JP2013228269A - Heat flux measuring apparatus and heat flux measuring method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat flux measuring apparatus and a heat flux measuring method which suitably measure a heat flux even when a temporal change of an object temperature is small.SOLUTION: A surface 12a of a portion to be measured of an object 12 includes a thermal resistor 14, and on the basis of a difference ΔT(=T-T) between a temperature Tof the surface 12a of the portion to be measured and a temperature Tof a surface 14a of the thermal resistor 14, a heat flux q regarding a heat transfer from the surface 12a of the portion to be measured is calculated. Therefore, regardless of a temporal change of surface temperature of a portion to be measured, a heat flux regarding a heat transfer from the portion to be measured can be accurately measured.

Description

  The present invention relates to a heat flux measuring device and a heat flux measuring method, and more particularly, to an improvement for suitably measuring a heat flux even when a time change of an object temperature is small.

  A heat flux measurement technique for measuring a heat flux related to heat transfer from an object to be measured is known. For example, the method for measuring the heat flux distribution on the surface of an object using the temperature-sensitive paint described in Patent Document 1 is that. This technology measures heat flux related to heat transfer from an object (object to be measured) using a temperature-sensitive paint that changes according to temperature when irradiated with excitation light, and the temperature-sensitive paint is applied. The emission intensity when the object surface is irradiated with excitation light is stored as image data, the temperature of the object is obtained from the image data using the light intensity and temperature calibration characteristics, and the heat flux is measured from the change in temperature over time. Is.

JP 2004-212193 A

  However, since the conventional technique measures the heat flux based on the time change related to the temperature of the object, the heat flux is accurately determined when the time change of the temperature of the object being measured is small. There was a problem that it could not be measured. Such a problem was newly found in the process of continuing the intensive research by the present inventors with the intention of improving the heat flux measurement technique.

  The present invention has been made in the background of the above circumstances, and the object of the present invention is to provide a heat flux measuring device and a heat flux measuring method for suitably measuring the heat flux even when the time change of the object temperature is small. Is to provide.

  In order to achieve such an object, the gist of the first aspect of the present invention is a heat flux measuring device for measuring a heat flux related to heat transfer from an object to be measured, which is a part to be measured in the object to be measured. A heat resistor is provided on the surface of the substrate, and a heat flux related to heat transfer from the surface of the measured region is calculated based on a difference between the surface temperature of the measured region and the surface temperature of the thermal resistor. It is characterized by this.

  Thus, according to the first invention, a thermal resistor is provided on the surface of the part to be measured in the object to be measured, and the difference between the surface temperature of the part to be measured and the surface temperature of the thermal resistor is determined. Based on the calculation of the heat flux related to the heat transfer from the surface of the measurement site, the heat transfer from the measurement site does not depend on the time change of the surface temperature of the measurement site. The heat flux can be measured with high accuracy. That is, it is possible to provide a heat flux measuring device that suitably measures heat flux even when the time change of the object temperature is small.

  In order to achieve the above object, the gist of the second invention is a heat flux measuring device for measuring a heat flux related to heat transfer from an object to be measured, wherein the measurement site of the object to be measured is measured. A thermal resistor is provided on the surface, and the thermal resistor is provided with a thin part formed with a thickness smaller than the other part in a part thereof, and the surface temperature of the thin part, The heat flux relating to the heat transfer from the surface of the measurement site is calculated based on the difference from the surface temperature of the portion of the thermal resistor that is not the thin portion. In this way, it is possible to accurately measure the heat flux related to the heat transfer from the measurement site regardless of the time change of the surface temperature of the measurement site. That is, it is possible to provide a heat flux measuring device that suitably measures heat flux even when the time change of the object temperature is small.

  The gist of the third invention according to the first and second inventions is that the thermal resistor is formed in a plate shape having a circular peripheral edge. In this way, by suppressing the directivity in the surface temperature of the thermal resistance body with respect to the flow of the fluid around the surface of the object to be measured, it is related to the heat transfer from the part to be measured. The heat flux can be measured with higher accuracy.

