JP2013222914A - Liquid leakage prevention device and method, and liquid cooling system - Google Patents

Liquid leakage prevention device and method, and liquid cooling system Download PDF

Info

Publication number
JP2013222914A
JP2013222914A JP2012095291A JP2012095291A JP2013222914A JP 2013222914 A JP2013222914 A JP 2013222914A JP 2012095291 A JP2012095291 A JP 2012095291A JP 2012095291 A JP2012095291 A JP 2012095291A JP 2013222914 A JP2013222914 A JP 2013222914A
Authority
JP
Japan
Prior art keywords
liquid
joint
housing
refrigerant liquid
cooling system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012095291A
Other languages
Japanese (ja)
Inventor
Mitsuo Ishikura
光男 石倉
Nobuhiro Tamayama
信宏 玉山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2012095291A priority Critical patent/JP2013222914A/en
Priority to US13/778,694 priority patent/US20130277008A1/en
Publication of JP2013222914A publication Critical patent/JP2013222914A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F11/00—Arrangements for sealing leaky tubes and conduits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L21/00—Joints with sleeve or socket
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M3/00—Investigating fluid-tightness of structures
    • G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
    • G01M3/26—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors
    • G01M3/28—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for pipes, cables or tubes; for pipe joints or seals; for valves ; for welds
    • G01M3/2853—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for pipes, cables or tubes; for pipe joints or seals; for valves ; for welds for pipe joints or seals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M3/00—Investigating fluid-tightness of structures
    • G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
    • G01M3/26—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors
    • G01M3/32—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for containers, e.g. radiators
    • G01M3/3236—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for containers, e.g. radiators by monitoring the interior space of the containers
    • G01M3/3254—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for containers, e.g. radiators by monitoring the interior space of the containers using a flow detector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L2201/00—Special arrangements for pipe couplings
    • F16L2201/30—Detecting leaks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2230/00—Sealing means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/16—Safety or protection arrangements; Arrangements for preventing malfunction for preventing leakage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent a leakage liquid confined in a housing from spilling out and being scattered over surrounding electronic parts when a card board is withdrawn in the case where a liquid leaked from the connection of a joint in a liquid cooling system having a structure in which the joint is attached or detached simultaneously when the card board is inserted or removed.SOLUTION: The liquid cooling system includes a male joint 1 and a female joint 2, and housings 3 and 4 that fix those joints to each other. A water absorbing material 5 is provided on an inner wall of the housing 3 of the male joint 1, and a seal material 6 such as a rubber packing is provided on an inner wall of the housing 4 of the female joint 2. The liquid cooling system, provided with a liquid leakage detection function, stops the operation of a pump if liquid leakage is detected and prevents the liquid from being further leaked.

Description

本発明は、液漏れ防止装置及び方法、液冷システムに係り、特に、管継手の液漏れ防止構造及び、管継手の液漏れ防止構造を備えた、電子機器等に用いられる液漏れ防止装置及び方法、液冷システムに関する。
The present invention relates to a liquid leakage prevention device and method, and a liquid cooling system, and in particular, a liquid leakage prevention device for a pipe joint, and a liquid leakage prevention device for use in an electronic device or the like having a liquid leakage prevention structure for a pipe joint, and The present invention relates to a method and a liquid cooling system.

電子機器に用いられる半導体部品は、動作時に発熱する。半導体部品は、ある温度を超えると半導体としての機能が失われるため、これを冷却する必要がある。半導体部品を冷却する方法としては、空冷法が多く採用されているが、近年、半導体部品の高集積化が進み、発熱密度が増していることにより、冷却効率の高い液冷法が広まりつつある。
図２に、一般的な液冷システムの構成を示した概念図を示す。
液冷システムの基本構成について、図２を用いて説明する。液冷システムは、ポンプ１０１と、放熱部１０４、リザーブタンク１０２、受熱ジャケット１０３を備え、これら各部の間は、金属管やゴムチューブ等によって配管される。配管１０５内には、冷媒液が充填されており、ポンプ１０１によって冷媒液を循環させることで熱が輸送される。図２では、半導体部品等の発熱素子から発生した熱は、受熱ジャケット１０３を介して冷媒液に伝わり、ラジエータまで輸送される。放熱部１０４には、ラジエータ、冷却ファンが備えられており、空冷によってラジエータ内の冷媒液が冷却される仕組みである。リザーブタンク１０２は、冷却液を溜めておき、出力量を一定に保つ。

