JP2013232588A - Light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To emit multicolor light varied according to a position in a linear light emitting device.SOLUTION: Light emitting sections 5 comprising an LED chip 4 only, a combination of the LED chip 4 and a first yellow phosphor layer 18, and a combination of the LED chip 4 and a second yellow phosphor layer 19 are respectively formed on a strip-like printed circuit board 2. The light emitting sections 5 adjacent to each other have different colors. A translucent sealing resin section 1 sealing the light emitting sections 5 has a flat light injection plane 1a. The first yellow phosphor layer 18 and the second yellow phosphor layer 19 are formed on the light injection plane 1a. A concentration of phosphor included in the first yellow phosphor layer 18 is lower than that of phosphor included in the second yellow phosphor layer 19. Thereby, not only colors of light emitted from the respective light emitting sections 5 are different from each other, but also a different color can be obtained by mixing the different colors of the emitted light.

Description

  The present invention relates to a light emitting device in which semiconductor light emitting elements such as LEDs are linearly arranged.

  In recent years, light emitting devices using semiconductor light emitting elements such as LEDs as light sources have been used in various fields. For example, the LED has a limited emission color when used alone, but a desired emission color can be obtained by combining LEDs of different emission colors or a phosphor.

  For example, in amusement machines and amusement facilities, it is often performed to obtain multicolor light by using a plurality of such light emitting devices for the purpose of enhancing entertainment. In other fields as well, a plurality of light emitting devices are similarly used to obtain multicolor light.

  In the case of using a plurality of light emitting devices, the light emitting devices can be arranged in a desired pattern because the arrangement is free. However, in the case where the light emitting device is linearly arranged with a narrow width, the width is determined by the size of the light emitting device, and thus cannot be further reduced. For example, in a light emitting device in which each of red, green, and blue LED chips is mounted, each LED chip is mounted in a package at a predetermined interval, and thus must be larger than the LED chip. .

  On the other hand, Patent Documents 1 and 2 disclose a light source device formed in a straight line. In these light source devices, a plurality of light emitting elements are mounted at intervals on a linearly formed substrate. Therefore, by using a substrate that is slightly wider than the light-emitting element, a long and narrow light source device can be formed.

JP 2008-108750 A (published May 8, 2008) Japanese Unexamined Patent Publication No. 2009-21221 (released on January 29, 2009)

  However, since the above light source device is used as a light source of a backlight in a liquid crystal display device, it emits only monochromatic light such as white. Therefore, even if the above light source device is used, a light emitting device that emits multicolor light cannot be obtained. In addition, it is not possible to obtain a light emitting device that emits not only multicolor light but also light that changes color according to position.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a linearly formed light emitting device that emits multicolor light that changes depending on the position.

  In order to solve the above-described problems, a light-emitting device according to the present invention includes an elongated and linear substrate, a semiconductor light-emitting element that is disposed on the surface of the substrate at an interval in the longitudinal direction of the substrate, A sealing resin portion that seals so as to cover all of the semiconductor light emitting element; and a wavelength conversion portion that converts the wavelength of light of the semiconductor light emitting element inside or outside the sealing resin portion, The wavelength conversion unit converts the wavelength of the light emitted from the semiconductor light emitting element so that the wavelengths of the emitted light are different from each other.

  In the above configuration, the wavelength of light emitted from at least one semiconductor light emitting element of the plurality of semiconductor light emitting elements is converted by the wavelength conversion unit. At this time, the wavelength conversion is performed by the adjacent wavelength conversion units so that the wavelengths of the emitted light are different from each other. Thereby, since the color of the light radiate | emitted from an adjacent wavelength conversion part differs, the color of the light seen for every semiconductor light-emitting device differs. And between these semiconductor light emitting elements, these light colors are mixed, whereby a change in emission color occurs between the semiconductor light emitting elements.

  In the light emitting device, the sealing resin portion emits a part of the light of the semiconductor light emitting element at a position facing the semiconductor light emitting element and reflects the other, the first emission adjacent to the first light emitting element. It is preferable to have a second emission part that emits light reflected by the first emission part and light from the semiconductor light emitting element between the parts.

  In the above configuration, part of the light emitted from the semiconductor light emitting element toward the first emission part is emitted from the first emission part to the outside, and the other is reflected by the first emission part. Further, the light reflected from the first emission part and directed to the second emission part, and the light emitted from the semiconductor light emitting element directly to the second emission part are emitted to the outside from the second emission part.

  As a result, the light that is reflected by two adjacent first output portions of the second output portion and travels toward the second output portion, and the light that directly reaches the second output portion from the adjacent semiconductor light emitting element are mixed and colored. 2 is emitted to the outside from the emission unit. Moreover, since all the light is reflected without being emitted from the first emission part, the intensity of light traveling straight from the semiconductor light emitting element can be suppressed, and the emitted light from the semiconductor light emitting element can also be used for color mixing. Accordingly, since the degree of color mixing near the semiconductor light emitting element is different from the degree of color mixing near the intermediate position between the adjacent semiconductor light emitting elements, the emission color changes between the adjacent semiconductor light emitting elements.

  In the light emitting device, it is preferable that the second emission unit decreases the amount of light emitted to the outside as it approaches an intermediate position between the adjacent first emission units.

  As a result, the closer to the above-mentioned intermediate position, the smaller the amount of light extracted to the outside, so that the light color obtained by the color mixture of light from adjacent semiconductor light emitting elements becomes lighter. Therefore, it is possible to obtain a gradation-like light emission pattern in which the color changes more smoothly between adjacent light emitting portions.

  In the light emitting device, it is preferable that the second emitting portion has a plurality of concave portions that are deepest at the intermediate position and become shallower as the distance from the intermediate position increases.

  By using a plurality of recesses in this way, the amount of light emitted from the second emission part as described above can be easily adjusted by appropriately setting the depth of each recess.

  In the light emitting device, it is preferable that the first emission part and the second emission part are concave parts having inclined surfaces.

  Thereby, the diffusion of light can be easily controlled by appropriately setting the inclination angle of the inclined surface.

  In the light emitting device, it is preferable that the wavelength conversion unit includes a phosphor that emits light when excited by light of the semiconductor light emitting element.

  Thereby, if the quantity (density | concentration) of the fluorescent substance of a fluorescent substance part is adjusted suitably, the luminescent color obtained by color mixing between wavelength conversion parts can be adjusted.

  In the light emitting device, it is preferable that the wavelength conversion unit is disposed between adjacent semiconductor light emitting elements on the surface of the substrate.

  Alternatively, in the light emitting device, it is preferable that the wavelength conversion unit is disposed in the second emission unit.

  Thereby, it becomes easy to adjust the change of the luminescent color between adjacent semiconductor light emitting elements by adjusting the density | concentration of the fluorescent substance of a wavelength conversion part.

  By being configured as described above, the light emitting device according to the present invention has the effect of being able to emit multicolor light that varies depending on the position.