  In order to achieve the above object, the gist of the fourth invention is a heat flux measuring method for measuring a heat flux related to heat transfer from an object to be measured, comprising: A thermal resistor is provided on the surface, and a heat flux related to heat transfer from the surface of the measurement site is calculated based on a difference between the surface temperature of the measurement site and the surface temperature of the thermal resistor. It is characterized by. In this way, it is possible to accurately measure the heat flux related to the heat transfer from the measurement site regardless of the time change of the surface temperature of the measurement site. That is, it is possible to provide a heat flux measurement method that suitably measures the heat flux even when the time change of the object temperature is small.

It is sectional drawing which shows roughly the structure of the heat flux measuring apparatus which is one Example of this invention. It is the top view which looked at the object and thermal resistor in the heat flux measuring apparatus of FIG. 1 from the direction perpendicular | vertical to the surface. It is a figure which shows an example of the verification apparatus for deriving the relationship used for the measurement by the heat flux measuring apparatus of FIG. 1, and is a top view which shows an outline schematically. FIG. 4 is an enlarged cross-sectional view taken along the line IV-IV in FIG. It is a figure which shows the temperature distribution concerning the flow direction of the air which is a fluid regarding the measurement result by the verification apparatus of FIG. It is a figure which shows the temperature distribution of the direction perpendicular | vertical to the flow of the fluid in a thermal resistor corresponding to the measurement result of FIG. It is a figure explaining calculation of the temperature of the object surface based on the measurement by the heat flux measuring apparatus of FIG. In the heat flux measuring apparatus of FIG. 1, it is a figure explaining the example which provided the heat resistor of another shape, and is sectional drawing containing the center of a heat resistor. In the heat flux measuring apparatus of FIG. 1, it is a figure explaining the example which provided the heat resistor of another shape, and is the top view seen from the central-axis direction of the heat resistor. It is process drawing explaining the principal part of the heat flux measuring method which is one Example of this invention.

  Preferably, the heat flux measuring device preferably has a relationship between a temperature difference between the surface temperature of the thermal resistor and the surface temperature of the object to be measured, and a heat flux corresponding to the temperature difference, obtained experimentally in advance. Based on (calibration associating temperature difference and heat flux as a pretreatment), the temperature difference between the surface temperature of the thermal resistor and the surface temperature of the object to be measured, which is measured by an infrared temperature sensor or the like, is converted into a heat flux. To do. Alternatively, based on the relationship between the temperature difference between the surface temperatures of a plurality of locations corresponding to the portions having different thickness dimensions in the thermal resistor, and the heat flux corresponding to the temperature difference, obtained in advance experimentally. The temperature difference of the surface temperature at a plurality of locations corresponding to the portions having different thickness dimensions in the thermal resistor measured by an infrared temperature sensor or the like is converted into a heat flux.

  The surface temperature of the thermal resistor is preferably the average temperature of the entire surface of the thermal resistor or the central portion (center in a plan view as viewed from the direction perpendicular to the surface). Preferably, the surface temperature of the object to be measured is a plurality of distances from the center of the thermal resistor (especially, the center of the circle when the thermal resistor is disk-shaped) on the surface of the object to be measured. This is the average value of the temperatures at the measurement points.

  In the heat flux measuring device, preferably, a black body paint is applied to the surface of the object to be measured and the surface of the thermal resistor provided on the surface. In the measurement of the heat flux by the heat flux measuring device, the temperature at the portion where the black body paint is applied is measured, and the heat flux related to the heat transfer from the surface of the object to be measured is calculated based on the measurement result. Is done.

  The thermal resistor is preferably made of a synthetic resin material such as polyimide having a low thermal conductivity and excellent heat resistance, or an inorganic material such as glass or ceramics, or a coating film having a known thickness dimension It is.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the drawings used for the following description, the dimensional ratios and the like of each part are not necessarily drawn accurately.

