JP2013241297A - Method of cutting glass plate, method of producing glass plate product, and apparatus for cutting glass plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent minute cracks from occurring when cutting a glass plate, and to reduce processes required for cutting the glass plate for cost reduction.SOLUTION: A method of cutting a glass plate includes: a glass plate-supporting part-mounting step of mounting a glass plate-supporting part for supporting the glass plate onto the glass plate to prevent the glass plate from falling down or colliding due to cutting; and a cutting step of cutting the glass plate, onto which the glass plate-supporting part is mounted through the glass plate-supporting part-mounting step, by performing etching using an etchant.

Description

  TECHNICAL FIELD The present invention relates to a glass plate cutting method, a glass plate product manufacturing method, and a glass plate cutting device, and in particular, a glass plate cutting method for etching a glass plate, a glass plate product manufacturing method, and a glass plate cutting. Relates to the device.

  Conventionally, in order to obtain a glass substrate having a predetermined size, a method of cutting a base glass by applying a physical force is known. The glass substrate is used as a material for a flat panel display or the like used in a liquid crystal display, a plasma display or the like. For example, a glass substrate having a size of 930 mm × 920 mm can be obtained by cutting a G6 size base glass (1500 mm × 1850 mm) into two parts.

  With the thinning of this glass substrate, the demand for chemically strengthened glass is increasing. When cutting chemically strengthened glass, vertical cracks for cutting hardly propagate to the inside due to the influence of the chemically strengthened layer on the glass surface. For this reason, in order to cut | disconnect the hard surface of chemically strengthened glass, it is necessary to apply a high pressure. However, when cutting with high pressure, horizontal figure-shaped cracks increase at the cutting point. Therefore, a method of performing chemical treatment on the base glass before applying pressure is known (for example, Patent Document 1).

  Patent Document 1 describes a method of performing chemical treatment after forming a scribe line on the glass surface, and then cutting and separating the base glass by mechanical or thermal stress. The scribe line is formed by, for example, engraving a line on the base glass with a diamond cutter or a cemented carbide wheel cutter. The chemical treatment is a treatment in which a liquid containing a glass-dissolving chemical is brought into contact with the base glass. As the mechanical force for cutting and separating the chemically-treated base glass, pulling or pressing is mentioned. In the case of pressurization, the base glass is installed so as to be bridged over two mounting tables, and then the base glass is cut and separated by pressing with a pressure jig from directly above the scribe line. As a method of cutting and separating the base glass by a thermal force, laser irradiation is mentioned on both sides of the scribe line.

  In addition, in Patent Document 1, instead of forming the scribe line, masking corresponding to the cutting separation pattern is performed on the surface of the base glass, and then chemical treatment is performed to form a groove corresponding to the cutting separation pattern. A method is described. In this case, similarly to the glass base material on which the scribe line is formed, the base glass is applied by applying pressure from directly above the groove formed on the base glass or irradiating laser on both sides of the groove. Disconnected.

JP 2004-307318 A

  However, in the method described in Patent Document 1, the base glass is cut by mechanical or thermal stress after the chemical treatment. As described above, when the base glass is cut by mechanical or thermal stress, even if it is after the chemical treatment, a minute crack is generated on the cut surface. These micro cracks cause cracking and chipping of the glass substrate in a subsequent process.

  In the method described in Patent Document 1, the glass base material is cut and separated by mechanical or thermal stress after scribe line formation and chemical treatment, or chemical treatment is performed instead of scribe line formation. Grooves are formed by the above, and the glass base material is finally cut and separated by mechanical or thermal stress. Therefore, at least two steps of a chemical treatment step and a cutting / separating step for applying mechanical or thermal force are required. Therefore, there are problems that the cutting process of the glass plate is complicated and the burden on the cost is large.

  Therefore, an object of the present invention is to suppress the generation of micro cracks associated with the cutting of the glass plate and reduce the cost by reducing the steps required for cutting the glass plate.

  The present invention relates to a glass plate cutting method. The glass plate cutting method according to the present invention includes a glass plate holding portion attaching step for attaching a glass plate holding portion for holding a glass plate to the glass plate in order to prevent the glass plate from falling or colliding due to cutting, and a glass A cutting step of cutting the glass plate to which the glass plate holding portion is attached by the plate holding portion attaching step by etching using an etching solution.

  Before the glass plate holding part mounting step, the method further includes a masking layer laminating step for laminating a masking layer for the etching liquid on the surface of the glass plate, and in the cutting step, the glass plate with the glass plate holding part attached is immersed in the etching liquid. Then, the glass plate may be cut in the etching solution.

