JP2013248669A5 - - Google Patents

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Publication number
JP2013248669A5
JP2013248669A5 JP2013115533A JP2013115533A JP2013248669A5 JP 2013248669 A5 JP2013248669 A5 JP 2013248669A5 JP 2013115533 A JP2013115533 A JP 2013115533A JP 2013115533 A JP2013115533 A JP 2013115533A JP 2013248669 A5 JP2013248669 A5 JP 2013248669A5
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JP
Japan
Prior art keywords
laser
machine tool
tool according
head
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013115533A
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English (en)
Japanese (ja)
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JP2013248669A (ja
JP6150619B2 (ja
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Publication date
Priority claimed from EP12170208.8A external-priority patent/EP2669038B1/en
Application filed filed Critical
Publication of JP2013248669A publication Critical patent/JP2013248669A/ja
Publication of JP2013248669A5 publication Critical patent/JP2013248669A5/ja
Application granted granted Critical
Publication of JP6150619B2 publication Critical patent/JP6150619B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013115533A 2012-05-31 2013-05-31 デュアルレーザヘッド Active JP6150619B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP12170208.8A EP2669038B1 (en) 2012-05-31 2012-05-31 Dual laser head
EP12170208.8 2012-05-31

Publications (3)

Publication Number Publication Date
JP2013248669A JP2013248669A (ja) 2013-12-12
JP2013248669A5 true JP2013248669A5 (https=) 2014-01-30
JP6150619B2 JP6150619B2 (ja) 2017-06-21

Family

ID=46178466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013115533A Active JP6150619B2 (ja) 2012-05-31 2013-05-31 デュアルレーザヘッド

Country Status (4)

Country Link
US (1) US9180551B2 (https=)
EP (1) EP2669038B1 (https=)
JP (1) JP6150619B2 (https=)
TW (1) TWI626104B (https=)

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* Cited by examiner, † Cited by third party
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RU2639200C1 (ru) * 2016-10-14 2017-12-20 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" (Госкорпорация "Росатом") Способ двухлучевой лазерной сварки
CN107020451B (zh) * 2017-06-19 2019-09-24 中国工程物理研究院激光聚变研究中心 可旋转扫描的激光输出装置
JP6603278B2 (ja) * 2017-08-31 2019-11-06 ファナック株式会社 ファイバセレクタ及びレーザ装置
CN111344870A (zh) 2017-09-08 2020-06-26 密歇根大学董事会 电磁能量转换器
US12445086B2 (en) 2020-08-24 2025-10-14 The Regents Of The University Of Michigan Three-dimensional photovoltaic charging system
US12377744B2 (en) 2018-04-09 2025-08-05 The Regents Of The University Of Michigan On-demand electric charge service
IT201900009366A1 (it) 2019-06-18 2020-12-18 Prima Ind Spa Apparato di lavorazione laser e procedimento di lavorazione laser corrispondente
CN111673292B (zh) * 2020-06-04 2022-05-27 西安中科微精光子科技股份有限公司 一种五轴激光加工设备rtcp误差标定补偿方法
KR102841528B1 (ko) 2020-08-03 2025-08-04 더 리젠츠 오브 더 유니버시티 오브 미시건 초박형 투명 전도체를 사용한 유기 발광 다이오드에서의 도파관 모드의 제거
RU2750603C1 (ru) * 2020-09-02 2021-06-29 Российская Федерация, от имени которой выступает ФОНД ПЕРСПЕКТИВНЫХ ИССЛЕДОВАНИЙ Устройство для создания деталей аддитивно-субтрактивно-упрочняющей технологией
CN112404755B (zh) * 2020-09-23 2023-10-03 浙江圣石激光科技股份有限公司 一种光伏玻璃激光打孔方法
US12323184B2 (en) 2021-08-30 2025-06-03 The Regents Of The University Of Michigan Visible light communications technology for inter-vehicular use
CN113751882A (zh) * 2021-09-01 2021-12-07 苏州和瑞科智能装备有限公司 一种双工位镭雕机及其控制方法
DE102021128707A1 (de) * 2021-11-04 2023-05-04 Precitec Gmbh & Co. Kg Verfahren zum Kalibrieren eines oder mehrerer optischer Sensoren eines Laserbearbeitungskopfes, Laserbearbeitungskopf und Laserbearbeitungssystem
CN117139848B (zh) * 2023-07-07 2024-04-12 上海君屹工业自动化股份有限公司 柔性多兼容激光焊接系统及其多兼容焊接装置

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JPH04100689A (ja) * 1990-08-14 1992-04-02 Tsubakimoto Chain Co レーザ加工機用５軸テーブル
JP2001147399A (ja) * 1999-11-18 2001-05-29 Nec Corp レーザ加工装置とその調整方法
GB0313887D0 (en) * 2003-06-16 2003-07-23 Gsi Lumonics Ltd Monitoring and controlling of laser operation
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JP5010832B2 (ja) * 2006-01-19 2012-08-29 株式会社ディスコ レーザー加工装置
EP2032345B1 (en) * 2006-06-20 2010-05-05 Katholieke Universiteit Leuven Procedure and apparatus for in-situ monitoring and feedback control of selective laser powder processing
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