JP2013234275A - Heat-dissipating resin composition, molding and illuminating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat-dissipating resin composition capable of giving a molding fully excellent in heat-dissipating ability and heat diffusivity; a molding using the heat-dissipating resin composition; and an illuminating device using the molding.SOLUTION: A heat-dissipating resin composition including a thermoplastic resin material, a spherical filler and a flat filler comprising boron nitride is prepared. The spherical filler contained in the heat-dissipating resin composition has an average particle diameter (Rs) of 10-60 μm, the flat filler has an average particle diameter (Rf) of 5-40 μm and oblateness of the flat filler is 2-30%.

Description

  The present invention relates to a heat radiating resin composition, a molded body using the same, and a lighting device.

  When an electric / electronic device is used, heat is often generated from components constituting the electric / electronic device. For example, when the electrical / electronic device is a lighting device, light is generated and heat is generated in the light source portion of the lighting device. As is clear from the example of incandescent bulbs for electrical and electronic equipment, the power used to perform functions such as light emission is a part of the total power consumption, and the majority of the total power consumption. Is often wasted as heat, so reduction of power loss is eagerly desired. For this reason, for example, an LED lighting device that uses an LED (Light Emitting Diode) element as a light source has been proposed as a lighting device that improves power saving by suppressing power loss as much as possible.

  Examples of LED lighting devices include LED fluorescent lamps and LED bulbs, and these are expected to reduce power loss that is a problem with mercury fluorescent lamps and incandescent bulbs. The LED lighting device has a structure in which an LED mounting substrate on which an LED element is mounted on a substrate and a power supply module are attached to a holding unit. Here, the power supply module includes a circuit board on which various electric and electronic components are arranged to form a predetermined electric circuit. The electric circuit of the circuit board electrically connects the power supply module to the LED element. In this state, power is appropriately supplied from the external power source to the LED element.

  In addition, the holding part is usually composed of a holding material formed in a predetermined shape and a base for attaching to a socket of an external power source, and the holding material has a space in which the power supply module can be stored, The power supply module is accommodated in a space in the holding material that constitutes the holding portion. The LED mounting board is attached to an appropriate position of the holding material. The LED mounting board has the LED element mounted so that the light emitting surface of the LED element is positioned on one side of the board. The surface on which the light emitting surface of the LED element is arranged is the front side, and the opposite side is the back side. And attached to the holding part.

  For example, when the LED lighting device is an LED bulb, the holding unit includes a cylindrical holding material having both ends opened and a base, and the base is attached so as to close one side opening of the holding material. And a power supply module is accommodated in the space in the holding material which comprises a holding | maintenance part, and an LED mounting board is attached so that the other side opening of a holding material may be blocked.

  In the LED lighting device, the amount of heat generated from the light emitting surface of the LED element is small, and the LED lighting device saves power when comparing the LED lighting device with an incandescent light bulb based on the amount of heat generated on the light emitting surface side. It has excellent properties. However, the amount of heat generated from the back surface side of the LED mounting substrate, which is the side opposite to the light emitting surface side, is much larger than the amount of heat generated on the light emitting surface side. For this reason, when the LED lighting device is used, heat is still emitted from the power supply module and the LED element as described above, and the heat is likely to be trapped in the LED lighting device. Then, there exists a possibility that the temperature inside a LED lighting apparatus may rise excessively, and there exists a possibility that durability of the electrical / electronic components and LED element which comprise a power supply module may fall with heat.

  For this reason, in order to maintain the advantage of the power saving property of the LED lighting device for a long time, it is important that heat is released to the outside as quickly as possible so as not to stay in the LED lighting device. Therefore, a metal material such as aluminum is used as a material for a member constituting the holding unit of the LED lighting device and / or a material for forming the substrate. Among various types of materials, metal materials are considered excellent in terms of heat dissipation and high thermal conductivity. Therefore, in the LED lighting device, the heat generated from the LED element is quickly transmitted to the substrate and the holding part and released to the outside, and the heat generated from the power supply module is mainly promptly sent to the holding part. It is transmitted and released to the outside.

  By the way, in the LED lighting device, since the shape of the power supply module and the LED mounting substrate varies depending on the standard of the LED lighting device, the holding material is formed in various shapes accordingly, and the LED mounting substrate and the base are formed. It is necessary to be configured to realize stable mounting of the power supply and stable storage of the power supply module. Also for the substrate, it is necessary to stably mount various types of LED elements. For that purpose, it is very important that the holding material and / or the substrate is easily molded and processed. In addition, the stable attachment of the LED element and the stable storage of the power supply module as described above are performed at a position where the heat generated from the LED element and the power supply module can be efficiently transmitted to the substrate and the holding material. This is also important for stably arranging the elements and power supply modules.

  Therefore, in the case where the holding material and / or the substrate is formed of a metal material, a die-cast molding method is usually used as a method for molding the metal material. And the state of a molded body simply formed by metal casting a metal material is not sufficient for the holding material or the substrate to be used in the process of mounting the LED element or the process of housing the power supply module. Therefore, it is necessary to ensure the insulating property of the molded body, and it is necessary to perform post-processing such as providing an insulating layer on the molded body. Moreover, the die-cast molding method is not suitable for long-term mass production of molded articles because the molding mold is easily damaged or deteriorated. Therefore, when the holding material and / or the substrate is formed of a metal material, it is difficult to easily form and process the holding material and the substrate.

  From the viewpoint of improving the moldability and processability of the holding material and / or the substrate, it is preferable that the holding material and the substrate are made of a resin composition rather than a metal material. For example, a molded body formed into a holding material shape using a resin material is preferable because it is excellent in insulation and can be used as it is as a holding material. In addition, the molding method using a resin material is superior to the die-cast molding method in that damage and deterioration of the molding die are suppressed. However, on the other hand, when the holding material and the substrate are made of a resin composition, there is a serious problem that the LED lighting device cannot secure sufficient heat dissipation in the first place. In the LED lighting device, the holding material and / or the substrate is usually required to have a thermal conductivity of about 1 W / (m · K) or more. On the other hand, the resin composition often has a thermal conductivity of about 0.1 W / (m · K). Therefore, even if the holding material and / or the substrate is molded with such a resin composition, the holding material and / or the substrate cannot be provided with sufficient heat conductivity and heat dissipation. Performance cannot be secured.

  Therefore, Patent Documents 1 and 2 describe preparing a heat-dissipating resin composition containing a specific filler. And in patent document 2, using the molded object using this heat-radiating resin composition as a member used for an LED lighting apparatus is proposed. Since the molded object obtained at this time contains a specific filler, compared with the molded object to which such a filler is not added, it is the thing improved in the point of heat dissipation and heat conductivity. Moreover, since a molded body is obtained using the heat-dissipating resin composition and the holding material and / or the substrate is prepared, the processing / molding process is easier than when the holding material and / or the substrate is prepared using the metal material. Thus, it is possible to obtain a holding material and / or a substrate having good heat dissipation and thermal conductivity.

JP-A-3-79663 JP 2010-1000068 A2

  However, the heat dissipation and thermal conductivity required for various members such as holding materials and substrates used in LED lighting devices have various characteristics depending on the state of each member such as the shape and thickness of the member. Requested. For example, for the holding material, the heat transferred from the LED mounting substrate and the power supply module does not stay in the contact portion between the LED mounting substrate and the holding material or the contact portion between the power supply module and the holding material, and leaves the contact portion. It is required to be quickly transmitted in the direction, and to be configured so that the diffused heat is allowed to escape to the outside instead of staying inside the holding material. As for the substrate, it is required that heat is not rapidly accumulated in the contact portion with the LED element but is quickly transmitted in a direction away from the contact portion. In other words, it is important to quickly transfer the heat away from the heat source so that the heat received by the holding material or the substrate at the contact portion with the heat source such as the LED element or the power supply module does not stay in that portion. .

  However, Patent Documents 1 and 2 do not specifically propose a technical idea that causes heat transferred locally to a member such as a holding material or a substrate to be sufficiently quickly transferred in a direction away from the heat source. With the techniques described therein, it is still difficult to prepare a holding material and / or a substrate having sufficient heat dissipation and thermal conductivity.

  In view of the above-mentioned problems, the present invention aims to provide a heat-dissipating resin composition that makes it possible to obtain a molded body that is sufficiently excellent in heat-dissipating properties and heat-diffusing properties. Another object of the present invention is to provide a molded body used and a lighting device using the moldability.

The present invention includes (1) a thermoplastic resin material, a spherical filler, and a flat filler made of boron nitride,
The average particle diameter (Rs) of the spherical filler is 10 μm or more and 60 μm or less,
The average particle diameter (Rf) of the flat filler is 5 μm or more and 40 μm or less,
The heat dissipation resin composition, wherein the flatness of the flat filler is 2% or more and 30% or less,
(2) When the total weight of the spherical filler and the flat filler is 100 parts by weight,
The heat-dissipating resin composition according to (1) above, wherein the amount of the flat filler is 3 parts by weight or more and 50 parts by weight or less,
(3) A molded article comprising the heat-dissipating resin composition according to (1) or (2), wherein a flat filler in contact with different spherical fillers is present,
(4) The molded body according to (3), wherein at least a part of the flat filler is oriented so that the directions of the flat surfaces are aligned with each other,
(5) An LED mounting board on which an LED element having a light emitting portion is mounted on a board, a power supply module electrically connected to the LED element, and a space that can hold the power supply module and that can be attached to the LED mounting board. A lighting device comprising a material,
The gist of the present invention is an illuminating device characterized in that the holding material and / or the substrate is formed from the molded body described in (3) or (4) above.

  The heat-dissipating resin composition of the present invention is (6) the heat-dissipating resin composition according to the above (1) or (2), wherein the average particle diameter of the flat filler is smaller than the average particle diameter of the spherical filler. May be. The molded body of the present invention may be (7) a molded body made of the heat-dissipating resin composition described in (6) above. Moreover, in the illuminating device of this invention, the holding material and / or the board | substrate may be comprised from the molded object as described in said (7).