(A) is a side view which shows the structure of the light-emitting device which concerns on Embodiment 1 of this invention, (b) is a top view which shows the structure of the said light-emitting device. It is a side view which shows the structure of the light-emitting device which concerns on Embodiment 2 of this invention. (A) is a side view which shows the structure of the light-emitting device which concerns on Embodiment 3 of this invention, (b) is a top view which shows the structure of the said light-emitting device. 6 is a plan view showing a light emission state of a light emitting device according to Embodiment 3. FIG. It is a side view which shows the structure of the light-emitting device which concerns on Embodiment 4 of this invention. It is a side view which shows the structure of the light-emitting device concerning Embodiment 5 of this invention. It is a side view which shows the structure of the LED chip and fluorescent substance film which are provided in the light-emitting device concerning Embodiment 5. It is a side view which shows the structure of the light-emitting device which concerns on Embodiment 6 of this invention. (A) is a side view which shows the structure of the light-emitting device which concerns on Embodiment 7 of this invention, (b) is a side view which shows the structure of the other light-emitting device which concerns on Embodiment 7. FIG.

[Embodiment 1]
An embodiment according to the present invention will be described below with reference to FIGS. 1 and 2.

[Configuration of light emitting device]
FIG. 1A is a side view showing the configuration of the light emitting device 21 according to Embodiment 1 of the present invention, and FIG. 1B is a plan view showing the configuration of the light emitting device 21.

  As shown in FIGS. 1A and 1B, the light emitting device 21 includes a sealing resin portion 1, a printed board 2, five LED chips 4, a first yellow phosphor layer 18, and a second yellow. And a phosphor layer 19.

  The printed circuit board 2 (substrate) is formed in an elongated strip shape (linear shape) and has a width that is slightly wider than the outer size (width) of the LED chip 4. In the printed board 2, printed wiring (not shown) for supplying power to the LED chip 4 is formed on a surface 2 a serving as a mounting surface on which the LED chip 4 is mounted. Further, a positive terminal and a negative terminal (not shown) connected to the printed wiring are provided at both ends or one end of the printed circuit board 2. The LED chip 4 is fed by connecting wiring for feeding power from the outside to the positive terminal and the negative terminal.

  The sealing resin portion 1 is formed of a translucent resin material on the printed circuit board 2 so as to seal the LED chip 4. Further, the sealing resin portion 1 has the same width as the printed board 2 and is formed so that both ends are located slightly inside the both ends of the printed board 2. Further, the sealing resin portion 1 has a flat light emission surface 1 a facing the surface 2 a of the printed circuit board 2. A first yellow phosphor layer 18 and a second yellow phosphor layer 19 are formed on the light emitting surface 1a without any gap.

  As a resin material for forming the sealing resin portion 1, for example, a silicone resin can be used. Further, the sealing resin portion 1 does not contain a phosphor.

  The LED chip 4 (semiconductor light emitting element) is an LED chip that emits blue light. The LED chip 4 (semiconductor light emitting element) is disposed on the surface 2a of the printed board 2 at a predetermined interval and is mounted by die bonding. The LED chip 4 is electrically connected to each other by connecting the anode and the cathode to the printed wiring. As the LED chip, for example, one using a GaN-based compound semiconductor can be used.

  The LED chip 4 is formed in a rectangular parallelepiped shape, but the shape is not limited. The rectangular parallelepiped LED chip 4 exhibits a light distribution characteristic having a peak of light emission intensity in the normal direction of the upper surface (light emitting surface). Alternatively, the LED chip 4 may have a light emitting surface that is inclined with respect to the upper surface as well as the upper surface, and may have a shape at a position on the longitudinal direction side of the sealing resin portion 3. The LED chip 4 having such a shape exhibits a light distribution characteristic having a peak of light emission intensity not only in the normal direction of the upper surface but also in the normal direction of the inclined light emitting surface. Thereby, light can be emitted also in an oblique direction with respect to the surface 2 a of the printed circuit board 2.

  The first yellow phosphor layer 18 (wavelength conversion unit) and the second yellow phosphor layer 19 (wavelength conversion unit) are formed by dispersing particulate yellow phosphors in a resin. Since the above resin is required to have high durability against blue light having a short wavelength from the LED chip 4, a silicone resin is preferably used.

  The yellow phosphor is a phosphor that is excited by the blue light of the LED chip 4 and emits yellow light having a longer wavelength than the blue light. For example, Ce: YAG, BOSE (Ba, Sr, O, Eu) And made of a phosphor material such as Eu-activated α sialon. By combining the yellow phosphor portion 7 including such a yellow phosphor and the LED chip 4, blue light and yellow light are mixed and pseudo white light can be obtained.

  In the first yellow phosphor layer 18, the concentration of the yellow phosphor is set so as to obtain the pseudo white light. On the other hand, the second yellow phosphor layer 19 contains an excessive amount of yellow phosphor compared to the first yellow phosphor layer 18 so as to obtain a yellowish emission color. Thereby, the first yellow phosphor layer 18 and the second yellow phosphor layer 19 convert the wavelength of the emitted light of each LED chip 4 so that the wavelengths of the emitted light are different from each other.

  The 1st yellow fluorescent substance layer 18 is arrange | positioned in the range which covers a part of LED chip 4 arrange | positioned on both sides of the LED chip 4 shown in the center in Fig.1 (a). Further, the second yellow phosphor layer 19 is located near the end (right end) of the sealing resin portion 1 from a part of the LED chip 4 arranged next to the LED chip 4 shown at the right end in FIG. It is arranged in the range.

[Manufacture of light-emitting devices]
Then, the manufacturing method of the light-emitting device 21 comprised as mentioned above is demonstrated.

  The light-emitting device 21 is manufactured by cutting a plurality of prototypes to be the light-emitting devices 21 on the same substrate and then cutting them individually.

  First, a plurality of wiring patterns of the printed circuit board 2 are formed on the surface of the rectangular substrate. Next, the LED chip 4 is arranged on the surface of the substrate, and each LED chip 4 is mounted with an adhesive by a die bonder. Thereafter, the LED chip 4 is connected to the wiring pattern by wire bonding so that power is supplied to the LED chip 4 from the outside.

  Next, a space in the molding die placed on the substrate is filled with a translucent resin and cured. Then, the mold of the sealing resin portion 1 that covers the LED chip 4 is formed by releasing the molding die from the cured resin.

  Here, a translucent resin material in which a phosphor material is dispersed is applied to the upper end surface of the original. By curing the resin material, a prototype of the first yellow phosphor layer 18 and the second yellow phosphor layer 19 is formed.

  Finally, each strip-shaped light-emitting device 21 is cut out by dicing from the prototype (block) of the light-emitting device 21 formed as described above. In dicing, the resin cut surface can be mirror-finished by appropriately selecting the blade particle size, rotation speed, and cutting speed.

[Light emission by light-emitting device]
In the light emitting device 21 configured as described above, the first yellow phosphor layer 18 and the second yellow phosphor layer 19 are formed on a part of the LED chips 4 on the light emitting surface 1a of the sealing resin portion 1. ing.

