JP2013226817A - Embossed film and motor using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide inexpensively an embossed film excelling in buckling resistance, without impairing heat resistance and electric insulation properties.SOLUTION: An embossed film has a biaxially oriented polyparaphenylene sulfide film in an outermost layer at least on one surface of a biaxially oriented thermoplastic resin film and has a thickness of 120-400 μm. When the thickness is expressed by T (μm) and the rigidity degree by S (mN×m), the thickness and the rigidity degree of the embossed film satisfy a formula S≥0.00007×T.

Description

  The present invention relates to an embossed film using a polyphenylene sulfide film, and more particularly to an embossed film suitable for use in electrical insulation of a motor.

  Polyphenylene sulfide film has excellent properties such as heat resistance, hydrolysis resistance, chemical resistance, flame retardancy, and electrical insulation, and is particularly suitable for electrical and electronic equipment, mechanical parts, automotive parts, etc. It is used.

  In recent years, polyphenylene sulfide films have been applied to electrical insulating materials by taking advantage of their high electrical insulation and heat resistance. For example, a composite film composed of polyphenylene sulfide / copolymerized polyphenylene sulfide / polyphenylene sulfide in which a polyphenylene sulfide film is combined to improve electrical insulation is disclosed (Patent Documents 1 and 2).

  Motors such as drive motors for hybrid cars and electric cars and air-conditioning compressor motors for automobiles have a high space factor expressed by the ratio of the coil cross-sectional area to the slot cross-sectional area for the purpose of downsizing and higher output. Such a design is required. As the space factor of the motor increases, the space for inserting the insulating material in the slot becomes narrower. However, the insulating material cannot be thinned in order to maintain electrical insulation, and as a result, the insulating material is inserted. The load at the time becomes large. When trying to apply the above conventional composite film as an insulating material for a high space factor motor, the composite film cannot withstand the load at the time of insertion, which has increased with the increase in the space factor, and buckling occurs. was there.

JP 2007-98941 A JP 2010-110898 A

  Accordingly, the object of the present invention is to solve this problem without impairing heat resistance and electrical insulation, and to provide an embossed film excellent in buckling resistance at a low cost.

The embossed film of this invention has the following means in order to solve said subject.
(1) An embossed film having a thickness of 120 μm or more and 400 μm or less having a biaxially oriented polyparaphenylene sulfide film as an outermost layer on at least one surface of a biaxially oriented thermoplastic resin film, wherein the thickness is T (μm), An embossed film characterized in that when the rigidity is S (mN · m), the thickness and the rigidity satisfy the following expressions.
S ≧ 0.00007 × T ²
(2) The embossed film according to (1), wherein the thickness and rigidity of the embossed film satisfy the following formula.
S ≦ 0.00012 × T ²
(3) The embossed film is characterized in that at least one side of the embossed film is embossed with a height ratio of 2.5% to 11.0% and an area ratio of 20% to 55%. The embossed film according to (1) or (2).
(4) The embossed film according to any one of (1) to (3), wherein a coefficient of dynamic friction is 0.35 or less.
(5) The embossed film is an embossed film formed by laminating a biaxially oriented polyparaphenylene sulfide film and a thermoplastic resin film, and the thickness of the outermost biaxially oriented polyparaphenylene sulfide film is 10 μm or more. The embossed film according to any one of (1) to (4), wherein the ratio of the thickness of the biaxially oriented polyparaphenylene sulfide film portion in the total thickness of the embossed film is 8% or more.
(6) The embossed film is formed by laminating a biaxially oriented polyparaphenylene sulfide film and a biaxially oriented copolymerized polyphenylene sulfide film without using an adhesive, (1) to (5) Embossed film.
(7) The embossed film according to any one of (1) to (6), wherein the thermal conductivity exceeds 0.130 W / (m · K).
(8) A motor using the embossed film according to any one of (1) to (7) as insulating paper.

  According to the present invention, an embossed film excellent in heat resistance, electrical insulation, and buckling resistance can be provided at a low cost.

  The present invention is an embossed film having a biaxially oriented polyparaphenylene sulfide film as an outermost layer on at least one surface of a biaxially oriented thermoplastic film. Polyparaphenylene sulfide resin has a faster crystallization speed than polyester resins such as polyethylene terephthalate and polyethylene naphthalate, so the polyparaphenylene sulfide film within the thickness range of the embossed film specified in the present invention is uniaxially or biaxially stretched. Then, since the film is torn and the production efficiency is deteriorated, it is necessary that the biaxially oriented polyparaphenylene sulfide film and the thermoplastic resin film are laminated.

  Here, as the biaxially oriented thermoplastic resin film used in the present invention, for example, a biaxially oriented polyparaphenylene sulfide film, a biaxially oriented copolymerized polyphenylene sulfide film, a biaxially oriented polyester film, or the like can be used. Biaxially oriented polyparaphenylene sulfide film and biaxially oriented copolymerized polyphenylene sulfide film are preferably used from the viewpoint of compatibility, and without using an adhesive by thermal fusion with the biaxially oriented polyparaphenylene sulfide film provided on the outermost layer. A biaxially oriented copolymer polyphenylene sulfide film is more preferably used because it can be laminated.

  Here, the polyparaphenylene sulfide refers to a polymer containing 85 mol% or more of paraphenylene sulfide units represented by the following structural formula as the main repeating unit of the polymer, preferably 90 mol% or more, more preferably 98 mol%. The above is the paraphenylene sulfide unit. If this component is less than 85 mol%, the crystallinity, softening point, etc. of the polymer may be lowered, and heat resistance, dimensional stability, mechanical properties, etc. may be impaired.

  In the polymer composed of polyparaphenylene sulfide, the repeating unit other than paraphenylene sulfide is preferably a repeating unit containing a phenylene sulfide structure other than the paraphenylene sulfide structure. However, as long as the object of the present invention is not impaired, Repeating units may be used. The mode of copolymerization may be random copolymerization or block copolymerization.

  The biaxially oriented polyparaphenylene sulfide film is preferably composed of polyparaphenylene sulfide, but other components such as poly (polyphenylene sulfide) may be used in a range of less than 10% by mass of the total mass without impairing the object of the present invention. Additives such as polymers other than paraphenylene sulfide, inorganic or organic fillers, lubricants, colorants, ultraviolet absorbers, and compatibilizers can be included. Examples of polymers other than polyparaphenylene sulfide include various polymers such as polyamide, polyetherimide, polyethersulfone, polysulfone, polyphenylene ether, polyester, polyarylate, polyamideimide, polycarbonate, polyolefin, polyetheretherketone, and the like. Examples of the inorganic filler include, for example, silica, alumina, calcium carbonate, barium carbonate, barium titanate, barium sulfate, calcium silicate, magnesium oxide, titanium oxide, and oxide. Examples of inorganic fillers and organic fillers such as zinc include fillers of organic polymer compounds that do not melt at 300 ° C. (eg, crosslinked polystyrene).

  The biaxially oriented polyparaphenylene sulfide film may be subjected to any processing such as heat treatment and surface treatment as necessary.

  The melting point of polyparaphenylene sulfide constituting the biaxially oriented polyparaphenylene sulfide film is preferably 260 ° C. or higher and 300 ° C. or lower, more preferably 270 ° C. or higher and 300 ° C. or lower, and further preferably 280 ° C. or higher and 290 ° C. or lower. is there. If it is less than 260 degreeC, the heat resistance as a composite film may not be enough, and if it exceeds 300 degreeC, the load of the extruder at the time of melt film formation may become large.

  Here, the copolymerized polyphenylene sulfide is polyphenylene sulfide having a phenylene sulfide unit as a main repeating unit. The main meaning is that 100 mol% of the polyphenylene sulfide is preferably a repeating unit containing a phenylene sulfide structure, but other repeating units are contained in an amount of about 10 mol% or less as long as the object of the present invention is not impaired. This means that it can be used. The melting point of the copolymerized polyphenylene sulfide can be adjusted by copolymerizing repeating units other than the paraphenylene sulfide unit.

  Specific examples of structural units other than the paraphenylene sulfide units used in the copolymerized polyphenylene sulfide include biphenylene sulfide units, biphenylene ether sulfide units, biphenylene sulfone sulfide units, biphenylene carbonyl sulfide units, naphthalene sulfide units, and the like. It is preferable that a metaphenylene sulfide unit represented by the following formula is copolymerized. The copolymerization amount of the metaphenylene sulfide unit is preferably 5 mol% or more and 20 mol% or less, more preferably 5 mol% or more and 15 mol% or less. By using 5 mol% or more of metaphenylene sulfide units, high interfacial adhesion can be obtained. In addition, as the structural unit other than the paraphenylene sulfide unit, a plurality of types of structural units may be used. Further, it may be a block copolymer or a random copolymer.

