JP2013251301A - Resin stamper manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin stamper manufacturing apparatus capable of efficiently manufacturing a plurality of resin stampers.SOLUTION: A resin stamper manufacturing apparatus 1 manufactures: a support base material storage unit 2 configured to store a plurality of support base materials 22; and a plurality of intermediate resin stampers 20 by transferring a fine structure 10a of a previously prepared matrix stamper 10 to a photocurable resin composition applied to the support base material 22, and also manufactures a plurality of resin stampers 30 by transferring a fine structure 20a of the intermediate resin stamper 20 to the photocurable resin composition applied to the support base material 22.

Description

  The present invention relates to a resin stamper manufacturing apparatus for manufacturing a resin stamper used when transferring a fine structure to a transfer target.

  Conventionally, a photolithography technique has been often used as a technique for processing a fine pattern required for a semiconductor device or the like. However, as the pattern becomes finer and the required processing dimensions become as small as the wavelength of light used for exposure, it is difficult to cope with the photolithography technique. Therefore, instead of this, an electron beam drawing apparatus, which is a kind of charged particle beam apparatus, has come to be used.

  Unlike the collective exposure method in pattern formation using a light source such as i-line or excimer laser, pattern formation using this electron beam employs a method of directly drawing a mask pattern. Therefore, the exposure (drawing) time increases as the pattern to be drawn increases, and it takes time to complete the pattern. As the degree of integration of the semiconductor integrated circuit increases, the time required for pattern formation increases. There is a concern that the throughput will decrease.

  Therefore, in order to increase the speed of the electron beam lithography system, development of a collective figure irradiation method that combines various shapes of masks and forms an electron beam with a complex shape by irradiating them with an electron beam in a lump. It is being advanced. However, while miniaturization of patterns has progressed, there has been a drawback that the cost of the apparatus becomes high, such as an increase in the size of the electron beam drawing apparatus and high-precision control of the mask position.

  On the other hand, a nanoimprint technique is known as a technique for performing highly accurate pattern formation at a low cost. In this nanoimprint technology, a stamper on which unevenness (surface shape) corresponding to the unevenness of a fine pattern to be formed is embossed, for example, on a transfer target obtained by forming a resin layer on a predetermined substrate. The fine pattern can be transferred to the resin layer.

In addition, when a stamper having optical transparency is used, the stamper is embossed against the resin layer made of a photocurable resin, and ultraviolet light is emitted through the stamper using a light source such as a high-pressure mercury lamp or LED. By irradiating light, the resin layer can be cured and a highly accurate pattern can be produced in a short time.
Such nanoimprint technology has been studied for application to formation of a recording bit pattern on a large-capacity recording medium and formation of a pattern of a semiconductor integrated circuit.

Hard stampers such as quartz are known as light-transmitting stampers that have been used in conventional nanoimprint technology.
However, a hard stamper such as quartz cannot follow the warp and protrusion of the substrate to be transferred during transfer, and there is a problem that a defective transfer region occurs in a wide range. In order to reduce the defective transfer area, the stamper is required to absorb both the warp and the protrusion of the transferred substrate on which the resin layer is formed.

  Therefore, a resinous stamper (hereinafter referred to as a resin stamper) formed of a flexible resin so as to follow both the warp and the protrusion of the substrate to be transferred has been proposed (for example, Patent Document 1). reference). Such a resin stamper can prevent a transfer failure by following a warp or a protrusion of the substrate to be transferred with a flexible and thick resin. In particular, if a nanoimprint technique using a photocurable resin rather than a thermoplastic resin is used for the resin layer of the resin stamper, a highly accurate pattern can be formed at a low cost for the production of the stamper.

  On the other hand, releasability with respect to the transfer target is important for the stamper. 2. Description of the Related Art Conventionally, a hard stamper such as quartz whose surface has been treated with a fluorine-based mold release agent is known (for example, see Patent Document 2). You can also. A stamper using a fluorine-based resin or a silicone-based resin is also known (see, for example, Patent Document 3).

  According to the stamper to which such releasability is imparted, it is possible to improve the transfer accuracy of the fine pattern to the transferred body by improving the release performance with respect to the transferred body. However, unlike hard stampers such as quartz, resinous stampers are often recyclable when the shape of the microstructure surface and the releasability deteriorate due to transfer, and are disposable.

JP 2010-5972 A JP 2004-351893 A JP 2009-1002 JP

By the way, when mass-producing devices with fine patterns using a resin stamper, an apparatus for producing a plurality of resin stampers is required. When producing a resin stamper by the nanoimprint technique, a master stamper in which a fine structure is formed in advance is required.
The master stamper is manufactured by a photolithography method, an electron beam lithography method, or the like. From the viewpoint of production cost, it is necessary to produce a plurality of resin stampers with a minimum number of master stampers. However, the master stamper is provided with a release layer in order to release the resin. However, when the number of times of transfer increases, the release layer deteriorates. For this reason, there is a problem in that the resin used for the transfer body adheres to the master stamper, so that the master stamper needs to be washed or re-released, and the productivity of the resin stamper is lowered.

  Therefore, an object of the present invention is to provide a resin stamper manufacturing apparatus that can efficiently manufacture a plurality of resin stampers.

  The present invention for solving the above problems is a resin stamper manufacturing apparatus for manufacturing a resin stamper that transfers a fine structure to a transfer object, and a support base material storage unit for storing a plurality of support base materials, and the support base material storage. A microstructure transfer unit for producing a plurality of intermediate resin stampers on which a resin layer made of a cured product of a photocurable resin composition obtained by transferring a microstructure of a master stamper prepared in advance is transferred on the support substrate transferred from the unit; An intermediate resin stamper storage unit for storing a plurality of intermediate resin stampers produced by the microstructure transfer unit, the microstructure transfer unit on the support substrate transferred from the support substrate storage unit The intermediate resin star transferred to the photocurable resin composition from the intermediate resin stamper storage unit is added to the photocurable resin composition. By transferring a fine structure of the path, characterized by manufacturing a plurality of resin stamper per one intermediate resin stamper.

  According to the resin stamper manufacturing apparatus of the present invention, a plurality of resin stampers can be manufactured efficiently.

It is composition explanatory drawing of the resin stamper manufacturing apparatus which concerns on embodiment of this invention. (A) Schematic diagram of a master stamper used in a resin stamper manufacturing apparatus according to an embodiment of the present invention, (b) is a resin stamper manufacturing apparatus according to an embodiment of the present invention, based on the master stamper shown in (a). (C) is a schematic view of an intermediate resin stamper manufactured to be used for manufacturing a target resin stamper, and (c) is a resin stamper manufacturing apparatus according to an embodiment of the present invention. It is a schematic diagram of the objective resin stamper produced based on it. It is a structure explanatory drawing of the bending jig | tool used with the resin stamper manufacturing apparatus which concerns on embodiment of this invention, (a) is a top view, (b) is III-III sectional drawing of (a). (A) to (c) are process explanatory views of a process in which an intermediate resin stamper is manufactured by the fine structure transfer unit of the resin stamper manufacturing apparatus of FIG. (A) to (d) are process explanatory views of a process in which a target resin stamper is manufactured by the microstructure transfer unit of the resin stamper manufacturing apparatus of FIG. It is the electron micrograph of the fine structure transcribe | transferred to the to-be-transferred object with the resin stamper produced in the Example of this invention. It is a structure explanatory drawing of the fine structure transfer apparatus using the resin stamper produced in the Example of this invention.

Next, embodiments of the present invention will be described in detail with reference to the drawings as appropriate.
The resin stamper manufacturing apparatus according to the present embodiment is a device having a nano-level fine structure obtained by processing a fine pattern, such as a large-scale integrated circuit component, an information recording medium such as a magnetic recording medium or an optical recording medium, a lens, or a polarizing plate. It is an apparatus for producing a resin stamper used when producing optical parts such as wavelength filters, light emitting elements, optical integrated circuits, and biodevices such as immunoassay, DNA separation, and cell culture by the nanoimprint method. In addition, the resin stamper manufacturing apparatus according to the present embodiment produces an intermediate resin stamper to which the fine structure of a master stamper prepared in advance is transferred, and the fine structure of the intermediate resin stamper is again converted into a target resin stamper (hereinafter referred to as a “material stamper”). This is simply referred to as “resin stamper” and is distinguished from the intermediate resin stamper).