  FIG. 1 is a cross-sectional view schematically showing a configuration of a heat flux measuring apparatus 10 according to an embodiment of the present invention. FIG. 2 is a plan view of the object 12 and the thermal resistor 14 in the heat flux measuring device 10 of FIG. 1 as viewed from the direction perpendicular to the surface (the direction indicated by the arrow II in FIG. 1). The heat flux measuring device 10 of this embodiment measures the heat flux related to heat transfer (for example, convective heat transfer or heat radiation) from the object 12 that is the object to be measured, that is, the amount of heat per unit time in a unit area. As shown in FIG. 1, a thermal resistor 14 is provided on the surface 12 a of the measurement site in the object 12. The thermal resistor 14 is preferably formed in a plate shape having a circular periphery from a synthetic resin material such as polyimide having a low thermal conductivity and excellent heat resistance, or an inorganic material such as glass or ceramics. It has been done. In other words, the thermal resistor 14 preferably has a substantially disk shape having a predetermined thickness, but the peripheral edge thereof does not necessarily have to be a perfect circle. Depending on the specification, the periphery may be elliptical. The thermal resistor 14 is bonded to the surface 12a of the object 12 via an adhesive layer 16 such as a double-sided tape (preferably a silicone adhesive tape having high thermal conductivity), grease, adhesive, or the like. . That is, in the heat flux measuring apparatus 10 shown in FIG. 1, the thermal resistor 14 is attached to the surface 12 a of the object 12 via the adhesive layer 16. Preferably, the surface 12a of the object 12 and the surface 14a of the thermal resistor 14 are coated with a black body paint (paint for making the emissivity from the surface uniform) (not shown). The emissivities of the surface 12a and the surface 14a of the thermal resistor 14 are substantially equal.

  As shown in FIG. 1, the heat flux measuring device 10 includes an infrared temperature sensor 18. The infrared temperature sensor 18 is a well-known radiation thermometer that measures the temperature of an object by detecting infrared rays emitted from the object. At least the temperature of the surface 12a of the object 12 and the surface of the thermal resistor 14 are measured. It is provided at a position where the temperature of 14a can be measured. Preferably, it is provided at a position where the temperature of the surface 14a of the thermal resistor 14 and the temperature of the surface 12a of the object 12 around the thermal resistor 14 can be measured synchronously (substantially simultaneously). Preferably, at least the surface 12a of the object 12 and the surface 14a of the thermal resistor 14 are provided at positions where the temperature of the portion to which the black body paint is applied can be measured.

  Hereinafter, the principle of the heat flux measuring device 10 of the present embodiment configured as described above will be described. When there is a temperature difference between the object 12 and a fluid (for example, air) around the object 12, heat exchange is performed between the surface 12a of the object 12 and the fluid. The heat flux measuring device 10 calculates a heat flux related to heat transfer from the surface 12 a of the object 12. In the configuration shown in FIG. 1, if there is thermal conduction in the thickness direction (thickness direction) of the thermal resistor 14, a temperature gradient (non-uniform temperature distribution) occurs in the thickness direction of the thermal resistor 14. . That is, the temperature between the surface 14 a of the thermal resistor 14, that is, the surface on the opposite side to the adhesive layer 16 relating to the adhesion to the object 12, and the surface 14 b on the object 12 side, that is, the adhesive layer 16 side. A gradient occurs. Here, when the adhesive layer 16 has a thickness, a temperature gradient also occurs in the thickness direction of the adhesive layer 16, but the thickness dimension of the adhesive layer 16 is sufficiently reduced and the thermal conductivity is increased ( The temperature gradient in the adhesive layer 16 is almost negligible compared to the temperature gradient related to the thickness dimension of the thermal resistor 14 by configuring the thermal resistor 14 to be at least larger than the thermal conductivity of the thermal resistor 14.