  As an example, before the glass plate holding part mounting step, a pre-etching step of etching the surface of a portion of the glass plate that is desired to be cut to such an extent that the glass plate is not cut is further included. In the cutting step, the glass plate may be etched from both sides.

  For example, in the cutting step, the cut surface of the glass plate is mirror finished by selecting the composition of the etching solution according to the thickness and material of the glass plate. “Mirror finish” refers to a finish that smoothes the surface to the extent that an image of an object or the like is reflected.

  As an example, the cutting step includes a deposit removing step of removing a chemical reaction product generated by a reaction between the etching solution and the glass plate and adhered to the glass plate during the etching. In the cutting step, the shape of the cut cross section of the glass plate may be adjusted by changing the time for contacting the portion of the glass plate to be cut with the etching solution.

  Moreover, this invention concerns on the manufacturing method of the glass plate product which manufactures the glass plate product cut | disconnected by the predetermined magnitude | size. The glass plate product manufacturing method according to the present invention includes a glass plate holding portion mounting step for attaching a glass plate holding portion for holding a glass plate to the glass plate in order to prevent the glass plate from dropping or colliding by cutting. And a cutting step of obtaining the glass plate product cut into a predetermined size by cutting the glass plate to which the glass plate holding portion is attached by the glass plate holding portion attaching step by etching using an etching solution.

  It includes a masking layer stacking step for stacking a masking layer for the etching solution on the surface of the glass plate before the glass plate holding unit mounting step, and in the cutting step, the glass plate attached to the glass plate holding unit is immersed in the etching solution. Then, the glass plate may be cut in the etching solution.

  The present invention also relates to a glass sheet cutting device. The glass plate cutting device according to the present invention includes a glass plate holding portion for holding a glass plate and an etching solution for cutting the glass plate by etching in order to prevent the glass plate from falling or colliding due to cutting. An etching solution tank is provided.

  You may comprise so that the at least 1 glass plate which attached the glass plate holding | maintenance part may further be equipped with the support part in an etching liquid tank which supports in an etching liquid tank.

  The glass plate cutting method according to the present invention includes a glass plate holding portion mounting step for attaching a glass plate holding portion for holding a glass plate to the glass plate in order to prevent the glass plate from falling or colliding due to cutting. Yes. Therefore, even when the glass plate is cut by etching, there is no possibility that the cut glass plate falls or collides. Thus, the glass plate can be cut only by etching by holding the glass plate by the glass plate holding portion. Therefore, after the etching process, a process of applying mechanical or thermal force as shown in the prior art is not required. When the glass plate is cut, no mechanical or thermal force is applied to the glass plate, so that the generation of micro cracks associated with the cutting of the glass plate can be suppressed. In addition, since a process of applying a mechanical or thermal force is not necessary, it is possible to reduce the cost by reducing the process required for cutting the glass plate.

  In the cutting step, when the glass plate to which the glass plate holding part is attached is immersed in the etching solution and the glass plate is cut in the etching solution, for example, compared with the case where the etching solution is sprayed on the portion to be cut. More uniform etching can be performed.

  Before the glass plate holding part mounting step, in the case of further including a pre-etching step for etching the surface of the portion to be cut in the glass plate to such an extent that the glass plate is not cut, the gap into which the etching solution enters becomes larger, so cutting The etching solution can be more easily brought into contact with a desired portion.

  In the cutting step, when the glass plate is etched from both sides, the etching speed is accelerated, so that the time required for the etching process can be shortened. In addition, it is possible to obtain a profile of a cut cross-sectional shape that is line symmetric with respect to a center line extending in the extending direction of the glass plate at the center in the thickness direction of the glass plate.

  In the cutting step, by selecting the composition of the etching solution according to the thickness and material of the glass plate, when the cut surface of the glass plate is mirror finished, the strength of the cut surface is increased by mirroring the cut surface. be able to.

  In the case of including a deposit removing step for removing chemical reactants generated by the reaction between the etchant and the glass plate in the course of etching, by removing the chemical reactants that hinder the etching action, It is possible to increase the strength and perform the etching uniformly.

  In the cutting step, when adjusting the shape of the cut cross section of the glass plate by changing the time for contacting the portion of the glass plate to be cut with the etching solution, the desired cut cross section can be obtained by changing the etching processing time. Shape can be obtained.