ところで、コンピュータ機器分野では、一つの筐体に複数の種類のカード基板を挿入することで、複数の機能を実現する電子機器が使用されている。このような電子機器において、液冷法を採用した例が特許文献１に記載されている。 Semiconductor components used in electronic devices generate heat during operation. Since a semiconductor component loses its function as a semiconductor when a certain temperature is exceeded, it must be cooled. As a method for cooling a semiconductor component, an air cooling method is often adopted. However, in recent years, a liquid cooling method having a high cooling efficiency is becoming widespread due to a high integration of semiconductor components and an increase in heat generation density. .
FIG. 2 is a conceptual diagram showing the configuration of a general liquid cooling system.
The basic configuration of the liquid cooling system will be described with reference to FIG. The liquid cooling system includes a pump 101, a heat radiating unit 104, a reserve tank 102, and a heat receiving jacket 103, and these parts are connected by a metal tube, a rubber tube, or the like. The pipe 105 is filled with a refrigerant liquid, and heat is transported by circulating the refrigerant liquid by the pump 101. In FIG. 2, heat generated from a heating element such as a semiconductor component is transmitted to the refrigerant liquid via the heat receiving jacket 103 and is transported to the radiator. The heat dissipating unit 104 includes a radiator and a cooling fan, and is a mechanism in which the refrigerant liquid in the radiator is cooled by air cooling. The reserve tank 102 stores the coolant and keeps the output amount constant.

By the way, in the computer equipment field, electronic devices that use a plurality of functions by inserting a plurality of types of card boards into one housing are used. An example of adopting a liquid cooling method in such an electronic device is described in Patent Document 1.

ここで、図３に、従来技術による液冷システムの例を示した概念図を示す。
以下に、特許文献１の構成例について図３を用いて説明する。筺体内部には、電子部品を搭載したカード基板９が複数枚搭載され、１枚のバックプレーン８に電気コネクタにより接続される。また、カード基板９には、複数搭載された発熱素子が１つの受熱ジャケット１０３に接続されている。さらに、この受熱ジャケット１０３は、継手を介して、冷媒液を循環するためのポンプ１０１、放熱部１０４（ラジエータ、ファン）と配管されており、発熱素子からの熱を輸送し、外気に放熱することができる。この装置構成によれば、搭載している一部の部品の故障やシステム異常の際、対象のカード基板９のみを引き抜き、保守することで、システム全体を停止することなく、サービスの提供が可能である。
Here, in FIG. 3, the conceptual diagram which showed the example of the liquid cooling system by a prior art is shown.
Below, the structural example of patent document 1 is demonstrated using FIG. A plurality of card substrates 9 on which electronic components are mounted are mounted inside the housing, and are connected to one backplane 8 by an electrical connector. A plurality of heating elements mounted on the card substrate 9 are connected to one heat receiving jacket 103. Further, the heat receiving jacket 103 is connected to a pump 101 for circulating the refrigerant liquid and a heat radiating unit 104 (radiator, fan) via a joint, and transports heat from the heat generating element and radiates it to the outside air. be able to. According to this device configuration, it is possible to provide services without stopping the entire system by pulling out and maintaining only the target card board 9 in the event of a failure of some of the installed components or a system malfunction. It is.

特開２００９−１５８６９号公報JP 2009-15869 A

特許文献１で使用される継手は、着脱時の液漏れ防止性が求められるため、次のような構造とされている。継手の内部には、オス側及びメス側双方にバルブが設けられており、継手が接続されていない時には、バルブが閉止状態となっている。他方、これらが接続されると、双方のバルブが開放状態となり、冷媒液を通流するようになる。


しかし、特許文献１のような従来の継手では、例えば、システムの作動時等において、カード基板の着脱を行う際、その着脱作業によって内部の冷媒液が外部に漏れること（液漏れ）を確実に防ぐことはできない場合が想定される。また、例えば、継手の着脱時にゴミ等の異物を噛み込んだ場合や、液密を封止するためのゴム製リング等が破損又は劣化した場合等、継手の接続部分から液漏れが生じ、電子機器の信頼性に影響を及ぼす可能性が想定される。 Since the joint used in Patent Document 1 is required to prevent liquid leakage during attachment and detachment, it has the following structure. Inside the joint, valves are provided on both the male side and the female side. When the joint is not connected, the valve is closed. On the other hand, if these are connected, both valves will be in an open state and the refrigerant liquid will flow through.


However, in the conventional joint as in Patent Document 1, for example, when the card board is attached / detached at the time of system operation or the like, it is ensured that the internal refrigerant liquid leaks to the outside (liquid leakage) by the attaching / detaching operation. The case where it cannot prevent is assumed. In addition, for example, when foreign matter such as dust is caught when attaching or detaching the joint, or when a rubber ring or the like for sealing the liquid tight is damaged or deteriorated, liquid leakage may occur from the connection part of the joint. The possibility of affecting the reliability of the equipment is assumed.

そこで、このような課題を解決する手段を以下に説明する。

図４は、継手の液漏れ防止構造を示した断面図で、オス継手とメス継手が嵌合する前の状態を示した断面図である。本例では、オス継手とメス継手をハウジングに固定しており、これらのハウジングは、両者が嵌合したときに、その状態を保持するためのロック機構（図示されない）を備える。また、双方のハウジングは、継手が嵌合したときに、接続部分がハウジングによって密閉される形状とし、さらに、メス継手のハウジング内壁には、ゴムパッキン等のシール材を備える。

図５は、継手の液漏れ防止構造を示した断面図で、上述のオス継手とメス継手が嵌合したときの状態を示した断面図である。継手が嵌合するとき、オス継手のハウジングでメス継手のハウジング内壁に取付けたシール材を押圧することにより、ハウジング内部の空間を密閉する。またこの時、ハウジングのロック機構（図示されない）が作動し、嵌合状態を保持することで、接続部分から液漏れが生じても、ハウジング外部への液漏れを防ぐことが可能である。
Therefore, means for solving such problems will be described below.

