JP2013250441A5 - Optical device - Google Patents

Optical device Download PDF

Info

Publication number
JP2013250441A5
JP2013250441A5 JP2012125095A JP2012125095A JP2013250441A5 JP 2013250441 A5 JP2013250441 A5 JP 2013250441A5 JP 2012125095 A JP2012125095 A JP 2012125095A JP 2012125095 A JP2012125095 A JP 2012125095A JP 2013250441 A5 JP2013250441 A5 JP 2013250441A5
Authority
JP
Japan
Prior art keywords
insulating substrate
end portion
reference pattern
light emitting
signal line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012125095A
Other languages
Japanese (ja)
Other versions
JP2013250441A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2012125095A priority Critical patent/JP2013250441A/en
Priority claimed from JP2012125095A external-priority patent/JP2013250441A/en
Publication of JP2013250441A publication Critical patent/JP2013250441A/en
Publication of JP2013250441A5 publication Critical patent/JP2013250441A5/en
Pending legal-status Critical Current

Links

Description

本発明は、光デバイスに関し、例えば、光変調器に入力する信号を伝送するコプレーナ線路を備える光デバイスに関する。
The present invention relates to an optical device, for example, to an optical device comprising a coplanar line for transmitting a signal to be input to the optical modulator.

Claims (1)

グランド電位に接続される基準パターンが表面に設けられた絶縁基板と、
前記絶縁基板上に搭載された発光素子と、
前記絶縁基板上に形成され、その両側に前記基準パターンが配置された関係で信号線路を備え、先端が前記発光素子と電気的に接続されるコプレーナ線路と、
前記信号線路を跨いで、前記信号線路の両側の前記基準パターン同士を電気的に接続するボンディングワイヤと、
を備え、
前記発光素子の光出力側の前記絶縁基板の端部と前記コプレーナ線路における前記絶縁基板の前記端部側の先端との間における前記基準パターンの幅は、前記絶縁基板の他の端部と前記コプレーナ線路の間における前記基準パターンより小さい、光デバイス
An insulating substrate provided on the surface with a reference pattern connected to the ground potential;
A light emitting device mounted on the insulating substrate;
A coplanar line formed on the insulating substrate, provided with a signal line in a relationship in which the reference pattern is disposed on both sides thereof, and a tip electrically connected to the light emitting element ;
A bonding wire that straddles the signal line and electrically connects the reference patterns on both sides of the signal line;
With
The width of the reference pattern between the end portion of the insulating substrate on the light output side of the light emitting element and the end portion on the end portion side of the insulating substrate in the coplanar line is different from that of the other end portion of the insulating substrate. An optical device smaller than the reference pattern between coplanar lines .
JP2012125095A 2012-05-31 2012-05-31 Optical device and transmission line Pending JP2013250441A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012125095A JP2013250441A (en) 2012-05-31 2012-05-31 Optical device and transmission line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012125095A JP2013250441A (en) 2012-05-31 2012-05-31 Optical device and transmission line

Publications (2)

Publication Number Publication Date
JP2013250441A JP2013250441A (en) 2013-12-12
JP2013250441A5 true JP2013250441A5 (en) 2015-07-16

Family

ID=49849178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012125095A Pending JP2013250441A (en) 2012-05-31 2012-05-31 Optical device and transmission line

Country Status (1)

Country Link
JP (1) JP2013250441A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6376377B2 (en) * 2014-05-30 2018-08-22 住友電工デバイス・イノベーション株式会社 Optical device
JP7332090B2 (en) * 2019-04-16 2023-08-23 住友電工デバイス・イノベーション株式会社 Optical modulator carrier assembly and optical module
US11811191B2 (en) 2019-08-22 2023-11-07 Sumitomo Electric Device Innovations, Inc. Optical semiconductor device and carrier
WO2021210464A1 (en) * 2020-04-16 2021-10-21 ヌヴォトンテクノロジージャパン株式会社 Arrayed semiconductor laser device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3695717B2 (en) * 2002-09-17 2005-09-14 住友大阪セメント株式会社 Light modulator
JP2007067314A (en) * 2005-09-02 2007-03-15 Ntt Electornics Corp Light emitting module
JP5003464B2 (en) * 2007-12-21 2012-08-15 三菱電機株式会社 Optical transmission module
JP5405073B2 (en) * 2008-09-17 2014-02-05 富士通株式会社 Electronic devices
JP5180176B2 (en) * 2009-11-19 2013-04-10 日本電信電話株式会社 TO-CAN type TOSA module
JP5144628B2 (en) * 2009-11-19 2013-02-13 日本電信電話株式会社 TO-CAN type TOSA module

Similar Documents

Publication Publication Date Title
JP2015173289A5 (en)
JP2011129920A5 (en)
JP2011066409A5 (en) Semiconductor device pattern structure
JP2016001724A5 (en)
JP2017183578A5 (en)
JP2012048264A5 (en) Semiconductor device
JP2015109258A5 (en) Light emitting device
JP2015519782A5 (en)
JP2016507160A5 (en)
JP2014074716A5 (en)
JP2014103148A5 (en)
JP2016033978A5 (en)
JP2013250441A5 (en) Optical device
JP2015026652A5 (en)
JP2014206814A5 (en)
JP2014187081A5 (en)
JP2014150150A5 (en) Semiconductor package and electronic equipment
JP2014029987A5 (en)
JP2014030321A5 (en)
JP2011165858A5 (en) Semiconductor device
JP2018046314A5 (en)
JP2016006821A5 (en)
JP2016502267A5 (en) Apparatus and printed circuit board for providing an electro-optic arrangement
JP2015228396A5 (en)
WO2014107216A3 (en) Methods and apparatuses to provide an electro-optical alignment