  In order to prevent the glass plate from falling or colliding due to cutting, the glass plate product manufacturing method according to the present invention includes a glass plate holding portion attaching step for attaching the glass plate holding portion for holding the glass plate to the glass plate. Contains. Therefore, even when the glass plate is cut by etching, there is no possibility that the cut glass plate falls or collides. Thus, the glass plate can be cut only by etching by holding the glass plate by the glass plate holding portion. Therefore, similarly to the glass plate cutting method described above, the generation of micro cracks associated with the cutting of the glass plate can be suppressed, and the cost required for cutting the glass plate can be reduced.

  In the cutting step according to the manufacturing method of the glass plate product, when the glass plate to which the glass plate holding portion is attached is immersed in an etching solution and the glass plate is cut in the etching solution, for example, in a portion to be cut Compared with the case where the etching solution is sprayed, more uniform etching can be performed.

  The glass plate cutting device according to the present invention includes a glass plate holding portion that holds the glass plate in order to prevent the glass plate from dropping or colliding due to cutting. Therefore, even when the glass plate is cut by etching, there is no possibility that the cut glass plate falls or collides. Thus, the glass plate can be cut only by etching by holding the glass by the glass plate holding portion. Therefore, similarly to the glass plate cutting method described above, the generation of micro cracks associated with the cutting of the glass plate can be suppressed, and the cost required for cutting the glass plate can be reduced.

  In the case of further comprising an etching solution tank support for supporting at least one glass plate to which the glass plate holding unit is attached in the etching solution tank, the glass plate at an arbitrary position in the etching solution tank. Can be supported. In addition, a plurality of glass plates can be simultaneously supported in the etching solution tank.

It is a front view of the glass plate cutting device concerning a 1st embodiment. It is a side view of the glass plate and glass plate holding | maintenance part which concern on 1st Embodiment. It is a flowchart which shows the process regarding the manufacturing method of the glass plate cutting method and glass plate product performed using the glass plate cutting device which concerns on 1st Embodiment. It is a front view of the glass plate cutting device concerning a 2nd embodiment. It is a side view of the glass plate and glass plate holding | maintenance part which concern on 2nd Embodiment. It is a flowchart which shows the process regarding the manufacturing method of the glass plate cutting method and glass plate product performed using the glass plate cutting device which concerns on 2nd Embodiment. It is a schematic diagram which shows the cut | disconnected cross-sectional shape of the glass plate which concerns on other embodiment.

[First Embodiment]
Embodiments of the present invention will be described below with reference to the accompanying drawings. The front view of the glass plate cutting device which concerns on FIG. 1 at 1st Embodiment is shown. The glass plate cutting device according to the first embodiment cuts a glass plate into a predetermined size. In order to prevent the glass plate 2 from dropping or colliding due to cutting, the glass plate cutting device 1 includes a glass plate holding unit 3 for holding the glass plate 2, an etching solution tank 6 containing an etching solution 5, and a glass An etching solution tank support portion 7 that supports the glass plate 2 to which the plate holding unit 3 is attached in the etching solution tank 6 is provided.

  The side view of the glass plate 2 to which the glass plate holding part 3 is attached is shown in FIG. The glass plate 2 and the glass plate holding | maintenance part 3 shown in FIG. 1 show the AA line end surface shown in FIG. The glass plate 2 is a chemically strengthened glass having a thickness of about 0.7 mm. Chemically tempered glass is a glass in which a compression layer is formed on the glass surface by immersing the glass in a molten salt and performing ion exchange. Generally, it has a strength about 5 times or more that of ordinary glass.

  A masking layer 10 is formed on the glass plate surface 2a. The masking layer 10 is made of a material resistant to the etching solution 5. In this embodiment, the masking layer 10 is formed by sticking a masking sheet having an adhesive layer on the surface facing the glass plate surface 2a to the glass plate surface 2a. The masking layer 10 covers substantially the entire surface of the glass plate surface 2a except for the portion 9 (hereinafter referred to as “scheduled cutting line”) 9 to be cut. In the present embodiment, as shown in FIG. 1, both surfaces of the glass plate 2 are masked by the masking layer 10.

  When the glass plate holding part 3 cuts the glass plate 2 by etching, the cut glass plate 2 falls or collides in the etchant tank 6 and the glass plate 2 is cracked or chipped. In order to prevent this, it is a jig for holding the glass plate 2. The glass plate holding unit 3 includes a plurality of rod-like members 11.