  The biaxially oriented copolymer polyphenylene sulfide film is less than 10% by mass of the total mass of each layer as long as the object of the present invention is not impaired, and other components such as polymers other than polyphenylene sulfide, inorganic or organic fillers, lubricants, coloring Additives such as an agent, a UV absorber, and a compatibilizer can be included. Examples of polymers other than polyphenylene sulfide include various polymers such as polyamide, polyetherimide, polyethersulfone, polysulfone, polyphenylene ether, polyester, polyarylate, polyamideimide, polycarbonate, polyolefin, polyetheretherketone, and polymers of these polymers. Examples of the inorganic filler include silica, alumina, calcium carbonate, barium carbonate, barium titanate, barium sulfate, calcium silicate, magnesium oxide, titanium oxide, and zinc oxide. Examples of the inorganic filler and organic filler include fillers of organic polymer compounds (eg, crosslinked polystyrene) that do not melt at 300 ° C.

  The polyphenylene sulfide constituting the biaxially oriented copolymer polyphenylene sulfide film should have a melting point of 20 ° C. or more lower than that of the polyparaphenylene sulfide constituting the biaxially oriented polyparaphenylene sulfide film. Since the heat resistance of the processed film may be impaired, the melting point difference is preferably within 90 ° C, desirably within 60 ° C, and more desirably within 40 ° C. On the other hand, when the melting point difference is less than 20 ° C., sufficient interfacial adhesion may not be obtained when the biaxially oriented polyparaphenylene sulfide film and the biaxially oriented copolymerized polyphenylene sulfide film are heat-sealed. .

  As the biaxially oriented thermoplastic resin film of the present invention, a biaxially oriented polyester film can be used in addition to the above-mentioned biaxially oriented polyphenylene sulfide film and biaxially oriented copolymerized polyphenylene sulfide film. For example, polyethylene terephthalate or polyethylene A thermoplastic resin film made of -2,6-naphthalate can be suitably used. The polyester here is a general term for polymers having an ester bond as the main bond chain, and preferred polyesters include ethylene terephthalate, ethylene-2,6-naphthalate, butylene terephthalate, ethylene- What has as a main component at least 1 sort (s) of components chosen from (alpha), (beta) -bis (2-chlorophenoxy) ethane-4,4'-dicarboxylate etc. can be used. These constituent components may be used singly or in combination of two or more. Among them, it is particularly preferable to use a polyester having ethylene terephthalate as a main constituent in view of quality, economy and the like.

  These polyesters may be further partially copolymerized with other dicarboxylic acid components and diol components, preferably 20 mol% or less.

  According to JIS-K-7367 (2000) of the polyester described above, the intrinsic viscosity measured in o-chlorophenol at 25 ° C. is preferably 0.4 to 1.2 dl / g, more preferably 0.5 to 0.9 dl. / G.

  Further, in this thermoplastic resin, various additives such as antioxidants, heat stabilizers, weathering stabilizers, ultraviolet absorbers, organic lubricants, pigments, dyes, organic or inorganic fine particles, fillers, An antistatic agent, a nucleating agent, a crosslinking agent and the like may be added to such an extent that the characteristics are not deteriorated.

  The total thickness of the embossed film of the present invention is required to be 120 μm to 400 μm, preferably 150 μm to 350 μm, and more preferably 200 μm to 350 μm. If the total thickness is less than 120μm, the motor insulation film does not have sufficient rigidity and electrical insulation. If the total thickness exceeds 400μm, the rigidity is too high and it is molded into an insulating material such as a slot liner or wedge. May decrease. Further, in order to increase the thickness, a plurality of lamination processes are required as will be described later, and the manufacturing cost may be very expensive. In addition, although the embossing film of this invention is embossed, the total thickness shall be calculated | required as the maximum thickness from the vertex of the embossing protrusion on the surface of each film, ie, on the vertex reference | standard.

  The rigidity of the embossed film of the present invention is preferably from 1.10 mN · m to 14.00 mN · m from the viewpoint of moldability when the embossed film is processed into an insulating material, more preferably from 1.30 mN · m to 13. 00 mN · m or less, more preferably 1.50 mN · m or more and 12.00 mN · m or less.

When the total thickness of the embossed film of the present invention is T (μm) and the rigidity is S (mN · m), the relationship between the total thickness T and the rigidity S satisfies S ≧ 0.00007 × T ^2. is required, preferably satisfies S ≧ 0.000075 × ^{T 2,} it is further preferable to satisfy the S ≧ 0.00008 × ^{T 2.} If not satisfied S ≧ 0.00007 × T ^2, when inserting the embossed film as a slot liner or wedge to a high space factor of the motor, buckling occurs not withstand the load. The method is not particularly limited in order to make the relationship between the total thickness and the rigidity within the range specified in the present application. However, the method of imparting a specific embossed shape to the film surface does not sacrifice productivity and cost, and the rigidity Is easily adjusted to the above range.

  The emboss shape imparted here will be described in detail later, but the film is thermocompression bonded with embossing rolls engraved with projections such as square pillars, or with an embossing roll and a pressure-bonding roll with a flat surface. By transferring the projections of the square pillars of the roll onto the film surface, a concave shape is formed at the position corresponding to the projection of the embossing roll, and a concave and convex portion having a convex shape due to the rise of the resin generated when forming the concave shape around the concave shape is formed. That is.

Further, the relationship between the total thickness T and the degree of rigidity S is preferably that S ≦ 0.00012 × T ² from the viewpoint of improving the buckling resistance without impairing the electrical insulation of the embossed film, and S ≦ 0. it is more preferable to satisfy .000115 × ^{T 2,} it is more preferable to satisfy S ≦ 0.00011 × ^{T 2.}

  The height ratio of the embossing of the present invention is preferably 2.5% or more and 11.0% or less, more preferably 3.0% or more and 10.5% or less, and still more preferably 4.0% or more and 9.5. % Or less. When the height ratio is less than 2.5%, the rigidity of the film may be difficult to increase. When the height ratio exceeds 11.0%, the electrical insulation of the embossed film may be deteriorated. The height ratio here is expressed as a ratio of the height from the concave portion to the convex portion formed in the embossed film with respect to the total thickness.

Further, the area ratio of embossing is preferably 20% or more and 55% or less, more preferably 25% or more and 50% or less, and further preferably 30% or more and 45% or less. When the area ratio is less than 20%, the rigidity of the film may be difficult to increase, and when the area ratio exceeds 55%, the electrical insulation of the embossed film may be deteriorated. The area ratio here is represented by the ratio of the area of the concavo-convex portion formed per 1 cm ^{2 of} the embossed film.

  In the present invention, if the height ratio and the area ratio satisfy the preferred range at the same time, the rigidity is defined without sacrificing electrical insulation, moldability, productivity, and cost. This is preferable because it is easy to adjust the range.

  Here, although detailed conditions for imparting the embossed shape will be described later, the embossed film of the present invention has a sufficient amount of heat because the biaxially oriented polyparaphenylene sulfide film having extremely high heat resistance is located in the outermost layer. A method that requires pressure and is performed in a short time under conditions of high temperature and high pressure is preferable because the embossed shape can be obtained without impairing productivity and cost.

  The embossed film of the present invention may be embossed on one side or both sides. As the method, there are a method in which an embossing roll in which a protrusion is engraved and a pressure-bonding roll having a flat surface are provided on each surface for pressure bonding, and a method in which an embossing roll and an embossing roll are provided on each surface for pressure bonding. It is preferable to carry out on one side from the viewpoint of improving the workability of embossing and reducing the processing cost.

In addition, embossing is preferably performed on the entire surface of the film. When embossing is performed partially, the part that has not been embossed is locally weakened and cannot withstand the load during insertion and buckling. May occur. Here, the meaning of carrying out on the entire surface means a state in which an uneven shape is always present in an arbitrary 0.5 cm ² .

  The dynamic friction coefficient of the embossed film of the present invention is preferably 0.35 or less from the viewpoint of improving the transportability when the embossed film is automatically inserted into the motor and reducing the load during insertion, and more preferably 0.33 or less. More preferably, it is 0.31 or less. The lower limit of the dynamic friction coefficient is not particularly limited, but is generally about 0.20.

  The thickness of the biaxially oriented polyparaphenylene sulfide film located in the outermost layer of the embossed film of the present invention is preferably 10 μm or more from the viewpoint of improving the heat resistance of the embossed film, more preferably 12 μm or more, and still more preferably. Is 14 μm or more.

  In the present invention, the biaxially oriented polyparaphenylene sulfide film can be used for layers other than the outermost layer, but the thickness of the biaxially oriented polyparaphenylene sulfide film portion relative to the total thickness of the embossed film of the present invention The ratio is preferably 8% or more from the viewpoint of improving the heat resistance of the embossed film, more preferably 10% or more, and still more preferably 12% or more.

  The method of laminating the biaxially oriented polyparaphenylene sulfide film and the biaxially oriented thermoplastic resin film is not particularly limited, but a method of laminating without using an adhesive is preferably used, and in particular, biaxially oriented from the viewpoint of heat resistance. This is useful when laminating a polyparaphenylene sulfide film and a biaxially oriented copolymerized polyphenylene sulfide film. As a specific method, a heat sealing method described later is preferably used. Although the method of heat sealing | fusion is not specifically limited, From the point of process property, the heat sealing | fusion with a heating roll is preferable. As described above, it is difficult to obtain a film having a certain thickness or more with polyphenylene sulfide. When trying to obtain the thickness range of the embossed film of the present invention by the coextrusion method, poly (para) phenylene sulfide crystallizes and biaxial direction while cooling in the casting process during film formation is insufficient. If the film is stretched, the film will be broken. On the other hand, if the stretching is insufficient, sufficient orientation cannot be obtained and the rigidity becomes low. For this reason, this invention is made into the laminated | multilayer film which joined the some biaxially oriented film.