≪Resin stamper manufacturing equipment≫
FIG. 1 is a diagram illustrating the configuration of a resin stamper manufacturing apparatus according to the present embodiment. FIG. 2A is a schematic diagram of a master stamper used in the resin stamper manufacturing apparatus according to this embodiment, and FIG. 2B shows the resin stamper manufacturing apparatus according to this embodiment as shown in FIG. FIG. 2C is a schematic diagram of an intermediate resin stamper manufactured based on the master stamper and used to manufacture the target resin stamper. FIG. 2B shows the resin stamper manufacturing apparatus according to this embodiment. It is a schematic diagram of the target resin stamper produced based on the intermediate resin stamper shown in FIG. FIG. 3 is an explanatory diagram of a configuration of a bending jig used in the resin stamper manufacturing apparatus according to the present embodiment. FIG. 3 (a) is a plan view, and FIG. 3 (b) is a cross-sectional view taken along line III-- in FIG. It is III sectional drawing.

As shown in FIG. 1, the resin stamper manufacturing apparatus 1 according to this embodiment mainly includes a support base material storage unit 2, a fine structure transfer unit 3, and an intermediate resin stamper storage unit 4. Yes.
In the fine structure transfer unit 3 in FIG. 1, the intermediate resin stamper indicated by reference numeral 20 indicated by an imaginary line (broken line) is a resin stamper indicated by reference numeral 30 also indicated by an imaginary line by the nanoimprint method. . Further, in the fine structure transfer unit 3 of FIG. 1, what is indicated by reference numeral 23 represented by a virtual line (broken line) is a curved member.
Incidentally, what is represented by these imaginary lines shows a state in which the resin stamper 30 is produced by the intermediate resin stamper 20 in the fine structure transfer unit 3, and the intermediate resin stamper 20 is formed in the fine structure transfer unit 3. When manufactured, the support base material 22 is disposed in place of the intermediate resin stamper 20 and the master stamper 10 is disposed in place of the resin stamper 30 as described later.

<Supporting substrate storage unit>
As will be described in detail later, the support base material storage unit 2 stores a plurality of light transmissive support base materials 22 which are constituent materials of the intermediate resin stamper 20 and the resin stamper 30 manufactured by the fine structure transfer unit 3. . It is desirable to attach an identification symbol such as numbering to each of the plurality of support substrates 22 so that each support substrate 22 can be identified.
Further, when the intermediate resin stamper 20 and the resin stamper 30 are produced, the support base material storage unit 2 is configured to transfer the stored support base material 22 to the microstructure transfer unit 3 by a predetermined transport mechanism (not shown). Supply to plate 31.
Incidentally, as the transport mechanism, for example, a chuck part that detachably holds the support base material 22 by vacuum suction or the like, an arm part that supports the chuck part, and the chuck part in a three-dimensional direction via the arm part. A well-known robot hand composed of an actuator to be moved can be exemplified.

  Further, the supporting base material storage unit 2 stores the master disc stamper 10 used for the production of the intermediate resin stamper 20, and at the time of production of the intermediate resin stamper 20, the fine structure transfer unit 3 by the transport mechanism (not shown). The master stamper 10 is supplied onto the stage 32. Then, the master stamper 10 after the production of the intermediate resin stamper 20 is returned to the support base material storage unit 2 by the transport mechanism, and the support base material storage unit 2 stores the returned master stamper 10 again.

  Further, as will be described in detail later, the supporting base material storage unit 2 stores a bending jig 23 which will be described later used for manufacturing the resin stamper 30, and at the time of manufacturing the resin stamper 30, the transport mechanism (illustrated). Omitting) supplies the bending jig 23 onto the stage 32 of the fine structure transfer unit 3. Then, the bending jig 23 after the production of the resin stamper 30 is returned to the supporting base material storage unit 2 by the transport mechanism, and the supporting base material storage unit 2 stores the returned bending jig 23 again. .

<Microstructure transfer unit>
As described above, the fine structure transfer unit 3 is a unit for producing the intermediate resin stamper 20 and the resin stamper 30, and mainly includes the stage 32, the plate 31, the nozzle 34, and the light source 33. ing.

  The stage 32 includes a chuck mechanism (not shown) that supports the master stamper 10 when the intermediate resin stamper 20 is manufactured and supports the support base material 22 via the bending jig 23 when the resin stamper 30 is manufactured. The chuck mechanism of the stage 32 in this embodiment is assumed to be a vacuum suction type chuck mechanism that sucks the support base material 22, but is not limited to this as long as the support base material 22 can be supported. A mechanical chuck mechanism may be used.

  Further, the stage 32 includes an elevating mechanism (not shown) that moves the stage 32 up and down. With this lifting mechanism, the stage 32 can approach or separate from the plate 31.

  The plate 31 includes a chuck mechanism (not shown) that supports the support base material 22 when the intermediate resin stamper 20 is manufactured, and supports the intermediate resin stamper 20 when the resin stamper 30 is manufactured. The chuck mechanism of the plate 31 in the present embodiment is assumed to be a vacuum chucking chuck mechanism that sucks the support base material 22 or the intermediate resin stamper 20, but supports the support base material 22 or the intermediate resin stamper 20. However, the present invention is not limited to this, and a mechanical chuck mechanism may be used. Incidentally, the plate 31 in this embodiment has light transmittance.

  When the intermediate resin stamper 20 is manufactured, the nozzle 34 is applied to the master stamper 10 on the stage 32 by discharging a first photocurable resin composition, which will be described later, stored in a predetermined tank (not shown). Further, the nozzle 34 is applied by discharging a second photocurable resin composition, which will be described later, stored in a predetermined tank (not shown) to the support base 22 on the stage 32 when the resin stamper 30 is manufactured. To do.

Incidentally, the nozzle 34 is disposed on the stage 32 so as to be interposed between the plate 31 and the nozzle 34 in this embodiment, as shown in FIG. When the stage 32 moves toward, the nozzle 34 can be retracted from between the stage 32 and the plate 31.
In FIG. 1, for convenience of drawing, only one nozzle 34 is illustrated, but the first photocurable resin composition and the second photocurable resin composition described above are separately ejected. It is desirable to have at least two nozzles.

  As will be described later, the light source 33 is a light (ultraviolet light) that cures the first photocurable resin composition applied on the master stamper 10 via the plate 31 and the support base material 22 when the intermediate resin stamper 20 is manufactured. ) (See FIGS. 4A to 4C), and the second photocurable resin composition applied to the support base 22 via the plate 31 and the intermediate resin stamper 20 when the resin stamper 30 is manufactured. Irradiating light (ultraviolet light) for curing an object (see FIGS. 5A to 5D).

<Intermediate resin stamper storage unit>
The intermediate resin stamper storage unit 4 stores a plurality of intermediate resin stampers 20 produced by the fine structure transfer unit 3 as will be described in detail later. Specifically, the intermediate resin stamper storage unit 4 can include a plurality of slots (not shown) for storing the intermediate resin stamper 20, and a cassette (not shown) for storing the plurality of intermediate resin stampers 20. It can also be provided detachably.
Incidentally, in the fine structure transfer unit 3, a plurality of intermediate resin stampers 20 are manufactured based on the master stamper 10, and each time the intermediate resin stamper 20 is manufactured, a transport mechanism (not shown) constituted by, for example, a robot hand or the like. Is transferred to the intermediate resin stamper storage unit 4.

  In addition, when the resin stamper 30 is manufactured by the fine structure transfer unit 3, the intermediate resin stamper storage unit 4 is configured by selecting one of the stored intermediate resin stampers 20 by, for example, a robot hand or the like. Is supplied to the plate 31 of the fine structure transfer unit 3 by a transport mechanism (not shown). The transport mechanism returns the intermediate resin stamper 20 to the intermediate resin stamper storage unit 4 after producing the predetermined number of resin stampers 30. Then, one selected from the plurality of stored intermediate resin stampers 20 is supplied to the plate 31 of the fine structure transfer unit 3 by a transport mechanism (not shown). Then, the resin stamper 30 is manufactured by the replaced new intermediate resin stamper 20.