  As shown in FIG. 2, the plurality of rod-like members 11 are elongated in the length direction of the glass plate 2. An adhesive layer 11a is formed at the tips of the plurality of rod-shaped members 11 (FIG. 1). The glass plate holding part 3 is detachably attached to the glass plate 2 through the adhesive layer 11a. The adhesive layer 11a is a masking layer in a plurality of regions defined by the planned cutting line 9 (in the example shown in FIG. 2, the inner region 25 surrounded by the planned cutting line 9 and the outer region 26 of the planned cutting line 9). 10 is adhered. As described above, the glass plate holding unit 3 supports a plurality of regions divided by the scheduled cutting line 9 so that the relative positional relationship between these regions does not change even after the glass plate 2 is cut. By doing so, the glass plate 2 is prevented from falling due to cutting, or the glass plates 2 cut into a plurality of pieces from colliding with each other.

  The glass plate holding part 3 further includes a reinforcing part 14 extending in a direction perpendicular to the direction in which the rod-shaped member 11 extends. Similar to the rod-shaped member 11, the reinforcing portion 14 includes an adhesive layer 11a on the surface facing the glass plate surface 2a. Since the area | region where the glass plate holding | maintenance part 3 adhere | attaches to the glass plate surface 2a increases by the reinforcement part 14, the attachment strength of the glass plate holding | maintenance part 3 can be reinforced.

  The glass plate holding part 3 is formed of a material resistant to the etching solution 5 including the adhesive layer 11a. As shown in FIG. 1, in this embodiment, the glass plate holding | maintenance part 3 is attached to both surfaces of the glass plate 2. As shown in FIG.

  The etching solution 5 filled in the etching solution tank 6 is a liquid having a property of dissolving glass. As an example, the etching solution 5 is an aqueous solution containing hydrofluoric acid. An inorganic acid or the like may be added to the aqueous solution containing hydrofluoric acid in order to reduce the amount of chemical reaction products generated during the etching process that adhere to the glass surface.

  The etching solution tank 6 includes a bubbling mount 22 that generates bubbles 23, and bubbles the etching solution 5. By bubbling, the etching solution 5 in the etching solution tank 6 is circulated and stirred, and variations in the etching solution composition, temperature distribution, and the like are reduced. As a result, a more uniform etching process can be performed. Further, by circulating and stirring the etching solution 5, the chemical reactant generated by the etching is washed away, and the amount of the chemical reactant attached to the glass plate 2 can be reduced.

  The etchant tank support part 7 includes a substantially rectangular parallelepiped cassette part 16 that houses the glass plate 2 to which the glass plate holding part 3 is attached, and a cassette support part that suspends the cassette part 16 and supports it in the etchant tank 6. 20 and so on. In this embodiment, since at least one of the surfaces defining the substantially rectangular parallelepiped shape of the cassette portion 16 is open, the glass plate 2 to which the glass plate holding portion 3 is attached is set in the cassette portion 16, and the cassette portion The glass plate 2 accommodated in the cassette unit 16 is immersed in the etching solution 5 in the etching solution tank 6 by immersing 16 in the etching solution vessel 6 filled with the etching solution 5.

  In the cassette unit 16, a plurality of upper end pockets 18 a for storing the upper end of the glass plate 2 and a plurality of lower end pockets for storing the lower end of the glass plate 2 in order to store the glass plate 2 to which the glass plate holding unit 3 is attached. 18b. The upper end pocket 18 a and the lower end pocket 18 b are each defined by an inner surface of the cassette part 16 and two wall parts 19 extending in a direction away from each other toward the center of the cassette part 16. Since a plurality of upper end pockets 18a and lower end pockets 18b are provided, a plurality of glass plates 2 with the glass plate holding portions 3 attached thereto can be accommodated in the cassette portion 16 and etched simultaneously.

  The cassette support portion 20 is configured to be detachable from the cassette portion 16. After setting the glass plate 2 with the glass plate holding part 3 attached to the cassette part 16, the cassette support part 20 is attached to the cassette part 16 and the cassette support part 20 is moved so that the cassette part 16 is moved into the etching solution tank 6. Sink into. During the etching process of the glass plate 2, the cassette unit 16 is suspended in the etching solution tank 6 by the cassette support unit 20. After the etching process is completed, the cassette support part 20 is moved to lift the cassette part 16 for storing the cut glass plate 2 from the etching liquid tank 6 and transport it to a cleaning tank or the like for performing the cleaning process. When it is no longer necessary to move or support the cassette unit 16, the cassette support unit 20 is removed from the cassette unit 16.