  Examples of the simplest configuration of the embossed film of the present invention include a three-layer configuration of biaxially oriented polyparaphenylene sulfide film / biaxially oriented copolymerized polyphenylene sulfide film / biaxially oriented polyparaphenylene sulfide film. In producing an embossed film of this configuration, a biaxially oriented polyparaphenylene sulfide film and a biaxially oriented copolymerized polyphenylene sulfide film may be separately produced and laminated. From the viewpoint of reduction, although a specific method will be described later, a polyparaphenylene sulfide and a copolymerized polyphenylene sulfide are coextruded to produce a biaxially oriented polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film, The biaxially oriented copolymer polyphenylene sulfide film side surface was laminated with the biaxially oriented polyparaphenylene sulfide film prepared separately (biaxially oriented polyparaphenylene sulfide film / biaxially oriented copolymerized polyphenylene sulfide film) / 2 How to a three-layer structure of oriented poly-p-phenylene sulfide film is preferably used.

  As another structural example, the polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented films were laminated on the surface on the biaxially oriented copolymerized polyphenylene sulfide film side (biaxially oriented polyparaphenylene sulfide film / Biaxially oriented copolymerized polyphenylene sulfide film) / (Biaxially oriented copolymerized polyphenylene sulfide film / Biaxially oriented polyparaphenylene sulfide film), and the above three-layer construction, polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextrusion Laminated biaxially oriented film, (biaxially oriented polyparaphenylene sulfide film / biaxially oriented copolymerized polyphenylene sulfide film) / biaxially oriented polyparaphenylene sulfide film / (biaxially A biaxially oriented polyester film is laminated between the polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film and the structure of (copolymerized polyphenylene sulfide film / biaxially oriented polyparaphenylene sulfide film). Examples include a configuration of axially oriented polyparaphenylene sulfide film / biaxially oriented copolymerized polyphenylene sulfide film) / biaxially oriented polyester film / (biaxially oriented copolymerized polyphenylene sulfide film / biaxially oriented polyparaphenylene sulfide film).

  The biaxially oriented polyparaphenylene sulfide film and the thermoplastic resin film may be laminated using an adhesive. When laminating using an adhesive, examples of the simplest configuration of the embossed film of the present invention include a configuration of biaxially oriented polyparaphenylene sulfide film / adhesive / biaxially oriented polyparaphenylene sulfide film. .

  As another structural example, a biaxially oriented polyparaphenylene sulfide film / adhesive / biaxially oriented polyparaphenylene sulfide film in which a biaxially oriented polyparaphenylene sulfide film is further laminated on the above structure via an adhesive / Composition of adhesive / biaxially oriented polyparaphenylene sulfide film and biaxially oriented polyparaphenylene sulfide film / adhesion in which a biaxially oriented polyester film is laminated via an adhesive between the biaxially oriented polyparaphenylene sulfide films The composition of an agent / biaxially oriented polyester film / adhesive / biaxially oriented polyparaphenylene sulfide film is included. Of course, the laminated structure of the embossed film of this invention is not limited to these.

  The embossed film of the present invention preferably has a dielectric breakdown voltage of 16.5 kV or more as a motor insulating film. More preferably, it is 17.0 kV or more, More preferably, it is 17.5 kV or more. The embossed film of the present invention preferably has a dielectric breakdown strength, which is a dielectric breakdown voltage per unit thickness, of 80 kV / mm or more as a motor insulating film. More preferably, it is 85 kV / mm or more, More preferably, it is 90 kV / mm or more.

The embossed film of the present invention preferably has a thermal conductivity exceeding 0.130 W / (m · K). Thermal conductivity is an index indicating the heat dissipation of the motor, and the higher this value, the better. When the heat dissipation property is low, heat is stored in the motor. However, the insulating film used in the motor has a limit in heat resistance, and deterioration of the insulating film is promoted, which is not preferable. The thermal conductivity is preferably 0.135 W / (m · K) or more, more preferably 0.140 W / (m · K) or more. In order to increase the thermal conductivity, it is preferable to increase the embossing height of the present invention or to increase the embossing area ratio. However, the embossing height is excessively increased or the embossing area ratio is increased. If it is too long, the electrical insulation property may be lowered, so that the above-described emboss height and the area ratio of the emboss are preferable.
The use of the embossed film of the present invention is not particularly limited, but can be used for various industrial materials such as electrical insulating materials, circuit board materials and process / release materials. It is suitably used as an electrical insulating material for drive motors and car air conditioner compressor motors used in electric vehicles.

  Next, the method for producing the embossed film of the present invention will be described in detail with specific examples.

  First, as an example of a method for producing a composite film having a biaxially oriented polyparaphenylene sulfide film as an outermost layer on at least one surface of a biaxially oriented thermoplastic resin film, a biaxially oriented polyparaphenylene sulfide film / biaxially oriented copolymer polyphenylene is used. A method for obtaining a composite film having a three-layer structure of sulfide film / biaxially oriented polyparaphenylene sulfide film will be described.

  When obtaining a composite film of this configuration, a biaxially oriented polyparaphenylene sulfide film and a biaxially oriented copolymerized polyphenylene sulfide film may be separately produced and laminated. From the viewpoint of reducing the processing cost, a method using a biaxially oriented polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film obtained by coextrusion of copolymerized polyphenylene sulfide and polyparaphenylene sulfide is preferably used.

  As a method of joining a biaxially oriented polyparaphenylene sulfide film and a polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film through a layer made of a copolymerized polyphenylene sulfide resin, a heat fusion method is simple. . As a method of heat fusion, for example, a method of heat fusion (thermocompression bonding) using a heating roll and a pressure roll is preferable. In order to obtain sufficient adhesive strength, the surface temperature of the heating roll is preferably 230 ° C. or more and 265 ° C. or less, more preferably 240 ° C. or more and 265 ° C. or less, and further preferably 245 ° C. or more and 260 ° C. or less. preferable. The surface temperature of the heating roll can be measured with a non-contact thermometer or a contact thermometer.

  In addition, the pressure-bonding roll is preferably made of a rubber material from the viewpoint of improving the surface properties of the composite film, and fluorine rubber, silicon rubber, or the like can be used, but is not limited thereto. The surface temperature of the pressure roll is preferably 180 ° C. or higher and 265 ° C. or lower, more preferably 190 ° C. or higher and 265 ° C. or lower, and further preferably 200 ° C. or higher and 260 ° C. or lower.

  The pressure during pressure bonding is preferably a linear pressure of 50 N / cm or more and 400 N / cm or less, more preferably 130 N / cm or more and 400 N / cm or less, and still more preferably 180 N / cm or more and 400 N / cm or less. It is preferable for obtaining sufficient adhesive strength between the biaxially oriented polyparaphenylene sulfide film and the polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film.

  When biaxially oriented polyparaphenylene sulfide film and polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film are heat-sealed, biaxially oriented polyparaphenylene sulfide film and polyparaphenylene sulfide / copolymerized polyphenylene in advance It is preferable that the sulfide coextruded biaxially oriented film is preheated and then heat-sealed. As a method of preheating the biaxially oriented polyparaphenylene sulfide film and the polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film, the holding angle on the outer periphery of the heating roll or pressure roll is 50 ° to 180 °, preferably In order to obtain sufficient adhesive strength, it is preferable to press and heat-bond after aligning at 60 ° to 180 °, more preferably 90 ° to 180 °.

  The composite film after pressure bonding is preferably heat-sealed along the outer periphery of the heating roll at an angle of 90 ° or more and 270 ° or less from the point where it is pressure-bonded to the heating roll by the pressure-bonding roll in terms of improving the adhesive strength. More preferably, the angle is 120 ° to 240 °, and still more preferably 150 ° to 210 °.

  The thermal fusion rate is 0.1 m / min to 10 m / min, preferably 0.5 m / min to 7 m / min, more preferably 1 m / min to 5 m / min, and even more preferably 2 m / min to 5 m. / Min or less is preferable from the viewpoint of adhesive strength and productivity.

  It is a preferable embodiment that the composite film after heat-sealing is immediately cooled below the glass transition temperature of polyparaphenylene sulfide from the viewpoint of maintaining the flatness and adhesive strength of the composite film. The method for cooling the composite film is not particularly limited, but a method of cooling using roll cooling or air cooling is used.

  In order to give stronger interfacial adhesion at the joint surface of the biaxially oriented polyparaphenylene sulfide film and polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film used in the present invention, Performing plasma treatment is also included in a preferred embodiment of the present invention. As the atmospheric gas during the corona discharge treatment, at least one gas selected from air (EC treatment), oxygen (OE treatment), nitrogen (NE treatment), carbon dioxide gas (CE treatment), and the like can be given. Among these, in the present invention, surface treatment by EC treatment is more preferable from the viewpoint of economy.