FIG. 4 is a cross-sectional view showing a liquid leakage prevention structure of the joint, and is a cross-sectional view showing a state before the male joint and the female joint are fitted. In this example, a male joint and a female joint are fixed to a housing, and these housings are provided with a lock mechanism (not shown) for maintaining the state when both are fitted. Further, both housings have a shape in which the connection portion is hermetically sealed by the housing when the joint is fitted, and the housing inner wall of the female joint is provided with a sealing material such as rubber packing.

FIG. 5 is a cross-sectional view showing a liquid leakage prevention structure of a joint, and is a cross-sectional view showing a state when the above-described male joint and female joint are fitted. When the joint is fitted, the space inside the housing is sealed by pressing the seal member attached to the inner wall of the female joint with the housing of the male joint. Further, at this time, the housing locking mechanism (not shown) is operated to maintain the fitted state, so that liquid leakage to the outside of the housing can be prevented even if liquid leakage occurs from the connection portion.

図４及び図５の継手の液漏れ構造も、上述のように、例えば、継手の着脱時にゴミ等の異物を噛み込んだ場合や、液密を封止するためのゴム製リング等が破損又は劣化した場合等、継手の接続部分から液漏れが生じ、電子機器の信頼性に影響を及ぼす可能性が想定される。
図６に、継手の液漏れ防止構造を示した断面図で、嵌合時に継手の接続部から液漏れが生じた後、オス継手とメス継手を離脱させた時の状態を表すものを示す。
このような継手１及び２は、もしも液漏れが生じた場合、ハウジング３及び４内部に液体を閉じ込める構造である。そのため、この状態からオス継手１を抜去すると、図６に示すように、ハウジング３及び４内に閉じ込めていた液体がこぼれ出し（漏水）、周囲の電子部品に飛散する可能性がある。

本発明は、以上のような点に鑑み、カード基板の挿抜と同時に、冷媒液用の継手が着脱される構造を有する液冷システムにおいて、継手の接続部から液漏れが生じた場合でも、外部への液漏れを生じることなく、カード基板の安全な挿抜が可能な構造を提供すること目的とする。
As described above, the liquid leakage structure of the joint shown in FIGS. 4 and 5 also includes, for example, a case where foreign matter such as dust is caught when the joint is attached or detached, or a rubber ring or the like for sealing the liquid tightness is damaged or In the case of deterioration or the like, there is a possibility that liquid leakage may occur from the connecting portion of the joint and affect the reliability of the electronic device.
FIG. 6 is a cross-sectional view showing a joint leakage prevention structure, and shows a state when a male joint and a female joint are separated after a liquid leak has occurred from the joint connection portion during fitting.
Such joints 1 and 2 have a structure in which liquid is confined inside the housings 3 and 4 if liquid leakage occurs. Therefore, when the male joint 1 is removed from this state, as shown in FIG. 6, the liquid confined in the housings 3 and 4 may spill out (leakage) and scatter to surrounding electronic components.

In view of the above points, the present invention provides a liquid cooling system having a structure in which a joint for a refrigerant liquid is attached and detached simultaneously with insertion / extraction of a card board, even when liquid leakage occurs from a joint connection portion. It is an object of the present invention to provide a structure capable of safely inserting and removing a card substrate without causing liquid leakage to the cardboard.

本発明に係る継手は、例えば、オス継手及びメス継手を備え、これらを固定するハウジングを有する。オス継手及びメス継手は、継手が接続されていない時には、流路が閉止し、他方、これらが接続されると、双方の流路が開放して冷媒液を通流することができる。また、ハウジングは、継手が嵌合したときに、継目部分がハウジングによって密閉されるような形状とすることができる。さらに、オス継手のハウジング内壁には吸水性ポリマーを備え、メス継手のハウジング内壁にはシール材を備える。

また液冷システムに液漏れを検知する機能を備えてもよい。さらに、液漏れを検知すると、ポンプの動作を停止し、それ以上の液漏れを防ぐことができる。
The joint according to the present invention includes, for example, a male joint and a female joint, and has a housing for fixing them. In the male joint and the female joint, when the joint is not connected, the flow path is closed. On the other hand, when they are connected, both flow paths are opened and the refrigerant liquid can flow. Further, the housing can be shaped such that the joint is sealed by the housing when the joint is fitted. Furthermore, the housing inner wall of the male joint is provided with a water-absorbing polymer, and the housing inner wall of the female joint is provided with a sealing material.

Further, the liquid cooling system may be provided with a function of detecting liquid leakage. Furthermore, when a liquid leak is detected, the operation of the pump can be stopped and further liquid leakage can be prevented.

