JP2013254056A - Display substrate laminating apparatus and method, and method for manufacturing display substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a display substrate laminating apparatus and method and a method for manufacturing a display substrate, capable of suppressing quality deterioration of the display substrate.SOLUTION: A display substrate laminating apparatus includes a chamber unit 100, a first stage 200, and a second stage 300, the apparatus for laminating a first substrate 10 and a second substrate 20 together. The display substrate laminating apparatus includes, when viewed from a direction in which the first stage 200 and the second stage 300 are arranged: a plurality of exhaust ports 400 positioned on both sides of the first stage 200 and the second stage 300; and a control unit 700 for controlling an inclination of the first stage 200 or the second stage 300. The control unit 700, when air is exhausted from the plurality of exhaust ports 400 to reduce pressure in the chamber unit, adjusts the inclination of the first stage 200 or the second stage 300 to adjust an interval between the first substrate 10 and the second substrate 20.

Description

  The present invention relates to a display substrate bonding apparatus, a display substrate bonding method, and a display substrate manufacturing method, and in particular, a display substrate bonding apparatus, a display substrate bonding method, and a display capable of suppressing deterioration in the quality of a display panel. The present invention relates to a method for manufacturing a substrate.

  In the manufacturing process of the display substrate and the semiconductor device, the first substrate and the second substrate are bonded using a substrate bonding apparatus. The first substrate and the second substrate are preferably bonded in parallel, and the stage holding the substrate needs to be precisely controlled.

  A substrate bonding apparatus for solving the above problem is disclosed in, for example, Japanese Patent Application Laid-Open No. 2011-192828 (Patent Document 1). In Patent Document 1, a first stage that holds a first substrate, a second stage that is arranged to face the first stage, is movable with respect to the first stage, and holds a second substrate; A parallel reference mark that is attached to the stage and serves as a parallel reference with respect to the reference surface, and a first mark observation unit that is fixed to the first stage and that observes the parallel reference mark and the alignment mark provided on the surface of the second substrate. A substrate bonding apparatus is disclosed.

  In the substrate bonding apparatus described in Patent Document 1, the second stage is controlled such that the distance measured by the first mark observation unit is constant with respect to each parallel reference mark attached to the second stage. Thereby, the second stage is adjusted horizontally, and the position is set as the parallel reference position of the second stage.

JP 2011-192828 A

  In some cases, substrates are bonded together in a state where the pressure in the chamber unit of the display substrate bonding apparatus is reduced. At the time of this pressure reduction, the state of exhaust in the chamber unit changes due to the inclination of the first stage or the second stage. If the exhaust state cannot be controlled, the gas and moisture adhering to the surfaces of the first substrate and the second substrate cannot be sufficiently removed, and the quality of the display substrate may deteriorate.

  In the substrate bonding apparatus described in Patent Document 1, such a problem is not considered.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a display substrate bonding apparatus, a display substrate bonding method, and a display substrate that can suppress a deterioration in the quality of the display substrate. It is to provide a manufacturing method.

  A display substrate bonding apparatus according to the present invention is provided in a chamber unit, a first stage that is provided in the chamber unit, holds the first substrate, and is positioned at a position facing the first stage in the chamber unit. A display substrate bonding apparatus including a second stage for holding a substrate, the first stage moving toward the second stage, and bonding the first substrate and the second substrate.

  When the display substrate bonding apparatus according to the present invention is viewed from the direction in which the first stage and the second stage are arranged, a plurality of exhaust ports located on both sides of the first stage and the second stage in the chamber unit, And a control unit that controls the inclination of the first stage or the second stage. The control unit adjusts the inclination of the first stage or the second stage to discharge the gas in the chamber unit from the plurality of exhaust ports and depressurize the inside of the chamber unit. Adjust the gap.

  In one embodiment, the control unit controls the inclination of the first stage or the second stage so that the first substrate and the second substrate are parallel to each other.

  In one embodiment, the control unit includes a gap between the first substrate and the second substrate at one end portion of the first substrate and the second substrate, and a first portion at the other end portion of the first substrate and the second substrate. The inclination of the first stage or the second stage is controlled so that the gap between the first substrate and the second substrate is different.