≪Master stamper, intermediate resin stamper and resin stamper≫
The master stamper 10 used in the resin stamper manufacturing apparatus 1 of the present invention, and the intermediate resin stamper 20 and the resin stamper 30 manufactured by the resin stamper manufacturing apparatus 1 will be described.

<Master stamper>
As shown in FIG. 2A, the master stamper 10 has a microstructure 10a that is transferred to the intermediate resin stamper 20 (FIG. 2B) on its surface. The fine structure 10a refers to a structure formed with a size of nanometer to micrometer. Specifically, a dot pattern in which a plurality of minute protrusions are regularly arranged, a pattern in which minute recesses are regularly arranged, on the contrary, a lamella pattern in which a plurality of stripes are regularly arranged (line And space pattern).

  The material of the master stamper 10 is not particularly limited as long as it can achieve strength and required processing accuracy, and examples thereof include materials made of various metal materials, glass, quartz, ceramics, resin materials, and the like. Among them, the master stamper 10 made of quartz is highly transparent, and light (ultraviolet light) is used when the first photocurable resin composition and the second photocurable resin composition described above are photocured. Can be efficiently irradiated, which is desirable.

  A method for forming the fine structure 10a of the master stamper 10 is not particularly limited, and examples thereof include photolithography, focused ion beam lithography, and electron beam drawing. These methods can be appropriately selected according to the processing accuracy of the uneven pattern.

  As will be described later, a release layer may be formed on the surface of the master stamper 10 as described above in order to improve the release property of the intermediate resin stamper 20 with respect to the cured first photocurable resin composition. it can. The release layer may be formed using an existing fluorine-based material or a material that reduces adhesion of a resin such as silicone, hydrocarbon chain, diamond-like carbon, or metal.

<Intermediate resin stamper>
As shown in FIG. 2B, the intermediate resin stamper 20 includes a support base material 22 and a resin layer 20b formed on the surface of the support base material 22. The resin layer 20b has a resin layer on the surface. It has a microstructure 20a to be transferred to the stamper 30 (FIG. 2C). The fine structure 20a has a negative / positive relationship with respect to the fine structure 10a of the master stamper 10. For example, when the fine structure 10a of the master stamper 10 is formed by a minute recess, the fine structure 20a will be formed by the minute convex part (micro projection) corresponding to this.

As long as it has the function to hold | maintain the resin layer 20b as the support base material 22, a shape, material, size, and a preparation method are not specifically limited.
Examples of the shape of the support base 22 include a planar shape such as a circle, a square, a rectangle, and the like. Moreover, what has a center hole can also be used for the support base material 22. FIG. Further, the support base material 22 may be different in shape and surface area from the master stamper 10 as long as the fine pattern can be transferred to a predetermined region.
As the material of the support base material 22, a material made of a light transmissive material is used. In particular, those having strength and workability such as glass, quartz, and resin are preferable. In addition, the surface of the support base 22 can be subjected to a surface treatment in order to enhance the adhesive force with the resin layer 20b.
Moreover, the support base material 22 can also be comprised by 2 or more types of layers from which an elasticity modulus differs. In such a support base material 22, there is no restriction | limiting in particular about the lamination order of a layer with a high elastic modulus, and a low layer, a combination, the number of layers. As the support base material 22 having two or more kinds of layers, for example, two or more kinds of the above materials are selected to form each layer, or a layer made of the above materials and a layer made of a resin are combined. Or a combination of layers made of resin.

  Specific examples of the resin described above include, for example, phenol resin (PF), urea resin (UF), melamine resin (MF), polyethylene terephthalate (PET), unsaturated polyester (UP), alkyd resin, vinyl ester resin, epoxy Resin (EP), polyimide (PI), polyurethane (PUR), polycarbonate (PC), polystyrene (PS), acrylic resin, polyamide (PA), ABS resin, AS resin, AAS resin, polyvinyl alcohol, polyethylene (PE), Polypropylene (PP), polytetrafluoroethylene (PTFE), polyarylate, cellulose acetate, polypropylene (PP), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyphenylene Niren'okishido, cycloolefin polymer, polylactic acid, silicone resin, silsesquioxane resin, diallyl phthalate resin or the like, can be mentioned. Any of these may be used alone, or a plurality of different resins may be mixed and used.

The resin layer 20b is formed of a cured product of a first photocurable resin composition described below. This 1st photocurable resin composition is comprised with the radical photopolymerization type material.
As for the photocurable resin contained in the 1st photocurable resin composition in this embodiment, what has a (meth) acrylate group, a (meth) acryl group, or a vinyl group is mentioned. Moreover, the thing which has an epoxy group or an oxetanyl group is used. A plurality of these photocurable resins having these reactive functional groups in the skeleton can be used.

  Those having a terminal (meth) acrylate group are specifically poly (meth) acrylate, ethoxylated bisphenol A acrylate resin, aliphatic urethane acrylate resin, polyester acrylate, polyethylene terephthalate, polystyrene, polycarbonate, acrylic Modified alicyclic epoxide resin, bifunctional alcohol ether type epoxide resin, acrylic silicone, acrylic dimethylsiloxane resin, and the like.

A monomer can also be used. Examples of the material having a (meth) acrylate group or a vinyl group at the terminal include methoxytriethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, and isoboronyl (meth). Acrylate, octoxy polyethylene glycol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, isostearyl (meth) acrylate, lauryl (meth) acrylate, polyethylene glycol di (meth) acrylate, 1,10-decane Diol di (meth) acrylate, cyclodecanedimethanol di (meth) acrylate, ethoxylated 2-methyl-1,3-propanediol di (meth) acrylate, neopentyl glycol di (meth) a Relate, 2-hydroxy-3-acryloyloxypropyl methacrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, dipropylene glycol diacrylate, tripropylene glycol di (meth) Acrylate, polypropylene glycol di (meth) acrylate, ethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, ethoxylated isocyanuric acid tri Acrylate, ethoxylated trimethylolpropane tri (meth) acrylate, trimethylolpropane tri (meth) acrylate, propoxylated trimethylolprop Tri (meth) acrylate, pentaerythritol tri (meth) acrylate, ethoxylated pentaerythritol tetra (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, propoxylated pentaerythritol tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate , Dipentaerythritol hexa (meth) acrylate, cyclohexyl (meth) acrylate, cyclopentanyl (meth) acrylate, cyclopentenyl (meth) acrylate, adamantyl (meth) acrylate, and the like, but are not limited thereto.
In addition, it is more desirable to use a fluorinated compound of the above-mentioned photo-curable resin because it can provide releasability.

  Examples of those having an epoxy group at the terminal include alicyclic epoxides, modified alicyclic epoxides, bisphenol A epoxides, hydrogenated bisphenol A epoxides, bisphenol F epoxides, novolac epoxides, and aliphatic cyclics. Examples thereof include epoxides, naphthalene epoxides, biphenyl epoxides, bifunctional alcohol ether epoxides, 1,6-hexanediol glycidyl ether, 1,4-butanediol glycidyl ether, epoxy silicone, and epoxy silsesquioxane.

  Examples of those having an oxetanyl group include 3-ethyl-3-hydroxymethyloxetane, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, 3-ethyl-3- (phenoxy). Methyl) oxetane, di [1-ethyl (3-oxetanyl)] methyl ether, 3-ethyl-3- (2-ethylhexyloxymethyl) oxetane, 3-ethyl-3-{[3- (triethoxysilyl) propoxy Methyl} oxetane, oxetanylsilsesquioxane, phenol novolac oxetane, and the like.

Examples of the organic component having a vinyl group include ethylene glycol divinyl ether, diethylene glycol divinyl ether, triethylene glycol divinyl ether, tetraethylene glycol divinyl ether, butanediol divinyl ether, hexanediol divinyl ether, cyclohexanedimethanol divinyl ether, Di (4-vinyloxy) butyl isophthalate, di (4-vinyloxy) butyl glutarate, di (4-vinyloxy) butyltrimethylolpropane trivinyl ether succinate, 2-hydroxyethyl vinyl ether, hydroxybutyl vinyl ether, hydroxyhexyl vinyl ether, vinyl Examples thereof include silicone and vinyl silsesquioxane.
As mentioned above, although the monomer component which has any functional group of an epoxy group, oxetanyl group, and vinyl ether group was illustrated, it is not limited to these. In addition, it is more desirable to use a fluorinated compound of the above-mentioned photo-curable resin because it can provide releasability.