  Next, a glass plate cutting method and a glass plate product manufacturing method executed using the glass plate cutting apparatus 1 will be described with reference to the flowchart shown in FIG. First, the masking layer 10 is laminated on the glass plate surface 2a (step 1). As described above, the masking layer 10 is formed so as to cover substantially the entire surface of the glass plate surface 2a except for the line 9 to be cut. The masking layer 10 is laminated on both surfaces of the glass plate 2.

  The glass plate holding part 3 is attached to the glass plate 2 on which the masking layer 10 is laminated (step 2). As described above, the glass plate holding unit 3 is in a plurality of regions defined by the planned cutting line 9 (in the example shown in FIG. 2, the inner region 25 and the outer region 26 surrounded by the planned cutting line 9). It adheres to the masking layer 10 of the glass plate 2 and supports the plurality of regions so that the relative positional relationship between these regions does not change even after the glass plate 2 is cut.

  Next, the glass plate 2 to which the glass plate holding unit 3 is attached is immersed in the etching solution 5 to cut the glass plate 2 in the etching solution 5 (step 3). First, the glass plate 2 to which the glass plate holding unit 3 is attached is set in the cassette unit 16 of the etching solution tank support unit 7. The cassette unit 16 containing the glass plate 2 is submerged in the etching solution tank 6 filled with the etching solution 5. Thereby, the glass plate 2 to which the glass plate holding part 3 is attached is immersed in the etching solution 5. The cassette part 16 is held in the etching solution tank 6 during the etching process by being suspended by the cassette support part 20.

  In the present embodiment, etching proceeds from both surfaces of the glass plate 2. When the cutting of the glass plate 2 is completed by the etching, the cassette unit 16 in which the glass plate 2 is stored is lifted from the etching solution 5. Since the glass plate holding part 3 is attached to the glass plate 2, the glass plate 2 is taken out from the etching solution 5 without being dropped or collided by cutting.

  The cassette unit 16 drawn from the etching solution 5 moves to the cleaning tank in a state where the glass plate 2 is stored. In the washing tank, the glass plate 2 is washed and the etching solution 5 is washed away. The glass plate 2 cut | disconnected from the glass plate holding | maintenance part 3 is removed after washing | cleaning. When the masking layer 10 is removed from the removed glass plate 2, a glass substrate of a predetermined size used as a material for a flat panel display or the like can be obtained as a glass plate product.

  As described above, in the glass plate cutting device 1 according to the first embodiment, since the glass plate holding unit 3 is attached to the glass plate 2, even when the glass plate 2 is cut by etching. There is no possibility that the cut glass plate 2 falls or collides. Since the glass plate cutting device 1 cuts the glass plate 2 only by etching, no mechanical or thermal force is applied to the glass plate 2 when the glass plate 2 is cut. Therefore, generation | occurrence | production of the micro crack accompanying the cutting | disconnection of the glass plate 2 can be suppressed. In addition, since a process of applying a mechanical or thermal force is not necessary, the process required for cutting the glass plate 2 can be reduced and the cost can be reduced.

[Second Embodiment]
The front view of the glass plate cutting device 30 which concerns on FIG. 4 at 2nd Embodiment is shown. The glass plate cutting device 30 includes a glass plate holding portion 33 different from the glass plate holding portion 3 of the glass plate cutting device 1 according to the first embodiment. The etchant tank 6 and the etchant tank support 7 are the same as those described above in the first embodiment.

  The side view of the glass plate holding | maintenance part 33 which concerns on 2nd Embodiment is shown in FIG. The glass plate 2 and the glass plate holding | maintenance part 33 shown in FIG. 4 show the BB line end surface shown in FIG. In FIG. 5, the components that are located between the planned cutting line 9 formed on the glass plate surface 2 a covered by the plate portion 42 of the glass plate holding portion 33 and the plate portion 42 and the glass plate surface 2 a are shown. It is illustrated virtually. On both surfaces of the glass plate 2, masking layers 10 are laminated at portions other than the scheduled cutting line 9, as with the glass plate 2 described above in the first embodiment. In 2nd Embodiment, before attaching the glass plate holding | maintenance part 33 to this glass plate 2, the glass plate surface 2a of the part corresponding to the scheduled cutting line 9 is etched to such an extent that the glass plate 2 is not cut | disconnected.