  In one embodiment, the display substrate bonding apparatus includes an inclination detection unit that detects the inclination of the first stage or the second stage. The tilt detection unit includes a pair of sensor devices arranged at positions symmetrical to the center of the first stage or the second stage so as to protrude from the side surface of the first stage or the second stage, and the sensor device. And a pair of fiducial marks arranged at opposing positions. The tilt detection unit detects the tilt of the first stage or the second stage by measuring the distance from the pair of sensor devices to the pair of reference marks. The said control part controls the inclination of a 1st stage or a 2nd stage based on the detection result by an inclination detection part.

In one embodiment, a pair of reference marks are provided inside the plurality of exhaust ports.
In the substrate bonding method according to the present invention, the first substrate is held by the first stage provided in the chamber unit, and the second substrate is held by the second stage facing the first stage in the chamber unit. When viewed from the process and the direction in which the first stage and the second stage are arranged, the gas in the chamber unit is exhausted from a plurality of exhaust ports located on both sides of the first stage and the second stage. And a step of moving the first stage toward the second stage. The step of reducing the pressure includes adjusting a gap between the first substrate and the second substrate by adjusting an inclination of the first stage or the second stage.

  In one embodiment, the inclination of the first stage or the second stage is adjusted so that the first substrate and the second substrate are parallel to each other.

  In one embodiment, the gap between the first substrate and the second substrate at one end of the first substrate and the second substrate, and the first substrate and the second substrate at the other end of the first substrate and the second substrate. The inclination of the first stage or the second stage is adjusted so that the gap between the two substrates is different.

  The display substrate manufacturing method according to the present invention includes a step of preparing a first substrate and a second substrate that are bonded together to form a display substrate, and a step of holding the first substrate by a first stage provided in the chamber unit. And a step of holding the second substrate by the second stage facing the first stage in the chamber unit, and both sides of the first stage and the second stage when viewed from the direction in which the first stage and the second stage are aligned. A step of exhausting the gas in the chamber unit from a plurality of exhaust ports located at a position to depressurize the chamber unit, and a step of moving the first stage toward the second stage. The step of reducing the pressure includes adjusting a gap between the first substrate and the second substrate by adjusting an inclination of the first stage or the second stage.

  In one embodiment, the method includes a step of dividing the bonded first substrate and second substrate to produce a plurality of bonded substrates having the same pattern. The inclination of the first stage or the second stage is adjusted so that the first substrate and the second substrate are parallel to each other.

  In one embodiment, the method includes a step of dividing the bonded first substrate and second substrate to produce a plurality of bonded substrates each having a different pattern. A gap between the first substrate and the second substrate at one end of the first substrate and the second substrate, and a gap between the first substrate and the second substrate at the other end of the first substrate and the second substrate. The inclination of the first stage or the second stage is adjusted so as to be different.

  In one embodiment, a method for manufacturing a display substrate includes a step of detecting a drop mark or a bubble in a bonded substrate manufactured by bonding the first substrate and the second substrate. The inclination of the first stage or the second stage is adjusted based on the detection result of the dropping trace or the bubble.

  In one embodiment, the inclination of the first stage or the second stage is controlled so as to reduce the gap between the first substrate and the second substrate on the side where the detected dripping trace is large.

  In one embodiment, the inclination of the first stage or the second stage is controlled so as to increase the gap between the first substrate and the second substrate on the detected side with a large amount of bubbles.

  ADVANTAGE OF THE INVENTION According to this invention, the display substrate bonding apparatus which can suppress the fall of the quality of a display substrate, the display substrate bonding method, and the manufacturing method of a display substrate can be provided.

It is a manufacturing flowchart which shows the manufacturing flow which manufactures a liquid crystal display substrate. It is the schematic of the display substrate bonding apparatus which concerns on Embodiment 1 of this invention. It is a top view of the lower chamber unit shown in FIG. It is a figure explaining operation | movement of the display substrate bonding apparatus which concerns on Embodiment 1 of this invention. It is a figure explaining the state which the bubble generate | occur | produced in the board | substrate after bonding. It is a figure explaining the state of exhaust when decompressing the inside of the chamber unit concerning Embodiment 1 of the present invention. It is a graph which shows the bubble generation rate. It is a figure explaining the state which the drop mark generate | occur | produced in the board | substrate after bonding. In Embodiment 2 and 3 of this invention, it is a figure explaining the state of the exhaust_gas | exhaustion at the time of decompressing the inside of a chamber unit. It is a figure explaining the state which the bubble generate | occur | produced in the board | substrate after bonding.