  In the configuration in which the thermal resistor 14 is provided on the surface 12a of the object 12 as in the heat flux measuring device 10, the thickness of the thermal resistor 14 is changed according to the heat transfer from the surface 12a of the object 12. The temperature gradient in the vertical direction changes. Specifically, as the heat flux related to heat transfer from the surface 12a of the object 12 provided with the thermal resistor 14 is larger, the temperature gradient in the thickness direction of the thermal resistor 14 is larger, and from the surface 12a. The smaller the heat flux related to the heat transfer, the smaller the temperature gradient in the thickness direction of the thermal resistor 14. That is, in the steady state, the heat flux related to the heat transfer from the surface 12a of the object 12 provided with the thermal resistor 14 and the thickness direction of the thermal resistor 14 according to Fourier's law regarding heat transfer. The temperature gradient is approximately proportional. When the temperature gradient in the thickness direction of the adhesive layer 16 is negligible, it can be considered that the temperature of the surface 14b of the thermal resistor 14 on the object 12 side and the temperature of the surface 12a of the object 12 are substantially equal. it can.

  3 and 4 show the difference in temperature ΔT between the surface temperature of the object 12 and the surface of the thermal resistor 14 and the heat flux q corresponding to the temperature difference, which are used for the measurement by the heat flux measuring device 10. FIG. 3 is a diagram showing an example of a verification device 20 for deriving a relationship (corresponding relationship for calibration), FIG. 3 is a plan view schematically showing a rectangular longitudinal channel shape, and FIG. FIG. 4 is a cross-sectional view showing an enlarged view of IV-IV. In FIG. 3, the flow direction of the fluid is indicated by a white arrow, and a part of the housing 28 is cut away. As shown in these drawings, the test apparatus 20 is composed of a rectangular longitudinal fluid channel 22 and heating provided on one surface of the fluid channel 22 (the surface constituting the bottom in the example shown in FIG. 4). A surface 24, an electric heater 26 for heating the heating surface 24, and a casing 28 made of a material such as a heat insulating material are provided. The thermal resistor 14 is attached to a part of the heating surface 24 (the heat flux sensor mounting position shown in FIG. 3, that is, the part corresponding to the IV-IV sectional view) via an adhesive layer 16. As shown in FIG. 4, the surface temperature of the thermal resistor 14 and the surrounding heating surface temperature can be measured by the infrared temperature sensor 18 at the position where the thermal resistor 14 is provided in the test device 20. In addition, a window portion 30 made of a material such as germanium or sapphire that transmits infrared rays is provided in a part of the casing 28 (a part of the upper surface facing the heating surface 24 in FIG. 4). A black body paint (not shown) is applied to the heating surface 24 and the surface 14a of the thermal resistor 14 in the same manner as described above with reference to FIG. In the verification device 20 configured as described above, the heat flux q corresponding to the heat transfer from the heating surface 24 can be theoretically calculated, and the heating amount of the fluid in the fluid flow path 22 is determined as the heating area. The value divided by. Therefore, by performing the above-described measurement by the verification device 20, the correspondence between the ΔT and the heat flux q = f (ΔT) can be obtained experimentally.

FIG. 5 is a fluid regarding the result of measuring the surface temperature of the thermal resistor 14 (the temperature of the surface 14a) and the surface temperature of the heating surface 24 around the thermal resistor 14 using the test apparatus 20. It is a figure which shows the temperature distribution which concerns on the flow direction of air. The horizontal axis in FIG. 5 corresponds to the air flow direction on the central axis (center in plan view) of the thermal resistor 14. For convenience, the relative positional relationship between the air flow direction and the thermal resistor 14 is indicated by white arrows in FIG. In the example shown in the measurement result of FIG. 5, the surface temperature of the thermal resistor 14 has a distribution, that is, a temperature gradient in the flow direction of the fluid (air), and local heat transfer is performed on the leading edge side (upstream side of the fluid flow direction). The temperature is well low. However, if the average temperature of the entire surface of the heat resistor 14 and T _1, particularly it is not necessary to consider the relationship between the flow direction of the heat resistor 14 and the fluid, thereby simplifying the analysis. In general, since the temperature measurement area per pixel of the infrared temperature sensor differs depending on the distance between the measurement point and the thermometer, the specifications of the infrared thermometer, etc., the surface temperature T of the thermal resistor 14 is also eliminated in order to eliminate these effects. _It is preferable to calculate the heat flux with ₁ as the average temperature. FIG. 6 shows the temperature distribution in the direction perpendicular to the fluid flow in the thermal resistor 14 (the direction parallel to the heating surface 24 and perpendicular to the fluid flow direction) corresponding to the measurement result of FIG. FIG. As shown in FIG. 6, the surface temperature of the thermal resistor 14 is substantially constant in the direction perpendicular to the fluid flow.