  Thereby, the blue light emitted from the LED chip 4 (light emitting portion 5) shown at the left end in FIG. 1A is directly emitted from the light emitting surface 1a to the outside of the sealing resin portion 1.

  A part of the blue light emitted from the LED chip 4 arranged on the right side of the LED chip 4 is emitted as it is, but the other is incident on the first yellow phosphor layer 18. Therefore, the LED chip 4 alone constitutes the light emitting part 5 and is combined with the first yellow phosphor layer 18 to constitute the light emitting part 5. In the first yellow phosphor layer 18, the yellow phosphor functioning as a point light source is excited by blue light and emits yellow light in the direction of 360 °, whereby blue light passing between the yellow light and the yellow phosphor is transmitted. A pseudo-white light can be obtained by mixing with the above. As a result, the blue light and the pseudo white light emitted as they are are mixed to obtain light blue light.

  When blue light emitted from the LED chip 4 (light emitting unit 5) shown in the center in FIG. 1A is incident on the first yellow phosphor layer 18, as described above, the pseudo white is emitted from the first yellow phosphor layer 18. Light is emitted.

  When blue light emitted from the LED chip 4 (light emitting unit 5) shown at the right end in FIG. 1A is incident on the second yellow phosphor layer 19, the yellow phosphor is blue light in the second yellow phosphor layer 19. Excited by. At this time, yellow light is emitted by containing more yellow phosphor than the first yellow phosphor layer 18.

  Part of the blue light emitted from the LED chip 4 disposed next to the LED chip 4 is incident on the first yellow phosphor layer 18, and part of the blue light is incident on the second yellow phosphor layer 19. Is emitted from between the first yellow phosphor layer 18 and the second yellow phosphor layer 19 as it is. From this, the LED chip 4 constitutes the light emitting part 5 alone, and constitutes the light emitting part 5 in combination with the first yellow phosphor layer 18 and the second yellow phosphor layer 19. As a result, mixed color light of pseudo white light from the first yellow phosphor layer 18 and yellow light from the second yellow phosphor layer 19 is obtained.

  As described above, the light emitting device 21 emits the light from one LED chip 4 as it is, and makes the emission colors of the adjacent first yellow phosphor layer 18 and second yellow phosphor layer 19 different from each other, thereby obtaining a single color. The mixed color light which cannot be obtained by the LED chip 4 can be obtained. Therefore, the emission color can be changed between the adjacent LED chips 4. Moreover, more multicolored light can be obtained with a small number of LED chips 4.

  Further, by appropriately adjusting the amount (concentration) of each phosphor dispersed in the first yellow phosphor layer 18 and the second yellow phosphor layer 19, the emission color obtained by the color mixture can be adjusted. For example, when the amount of yellow phosphor in the second yellow phosphor layer 19 is increased, the yellow concentration of the emitted light from the light emitting unit 5 in which the LED chip 4 and the second yellow phosphor layer 19 are combined increases. The obtained mixed color is also more yellowish. Conversely, when the amount of yellow phosphor in the second yellow phosphor layer 19 is decreased, the yellow density of the emitted light from the light emitting unit 5 is decreased, and thus the yellow color of the obtained mixed color is decreased.

[Embodiment 2]
Embodiment 2 according to the present invention will be described below with reference to FIG.

  In the present embodiment, components having functions equivalent to those of the components in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

[Configuration of light emitting device]
FIG. 2 is a side view showing the configuration of the light emitting device 22 according to Embodiment 2 of the present invention.

  As shown in FIG. 2, the light emitting device 22 includes a sealing resin portion 1, a printed circuit board 2, five LED chips 4, and first to fourth yellow-green phosphor portions 14 to 17.

  The LED chip 4 shown at the left end in FIG. 2 is not covered with the first to fourth yellow phosphor portions 14 to 17 and constitutes the light emitting portion 5 alone, and is sealed by the sealing resin portion 1 as it is. It has been stopped. Further, the LED chip 4 arranged next to the LED chip 4 is covered with the first yellow phosphor portion 14, and the light emitting portion 5 is configured in combination with the first yellow phosphor portion 14. . The LED chip 4 shown in the center in FIG. 2 is covered with a second yellow phosphor portion 15, and constitutes a light emitting portion 5 in combination with the second yellow phosphor portion 15. The LED chip 4 arranged on the right side of the LED chip 4 is covered with a third yellow phosphor portion 16 and is combined with the third yellow phosphor portion 16 to constitute the light emitting portion 5. The LED chip 4 shown at the right end in FIG. 2 is covered with a fourth yellow phosphor portion 17, and constitutes the light emitting portion 5 in combination with the fourth yellow phosphor portion 17.

  The first to fourth yellow phosphor portions 14 to 17 include yellow phosphors having different amounts so that the concentration of the yellow phosphor dispersed in this order increases. Specifically, the second yellow phosphor portion 15 includes a yellow phosphor in an amount that emits pseudo white light. The first yellow phosphor portion 14 includes a smaller amount of yellow phosphor than the second yellow phosphor portion 15 so as to emit light blue light. The third yellow phosphor portion 16 includes a larger amount of yellow phosphor than the second yellow phosphor portion 15 so as to emit light yellow light. The fourth yellow phosphor portion 17 includes a larger amount of yellow phosphor than the third yellow phosphor portion 16 so as to emit deep yellow light.

  Thereby, the 1st-4th yellow fluorescent substance parts 14-17 convert the wavelength of the emitted light of each LED chip 4 so that the wavelength of the emitted light may mutually differ.

  In this way, the light emitting units 5 have different emission colors between adjacent ones.

[Manufacture of light-emitting devices]
Then, the manufacturing method of the light-emitting device 22 comprised as mentioned above is demonstrated.

  The light-emitting devices 22 are manufactured by being cut into individual pieces by cutting after a prototype to be a plurality of light-emitting devices 22 is formed on the same substrate.

  First, a step of forming a plurality of printed circuit board 2 wiring patterns on the surface of a rectangular substrate, a step of mounting the LED chip 4 on the surface of the substrate, and a step of connecting to the wiring pattern of the LED chip 4 include: This is similar to the case of manufacturing the light emitting device 21 described above.

  Here, for the LED chip 4 combined with the phosphor, a translucent resin material in which the phosphor material is dispersed is connected in a line from the dispenser onto the substrate so as to cover the plurality of LED chips 4 provided together. To be discharged. By curing the resin material, prototypes of the first to fourth yellow phosphor portions 14 to 17 are formed.

  Next, a space in the molding die placed on the substrate is filled with a translucent resin and cured. And the original mold of the sealing resin part 1 which covers the LED chip 4 and the first to fourth yellow phosphor parts 14 to 17 is formed by releasing the molding die from the cured resin.

  Finally, each strip-shaped light emitting device 22 is cut out by dicing in the same manner as in the case of manufacturing the light emitting device 21 from the prototype (block) of the light emitting device 22 formed as described above.