  Hereinafter, embodiments of a display substrate bonding apparatus of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected to each figure to the same or corresponding component, and detailed description may not be repeated.

  Note that in the embodiment described below, when referring to the number, amount, and the like, the scope of the present invention is not necessarily limited to the number, amount, and the like unless otherwise specified. In the following embodiments, each component is not necessarily essential for the present invention unless otherwise specified.

(Manufacturing process of liquid crystal display substrate)
A manufacturing process of the liquid crystal display substrate will be described with reference to FIG. 1 and FIG. A first substrate 10 formed of a glass substrate and having a main surface is prepared (step S10). A black resin film is formed on the main surface of the prepared first substrate, and the black resin film is patterned by photolithography to form a black matrix. Subsequently, a red resin film is formed, and the red resin film is patterned by photolithography to form a red color filter. In the same manner, a green color filter and a blue color filter are sequentially formed, and a CF (Color Filter) layer is formed (step S11).

  An ITO (Indium Tin Oxide) film is laminated by sputtering and patterned by photolithography to form a counter electrode (step S12). In this way, a CF mother substrate is formed from the first substrate 10. The CF mother substrate includes a plurality of CF substrates having the same or different patterns.

  An alignment film for controlling the alignment of the liquid crystal material is formed on the counter electrode by a printing method or an inkjet method (step S13). A sealing material is drawn so as to surround the display area of each CF substrate formed on the CF mother substrate (step S14). The sealing material acts as a sealing material for the liquid crystal display substrate to be obtained later by dividing the substrate after bonding (the substrate on which the CF mother substrate and the TFT mother substrate are bonded). As the sealing material, for example, a thermosetting resin, a photocurable resin, or a light / heat combination type resin is used.

  Liquid crystal is dropped onto the region surrounded by the sealing material (step S15). The amount of liquid crystal is determined in consideration of the cell thickness after the CF mother substrate and the TFT mother substrate are bonded together and the sizes of the TFT substrate and the CF substrate.

  Separately from the above steps (S10 to S15) for the first substrate, a second substrate 20 formed of a glass substrate and having a main surface is prepared. (Step S20). A TFT (Thin Film Transistor) layer is formed on the main surface of the prepared second substrate using a general manufacturing method, and a TFT mother substrate is manufactured (step S21). The TFT mother substrate includes a plurality of TFT substrates having the same or different patterns. In the TFT substrate, a pixel electrode and an alignment film are formed on an element substrate. On the element substrate, a plurality of gate signal lines and a plurality of source signal lines intersecting each other are arranged, and a TFT is provided at a portion where the gate signal lines and the source signal lines intersect. The TFT has a gate electrode connected to the gate signal line, a source electrode connected to the source signal line, and a drain electrode connected to the pixel electrode.

  The CF mother substrate on which the liquid crystal is dropped is bonded to the TFT mother substrate on which the TFT layer is formed with the dropped liquid crystal layer interposed therebetween (step S30). In the inspection process after bonding the substrates, the bonded substrates are inspected using white light or a sodium lamp. (Step S40). By this inspection, quality defects such as bubbles and dripping marks can be detected. By subjecting the bonded substrates to scribe division or the like, the bonded substrates are divided into desired patterns to manufacture a liquid crystal display substrate (step S50).

  An inspection needle is connected to the inspection terminal of the liquid crystal display substrate, and a driving signal for lighting inspection is supplied from the outside to light the liquid crystal display substrate. The display quality is inspected with the liquid crystal display substrate turned on. By this inspection, it is possible to detect quality defects such as bubbles and dripping marks (step S60).

  Here, the sealing material is drawn on the first substrate 10 and the liquid crystal 40 is dropped. However, the sealing material may be drawn on the first substrate 10 and the liquid crystal 40 may be dropped on the second substrate 20. A sealing material may be drawn on the second substrate 20, and the liquid crystal may be dropped on the first substrate 10. Alternatively, a sealing material may be drawn on the second substrate 20 and the liquid crystal 40 may be dropped. Alternatively, a TFT layer may be formed on the first substrate 10 and a CF layer may be formed on the second substrate 20.