On the premise of the above, the heat flux measuring device 10 of this embodiment shown in FIG. 1 and the like has the temperature T ₁ of the surface 12a of the object 12 and the surface 14a of the thermal resistor 14 measured by the infrared temperature sensor 18. calculating the heat flux q according to heat transfer from the surface 12a of the object 12 based on the temperature T _2. That is, a difference ΔT (= T ₁ −T ₂ ) between the temperature T ₁ of the surface 12 a of the object 12 measured by the infrared temperature sensor 18 and the temperature T ₂ of the surface 14 a of the thermal resistor 14 is calculated. Based on the calculated temperature difference ΔT from the relationship derived beforehand using the test device 20 shown in FIGS. 3 and 4 (correspondence relationship between ΔT and q = f (ΔT)), A heat flux q (= f (ΔT)) relating to heat transfer from the surface 12a of the measurement site is calculated. Here, the surface average temperature of the thermal resistor 14 is substantially equal to the center temperature of the thermal resistor 14 (center temperature in plan view). Therefore, the surface temperature T ₁ of the thermal resistor 14 may be the center temperature instead of the average temperature of the entire surface of the thermal resistor 14. In this way, the measurement can be made simpler. The surface temperature T ₂ of the object 12, for example, as shown in FIG. 7, to measure the temperature of the measuring point 32a~32d multiple distances from the center of the heat resistor 14 is equal to (in Fig. 7, four) The average value of the temperatures at each measurement point is preferably the surface temperature T _{2 of the} object 12. Wherein even if the temperature gradient is present in the surface direction of the surface 12a of the object 12 (the direction parallel to the surface 12a), by calculating the such average values as the surface temperature T ₂ of the object 12, the thermal resistor 14 The surface temperature of the object 12 in the vicinity of the center can be applied.

Thus, according to the present embodiment, the thermal resistor 14 is provided on the surface 12a of the measurement site of the object 12 that is the measurement object, and the temperature T ₁ of the surface 12a of the measurement site and the heat Based on the difference ΔT (= T ₁ −T ₂ ) from the temperature T ₂ of the surface 14 a of the resistor 14, the heat flux q relating to the heat transfer from the surface 12 a of the measurement site is calculated. The heat flux relating to the heat transfer from the measurement site can be accurately measured regardless of the time change of the surface temperature of the measurement site. That is, it is possible to provide the heat flux measuring device 10 that suitably measures the heat flux even when the time change of the temperature of the object 12 is small.

  Since the thermal resistor 14 is formed in a plate shape having a circular periphery, the surface 14a of the thermal resistor 14 is affected by the flow of fluid around the surface 12a of the object to be measured. By suppressing the directivity from occurring in the temperature, the heat flux relating to the heat transfer from the measurement site can be measured with higher accuracy.

  Next, another preferred embodiment of the present invention will be described in detail with reference to the drawings. In the following description, parts common to the embodiments are denoted by the same reference numerals and description thereof is omitted.