  Next, a method for producing a biaxially oriented polyparaphenylene sulfide film and a polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film will be described. As a method for obtaining a biaxially oriented polyparaphenylene sulfide film, a polyparaphenylene sulfide resin or a resin composition is supplied to a melt extrusion apparatus and heated to a melting point or higher. The resin composition melted by heating is pushed out from the slit-shaped die outlet. Such a melt is cooled on the cooling drum below the glass transition point to obtain an unstretched film. A well-known apparatus can be used as the melt extrusion apparatus, but a single-screw or twin-screw extruder is simple and preferably used.

  As described above, the polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film has a layer made of polyparaphenylene sulfide resin as one outermost layer in order to reduce the number of laminations required to obtain an embossed film. And a layer made of copolymerized polyphenylene sulfide resin on the opposite outermost layer. As a method of obtaining such a polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film, the polyparaphenylene sulfide resin and the copolymerized polyphenylene sulfide resin are laminated in the melting process so as to be the outermost layers, and discharged and cooled. Is preferably used. Each resin was supplied to a separate melt extrusion apparatus and heated above the melting point of each resin or resin composition, and each resin composition melted by heating was provided between the melt extrusion apparatus and the die outlet. Laminate in two or more layers in a molten state in a confluence apparatus. The laminated resin stream is extruded from a slit-shaped mouthpiece outlet, and the resulting molten composite is cooled on the cooling drum to below the glass transition point of the copolymerized polyphenylene sulfide resin or resin composition, and the polyparaphenylene sulfide resin is used. An unstretched film is obtained in which a layer made of a copolymer polyphenylene sulfide resin and a layer made of a copolymerized polyphenylene sulfide resin are arranged in the outermost layer.

  Next, each unstretched film obtained as described above is biaxially stretched to obtain a biaxially oriented film. As a stretching method of an unstretched film capable of biaxially orientating a biaxially oriented polyparaphenylene sulfide film and a polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film, a roll group and a tenter are used. Examples include a sequential biaxial stretching method in which stretching in the longitudinal direction and the width direction are sequentially performed, a simultaneous biaxial stretching method in which stretching in the longitudinal direction and the width direction are performed simultaneously, and among them, the sequential biaxial stretching method is preferable.

  When the sequential biaxial stretching method is used, it is preferably stretched in the longitudinal direction in the range of 90 ° C. or more and 120 ° C. or less and 3.0 or more and 4.0 or less. In the case of this invention, a more preferable draw ratio is 3.0 times or more and 3.7 times or less, More preferably, they are 3.0 times or more and 3.5 times or less. When the draw ratio is less than 3.0 times, a biaxially oriented film having sufficient film flatness may not be obtained. When the draw ratio exceeds 4.0 times, the embossed film of the present invention is stretched at break. Degree of strength and adhesive strength are reduced, and cracking or peeling may occur during processing of insulating materials such as slot liners and wedges. In the width direction, it is preferably stretched from 2.8 to 3.5 times at 90 to 120 ° C. More preferably, they are 2.8 times or more and 3.3 times or less, More preferably, they are 2.8 times or more and 3.0 times or less. If the draw ratio is less than 2.8 times, a biaxially oriented film having sufficient film flatness may not be obtained. If the draw ratio exceeds 3.5 times, the elongation at break and the adhesive strength are lowered. Because there are cases.

  After transverse stretching, the biaxially oriented film can be further heat treated. By applying heat treatment, the crystal structure is fixed, and a desirable rigidity and heat resistance can be obtained as a motor insulating film, and by reducing the heat shrinkage rate, the width shrinkage in the heat fusion process described later can be reduced. It can be suppressed. As the heat treatment, a one-step heat treatment or a two-step heat treatment is preferably used, and a two-step heat treatment is more preferably used. In the case of one-step heat treatment, the heat treatment temperature is preferably 240 ° C. or higher and 280 ° C. or lower, more preferably 260 ° C. or higher and 280 ° C. or lower, and the treatment time is preferably 1 second or longer and 60 seconds or shorter, more preferably 5 seconds or longer. 30 seconds or less. In the case of two-stage heat treatment, the heat treatment temperature of the first stage is preferably 160 ° C. or higher and 220 ° C. or lower, more preferably 180 ° C. or higher and 220 ° C. or lower, and the treatment time is preferably 1 second or longer and 30 seconds or shorter, more preferably Is from 1 second to 15 seconds. The second heat treatment temperature is preferably 240 ° C. or higher and 280 ° C. or lower, more preferably 260 ° C. or higher and 280 ° C. or lower, and the treatment time is preferably 1 second or longer and 30 seconds or shorter, more preferably 1 second or longer and 15 seconds or lower. Less than a second. Further, after the heat treatment, relaxation treatment can be performed in the range of 1% or more and 20% or less, more preferably 3% or more and 15% or less, and further preferably 3% or more and 10% or less in the longitudinal direction and / or the width direction. In this way, the relaxation of the orientation of the biaxially oriented copolymerized polyphenylene sulfide resin can be promoted, and the adhesive strength between the biaxially oriented polyparaphenylene sulfide film and the polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film can be increased. It is preferable because it can be improved.

  Next, a method for obtaining a resin and a resin composition necessary for obtaining a biaxially oriented polyparaphenylene sulfide film and a polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film will be described.

  Examples of a method for producing polyparaphenylene sulfide (hereinafter, polyparaphenylene sulfide may be abbreviated as PPS) resin include the following methods. Sodium sulfide and p-dichlorobenzene are reacted under high temperature and high pressure in an amide polar solvent such as N-methyl-2-pyrrolidone (hereinafter sometimes abbreviated as NMP). If necessary, a copolymer component such as trihalobenzene may be included. As a polymerization degree adjusting agent, caustic potash or alkali metal carboxylate is added, and a polymerization reaction is performed at a temperature of 230 to 280 ° C. After the polymerization, the polymer is cooled, and the polymer is filtered as a water slurry through a filter to obtain a granular polymer. This is stirred in an aqueous solution such as acetate at a temperature of 30 to 100 ° C. for 10 to 60 minutes, washed several times with ion exchange water at a temperature of 30 to 80 ° C. and dried to obtain a PPS granular polymer. The obtained granular polymer was washed with NMP at an oxygen partial pressure of 10 torr or less, preferably 5 torr or less, and then washed several times with ion-exchanged water at a temperature of 30 to 80 ° C. Separate unreacted monomers. If necessary, an inorganic or organic additive or the like is added to the polymer obtained above to the extent that the object of the present invention is not hindered to obtain a PPS resin.

  As a method for producing a copolymerized polyphenylene sulfide (hereinafter, copolymerized polyphenylene sulfide may be abbreviated as copolymerized PPS) resin, in the above-mentioned method for producing polyparaphenylene sulfide resin, m-dibenzene is used instead of p-dichlorobenzene. There is a method of blending a monomer that gives a phenylene sulfide unit such as chlorobenzene and carrying out a similar polymerization reaction. The same applies when units other than phenylene sulfide units are introduced.

  Next, the obtained resin is supplied to an extruder, preferably an extruder having one or more vent holes, melted and kneaded at a temperature of 290 to 360 ° C., extruded from a suitable die, and melt-formed into a gut shape. Further, it may be cut into a length of about 2 to 10 mm to form a pellet. The obtained resin is dried with a heating dryer under vacuum at a temperature of 100 to 180 ° C. for about 1 to 5 hours.

  When adding additives such as other resins, inorganic or organic fillers, lubricants, colorants, ultraviolet absorbers, compatibilizers, etc., if necessary, Henschel mixer etc. together with the resin obtained by the above method And extrusion molding or melt molding in the same manner as described above, and can be used as a resin composition.

  In the film forming process described above, a plurality of types of resin pellets can be used. For example, it is an aspect which uses together the pellet to which the particle | grains were added, and the pellet without an addition.

  The composite film obtained through the above steps is embossed. As a method for embossing, for example, a method in which a film is thermocompression bonded between embossing rolls with protrusions as described above or between an embossing roll and a pressing roll having a flat surface is preferable. In this respect, a method using an embossing roll and a pressure-bonding roll is more preferable.

  As for the shape of the protrusion of the embossing roll, shapes such as a quadrangular prism, a quadrangular frustum, a cylinder, and a truncated cone are used, but the shape is not limited thereto.

  In the embossed film of the present invention, the biaxially oriented polyparaphenylene sulfide film having very high heat resistance is located in the outermost layer, and therefore high temperature conditions are preferable to obtain the above-described embossed shape without impairing productivity and cost. . Therefore, the surface temperature of the embossing roll and the pressure-bonding roll is preferably 140 ° C. or higher and 260 ° C. or lower, more preferably 160 ° C. or higher and 250 ° C. or lower, and further preferably 200 ° C. or higher and 240 ° C. or lower. When the temperature of the heating roll is less than 140 ° C., a sufficient amount of heat for embossing cannot be obtained, and the above-described embossed shape may not be obtained. When the temperature exceeds 260 ° C., the orientation of the biaxially oriented polyparaphenylene sulfide film or the polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film is relaxed and the rigidity is lowered, or the heat shrinks. Wrinkles may occur during crimping. The surface temperature of the embossing roll and the pressure-bonding roll can be measured with a non-contact thermometer or a contact thermometer.