  According to the present invention, it is possible to provide a heat-dissipating resin composition that makes it possible to obtain a molded article that is sufficiently excellent in heat dissipation and thermal diffusibility, and a molded article using the heat-dissipating resin composition, It becomes possible to obtain an illumination device using the moldability.

FIG. 1A is a schematic plan view for explaining a flat filler. FIG. 1B is a schematic side view for explaining the flat filler. FIG. 1C is a schematic diagram for explaining a spherical filler. It is a general | schematic partial cross-section schematic diagram about a part of 1 Example of the molded object using the heat-radiating resin composition of this invention. Drawing 3A is a mimetic diagram for explaining one of the manufacturing methods about one example of a fabrication object using a heat dissipation resin composition of the present invention. Drawing 3B is a mimetic diagram for explaining one of the manufacturing methods about one example of a fabrication object using a heat dissipation resin composition of the present invention. FIG. 4A is a schematic exploded perspective view of an embodiment of an LED lighting device. FIG. 4B is a schematic cross-sectional schematic diagram of one embodiment of an LED lighting device. FIG. 4C is a partial cross-sectional enlarged schematic view schematically showing a state where an area indicated by a part S in FIG. 4B is enlarged. It is a schematic explanatory drawing for demonstrating the heat conduction path | route about the heat which arose from the LED element and the power supply module in the LED lighting apparatus. It is a schematic diagram for demonstrating the structure of the test lighting apparatus of Example 2-1. It is a graph which shows the result of the heat dissipation confirmation test in Example 2-1 and Comparative Example 2-1. It is a graph which shows the result of the heat dissipation confirmation test in Example 2-2 and Comparative Example 2-2.

[About heat-dissipating resin composition]
The heat-radiating resin composition of the present invention comprises a thermoplastic resin material and a filler.

[Thermoplastic resin material]
The kind of the thermoplastic resin material is not particularly limited, and may be appropriately selected.

  For example, as the thermoplastic resin material, specifically, nylon materials such as 6-nylon, 6,6-nylon, 4,6-nylon, aromatic nylon (for example, 10T nylon), polybutylene terephthalate (PBT), Mention may be made of polyphenylene sulfite (PPS). The thermoplastic resin material may be composed of one kind or a plurality of kinds of combinations such as a combination of 6-nylon and 6,6-nylon. In terms of low melt viscosity, good mixing with the filler, and ease of coloring, the thermoplastic resin material is preferably a nylon material.

  However, a thermoplastic resin material whose melting point exceeds a predetermined temperature is selected. At this time, the predetermined temperature indicates a heat-resistant temperature required for the molded body according to the use of the molded body made of the heat-dissipating resin composition.

  As the thermoplastic resin material, any of an amorphous resin and a crystalline resin can be used, but a crystalline resin is preferable, and a resin having higher crystallinity is preferably used. In the present application, the high crystallinity of the resin means that the crystallinity (%) of the resin is 15% or more. The thermoplastic resin material preferably has a crystallinity of 20% or more. Further, regarding the degree of crystallinity, the thermoplastic resin material is more preferably 20% to 40%, and still more preferably 20% to 30%.

  When the thermoplastic resin material is a crystalline resin, the fluidity of the heat-dissipating resin composition is increased when the heat-dissipating resin composition is melt-plasticized as compared with the case where it is a crystalline resin. be able to. Also. When the degree of crystallinity of the thermoplastic resin material is 20% or more, an effect that the fluidity of the heat-dissipating resin composition when the heat-dissipating resin composition is melt-plasticized can be further improved. Further, when the degree of crystallinity of the thermoplastic resin material is 30% or less, it is possible to obtain a molded article made of the thermoplastic resin material with improved impact resistance.

  The crystallinity (%) of the resin is measured using a differential scanning calorimeter (DSC) as follows. Using DSC, the resin to be measured is melted and then cooled at a predetermined cooling rate, and the heat of fusion (J / g) is measured. This value is the measured heat of fusion. The crystallinity is calculated based on this value and the heat of fusion (complete crystal melting heat) (J / g) of the resin of the same kind as the resin to be measured and crystallized 100%. Specifically, the degree of crystallinity is calculated by (measured heat of fusion) / (complete crystal heat of fusion) × 100. At this time, literature values can be appropriately used for the complete crystal melting heat quantity. When measuring the heat of fusion using a differential scanning calorimeter, the cooling rate is 10 ° C./min.

[Filler]
A filler consists of a spherical filler and a flat filler.

(Spherical filler)
The spherical filler is not particularly limited as long as a material having a higher thermal conductivity than the thermoplastic resin material is selected, but a material made of a material having thermal conductivity such as a metal material is appropriately used. May be selected. Specifically, as a material for forming the spherical filler, alumina (Al ₂ O ₃ ), silicon dioxide (SiO ₂ ), aluminum nitride (AlN), magnesium oxide (MgO), or the like can be preferably used. Among these materials, alumina and water-resistant magnesium oxide are preferably selected in terms of easy preparation and excellent thermal conductivity. In addition, as a water-resistant process, the process etc. which bake magnesium oxide at the high temperature of 1800 degreeC or more and 2000 degrees C or less can be mentioned.

  The spherical filler has an average particle diameter (Rs) of 10 μm to 60 μm, preferably 15 μm to 60 μm, and more preferably 15 μm to 50 μm.

  When the average particle diameter of the spherical filler is 10 μm or more, it is possible to effectively suppress the possibility that the interfacial thermal resistance increases due to contact between the spherical fillers in the molded body of the heat-dissipating resin composition. The effect that it becomes possible to raise the thermal conductivity of a body efficiently is acquired. Moreover, the average particle diameter of a spherical filler is 60 micrometers or less, The effect that the possibility of the failure | damage of a molding machine at the time of preparing a molded object can be suppressed is acquired.

  The average particle size of the spherical filler is measured by the same measurement method as the method of measuring the average particle size of the flat filler described later.

  The spherical filler preferably has a sphericity of 30% or more, preferably 60% or more, and more preferably 70% or more. If the sphericity is 30% or more, the spherical filler exhibits more isotropic heat transfer. From the viewpoint of more surely realizing isotropic thermal conductivity, it is ideal that the spherical filler has a true spherical shape.

  The sphericity is a scale indicating how close the shape of the object is to a true sphere. The sphericity is measured as follows. A spherical filler (10 mg) is taken and placed on a glass plate to form a sample. This sample is magnified 500 times with an electron microscope to obtain an enlarged observation image. In the magnified observation image, 20 spherical fillers whose plane can be recognized are selected, and the maximum particle diameter of each spherical filler is measured. At this time, as shown in FIG. 1C, the maximum particle diameter of each spherical filler (indicated by reference numeral 3) is a value of the length (L1) recognized as the maximum of the length of the spherical filler based on the enlarged observation image. Identified. Furthermore, regarding the particle diameter of each spherical filler, the length (L2) in the direction orthogonal to the length direction recognized as the maximum is specified, and this is defined as the transverse particle diameter. Then, the average value (LA1) of the maximum particle diameters and the average value (LA2) of the lateral particle diameters of the spherical fillers specified for each of the 20 particles are calculated. Then, a ratio (LA2 / LA1) × 100 (%) of these calculated values is calculated, and the calculated value is defined as the sphericity (%) of the spherical filler. In the present application, a scanning electron microscope S-4700 manufactured by Hitachi, Ltd. may be used as the electron microscope.

(Flat filler)
The flat filler is made of boron nitride (BN). As this boron nitride, one having a flat crystal structure is used. Specifically, it is preferable to use boron nitride having a hexagonal crystal structure. As shown in FIGS. 1A and 1B, hexagonal boron nitride forming a flat filler has a substantially hexagonal appearance in plan view. In FIGS. 1A and 1B, reference numeral 1 denotes a flat filler. Hexagonal boron nitride has a heat transfer coefficient in the direction parallel to the thickness direction (the direction along the arrow Y direction in FIG. 1B) of approximately 1 W / (m · K) or more and 2 W / (m · K). The heat transfer coefficient in the following range and in the direction parallel to the flat surface (for example, the arrow X direction in FIG. 1B) is a range of approximately 100 W / (m · K) to 110 W / (m · K). Therefore, any of these thermal conductivities are considered to be higher than the general thermal conductivity (0.1 W / (m · K)) of the thermoplastic resin material. Further, in boron nitride having a hexagonal crystal structure, the heat transfer coefficient in the direction parallel to the flat surface is much higher than the heat transfer coefficient in the direction parallel to the thickness direction. Therefore, the flat filler has a function existing in hexagonal boron nitride, that is, a direction parallel to the flat plane rather than a direction parallel to the thickness direction (direction along the arrow Y direction in FIG. 1Bb) ( For example, it has a function of transferring heat particularly quickly in the direction of arrow X in FIG. 1B.

  The average particle diameter (Rf) of the flat filler is preferably 5 μm or more and 40 μm or less, more preferably 10 μm or more and 40 μm or less, and further preferably 15 μm or more and 35 μm or less. Since the average particle diameter of the flat filler is 5 μm or more, there is an effect that it becomes easy to form a state in which the flat filler is in contact with different spherical fillers in a molded body made of a heat-dissipating resin plastic. Brought about. The effect that the average particle diameter of the flat filler is 40 μm or less, which effectively suppresses the possibility that the flat filler is crushed and made amorphous in the process of preparing a molded body made of a heat-dissipating resin plastic material. Is brought about.

  The flatness (%) of the flat filler is preferably 2% or more and 30% or less, more preferably 4% or more and 20% or less, and further preferably 6% or more and 15% or less. When the flatness of the flat filler is 2% or more, an effect that the possibility that the flat filler is crushed is suppressed is efficiently brought about. The effect that the flatness of the flat filler is 30% or less, so that a molded body made of a heat-dissipating resin plastic material can be efficiently prepared with high thermal conductivity in a specific direction. Is brought about efficiently.