  The photocurable resin composition of the present invention contains a radical photopolymerization initiator. Incidentally, the second photocurable resin composition to be described later contains a photocationic polymerization initiator.

  Examples of the photo radical polymerization initiator include an acetophenone photopolymerization initiator, a benzyl ketal photopolymerization initiator, and a phosphorus photopolymerization initiator. Specifically, as an acetophenone photopolymerization initiator, 2-hydroxy-2-cyclohexylacetophenone (IRGACURE 184, manufactured by Ciba Japan), α-hydroxy-α, α′-dimethylacetophenone (Darocur ( DAROCUR) 1173, manufactured by Ciba Japan), 2,2-dimethoxy-2-phenylacetophenone (IRGACURE 651, manufactured by Ciba Japan), 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ) Ketone (DAROCUR 2959, manufactured by Ciba Japan), 2-hydroxy-1- [4- {4- (2-hydroxy-2-methyl-propionyl) -benzyl} phenyl] -2-methyl-propane- 1-On (Irgacure (IRGACU E) 127, include the Chiba Japan Co., Ltd.), and the like. Examples of the benzyl ketal photoinitiator include benzophenone, fluorenone, dibenzosuberone, 4-aminobenzophenone, 4,4'-diaminobenzophenone, 4-hydroxybenzophenone, 4-chlorobenzophenone, 4,4'-dichlorobenzophenone, and the like. It is done. As phosphorous photopolymerization initiators, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (IRGACURE 819, manufactured by Ciba Japan), (2,4,6-trimethylbenzoyl-diphenylphosphine) And oxide (DAROCURE TPO, manufactured by Ciba Japan Co., Ltd.).

<Resin stamper>
As shown in FIG. 2C, the resin stamper 30 includes a support base material 22 and a resin layer 30 b formed on the surface of the support base material 22. As described above, the resin stamper 30 can manufacture a device having a nano-level microstructure.
The support base material 22 is supplied from the support base material storage unit 2, and is the same as the support base material 22 (see FIG. 2B) of the intermediate resin stamper 20 (see FIG. 2B). The same material is used in shape.

The resin layer 30b has flexibility and is formed with a curved surface (preferably a spherical surface) that protrudes upward with a predetermined curvature on the support base material 22. Such a curved surface of the resin layer 30b is applied to the resin layer 30b by producing the resin stamper 30 on the bending jig 23, as will be described in detail later.
A microstructure 30a transferred from the intermediate resin stamper 20 (FIG. 2B) is formed on the surface of the resin layer 30b. The fine structure 30a has a negative / positive relationship with respect to the fine structure 20a of the intermediate resin stamper 20 (see FIG. 2B). That is, the fine structure 30a is configured in the same manner as the fine structure 10a (see FIG. 2A) of the master stamper 10 (see FIG. 2A) except that it is formed along a curved surface. When the fine structure 10a of the master stamper 10 is formed with a minute recess, the microstructure 30a is formed with a corresponding (similar) minute recess.

The resin layer 30b is formed of a cured product of a second photocurable resin composition described below. The second photocurable resin composition is a cationic polymerization material containing a photocationic polymerization initiator, whereas the first photocurable resin composition is composed of a photoradical polymerization material. It consists of
Examples of the cationic photopolymerization initiator for initiating polymerization of a photocurable resin having a (meth) acrylic group and a vinyl group include benzyl ketal, α-hydroxyketone, α-aminoketone, acylphosphine oxide, titanocenone, and oxyphenyl. Examples include acetic acid esters and oxime esters. More specifically, for example, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy-2-methyl-1-phenyl-propane-1 -One, benzophenone, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-methyl-1 [4- (methylthio) phenyl]- 2-Morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, bis (2,6-dimethoxybenzoyl) -2,4,4- Trimethyl-pentylphosphine oxide, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, bis (2,4,6-trimethylbenzoy ) - include phenyl phosphine oxide. These can be applied alone, but can also be used in combination of two or more.

  In addition, as a photocationic polymerization initiator for initiating polymerization of an epoxy group and an oxetanyl group, an electrophile having a cation generation source is not particularly limited as long as the organic component is cured by light. In addition, a known photocationic polymerization initiator can be used. Examples of such photocationic polymerization initiators include iron-allene complex compounds, aromatic diazonium salts, aromatic iodonium salts, aromatic sulfonium salts, pyridinium salts, aluminum complexes / silyl ethers, protonic acids, Lewis acids, and the like. Can be mentioned. More specifically, for example, IRGACURE261 (manufactured by Ciba Geigy), Optmer SP-150 (manufactured by ADEKA), Optmer SP-151 (manufactured by Asahi Denka Kogyo), Optmer SP-152 (manufactured by Asahi Denka Kogyo), Optomer SP-170 (manufactured by ADEKA), Optmer SP-171 (manufactured by ADEKA), Optmer SP-172 (manufactured by ADEKA), UVE-1014 (manufactured by General Electronics), CD-1012 (manufactured by Sartomer), Sun Aid SI -60L (manufactured by Sanshin Chemical Industry Co., Ltd.), Sun Aid SI-80L (manufactured by Sanshin Chemical Industry Co., Ltd.), Sun Aid SI-100L (manufactured by Sanshin Chemical Industry Co., Ltd.), Sun Aid SI-110 (manufactured by Sanshin Chemical Industry Co., Ltd.), Sun-Aid SI-180 (manufactured by Sanshin Chemical Industry Co., Ltd.), CI-2064 (manufactured by Nippon Soda Co., Ltd.), CI-2 39 (manufactured by Nippon Soda Co., Ltd.), CI-2624 (manufactured by Nippon Soda Co., Ltd.), CI-2481 (manufactured by Nippon Soda Co., Ltd.), Uvacure 1590 (Daicel UCB), Uvacure 1591 (Daicel UCB), RHODORSILPhotoInItiator 2074 (manufactured by Rhone-Poulenc), UVI -6990 (manufactured by Union Carbide), BBI-103 (manufactured by Midori Chemical), MPI-103 (manufactured by Midori Chemical), TPS-103 (manufactured by Midori Chemical), MDS-103 (manufactured by Midori Chemical), DTS -103 (made by Midori Chemical), DTS-103 (made by Midori Chemical), NAT-103 (made by Midori Chemical), NDS-103 (made by Midori Chemical), CYRAURE UVI 6990 (made by Union Carbide Japan) Is mentioned. These can be applied alone, but can also be used in combination of two or more. In addition, a known photopolymerization initiator can also be applied.

  Since the resin layer 30b formed of the second photocurable resin composition as described above has a curing mechanism different from that of the first photocurable resin composition forming the resin layer 20b of the intermediate resin stamper 20, As will be described later, when the fine structure 20a of the intermediate resin stamper 20 is transferred to the resin layer 30b of the resin stamper 30, the releasability is improved.

  Further, by making the resin layer 30b of the resin stamper 30 a flexible curved surface, the top of the curved surface comes into contact with the center of the transferred body when the fine structure 30a is transferred to the transferred body (not shown). After that, the contact area gradually expands toward the outer periphery of the transferred object, so that the resin of this resin layer is transferred thinly and uniformly without entraining air between the resin layer of the transferred object. Can be spread on the surface of the body.

<Curving jig>
As shown in FIGS. 3A and 3B, the bending jig 23 includes a square plate-like base 23a in plan view and a frame body 23b stacked on the base 23a.
The frame body 23b is formed according to a square whose outer contour is the contour of the base 23a. Further, the frame body 23b forms a recess 23d by a square space at the center thereof.
In the bending jig 23, a suction port 23c penetrating in the thickness direction of the base 23a and the frame body 23b is formed at a portion where the base 23a and the frame body 23b overlap. Four suction ports 23c are provided so as to correspond to the four sides of the square.
Incidentally, the four suction ports 23c in the present embodiment are provided at positions corresponding to suction holes (not shown) provided in the stage 32 shown in FIG. 1, and the bending jig 23 is provided on the stage 32. When arranged, the suction port 23c and the suction hole provided in the stage 32 communicate with each other.
The bending jig 23 is stored in the support base material storage unit 2, transferred to the fine structure transfer unit 3 during use, and installed on the stage 32. In addition, the storage place of the bending jig 23 is not limited to the support base material storage unit 2, and may be stored in another storage unit.

