomes difficult to apply an air cooling structure. Therefore, when an advanced composite material having excellent mechanical properties is used for an aircraft electronic device, there are problems of cost and indirect air cooling, which are difficult to realize.

  The embodiment has been made paying attention to the above circumstances, and is to provide a chassis structure of an electronic device casing that can realize a lightweight structure with low mechanical cost, high mechanical performance, and the like.

  According to the embodiment, a metal frame composed of two front upper and lower bars and two rear upper and lower bars, and a substrate holder that is disposed on both sides of the frame and holds a substrate of an electronic device. A metal substrate holding plate having a portion, an upper cover disposed on the upper surface of the frame, a lower cover disposed on the lower surface of the frame, a front panel disposed on the front surface of the frame, 1 is a chassis structure of an electronic device casing including a rear panel disposed on a rear surface. The upper cover, the lower cover, the front panel, and the rear panel are each formed by a single flat plate panel made of a composite material.

1 is an exploded perspective view showing a schematic configuration of an entire chassis structure of an electronic device housing according to a first embodiment. The perspective view which shows the base unit of the chassis of the electronic device housing | casing of 1st Embodiment. The top view which shows the internal structure of the chassis of the electronic device housing | casing of 1st Embodiment.

Hereinafter, embodiments will be described with reference to the drawings.
(Constitution)
1 to 3 show a first embodiment. FIG. 1 is an exploded perspective view showing a schematic configuration of an entire chassis structure of an electronic equipment casing mainly used in aircraft-mounted equipment. The chassis 1 of the electronic device casing of the present embodiment includes a metal frame 6 composed of two upper and lower bars 2 and 3 and two upper and lower bars 4 and 5, and both sides of the frame 6. A base unit 9 shown in FIG. 2 comprising metal substrate holding plates 7 and 8 disposed on the surface is provided. The base unit 9 is configured by fastening between the connecting portions of the substrate holding plates 7 and 8 on both sides of the base unit 9 and the bars 2, 3, 4, and 5 of the frame 6 with small metal fittings or the like. Yes.

  The frame 6 of the base unit 9 is formed by cutting an aluminum alloy. Each bar 2, 3, 4, 5 of the frame 6 is formed with a plurality of screw holes 10 for attaching a panel made of a composite material to be described later.

  The substrate holding plates 7 and 8 are made of an aluminum alloy. On the inner surface side of the substrate holding plates 7, 8, there are a plurality of protrusions (substrate holding portions) 11 that hold, for example, an electronic circuit board 12 (see FIG. 3) having a conductive cooling structure that is an internal device of the electronic device housing. It is installed side by side. These protrusions 11 extend in the vertical direction in FIG. As shown in FIG. 3, the electronic circuit board 12 incorporated in the chassis 1 of the electronic device casing is fixed in a state of being laid between the protrusions 11 of the left and right board holding plates 7 and 8. As a result, the heat generated from the electrical component (heat generating product) 12a mounted on the electronic circuit board 12 as shown by the dotted line arrow in FIG. 8 is formed with a heat transfer path for heat transfer.

  A heat sink 13 is formed on the outer surface side of the substrate holding plates 7 and 8. A plurality of fins 13a extending in the front-rear direction in FIG. Furthermore, a plurality of screw holes 14 are formed on the upper, lower and side surfaces of the substrate holding plates 7 and 8 for attaching a panel which will be described later made of a composite material.

  An upper cover 15 is disposed on the upper surface of the frame 6 of the base unit 9. A lower cover 16 is disposed on the lower surface of the frame 6. Horizontal covers 21 and 22 are arranged on the outer surface sides of the left and right substrate holding plates 7 and 8. Further, a front panel 17 is disposed on the front surface of the frame 6, and a rear panel 18 is disposed on the rear surface of the frame 6. The upper cover 15, the lower cover 16, the lateral covers 21 and 22, the front panel 17, and the rear panel 18 are each formed by a single flat plate panel made of a composite material. The flat panel of the composite material is formed of an advanced composite material such as CFRP (carbon fiber reinforced resin).