[Light emission by light-emitting device]
In the light emitting device 22 configured as described above, the four LED chips 4 are covered with the first to fourth yellow phosphor portions 14 to 17, respectively.

  Thereby, the blue light emitted from the LED chip 4 (light emitting portion 5) shown at the left end in FIG. 2 is emitted as it is from the light emitting surface 1a to the outside of the sealing resin portion 1.

  Blue light emitted from the LED chip 4 arranged on the right side of the LED chip 4 enters the first yellow phosphor portion 14. In the first yellow phosphor portion 14, a yellow phosphor that functions as a point light source is excited by blue light and emits yellow light. Since the yellow phosphor contained in the first yellow phosphor portion 14 is the least, this yellow light has a relatively light yellow color. Thereby, light blue light is obtained by mixing the yellow light and the blue light passing between the yellow phosphors.

  When blue light emitted from the LED chip 4 shown in the center in FIG. 2 enters the second yellow phosphor portion 15, the yellow phosphor is excited by the blue light in the second yellow phosphor portion 15 to emit yellow light. Thereby, pseudo white light is obtained by mixing the yellow light and the blue light passing between the yellow phosphors.

  When blue light emitted from the LED chip 4 disposed on the right side of the LED chip 4 is incident on the third yellow phosphor portion 16, the yellow phosphor is excited by blue light in the third yellow phosphor portion 16. Emits yellow light. Thereby, light yellow light is obtained by mixing the yellow light and the blue light passing between the yellow phosphors.

  When blue light emitted from the LED chip 4 shown at the right end in FIG. 2 enters the fourth yellow phosphor portion 17, the yellow phosphor is excited by blue light and emits yellow light in the fourth yellow phosphor portion 17. . As a result, dark yellow light is obtained by mixing the yellow light and the blue light passing between the yellow phosphors.

  As described above, in the light emitting device 22, mixed light that cannot be obtained by each light emitting unit 5 can be obtained by making the light emitting colors of the adjacent light emitting units 5 different. Therefore, the emission color can be changed between the adjacent light emitting units 5. In addition, multicolor light can be obtained with a small number of light emitting portions 5.

  Moreover, the light emission color obtained by color mixing can be adjusted by adjusting suitably the quantity (concentration) of each fluorescent substance disperse | distributed to the 1st-4th yellow fluorescent substance parts 14-17.

[Embodiment 3]
Embodiment 3 according to the present invention will be described below with reference to FIGS. 3 and 4.

  In the present embodiment, components having functions equivalent to those in the first and second embodiments described above are denoted by the same reference numerals, and description thereof is omitted.

[Configuration of light emitting device]
FIG. 3A is a side view showing the configuration of the light emitting device 23 according to Embodiment 3 of the present invention, and FIG. 3B is a plan view showing the configuration of the light emitting device 23.

  As shown in FIGS. 3A and 3B, the light-emitting device 23 includes a printed circuit board 2, a sealing resin portion 3, three LED chips 4, a red-green phosphor portion 6, and a yellow phosphor portion. 7.

  The sealing resin portion 3 is formed of a translucent resin material on the printed circuit board 2 so as to seal the LED chip 4, the red-green phosphor portion 6, and the yellow phosphor portion 7. Further, the sealing resin portion 3 has the same width as the printed board 2 and is formed so that both ends are located slightly inside the both ends of the printed board 2. As a resin material for forming the sealing resin portion 3, for example, a silicone resin can be used. Further, the sealing resin portion 3 does not contain a phosphor. The sealing resin portion 3 will be described in detail later.

  The LED chip 4 shown at the left end in FIG. 3A is not covered with the red-green phosphor portion 6 and the yellow phosphor portion 7 and constitutes the light emitting portion 5 alone, and the sealing resin portion as it is. 3 is sealed. Further, the LED chip 4 shown in the center in FIG. 3A is covered with a red-green phosphor portion 6, and the light-emitting portion 5 is configured in combination with the red-green phosphor portion 6. The LED chip 4 shown at the right end in FIG. 3A is covered with a yellow phosphor portion 7 and is combined with the yellow phosphor portion 7 to constitute a light emitting portion 5. The light emitting units 5 have different emission colors between adjacent ones.

  The red-green phosphor portion 6 is formed by dispersing a red phosphor and a green phosphor in a resin. The yellow phosphor portion 7 is formed by dispersing a yellow phosphor in a resin. As the resin, a silicone resin used as a resin for forming the first yellow phosphor layer 18 and the second yellow phosphor layer 19 is preferably used. Thus, the red-green phosphor portion 6 and the yellow phosphor portion 7 convert the wavelength of the emitted light of each LED chip 4 so that the wavelengths of the emitted light are different from each other.

  The red phosphor is a phosphor that is excited by the blue light of the LED chip 4 and emits red light having a longer wavelength than the blue light. For example, the red phosphor is made of a phosphor material mixed with CaAlSiN3: Eu. The green phosphor is a phosphor that is excited by the blue light of the LED chip 4 and emits green light having a longer wavelength than the blue light, and is made of, for example, a phosphor material of Eu-activated β sialon. By combining the red-green phosphor portion 6 including the red phosphor and the green phosphor and the LED chip 4, blue light, red light, and green light are mixed to produce white light with good color rendering. Can be obtained.

  As the yellow phosphor, a yellow phosphor similar to the yellow phosphor used in the first yellow phosphor layer 18 and the second yellow phosphor layer 19 is used. In particular, the yellow phosphor portion 7 contains an excessive amount as compared with the case where the yellow phosphor obtains pseudo white light so as to obtain yellowish white light.

<Configuration of sealing resin part>
The sealing resin portion 3 has a light emitting surface 30 that faces the surface 2 a of the printed circuit board 2. On this light emitting surface 30, an on-chip recess 31, an inter-chip recess 32 and a flat portion 33 are formed.

  The chip upper concave portion 31 (first emission portion) is formed immediately above each light emitting portion 5, and has an inclined surface inclined with respect to the surface 2a. The on-chip concave portion 31 emits a part of the light from the light emitting portion 5 to the outside, and the inclined surface so as to totally reflect the light emitted from the light emitting portion 5 mainly in the vertical direction on the surface 2a. An inclination angle is set. For this reason, the inclination angle is set so that light is extracted from the interchip recess 32 (second emission part). For example, the chip upper recess 31 is formed such that a cross section along the longitudinal direction of the printed circuit board 2 forms a V shape.

  The inter-chip concave portion 32 (second emission portion) is formed at a middle position between the adjacent chip upper concave portions 31 so as to be larger and deeper than the chip upper concave portion 31, and has an inclined surface inclined with respect to the surface 2a. The inter-chip recess 32 is formed on the inclined surface so that the light emitted from the light emitting unit 5 in the oblique direction inclined with respect to the surface 2a along the longitudinal direction of the printed circuit board 2 is diffused and emitted to the outside. An inclination angle is set. For this reason, the inclination angle is set so as to reduce the total reflected light as much as possible. For example, the inter-chip recess 32 is formed such that a cross section along the longitudinal direction of the printed circuit board 2 forms a V shape.