≪Resin stamper manufacturing method≫
Next, a method for manufacturing the resin stamper 30 using the resin stamper manufacturing apparatus 1 according to this embodiment will be described. FIGS. 4A to 4C are process explanatory views of a process in which an intermediate resin stamper is manufactured by the fine structure transfer unit of the resin stamper manufacturing apparatus of FIG. FIGS. 5A to 5D are process explanatory views of a process in which a resin stamper is manufactured by the fine structure transfer unit of the resin stamper manufacturing apparatus of FIG.

<Preparation of intermediate resin stamper>
As shown in FIGS. 4A to 4C, in the resin stamper manufacturing apparatus 1, the intermediate resin stamper 20 is manufactured prior to manufacturing the resin stamper 30.
First, the master stamper 10 taken out from the supporting base material storage unit 2 shown in FIG. 1 is fixed to the stage 32 of the fine structure transfer unit 3 by vacuum suction as shown in FIG.
Moreover, the support base material 22 taken out from the support base material storage unit 2 shown in FIG. 1 is fixed to the plate 31 by vacuum suction as shown in FIG. The master stamper 10 and the support base 22 are transported by a transport mechanism (not shown) such as the robot hand described above.

Next, as shown in FIG. 4A, the first photocurable resin composition R <b> 1 is applied from the nozzle 34 to the master stamper 10.
And as shown in FIG.4 (b), the stage 32 raises with the raising / lowering mechanism which is not shown in figure, and the original disk stamper 10 and the support base material 22 contact so that 1st photocurable resin composition R1 may be pinched | interposed. To do. As a result, the first photocurable resin composition R1 is spread between the master stamper 10 and the support substrate 22.

  Next, ultraviolet light is irradiated from the light source 33 toward the first photocurable resin composition R1 in a state in which the master stamper 10 and the support base material 22 are in close contact with each other via the first photocurable resin composition R1. Is done. As a result, the photocurable resin composition R1 is cured.

  Further, as shown in FIG. 4C, the stage 32 is lowered by an elevating mechanism (not shown), whereby the fine structure 10a of the master stamper 10 is transferred to the support base 22, and the resin layer having the fine structure 20a. 20b is formed. That is, the intermediate resin stamper 20 in which the resin layer 20b is formed on the support base 22 is produced on the plate 31 side.

  Although not shown, in this fine structure transfer unit 3, a plurality of intermediate resin stampers 20 are manufactured, and each time the intermediate resin stamper 20 is manufactured, the intermediate resin stamper storage unit 4 has the above-described transport mechanism. Stored in a slot (not shown) or a cassette (not shown). The used master stamper 10 is returned to and stored in the supporting base material storage unit 2 by a transport mechanism (not shown).

<Production of resin stamper>
As shown in FIGS. 5A to 5D, in the resin stamper manufacturing apparatus 1, the resin stamper 30 is manufactured using the intermediate resin stamper 20.

First, the intermediate resin stamper 20 taken out from the intermediate resin stamper storage unit 4 shown in FIG. 1 is fixed to the plate 31 by vacuum suction as shown in FIG.
Then, the bending jig 23 taken out from the supporting base material storage unit 2 shown in FIG. 1 is arranged on the stage 32 of the fine structure transfer unit 3 as shown in FIG. The intermediate resin stamper 20 and the bending jig 23 are transported by the transport mechanism (not shown).

Next, the support base material 22 taken out from the support base material storage unit 2 shown in FIG. 1 is placed on the bending jig 23 as shown in FIG. At this time, as described above, the suction hole (not shown) provided in the stage 32 communicates with the suction port 23c of the bending jig 23, and the suction pump (disposed to communicate with the suction hole of the stage 32) The support base material 22 is fixed on the stage 32 via the bending jig 23 by vacuum suction.
And as shown in FIG.5 (b), 2nd photocurable resin composition R2 is provided on the support base material 22 from the nozzle 34. As shown in FIG.

Next, as shown in FIG. 5 (c), the stage 32 is raised by an elevating mechanism (not shown) so that the intermediate resin stamper 20 and the support base material 22 sandwich the second photocurable resin composition R2. To touch.
At this time, the support base material 22 is pressed downward by the plate 31 via the second photocurable resin composition R2, so that the concave portion 23d of the bending jig 23 (see FIG. 3B). It bends and curves downward so as to fit in.

  Next, in a state where the intermediate resin stamper 20 and the curved support substrate 22 are in close contact with each other via the second photocurable resin composition R2, ultraviolet light from the light source 33 is applied to the second photocurable resin composition R2. Irradiated toward. Thereby, the photocurable resin composition R2 is cured.

  Then, as shown in FIG. 5D, when the intermediate resin stamper 20 is separated from the support base material 22 by the stage 32 being lowered by an elevating mechanism (not shown), the curved support base material 22 is restored. It becomes flat. Thereby, the resin layer 30b formed on the support base material 22 forms a curved surface so as to be convex upward. That is, on the stage 32, the resin stamper 30 in which the resin layer 30b having the fine structure 30a on the curved surface convex upward with a predetermined curvature is formed on the support base material 22 is manufactured.

Although not shown, in this fine structure transfer unit 3, a plurality of resin stampers 30 are produced per one intermediate resin stamper 20, and each time the resin stamper 30 is produced, It is stored in the aforementioned slot (not shown) or cassette (not shown) of the resin stamper storage unit 4.
The used intermediate resin stamper 20 is returned to and stored in the slot (not shown) or cassette (not shown) of the intermediate resin stamper storage unit 4 again by a transport mechanism (not shown).

Next, the effect which the resin stamper manufacturing apparatus 1 which concerns on this embodiment show | plays is demonstrated.
According to the embodiment of the present invention, a plurality of intermediate resin stampers 20 are produced based on the master stamper 10, and a plurality of resin stampers 30 are produced based on each of the intermediate resin stampers 20. Many resin stampers 30 can be manufactured efficiently without the fine structure 10a of the master stamper 10 being clogged with resin.

In addition, this embodiment is implemented in various forms, without being limited to the said embodiment.
In the embodiment, the support base material storage unit 2, the fine structure transfer unit 3, and the intermediate resin stamper storage unit 4 are installed in series, but the positional relationship is not limited. Therefore, the support base material storage unit 2 and the intermediate resin stamper storage unit 4 may be in the same direction with respect to the microstructure transfer unit 3, or the support base material storage unit 2 and the intermediate resin stamper storage unit 4 are 90 degrees. It may be in a rotated position.

Moreover, there is no restriction | limiting in particular as a provision method of the 1st photocurable resin composition and the 2nd photocurable resin composition with respect to the original disc stamper 10 or the support base material 22, Dispensing method, inkjet method, spray method, spin A coating method or the like can be used.
Moreover, the adhesion layer for accelerating | stimulating adhesion | attachment with the 1st photocurable resin composition or the 2nd photocurable resin composition can also be formed in the surface of the support base material 22.
In addition, in the support base material storage unit 2, at least two types of support base materials 22 having different types of surface treatment can be installed. That is, the surface treatment for promoting the adhesion between the support substrate 22 subjected to the surface treatment for promoting the adhesion with the first photocurable resin composition and the second photocurable resin composition was carried out. By installing the support base material 22, the support base material 22 suitable for the intermediate resin stamper 20 and the support base material 22 suitable for the resin stamper 30 can be supplied to the fine structure transfer unit 3.

In the above embodiment, it is assumed that an identification symbol for identifying each of the plurality of support base materials 22 is attached. This identification symbol can be visually discriminated by the operator, or optically. Or a magnetically readable identification mark. Moreover, the support base material 22 used according to the position and type of the slot or cassette provided in the intermediate resin stamper storage unit 4 may be identified without using such an identification symbol or identification mark. .
By making the support base material 22 identifiable in this way, for example, even when a defect is found by sampling inspection of the manufactured resin stamper 30, the manufacturing history becomes clear, so that the process of generating the defect is clarified. I can grasp it. Even when the support substrate 22 subjected to different surface treatments as described above is used, the support base material 22 having a different surface treatment can be accurately identified by making the support substrate 22 identifiable.