  The flatness ratio (%) of the flat filler is defined by (thickness of flat filler) / (average particle diameter of flat filler) × 100.

  The average particle diameter (μm) and thickness (μm) of the flat filler are measured as follows. First, a flat filler (5 mg) is taken and placed on a glass plate to form a sample. This sample is magnified 500 times with an electron microscope to obtain an enlarged observation image. In the enlarged observation image, 20 of the flat fillers that can recognize the plane are selected, and the particle diameter of each flat filler is measured. At this time, the particle diameter of each flat filler is specified as a value of the length (length R in FIG. 1A) recognized as the maximum among the diagonal lengths of the hexagonal flat filler based on the enlarged observation image. The And the average value of the particle diameter of the flat filler specified about 20 each is calculated, and let the calculated value be the average particle diameter of the flat filler. In the present application, a scanning electron microscope JSM-7800F manufactured by JEOL Ltd. may be used as the electron microscope.

  As for the thickness of the flat filler, an enlarged observation image is used as in the case of specifying the average particle diameter of the flat filler. However, in the enlarged observation image, 20 of the flat fillers whose thickness can be recognized are selected, the thickness of each flat filler (thickness T in FIG. 1B) is measured, and the average value is calculated. . The value is taken as the thickness of the flat filler.

  The flat filler is preferably composed only of boron nitride having a hexagonal crystal structure, but may contain boron nitride other than those having a hexagonal crystal structure. The flat filler preferably has a weight ratio (purity) occupied by boron nitride having a hexagonal crystal structure of 80 wt% or more, more preferably 90% or more, and purity of 99 wt% or more. Further preferred. Examples of boron nitride other than boron nitride having a hexagonal crystal structure include a flat and amorphous one.

[Other fillers]
In addition to the spherical filler and the flat filler, the filler may further contain other fillers as long as the gist of the present invention is not lost. Examples of the other filler include boron nitride having a non-flat shape and a crystal structure other than a hexagonal crystal structure. Regarding boron nitride, examples of the crystal structure other than the hexagonal structure include a cubic structure (cubic, (cubic) c-BN). An example of boron nitride having a cubic structure is pyrotic BN. When the filler contains other fillers in addition to the spherical filler and the flat filler, the other filler is preferably 10 parts by weight or more and 40 parts by weight or less when the total weight of the filler is 100 parts by weight. More preferably, it is 12 parts by weight or more and 35 parts by weight or less. When the amount of other fillers exceeds 40 parts by weight, there is a possibility that the effect of improving the thermal conductivity due to the flat filler is reduced. When the amount of other fillers is less than 10 parts by weight, the function of the other fillers may not be exhibited.

[Other additives]
In addition to the thermoplastic resin material and the filler, the heat dissipating resin composition may contain other additives as long as the gist of the present invention is not lost. Specific examples of other additives include antioxidants, ultraviolet absorbers, silane coupling agents, and anti-drip agents. This does not prohibit the addition of a filler having a predetermined function corresponding to the functions of the additives listed above to the heat-dissipating resin composition. For example, the heat-dissipating resin composition may contain titanium oxide, talc and the like as fillers having a function as a colorant, and magnesium hydroxide and aluminum hydroxide as fillers having a function as a flame retardant. Etc. may be included.

[Preparation of heat-radiating resin composition and blending ratio of each component]
The heat dissipating resin composition is prepared by mixing a thermoplastic resin material constituting the component and a filler. The mixing method is not particularly limited.

  The blending ratio of the thermoplastic resin material and the filler is preferably 10 parts by weight or more and 65 parts by weight or less when the total weight of the thermoplastic resin material and the filler is 100 parts by weight. More preferably, the plastic resin material is 13 parts by weight or more and 60 parts by weight or less, and more preferably, the thermoplastic resin material is 15 parts by weight or more and 60 parts by weight or less. When the blending amount of the thermoplastic resin material is 65 parts by weight or less, it is possible to efficiently prepare a molded body made of a heat-dissipating resin plastic material that ensures high thermal conductivity in a specific direction. When the blending amount of the thermoplastic resin material is 10 parts by weight or more, it is possible to obtain a molded article made of a heat-dissipating resin plastic that has ensured strength. Brought stronger.

  In the heat-dissipating resin composition, if both the spherical filler and the flat filler are present, the mixing ratio of the spherical filler and the flat filler is not particularly limited, but the spherical filler When the total weight of the filler and the flat filler is 100 parts by weight, the amount of the flat filler is preferably 2 parts by weight or more and 50 parts by weight or less, and preferably 4 parts by weight or more and 45 parts by weight or less. Is more preferably 5 parts by weight or more and 40 parts by weight or less.

  When the blending amount of the flat filler is 2 parts by weight or more, an effect that the molded body described later can be excellent in heat transfer in a direction away from the heat source, and a heat-dissipating resin composition This brings about an effect that the fluidity of the heat-dissipating resin composition when melted and plasticized can be made excellent in lubricity. When the blending amount of the flat filler is 50 parts by weight or less, the blending amount of the spherical filler is 50 parts by weight or more, and the molded product can be excellent in heat dissipation. And the effect that it can keep so that the lubricity of the heat dissipation resin composition at the time of melt-plasticizing the heat dissipation resin composition may not become excessive is brought about.

  The heat-dissipating resin composition is not limited to the ratio of the average particle diameter of the spherical filler and the flat filler, but the average particle diameter of the flat filler is preferably smaller than the average particle diameter of the spherical filler. The ratio of the average particle diameter of the flat filler to the average particle diameter of the spherical filler (Rf / Rs) is preferably from 0.1 to 0.9, preferably from 0.15 to 0.85. More preferably, it is 0.2 or more and 0.8 or less. When Rf / Rs is 0.2 or more, a structure in which flat fillers are brought into contact with different spherical fillers in a molded body made of a heat-dissipating resin plastic material, and the spherical fillers are bridged with the flat fillers. The effect of being able to be obtained more reliably is brought about more strongly, and if it is 0.9 or less, the effect of being able to more reliably obtain a product with improved heat dissipation as a molded body made of a heat-dissipating resin plastic material Is brought stronger.

[Molded body made of heat-dissipating resin composition]
Next, the molded object which consists of a heat-radiating resin composition is demonstrated. In FIG. 2, the general | schematic partial cross-section schematic diagram which shows typically the one part cross section about 1 Example of the molded object 2 is shown.

[Configuration of Molded Body 2]
The molded body 2 is formed by molding a heat-dissipating resin composition into an appropriately defined shape, and has a structure including a flat filler 1 and a spherical filler 3 in a thermoplastic resin material 4. Yes.

  The shape of the molded body 2 is not particularly limited. For example, the molded body 2 may be formed in a sheet shape or may be formed with specific irregularities.

  As shown in FIG. 2, the thickness of the molded body 2 is not particularly limited, but the thickness (W in the example of FIG. 2) is preferably 0.3 mm or more and 30 mm or less. More preferably, the thickness is from 5 mm to 25 mm, and further preferably from 0.75 mm to 20 mm. And when the molded object 2 is formed so that a sheet | seat may be made, it is preferable that the thickness is 0.3 mm or more and 15 mm or less. When the thickness of the molded body 2 is 0.3 mm or more, even if heat is locally applied to the molded body 2, heat can be diffused over a wide range within the molded body 2. When the thickness of the molded body 2 is 30 mm or less, it becomes possible to easily form a configuration in which the directions of the flat surfaces of the flat fillers 1 described later are aligned. Specifically, when the molded body 2 is formed so as to form a sheet, the thickness of the sheet becomes a thickness, and if the molded body 2 is formed in a rod shape, the diameter becomes the thickness, If the molded body 2 is formed in a cylindrical shape, the distance between the inner peripheral surface and the outer peripheral surface becomes the thickness, and if the molded body 2 is formed in a donut shape in plan view, the longitudinal section of the molded body 2 is obtained. The thickness of the surface is the thickness of the wall.

[Arrangement of flat filler 1 and spherical filler 3]
As shown in FIG. 2, the molded body 2 is configured to form a structure (bridge structure) in which flat fillers 1 (1a) that are in contact with a plurality of different spherical fillers 3 (3a, 3b) are present. It is preferred that Since the molded body 2 is configured to have a bridge structure in this way, it is not necessary to place the thermoplastic resin material 4 in a portion where the spherical filler 3 and the flat filler 1 are in contact with each other. In addition, heat transfer between the spherical filler 3 and the flat filler 1 can be realized. The thermal conductivity of fillers such as the spherical filler 3 and the flat filler 1 is usually larger than the thermal conductivity of the thermoplastic resin material 4. For this reason, this molded object 2 becomes the thing excellent in the heat transferability, and becomes excellent in heat dissipation. Further, as described above, the flat filler 1 has a function of quickly transferring heat in a direction parallel to the flat surface. Then, since the flat filler 1 that is in contact with the different spherical filler 3 exists, the heat transferred to one spherical filler 3 is quickly transferred to the flat filler 1 and further flat. Heat is transferred to the other spherical filler 3 in contact with the flat filler 1 more rapidly along the flat surface of the filler 1. For this reason, this molded object 2 becomes the thing which was further excellent in the heat transfer property rather than the thing which does not contain the flat filler 1. At this time, since the spherical filler 3 has isotropic thermal conductivity as compared with the flat filler 1, the spherical filler 3 and the flat filler 3 are flattened depending on which position the flat filler 1 is in contact with the spherical filler 3. The possibility that the thermal conductivity of the filler 1 is greatly reduced is suppressed.

  In addition, in the molded object 2, as shown in FIG. 2, the structure which made flat fillers 1 (1b, 1c) contact and spherical fillers 3 (3c, 3d) may exist.