  The upper cover 15 has screw insertion holes (screw fixing portions) 19 at positions corresponding to the screw holes 10 of the front and rear upper bars 2, 4 and the screw holes 14 of the upper surfaces of the left and right substrate holding plates 7, 8. Is formed. Similarly, screw insertion holes 19 are formed in the lower cover 16 at positions corresponding to the screw holes 10 of the front and rear lower bars 3 and 5 and the screw holes 14 of the lower surfaces of the left and right substrate holding plates 7 and 8, respectively. Yes. The upper cover 15 is fixed by screwing unillustrated fixing screws to the screw holes 10 of the upper and lower upper bars 2, 4 and the screw holes 14 of the upper surfaces of the left and right substrate holding plates 7, 8 through the screw insertion holes 19. Thus, it is fixed to the upper surface of the frame 6. Similarly, in the lower cover 16, fixing screws (not shown) are fixed to the screw holes 10 of the front and rear lower bars 3 and 5 and the screw holes 14 on the lower surfaces of the left and right substrate holding plates 7 and 8 through screw insertion holes 19. By doing so, it is fixed to the lower surface of the frame 6. In the horizontal covers 21 and 22, screw insertion holes (screw fixing portions) 19 are formed at positions corresponding to the screw holes 14 on the side surfaces of the left and right substrate holding plates 7 and 8, respectively. The horizontal covers 21 and 22 are fixed by screwing fixing screws (not shown) through the screw insertion holes 19 into the screw holes 14 on the side surfaces of the left and right substrate holding plates 7 and 8, respectively. 8 is fixed to the outer surface.

  Further, the front panel 17 is fixed by screwing unillustrated fixing screws into the screw holes on the front surfaces of the front and rear upper bars 2 and 4 and the front surfaces of the left and right substrate holding plates 7 and 8 through screw insertion holes, respectively. The front surface of the frame 6 is fixed. Similarly, the rear panel 18 is fixed by screwing unillustrated fixing screws to the screw holes on the rear surfaces of the front and rear upper bars 2 and 4 and the rear surfaces of the left and right substrate holding plates 7 and 8 through screw insertion holes. Thus, it is fixed to the rear surface of the frame 6.

  As shown in FIG. 3, the rear panel 18 is provided with a plurality of blower devices 20a and 20b in the present embodiment. A blower fan is built in these blower devices 20a and 20b. Further, on the outer surface side of the chassis 1 of the electronic device casing, the periphery of the heat sink 13 on the outer surface side of the substrate holding plates 7 and 8 on both sides of the frame 6, the side covers 21 and 22, and the blower devices 20 a and 20 b A ventilation duct (not shown) is formed between the two.

  Then, by driving the blower devices 20a and 20b, an air passage through which cooling air flows is formed on the outer surface side of the chassis 1 of the electronic device housing as indicated by an arrow in FIG. At this time, the cooling air flows from the front side of the chassis 1 of the electronic device casing along the heat sink 13 between the substrate holding plates 7 and 8 on both sides of the frame 6 and the lateral covers 21 and 22 on the outer side. It flows to the rear side and is blown out from the blower devices 20a and 20b to the rear of the chassis 1 of the electronic device casing. Accordingly, the substrate holding plates 7 and 8 are cooled by forcibly flowing air along the heat sink 13 on the outer surface side of the substrate holding plates 7 and 8 outside the housing. Therefore, the heat generated from the electrical component (heat generating product) 12a mounted on the electronic circuit board 12 inside the electronic device casing is transferred to both sides of the circuit board 12 through the electronic circuit board 12, and further the protrusions. 11 is transferred to the substrate holding plates 7 and 8 through heat conduction, and at the same time, the substrate holding plates 7 and 8 are air-cooled by the cooling air flowing along the heat sink 13 outside the housing. An indirect air cooling structure for indirectly cooling the electrical component 12a of the electronic circuit board 12 inside the body is formed.

(Action / Effect)
Therefore, the above configuration has the following effects. That is, in the chassis structure using the composite material panel of the present embodiment, the frame 6 composed of the front upper and lower two bars 2 and 3 and the rear upper and lower two bars 4 and 5, and both sides of the frame 6 An indirect air cooling structure for cooling is formed by the base unit 9 shown in FIG. 2 comprising substrate holding plates 7 and 8 disposed on the surface. The base unit 9 is a frame made of an aluminum alloy and has a cooling structure equivalent to that of conventional equipment.