  The glass plate holding portion 33 according to the second embodiment includes a plate portion 42 that faces the glass plate surface 2a and covers substantially the entire surface of the glass plate surface 2a, and a surface of the plate portion 42 that faces the glass plate surface 2a. And a plurality of adhesive layers 41 provided on the substrate. The glass plate holding part 33 is detachably attached to the glass plate 2 through the adhesive layer 41. The adhesive layer 41 is elongated in the width direction of the glass plate 2 and is defined by a plurality of regions defined by the planned cutting line 9 (in the example shown in FIG. 5, the inner region 25 surrounded by the planned cutting line 9 and the planned cutting line 9 9 is adhered to the masking layer 10 in the outer region 26). Similar to the first embodiment, the glass plate holding portion 33 includes the adhesive layer 41 and is formed of a material resistant to the etching solution 5. As shown in FIG. 4, in this embodiment, the glass plate holding | maintenance part 33 is attached to both surfaces of the glass plate 2. As shown in FIG.

  Next, a glass plate cutting method and a glass plate product manufacturing method executed using the glass plate cutting apparatus will be described with reference to the flowchart shown in FIG. First, the masking layer 10 is laminated on the glass plate surface 2a (step 11). Similar to the first embodiment, the masking layer 10 is formed so as to cover substantially the entire surface of the glass plate surface 2a except for the line 9 to be cut. The masking layer 10 is laminated on both surfaces of the glass plate 2.

  The glass plate 2 on which the masking layer 10 is laminated is immersed in the etching solution 5 (step 12). At this stage, the glass plate holder 33 may not be attached to the glass plate 2. The masked glass plate 2 is set in the cassette portion 16 of the support portion 7 in the etching solution tank, and the cassette portion 16 containing the glass plate 2 is submerged in the etching solution tank 6.

  As a result, the glass plate surface 2a corresponding to the planned cutting line 9 is etched to such an extent that the glass plate 2 is not cut (step 13). When the etching process shown in Step 13 (hereinafter referred to as “pre-etching”) performed prior to the etching for completely cutting the glass plate 2 is completed, the cassette unit 16 containing the glass plate 2 is removed from the etching solution 5. The glass plate 2 is washed and the etching solution 5 is washed away.

  A glass plate holder 33 is attached to the cleaned glass plate 2 (step 14). The glass plate holding part 33 is in a plurality of regions defined by the planned cutting line 9 (in the example shown in FIG. 5, the inner region 25 surrounded by the planned cutting line 9 and the outer region 26 of the planned cutting line 9). It adheres to the masking layer 10 of the glass plate 2 and supports the plurality of regions so that the relative positional relationship between these regions does not change even after the glass plate 2 is cut.

  Next, the glass plate 2 to which the glass plate holding portion 33 is attached is immersed in the etching solution 5 to cut the glass plate 2 in the etching solution 5 (step 15). The glass plate 2 to which the glass plate holding part 33 is attached is set in the cassette part 16 of the supporting part 7 in the etching solution tank and submerged in the etching solution tank 6. Thereby, the glass plate 2 to which the glass plate holding part 33 is attached is immersed in the etching solution 5.

  As shown in FIG. 4, the thickness of the glass plate 2 is thinner than the other portions by the pre-etching (step 13) in the portion corresponding to the planned cutting line 9. As an example, the thickness of the glass plate 2 is about 0.7 mm, and the thickness of the portion thinned by the pre-etching is about 0.3 mm. By making the thickness of the glass plate 2 corresponding to the planned cutting line 9 thinner than other portions by pre-etching, the etching solution 5 enters more into the portion corresponding to the planned cutting line 9 in the glass plate 2. It has become easier.

  As in the first embodiment, etching proceeds from both surfaces of the glass plate 2. When the cutting of the glass plate 2 is completed by the etching, the cassette unit 16 in which the glass plate 2 is stored is lifted from the etching solution 5. Since the glass plate holding part 33 is attached to the glass plate 2, the glass plate 2 is taken out from the etching solution 5 without being dropped or collided by cutting. When the glass plate 2 lifted from the etching solution 5 is washed and the masking layer 10 is removed, a glass substrate cut into a predetermined size can be obtained.

  As described above, the glass plate cutting device according to the second embodiment brings the etching solution 5 into more contact with the cut portion by performing a pre-etching process in addition to the advantages described above in the first embodiment. It has the advantage of being easy.

[Other Embodiments]
Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications and changes can be made based on the technical idea of the present invention. For example, in the first and second embodiments, the composition of the etching solution 5 may be selected according to the thickness and material of the glass plate 2 so that the cut surface of the glass plate 2 has a mirror finish. By making the cut surface of the glass plate 2 into a mirror finish, the strength of the cut surface can be increased.