[Network structure of flat filler 1 and spherical filler 3]
As shown in FIG. 2, the molded body 2 preferably has a network structure in which flat fillers that are in contact with a plurality of different spherical fillers are continuously formed. In the example of FIG. 2, for example, a structure is formed in which fillers are in continuous contact such as spherical filler 3a, flat filler 1a, spherical filler 3b, flat filler 1b,. . The network structure may be formed on at least a part of the molded body 2, but is more preferably formed on the entire molded body 2. By forming such a network structure, heat can be efficiently transferred from one filler to another filler in contact therewith, and the thermal conductivity of the molded body 2 can be further enhanced. It becomes possible.

[Orientation of individual flat filler 1]
The molded body 2 is flat so that at least a part of the flat filler 1, preferably all of the flat filler 1, one flat surface of the flat filler 1 faces the air interface 5 of the molded body 2. It is preferable that the filler 1 is oriented. In this case, heat can be more quickly transferred along the air interface 5 of the molded body 2 in the direction away from the heat source in the molded body 2. At this time, it is preferable that the direction of one flat surface of the flat filler 1 is directed to the air interface 5 of the molded body 2 located closest to the flat filler. In the example of FIG. 2, for example, the flat filler 1 d has one flat surface oriented in the direction of the air interface 5 a of the molded body 2, and the flat filler 1 e has one flat flat direction. Is directed in the direction of the air interface 5b of the molded body 2. In this case, even when heat is transmitted near the surface of the molded body 2, the heat can be transmitted along the surface of the molded body 2 in a direction further away from the heat source in the molded body 2.

[Orientation of adjacent flat fillers 1]
As shown in FIG. 2, in the molded body 2, the flat filler 1 is oriented so that the flat plane directions of the flat filler 1 are aligned with each other and are adjacent to each other in the flat plane direction for at least a part of the flat filler 1. Is preferably provided. At this time, it is preferable that a flat filler adjoins via a spherical filler. Here, a combination of a plurality of flat fillers that are aligned with the flat plane orientation aligned when the flat plane directions of the adjacent flat fillers 1 are sequentially viewed are defined as an oriented filler group. And In addition, when the directions of the flat surfaces of the flat filler are aligned with each other, the flat surfaces of the two flat fillers constituting the oriented filler group are aligned with each other, and the two flat fillers constituting the oriented filler group When the flat surfaces of the flat fillers are arranged in the thickness direction of the flat filler while the flat surfaces of the flat fillers are oriented in the same direction. For example, in the example of FIG. 2, the flat filler 1a and the flat filler 1b are aligned in the flat plane direction and are adjacent to each other via the spherical filler 3b in the flat plane direction. Therefore, the flat filler 1a and the flat filler 1b constitute an oriented filler group.

  More preferably, in the molded body 2, the flat filler 1 is oriented to form a blended filler group so that the flat plane directions of 30% or more of the flat filler 1 are aligned with each other. And it is still more preferable that the molded body 2 forms the orientation filler group by orienting the flat filler 1 so that the directions of the flat surfaces of the entire flat filler 1 are aligned with each other.

  In the orientation filler group, the orientation of the flat surfaces of the flat fillers 1 constituting the same is that the angle difference between the normal vectors of the flat surfaces of the two flat fillers 1 is 30 degrees or less. It is shown that. This angular difference is preferably 20 degrees or less, and ideally 0 (zero) degrees. That is, it is ideal that the flat surfaces of the flat filler 1 are parallel to each other.

  Thus, according to the molded body in which the flat filler is oriented to form the oriented filler group, when the heat source is in contact with a part of the molded body and heat is locally applied, the heat is When reaching the oriented flat filler, it is possible to quickly transfer heat away from the heat source along the direction of the flat surface of the flat filler. In addition, since the flat fillers constituting the oriented filler group are aligned in the flat plane direction, the heat transfer direction is controlled to be a specific direction.

  The degree of orientation of the flat filler 1 in the molded body 2 can be specified as follows. First, a compact material having a predetermined size is prepared. For example, a sheet-like material having a thickness of 2 mm is prepared as the molded body 2, and this is cut into a width of about 3 mm and a length of about 5 mm to obtain a molded body sample. Such a molded body sample is placed on the sample table, and is fixed to the sample table with a double-sided tape, an epoxy resin, or the like. After fixing, the compact sample is first polished with coarse diamond abrasive grains in the longitudinal cross-section direction, and when the cross section of the compact specimen is exposed, the cross section of the compact sample is formed with diamond abrasive grains having a particle diameter of 1 μm or less. The orientation state of the flat filler was observed by smoothing and observing the cross section. This cross-sectional observation is realized by enlarging the cross-section 500 times with an electron microscope to obtain an enlarged observation image. In the magnified observation image, 20 of the flat fillers that can recognize the flat cross section are selected, and the orientation azimuth angle of each flat filler is measured. The orientation azimuth angle indicates the azimuth angle of the normal vector of the flat surface of the flat filler with respect to the direction along the thickness direction of the compact sample. And the average value of the orientation azimuth angle of the flat filler specified about 20 each is calculated. Further, out of the 20 selected flat fillers, the flat filler closest to the average value is extracted as a reference filler, and the deviation from the value is determined based on the orientation azimuth angle value of the reference filler. The number of flat fillers satisfying the condition that the angle is 30 degrees or less is counted from among the 19 flat fillers obtained by removing the reference filler from the selected 20 flat fillers. When 5 or more of 19 satisfy the above conditions, it is evaluated that the flat surfaces of 30% or more of the flat filler are aligned with each other, that is, the flat filler is oriented in a predetermined direction. To do. In the present application, a scanning electron microscope S-4700 manufactured by Hitachi, Ltd. may be used as the electron microscope.

  Moreover, the spherical filler 3 is contained also in the molded object 2 which forms the orientation filler group. Since the spherical filler 3 has isotropic thermal conductivity as compared with the flat filler 1, the heat transferred away from the heat source along the flat plane direction of the flat filler 1 constituting the oriented filler group. Is transmitted in a direction different from the direction of the flat surface. For this reason, according to the molded body 2 that forms the oriented filler group, heat is transmitted to a position some distance away from the heat source, so that the heat can be efficiently emitted to the outside. Become. In this way, the molded body 2 is capable of transferring heat to a wider range within the inside thereof, becomes more excellent in heat diffusibility, and efficiently releases heat to the outside, thereby dissipating heat. Will be better.

[Preparation of molded body 2]
The molded body 2 made of the heat-dissipating resin composition can be adjusted by, for example, an injection molding method or an extrusion molding method as shown below.

(Injection molding method)
The injection molding method is realized using an injection molding apparatus 10 as shown in FIG. 3A, for example.

  The injection molding apparatus 10 includes a mold clamping unit including an injection unit 11 that melt-plasticizes a resin composition and injects a melt-plasticized product of the resin composition, and a mold 14 that has a pair of a male mold 12 and a female mold 13. 15.

  The injection unit 11 has a hopper 16 serving as a charging port for charging a resin composition exhibiting thermoplasticity, and a heating device 18 for heating and melting the resin composition while having a space 17 for receiving the resin composition charged from the hopper 16. , A rotatable screw 21 in which a spiral groove 20 provided in the cylinder 19 is formed, and a screw drive device 22 that rotationally drives the screw 21. In the injection unit 11, the screw 21 is arranged with the tip facing the back side of the space 17 in the cylinder 19, and the space that forms the resin reservoir 23 in the tip of the screw 21 in the cylinder 19. Further, a nozzle 24 for discharging the resin accumulated in the resin reservoir 23 is provided in the back of the cylinder 19. Further, the screw drive device 22 is configured not only to rotate the screw 21 but also to be able to advance and retract, that is, a function to move the screw 21 to the back side in the cylinder 19 and a function to move it appropriately to the opposite side. It is prepared for.

  The mold clamping unit 15 includes a mold 14 having a pair of male mold 12 and female mold 13, a die plate 25 to which the mold 14 is attached, and a male mold 12 and a female mold 13 by pressure applied to the mold 14 during injection molding. And a mold clamping mechanism 26 for maintaining the mold clamping state. The mold 14 is appropriately designed according to the shape of the molded body to be obtained.

  Using such an injection molding apparatus 10, the molded body 2 is prepared as an injection molded body as follows.

  The heat radiating resin composition 27 is put into the hopper 16 of the injection unit 11. When the heat-dissipating resin composition 27 is charged, it is sent from the hopper 16 to the space 17 in the cylinder 19. In the injection part 11, the screw 21 is disposed with its tip directed toward the space 17 in the cylinder 19, and the screw 21 rotates in the cylinder 19 and advances toward the back of the internal space of the cylinder 19 to dissipate heat. The resin composition 27 enters the space of the spiral groove 20 of the screw 21 and moves toward the tip side of the screw 21 as the screw 21 rotates. At this time, the heat radiating resin composition 27 moves toward the inner space of the cylinder 19. Since the inside of the cylinder 19 is heated by the heating device 18, the heat radiating resin composition 27 is melt-plasticized while moving in the cylinder 19 toward the tip of the screw 21. The heat-dissipating heat-dissipating resin composition 27 is fed into the resin reservoir 23 formed at the tip of the tip of the screw 21 in the cylinder 19 and temporarily stored there. When a predetermined amount of the heat-dissipating resin composition 27 accumulates in the resin reservoir space 23, the screw driving device 22 advances the screw 21 toward the back of the cylinder 19. At this time, the melt-plasticized heat-dissipating resin composition 27 stored in the resin reservoir 23 is injected from the nozzle 24. The tip of the nozzle 24 is directed to the sprue 28 formed in the mold clamping portion 15, and the heat-dissipating heat-dissipating resin composition 27 flows into the cavity 29 of the mold 14 through the sprue 28. The heat-dissipating resin composition 27 poured into the cavity 29 of the mold 14 is cooled and solidified. Thereafter, the mold 14 is opened and the molded product is taken out. In this way, a molded product formed into a predetermined shape is prepared.

(Extrusion molding method)
The extrusion molding method is realized by using an extrusion molding apparatus 30 as shown in FIG. 3B, for example.