本発明の第１の解決手段によると、
基板に搭載された電子部品を冷却するための受熱ジャケットに冷媒液を流すための管を接続する液コネクタの第１の継手と、
前記第１の継手に嵌合する、前記液コネクタの第２の継手と、
前記第１の継手を内部に固定する第１のハウジングと、
前記第１のハウジングに外側から嵌合し、前記第２の継手を内部に固定する第２のハウジングと、
前記第２のハウジングの内壁に設けられ、前記第１のハウジングと前記第２のハウジングが嵌合されたとき形成される空間内に、前記第１の継手と前記第２の継手との接続部分から漏れた冷媒液を閉じ込めるシール材と、
前記第１のハウジングの内壁に設けられ、前記空間内に閉じ込められた冷媒液を吸収する吸水材と
を備えた液冷システムにおける液漏れ防止装置が提供される。
According to the first solution of the present invention,
A first joint of a liquid connector for connecting a pipe for flowing a refrigerant liquid to a heat receiving jacket for cooling an electronic component mounted on the substrate;
A second joint of the liquid connector that fits into the first joint;
A first housing for fixing the first joint therein;
A second housing that fits into the first housing from the outside and fixes the second joint inside;
A connecting portion between the first joint and the second joint in a space provided on the inner wall of the second housing and formed when the first housing and the second housing are fitted together A sealing material for confining the refrigerant liquid leaked from,
There is provided a liquid leakage prevention device in a liquid cooling system provided with a water absorbing material that is provided on an inner wall of the first housing and absorbs a refrigerant liquid confined in the space.

本発明の第２の解決手段によると、
基板に搭載された電子部品を冷却するための受熱ジャケットに冷媒液を流すための管を、液コネクタの第１の継手により接続し、
前記液コネクタの第２の継手により、前記第１の継手に嵌合し、
第１のハウジングにより、前記第１の継手を内部に固定し、
第２のハウジングにより、前記第１のハウジングに外側から嵌合し、前記第２の継手を内部に固定し、
前記第２のハウジングの内壁に設けられ、前記第１のハウジングと前記第２のハウジングが嵌合されたとき形成される空間内に、前記第１の継手と前記第２の継手との接続部分から漏れた冷媒液を、シール材により閉じ込め、
前記第１のハウジングの内壁に設けられ、前記空間内に閉じ込められた冷媒液を、吸水材により吸収する
液冷システムにおける液漏れ防止方法が提供される。
According to the second solution of the present invention,
A pipe for flowing a refrigerant liquid to a heat receiving jacket for cooling an electronic component mounted on the substrate is connected by a first joint of the liquid connector;
The second joint of the liquid connector is fitted to the first joint,
The first housing fixes the first joint inside,
The second housing is fitted into the first housing from the outside, and the second joint is fixed inside,
A connecting portion between the first joint and the second joint in a space provided on the inner wall of the second housing and formed when the first housing and the second housing are fitted together The refrigerant liquid leaking from
A liquid leakage prevention method is provided in a liquid cooling system that is provided on an inner wall of the first housing and absorbs a refrigerant liquid confined in the space by a water absorbing material.

本発明の第３の解決手段によると、
バックプレーンへ挿入される又は前記バックプレーンから抜きとられる、電子部品を搭載した基板と、
前記電子部品を覆い取り付けられ、前記バックプレーンへの前記基板の挿入時に、内部に冷媒液が循環されて前記電子部品を冷却する受熱ジャケットと、
冷媒液を循環するポンプと、冷媒液を溜めるリザーブタンクと、冷媒液を冷却する放熱部と、
冷媒液の液漏れ防止装置と
を備え、

前記液漏れ防止装置は、
基板に搭載された電子部品を冷却するための受熱ジャケットに冷媒液を流すための管を接続する液コネクタの第１の継手と、
前記第１の継手に嵌合する、前記液コネクタの第２の継手と、
前記第１の継手を内部に固定する第１のハウジングと、
前記第１のハウジングに外側から嵌合し、前記第２の継手を内部に固定する第２のハウジングと、
前記第２のハウジングの内壁に設けられ、前記第１のハウジングと前記第２のハウジングが嵌合されたとき形成される空間内に、前記第１の継手と前記第２の継手との接続部分から漏れた冷媒液を閉じ込めるシール材と、
前記第１のハウジングの内壁に設けられ、前記空間内に閉じ込められた冷媒液を吸収する吸水材と
を有し、

前記基板は、前記バックプレーンに電気コネクタで接続され、且つ、前記基板上の前記受熱ジャケットは、前記バックプレーンに、前記第１及び第２の継手を有する前記液コネクタで接続され、
前記ポンプは、前記リザーブタンク、前記第１及び第２の継手を有する前記液コネクタ、前記受熱ジャケット、及び、前記放熱部を含む経路に、冷媒液を循環させて冷媒液を冷却するようにした液冷システムが提供される。
According to the third solution of the present invention,
A board with electronic components inserted into or removed from the backplane;
A heat receiving jacket that covers and attaches the electronic component, and cools the electronic component by circulating a coolant liquid therein when the substrate is inserted into the backplane.
A pump that circulates the refrigerant liquid, a reserve tank that stores the refrigerant liquid, a heat radiating unit that cools the refrigerant liquid,
A liquid leakage prevention device for refrigerant liquid,