  The on-chip recess 31 and the inter-chip recess 32 only have to be able to emit light to the outside as described above. Therefore, the cross-sectional shape along the longitudinal direction of the printed board 2 is not limited to the above V-shape in the upper chip recess 31 and the interchip recess 32. For example, the inclined surfaces of the chip upper concave portion 31 and the inter-chip concave portion 32 may be curved in a convex shape or a concave shape, or may be formed in a shape such that the angle changes stepwise.

  The flat portion 33 is a portion of a flat surface formed between the adjacent chip upper concave portion 31 and the inter-chip concave portion 32.

[Manufacture of light-emitting devices]
Then, the manufacturing method of the light-emitting device 23 comprised as mentioned above is demonstrated.

  The light emitting device 23 is manufactured by cutting a plurality of prototypes to be the light emitting devices 23 on the same substrate and then individually cutting the prototype.

  First, a step of forming a plurality of printed circuit board 2 wiring patterns on the surface of a rectangular substrate, a step of mounting the LED chip 4 on the surface of the substrate, and a step of connecting to the wiring pattern of the LED chip 4 include: This is similar to the case of manufacturing the light emitting device 21 described above.

  Here, for the LED chip 4 combined with the phosphor, a translucent resin material in which the phosphor material is dispersed is connected in a line from the dispenser onto the substrate so as to cover the plurality of LED chips 4 provided together. To be discharged. By curing the resin material, a prototype of the red-green phosphor portion 6 and the yellow phosphor portion 7 described above is formed.

  Next, a space in the molding die placed on the substrate is filled with a translucent resin and cured. Then, by removing the molding die from the cured resin, a prototype of the sealing resin portion 3 that covers the LED chip 4, the red-green phosphor portion 6, and the yellow phosphor portion 7 is formed.

  Finally, each strip-shaped light emitting device 23 is cut out by dicing in the same manner as in the case of manufacturing the light emitting device 21 from the prototype (block) of the light emitting device 23 formed as described above.

[Light emission by light-emitting device]
FIG. 4 is a plan view showing a light emission state of the light emitting device 23.

  In the light emitting device 23 configured as described above, the sealing resin portion 3 has on the light emitting surface 30 an on-chip concave portion 31 and an interchip concave portion 32 for emitting light from the light emitting portion 5 to the outside. As a result, part of the light emitted from the light emitting unit 5 toward the chip upper recess 31 is emitted from the chip upper recess 31 to the outside, and the others are totally reflected by the chip upper recess 31 and sealed. It proceeds along the longitudinal direction in the stop resin portion 3 and is emitted from the interchip recess 32. Of the light emitted from the light emitting section 5, the light that goes directly to the interchip recess 32 and the light that is reflected by the chip upper recess 31 and goes to the interchip recess 32 diffuses to the outside from the interchip recess 32. Emitted.

  As a result, the light totally reflected from the adjacent chip upper recesses 31 and the light directly reaching from the adjacent light emitting portions 5 are extracted from the interchip recesses 32 between these chip upper recesses 31 and mixed. . In addition, since a part of the light from the light emitting unit 5 is emitted from the on-chip concave portion 31, the intensity of light traveling straight from the light emitting unit 5 is suppressed, and the emitted light from the on-chip concave portion 31 is also used for color mixing. be able to. Thereby, since the degree of color mixing in the vicinity of the light emitting unit 5 and the degree of color mixing in the vicinity of the intermediate position with the adjacent light emitting unit 5 are different, the emission color changes between the adjacent light emitting units 5.

  In the light emitting device 23, blue light is emitted from the leftmost light emitting part 5 (LED chip 4 alone) in FIG. 3A, and white light is emitted from the central light emitting part 5 (LED chip 4 and red-green phosphor part 6). Emitted, and yellowish white light is emitted from the leftmost light emitting part 5 (LED chip 4 and yellow phosphor part 7). As a result, as shown in FIG. 2, mixed light of blue light and white light is obtained between the leftmost light emitting unit 5 and the central light emitting unit 5, and the central light emitting unit 5 and the rightmost light emitting unit 5 are obtained. Between, a mixed color light of white light and yellowish white light is obtained.

  As described above, in the light emitting device 23, mixed light that cannot be obtained by the two light emitting units 5 alone can be obtained by making the light emitting colors of the adjacent light emitting units 5 different. Therefore, the emission color can be changed between the adjacent light emitting units 5. In addition, multicolor light can be obtained with a small number of light emitting portions 5.

  As shown in FIG. 3A, the inclination angle θ1 of the inclined surface of the chip upper recess 31 is set to an angle larger than the total reflection critical angle (for example, 42 °). As a result, the light emitted in the normal direction of the light emitting surface of the LED chip 4 is incident on the chip upper recess 31 at an angle larger than the total reflection critical angle. To do. Further, light emitted in an oblique direction with respect to the normal direction of the light emitting surface of the LED chip 4 is emitted from the chip upper recess 31 if it enters the chip upper recess 31 at an angle smaller than the total reflection critical angle. .

  On the other hand, as shown in FIG. 3A, the inclination angle θ2 of the inclined surface of the interchip recess 32 is set to an angle (for example, 37 °) smaller than the total reflection critical angle. Thereby, the light emitted in the normal direction of the light emitting surface of the LED chip 4 is incident on the inter-chip concave portion 32 at an angle smaller than the total reflection critical angle, and thus is emitted from the inter-chip concave portion 32.

  Furthermore, by appropriately adjusting the amount (concentration) of each phosphor dispersed in the red-green phosphor portion 6 and the yellow phosphor portion 7, the emission color obtained by the color mixture can be adjusted. For example, when the amount of the yellow phosphor in the yellow phosphor portion 7 is increased, the yellow concentration of the emitted light from the light emitting portion 5 in which the LED chip 4 and the yellow phosphor portion 7 are combined increases, so that the obtained color mixture Will be more yellowish. Conversely, when the amount of yellow phosphor in the yellow phosphor portion 7 is reduced, the yellow density of the emitted light from the light emitting portion 5 is reduced, so that the resulting mixed color yellowness is reduced. This makes it possible to increase or decrease the change in emission color obtained by the phosphor between the adjacent light emitting units 5.

[Embodiment 4]
Embodiment 4 according to the present invention will be described below with reference to FIG.

  In the present embodiment, components having functions equivalent to those of the components in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

[Configuration of light emitting device]
FIG. 5 is a side view showing the configuration of the light emitting device 24 according to the fourth embodiment.

  As shown in FIG. 5, the light emitting device 24 includes a printed circuit board 2, a sealing resin portion 3, three LED chips 4, a yellow phosphor portion 7, a green phosphor portion 8, and a red phosphor portion 9. And.