  Further, the upper surface of the frame 6 of the base unit 9 has an upper cover 15, the lower surface of the frame 6 has a lower cover 16, the lateral surface of the frame 6 has lateral covers 21 and 22, and the front surface of the frame 6 has a front surface. A rear panel 18 is disposed on the rear surface of the panel 17 and the frame 6. The upper cover 15, the lower cover 16, the lateral covers 21 and 22, the front panel 17, and the rear panel 18 are each formed by a single flat plate panel made of a composite material. The composite material used in the present embodiment is obtained by processing a panel (plate). Although it is generally an expensive composite material, a simple plate can be obtained at a low cost. Thereby, the indirect cooling structure can be realized by using the composite material having excellent mechanical properties at low cost and by the base unit 9 made of the aluminum alloy.

  Here, when a chassis is made using a composite panel having excellent mechanical properties, if the chassis is manufactured by integral molding of the composite material, the manufacturing becomes complicated and expensive. Furthermore, when a panel is manufactured from an aluminum alloy, complicated cutting or a rib structure is required instead of a simple plate because of problems such as strength and rigidity.

  On the other hand, in the present embodiment, the frame 6 constituted by the front upper and lower two bars 2 and 3 and the rear upper and lower two bars 4 and 5 and the substrates disposed on both side surfaces of the frame 6. An indirect air cooling structure responsible for cooling is formed by the base unit 9 shown in FIG. 2 comprising the holding plates 7 and 8. Further, the upper cover 15, the lower cover 16, the lateral covers 21 and 22, the front panel 17, and the rear panel 18 of the frame 6 of the base unit 9 are each formed by a single plate flat panel made of a composite material. Yes. Since the composite material is superior in strength and rigidity as compared with the aluminum alloy, desired mechanical performance can be obtained with a simple plate. Thus, the indirect air cooling structure responsible for cooling is constituted by the base unit 9 of the frame 6 made of an aluminum alloy, and the single unit plate made of the aluminum alloy base unit 9 and a composite material that is superior in strength and rigidity compared to the aluminum alloy. The combination of the upper cover 15, the lower cover 16, the front panel 17, and the rear panel 18 made of a flat panel panel results in a low-cost, high mechanical performance, lightweight chassis 1 for an electronic device housing. The structure can be realized.

  According to the chassis 1 of the electronic device casing of the present embodiment, the upper cover 15, the lower cover 16, and the lateral cover 21 are maintained while the base unit 9 of the frame 6 made of aluminum alloy maintains the indirect air cooling structure. , 22, the front panel 17, and the rear panel 18 together with a composite flat panel can improve the mechanical properties. Since the composite flat panel is based on a single plate, cost impact is also minimized. As a result, the chassis 1 of the electronic device casing can realize a small, lightweight, and high environmental resistance chassis while maintaining the cooling performance. As a result, it is possible to provide a chassis structure for an electronic device casing that can realize a lightweight structure with low mechanical cost and high mechanical performance.

  Although the embodiment of the present invention has been described, this embodiment is presented as an example and is not intended to limit the scope of the invention. The novel embodiment can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. This embodiment and its modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

    DESCRIPTION OF SYMBOLS 1 ... Chassis, 2-5 ... Bar, 6 ... Frame, 7, 8 ... Substrate holding plate, 11 ... Projection part (substrate holding part), 12 ... Electronic circuit board, 15 ... Upper cover, 16 ... Lower cover, 17 ... Front panel, 18 ... rear panel, 19 ... screw insertion hole (screw fixing part), 21, 22 ... side cover.

Claims (4)

A metal frame composed of two front upper and lower bars and two rear upper and lower bars;
A metal substrate holding plate disposed on both sides of the frame and having a substrate holding portion for holding a substrate of an electronic device;
An upper cover disposed on an upper surface of the frame; a lower cover disposed on a lower surface of the frame; a front panel disposed on a front surface of the frame; and a rear panel disposed on a rear surface of the frame. A chassis structure of an electronic device housing,
A chassis structure for an electronic device casing, wherein the upper cover, the lower cover, the front panel, and the rear panel are each formed of a single flat panel made of a composite material. The chassis structure for an electronic device casing according to claim 1, wherein the flat panel has a screw fixing portion at a joint portion with the frame. The chassis structure of the electronic device casing according to claim 1, wherein the flat panel is formed of a composite material made of fiber reinforced resin. The chassis structure of the electronic device casing according to claim 1, wherein the substrate holding plate has a heat sink for cooling with an indirect air cooling structure formed on an outer surface thereof.

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