The liquid leakage prevention device is
A first joint of a liquid connector for connecting a pipe for flowing a refrigerant liquid to a heat receiving jacket for cooling an electronic component mounted on the substrate;
A second joint of the liquid connector that fits into the first joint;
A first housing for fixing the first joint therein;
A second housing that fits into the first housing from the outside and fixes the second joint inside;
A connecting portion between the first joint and the second joint in a space provided on the inner wall of the second housing and formed when the first housing and the second housing are fitted together A sealing material for confining the refrigerant liquid leaked from,
A water absorbing material that is provided on the inner wall of the first housing and absorbs the refrigerant liquid confined in the space;

The substrate is connected to the backplane with an electrical connector, and the heat receiving jacket on the substrate is connected to the backplane with the liquid connector having the first and second joints,
The pump cools the refrigerant liquid by circulating the refrigerant liquid through a path including the reserve tank, the liquid connector having the first and second joints, the heat receiving jacket, and the heat radiating portion. A liquid cooling system is provided.

本発明の第４の解決手段によると、
バックプレーンへ挿入される又は前記バックプレーンから抜きとられる、電子部品を搭載した基板と、
前記電子部品を覆い取り付けられ、前記バックプレーンへの前記基板の挿入時に、内部に冷媒液が循環されて前記電子部品を冷却する受熱ジャケットと、
冷媒液を循環するポンプと、冷媒液を溜めるリザーブタンクと、冷媒液を冷却する放熱部と、
冷媒液の液漏れ防止装置と、
リザーブタンクの流入側と流出側に設けられた第１及び第２の流量センサと、
前記第１及び第２の流量センサの差分を監視することで、液漏れを検知する検出部と
を備え、

前記液漏れ防止装置は、
基板に搭載された電子部品を冷却するための受熱ジャケットに冷媒液を流すための管を接続する液コネクタの第１の継手と、
前記第１の継手に嵌合する、前記液コネクタの第２の継手と、
前記第１の継手を内部に固定する第１のハウジングと、
前記第１のハウジングに外側から嵌合し、前記第２の継手を内部に固定する第２のハウジングと、
前記第２のハウジングの内壁に設けられ、前記第１のハウジングと前記第２のハウジングが嵌合されたとき形成される空間内に、前記第１の継手と前記第２の継手との接続部分から漏れた冷媒液を閉じ込めるシール材と、
前記第１のハウジングの内壁に設けられ、前記空間内に閉じ込められた冷媒液を吸収する吸水材と、
を有し、

前記基板は、前記バックプレーンに電気コネクタで接続され、且つ、前記基板上の前記受熱ジャケットは、前記バックプレーンに、前記第１及び第２の継手を有する前記液コネクタで接続され、
前記ポンプは、前記リザーブタンク、前記第１及び第２の継手を有する前記液コネクタ、前記受熱ジャケット、及び、前記放熱部を含む経路に、冷媒液を循環させて冷媒液を冷却するようにした液冷システムが提供される。
According to the fourth solution of the present invention,
A board with electronic components inserted into or removed from the backplane;
A heat receiving jacket that covers and attaches the electronic component, and cools the electronic component by circulating a coolant liquid therein when the substrate is inserted into the backplane.
A pump that circulates the refrigerant liquid, a reserve tank that stores the refrigerant liquid, a heat radiating unit that cools the refrigerant liquid,
A liquid leakage prevention device for refrigerant liquid;
First and second flow rate sensors provided on the inflow side and the outflow side of the reserve tank;
A detector that detects a liquid leak by monitoring a difference between the first and second flow rate sensors;

The liquid leakage prevention device is
A first joint of a liquid connector for connecting a pipe for flowing a refrigerant liquid to a heat receiving jacket for cooling an electronic component mounted on the substrate;
A second joint of the liquid connector that fits into the first joint;
A first housing for fixing the first joint therein;
A second housing that fits into the first housing from the outside and fixes the second joint inside;
A connecting portion between the first joint and the second joint in a space provided on the inner wall of the second housing and formed when the first housing and the second housing are fitted together A sealing material for confining the refrigerant liquid leaked from,
A water absorbing material that is provided on the inner wall of the first housing and absorbs the refrigerant liquid confined in the space;
Have

The substrate is connected to the backplane with an electrical connector, and the heat receiving jacket on the substrate is connected to the backplane with the liquid connector having the first and second joints,
The pump cools the refrigerant liquid by circulating the refrigerant liquid through a path including the reserve tank, the liquid connector having the first and second joints, the heat receiving jacket, and the heat radiating portion. A liquid cooling system is provided.