Further, the intermediate resin stamper storage unit 4 may have a temperature and humidity adjusting mechanism for stably storing the resin stamper 30.
If the temperature in the intermediate resin stamper storage unit 4 is set high enough to accelerate the curing of the first photocurable resin composition and the second photocurable resin composition, the microstructure transfer unit 3, even if the exposure time by the light source 33 when curing is short, the curing is promoted in the intermediate resin stamper storage unit 4, so that the production time per sheet of the intermediate resin stamper 20 and the resin stamper 30 is shortened. Can do.

Further, when the master stamper 10 and the first photocurable resin composition are brought into contact with each other, the master stamper 10 and the first photocurable resin composition are used in order to accelerate the curing of the first photocurable resin composition. The master stamper 10 and the first photocurable resin composition may be brought into contact with each other after the object is exposed to a reduced pressure or a gas atmosphere such as nitrogen.
Moreover, in the said embodiment, although the support base material 22 was curved in concave shape with the bending jig | tool 23, the method in particular of curving the support base material 22 into concave shape is not restrict | limited, A vacuum adsorption method or a mechanical method It may be curved by various methods such as.

In the embodiment, the support base material 22 is curved when the resin stamper 30 is manufactured. However, the arrangement of the resin stamper 30 and the intermediate resin stamper 20 is reversed, and the intermediate resin stamper 20 is placed on the bending jig 23. It is also possible to produce the resin stamper 30 having the convex resin layer 30b by curving the intermediate resin stamper 20 by arranging. The method of bending the intermediate resin stamper 20 into a concave shape is not particularly limited, and may be curved by various methods such as a vacuum suction method and a mechanical method.
In addition, the resin stamper manufacturing apparatus 1 can include an alignment mechanism for aligning the master stamper 10 and the support base material 22 or the intermediate resin stamper 20 and the support base material 22. This alignment mechanism may be either an optical alignment method, a mechanical alignment method, or the like.

  In the above embodiment, one fine structure transfer unit 3 is provided, but a plurality of fine structure transfer units 3 may be provided. For example, an apparatus including two microstructure transfer units 3 can produce the intermediate resin stamper 20 on the one hand and the resin stamper 30 on the other hand, and can improve the manufacturing throughput of the resin stamper 30.

  In the embodiment, the intermediate resin stamper 20 is produced by transferring the fine structure 10a of the master stamper 10 to the first photocurable resin composition made of a radical polymerization material on the support base 22, The resin stamper 30 was produced by transferring the microstructure 20a of the intermediate resin stamper 20 to the second photocurable resin composition made of a cationic polymerization material. On the contrary, the resin layer of the intermediate resin stamper 20 The second photocurable resin composition made of a cationic polymerization material is used for 20b, and the first photocurable resin composition made of a radical polymerization material is used for the resin layer 30b of the resin stamper 30. May be.

Next, the present invention will be described more specifically with reference to examples.
Example 1
In Example 1, the resin stamper manufacturing apparatus 1 shown in FIG. 1 was used to produce the intermediate resin stamper 20 based on the master stamper 10, and then the resin stamper 30 was produced based on the intermediate resin stamper 20.
As the master stamper 10 disposed in the supporting base material storage unit 2, a small recess having a diameter of 20 nm and a depth of 30 nm is formed at a pitch of 46 nm in a central area of 50 mm × 50 mm square of a silicon wafer having a thickness of 0.675 mm and a diameter of 150 mmφ. One having a hole pattern arranged in a plurality of hexagonals was used. This hole pattern is formed on the surface of the silicon wafer by the EB drawing method. Further, the surface having the hole pattern of the master stamper 10 was subjected to a mold release process using OPTOOL DSX (manufactured by Daikin Industries).

The supporting substrate storage unit 2 includes a group A supporting substrate 22 composed of 100 sheets numbered from A1 to A100, and a group B supporting substrate 22 composed of 5000 sheets numbered from B1 to B5000. Arranged. Note that a square glass substrate having a thickness of 0.7 mm and a side of 120 mm was used as the support base material 22. Further, each supporting base material 22 was printed with a corresponding numbering identification symbol (A1 to A100, B1 to B500) by an ink jet method.
And the surface treatment was performed to the surface of the support base material 22 of A group by apply | coating KBM5103 (made by Shin-Etsu Silicone). Further, KBM403 (manufactured by Shin-Etsu Silicone) was applied to the surface of the group B support substrate 22 to perform surface treatment.

  Further, as the bending jig 23 (see FIGS. 3A and 3B) arranged in the resin stamper manufacturing apparatus 1, a sheet (thickness 50 μm) made of 150 mm × 150 mm square polytetrafluoroethylene is used. A sheet (thickness 50 μm) made of polytetrafluoroethylene having a shape (outer circumference 150 mm × 150 mm, inner circumference 100 mm × 100 mm) was produced. As shown in FIGS. 3A and 3B, the suction ports 23c are provided at four locations.

  As the stage 32 of the fine structure transfer unit 3, a stainless steel disk having a lifting mechanism at the bottom was used. Incidentally, the stage 32 is provided with a suction hole (not shown) so as to communicate with the suction port 23c of the bending jig 23 when the bending jig 23 is disposed, and a vacuum pump is provided in the suction hole. Configured to connect.

As the plate 31 of the fine structure transfer unit 3, a quartz disk-shaped member was used. Incidentally, the plate 31 is provided with a suction hole (not shown) for sucking the support base material 22 or the intermediate resin stamper 20 when the support base material 22 or the intermediate resin stamper 20 is disposed, and a vacuum pump is connected to the suction hole. did.
As the light source 33 of the fine structure transfer unit 3, an LED light source that emits light having a wavelength of 365 nm was used.

From the nozzle 34, the 1st photocurable resin composition and the 2nd photocurable resin composition were each comprised separately. Incidentally, in this embodiment, although not shown in FIG. 1, the resin stamper manufacturing apparatus 1 having two nozzles 34 is used, and from each nozzle 34, the first photocurable resin composition and the second photocurable resin are used. The resin composition was configured to be discharged.
This 1st photocurable resin composition mixes 5 mass parts of IRGACURE819 (made by Ciba) as a polymerization initiator with respect to 100 mass parts of UA-53H (made by Shin-Nakamura Chemical Co., Ltd.) of urethane acrylate. The prepared radical photopolymerization material was used. 2nd photocurable resin composition mixes 5 mass parts of Adeka optomer SP-152 (made by ADEKA) as a polymerization initiator with respect to 100 mass parts of OX-SQ (made by Toagosei Co., Ltd.). The prepared cationic photopolymerization material was used.

  In the intermediate resin stamper storage unit 4, 100 slots for storing the intermediate resin stamper 20 produced by the fine structure transfer unit 3 were prepared, and each slot was numbered from N1 to N100. In addition, the intermediate resin stamper storage unit 4 was prepared with 5000 slots for storing the resin stamper 30 produced by the fine structure transfer unit 3, and each slot was numbered from M1 to M5000.

In the fine structure transfer unit 3, as shown in FIGS. 4 (a) to 4 (c), the master disk is used by using 100 support substrates 22 of group A arranged in the support substrate storage unit 2. The microstructure 10a of the stamper 10 was transferred to the resin layer 20b made of the first photocurable resin composition formed on the support substrate 22. As a result, 100 intermediate resin stampers 20 having the fine structure 20a in the resin layer 20b were produced. Each of the 100 intermediate resin stampers 20 having the support base material 22 on which the identification symbols A1 to A100 were printed was manufactured in order from the support base material 22 with the smallest numbering. Each of the intermediate resin stampers 20 was stored in each slot by the predetermined transfer device (not shown) every time it was manufactured. At this time, each of the intermediate resin stampers 20 was stored in each slot in ascending order of numbering of the 100 slots in which the numbering of N1 to N100 of the intermediate resin stamper storage unit 4 was performed.
And the mold release process was performed to the surface of the resin layer 20b which has the microstructure 20a of the produced intermediate resin stamper 20 using OPTOOL DSX (made by Daikin Industries).

  Next, in the fine structure transfer unit 3, each of the 100 intermediate resin stampers 20 stored in the slots N1 to N100 of the intermediate resin stamper storage unit 4 is used, as shown in FIGS. As shown, a resin stamper 30 was produced.