  The LED chip 4 shown at the left end in FIG. 5 is covered with a yellow phosphor portion 7 and is combined with the yellow phosphor portion 7 to constitute a light emitting portion 5. In addition, the LED chip 4 shown in the center in FIG. 5 is covered with a green phosphor portion 8 and is combined with the green phosphor portion 8 to constitute a light emitting portion 5. The LED chip 4 shown at the right end in FIG. 5 is covered with a red phosphor portion 9 and is combined with the red phosphor portion 9 to constitute a light emitting portion 5.

  The green phosphor portion 8 is formed by dispersing the green phosphor as described above in a resin. The red phosphor portion 9 is formed by dispersing the above-described red phosphor in a resin. As the resin, the same silicone resin as that used in the yellow phosphor portion 7 is used. Thus, the green phosphor portion 8 and the red phosphor portion 9 convert the wavelength of the emitted light of each LED chip 4 so that the wavelengths of the emitted light are different from each other.

[Manufacture of light-emitting devices]
The light emitting device 24 configured as described above can also be manufactured in the same manner as the light emitting device 21 described above.

[Light emission by light-emitting device]
As described above, the light emitting device 24 of the present embodiment is different in the configuration of the light emitting device 23 and the light emitting unit 5 described above. A yellowish white light is emitted from the light emitting part 5 (the LED chip 4 and the yellow phosphor part 7) at the left end in FIG. 5, and blue-green is emitted from the central light emitting part 5 (the LED chip 4 and the green phosphor part 8). Light is emitted, and magenta light is emitted from the light emitting part 5 (the LED chip 4 and the red phosphor part 9) at the left end. As a result, mixed light of yellowish white light and blue-green light is obtained between the leftmost light emitting unit 5 and the central light emitting unit 5, and the central light emitting unit 5 and the rightmost light emitting unit 5 In between, a light mixture of blue-green light and magenta light is obtained.

  As described above, also in the light emitting device 24, similarly to the light emitting device 23, mixed light that cannot be obtained by both the light emitting units 5 can be obtained by making the light emitting colors of the adjacent light emitting units 5 different. Therefore, the emission color can be changed between the adjacent light emitting units 5. In addition, multicolor light can be obtained with a small number of light emitting portions 5.

  Further, by appropriately setting the inclination angles of the inclined surfaces of the on-chip concave portion 31 and the inter-chip concave portion 32 as described above, a part of light from the adjacent light emitting portions 5 can be taken out from the inter-chip concave portion 32.

  Furthermore, by appropriately adjusting the amount (concentration) of each phosphor dispersed in the red-green phosphor portion 6 and the yellow phosphor portion 7, the emission color obtained by the color mixture can be adjusted.

[Embodiment 5]
Embodiment 5 according to the present invention will be described below with reference to FIGS.

  In addition, in this embodiment, about the component which has a function equivalent to the component in above-mentioned Embodiment 1-3, the same code | symbol is attached and the description is abbreviate | omitted.

  FIG. 6 is a side view showing the configuration of the light emitting device 25 according to the fifth embodiment. FIG. 7 is a side view showing the configuration of the LED chip 4 and the phosphor film 10 provided in the light emitting device 25.

  As shown in FIG. 6, the light emitting device 25 includes a printed circuit board 2, a sealing resin portion 3, three LED chips 4, three yellow phosphor portions 7, a blue phosphor light emitting portion 11, and green fluorescence. A body light emitting unit 12 and a red phosphor light emitting unit 13 are provided.

  All the LED chips 4 are covered with a yellow phosphor portion 7 and are combined with the yellow phosphor portion 7 to constitute a light emitting portion 5.

  The blue phosphor light emitting unit 11, the green phosphor light emitting unit 12, and the red phosphor light emitting unit 13 are formed on the printed circuit board 2 alone without being combined with the LED chip 4. The blue phosphor light-emitting portion 11, the green phosphor light-emitting portion 12, and the red phosphor light-emitting portion 13 are each disposed directly below the interchip recess 32.

  The blue phosphor light-emitting portion 11 is formed by dispersing a blue phosphor in a resin. As the resin, the same silicone resin as that used in the yellow phosphor portion 7 is used. In addition, the green phosphor light emitting portion 12 is formed by dispersing the green phosphor as described above in a resin, similarly to the green phosphor portion 8 described above. Similarly to the red phosphor portion 9 described above, the red phosphor light emitting portion 13 is formed by dispersing the above-described red phosphor in a resin. As described above, the blue phosphor light-emitting unit 11, the green phosphor light-emitting unit 12, and the red phosphor light-emitting unit 13 have the LED chips 4 of the LED chips 4 so that the wavelength of the emitted light is different from that of the adjacent yellow phosphor unit 7. The wavelength of the emitted light is converted.

  The blue phosphor light-emitting unit 11, the green phosphor light-emitting unit 12, and the red phosphor light-emitting unit 13 are not combined with the LED chip 4, but they are excited by the light of the LED chip 4 and emit light themselves. 5 has the same light emission function.

  In the light emitting device 25, the light emitting unit 5 in which the LED chip 4 is covered with the yellow phosphor portion 7 is used. Instead, as shown in FIG. A configuration in which the body film 10 is formed may be used as the light emitting unit 5. The phosphor film 10 (wavelength conversion section) is formed in a film shape using the same material as the resin and the yellow phosphor forming the yellow phosphor section 7.

[Manufacture of light-emitting devices]
The light emitting device 25 configured as described above can be manufactured in the same manner as the light emitting device 23 described above.

  However, the process of forming the blue phosphor light-emitting part 11, the green phosphor light-emitting part 12, and the red phosphor light-emitting part 13 is added simultaneously with or before or after the process of forming the yellow phosphor part 7.

[Light emission by light-emitting device]
As described above, the light emitting device 25 of the present embodiment is different in the configuration of the light emitting device 24 and the light emitting unit 5 described above. In the light emitting device 25, yellowish white light is emitted from all the light emitting units 5. A part of this white light is emitted from the on-chip recess 31.

  In addition, among the white light, a part of the light that travels inside the sealing resin portion 3 or is reflected by the flat portion 33 is part of the blue phosphor light emitting portion 11, the green phosphor light emitting portion 12, and the red fluorescence. The light enters the body light emitting unit 13. Thereby, the blue phosphor light emitting unit 11 is excited by the light of the light emitting unit 5 to emit blue light, and the green phosphor light emitting unit 12 is excited by the light of the light emitting unit 5 to emit green light, and the red phosphor light emitting unit. 13 emits red light when excited by the light of the light emitting section 5. These blue light, green light, and red light are each emitted from the interchip recess 32, and are similarly mixed with the light of the light emitting unit 5 emitted from the interchip recess 32. Therefore, the light emitted from the interchip recess 32 is a mixed color of the blue light, the green light, the red light, and the yellowish white light.