(Embodiment 1)
FIG. 2 is a diagram showing the display substrate bonding apparatus 1 according to the first embodiment. As shown in FIG. 2, the display substrate bonding apparatus 1 includes a chamber unit 100, an upper stage 200 and a lower stage 300 provided in the chamber unit 100, an exhaust port 400, an inclination detection unit 500, and a decompression device. 600, the control part 700, and the gas supply apparatus 800 are included.

  The chamber unit 100 includes an upper chamber unit 110 and a lower chamber unit 120. By moving the upper chamber unit 110 and bringing it into contact with the lower chamber unit 120, the chamber unit 100 can be sealed. The controller 700 controls the movement of the upper chamber unit 110.

  The upper stage 200 includes an elevating mechanism 210 and can move relative to the lower stage 300 while holding the first substrate 10 onto which the liquid crystal 40 has been dropped. The elevating mechanism 210 includes a cam 211 and a cam follower 212, and a support portion 213 that supports the upper stage 200.

  The elevating mechanism 210 is formed on the plate portion 111 located on the upper portion of the upper chamber unit 110. The cam 211, the cam follower 212, and the support part 213 are interlocked. When the cam follower 212 moves away from the center of the display substrate bonding apparatus 1, the cam 211 is lowered and the support portion 213 is lowered. At the same time as the support portion 213 is lowered, the upper stage 200 is lowered. On the other hand, when the cam follower 212 moves so as to approach the center of the display substrate bonding apparatus 1, the cam 211 rises and the support portion 213 rises. At the same time as the support portion 213 is raised, the upper stage 200 is raised. The movement of the cam follower 212 is controlled by the control unit 700, and the lifting mechanism 210 is controlled.

  The upper stage 200 is provided with a pair of tilt detection units 500. The tilt detection unit 500 detects the tilt of the upper stage 200 and sends the detected result to the control unit 700. Based on the detected result, the control unit 700 controls the lifting mechanism 210. As a result, the inclination of the upper stage 200 is adjusted.

  The lower stage 300 includes a support part 310 and a drive part 320. The support part 310 supports the lower stage. The driving unit 320 is controlled by the control unit 700 and can move in the X direction, the Y direction, and the θ direction. The driving unit 320 is disposed on the gantry 900.

  An exhaust port 400 is formed in the lower chamber unit 120. The exhaust port 400 is connected to a decompression device 600 including a vacuum pump through a pipe 410. Two exhaust ports 400 are formed so as to sandwich the lower stage 300.

  The tilt detection unit 500 includes a sensor device 510 and a reference mark 520. The sensor device 510 is disposed so as to be symmetrical with respect to the center of the upper stage 200 so as to protrude from the side surface of the upper stage 200. Sensor device 510 includes, for example, a gap sensor. Sensor device 510 is provided to face exhaust port 400. As the gap sensor, an eddy current type, a capacitance type, an ultrasonic type, or an optical type can be appropriately selected. The reference mark 520 is disposed in the exhaust port 400 so as to face the sensor device 510.

  The decompression device 600 decompresses the inside of the sealed chamber unit 100. The decompressed chamber unit 100 can be returned to atmospheric pressure by supplying gas into the chamber unit 100 by the gas supply device 800.

  FIG. 3 is a plan view of the lower chamber unit 120. As shown in FIG. 3, the lower stage 300 is disposed inside the lower chamber unit 120. The two exhaust ports 400 are located between the side wall of the lower chamber unit 120 and the lower stage 300, and are arranged so as to be symmetric with respect to the center of the lower stage 300.

  With reference to FIG. 4, operation | movement of the display substrate bonding apparatus 1 which concerns on this Embodiment is demonstrated. FIG. 4A shows a state in which the upper stage 200 and the lower stage 300 hold the first substrate 10 and the second substrate 20. FIG. 4B shows a state where the chamber unit 100 is sealed and the first substrate and the second substrate are bonded together. FIG. 4C shows a state in which the chamber unit 100 is opened and the substrate 30 after bonding is taken out.

  As shown in FIG. 4A, the first substrate 10 is held on the upper stage 200 provided in the upper chamber unit 110. The upper stage 200 sucks and holds the first substrate 10 by vacuum suction / electrostatic suction. The second substrate 20 is held on the lower stage 300 provided in the lower chamber unit 120. The lower stage 300 holds the second substrate 20 by a vacuum suction method. The substrate adsorption method may be an adhesive method, and the above-described adsorption methods may be combined as appropriate.