At this time, the support base material 22 uses 5000 support base materials 22 of the group B arranged in the support base material storage unit 2, and 50 resin stampers 30 are produced per one intermediate resin stamper 20. It was done. Further, the intermediate resin stamper 20 was used in the order of the numbering from N1 to N100, and 5000 support base materials 22 were also used in the order of the numbering from B1 to B5000. Then, each time the resin stamper 30 is produced, each of the produced resin stampers 30 is arranged in the ascending order of the numbering of the slots numbered from M1 to M5000 of the intermediate resin stamper storage unit 4 by a predetermined conveying device (not shown). Stored in the slot.
The used intermediate resin stamper 20 after the 50 resin stampers 30 had been produced was returned to the slots N1 to N100 of the original intermediate resin stamper storage unit 4 taken out.

Next, in this embodiment, the produced resin stamper 30 is used, and an acrylate resin applied on a silicon wafer (thickness 0.3 mm, diameter 65 mm) by a microstructure transfer device M (see FIG. 7) described later. The fine structure 30a was transferred to the material (transfer object).
FIG. 6 to be referred to is an electron micrograph of the fine structure transferred to the transfer body by the resin stamper 30 (having the support base material 22 for B1 numbering) produced in this example.
As shown in FIG. 6, a pillar pattern in which a plurality of micro-projections are arranged in hexagonal form corresponding to the hole pattern of the master stamper 10 is formed on the acrylate resin material of the transfer object.
Next, the configuration of the fine structure transfer apparatus M used in this embodiment will be described.
FIG. 7 is a configuration explanatory view of a fine structure transfer apparatus using a resin stamper manufactured in an embodiment of the present invention.
As shown in FIG. 7, the fine structure transfer device M includes a plate 41 and a stage 42 for holding and pressing the resin stamper 30 and the transfer target 5, and the photocurable resin composition S on the transfer target 5. And a light source 43 for curing.
As the stage 42, a stainless steel disk having an elevating mechanism (not shown) at the lower part was used. Incidentally, the stage 42 is provided with a suction hole (not shown), and a vacuum pump (not shown) is connected to the suction hole.
As the plate 31, a quartz disk was used. Incidentally, the plate 31 is provided with a suction hole (not shown) for sucking the support base material 22 or the intermediate resin stamper 20 when the support base material 22 or the intermediate resin stamper 20 is disposed, and a vacuum pump is connected to the suction hole. did.
As the light source 33, an LED light source that emits light having a wavelength of 365 nm was used.
The photopolymerizable composition S is an acrylate resin to which a photosensitive substance is added, and was prepared so as to have a viscosity of 4 mPa · s. As the transfer object 5, a silicon wafer having a diameter of 65 mm and a thickness of 0.3 mm was used.
Next, a transfer method using the fine structure transfer apparatus M will be described.
First, the transferred object 5 was vacuum-adsorbed on the stage 42 of the microstructure transfer apparatus M, the resin stamper 30 was vacuum-adsorbed on the plate 41, and then the photopolymerizable composition S was applied to the transferred object 5. Thereafter, the stage 32 was raised to press the photocurable resin composition S on the transfer target 5 against the resin stamper 30 installed on the plate 31. Thereafter, the photopolymerizable composition S is cured by irradiating with ultraviolet light from the light source 33 installed on the back surface of the plate 31. Finally, the stage 32 is lowered, and the resin stamper 30 and the transferred object 5 are peeled off to transfer the fine structure of the resin stamper 30 to the transferred object 5.

  Similarly, the fine structure 30a was transferred to an acrylate resin material (transfer object) coated on a silicon wafer by using a resin stamper 30 having a support base material 22 for B5000 numbering. And the diameter of the minute convex part of the to-be-transferred object by the resin stamper 30 which has the support base material 22 of B1 numbering, and the diameter of the minute convex part of the to-be-transferred object by the resin stamper 30 which has the supporting base material 22 of B5000 numbering As a result, the variation in diameter was within 3 nm.

(Example 2)
In Example 2, as a first photocurable resin composition, 5112X (manufactured by Solvay) 50 parts by mass, 1,6-bis (acryloyloxy) -2,2,3,3,4,4,5,5 -A radical photopolymerization material prepared by mixing 50 parts by mass of octafluorohexane (manufactured by Tokyo Chemical Industry Co., Ltd.) and 5 parts by mass of DAROCUR1173 as a polymerization initiator was used. In Example 2, the intermediate resin stamper 20 was not subjected to the mold release process. Except for this, 100 intermediate resin stampers 20 were produced in the same manner as in Example 1. Then, a total of 2000 resin stampers 30 were produced by producing 20 resin stampers 30 for each produced intermediate resin stamper 20.

  And the diameter of the minute convex part of the to-be-transferred object by the resin stamper 30 which has the support base material 22 of B1 numbering, and the diameter of the minute convex part of the to-be-transferred object by the resin stamper 30 which has the supporting base material 22 of B2000 numbering As a result, the variation in diameter was within 3 nm.

(Example 3)
In Example 3, each of the B1-B5000 resin stampers 30 produced in Example 1 was attached to the plate 31 in order, and 10 intermediate resin stampers 20 were produced per resin stamper 30. That is, instead of transferring the fine structure 10a of the master stamper 10 to the resin layer 20b of the intermediate resin stamper 20 in the first embodiment, the fine structure 30a of the resin stamper 30 is replaced with the resin layer of the intermediate resin stamper 20 in the third embodiment. Transferred to 20b. Incidentally, in the first embodiment, the master stamper 10 is mounted on the stage 32 side, and the intermediate resin stamper 20 is manufactured on the plate 31 side. However, in this third embodiment, the resin stamper 30 instead of the master stamper 10 is used. Is attached to the plate 31 side, and the intermediate resin stamper 20 is manufactured on the stage 32 side.
In addition, as the support base material 22 of the 50,000 intermediate resin stampers 20 produced on the stage 32 side, the support base material 22 subjected to C1 to C50000 numbering was used. Then, the 50000 support base materials 22 were arranged in the support base material storage unit 2 in order according to the progress in which the intermediate resin stamper 20 was manufactured by dividing the number of the support base materials 22 into 100 sets of 500 sheets in ascending order.

  Further, in the intermediate resin stamper storage unit 4, a cassette having 25 slots for the intermediate resin stamper 20 produced on the stage 32 side is detachably disposed at a predetermined position, and the produced intermediate resin stamper 20 is provided. Was adjusted so that the cartridges were sequentially stored in the slots of the cassette. In the intermediate resin stamper storage unit 4, 2000 cassettes are sequentially arranged in the intermediate resin stamper storage unit 4 in accordance with the production progress of the intermediate resin stamper 20, so that the support base that has been numbered C1 to C50000 is provided. The 50,000 intermediate resin stampers 20 having the material 22 were collected.

  Next, each of the collected 50,000 intermediate resin stampers 20 is sequentially attached to the plate 31 to produce 50 resin stampers 30 per intermediate resin stamper 20, for a total of 2500,000 resin stampers. 30 was produced. And the support base material 22 which gave the numbering from D1 to D2500000 was used for the support base material 22 of the 2500,000 resin stampers 30 produced on this stage 32 side. The 2500,000 support base materials 22 were arranged in the support base material storage unit 2 in order according to the progress in which the resin stamper 30 was produced by dividing the number of the support base materials 22 into 5000 sets of 500 sheets in ascending order.

  Further, in the intermediate resin stamper storage unit 4, a resin stamper 30 produced on the stage 32 side is detachably disposed at a predetermined position with a cassette having 25 slots, and the produced resin stamper 30 is a cassette. The transport mechanism was adjusted so that the slots were sequentially stored in the slots. In the intermediate resin stamper storage unit 4, 100,000 cassettes are sequentially arranged in the intermediate resin stamper storage unit 4 in accordance with the production progress of the resin stamper 30, thereby providing a support base material that has been numbered from D1 to D2500000. 2500,000 resin stampers 30 having 22 were collected.

  Further, using the resin stamper 30 having the D1 numbering support base material 22, the fine structure 30a is transferred to the acrylate resin material (transfer object) coated on the silicon wafer, and the D2500000 numbering support base material is used. Using the resin stamper 30 having the material 22, the fine structure 30a was transferred to the acrylate resin material (transfer object) applied on the silicon wafer. Then, the diameter of the minute convex portion of the transferred object by the resin stamper 30 having the support base material 22 for D1 numbering and the diameter of the minute convex portion of the transferred object by the resin stamper 30 having the support base material 22 for numbering D2500000. And the variation in diameter was only within 4 nm.