  The extrusion molding apparatus 30 has a hopper 31 serving as a charging port for charging a resin composition exhibiting thermoplasticity, and a space 32 for receiving the resin composition charged from the hopper 31, and heating and melting the resin composition. A cylinder 34 provided with a device 33; a screw 36 provided in the cylinder 34 and formed so as to be rotatable by forming a spiral groove 35; a screw drive device 37 for rotating the screw 36; a cylinder; 34, and a die head 38 provided at the tip of 34.

  The die head 38 has an extrusion port 39 for extruding the resin composition melt-plasticized in the cylinder 34. The shape of the extrusion port 39 is not particularly limited. The die head 38 may be appropriately selected according to the shape of the molded body 2 to be obtained. For example, when the sheet-like molded body 2 is to be obtained, a T die may be selected as the die head 38.

  Further, a take-up device 40 for taking up the extruded molded body 2 may be installed at the tip of the extrusion port 39 of the die head 38. The take-up device 40 is not particularly limited, and for example, a conventionally known portable belt conveyor may be used.

  Using such an extrusion molding apparatus 30, the molded body 2 is adjusted as an extruded molded body as follows.

  First, the heat radiating resin composition 27 is put into the hopper 31. The heat radiating resin composition 27 is sent from the hopper 31 to the space 32 in the cylinder 34. In the cylinder 34, the screw 36 in which the spiral groove 35 is formed is rotated. At this time, the heat-dissipating resin composition 27 enters the spiral groove 35 of the screw 36 and moves toward the tip side of the screw 36 as the screw 36 rotates. At this time, the heat radiating resin composition 27 moves in the cylinder 34 toward the back. Since the inside of the cylinder 34 is heated by the heating device 33, the heat radiating resin composition 27 is melt-plasticized while moving in the cylinder 34 toward the tip of the screw 36. The heat-dissipating heat-dissipating resin composition 27 is fed from the tip of the screw 36 in the cylinder 34 to the die head 38 disposed ahead of the screw 36 and sequentially extruded from the extrusion port 39 of the die head 38. At this time, the heat dissipating resin composition 27 has a predetermined shape according to the shape of the extrusion port 39. The heat radiating resin composition 27 molded into a predetermined shape is solidified. In this way, the molded body 2 is prepared. When the take-out device 40 is installed at the tip of the extrusion port 39, the heat-radiating resin composition extruded from the extrusion port 39 is solidified in the middle while being conveyed in the predetermined direction by the take-up device 40. Become.

(Advantages of preparing molded body 2 using a heat-dissipating resin composition)
The method for preparing the molded body 2 made of the heat-dissipating resin composition is not limited to the above-mentioned method, and various molding methods such as a compression molding method can be adopted. This is particularly suitable when the molded body 2 is prepared by an extrusion method.

  In both the injection molding method and the extrusion molding method, as described above, the heat-dissipating resin composition charged into the cylinder from the hopper is transferred in a predetermined direction by the rotation of the screw and melt-plasticized. (Melt plasticizing step) is performed. In the conventional heat-dissipating resin composition, there has been a problem that in this melt plasticizing step, many filler corners collide with the screw, and the screw is worn or damaged while this is repeated. On the other hand, in the heat-dissipating resin composition of the present invention, a spherical filler is used as the filler, and the possibility that the screw corners the screw in the melt plasticizing process and damages is reduced. Furthermore, in the heat dissipating resin composition of the present application, since a flat filler is used as the filler, the fluidity of the heat dissipating resin composition is enhanced. That is, in the melt plasticizing step, the heat-dissipating resin composition melt-plasticized is transferred more smoothly in the groove of the screw. For this reason, it becomes difficult to produce disorder in the flow of the filler contained in the heat-radiating resin composition melt-plasticized, and the possibility that the wear and breakage of the screw will be reduced.

  In the injection molding method and the extrusion molding method, the molded body 2 has a structure in which the flat filler 1 is oriented so that the direction of one flat surface of the flat filler 1 faces the air surface 5 of the molded body 2. Is achieved. That is, the preparation of the molded body 2 by the injection molding method or the extrusion molding method using the heat dissipating resin composition of the present invention is suitable for efficiently forming the molded body 2 having better thermal conductivity. is there.

  In addition, the injection molding method is used to prepare a molded body 2 having a structure in which the flat filler 1 is oriented so that the orientation of one flat surface of the flat filler 1 faces the air surface 5 of the molded body 2. In order to achieve this, the injection speed of the heat radiating resin composition from the nozzle 24 of the injection section 11 is preferably 70 mm / sec or more and 150 mm / sec or less, and preferably 80 mm / sec or more and 140 mm / sec or less. More preferably, it is 90 mm / sec or more and 150 mm / sec or less. When such injection speed conditions are satisfied, the molded body is effectively prepared as one that forms a group of oriented fillers if it has a uniform thickness such as a sheet.

  Further, by using an extrusion molding method, a molded body 2 having a structure in which the flat filler 1 is oriented so that one flat plane direction of the flat filler 1 faces the air surface 5 of the molded body 2 is prepared. In order to do this, the gap (gap) of the extrusion port 39 is preferably 0.2 mm or more and 10 mm or less, more preferably 0.5 mm or more and 7 mm or less, and more preferably 0.75 mm or more and 3 mm or less. More preferably. In such a case, as in the case of the injection molding method, the molded body 2 can be effectively prepared to form the oriented filler group if it has a uniform thickness such as a sheet.

[Use of Molded Body 2 Using Heat Dissipating Resin Composition]
The molded body 2 made of a heat-dissipating resin composition can be used for various purposes, but it is used for various members used in electrical and electronic equipment in terms of taking advantage of its excellent heat dissipation and heat transfer properties. It is preferable.

  Next, as an example of the case where the electrical / electronic device is an LED lighting device, in particular, the case where the LED lighting device is an LED bulb, the case where the molded body 2 is used as a member used in the electronic / electric device, This will be specifically described. Furthermore, at this time, the case where the molded body 2 is used as a holding material in the LED lighting device will be described in detail.

[LED lighting device 50]
4A and 4B, the LED lighting device 50 includes an LED mounting substrate 53 in which the LED elements 51 are mounted on a substrate 52, and a power supply module 54 that is electrically connected to the LED elements 51, and a power source. A holding portion 58 having a space 55 capable of holding the module 54 and having a holding member 56 to which the LED mounting substrate 53 can be attached and a base 57 for attaching to an external socket is provided.

  In the LED lighting device 50, the LED light emitting surface 59 side of the substrate 52 is covered with a covering material 60. The covering material 60 only needs to transmit light to such an extent that light emitted from the LED element 51 is diffused to the outside. For example, a member formed of a transparent resin material such as polycarbonate resin is appropriately used. Good. In addition, the shape of the covering material 60 is not particularly limited, and in the example of FIG.

[LED mounting board 53]
(LED element 51)
The LED element 51 is not particularly limited, and a light-emitting diode having a light-emitting portion may be appropriately employed. Specifically, a semiconductor chip having a double hetero structure is preferably used. The double hetero structure is a structure in which an n-type cladding layer and a p-type cladding layer are formed with an active layer interposed therebetween. At this time, the active layer is preferably a layer made of AlGaAs, AlGaInP, GaP, GaN or the like.

(Substrate 52)
The substrate 52 on which the LED element 51 is mounted is not particularly limited, but a substrate formed by forming a circuit pattern on a substrate constituent material can be used. As the substrate constituent material, a material obtained by forming a metal material or a resin material into a predetermined shape may be used as appropriate. The circuit pattern may be formed by patterning a conductive material such as copper in a predetermined pattern on the substrate constituent material. The circuit pattern is appropriately formed in a predetermined pattern corresponding to the LED element arrangement pattern and the power supply module formation pattern. The patterning method of the circuit pattern is not particularly limited, and may be appropriately selected such as a photolithography method and a printing method.

[Power supply module 54]
The power supply module 54 is formed by forming an electric circuit that transmits power from the power supply to the LED element 51. More specifically, the power supply module 54 is a circuit board on which various electric and electronic components corresponding to the contents of the electric circuit are mounted. A structure having the structure can be used. At this time, examples of electrical and electronic parts include resistors and electrolytic capacitors.

[Holding part 58]
The holding portion 58 includes a holding material 56 and a base 57.

(Retaining material 56)
As shown in FIGS. 4A and 4B, the holding member 56 is formed in a cylindrical shape having both ends opened, and is narrowed at one end side. It is made into the support part 61 for supporting and fixing. The other end side of the holding member 56 has a larger opening than the one end side, but the size of the opening is such a size that it can be covered with the LED mounting board 53, and the other end side A substrate support surface 62 for attaching the LED mounting substrate 53 is formed on the end surface, and a flange 63 is erected along the outer periphery of the substrate support surface 62. However, the outer periphery of the substrate support surface 62 indicates a peripheral edge on the outer side in the cylinder radial direction of the holding material 56 among the edges of the substrate support surface 62. Further, a space 55 having a shape and a size capable of accommodating the power supply module 54 is formed inside the holding material 56.

  As the holding material 56, the molded body 2 made of the heat-dissipating resin composition described above is used.

  Note that the molded body 2 may be formed in a shape corresponding to the shape of the holding material 56 by appropriately employing a manufacturing method. For example, the molded body 2 can be formed by an injection molding method. When the injection molding method is employed, the male mold and the female mold may be designed so that the cavity is formed corresponding to the shape of the holding material 2 for the mold.

  As shown in FIG. 4C, the molded body 2 constituting the holding member 56 is preferably arranged so that the direction of one flat surface of the flat filler 1 is directed toward the air interface 5 of the molded body 2. At this time, it is more preferable that the flat filler 1 is oriented so as to be directed to one of the flat surfaces of the air interface 5. In this case, the flat filler 1 that is closer to the air interface 5a has one flat surface of the flat filler 1 facing the air interface 5a, and more preferably the surface direction of the flat surface and the air interface. The surface direction 5a is roughly aligned, and the flat filler 1 that is closer to the air interface 5b has one flat surface of the flat filler 1 facing the air interface 5b, more preferably a flat surface. The surface direction and the surface direction 5b of the air interface are roughly aligned. Also, the holding material 56 is preferably one that forms an oriented filler group or one that forms a network structure of the flat filler 1 and the spherical filler 3.