  As shown in FIG. 4B, the upper chamber unit 110 descends and comes into contact with the lower chamber unit 120, whereby the chamber unit 100 is sealed. The inside of the sealed chamber unit 100 is decompressed by the decompression device 600 via the exhaust port 400. The pressure in the chamber unit 100 is reduced, and the gas and moisture attached to the surfaces of the first substrate 10 and the second substrate 20 are removed (degassed).

  When the pressure in the chamber unit 100 is reduced, the inclination of the upper stage 200 is controlled. An inclination detection unit 500 provided on the upper stage 200 measures the distance from the sensor device 510 to the reference mark 520, and measures the relative positional deviation between the upper stage 200 and the lower stage 300 in the vertical direction. Based on the measured relative displacement result, the control unit 700 controls the inclination of the upper stage 200.

  When the degree of vacuum in the chamber unit 100 reaches a predetermined degree of vacuum, the upper stage 200 is lowered to the alignment adjustment position by the elevating mechanism 210. The alignment mark provided on the first substrate 10 and the alignment mark provided on the second substrate 20 are respectively imaged by an alignment camera (not shown), whereby the first substrate 10 and the second substrate 20 in the horizontal direction. Measure relative displacement. The lower stage 300 is moved in the horizontal direction by the drive unit 320 so that the measured relative displacement is eliminated.

  The upper stage 200 is further lowered by the elevating mechanism 210, and the first substrate 10 is pressed against the second substrate 20 through the liquid crystal 40 and the sealing material for a predetermined time. Thereafter, the pressing of the first substrate 10 against the second substrate 20 is released. Next, the holding of the upper stage 200 on the first substrate 10 is released, and the upper stage 200 is raised by the lifting mechanism 210.

  As shown in FIG. 4C, gas is supplied into the chamber unit 100 by the gas supply device 800, and the inside of the chamber unit 100 is returned to atmospheric pressure. Thereafter, the upper chamber unit 110 is raised. The holding on the second substrate 20 by the lower stage 300 is released, and the bonded substrate 30 on which the first substrate 10 and the second substrate 20 are bonded is taken out.

  FIG. 5 is a diagram illustrating a state in which bubbles are generated on the substrates after bonding. As shown in FIG. 5, a plurality of first display bodies 31 having the same pattern are formed on the bonded substrate 30. The first display body 31 is obtained by bonding a CF substrate formed on a CF mother substrate and a TFT substrate formed on the TFT mother substrate through a liquid crystal 40 and a sealing material. Bubbles 50 are generated on the A side (left side in FIG. 5) of the substrate 30 after being bonded. The display defect of bubbles is detected in an inspection process after bonding and an inspection process after manufacturing the liquid crystal display substrate.

  When the pressure inside the chamber unit 100 is reduced, bubbles may be generated when the gas and moisture attached to the surfaces of the CF mother substrate and the TFT mother substrate are not sufficiently removed. In the first display body 31, gas and moisture remaining without being removed appear as bubbles. The difference in the ability to remove gas and moisture is caused by the balance of exhaust during decompression in the chamber unit 100. In the present embodiment, since the first display bodies 31 of the substrates 30 after bonding are all the same size, gas and moisture are uniformly removed from the surfaces of the first substrate 10 and the second substrate 20. Thus, the generation of bubbles can be prevented. Therefore, it is necessary to adjust the exhaust state so that it is uniform in the chamber unit 100.

  FIG. 6 is a diagram for explaining an exhaust state when the pressure in the chamber unit 100 according to Embodiment 1 is reduced. As shown in FIG. 6, two tilt detectors 500 are provided on the side surface of the upper stage 200. An exhaust port 400 is provided at a position facing the sensor device 510, and a reference mark 520 is provided in the exhaust port 400. The reference marks 520 are provided on the same plane so that the distance from the sensor device 510 to the reference mark 520 is constant.

  If the exhaust port 400 is formed so as to be symmetric with respect to the center of the lower stage 300, it is not necessary to be provided at a position facing the sensor device 510. The reference mark 520 does not need to be provided in the exhaust port 400, and may be located at a position facing the sensor device 510 and on the same plane.

  As shown in FIG. 6, since the reference mark 520 is provided below the lower stage 300, the sensor device 510 and the reference mark 520 collide when the first substrate 10 and the second substrate 20 are bonded together. This can be prevented.