  Thus, since the blue phosphor light emitting unit 11, the green phosphor light emitting unit 12 and the red phosphor light emitting unit 13 are disposed between the adjacent light emitting units 5, by adjusting the concentration of each phosphor, It becomes easy to adjust the change of the luminescent color between the adjacent light emission parts 5. Further, since the blue phosphor light emitting unit 11, the green phosphor light emitting unit 12, and the red phosphor light emitting unit 13 are not combined with the LED chip 4, a light emitting function equivalent to the light emitting unit 5 is added without adding the LED chip 4. can do.

[Embodiment 6]
Embodiment 6 according to the present invention will be described below with reference to FIG.

  In addition, in this embodiment, about the component which has a function equivalent to the component in above-mentioned Embodiment 1-3, the same code | symbol is attached and the description is abbreviate | omitted.

  FIG. 8 is a side view showing the configuration of the light emitting device 26 according to the sixth embodiment.

  As shown in FIG. 8, the light emitting device 26 includes a printed circuit board 2, a sealing resin portion 3, three LED chips 4, three yellow phosphor portions 7, a blue phosphor light emitting portion 11, and green fluorescence. A body light emitting unit 12 and a red phosphor light emitting unit 13 are provided.

  In the light emitting device 26, the blue light emitting unit 11, the green phosphor light emitting unit 12, and the red phosphor light emitting unit 13 are formed not in the interchip recess 32 but in the interchip recess 32 as described above. However, the rest of the configuration is the same as that of the light emitting device 25.

[Manufacture of light-emitting devices]
The light emitting device 26 configured as described above is manufactured in the same manner as the light emitting device 25 described above except for the step of forming the blue phosphor light emitting portion 11, the green phosphor light emitting portion 12, and the red phosphor light emitting portion 13. be able to. In the step of forming the blue phosphor light-emitting portion 11, the green phosphor light-emitting portion 12, and the red phosphor light-emitting portion 13, the phosphor material is dispersed in the groove that becomes the interchip recess 32 in the original mold of the sealing resin portion 3. A translucent resin material is discharged from the dispenser to the interchip recess 32 so as to be continuous in a line.

[Light emission by light-emitting device]
As described above, the light-emitting device 26 of the present embodiment is different in the configuration of the light-emitting device 24 and the light-emitting unit 5 described above. In the light emitting device 26, yellow light white light is emitted from all the light emitting units 5. A part of this white light is emitted from the on-chip recess 31.

  Of the white light, light emitted from the inter-chip recess 32 is incident on the blue phosphor light emitting unit 11, the green phosphor light emitting unit 12, and the red phosphor light emitting unit 13. Thereby, the blue phosphor light emitting unit 11 is excited by the light of the light emitting unit 5 to emit blue light, and the green phosphor light emitting unit 12 is excited by the light of the light emitting unit 5 to emit green light, and the red phosphor light emitting unit. 13 emits red light when excited by the light of the light emitting section 5. These blue light, green light, and red light are mixed with the light of the light emitting section 5 emitted from the interchip recess 32. Therefore, from the interchip recess 32, mixed light of the above-described blue light, green light, red light and yellowish white light is obtained.

  Thus, since the blue phosphor light-emitting part 11, the green phosphor light-emitting part 12, and the red phosphor light-emitting part 13 are arranged in the interchip recess 32, the adjacent light emission can be achieved by adjusting the concentration of each phosphor. It becomes easy to adjust the change of the luminescent color between the parts 5. Further, since the blue phosphor light emitting unit 11, the green phosphor light emitting unit 12, and the red phosphor light emitting unit 13 are not combined with the LED chip 4, a light emitting function equivalent to the light emitting unit 5 is added without adding the LED chip 4. can do.

[Embodiment 7]
Embodiment 7 according to the present invention will be described below with reference to FIG.

  In the present embodiment, components having functions equivalent to those of the components in the above-described fourth embodiment are denoted by the same reference numerals and description thereof is omitted.

[Configuration of light emitting device]
FIG. 9A is a side view showing the configuration of the light emitting device 27 according to the seventh embodiment, and FIG. 9A is a side view showing the configuration of another light emitting device 27 according to the seventh embodiment.

[Configuration of light emitting device]
As shown in FIG. 9A, the light emitting device 27 includes a printed circuit board 2, three LED chips 4, a yellow phosphor portion 7, a green phosphor portion 8, a red phosphor portion 9, and a sealing. And a resin portion 40.

  The LED chip 4 shown at the left end in FIG. 9A is covered with a yellow phosphor portion 7 and is combined with the yellow phosphor portion 7 to constitute a light emitting portion 5. Further, the LED chip 4 shown in the center in FIG. 9A is covered with a green phosphor portion 8, and the light emitting portion 5 is configured in combination with the green phosphor portion 8. The LED chip 4 shown at the right end in FIG. 9A is covered with a red phosphor portion 9 and constitutes a light emitting portion 5 in combination with the red phosphor portion 9.

  The sealing resin portion 40 has a light emission surface 44 that faces the surface 2 a of the printed circuit board 2. On this light emitting surface 44, an on-chip concave portion 41, an inter-chip concave portion 42 and a flat portion 43 are formed.

  The on-chip concave portion 41 (first emitting portion) is formed just above each light emitting portion 5 in the same manner as the above-described chip upper concave portion 31 in the third embodiment.

  The inter-chip concave portion 42 (second emitting portion) is formed as a portion including a plurality of concave portions between the adjacent chip upper concave portions 41. Each recess is formed such that a cross section along the longitudinal direction of the printed circuit board 2 forms a V shape. In the inter-chip concave portion 42, the concave portion at the middle position of the adjacent chip upper concave portion 41 (the position equidistant from the adjacent chip upper concave portion 41 on the light emitting surface 44) is formed at the shallowest distance, and is away from the intermediate position. The recess is formed deeper.

  The inter-chip recess 42 is formed for the purpose of taking out the reflected light from the on-chip recess 41 and the direct light from the light emitting unit 5 to the outside, like the above-described inter-chip recess 32 in the third embodiment. In the inter-chip recess 42, the deeper the recess, the greater the amount of light that can be extracted to the outside. Therefore, the least amount of light can be extracted from the recess at the intermediate position, and the greater the amount of light that can be extracted.

  On the other hand, as shown in FIG. 9B, the light emitting device 28 includes a printed circuit board 2, three LED chips 4, a yellow phosphor portion 7, a green phosphor portion 8, a red phosphor portion 9, And a sealing resin portion 50. The light emitting device 28 is configured in the same manner as the light emitting device 27 except that the sealing resin portion 40 of the light emitting device 27 is replaced with a sealing resin portion 50. Therefore, only the sealing resin portion 50 will be described here.

  The sealing resin portion 50 has a light emitting surface 54 that faces the surface 2 a of the printed circuit board 2. On this light emitting surface 54, an on-chip recess 51, an inter-chip recess 52 and a flat portion 53 are formed.

  The on-chip concave portion 51 (first emission portion) is formed just above each light emitting portion 5 in the same manner as the above-described chip upper concave portion 41.