(Base 57)
The base 57 is formed in a predetermined shape corresponding to the shape of the socket that constitutes a contact point between the external power source and the LED lighting device 50. A terminal 64 for electrically connecting the electric circuit of the power supply module 54 and an external power supply is formed on the base 57. Such a base 57 is attached to the support portion 61 of the holding member 56 and closes one side opening of the holding member 56.

[Attachment of Power Supply Module 54 and LED Mounting Board 53 to Holding Unit 58]
In the LED lighting device 50, the power supply module 54 is attached by being accommodated in the space 55 in the holding member 56 of the holding portion 58, and the LED mounting board 53 is attached on the board support surface 62. In the example of FIGS. 4A and 4B, at this time, the LED mounting substrate 53 blocks the other side opening of the holding member 56 on the opposite side to the opening to which the base 57 can be attached.

  The LED mounting substrate 53 is mounted with the LED elements 51 so that the light emitting surface of the LED elements 51 is positioned on one side of the substrate 52. The LED mounting substrate 53 is mounted on the substrate support surface 62 with the light emitting surface of the LED element 51 arranged on the front side, and the surface of the LED element 51 on which the light emitting surface is arranged is It forms the surface of the LED mounting substrate 53 (LED light emitting surface 59). At this time, the LED mounting substrate 53 faces the substrate support surface 62 of the holding portion 58 on the surface opposite to the LED light emitting surface 59. A method for attaching the LED mounting substrate 53 on the substrate support surface 62 is not particularly limited. The LED mounting substrate 53 may be fixed on the substrate supporting surface 62 using a fixing member such as a screw, or an adhesive is applied between the LED mounting substrate 53 and the substrate supporting surface 62 so that the LED mounting substrate 53 It may be fixed on the substrate support surface 62. Then, the covering material 60 is attached on the surface of the LED mounting substrate 53.

[Connection of Electric Circuit in LED Lighting Device 50]
In the LED lighting device 50, the power supply module 54 is electrically connected to both the terminal 64 of the base 57 and the LED element 51. For example, in the example of FIG. 4, the power supply module 54 connects the wiring 65 extending from the circuit board to a predetermined position of the LED mounting board 53. A circuit pattern is formed on the LED mounting substrate 53 so that electricity is communicated to the LED element 51 from a predetermined position where the wiring 65 extending from the predetermined position of the circuit board of the power supply module 54 is connected. Further, the circuit board of the power supply module 54 is electrically connected to a terminal 64 provided on the base 57 through a wiring 66.

[Heat conduction and heat dissipation in LED lighting device 50]
When the LED lighting device 50 is used, as shown in FIG. 5, heat is generated using the LED element 51 as a heat source on the side opposite to the light emitting surface of the LED element 51, and heat generated using the power supply module 54 as a heat source. Arise. Heat indicated by the LED element 51 as a heat source is mainly transferred to the substrate support surface 62 through the substrate 52 and transmitted from the substrate support surface 62 to the holding member 56 as indicated by an arrow H1. The holding material 56 is composed of the molded body 2 made of a heat-dissipating resin composition, and the heat transferred to the holding material 56 promptly moves inside the holding material 56 from the substrate support surface 62 as indicated by an arrow Hp1. It is transmitted in the direction of leaving. Furthermore, since the molded body 2 forming the holding material 56 is excellent in heat transfer as well as heat transfer properties, the transferred heat is efficiently directed from the surface of the holding material 56 to the outside (in the direction of the arrow Hr1). To be released). Thus, heat generated from the LED element 51 is efficiently released to the outside of the LED lighting device 50.

  Heat generated by the power supply module 54 as a heat source is roughly classified into two types. One of them is heat transferred to the air around the power supply module 54 and away from the heat source from the inner wall surface of the holding member 56 in contact with the air (in the direction of the arrow H2), that is, heat transferred into the holding member 56. It is. In addition, the heat is transmitted in a direction (in the direction of arrow H <b> 3) from the inner wall surface portion of the holding member 56 that contacts the power supply module 54 toward the inside of the holding member 56. And since the molded object 2 which comprises the holding material 56 is what transmits heat | fever rapidly in the direction away from a heat source in the molded object 2, it was transmitted from the inner wall face of the transmission holding material 56 into the holding material 56. The heat is further transferred efficiently in the direction away from the heat source inside the holding material 56 (arrow Hp2, arrow Hp3 direction), and efficiently from the outer wall surface of the holding material 56 toward the outside (arrow Hr2, arrow Hr3). Emitted). Thus, the heat generated from the power supply module 54 is efficiently released to the outside of the LED lighting device 50.

  In this way, the LED lighting device 50 forms the holding material 56 with the molded body 2, thereby maintaining the function of releasing heat toward the outside of the holding material 56, while leaving the inside of the holding material 56 from the heat source. Heat can be quickly transferred. Therefore, the LED lighting device 50 can make the outer surface area of the holding material 56 over a wide area function as an area for releasing heat, and has excellent heat dissipation.

[Other examples]
In the example of the LED lighting device described above, the case where the molded body made of the heat radiating resin composition is used as a holding material in the LED lighting device is taken as an example, and furthermore, the case where the LED lighting device is an LED bulb is taken as an example. Although the lighting device has been described in detail, a molded body may be used as a substrate on which the LED elements are mounted. However, in that case, what formed the heat-radiating resin composition in the shape according to the board | substrate is used for a molded object. Thus, the LED illuminating device may use a molded body made of a heat dissipating resin composition for the holding material and / or the substrate.

[Use of compacts in other electrical and electronic equipment]
In addition, in the above, the case where the electrical / electronic device is an LED lighting device has been described in detail, but the electrical / electronic device that can use the molded body made of the heat-dissipating resin composition is not limited thereto, For example, a housing of an image display device such as a television can be used. In such an electric / electronic device, specifically, the molded body can be used as a substrate or the like for mounting a transistor. In that case, what is necessary is just to use what was formed in the shape each determined suitably according to the member applied.

[Heat-dissipating resin composition]
Examples 1-1 to 1-15
(Preparation of thermoplastic resin material and filler)
Nylon 6 (Ube Industries, UBE nylon (trademark), type 1010X1) and polyphenylene sulfide (PPS) (DIC Corporation, DIC-PPS (trademark), type FZ, which are nylon resins as thermoplastic resin materials -2100). In addition, spherical fillers and flat fillers were prepared as fillers. Spherical alumina (DAM-45 (trademark) manufactured by Denki Kagaku Kogyo Co., Ltd.) as a spherical filler, hexagonal boron nitride (BN) (Grade HS, manufactured by Dandong City Chemical Research Laboratory Co., Ltd.) as a flat filler. Was prepared. For the prepared filler, the thermal conductivity of spherical alumina is 30 W / (m · K), and the thermal conductivity of boron nitride is 3 W / (m · K) in the direction perpendicular to the flat surface, 100 W / (m · K) in the direction horizontal to the flat surface. The purity of the flat filler is 99%.

  In each of Examples 1-1 to 1-15, the spherical filler and the flat filler are the ones prepared above, and the average particle diameter (μm) of the spherical filler, the average particle diameter of the flat filler. Those having (μm) and flatness (%) as shown in Tables 1 and 2 were appropriately selected and used.

  In addition, the value of the average particle diameter of the spherical filler shown in Table 1, the average particle diameter of the flat filler, and the flattening ratio are values measured in accordance with the above-described average particle diameter measuring method and flattening ratio measuring method. It is. The same applies to Tables 2 to 4.

  The thermoplastic resin material and the filler prepared as described above are mixed so as to have a blending amount as shown in Tables 1 and 2, and the heat-dissipating resin composition is obtained for each of Examples 1-1 to 1-15. Prepared.

(Evaluation of formability)
Using the heat-dissipating resin composition, the moldability was evaluated as follows. The moldability was evaluated based on a resin fluidity confirmation test, a test molded body preparation test, and a test molded body thermal conductivity test. In the test molded body thermal conductivity test, the moldability is determined from the viewpoint of the possibility of preparing a thermally conductive molded body whether or not a preferable molded body having excellent thermal conductivity is formed using the heat-dissipating resin composition. Be evaluated. In particular, in the test molded body thermal conductivity test, by measuring the thermal conductivity of the test molded body and confirming the directivity of the heat conduction, the thermal conductivity in a specific direction based on the heat-radiating resin composition. An evaluation is made as to whether or not an excellent molded body can be obtained.

(Resin fluidity confirmation test)
The resin fluidity confirmation test was performed using a flow tester (manufactured by Shimadzu Corporation, Shimadzu flow tester (CFT-500D) (trademark)) under conditions based on JIS K 7210. More specifically, the resin fluidity confirmation test was performed by pouring a resin composition as a sample into the cylinder, pressurizing with a piston from one end of the cylinder, and extruding the resin composition from the other end. The piston of the flow tester had a circular inner surface and a cross-sectional area of 1 cm ² . In this test, the resin composition extrusion rate (cm ³ / s) per second between the piston lowering positions 3 mm and 7 mm is measured, and this value is taken as the flow rate (flow value). This value is a value indicating the quality of resin fluidity.

  The measurement results are as shown in Tables 1 and 2.

(Test molded body preparation test)
The test molded body preparation test is a test for preparing a test molded body (molded body A) using the heat radiating resin composition. In this test, it is determined whether or not a molded product A having a predetermined appearance can be obtained. Here, as the molded product A as the test molded product, a molded product formed into a cylindrical shape gradually narrowed so that the sectional diameter decreases from one end to the other end as shown in FIG. 5 is selected. It was done. An injection molding method was applied to the preparation of the test molded body. JSW J75EII manufactured by Nippon Steel Works was used for the injection molding apparatus. The injection molding method was carried out under an injection pressure of 193 MPa (1968 Kg / cm ² ), an injection speed of 80 mm / second, and a mold temperature of 100 ° C.