  Moreover, in order to obtain the embossed film of this invention, without impairing productivity and cost, the one where the pressure at the time of pressure bonding is high is preferable. The pressure at the time of pressure bonding is preferably in the range of 300 to 1700 N / cm, more preferably 500 to 1400 N / cm, and still more preferably 700 to 1100 N / cm. If it is less than 300 N / cm, a sufficient embossed shape may not be obtained. If it exceeds 1700 N / cm, the flatness of the embossed film may be impaired.

  The pressure roll is preferably made of a rubber material from the viewpoint of improving the flatness of the embossed film, and nitrile rubber, fluorine rubber, silicon rubber, or the like can be used, but is not limited thereto. The rubber hardness measured with a durometer based on JIS-K-6253 of the pressure roll is preferably 65 ° or more and 95 ° or less in order to obtain a sufficient embossed shape.

  The embossing speed is preferably 0.1 to 10 m / min, more preferably 0.3 to 5 m / min, and even more preferably 0.5 to 3 m / min to obtain productivity and a sufficient embossed shape. Therefore, it is preferable.

  The embossed film after being embossed is preferably cooled immediately below the glass transition temperature of polyparaphenylene sulfide from the viewpoint of maintaining the flatness of the embossed film. Although the method of cooling an embossed film is not specifically limited, The method of cooling using roll cooling, air cooling, etc. is used.

  In addition, as another method for producing the embossed film of the present invention, details of the configuration of the biaxially oriented polyparaphenylene sulfide film / biaxially oriented polyester film / biaxially oriented polyparaphenylene sulfide film will be described in detail with specific examples. explain.

  As a method for obtaining a biaxially oriented polyester film, a polyethylene terephthalate (hereinafter, polyethylene terephthalate may be abbreviated as PET) film will be described as an example, but the present invention is not limited thereto.

  A PET resin composition having an intrinsic viscosity of 0.5 to 0.9 dl / g is vacuum-dried, then supplied to a melt extrusion apparatus and heated to the melting point or higher. The resin composition melted by heating is pushed out from the slit-shaped die outlet. Such a melt is cooled on the cooling drum below the glass transition point to obtain an unstretched film. A well-known apparatus can be used as the melt extrusion apparatus, but a single-screw or twin-screw extruder is simple and preferably used.

  Next, the unstretched film obtained as described above is biaxially stretched to obtain a biaxially oriented film. Examples of the stretching method of the unstretched film that can orient the biaxially oriented polyethylene terephthalate film biaxially include the sequential biaxial stretching method and the simultaneous biaxial stretching method described above. preferable.

  When the sequential biaxial stretching method is used, it is preferably stretched in the range of 2.5 to 5.0 times in the longitudinal direction at 70 to 100 ° C. In the width direction, the film is preferably stretched by 70 to 150 ° C. and 2.5 to 5.0 times.

  After transverse stretching, the biaxially oriented film can be further heat treated. By applying heat treatment, the crystal structure is fixed, and a desirable rigidity and dielectric breakdown voltage can be obtained as a motor insulating film. Also, by reducing the thermal shrinkage rate, the width shrinkage in the dry laminating process described later can be reduced. Can be suppressed. The heat treatment temperature is preferably from 200 ° C. to 240 ° C., and the treatment time is preferably from 5 seconds to 40 seconds. Further, after the heat treatment, relaxation treatment can be performed in the range of 1% to 20%, more preferably 4% to 12% in the longitudinal direction and / or the width direction.

  Next, the obtained biaxially oriented polyethylene terephthalate film and the biaxially oriented polyparaphenylene sulfide film are laminated via an adhesive. Prior to lamination, the biaxially oriented polyethylene terephthalate film is preferably subjected to surface treatment such as corona discharge treatment, plasma treatment, and plier coat treatment on both sides, and the biaxially oriented polyparaphenylene sulfide film is subjected to surface treatment alone or in combination. .

  As a method of laminating, an adhesive is applied to one side of a biaxially oriented polyparaphenylene sulfide film (or biaxially oriented polyethylene terephthalate film), and after drying, a biaxially oriented polyethylene terephthalate film (or two Axial-oriented polyparaphenylene sulfide film) is bonded together. Next, the biaxially oriented polyparaphenylene sulfide film and the biaxially oriented polyethylene terephthalate film are laminated on one side of the biaxially oriented polyethylene terephthalate film side (or another biaxially oriented polyparaphenylene sulfide film side). Apply the same adhesive and dry, then use a heated roll or press to form another biaxially oriented polyparaphenylene sulfide film (or two layers of biaxially oriented polyparaphenylene sulfide film and biaxially oriented polyethylene terephthalate film) The most common method is to bond the body) so that the biaxially oriented polyethylene terephthalate film is the core.

  The adhesive used may be either a solvent-free or solvent-based adhesive, but a curable solvent-based adhesive is preferred from the viewpoint of heat resistance of the adhesive and workability for laminating the adhesive. The composition of the adhesive is not particularly limited, and polyurethane, acrylic, epoxy, polyester, modified polyolefin, and silicone adhesives can be used.

  The thickness of the adhesive is preferably 1 μm or more and 40 μm or less after curing, and if it is less than 1 μm, sufficient adhesive strength may not be obtained and may be peeled off when processed into an insulating material such as a slot liner or wedge, When exceeding 40 micrometers, the ratio of the adhesive agent to an embossed film becomes large, and the heat resistance of an embossed film may fall.

  As a coating method, a gravure roll method, a reverse roll coater method, or the like can be used. The conditions for drying the solvent after coating vary depending on the type of solvent used, usually depending on the type of solvent, and usually the condition that the residual solvent disappears completely at a temperature near the boiling point of the solvent and the curing of the adhesive is not accelerated. Is selected. The bonding is preferably performed at a temperature of 50 ° C. to 150 ° C. and a linear pressure of 1 kg / cm to 50 kg / cm.

[Measurement methods of physical properties and characteristics]
(1) Thickness The cross section of the embossed film cut out with a microtome is observed with an optical microscope (10 to 100 times) or a scanning electron microscope (100 to 2000 times), and a photograph is taken. The total thickness of the film and the thickness of each layer were measured. The same measurement was carried out at any five locations on the embossed film, and the average value was the total thickness of the embossed film and the thickness of each layer. In addition, about the surface which gave the embossing, the highest point of the convex part of embossing was made into the reference | standard of a measurement.

(2) Rigidity Using a TELEDYNE TABER stiffness tester (V-5 STIFFNESS TESTER Model 150-D), a sample film having a width of 38 mm and a length of 68 mm was sampled according to the method specified in JIS-P-8125. Was measured for the degree of rigidity when bent by 15 °. The same measurement was performed 10 times, and the average value was defined as the stiffness.

(3) Emboss height and height ratio A portion of the film surface on which the irregular shape can be visually confirmed is cut out with a microtome, and a cross section of the cut embossed film is observed with a scanning electron microscope (100 to 2000 times). It was formed by the bulge of the resin generated when forming the concave shape around the concave shape from the lowest point of the concave shape formed by projecting the projection of the embossing roll on the film surface from the dimensions of the cross-sectional photograph taken The distance to the highest point of the convex shape was measured. The same measurement was carried out at any five locations on the embossed film, and the average value was taken as the embossed height. Moreover, the ratio of the height of the embossing measured by the said method with respect to the whole thickness of the embossing film measured by the method of (1) was computed as the height ratio of embossing.

(4) Area ratio of embossing The embossed surface of the embossed film is observed with an optical microscope (10 to 100 times), a photograph is taken, and the protrusion of the embossing roll is transferred to the film surface from the dimensions of the surface photograph. The area of the concavo-convex part formed per 1 cm ² was measured by actually measuring the area of the concavo-convex part formed by the concave shape and the convex shape formed by the bulge of the resin generated when the concave shape was formed around the concave shape Was calculated as the area ratio of the emboss.

(5) Coefficient of dynamic friction Using a techno-needs sliding coefficient measuring device, sample films of 75 mm in width and 100 mm in length are subjected to the conditions of 200 g load according to the method prescribed in ASTM-D1894-63. The coefficient of dynamic friction when sliding 7 mm at a speed of 150 mm / min was measured. The same measurement was performed 5 times, and the average value was taken as the dynamic friction coefficient.