  The inter-chip concave portion 52 (second emission portion) is formed as a portion including a plurality of concave portions between the adjacent chip upper concave portions 51. Each recess is formed such that a cross section along the longitudinal direction of the printed circuit board 2 forms a V shape. In the inter-chip concave portion 52, the concave portion at the intermediate position of the adjacent chip upper concave portion 51 (equal distance from the adjacent chip upper concave portion 51 on the light emitting surface 54) is formed deepest, and is away from the intermediate position. The concave portion is formed shallower. That is, the inter-chip recess 52 is formed such that the depth of the recess with respect to the intermediate position is opposite to that of the inter-chip recess 42 described above.

  The inter-chip recess 52 is formed for the purpose of taking out the reflected light from the on-chip recess 51 and the direct light from the light emitting portion 5 to the outside, like the inter-chip recess 42 described above. In the inter-chip recess 52, contrary to the inter-chip recess 42, the amount of light that can be extracted from the recess at the intermediate position is the largest, and the amount of light that can be extracted decreases as the recess moves away from the intermediate position.

[Manufacture of light-emitting devices]
The light emitting devices 27 and 28 configured as described above can also be manufactured in the same manner as the light emitting device 24 described above.

[Light emission by light-emitting device]
As described above, the light-emitting device 27 of the present embodiment includes the light-emitting unit 5 configured similarly to the light-emitting unit 5 of the light-emitting device 24, and the sealing resin unit 40 is on the same chip as the above-described on-chip concave portion 31. A recess 41 is provided. However, the sealing resin portion 40 has an inter-chip concave portion 42 having a structure having a plurality of concave portions having different depths, unlike the inter-chip concave portion 32 described above.

  Thereby, the light quantity of the light radiate | emitted from the recessed part 42 between chips decreases, so that the intermediate position of the adjacent recessed part 41 on a chip | tip is adjoined. As a result, the closer to the above-described intermediate position, the smaller the amount of light extracted to the outside, so that the light color obtained by the color mixture of the light from the adjacent light emitting units 5 becomes lighter. Therefore, a gradation-like light emission pattern whose color changes more smoothly between the adjacent light emitting units 5 can be obtained.

  On the other hand, in the light emitting device 28 of the present embodiment, the inter-chip concave portion 52 of the sealing resin portion 50 has a plurality of concave portions whose depth relationship according to the position is opposite to the concave portion of the inter-chip concave portion 42 described above. ing.

  Thereby, the light quantity of the light emitted from the inter-chip concave portion 52 increases as the position approaches the intermediate position between the adjacent concave portions 51 on the chip. As a result, the closer to the above-mentioned intermediate position, the greater the amount of light extracted to the outside, so that the color of the light obtained by the color mixture of the lights of the adjacent light emitting units 5 becomes deeper. Therefore, a gradation-like light emission pattern whose color changes more smoothly between the adjacent light emitting units 5 can be obtained as a light emission pattern opposite to that of the light emitting device 27.

[Additional Notes]
The light emitting devices 21 to 28 in the above-described embodiments each have three or five LED chips 4, but the number is not limited, and it is sufficient that at least two LED chips 4 are provided. Therefore, the light emitting devices 21 to 28 need only have at least two light emitting units 5.

  Moreover, although the LED chip 4 provided in the light-emitting devices 21-28 was a blue LED chip, it is not limited to a blue LED chip. As the LED chip 4, an LED chip other than blue may be used according to the required emission color or the color of the phosphor to be combined.

  Furthermore, the structure provided immediately above the light emitting unit 5 and directly above the intermediate position between the adjacent light emitting units 5 is not limited to the chip upper recesses 31, 41, 51 and the interchip recesses 32, 42, 52. For example, instead of the chip top recesses 31, 41, 51 and the chip-to-chip recesses 32, 42, 52, projecting structures are used as the light emitting surfaces 1a, 30, 44, 50 of the sealing resin portions 1, 3, 40, 50. Also by forming in 54, an effect equivalent to that of the recess can be obtained.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope of the claims are also included in the technical scope of the present invention.

  Since the light-emitting device according to the present invention is a linear light-emitting device capable of emitting multicolor light, it can be suitably used for applications such as arranging a light-emitting device having a high light effect in a narrow area. is there.

DESCRIPTION OF SYMBOLS 1 Sealing resin part 1a Light emission surface 2 Printed circuit board 2a Surface 3 Sealing resin part 4 LED chip (semiconductor light emitting element)
5 Light emitting part 6 Red-green phosphor part (wavelength conversion part)
7 Yellow phosphor (wavelength converter)
8 Green phosphor part (wavelength conversion part)
9 Red phosphor part (wavelength conversion part)
10 Phosphor film (wavelength converter)
11 Blue phosphor light emitting part (wavelength conversion part)
12 Green phosphor light emitting part (wavelength conversion part)
13 Red phosphor light emitting part (wavelength conversion part)
21 to 28 Light emitting device 30 Light emitting surface 31 On-chip recess (first emitting portion)
32 Inter-chip recess (second emitting part)
33 Flat part 40 Sealing resin part 41 Recess on chip (first emitting part)
42 Inter-chip recess (second emitting part)
43 Flat part 44 Light emitting surface 50 Sealing resin part 51 Concave on chip (first emitting part)
52 Inter-chip recess (second emitting part)
53 Flat part 54 Light exit surface

Claims (8)

An elongated and linear substrate;
A semiconductor light emitting device disposed on the surface of the substrate at an interval in the longitudinal direction of the substrate;
A sealing resin portion for sealing so as to cover all of the semiconductor light emitting element;
A wavelength conversion unit that converts the wavelength of light of the semiconductor light emitting element inside or outside the sealing resin part,
The adjacent wavelength converters convert the wavelength of light of the semiconductor light emitting element so that the wavelengths of emitted light are different from each other.   The sealing resin portion emits a part of the light of the semiconductor light emitting element at a position facing the semiconductor light emitting element and reflects the other between the first emitting part adjacent to the first emitting part. The light-emitting device according to claim 1, further comprising: a second light-emitting portion that emits light reflected by the first light-emitting portion and light from the semiconductor light-emitting element.   3. The light emitting device according to claim 2, wherein the second emission unit reduces the amount of light emitted to the outside as it approaches an intermediate position between the adjacent first emission units.   4. The light emitting device according to claim 3, wherein the second emission unit has a plurality of concave portions that are deepest at the intermediate position and become shallower as the distance from the intermediate position increases.   5. The light emitting device according to claim 2, wherein each of the first emission part and the second emission part is a concave part having an inclined surface.   The light emitting device according to claim 2, wherein the wavelength conversion unit includes a phosphor that emits light when excited by light of the semiconductor light emitting element.   The light emitting device according to claim 6, wherein the wavelength conversion unit is disposed between the semiconductor light emitting elements adjacent to each other on the surface of the substrate.   The light emitting device according to claim 6, wherein the wavelength conversion unit is disposed in the second emission unit.