  When the test molded body preparation test was carried out, the judgment results of the presence or absence of abnormalities in the molding machine, stable progress of molding, and whether or not the molded body A with the expected appearance was obtained (observation of the test molded body) are summarized. And evaluated as follows.

(Observation of test compact)
About observation of a test molded object, it determined as follows based on the visual observation result of a test molded object.

Gray or black turbidity was not recognized in the test molded product, and a molded product having a predetermined shape was formed. ... ○ (Appearance of test molded product is good)
Gray or black turbidity is not recognized in the test molded product, or a molded product having a predetermined shape is not formed. ... × (Appearance of test molded product is poor)

  In addition, when gray or black turbidity is observed in the test molded product, it is determined that the molding machine is broken when the molded product is prepared, and the fine fragments are mixed in the test molded product, and heat dissipation The moldability of the conductive resin composition was evaluated as poor. When gray or black turbidity was not recognized in the test molded product, it was determined that such a fragment was not mixed in the test molded product. Further, if the fluidity of the heat-dissipating resin composition is appropriate, the heat-dissipating resin composition is completely filled in the mold set in the injection molding machine, and a molded product having a predetermined shape is formed. . That is, when a molded product having a predetermined shape is formed, the heat dissipating resin composition is suitable for forming a molded body, and it can be evaluated that the moldability is good.

(Evaluation of test molded body preparation test)
The observation result of the test molded body was ◯, there was no abnormality in the molding machine, and the molding proceeded stably.・ ・ ・ ・ ◎ (The test molded body is prepared very well including the manufacturing process)
The observation result of the test molded body was ◯. Regarding the molding machine, only one of either an abnormality of the molding machine or unstable molding progress was recognized to some extent.・ ・ ・ ・ ○ (Test molded body is prepared)
Although the observation result of the test molded body was ◯, an abnormality of the molding machine was recognized, and the molding did not proceed stably. ... Δ (The test molded body is prepared but not good.)
The observation result of the test molded body was x. ....... (preparation of test molded body is poor)

  The evaluation results are as shown in Tables 1 and 2.

(Test molded body thermal conductivity test)
An injection molding method was applied in the same manner as in the test molded body preparation test to form a molded body from the heat-dissipating resin composition to obtain a test molded body (molded body B). At this time, the injection molding conditions were the same as those in the test molded body preparation test. However, as the molded body B, instead of the cylindrical body in the test molded body preparation test, a rectangular plate-shaped molded body having a length of 8 cm, a width of 8 cm, and a thickness of 1.8 mm was selected.

  The following thermal conductivity measurement test was performed using the molded body B as a test molded body. The thermal conductivity measurement test is a test for measuring how much a molded article obtained using the heat-dissipating resin composition can be obtained with excellent thermal conductivity. In this test, measurements were made to confirm the directivity of thermal conductivity.

(Thermal conductivity of the molded product)
About the heat conductivity of the molded object B, it implemented by measuring heat conductivity (W / m * K) using the following xenon flash heat conductivity measuring method. In addition, as the thermal conductivity of the molded body B, the thermal conductivity in the thickness direction of the molded body B and the thermal conductivity in the surface direction of the molded body B were measured.

(Preparation of test piece)
A test piece used for measuring the thermal conductivity in the thickness direction of the molded body B and a test piece used for measuring the thermal conductivity in the surface direction were prepared. That is, the molded body B was cut out to prepare test pieces 1 and 2 as cut pieces of 10 mm long × 10 mm wide × 1.8 mm thick.

  The test piece 1 is a cut piece whose surface direction is a direction along the flow direction of the heat-dissipating resin composition that flows into the mold internal space during the injection molding of the molded body B. Here, the surface direction is The cut piece is the same as the direction along the surface direction of the molded body B, and the thickness direction is the same as the direction along the thickness direction of the molded body B.

  The test piece 2 is a cut piece whose surface direction is a direction orthogonal to the flow direction of the heat-dissipating resin composition flowing into the inner space of the mold during the injection molding of the molded body B. Here, the surface direction is defined as the molded body B. The cut piece is the same as the direction along the thickness direction, and the thickness direction is the direction along the surface direction of the molded body B. As for the test piece 2, a large number of cut pieces (10 mm × 10 mm × 1.8 mm) cut from the molded body B in the same manner as the test piece 1 are prepared (10 pieces), and the plurality of cut pieces are arranged in the thickness direction. Are stacked while being aligned with each other to form a laminated body (vertical 10 mm × width 10 mm × thickness 18 mm), and the laminated body is cut in a direction along the thickness direction of the cut piece to obtain a cut structure (vertical 1.8 mm). X width 10 mm x thickness 10 mm). Note that the length, width, and thickness of the cutout structure correspond to the thickness, width, and length of the test piece 2, respectively.

  The thickness direction of the molded body B approximately matches the thickness direction of the test piece 1, and the surface direction of the molded body B approximately matches the thickness direction of the test piece 2.

(Xenon flash thermal conductivity measurement method)
Using the test pieces 1 and 2 prepared above, the thermal conductivity in the thickness direction was measured. First, the thermal conductivity in the thickness direction of the test piece 1 was measured using a xenon flash thermal conductivity measuring device as follows. The xenon flash thermal conductivity measuring device is configured by arranging a xenon light source and a detection unit of an infrared detector facing each other with a gap therebetween. Used). This is because the test piece 1 is arranged at a position between the xenon light source and the detection unit so that the xenon light source and one side of the test piece 1 face each other, and the detection unit and the other side of the test piece 1 face each other. Test piece 1 was set in a xenon flash heat conduction measuring device. Next, pulse light is irradiated from the xenon light source toward one side of the test piece 1, and the temperature change on the other side of the test piece 1 is measured by the detection unit. The temperature change profile on the other side of the test piece 1 is obtained by taking the temperature change on the vertical axis and the elapsed time from pulse light irradiation on the horizontal axis. Based on this profile, the thermal diffusivity (α) (m ² / s) in the thickness direction of the test piece 1 is obtained using a conventionally known t1 / 2 method. And thermal conductivity ((lambda)) was computed using following formula (1). It should be noted that the thermal diffusivity is how efficiently heat is released from the other side of the test piece 1 after the one side of the test piece 1 is irradiated with light and given thermal energy to the test piece 1. Indicates.

In the above formula (1), λ represents thermal conductivity, α represents thermal diffusivity, ρ represents density (kg / m ³ ), and C represents specific heat capacity (kJ / (kg · K)).

The specific heat capacity in the above formula (1) was measured in accordance with JIS K 7123: 1987. The density was measured according to JIS K 7112: 1999. Specifically, in the case of the test piece 1, the density (ρ) (kg / m ³ ) of the test piece 1 measured according to JIS JIS K 7112: 1999 and JIS K 7123: 1987, Specific heat capacity (C) (kJ / (kg · K)) is used.

  For the test piece 2 as well, a thermal diffusivity in the thickness direction of the test piece 2 was obtained by the same xenon flash thermal conductivity measurement method as that described above for the test piece 1.

  The thermal diffusivities of these test pieces 1 and 2 correspond to the thermal conductivity in the thickness direction and the surface direction of the molded body B, respectively. Thus, the thermal diffusivity in the thickness direction and the thermal diffusivity in the surface direction of the compact B were specified. The results are as shown in Tables 1 and 2. The greater the difference between the thermal conductivity in the thickness direction of the molded body B and the thermal conductivity in the surface direction of the molded body B, the stronger directivity is recognized in the thermal conductivity of the molded body B.

Reference Examples 1-1 to 1-2, Comparative Examples 1-1 to 1-7
A heat radiating resin composition was prepared in the same manner as in Example 1-1 except that the composition of each component such as the filler and thermoplastic resin used was as shown in Tables 3 and 4. Further, for Reference Examples 1-1 and 1-2 and Comparative Examples 1-1 to 1-7, the resin fluidity confirmation test, the test molded body preparation test, and the test molded body heat were performed in the same manner as in Example 1-1. Based on the conductivity test, the moldability of the heat radiating resin composition was evaluated. The results are shown in Tables 3 and 4.

[Molded body using heat-dissipating resin composition]
Example 2-1
A molded body was prepared using the heat dissipating resin composition prepared in Example 1-4. An injection molding method was used for the preparation of the molded body. The injection molding method was performed using an injection molding apparatus (JSW J75EII manufactured by Nippon Steel Works). The mold used in the injection molding method was formed in a shape corresponding to the shape of the molded body. As the molded body, a material having a shape that can be used as a holding material in an LED bulb as shown in FIG. 5 was prepared. That is, as the molded body, a molded body having a cylindrical shape whose sectional diameter decreases from one side end along the injection direction toward the other side end was prepared.

  Regarding the molding conditions of the heat-dissipating resin composition at the time of the injection molding method, the injection molding temperature, mold temperature, and injection pressure were 280 ° C., 100 ° C., and 193 MPa, respectively. When the cross-section of the resulting molded body was enlarged and observed, the flat filler contained in the molded body had a flat plane direction along the inflow direction of the heat radiating resin composition into the mold.

[Applicability as a member constituting the LED lighting device]
Whether or not the molded body has suitability as a member constituting the LED lighting device was evaluated as follows. In the evaluation, a test lighting device 70 formed of some components of the LED lighting device as shown in FIG. 6 was used as a model of the LED lighting device. A heat transfer test and a heat dissipation test were performed using the test lighting device 70, and the heat transfer properties and heat dissipation properties of the LED lighting device were evaluated based on the results. And if the LED illuminating device excellent in heat transfer property and heat dissipation is obtained, it will be evaluated that a molded object has a suitability as a member which comprises an LED illuminating device.

  The molded body obtained in Example 2-1 was used as a member corresponding to the holding material of the LED lighting device. Here, an LED bulb was adopted as the LED illumination device.