本発明によれば、カード基板の挿抜と同時に、冷媒液用の継手が着脱される構造を持つ液冷システムにおいて、継手の接続部から液漏れが生じた場合でも、外部への液漏れを生じることなく、カード基板の安全な挿抜が可能である。
According to the present invention, in a liquid cooling system having a structure in which a joint for refrigerant liquid is attached and detached simultaneously with insertion and removal of a card substrate, even when liquid leakage occurs from a joint connection portion, liquid leakage to the outside occurs. It is possible to safely insert and remove the card substrate without any trouble.

本発明の実施形態１に係る継手の構造を示した断面図で、オス継手とメス継手が嵌合する前の状態を表す。It is sectional drawing which showed the structure of the coupling which concerns on Embodiment 1 of this invention, and represents the state before a male coupling and a female coupling fit. 一般的な液冷システムの構成を示した概念図。The conceptual diagram which showed the structure of the general liquid cooling system. 従来技術による液冷システムの例を示した概念図。The conceptual diagram which showed the example of the liquid cooling system by a prior art. 継手の液漏れ防止構造を示した断面図で、オス継手とメス継手が嵌合する前の状態を表す。It is sectional drawing which showed the liquid leakage prevention structure of the coupling | joint, and represents the state before a male coupling and a female coupling fit. 継手の液漏れ防止構造を示した断面図で、オス継手とメス継手が嵌合した後の状態を表す。It is sectional drawing which showed the liquid leakage prevention structure of the joint, and represents the state after a male joint and a female joint fitted. 継手の液漏れ防止構造を示した断面図で、嵌合時に継手の接続部から液漏れが生じた後、オス継手とメス継手を離脱させた時の状態を表す。It is sectional drawing which showed the liquid leakage prevention structure of a coupling | joint, and represents the state when the male coupling and the female coupling | bonding are made to detach after liquid leakage arises from the connection part of the coupling at the time of a fitting. 本発明の実施形態１に係る継手の構造を示した斜視図で、吸水性ポリマーをハウジングに固定する方法を表す。It is the perspective view which showed the structure of the coupling which concerns on Embodiment 1 of this invention, and represents the method of fixing a water absorbing polymer to a housing. 本発明の実施形態１に係る継手の構造を示した断面図で、オス継手とメス継手が嵌合した後の状態を表す。It is sectional drawing which showed the structure of the joint which concerns on Embodiment 1 of this invention, and represents the state after a male joint and a female joint fitted. 本実施形態に係る液冷システムの構成を示した概念図。The conceptual diagram which showed the structure of the liquid cooling system which concerns on this embodiment. 本発明の実施形態１に係る継手の構造を示した断面図で、液漏れ時の挙動を表す。It is sectional drawing which showed the structure of the joint which concerns on Embodiment 1 of this invention, and represents the behavior at the time of a liquid leak. 本発明の実施形態２に係る継手の構造を示した断面図。Sectional drawing which showed the structure of the coupling which concerns on Embodiment 2 of this invention. 本発明の実施形態２に係る継手において、液漏れ時の挙動を示した断面図。Sectional drawing which showed the behavior at the time of a liquid leak in the coupling which concerns on Embodiment 2 of this invention. 本発明の実施形態２に係る継手の構造の変形例を示した断面図。Sectional drawing which showed the modification of the structure of the coupling which concerns on Embodiment 2 of this invention. 本発明の実施形態３に係る継手の構造を示した断面図。Sectional drawing which showed the structure of the coupling which concerns on Embodiment 3 of this invention.

以下、本発明の実施形態について図面を用いて説明する。

Ａ．液漏れ防止装置（継手構造）
Hereinafter, embodiments of the present invention will be described with reference to the drawings.

A. Liquid leakage prevention device (joint structure)

図１は、本発明の実施形態１に係る継手の構造を示した断面図で、オス継手１とメス継手２が嵌合する前の状態を表している。本実施形態の継手は、オス継手１とメス継手２を備え、これらを固定するハウジング３及び４を有する。これらのハウジング３及び４は、両者が嵌合したときに、その状態を保持するためのロック機構（図示されない）を備える。そして、オス継手１のハウジング３内壁には吸水性ポリマー等の吸水材５を設置し、メス継手２のハウジング４内壁にはゴムパッキン等のシール材６を備える。ここで、吸水材５（吸水性ポリマー等）は、例えば、シート状に加工した材料を用い、少なくとも、ハウジング３及び４で密閉される空間と同体積の液体を吸収できるだけの大きさ又は容量を持つ。さらに、吸水材５（吸水性ポリマー等）を設置する面は、ハウジング３及び４内壁を覆う全ての面に取付けても良いし、冷媒液が溜まりやすい面（例えば、重力方向下側の平面）だけに取付けても良いし、又は、その面と側面等の適宜の位置に取り付けてもよい。なお、冷媒液として、水以外の液体を用いる場合は、吸水性ポリマーに限らず、その液体を吸収できる材料を適宜使用することができる。
また、吸水材５（吸水性ポリマー等）を取付ける方法としては、継手の着脱で容易に脱落しないように、接着剤を用いてオス継手１のハウジング３内壁に貼り付けても良い。