  When the pressure in the chamber unit 100 is reduced, the tilt detection unit 500 measures the distance from the sensor device 510 to the reference mark 520, and the vertical relationship between the upper stage 200 and the lower stage 300 at both ends of the upper stage 200 is measured. Measure misalignment. The measured relative displacement result is sent to the control unit 700. The controller 700 controls the upper stage 200 so as to eliminate the relative displacement. That is, the upper stage 200 is adjusted to be substantially parallel to the lower stage 300. As a result, the first substrate 10 held on the upper stage 200 and the second substrate 20 held on the lower stage 300 become parallel. Since the two exhaust ports 400 are formed so as to be symmetric with respect to the center of the lower stage 300, when the first substrate 10 and the second substrate 20 are parallel, the exhaust capability during decompression is indicated by an arrow. As shown in A1, it becomes uniform on both sides (A side, B side) in the chamber unit 100. Therefore, the gas and moisture removed from the surfaces of the first substrate 10 and the second substrate 20 are uniform on the A side and the B side in the chamber unit 100, and the first substrate 10 and the second substrate 20 are bonded together. Generation of bubbles can be prevented.

  FIG. 7 is a graph showing the bubble generation rate. On the left side of the graph, the bubble generation rate when the first substrate 10 and the second substrate 20 are bonded together without using the inclination detection unit 500 is shown. On the right side of the graph, the incidence rate of bubbles when the inclination of the upper stage 200 is adjusted using the inclination detection unit 500 and the first substrate 10 and the second substrate 20 are bonded together is shown. The inclination rate of the upper stage 200 is adjusted using the inclination detection unit 500, and the bubble generation rate when the first substrate 10 and the second substrate 20 are bonded together is the first substrate without using the inclination detection unit 500. Compared to the rate of occurrence when 10 and the second substrate 20 are bonded together, it is about 5% lower.

(Embodiment 2)
The display substrate bonding apparatus 1 according to the second embodiment is configured in the same manner as in the first embodiment in that the upper stage 200 is controlled to be inclined with respect to the lower stage 300 when the inside of the chamber unit 100 is decompressed. Different.

  FIG. 8 is a diagram for explaining a state in which dripping marks are generated on the substrates after bonding. As shown in FIG. 8, a first display body 31 and a second display body 32 having different patterns are formed on the substrate 30 after bonding. The first display body 31 and the second display body 32 are obtained by bonding a CF substrate formed on a CF mother substrate and a TFT substrate formed on the TFT mother substrate through a liquid crystal 40 and a sealing material.

  The size of the first display body 31 is smaller than the size of the second display body 32. The first display body 31 and the second display body 32 are alternately arranged from the A side (left side in FIG. 8) to the B side (right side in FIG. 8) of the substrate 30 after bonding. A dripping trace 60 of the liquid crystal 40 is visible on the A side of the substrate 30 after bonding. The defect due to the dropping trace 60 of the liquid crystal 40 is detected in the post-bonding inspection process and the liquid crystal display substrate manufacturing inspection process.

  The dropping trace 60 of the liquid crystal 40 may be generated due to a difference in surface state between a portion where the liquid crystal 40 is dropped and a portion where the liquid crystal 40 is not dropped. Before the liquid crystal 40 is dropped on the first substrate 10, gas and moisture are attached to the surface of the first substrate 10. When the pressure inside the chamber unit is reduced, gas and moisture are easily removed from the portion of the surface of the first substrate 10 where the liquid crystal 40 is not dropped. On the contrary, the liquid crystal 40 becomes an obstacle from the portion where the liquid crystal 40 is dripped, and it is difficult to remove gas and moisture. When the surface state of the first substrate 10 after removing the gas and moisture is significantly different between the portion where the liquid crystal 40 is dropped and the portion where the liquid crystal 40 is not dropped, the dripping trace 60 of the liquid crystal 40 can be seen. It becomes easy.

  The amount of liquid crystal 40 to be dropped is determined in consideration of the TFT substrate and the CF substrate size. Therefore, when the size of the first display body 31 and the size of the second display body 32 are different, the amount of the liquid crystal 40 of the first display body 31 and the amount of the liquid crystal 40 of the second display body 32 are different. That is, the amount of liquid crystal 40 dropped on the A side and the B side of the first substrate 10 is different.