(6) Buckling resistance Using a slot cell inserter manufactured by Nittoku Engineering, an embossed film having a width of 40 mm and a length of 165 mm is processed into a slot liner shape and inserted into a 48-slot motor stator. Subsequently, using a coil winding machine manufactured by Nittoku Engineering Co., Ltd., the coil is wound by the distributed winding method so that the space factor, which is the ratio of the coil sectional area to the slot sectional area, becomes 65%. -Using a wedge insertion machine, the coil is inserted into the motor stator, an embossed film having a width of 10 mm and a length of 160 mm is processed into a wedge shape, and inserted into the motor stator. At this time, the slot liner and wedge in which buckling occurred were regarded as defective products, and the defective product occurrence rate was evaluated according to the following criteria. It should be noted that the number of processing is 5 as motors and 240 as slot liners and wedges.
◎: Defect rate is 1% or less ○: Defect rate is over 1% and 5% or less △: Defect rate is over 5% and 10% or less ×: Defect rate is over 10% (7) Heat resistance Espec hot air gear Using an oven (GPHH-200), a sample film having a width of 10 mm and a length of 250 mm was treated in an atmosphere of 200 ° C. for 40 hours, and elongation at break of 5 untreated sample films and 10 treated sample films In accordance with the method prescribed in JIS-C-2151, the degree is set so that the length between the width chucks becomes 100 mm using an Instron type tensile tester (AMF / RTA-1210 manufactured by Orientec Co., Ltd.). A tensile test is performed at a temperature of ° C and an atmospheric condition of 65% RH at a tensile speed of 200 mm / min. When the numerical value obtained by dividing the arithmetic average value of the breaking elongation of the sample film after the treatment by the arithmetic average value of the breaking elongation of the sample film before the treatment is the breaking elongation retention, the breaking elongation retention is expressed as follows: Evaluated by criteria.
◎: Breaking elongation retention is 80% or more ○: Breaking elongation retention is 50% or more and less than 80% Δ: Breaking elongation retention is 20% or more and less than 50% ×: Breaking elongation retention is less than 20% (8) Formability Using a slot cell insertion machine manufactured by Nittoku Engineering Co., Ltd., an embossed film with a width of 40 mm and a length of 165 mm is processed into a slot liner shape with a folding angle of 120 °. Was measured and the molding was evaluated according to the following criteria from the degree of maintenance of the bending angle. The number of processed parts is 100 as a slot liner.
○: Bending angle is 105 ° or more and 135 ° or less Δ: Bending angle is 90 ° or more and less than 105 ° ×: Bending angle is less than 90 ° (9) Dielectric breakdown voltage and dielectric breakdown strength Kasuga Electric 6-point AC withstand voltage test Breakdown voltage when an AC voltage with a frequency of 60 Hz is applied to a sample film with a width of 50 cm and a length of 75 cm using a machine, and an AC voltage with a frequency of 60 Hz is applied and boosted at a rate of 1 kV / sec. Was measured. Further, a value obtained by dividing the dielectric breakdown voltage measured by the above method by the total thickness of the embossed film measured by the method (1) was calculated as the dielectric breakdown strength.
(10) Thermal conductivity Embossed film is punched into a circle with a diameter of 50 mm, and several sheets are prepared. This was laminated so as to have a thickness of 1 mm or more, and measured with a Xenon lamp flash method at 25 ° C. using an LFA447 manufactured by Netch Co., and the thermal conductivity per thickness was determined.

  EXAMPLES Next, although an Example is given and this invention is demonstrated further in detail, it limits to a present Example and is not interpreted.

(1) Production of polyparaphenylene sulfide resin composition Into an autoclave, 100 mol parts of sodium sulfide nonahydrate, 45 mol parts of sodium acetate and 259 mol parts of N-methyl-2-pyrrolidone were charged and gradually stirred. The temperature was raised to 220 ° C. and the contained water was removed by distillation. To the system after the dehydration, 101 mol parts of p-dichlorobenzene as a main component monomer and 0.2 mol parts of 1,2,4-trichlorobenzene as an accessory component together with 52 mol parts of NMP were added, and 170 ° C. After pressurizing nitrogen at a temperature of 3 kg / cm ² , the temperature was raised and polymerization was carried out at 260 ° C. for 4 hours. After completion of the polymerization, the polymer was cooled, the polymer was precipitated in distilled water, and a small polymer was collected with a wire mesh having a 150 mesh opening. The small polymer thus obtained was washed five times with distilled water at 90 ° C. and then dried at 120 ° C. under reduced pressure to obtain a resin having a melting point of 280 ° C. and a glass transition temperature of 91 ° C. It was. Next, 0.7% by weight of calcium carbonate powder having an average particle size of 1.0 μm was added to the resin and uniformly dispersed and blended, and extruded into a gut shape at a temperature of 320 ° C. with a 30 mmφ twin-screw extruder, to obtain polyparaphenylene sulfide. A resin composition was obtained.

(2) Production of Copolymer Polyphenylene Sulfide Resin Composition 91 mol parts of p-dichlorobenzene as main component monomer, 10 mol parts of m-dichlorobenzene as subcomponent monomer, and 0.2 mol portion of 1,2,4 -A copolymer polyphenylene sulfide resin composition was produced in the same manner as in the production of the polyparaphenylene sulfide resin composition of (1) except that trichlorobenzene was used.

(3) Production of polyethylene terephthalate resin composition Using terephthalic acid as the acid component and ethylene glycol as the glycol component, added to the polyester pellets to obtain antimony trioxide (polymerization catalyst) so as to be 300 ppm in terms of antimony atoms Then, a polycondensation reaction was performed to obtain a polyethylene terephthalate resin composition having an intrinsic viscosity of 0.69 dl / g and a carboxyl end group amount of 37 equivalents / ton.

(4) Production of biaxially oriented film [biaxially oriented polyparaphenylene sulfide film 1]
The polyparaphenylene sulfide resin composition obtained in the above (1) was dried at a temperature of 180 ° C. for 4 hours under a reduced pressure of 3 mmHg using a rotary vacuum dryer. The dried resin composition was supplied to a single screw extruder and melted at 310 ° C. The melted resin composition was filtered through a stainless steel sintered filter having an average aperture of 14 μm, and then discharged from a T-die die having a width of 940 mm and a lip gap of 3 mm, and extruded into a sheet shape. Subsequently, this sheet was wound around a casting drum having a surface temperature of 25 ° C. by using an electrostatic application casting method, and was cooled and solidified to produce an unstretched film having a thickness of about 1250 μm.

Using sequential biaxial stretching, the unstretched film obtained was run in contact with a plurality of heating rolls having a surface temperature of 97 ° C., and the length was between a cooling roll of 25 ° C. having a different peripheral speed provided next to the heating roll. The film was stretched 3.7 times in the direction. The uniaxially stretched film thus obtained was stretched 3.4 times at a temperature of 100 ° C. in the direction perpendicular to the longitudinal direction using a tenter, followed by a temperature of 200 ° C. for 10 seconds and a temperature of 265 ° C. After 10 seconds of heat treatment at a temperature of 260 ° C. in the direction perpendicular to the longitudinal direction of the film, 5.0% limited shrinkage treatment is performed for 10 seconds, and further 115% limited shrinkage treatment is performed at 115 ° C. for 9 seconds. Then, the film was cooled to room temperature to obtain a film having a thickness of 100 μm.
[Biaxially oriented polyparaphenylene sulfide film 2]
A film was obtained in the same manner as the biaxially oriented polyparaphenylene sulfide film 1 except that the thickness was 50 μm.
[Biaxially oriented polyparaphenylene sulfide film 3]
A film was obtained in the same manner as the biaxially oriented polyparaphenylene sulfide film 1 except that the thickness was 115 μm.
[Biaxially oriented polyparaphenylene sulfide film 4]
A film was obtained in the same manner as the biaxially oriented polyparaphenylene sulfide film 1 except that the thickness was 16 μm.
[Biaxially oriented polyparaphenylene sulfide film 5]
A film was obtained in the same manner as the biaxially oriented polyparaphenylene sulfide film 1 except that the thickness was 9 μm.
[Biaxially oriented polyparaphenylene sulfide film 6]
A film was obtained in the same manner as the biaxially oriented polyparaphenylene sulfide film 1 except that the thickness was 12 μm.
[Polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film 1]
The polyparaphenylene sulfide resin composition and the copolymerized polyphenylene sulfide resin composition obtained in the above (1) and (2) were each obtained at a temperature of 180 ° C. under a reduced pressure of 3 mmHg using a rotary vacuum dryer. Let dry for hours. The dried polyparaphenylene sulfide resin composition 1 was supplied to a single screw extruder and melted at 310 ° C. Moreover, the dried copolymer polyphenylene sulfide resin composition was supplied to another vent type biaxial kneading extruder and melted at 280 ° C. The two melted resin compositions are each filtered through a stainless fiber sintered filter having an average opening of 8 μm, and then combined in a two-layer merge block having a rectangular composite part, and a T die having a 940 mm width and a lip gap of 3 mm. From the die, it was made to discharge so that ratio of discharge amount might be polyparaphenylene sulfide resin composition: copolymerization polyphenylene sulfide resin composition = 80: 20, and it extruded to the sheet form. Subsequently, this sheet was wound around a casting drum having a surface temperature of 25 ° C. by using an electrostatic application casting method and solidified by cooling to produce an unstretched laminated film having a thickness of about 950 μm.