図７に、本発明の実施形態１に係る継手の構造を示した斜視図を示す。
吸水材５（吸水性ポリマー等）をハウジングに固定する方法としては、図７に示すように、吸水材５（吸水性ポリマー等）に突起７１を設け、ハウジング３の内壁にその突起７１を固定する溝７２を設けておいても良い。 FIG. 1 is a cross-sectional view showing the structure of a joint according to Embodiment 1 of the present invention, and shows a state before the male joint 1 and the female joint 2 are fitted. The joint of the present embodiment includes a male joint 1 and a female joint 2 and includes housings 3 and 4 for fixing them. These housings 3 and 4 are provided with a lock mechanism (not shown) for maintaining the state when both are fitted. A water absorbing material 5 such as a water absorbing polymer is installed on the inner wall of the housing 3 of the male joint 1, and a sealing material 6 such as rubber packing is provided on the inner wall of the housing 4 of the female joint 2. Here, the water-absorbing material 5 (water-absorbing polymer or the like) is, for example, a material processed into a sheet shape, and has a size or capacity sufficient to absorb at least the same volume of liquid as the space sealed by the housings 3 and 4. Have. Furthermore, the surface on which the water absorbing material 5 (water absorbing polymer or the like) is installed may be attached to all the surfaces covering the inner walls of the housings 3 and 4, or a surface on which the refrigerant liquid easily collects (for example, a plane on the lower side in the gravity direction). It may be attached only to the surface, or may be attached to an appropriate position such as the surface and the side surface. In addition, when using liquids other than water as a refrigerant | coolant liquid, not only a water absorbing polymer but the material which can absorb the liquid can be used suitably.
Moreover, as a method of attaching the water absorbing material 5 (water absorbing polymer or the like), an adhesive may be attached to the inner wall of the housing 3 of the male joint 1 so that the water absorbing material 5 (water absorbing polymer or the like) is not easily detached when the joint is attached or detached.

FIG. 7 is a perspective view showing the structure of the joint according to Embodiment 1 of the present invention.
As a method of fixing the water absorbing material 5 (water absorbing polymer or the like) to the housing, as shown in FIG. 7, a protrusion 71 is provided on the water absorbing material 5 (water absorbing polymer or the like), and the protrusion 71 is fixed to the inner wall of the housing 3. A groove 72 may be provided.

図８に、本発明の実施形態１に係る継手の構造を示した断面図で、オス継手とメス継手が嵌合した後の状態を表したものを示す。
次に、図８を用いて、オス継手１とメス継手２が嵌合したときの状態を説明する。両者が嵌合するとき、オス継手１のハウジング３でメス継手２のハウジング内壁４に取付けたシール材６を押圧することにより、ハウジング４内の空間のシール性が確保される。またこの時、ハウジング４のロック機構（図示されない）が作動し、嵌合状態を保持することで、継目から液漏れが生じても、ハウジング４外部への液漏れを防ぐことができる。

以下、実施形態１の構成において、継手嵌合時に接続部から液漏れが生じた場合の挙動について説明する。
図１０に、本発明の実施形態１に係る継手の構造を示した断面図で、液漏れ時の挙動を表したものを示す。
図示のように、継手嵌合時に接続部から液漏れが生じた場合、ハウジング３及び４内部の密閉空間に漏水が閉じ込められる。ハウジング３及び４内部に閉じ込められた液体は、吸水材５（吸水性ポリマー）により全て吸収されるため、ハウジング３及び４内部には液体が存在しない状態となる。そのため、この状態からオス継手１を離脱しても、周囲の電子部品に冷媒液が飛散する心配がなく、カード基板９の安全な挿抜が可能である。

なお、カード基板９側のオス継手１と、バックプレーン８側のメス継手２とを、逆に配置するようにしてもよい。また、カード基板９側のハウジング３と、バックプレーン８側のハウジング４とを、逆に配置するようにしてよい。
FIG. 8 is a cross-sectional view showing the structure of the joint according to Embodiment 1 of the present invention, and shows a state after the male joint and the female joint are fitted.
Next, a state when the male joint 1 and the female joint 2 are fitted will be described with reference to FIG. When the two are fitted together, the sealing material 6 attached to the housing inner wall 4 of the female joint 2 is pressed by the housing 3 of the male joint 1, thereby ensuring the sealing performance of the space in the housing 4. Further, at this time, a locking mechanism (not shown) of the housing 4 is operated and the fitting state is maintained, so that liquid leakage to the outside of the housing 4 can be prevented even if liquid leakage occurs from the joint.