  For this reason, if the exhaust states on the A side and the B side of the first substrate 10 are the same, the speed at which the gas and moisture are removed differs between the A side and the B side, and the drip trace 60 is easily visible. Therefore, it is necessary to adjust the exhaust gas balance between the A side and the B side. In the present embodiment, it is necessary to weaken the exhaust capability so that the difference in the surface state between the portion where the liquid crystal 40 is dropped and the portion where the liquid crystal 40 is not dropped is reduced on the side where the drop mark is detected.

  FIG. 9 is a view for explaining the state of exhaust during decompression in the chamber unit. As shown in FIG. 9, when the pressure in the chamber unit 100 is reduced, the tilt detection unit 500 measures the distance from the sensor device 510 to the reference mark 520, and the vertical relationship between the upper stage 200 and the lower stage 300 is measured. Measure misalignment. The measured relative displacement result is sent to the control unit 700. The control unit 700 tilts the upper stage 200 so that the A side (left side in FIG. 9) approaches the lower stage 300 and the B side (right side in FIG. 9) is further away. The gap between the first substrate 10 on the A side and the second substrate 20 is smaller than the gap between the first substrate 10 on the B side and the second substrate 20. On the A side in the chamber unit 100, the exhaust becomes weaker as indicated by the arrow A2, and on the B side, the exhaust becomes stronger as indicated by the arrow A3. As a result, the gas and moisture to be removed can be adjusted on the A side and B side of the first substrate 10, and the dripping trace 60 of the liquid crystal 40 becomes difficult to see.

(Embodiment 3)
The bonding apparatus 1 according to the third embodiment is a further modification of the second embodiment. However, the bonding apparatus 1 according to the third embodiment is different from the second embodiment in that the inclination of the upper stage is controlled based on the detection of the defect due to the bubbles 50. Different from Form 2.

  FIG. 10 is a diagram illustrating the state of the substrates after bonding. As shown in FIG. 10, bubbles 50 are generated in the second display body 32 on the B side (right side in FIG. 10) of the substrate 30 after bonding. Defects due to the bubbles 50 are detected in an inspection process after bonding and an inspection process after manufacturing the liquid crystal display substrate.

  As described above, the gas and moisture remaining without being removed when the pressure in the chamber unit 100 is reduced appear as the bubbles 50. Therefore, in the present embodiment, it is necessary to increase the exhaust capacity on the side where the bubbles 50 are generated.

  When the pressure in the chamber unit 100 is reduced, the upper stage 200 is tilted so that the A side (left side in FIG. 9) approaches the lower stage 300 and the B side (right side in FIG. 9) is further away. The gap between the first substrate 10 on the B side and the second substrate 20 is larger than the gap between the first substrate 10 on the A side and the second substrate. As a result, the exhaust becomes weak on the A side in the chamber unit 100 and the exhaust becomes strong on the B side. As a result, the gas and moisture to be removed can be adjusted on the A side and the B side of the first substrate 10, and the occurrence of defects due to bubbles can be prevented.

  Although the embodiments of the present invention have been described above, the embodiments disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention can be applied to a display substrate bonding apparatus, a display substrate bonding method, and a display substrate manufacturing method.

  DESCRIPTION OF SYMBOLS 1 Display board | substrate bonding apparatus, 10 1st board | substrate, 20 2nd board | substrate, 30 board | substrate after bonding, 31 1st display body, 32 2nd display body, 40 liquid crystal, 50 bubble, 60 dripping trace, 100 chamber unit, 110 Upper chamber unit, 111 plate part, 120 Lower chamber unit, 200 Upper stage, 210 Elevating mechanism, 211 Cam, 212 Cam follower, 213, 310 Support part, 300 Lower stage, 320 Drive part, 400 Exhaust port, 410 Piping, 500 Tilt detection unit, 510 sensor device, 520 reference mark, 600 decompression device, 700 control unit, 800 gas supply device, 900 frame.