Using sequential biaxial stretching, the obtained unstretched film was run in contact with a plurality of heating rolls having a surface temperature of 92 ° C., and longitudinally between 25 ° C. cooling rolls with different peripheral speeds provided next to the heating roll. The film was stretched 3.7 times in the direction. The uniaxially stretched sheet thus obtained was stretched 3.4 times at a temperature of 100 ° C. in the direction perpendicular to the longitudinal direction using a tenter, and then at a temperature of 200 ° C. for 10 seconds and further at a temperature of 250 ° C. After 10 seconds of heat treatment at 245 ° C in the direction perpendicular to the longitudinal direction of the film, 4.5% limiting shrinkage treatment is performed for 10 seconds at a temperature of 115 ° C, followed by intermediate cooling at 115 ° C for 9 seconds, followed by cooling to room temperature. A film having a thickness of 60 μm by the paraphenylene sulfide resin composition, a thickness of 15 μm by the copolymerized polyphenylene sulfide resin composition, and a total thickness of 75 μm was obtained.
[Polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film 2]
The ratio of the discharge amounts of the polyparaphenylene sulfide resin composition and the copolymerized polyphenylene sulfide resin composition obtained in the above (1) and (2) is the polyparaphenylene sulfide resin composition: copolymerized polyphenylene sulfide resin composition = 87. : 13 except that the layer thickness of the polyparaphenylene sulfide resin composition is 100 μm, the layer thickness of the copolymerized polyphenylene sulfide resin composition is 15 μm, and the total thickness is 115 μm. A film was obtained in the same manner as the extruded biaxially oriented film 1.
[Biaxially oriented polyethylene terephthalate film 1]
The PET resin composition obtained in (3) was dried at 160 ° C. for 2 hours under a reduced pressure of 20 mmHg using a rotary vacuum dryer. The dried resin composition was supplied to a single screw extruder and melted at 280 ° C. The molten resin composition was filtered through a stainless steel sintered filter having an average aperture of 25 μm, and then discharged from a T-die die having a width of 1240 mm and a lip gap of 4 mm, and extruded into a sheet shape. Next, this sheet was wound around a casting drum having a surface temperature of 20 ° C. using an electrostatic application casting method, and solidified by cooling to produce an unstretched film having a thickness of about 1250 μm.

Using sequential biaxial stretching, the obtained unstretched film is run in contact with a plurality of heating rolls having a surface temperature of 85 ° C., and is stretched between 25 ° C. cooling rolls having different peripheral speeds provided next to the heating roll. The film was stretched 2.8 times in the direction. The uniaxially stretched film thus obtained was stretched 3.3 times at a temperature of 135 ° C. in the direction perpendicular to the longitudinal direction using a tenter and subsequently heat treated at a temperature of 225 ° C. for 12 seconds, In the direction perpendicular to the direction, 1.0% limited shrinkage treatment is performed for 6 seconds at a temperature of 225 ° C., and further, 1.0% limited shrinkage treatment is performed for 6 seconds at a temperature of 220 ° C., and then cooled to room temperature. A film having a thickness of 188 μm was obtained.
[Biaxially oriented polyethylene terephthalate film 2]
A film was obtained in the same manner as the biaxially oriented polyethylene terephthalate film 1 except that the thickness was 125 μm.
[Biaxially oriented polyethylene terephthalate film 3]
A film was obtained in the same manner as the biaxially oriented polyethylene terephthalate film 1 except that the thickness was 350 μm.

(5) Manufacture of composite film [Composite film 1]
The biaxially oriented polyparaphenylene sulfide film 1 and the polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film 1 obtained by the film-forming method of (4) above were used as the polyparaphenylene sulfide / copolymerized polyphenylene sulfide. Extruded biaxially oriented film 1 / biaxially oriented polyparaphenylene sulfide film 1 / polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film 1 are laminated in this order, but the copolymerized polyphenylene sulfide layer is on the bonding surface side It was heat-sealed in the same manner. The heat fusion rate was 2.5 m / min. Using a hard chrome roll heated to a surface temperature of 250 ° C. as a heating roll, the polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film 1 is arranged so as to be in direct contact with the heating roll, Preheat along the outer periphery of the heating roll so that the holding angle to the crimping point is 90 degrees. Further, a fluororubber roll heated to a surface temperature of 200 ° C. is used as the pressure roll, and another polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film 1 is brought into direct contact with the pressure roll. And preheated along the outer periphery of the crimping roll so that the holding angle to the crimping point was 180 degrees. Between the polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film 1 on the heated roll side and the polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film 1 on the pressure roll side preheated by the above method. The biaxially oriented polyparaphenylene sulfide film 1 was placed and pressure-bonded between the heating roll and the pressure roll at a pressure of 230 N / cm. The bonded composite film is heat-sealed along the outer periphery of the heating roll so that the angle from the pressing point is 180 degrees, and then the composite film is pulled away from the heating roll. Immediately after that, cooling air of 25 ° C. was blown onto the composite film between the heating roll and the first transport roll to cool the temperature of the composite film to 80 ° C. Then, it wound up via the conveyance roll and obtained the composite film.

[Composite film 2]
The biaxially oriented polyparaphenylene sulfide film 2 and the polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film 1 obtained by the film forming method of (4) above are bonded to the copolymerized polyphenylene sulfide resin composition. It was heat-sealed so that it came to the side. The heat fusion rate was 4.0 m / min. Using a hard chrome roll heated to a surface temperature of 250 ° C. as a heating roll, the polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film 1 is arranged so as to be in direct contact with the heating roll, Preheat along the outer periphery of the heating roll so that the holding angle to the crimping point is 90 degrees. Also, a fluororubber roll heated to a surface temperature of 200 ° C. is used as the pressure roll, and the outer circumference of the pressure roll is adjusted so that the holding angle of the biaxially oriented polyparaphenylene sulfide film 2 to the pressure bonding point is 180 degrees. Preheated along. The polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film 1 and the biaxially oriented polyparaphenylene sulfide film 2 preheated by the above method were pressure-bonded between a heating roll and a pressure-bonding roll at a pressure of 230 N / cm. The bonded composite film is heat-sealed along the outer periphery of the heating roll so that the angle from the pressing point is 180 degrees, and then the composite film is pulled away from the heating roll. Immediately after that, cooling air of 25 ° C. was sprayed on the composite film between the heating roll and the first transport roll, and the temperature of the composite film was cooled to 60 ° C. Then, it wound up via the conveyance roll and obtained the composite film.

[Composite film 3]
Instead of the polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film 1, the polyparaphenylene sulfide / copolymerized polyphenylene sulfide coextruded biaxially oriented film 2 is replaced with the biaxially oriented polyparaphenylene sulfide film 1. A film was obtained in the same manner as the composite film 1 except that the biaxially oriented polyparaphenylene sulfide film 3 was used.

[Composite film 4]
One side of the biaxially oriented polyparaphenylene sulfide film 4 obtained by the film forming method of (4) was subjected to corona discharge treatment in air, and the surface wetting tension was set to 72 mN / m. Next, an adhesive was coated on the corona discharge treated surface of the biaxially oriented polyparaphenylene sulfide film 4 by a gravure roll method. As the adhesive, the following commercially available heat-resistant polyurethane adhesive was used. The mixing ratio of the main agent and the curing agent of “Ad Coat” TKS-9761 manufactured by Toyo Morton Co., Ltd. was set to the main agent: curing agent = 100: 10, and the solid content concentration was adjusted to 29% by weight using ethyl acetate as a solvent. The drying condition of the solvent was 40 ° C. for 40 seconds, and the thickness of the adhesive was adjusted to 7 μm after curing. Subsequently, it was bonded to the biaxially oriented polyethylene terephthalate film 1 obtained by the film forming method of (4) above using a subsequent roll laminator. The bonding conditions were 80 ° C. and linear pressure 4 kg / cm. Next, the corona-treated surface of another biaxially oriented polyparaphenylene sulfide film 4 is coated under the above conditions, and the biaxially oriented polyparaphenylene sulfide film 4 and the biaxially oriented polyethylene terephthalate film 1 obtained above are coated. It was bonded to the biaxially oriented polyethylene terephthalate film 1 side of the bilayer under the above conditions. The obtained composite film was cured at 40 ° C. for 48 hours, and further cured at 60 ° C. for 48 hours to obtain a film.

[Composite film 5]
A film was obtained in the same manner as the composite film 4 except that the biaxially oriented parapolyphenylene sulfide film 2 was used instead of the biaxially oriented polyparaphenylene sulfide film 4.

[Composite film 6]
Instead of the biaxially oriented polyparaphenylene sulfide film 4, the biaxially oriented parapolyphenylene sulfide film 5 is replaced with the biaxially oriented polyethylene terephthalate film 1 except that the biaxially oriented polyethylene terephthalate film 2 is used. A film was obtained in the same manner.

[Composite film 7]
Instead of the biaxially oriented polyparaphenylene sulfide film 4, the biaxially oriented parapolyphenylene sulfide film 6 was replaced with the biaxially oriented polyethylene terephthalate film 1, except that the biaxially oriented polyethylene terephthalate film 3 was used. A film was obtained in the same manner.

Example 1
The composite film 1 obtained by the laminating method (5) was embossed. The embossing speed was 1 m / min. A steel roll placed on the entire roll surface so that a 0.6 mm square as an embossing roll is convex with an area ratio of 35% and a height of 170 μm is heated so that the surface temperature is 220 ° C. Use. Also, a nitrile rubber roll (rubber hardness 80 °) heated to have a surface temperature of 220 ° C. is used as the pressure-bonding roll. The composite film 1 is preheated along the outer periphery of the crimping roll so that the holding angle to the crimping point is 60 degrees, and is crimped at a pressure of 800 N / cm between the embossing roll and the crimping roll, and is applied to the surface of the composite film. Embossed shape. Immediately afterwards, 25 ° C. cooling air was blown onto the embossed film to cool the embossed film to 50 ° C. Then, it wound up via the conveyance roll and obtained the embossed film. The embossed film obtained had an embossed height of 12.0 μm.