  In this manner, by using the resin stamper 30 manufactured in the first embodiment, a plurality of intermediate resin stampers 20 are manufactured, and a plurality of resin stampers 30 are manufactured from the intermediate resin stamper 20, so that from the first embodiment. In addition, the number of resin stampers 30 that can be manufactured from one master stamper can be greatly increased, and the productivity of the resin stamper 30 can be improved.

  Further, in this embodiment, an example in which the intermediate resin stamper 20 is manufactured using all of the resin stampers 30 manufactured in the procedure of the first embodiment is shown, but the intermediate resin stamper using only a part of the resin stampers 30 is shown. 20 may be produced. For example, the quality of the resin stamper 30 to be finally used can be improved by selectively using the resin stamper 30 having excellent pattern accuracy as a stamper for producing the intermediate resin stamper 20.

  At this time, as an example, the resin stamper 30 for producing the intermediate resin stamper 20 can be managed as follows. First, when the intermediate resin stamper 20 is manufactured from the master stamper 10, the transfer accuracy tends to decrease with the number of transfers. Therefore, the pattern accuracy tends to be higher in the resin stamper 30 manufactured from the intermediate resin stamper 20 having the earlier transfer order than the intermediate resin stamper 20 having the later transfer order. Similarly, when the resin stamper 30 is manufactured from the intermediate resin stamper 20, the transfer accuracy decreases with the number of times of transfer, so that the pattern accuracy of the resin stamper 30 with the earlier transfer order becomes higher.

  Since the production history of the resin stamper 30 produced by making the support substrate 22 discriminable by the identification symbol or the like of the support substrate 22 can be easily managed, based on the relationship of the transfer accuracy (pattern accuracy) described above. The resin stamper 30 with high pattern accuracy can be selected as a stamper for producing the intermediate resin stamper 20. Moreover, it is also possible to set in advance the target of the resin stamper 30 that is used for the production of the intermediate resin stamper 20 based on the relationship of the transfer accuracy described above.

(Comparative Example 1)
Unlike Comparative Example 1, in Comparative Example 1, the resin stamper 30 was produced directly from the master stamper 10 without producing the intermediate resin stamper 20. However, the fine structure of the resin stamper 30 is different from the resin stamper 30 of the first embodiment, and the fine structure 10a of the master stamper 10 is inverted.
In Comparative Example 1, the second photocurable resin composition for forming the resin layer 20b of the resin stamper 30 due to the deterioration of the release property of the master stamper 10 at the stage where 30 resin stampers 30 were produced. Adhered to the stamper 9. In addition, since the second photocurable resin composition is an organic-inorganic hybrid material, it is difficult to remove it from the master stamper 10.
In Comparative Example 1, the master stamper 10 was replaced with a new one, and the release process of the master stamper 10 was repeated every time 20 resin stampers 30 were produced. Therefore, the production efficiency of the resin stamper 30 was lowered.

DESCRIPTION OF SYMBOLS 1 Resin stamper manufacturing apparatus 2 Support base material storage unit 3 Fine structure transfer unit 4 Intermediate resin stamper storage unit 10 Master disk stamper 10a Fine structure 20 Intermediate resin stamper 20a Fine structure 22 Support base material 23 Bending jig 30 Resin stamper 30a Fine structure 31 Plate 32 Stage 33 Light source 34 Nozzle

Claims (14)

A resin stamper manufacturing apparatus for manufacturing a resin stamper that transfers a fine structure to a transfer target,
A supporting substrate storage unit for storing a plurality of supporting substrates;
A plurality of intermediate resin stampers in which a resin layer made of a cured product of a photocurable resin composition obtained by transferring a fine structure of a master stamper prepared in advance is formed on the support substrate transferred from the support substrate storage unit. A microstructure transfer unit;
An intermediate resin stamper storage unit for storing a plurality of intermediate resin stampers produced by the microstructure transfer unit;
The microstructure transfer unit applies a photocurable resin composition onto the support substrate transferred from the support substrate storage unit, and transfers the photocurable resin composition to the photocurable resin composition from the intermediate resin stamper storage unit. A resin stamper manufacturing apparatus, wherein a plurality of resin stampers are produced for each intermediate resin stamper by transferring the fine structure of the intermediate resin stamper. In the resin stamper manufacturing apparatus according to claim 1,
An apparatus for manufacturing a resin stamper, comprising: a mechanism for bending one of the support base material and the intermediate resin stamper transferred to the microstructure transfer unit into a concave shape. In the resin stamper manufacturing apparatus according to claim 2,
A mechanism for bending the support substrate or the intermediate resin stamper in a concave shape is a bending jig,
The resin stamper manufacturing apparatus, wherein the bending jig is supplied to the fine structure transfer unit at the time of use. In the resin stamper manufacturing apparatus according to claim 2,
The resin layer of the resin stamper to which the fine structure of the intermediate resin stamper is transferred is formed to have a convex curved surface by a mechanism that curves the support substrate or the intermediate resin stamper into a concave shape. Resin stamper manufacturing equipment. In the resin stamper manufacturing apparatus according to claim 1,
The fine structure transfer unit includes a nozzle capable of supplying at least a first photocurable resin composition and a second photocurable resin composition. In the resin stamper manufacturing apparatus according to claim 1,
The resin stamper manufacturing apparatus, wherein the support base material storage unit is provided with at least two types of support base materials having different types of surface treatment. In the resin stamper manufacturing apparatus according to claim 1,
The intermediate resin stamper is manufactured by transferring the fine structure of the master stamper to the first photocurable resin composition made of a radical polymerization material on the support substrate, and the fine structure of the intermediate resin stamper is converted into a cationic polymerization system. A resin stamper manufacturing apparatus for manufacturing a resin stamper by transferring to a second photocurable resin composition made of a material. In the resin stamper manufacturing apparatus according to claim 7,
A resin stamper manufacturing apparatus, wherein the microstructure of the resin stamper is transferred to a first photocurable resin composition made of a radical polymerization material to further produce an intermediate resin stamper different from the intermediate resin stamper. . In the resin stamper manufacturing apparatus according to claim 1,
The intermediate resin stamper and the resin stamper are transported to a specific position of the intermediate resin stamper storage unit, and each of the plurality of resin stampers can be identified by the specific position. . In the resin stamper manufacturing apparatus according to claim 1,
The fine structure of the master stamper is transferred to a resin material made of a cationic polymerization material to produce the intermediate resin stamper, and the fine structure of the intermediate resin stamper is transferred to a resin material made of a radical polymerization material so that the resin stamper An apparatus for manufacturing a resin stamper, wherein: A method of manufacturing a resin stamper that transfers a fine structure to a transfer target,
The support base material is transferred from a support base material storage unit for storing a plurality of support base materials to the microstructure transfer unit, and a first photocurable resin composition is applied onto the support base material. A step of transferring a fine structure of a master stamper prepared in advance to the photocurable resin composition to produce an intermediate resin stamper, and a step of producing a plurality of the intermediate resin stampers per master stamper,
A step of applying a second photocurable resin composition onto the support substrate transferred from the support substrate storage unit, and transferring the microstructure of the intermediate resin stamper to the second photocurable resin composition. Repeatedly producing a plurality of resin stampers per one intermediate resin stamper;
A method for manufacturing a resin stamper, comprising: In the step of producing the resin stamper,
The resin layer of the resin stamper onto which the microstructure of the intermediate resin stamper is transferred by curving one of the support base material coated with the second photocurable resin composition or the intermediate resin stamper into a concave shape The method for producing a resin stamper according to claim 11, wherein the curved surface is a convex curved surface. The method for producing a resin stamper according to claim 11, wherein the first photocurable resin composition and the second photocurable resin composition have different curing mechanisms. The first photocurable resin composition is applied onto the support substrate transferred from the support substrate storage unit, and the microstructure of the resin stamper is transferred to the first photocurable resin composition. The method for producing a resin stamper according to claim 11, further comprising a step of repeatedly producing the intermediate resin stamper and producing a plurality of the intermediate resin stampers per one resin stamper.