Claims (14)

A chamber unit;
A first stage provided in the chamber unit and holding a first substrate;
A second stage that is provided at a position facing the first stage in the chamber unit and holds a second substrate;
A substrate laminating apparatus for laminating the first substrate and the second substrate, wherein the first stage moves toward the second stage;
A plurality of exhaust ports located on both sides of the first stage and the second stage in the chamber unit when viewed from the direction in which the first stage and the second stage are arranged;
A control unit for controlling the inclination of the first stage or the second stage,
The control unit adjusts an inclination of the first stage or the second stage when exhausting the gas in the chamber unit from the plurality of exhaust ports to depressurize the chamber unit, thereby controlling the first substrate or the second stage. And a display substrate bonding apparatus for adjusting a gap between the second substrate and the second substrate.   The display substrate bonding apparatus according to claim 1, wherein the control unit controls an inclination of the first stage or the second stage so that the first substrate and the second substrate are parallel to each other.   The control unit includes a gap between the first substrate and the second substrate at one end portion of the first substrate and the second substrate, and the other end portion of the first substrate and the second substrate. The display substrate bonding apparatus according to claim 1, wherein an inclination of the first stage or the second stage is controlled so that a gap between the first substrate and the second substrate is different. The display substrate bonding apparatus includes an inclination detection unit that detects an inclination of the first stage or the second stage,
The inclination detector is
A pair of sensor devices arranged at positions symmetrical to the center of the first stage or the second stage so as to protrude from the side surface of the first stage or the second stage;
A pair of reference marks arranged at positions facing the sensor device;
The tilt detection unit detects the tilt of the first stage or the second stage by measuring a distance from the pair of sensor devices to the pair of reference marks,
The display substrate bonding apparatus according to claim 1, wherein the control unit controls the tilt of the first stage or the second stage based on a detection result by the tilt detection unit.   The display substrate bonding apparatus according to claim 4, wherein the pair of reference marks are provided inside the plurality of exhaust ports. Holding the first substrate by a first stage provided in the chamber unit;
Holding the second substrate by a second stage facing the first stage in the chamber unit;
When viewed from the direction in which the first stage and the second stage are arranged, the gas in the chamber unit is discharged from a plurality of exhaust ports located on both sides of the first stage and the second stage, and Reducing the pressure in the chamber unit;
A step of moving the first stage toward the second stage,
The display substrate bonding method, wherein the depressurizing step includes adjusting a gap between the first substrate and the second substrate by adjusting an inclination of the first stage or the second stage.   The display substrate bonding method according to claim 6, wherein an inclination of the first stage or the second stage is adjusted so that the first substrate and the second substrate are parallel to each other.   The gap between the first substrate and the second substrate at one end of the first substrate and the second substrate, the first substrate at the other end of the first substrate and the second substrate, and the The display substrate bonding method according to claim 6, wherein an inclination of the first stage or the second stage is adjusted so that a gap with the second substrate is different. Preparing a first substrate and a second substrate that are bonded together to form a display substrate;
Holding the first substrate by a first stage provided in the chamber unit;
Holding the second substrate by a second stage facing the first stage in the chamber unit;
When viewed from the direction in which the first stage and the second stage are arranged, the gas in the chamber unit is discharged from a plurality of exhaust ports located on both sides of the first stage and the second stage, and Reducing the pressure in the chamber unit;
A step of moving the first stage toward the second stage,
The step of depressurizing includes adjusting the inclination of the first stage or the second stage to adjust the gap between the first substrate and the second substrate. A step of dividing the bonded first substrate and the second substrate to produce a plurality of bonded substrates having the same pattern;
The method for manufacturing a display substrate according to claim 9, wherein an inclination of the first stage or the second stage is adjusted so that the first substrate and the second substrate are parallel to each other. A step of dividing the bonded first substrate and the second substrate to produce a plurality of bonded substrates each having a different pattern;
The gap between the first substrate and the second substrate at one end of the first substrate and the second substrate, the first substrate at the other end of the first substrate and the second substrate, and the The method for manufacturing a display substrate according to claim 9, wherein an inclination of the first stage or the second stage is adjusted so that a gap with the second substrate is different. A step of detecting dripping marks or bubbles in a bonded substrate produced by bonding the first substrate and the second substrate;
The method for manufacturing a display substrate according to claim 9, wherein an inclination of the first stage or the second stage is adjusted based on the dropping trace or the detection result of the bubbles.   The tilt of the first stage or the second stage is controlled so as to reduce a gap between the first substrate and the second substrate on the side where the detected dripping trace is large. Manufacturing method of display substrate.   The display according to claim 12, wherein an inclination of the first stage or the second stage is controlled so as to increase a gap between the first substrate and the second substrate on the detected bubble-rich side. A method for manufacturing a substrate.

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