  8 and 9 are diagrams for explaining an example in which a thermal resistor 34 having a shape different from that of the thermal resistor 14 is provided on the surface 12a of the object 12 in the heat flux measuring apparatus 10, and FIG. FIG. 9 is a cross-sectional view including the center of the thermal resistor 34, and FIG. 9 is a plan view of the thermal resistor 34 as viewed from the central axis direction. As shown in these drawings, the thermal resistor 34 provided in the heat flux measuring device 10 of the present embodiment is provided with a thin portion 36 formed in a part of which is thinner than other portions. Is. That is, a thin portion 36 having a relatively thin thickness dimension and a thick portion 38 having a thickness dimension larger than the thin portion 36 by a predetermined value Δt are provided. 8 and 9 exemplify a thermal resistor 34 in which a thick portion 38 is provided at the central portion (portion including the center) and a thin portion 36 is provided at the peripheral portion (outer peripheral side) of the thick portion 38. However, a thermal resistor in which a thin portion 36 is provided in the center portion and a thick portion 38 is provided on the outer peripheral side thereof is also preferably used. The thermal resistor 34 is attached to the surface 12 a of the object 12 through the adhesive layer 16.

In the thermal resistor 34 having the above-described configuration, when heat conduction is performed in the thickness direction of the thermal resistor 34, there is a difference in thickness between the thin portion 36 and the thick portion 38. The surface temperatures of the surface 36a of the thin portion 36 and the surface 38a of the thick portion 38 are different. Therefore, with respect to the thermal resistor 34, the temperature difference ΔT ′ (= T ₁ ′ −T ₂ ′) between the temperature T ₁ ′ of the surface 36 a of the thin portion 36 and the temperature T ₂ ′ of the surface 38 a of the thick portion 38. ) And the heat flux q corresponding to the temperature difference are derived in advance by the verification device 20 or the like, and the temperature of the surface 36a of the thin portion 36 detected by the infrared temperature sensor 18 from the relationship. Based on the temperature difference ΔT ′ between T ₁ ′ and the temperature T ₂ ′ of the surface 38 a of the thick portion 38, the heat flux q relating to the heat transfer from the surface 12 a of the object 12 can be measured. Compared to the heat flux measuring device 10 having the thermal resistor 14 described above with reference to FIG. 1 and the like, the heat flux measuring device 10 having the thermal resistor 34 shown in FIG. In addition to being unaffected by temperature gradients, the surfaces 36a and 38a related to temperature detection are made of the same material, so the emissivity is the same, and temperature can be measured accurately with infrared rays without applying black body paint. There are advantages.

According to the present embodiment, the thermal resistor 34 is provided on the surface 12a of the part to be measured in the object 12 which is the object to be measured, and the thermal resistor 34 has another part, that is, a thick part 38 in a part thereof. are those having a thin portion 36 having a thickness dimension is formed thinner than the surface temperature T ₁ 'of the thin portion 36, the heat resistive element not its thin portion 36 in the 34 portion or thick portion 38 The heat flux q relating to the heat transfer from the surface 12a of the part to be measured is calculated based on the difference ΔT ′ (= T ₁ ′ −T ₂ ′) from the surface temperature T ₂ ′. It is. In this way, it is possible to accurately measure the heat flux related to the heat transfer from the measurement site regardless of the time change of the surface temperature of the measurement site. That is, it is possible to provide the heat flux measuring device 10 that suitably measures the heat flux even when the time change of the object temperature is small.

  Since the thermal resistor 34 is formed in a plate shape having a circular periphery, the surface temperature of the thermal resistor 34 with respect to the flow of fluid around the surface 12a to be measured. By suppressing the directivity from being generated, the heat flux related to the heat transfer from the measurement site can be measured with higher accuracy.

