JP2013243389A5 - Alignment apparatus, alignment method and substrate bonding method - Google Patents

Claims (21)

An alignment apparatus for aligning the positions of a first substrate and a second substrate to be overlapped, the alignment apparatus comprising:
A microscope which moves to detect an alignment mark of the first substrate;
A position calculation unit that calculates the position of the first substrate based on the image including the alignment mark obtained by the microscope;
A detection unit that detects displacement of the microscope caused by vibration generated in the microscope that has moved to detect the alignment mark;
And a position correction unit configured to correct the calculated position of the first substrate based on the displacement of the microscope.   The alignment apparatus according to claim 1, further comprising a substrate holding unit that holds and fixes the first substrate.   The alignment apparatus according to claim 1, further comprising a moving stage which moves with the microscope mounted thereon.   The alignment apparatus according to claim 3, wherein the movement stage mounts the second substrate together with the microscope.   The alignment apparatus according to claim 3, further comprising: a first reflecting mirror provided on the moving stage; and a first interferometer that detects a moving amount of the moving stage using the first reflecting mirror. .   The displacement of the microscope relative to the moving stage is detected using a first reflecting mirror provided on the moving stage, a second reflecting mirror provided on the microscope, and the first reflecting mirror and the second reflecting mirror. The alignment apparatus according to claim 3, further comprising a second interferometer.   A drive unit is further provided, which stores in advance a drive profile of the movable stage to drive the movable stage, and causes the position correction unit to refer to the displacement of the microscope caused when the movable stage moves according to the drive profile. The alignment apparatus of Claim 3 or Claim 4.   The alignment apparatus according to claim 2, further comprising an accelerometer that detects displacement of the microscope.   The alignment apparatus according to any one of claims 3 to 7, wherein the position correction unit includes a tilt detection unit that calculates a tilt of the microscope with respect to the moving stage.   The alignment apparatus according to claim 9, wherein the position correction unit includes a measurement error calculation unit that calculates a measurement error of the position calculation unit from an inclination of the microscope detected based on a displacement of the microscope. An alignment method for aligning the positions of a first substrate and a second substrate to be overlapped,
Moving the microscope to detect an alignment mark of the first substrate;
Calculating a position of the first substrate based on an image including the alignment mark obtained by the microscope;
Detecting the displacement of the microscope caused by the vibration generated in the microscope moved to detect the alignment mark;
And correcting the calculated position of the first substrate based on the displacement of the microscope.   The alignment method according to claim 11, further comprising a substrate holding step of holding and fixing the first substrate.   The alignment method according to claim 11, wherein the microscope is moved by being mounted on a moving stage in the moving step.   The alignment method according to claim 13, wherein, in the moving step, the second substrate is mounted on the moving stage and moved together with the microscope.   14. The method according to claim 13, wherein the position calculating step comprises using a first reflecting mirror provided on the moving stage, and a first interferometer that detects a moving amount of the moving stage using the first reflecting mirror. The alignment method according to claim 14.   The detecting step may include a first reflecting mirror provided on the moving stage, a second reflecting mirror provided on the microscope, and the microscope on the moving stage using the first reflecting mirror and the second reflecting mirror. The alignment method according to claim 13, further comprising a second interferometer that detects a displacement of   In the detecting step, a driving profile of the moving stage is stored in advance to drive the moving stage, and the displacement of the microscope, which occurs when the moving stage moves according to the driving profile, is referred to in the position correcting step. The alignment method according to claim 13, further comprising:   The alignment method according to claim 12 or 13, wherein the detection step includes a step of detecting displacement of the microscope by an accelerometer.   The alignment method according to any one of claims 13 to 17, wherein the position correction step includes an inclination detection step of calculating an inclination of the microscope with respect to the moving stage.   20. The alignment method according to claim 19, wherein the position correction step comprises a measurement error calculation step of calculating a measurement error of the position calculation step from an inclination of the microscope detected based on a displacement of the microscope. An alignment step of aligning the first substrate and the second substrate by the alignment method according to any one of claims 11 to 20;
And a bonding step of overlapping and bonding the first substrate and the second substrate aligned in the alignment step.