[Test lighting device 70]
The test illumination device 70 is formed by attaching the LED mounting substrate 72 to the holding material 71. This corresponds to the structure in which the base 57, the power supply module 54, and the wirings 65 and 66 are removed from the LED lighting device 50 in FIG. 4B.

[Preparation of LED mounting board 71]
A metal circuit board (manufactured by Meiko Co., Ltd.) (a disk shape having a thickness of 1.115 mm and a diameter of 51 mm) was prepared as a substrate. The metal circuit board is made of aluminum as a base material (thickness 1 mm), and a thermal conductive insulating layer (thickness 80 μm, thermal conductivity 2 (W / mK)) and a copper foil (thickness 35 μm) in this order. The copper foil is laminated and patterned in accordance with an electric circuit pattern for controlling energization to the LED element. Six LED elements (manufactured by Nichia Corporation, NS6W183A-H1) were mounted at predetermined positions on the substrate. These LED elements were arranged on the concentric circle at substantially equal intervals.

  Using the test lighting device 70 of Example 2-1, a heat transfer test and a heat release test were performed as follows. The heat transferability test is a test for confirming that the heat transferred from the LED element of the test lighting device 70 to the holding material is quickly transferred in the direction away from the LED element serving as a heat source in the holding material, The heat dissipation test is to confirm that the test lighting device 70 is efficiently discharging heat to the outside of the device.

  In conducting the heat transfer test and the heat dissipation test, the variable DC power supply device and the LED element are connected by directly connecting the wiring of the variable DC power supply device to the electric circuit of the LED mounting board 72 from the outside of the test lighting device 70. Electrical connection was established, and DC power could be supplied to the LED elements according to the operation control of the variable DC power supply.

[Heat transfer test]
As shown in FIG. 6, in the heat transfer test, the position corresponding to the contact portion with the LED mounting substrate 72 is set as a reference position on the outer side of the side surface of the holding material 71, and the holding is performed from the reference position (position T1). One point was selected at positions 10 mm, 20 mm, and 30 mm away from the contact portion along the side surface of the material, and designated as positions T2, T3, and T4. At this time, when the position T1 is viewed from the front, the positions T1, T2, T3, and T4 are arranged in a line along the direction from one opening of the holding member to the other opening. An infrared temperature measurement device (TVS-500EX manufactured by NEC Avio Infrared Technology Co., Ltd.) was disposed outside the side surface of the holding material 71. The infrared temperature measuring device is arranged so as to face the positions T1, T2, T3, and T4, and can specify the temperature of each position. The surface temperature at each of the positions T1, T2, T3, and T4 was measured at room temperature with no power applied to the LED elements of the test illumination device 70. Furthermore, power (6 W) was applied to the LED element, and the surface temperature (° C.) at each position after 150 minutes had elapsed was measured. The results are shown in Table 5.

  In the test illumination device 70, heat is quickly transmitted to the entire holding material 71, and the heat transmitted to the holding material 71 is quickly transmitted in a direction away from the heat source inside the molded body. In this way, it was confirmed that the test lighting device can secure a larger part of the holding material used for heat dissipation because heat is rapidly transmitted in the direction away from the heat source. .

[Heat dissipation confirmation test]
In the heat dissipation confirmation test, the heat dissipation of the test lighting device 70 was measured as shown below.

  The test illumination device 70 was placed indoors (room temperature 25 ° C.), and power was turned on to the LED element serving as the light source of the test illumination device 70 to generate light from the light source, and the time of the surface temperature of each LED element was measured. The surface temperature of the LED element was detected using a thermocouple. That is, the temperature detection end of the thermocouple was placed on each LED element on the LED element placement surface side of the LED mounting substrate of the test lighting device, and the surface temperature of each LED element was measured. At this time, the temperature was measured at intervals of 5 minutes after the start of power supply to the LED elements until 150 minutes passed from the start of light emission. For each LED element, a temperature change profile was obtained with the horizontal axis representing the time (minutes) elapsed from the start of power application to the LED element and the temperature (° C.) representing the vertical axis. FIG. 7 shows the LED element having the largest temperature rise at this time.

Comparative Example 2-1
A molded body was prepared in the same manner as in Example 2-1, except that the heat dissipating resin composition prepared in Comparative Example 1-1 was used.

  It was evaluated whether or not the molded body formed in Comparative Example 2-1 was suitable as a member constituting the LED lighting device. In the evaluation, a test lighting device was prepared in the same manner as in Example 2-1, except that the molded body formed in Comparative Example 2-1 was used as the molded body used as the holding material. And the heat transfer test and the heat dissipation test were implemented similarly to Example 2-1 using the test illumination apparatus, and evaluation based on the result of the test was performed. The results are shown in Table 5 and FIG.

Example 2-2
A molded body was prepared in the same manner as in Example 2-1, except that the shape of the molded body was a flat plate shape of 180 mm long × 120 mm wide × 3 mm thick. When the obtained molded body was enlarged and observed, in the molded body, the flat surface direction of the flat filler was substantially along the surface direction of the molded body, and the thickness direction of the flat filler was approximately the thickness of the molded body. It was recognized that the flat filler was oriented along the direction.

  It was evaluated whether or not the molded body formed in Example 2-2 was suitable as a member constituting the LED lighting device. In the evaluation, the laminate (laminate κ) using the molded body formed in Example 2-2 as shown below was used as the substrate of the LED mounting substrate in the same manner as in Example 2-1. A test lighting device was prepared. In this test illumination device, the substrate and the holding material are formed of a molded body of the heat dissipating resin composition. And the heat dissipation test was implemented similarly to Example 2-1 using the test illumination apparatus, and evaluation based on the result of the test was performed. The results are shown in FIG.

[Laminated body used as substrate in LED mounting substrate (laminated body κ)]
This laminated body is an epoxy resin adhesive sheet (GEA-679FG (trademark) manufactured by Hitachi Chemical Co., Ltd.) on one side of the base material obtained by using the plate-like molded body obtained in Example 2-2. ) (Thickness: 100 μm), copper foil (electrolytic copper foil manufactured by Furukawa Electric Co., Ltd.) (thickness: 35 μm) was pressure-bonded, and the copper foil was patterned in accordance with an electric circuit pattern for controlling energization to the LED element Is. The electric circuit pattern is the same pattern as the substrate constituting the LED mounting substrate of Example 2-1. In the patterning, an etching resist is printed on a pattern corresponding to the electric circuit pattern to mask a portion corresponding to the electric circuit pattern, and an exposed surface (non-masking portion) of the copper foil is removed by etching to remove the etching resist. It was carried out. The LED mounting substrate is prepared by mounting LED elements at predetermined positions of the laminate.

Comparative Example 2-2
A molded body was prepared in the same manner as in Example 2-2 except that the heat dissipating resin composition prepared in Comparative Example 1-1 was used.

  It was evaluated whether or not the molded body formed in Comparative Example 2-2 was suitable as a member constituting the LED lighting device. In evaluation, Example 2 was used except that the laminate using the molded body formed in Comparative Example 2-2 was used as the substrate of the LED mounting substrate instead of the laminate formed in Example 2-2. The LED mounting substrate was adjusted in the same manner as in Example-2. And the test lighting apparatus was prepared like Comparative Example 2-1 except having used this LED mounting substrate. In this test illumination device, the substrate and the holding material are constituted by a molded body formed from the heat dissipating resin composition of Comparative Example 1-1. And the heat dissipation test was implemented similarly to Example 2-1 using the test illumination apparatus, and evaluation based on the result of the test was performed. The results are shown in FIG.

  The present invention is useful in applications that improve the heat dissipation of electrical and electronic equipment such as lighting equipment.

DESCRIPTION OF SYMBOLS 1 Flat filler 2 Molded body 3 Spherical filler 4 Thermoplastic resin material 5 Air interface 10 Injection molding apparatus 11 Injection part 12 Male mold 13 Female mold 14 Mold 15 Clamping part 16, 31 Hopper 17, 32 Space 18, 33 Heating device 19, 34 Cylinder 20, 35 Spiral groove 21, 36 Screw 22, 37 Screw drive device 23 Resin reservoir 24 Nozzle 25 Die plate 26 Clamping mechanism 27 Heat-dissipating resin composition 28 Sprue 29 Cavity 30 Extrusion device 38 Die head DESCRIPTION OF SYMBOLS 39 Extrusion port 40 Taking-out apparatus 50 LED illumination apparatus 51 LED element 52 Board | substrate 53, 72 LED mounting board 54 Power supply module 55 Space 56, 71 Holding material 57 Base 58 Holding part 59 LED light emission surface 60 Covering material 61 Support part 62 Substrate support surface 63 Flange 64 Terminal 65 , 66 Wiring 70 Test lighting device

Claims (5)

Including a thermoplastic resin material, a spherical filler, and a flat filler made of boron nitride,
The average particle diameter (Rs) of the spherical filler is 10 μm or more and 60 μm or less,
The average particle diameter (Rf) of the flat filler is 5 μm or more and 40 μm or less,
A heat-dissipating resin composition, wherein the flatness of the flat filler is 2% or more and 30% or less. When the total weight of the spherical filler and the flat filler is 100 parts by weight,
The heat-radiating resin composition according to claim 1, wherein the amount of the flat filler is 2 parts by weight or more and 50 parts by weight or less.   The molded object which consists of a heat-radiating resin composition of Claim 1 or 2, and the flat filler which is in contact with several different spherical fillers exists.   The molded product according to claim 3, wherein at least a part of the flat filler is oriented so that the directions of the flat surfaces are aligned with each other. An LED mounting board in which an LED element having a light emitting unit is mounted on a board, a power supply module electrically connected to the LED element, and a holding material having a space capable of holding the power supply module and to which the LED mounting board can be attached A lighting device comprising:
An illuminating device, wherein the holding member and / or the substrate is formed from the molded body according to claim 3 or 4.