  As an example, the composition of the etching solution 5 for mirror-finishing the cut surface is a mixed acid in which the weight percentage of hydrogen fluoride, sulfuric acid, hydrochloric acid, nitric acid, etc. is 0% to 50%. From the above weight percent range, a liquid composition is selected in which the cut surface of the glass plate 2 is mirror-finished according to the thickness and material of the glass plate 2. A surfactant may be added as necessary. In addition, the said liquid composition is an illustration, Comprising: You may use the etching liquid 5 which has another composition which can make the cut surface of the glass plate 2 into a mirror surface finish.

  In the first and second embodiments, when the glass plate 2 is cut while being immersed in the etching solution 5 (steps 3 and 15), the glass plate 2 is removed from the etching solution tank 6 during the etching process. You may perform the deposit | attachment removal process which lifts and removes the deposit | attachment of the location currently cut | disconnected. During the etching process, a chemical reaction product due to etching may adhere to a location where the glass plate 2 is to be cut. This chemical reactant prevents the etching action. By removing this deposit during etching, the strength of the cut surface can be increased and the etching can be progressed uniformly.

  For example, the deposits are removed by applying brush treatment or vibration agitation to the portion of the glass plate 2 that is to be cut. Moreover, you may remove a deposit | attachment by giving a marking process to the location which is going to cut | disconnect the glass plate 2. FIG. The glass plate holders 3 and 33 may be removed from the glass plate 2 drawn up from the etching solution tank 6 to perform the deposit removal process, or the glass plate holders 3 and 33 are attached to the glass plate 2. The deposit removal process may be performed. When the deposit removal process is completed, the glass plate 2 to which the glass plate holders 3 and 33 are attached is returned to the etching solution 5 again to continue the etching process. During the etching process, the deposit removing process may be performed once or a plurality of times.

  In the said 1st and 2nd embodiment, you may adjust the shape of the cut cross section of the glass plate 2 to a desired shape by changing the time which makes the glass plate 2 contact the etching liquid 5. FIG. In FIG. 7, the shape of the cut cross section in the glass plate 2 is illustrated typically. The first cross-sectional shape 51 and the second cross-sectional shape 52 are examples of cross-sectional shapes when the time for bringing the glass plate 2 into contact with the etching solution 5 is relatively short and when the time is relatively long. In the said 1st and 2nd embodiment, since it etches from both surfaces of the glass plate 2, the profile of a cutting | disconnection cross-sectional shape is extended in the direction where the glass plate 2 is extended in the center of the thickness direction of the glass plate 2. FIG. The line is symmetrical with respect to the center line L.

  When the time for bringing the glass plate 2 into contact with the etching solution 5 is short, as shown in the first cross-sectional shape 51, a sharp corner protruding outward is formed on the cut surface of the glass plate 2. The sharp state on the cut surface is adjusted by the etching processing time. When the time during which the glass plate 2 is brought into contact with the etching solution 5 is long, the sharp corners shown in the first cross-sectional shape 51 are shaved by etching, and as shown in the second cross-sectional shape 52, The cut surface has a rounded shape toward the outside. As an example, when importance is attached to the safety during handling of the glass plate 2, the glass plate 2 is brought into contact with the etching solution 5 for a longer time so that the glass plate 2 has a shape as shown in the second cross-sectional shape 52. The shape of the two cut surfaces can be rounded toward the outside.

  The glass plate 2 is not limited by the glass composition. The glass plate 2 may be a single glass plate or a glass plate formed by bonding a plurality of glass plates. The glass plate 2 may include a liquid crystal cell region, a thin film transistor, a transparent electrode, an alignment film, and the like.

  As a masking method, a method of sticking a masking sheet having an adhesive layer to the surface of a plate glass has been described, but the method is not limited thereto. For example, the plate glass may be masked by applying a photoresist to the glass plate surface 2a, transferring a masking pattern by exposure, and removing the photoresist on the line 9 to be cut.

  The glass plate holding part 3 in the first embodiment may be a rod-like member bonded to the masking layer 10 in the plurality of regions 25 and 26 defined by the planned cutting line 9, and is defined by the planned cutting line 9. The plurality of regions 25 and 26 may be lattice-like members that are bonded to the masking layer 10.