FIG. 10 is a process diagram for explaining the main part of the heat flux measuring method according to one embodiment of the present invention. First, in the first surface temperature measurement step P1, the infrared temperature sensor 18 measures (detects) the temperature T ₁ of the surface 12a of the object 12 to the temperature T ₁ ′ of the surface 36a of the thin portion 36. In parallel with the first surface temperature measurement step P1, in the second surface temperature measurement step P2, the infrared temperature sensor 18 causes the temperature T ₂ of the surface 14a of the thermal resistor 14 to the surface 38a of the thick portion 38 to be obtained. temperature T ₂ 'is measured (detected) in the. Next, in the temperature difference calculating step P3, the first temperatures T _{1 to} T ₁ ′ measured in the first surface temperature measuring step P1 and the second temperature T ₂ measured in the second surface temperature measuring step P2. or T ₂ 'difference between ΔT (= T ₁ -T ₂₎ to _{ΔT' (= T 1 '-T} 2') is calculated. Next, in the heat flux calculation step P4, the temperature differences ΔT (= T ₁ −T ₂ ) to ΔT ′ (= T ₁ ′ −T ₂ ) calculated in the temperature difference calculation step P3 based on a predetermined relationship. ′), A heat flux q relating to heat transfer from the surface 12a of the object 12 is calculated.

According to the present embodiment, the thermal resistor 14 is provided on the surface 12a of the measurement site in the object 12 that is the measurement object, and the surface temperature T _{1 of the} measurement site and the surface temperature of the thermal resistance 14 are measured. Since the heat flux q relating to the heat transfer from the surface 12a of the measurement site is calculated on the basis of the difference ΔT with respect to T ₂ , the measurement is performed regardless of the time change of the surface temperature of the measurement site. The heat flux related to heat transfer from the measurement site can be measured with high accuracy. That is, it is possible to provide a heat flux measurement method that suitably measures the heat flux even when the time change of the object temperature is small.

A thermal resistor 34 is provided on the surface 12a of the measurement site in the object 12 to be measured, and the thermal resistor 34 is a thin portion formed in a part of which is thinner than other parts. 36, and the difference ΔT ′ between the surface temperature T ₁ ′ of the thin portion 36 and the surface temperature T ₂ ′ of the thermal resistor 34 that is not the thin portion 36, that is, the thick portion 38. Based on this, the heat flux related to the heat transfer from the surface 12a of the measurement site is calculated, so that the heat transfer from the measurement site does not depend on the time change of the surface temperature of the measurement site. The heat flux can be measured with high accuracy. That is, it is possible to provide a heat flux measurement method that suitably measures the heat flux even when the time change of the object temperature is small.

  The preferred embodiments of the present invention have been described in detail with reference to the drawings. However, the present invention is not limited to these embodiments, and various modifications can be made without departing from the spirit of the present invention. Is.

  10: heat flux measuring device, 12: object (object to be measured), 12a: surface, 14, 34: thermal resistor, 14a: surface, 36: thin part, 36a: surface, 38: thick part (other parts) ), 38a: surface

Claims (4)

A heat flux measuring device for measuring a heat flux related to heat transfer from an object to be measured,
A thermal resistor is provided on the surface of the measurement site in the measurement object,
A heat flux measurement device that calculates a heat flux related to heat transfer from the surface of the measurement site based on a difference between the surface temperature of the measurement site and the surface temperature of the thermal resistor. A heat flux measuring device for measuring a heat flux related to heat transfer from an object to be measured,
A thermal resistor is provided on the surface of the measurement site in the measurement object,
The thermal resistor has a thin portion formed in a part thereof with a thickness dimension thinner than other portions,
A heat flux relating to heat transfer from the surface of the measurement site is calculated based on a difference between the surface temperature of the thin portion and the surface temperature of a portion of the thermal resistor that is not the thin portion. Heat flux measuring device.   The heat flux measuring device according to claim 1 or 2, wherein the thermal resistor is formed in a plate shape having a circular periphery. A heat flux measurement method for measuring a heat flux related to heat transfer from an object to be measured,
A thermal resistor is provided on the surface of the measurement site in the measurement object,
A heat flux measurement method, comprising: calculating a heat flux related to heat transfer from the surface of the measurement site based on a difference between the surface temperature of the measurement site and the surface temperature of the thermal resistor.

Images