(Example 2)
An embossed film was obtained in the same manner as in Example 1 except that a steel roll having a height of 105 μm was used as the embossing roll. The embossed film obtained had an embossed height of 7.5 μm.

(Example 3)
An embossed film was obtained in the same manner as in Example 1 except that a steel roll having a height of 360 μm was used as the embossing roll. The embossed film thus obtained had an embossed height of 25.0 μm.

Example 4
An embossed film was obtained in the same manner as in Example 1 except that a steel roll having a height of 430 μm was used as the embossing roll. The embossed film obtained had an embossed height of 30.0 μm.

(Example 5)
An embossed film was obtained in the same manner as in Example 1 except that a steel roll having an area ratio of 25% was used as the embossing roll. The embossed film obtained had an embossed height of 12.0 μm.

(Example 6)
An embossed film was obtained in the same manner as in Example 1 except that a steel roll having an area ratio of 50% was used as the embossing roll. The embossed film obtained had an embossed height of 12.0 μm.

(Example 7)
An embossed film was obtained in the same manner as in Example 1 except that a steel roll having an area ratio of 60% was used as the embossing roll. The embossed film obtained had an embossed height of 12.0 μm.

(Example 8)
An embossed film was obtained in the same manner as in Example 1 except that a steel roll having an area ratio of 25% and a height of 105 μm was used as the embossing roll. The embossed film obtained had an embossed height of 7.5 μm.

Example 9
An embossed film was obtained in the same manner as in Example 1 except that a steel roll having an area ratio of 60% and a height of 430 μm was used as the embossing roll. The embossed film obtained had an embossed height of 30.0 μm.

(Example 10)
An embossed film was obtained in the same manner as in Example 1 except that a steel roll having an area ratio of 50% and a height of 70 μm was used as the embossing roll. The embossed film obtained had an embossed height of 5.0 μm.

(Example 11)
An embossed film was obtained in the same manner as in Example 1 except that a steel roll having an area ratio of 15% and a height of 360 μm was used as the embossing roll. The embossed film thus obtained had an embossed height of 25.0 μm.

(Example 12)
An embossed film was obtained in the same manner as in Example 1 except that the composite film 2 was used in place of the composite film 1 and a steel roll having an area ratio of 25% and a height of 50 μm was used as the emboss roll. The embossed film obtained had an embossed height of 3.5 μm.

(Example 13)
An embossed film was obtained in the same manner as in Example 12 except that a steel roll having an area ratio of 35% and a height of 70 μm was used as the embossing roll. The embossed film obtained had an embossed height of 5.0 μm.

(Example 14)
An embossed film was obtained in the same manner as in Example 12 except that a steel roll having an area ratio of 50% and a height of 170 μm was used as the embossing roll. The embossed film obtained had an embossed height of 12.0 μm.

(Example 15)
An embossed film was obtained in the same manner as in Example 12 except that a steel roll having an area ratio of 50% and a height of 215 μm was used as the embossing roll. The embossed film obtained had an embossed height of 15.0 μm.

(Example 16)
An embossed film was obtained in the same manner as in Example 12 except that a steel roll having an area ratio of 60% and a height of 215 μm was used as the embossing roll. The embossed film obtained had an embossed height of 15.0 μm.

(Example 17)
An embossed film was obtained in the same manner as in Example 1 except that the composite film 3 was used in place of the composite film 1 and a steel roll having an area ratio of 25% and a height of 140 μm was used as the emboss roll. The embossed film obtained had an embossed height of 10.0 μm.

(Example 18)
An embossed film was obtained in the same manner as in Example 17 except that a steel roll having an area ratio of 35% and a height of 215 μm was used as the embossing roll. The embossed film obtained had an embossed height of 15.0 μm.

(Example 19)
An embossed film was obtained in the same manner as in Example 17 except that a steel roll having an area ratio of 50% and a height of 500 μm was used as the embossing roll. The embossed film obtained had an embossed height of 35.0 μm.

(Example 20)
An embossed film was obtained in the same manner as in Example 17 except that a steel roll having an area ratio of 60% and a height of 500 μm was used as the embossing roll. The embossed film obtained had an embossed height of 35.0 μm.

(Example 21)
An embossed film was obtained in the same manner as in Example 17 except that a steel roll having an area ratio of 60% and a height of 570 μm was used as the embossing roll. The embossed film thus obtained had an embossed height of 40.0 μm.

(Example 22)
An embossed film was obtained in the same manner as in Example 1 except that the composite film 4 was used in place of the composite film 1. The embossed film obtained had an embossed height of 12.0 μm.

(Example 23)
An embossed film was obtained in the same manner as in Example 1 except that the composite film 5 was used in place of the composite film 1 and a steel roll having an area ratio of 25% and a height of 140 μm was used as the emboss roll. The embossed film obtained had an embossed height of 10.0 μm.

(Example 24)
An embossed film was obtained in the same manner as in Example 1 except that the composite film 6 was used in place of the composite film 1 and a steel roll having a height of 105 μm was used as the embossing roll. The embossed film obtained had an embossed height of 7.5 μm.

(Example 25)
An embossed film was obtained in the same manner as in Example 1 except that the composite film 7 was used instead of the composite film 1 and a steel roll having a height of 285 μm was used as the embossing roll. The embossed film obtained had an embossed height of 20.0 μm.

(Comparative Example 1)
An embossed film was obtained in the same manner as in Example 1 except that the biaxially oriented polyparaphenylene sulfide film 3 was used in place of the composite film 1 and a steel roll having a height of 70 μm was used as the embossing roll. The embossed film obtained had an embossed height of 5.0 μm.

(Comparative Example 2)
The composite film 1 was evaluated as it was without being embossed.

(Comparative Example 3)
An embossed film was obtained in the same manner as in Example 1 except that a steel roll having a height of 70 μm was used as the embossing roll. The embossed film obtained had an embossed height of 5.0 μm.

(Comparative Example 4)
An embossed film was obtained in the same manner as in Example 1 except that a steel roll having an area ratio of 15% was used as the embossing roll. The embossed film obtained had an embossed height of 12.0 μm.

(Comparative Example 5)
An embossed film was obtained in the same manner as in Example 1 except that a steel roll having an area ratio of 15% and a height of 70 μm was used as the embossing roll. The embossed film obtained had an embossed height of 5.0 μm.

(Comparative Example 6)
An embossed film was obtained in the same manner as in Example 12 except that a steel roll having an area ratio of 15% and a height of 35 μm was used as the embossing roll. The embossed film obtained had an embossed height of 2.5 μm.

(Comparative Example 7)
An embossed film was obtained in the same manner as in Example 12 except that a steel roll having an area ratio of 15% was used as the embossing roll. The embossed film obtained had an embossed height of 3.5 μm.

(Comparative Example 8)
An embossed film was obtained in the same manner as in Example 17 except that a steel roll having a height of 100 μm was used as the embossing roll. The embossed film thus obtained had an embossed height of 7.0 μm.

(Comparative Example 9)
An embossed film was obtained in the same manner as in Example 17 except that a steel roll having an area ratio of 15% and a height of 215 μm was used as the embossing roll. The embossed film obtained had an embossed height of 15.0 μm.

(Comparative Example 10)
An embossed film was obtained in the same manner as in Example 1 except that the biaxially oriented polyethylene terephthalate film 3 was used in place of the composite film 1 and a steel roll having a height of 215 μm was used as the embossing roll. The embossed film obtained had an embossed height of 15.0 μm.

  Table 1 shows the characteristics of the embossed films obtained from the examples and comparative examples.

  The film according to the present invention can be suitably used as a film for motor insulation.

Claims (8)

An embossed film having a total thickness of 120 μm or more and 400 μm or less having a biaxially oriented polyparaphenylene sulfide film as an outermost layer on at least one surface of the biaxially oriented thermoplastic resin film, the total thickness of the film being T (μm), An embossed film characterized in that the total thickness and the stiffness satisfy the following formulas when the stiffness is S (mN · m).
S ≧ 0.00007 × T ² The embossed film according to claim 1, wherein the total thickness and the rigidity of the embossed film satisfy the following expression.
S ≦ 0.00012 × T ² The embossed film having a height ratio of 2.5% to 11.0% and an area ratio of 20% to 55% is applied to the entire surface of at least one side of the embossed film. The embossed film according to 1 or 2. The embossed film according to any one of claims 1 to 3, wherein a coefficient of dynamic friction is 0.35 or less. The embossed film is an embossed film formed by laminating a biaxially oriented polyparaphenylene sulfide film and a biaxially oriented thermoplastic resin film, and the thickness of the outermost biaxially oriented polyparaphenylene sulfide film is 10 μm or more. The ratio of the thickness of the biaxially oriented polyparaphenylene sulfide film part which occupies for the total thickness of an embossed film is 8% or more, The embossed film in any one of Claims 1-4 characterized by the above-mentioned. The embossed film according to any one of claims 1 to 5, wherein the embossed film is formed by laminating a biaxially oriented polyparaphenylene sulfide film and a biaxially oriented copolymerized polyphenylene sulfide film without using an adhesive. Processed film. The embossed film according to any one of claims 1 to 6, wherein the thermal conductivity exceeds 0.130 W / (m · K). A motor using the embossed film according to claim 1 as insulating paper.