  If the etching solution 5 can be brought into contact with the scheduled cutting line 9 of the glass plate 2, the glass plate holding portion 3 is so adhered that the adhesive layers 11a and 41 of the glass plate holding portions 3 and 33 adhere to substantially the entire surface of the glass plate surface 2a. , 33 may be configured. For example, when the planned cutting line 9 extends to the outer edge of the glass plate 2, even if the adhesive layers 11 a and 41 are bonded to substantially the entire surface of the glass plate surface 2 a, Then, the etching solution 5 can be made to enter the line 9 to be cut. As described above, in the case of adopting a configuration in which the adhesive layers 11a and 41 adhere to substantially the entire surface of the glass plate surface 2a, the above-described pre-etching process is performed in order to make it easier for the etching solution 5 to enter the planned cutting line 9. It is desirable to do.

  In 1st and 2nd embodiment, although the glass plate holding | maintenance part is attached to both surfaces of the glass plate 2, you may attach the glass plate holding | maintenance parts 3 and 33 only to the single side | surface of the glass plate 2. FIG.

  The etching solution 5 need only be a liquid having a property of dissolving glass, and its composition is not limited. In 1st and 2nd embodiment, although the glass plate 2 is immersed in the etching liquid 5 for an etching, it is not limited to this. For example, you may expose the glass plate 2 which attached the glass plate holding | maintenance part in the vapor | steam of the etching liquid 5. FIG.

  In 1st and 2nd embodiment, although the glass plate 2 accommodated in the cassette part 16 of the support part 7 in an etching liquid tank is vertically arranged in the etching liquid tank 6, it is not limited to this. The glass plate 2 housed in the cassette unit 16 may be submerged in the etching solution tank 6 by changing the orientation of the cassette unit 16 so that the glass plate 2 is horizontally disposed in the etching solution tank 6.

DESCRIPTION OF SYMBOLS 1,30 Glass plate cutting device 2 Glass plate 2a Glass plate surface 3,33 Glass plate holding | maintenance part 5 Etching liquid 6 Etching liquid tank 7 Support part in etching liquid tank 9 Line to cut 10 Masking layer

Claims (11)

In order to prevent the glass plate from falling or colliding due to cutting, a glass plate holding portion for attaching the glass plate holding portion for holding the glass plate to the glass plate, and
A cutting step of cutting the glass plate to which the glass plate holding portion is attached by the glass plate holding portion attaching step by etching using an etchant. Before the glass plate holding part mounting step, further comprising a masking layer lamination step of laminating a masking layer for the etching solution on the surface of the glass plate,
2. The glass plate cutting according to claim 1, wherein in the cutting step, the glass plate to which the glass plate holding portion is attached is immersed in the etching solution, and the glass plate is cut in the etching solution. Method.   3. The glass according to claim 1, further comprising a pre-etching step of etching a surface of a portion of the glass plate that is desired to be cut to the extent that the glass plate is not cut before the glass plate holding portion mounting step. Board cutting method.   The glass plate cutting method according to any one of claims 1 to 3, wherein the glass plate is etched from both sides in the cutting step.   5. In the cutting step, the cut surface of the glass plate is mirror-finished by selecting the composition of the etching solution according to the thickness and material of the glass plate. The glass plate cutting method according to claim 1.   The said cutting | disconnection step includes the deposit | attachment removal step which removes the chemical reaction material which arises by reaction of the said etching liquid and the said glass plate, and adhered to the said glass plate in the middle of the said etching. The glass plate cutting method according to any one of the preceding claims.   The cutting step includes adjusting a shape of a cut cross section of the glass plate by changing a time for which a portion of the glass plate to be cut is brought into contact with the etching solution. The glass plate cutting method according to claim 1. A glass plate product manufacturing method for manufacturing a glass plate product cut into a predetermined size,
In order to prevent the glass plate from falling or colliding due to cutting, a glass plate holding portion for attaching the glass plate holding portion for holding the glass plate to the glass plate, and
Cutting the glass plate to which the glass plate holding part is attached by the glass plate holding part attaching step by etching using an etchant to obtain a glass plate product cut to a predetermined size; A method for producing a glass plate product. Before the glass plate holding part mounting step, including a masking layer lamination step of laminating a masking layer for the etching solution on the surface of the glass plate,
The glass plate product according to claim 8, wherein, in the cutting step, the glass plate attached to the glass plate holding part is immersed in the etching solution, and the glass plate is cut in the etching solution. Manufacturing method. In order to prevent the glass plate from dropping or colliding due to cutting, a glass plate holding part for holding the glass plate,
In order to cut | disconnect the said glass plate by an etching, the glass plate cutting device provided with the etching liquid tank which put the etching liquid.   The glass plate cutting device according to claim 10, further comprising an etching solution tank support portion that supports at least one of the glass plates to which the glass plate holding portion is attached in the etching solution tank.

Images