Hereinafter, in the configuration of the first embodiment, the behavior when liquid leakage occurs from the connection portion when fitting the joint will be described.
FIG. 10 is a cross-sectional view showing the structure of the joint according to Embodiment 1 of the present invention, and shows the behavior at the time of liquid leakage.
As shown in the drawing, when liquid leakage occurs from the connecting portion when fitting the joint, the water leakage is confined in the sealed space inside the housings 3 and 4. Since the liquid confined inside the housings 3 and 4 is all absorbed by the water absorbing material 5 (water absorbing polymer), no liquid exists inside the housings 3 and 4. Therefore, even if the male joint 1 is detached from this state, there is no fear that the refrigerant liquid scatters to the surrounding electronic components, and the card substrate 9 can be safely inserted and removed.

Note that the male joint 1 on the card substrate 9 side and the female joint 2 on the backplane 8 side may be arranged in reverse. Further, the housing 3 on the card substrate 9 side and the housing 4 on the backplane 8 side may be arranged in reverse.

Ｂ．液漏れ検知

以下に、液漏れを検知するための液冷システムと、それに用いられる液漏れ防止装置（継手装置）について説明する。

（１）液冷システム

図９は、本実施形態に係る液冷システムの構成を示した概念図である。本実施形態では、図２の液冷システムと比較して、流量センサＳ１及びＳ２を、リザーブタンク１０２の流入側と流出側に追加し、検出回路９１を備えた構成としている。なお、図９において、図２と同一符号の構成は、同様の構成である。流量センサＳ１及びＳ２には、超音波式、差圧式等の種類が存在するが、ここでは種類を問わない。本システムでは、液漏れが生じていない場合、システム全体の流量が常に一定となるため、流入側の流量Ｑｉｎと、流出側の流量Ｑｏｕｔの関係は、Ｑｉｎ＝Ｑｏｕｔとなる。一方、流量センサＳ２から受熱ジャケット１０３を経て流出センサＳ１へ流れる流路で液漏れが生じた場合は、この流路を流れる冷媒液の量が減じてしまうため、流量Ｑｉｎが低下する。しかし、流量Ｑｏｕｔは、リザーブタンク１０２で冷媒液の補充を受けるため、流量は変化しない。すなわち、液漏れが生じた場合は、Ｑｏｕｔ＞Ｑｉｎの関係となる。このような原理により、リザーブタンク１０２の流入側と流出側に流量センサＳ１及びＳ２を備え、検出回路９１が両者の差分を監視することで、液漏れを検知することが可能である。

本実施形態において、継手嵌合時に接続部から液漏れが生じた場合、ハウジング３及び４内部の密閉空間に漏水が閉じ込められる。このとき、図９において説明したように、検出回路９１が流量センサＳ１及びＳ２の流量を比較するという液漏れ検知機能により液漏れを検知した場合、ポンプ１０１の動作を停止するように設定しておく。こうすることで、継手接続部からのそれ以上の液漏れを防ぐことができる。

（２）液漏れ防止装置（継手装置）
B. Liquid leak detection

Below, the liquid cooling system for detecting a liquid leak and the liquid leak prevention apparatus (joint apparatus) used for it are demonstrated.

(1) Liquid cooling system

FIG. 9 is a conceptual diagram showing the configuration of the liquid cooling system according to the present embodiment. In the present embodiment, as compared with the liquid cooling system of FIG. 2, flow rate sensors S <b> 1 and S <b> 2 are added to the inflow side and the outflow side of the reserve tank 102, and a detection circuit 91 is provided. In FIG. 9, the same reference numerals as those in FIG. 2 are the same. There are various types of flow rate sensors S1 and S2, such as an ultrasonic type and a differential pressure type. In this system, when there is no liquid leakage, the flow rate of the entire system is always constant, so the relationship between the inflow side flow rate Qin and the outflow side flow rate Qout is Qin = Qout. On the other hand, when a liquid leak occurs in the flow path that flows from the flow rate sensor S2 to the outflow sensor S1 through the heat receiving jacket 103, the amount of the refrigerant liquid that flows through this flow path is reduced, so the flow rate Qin decreases. However, since the flow rate Qout is replenished with the refrigerant liquid in the reserve tank 102, the flow rate does not change. That is, when liquid leakage occurs, the relationship is Qout> Qin. Based on such a principle, the flow rate sensors S1 and S2 are provided on the inflow side and the outflow side of the reserve tank 102, and the detection circuit 91 monitors the difference between the two so that the liquid leakage can be detected.

In the present embodiment, when liquid leakage occurs from the connection portion when fitting the joint, water leakage is confined in the sealed space inside the housings 3 and 4. At this time, as described with reference to FIG. 9, if the detection circuit 91 detects a liquid leakage by the liquid leakage detection function of comparing the flow rates of the flow rate sensors S1 and S2, the operation of the pump 101 is set to stop. deep. By carrying out like this, the further liquid leakage from a joint connection part can be prevented.

(2) Liquid leakage prevention device (joint device)

図１１に、本発明の実施形態２に係る継手の構造を示した断面図を示す。
ところで、液漏れを検知する別手段として、次に示す方法がある。
図１１では、オス継手１のハウジング３内壁に窪地を設けており、その窪地内に圧力センサ１１１を備える。圧力センサ１１１は、ハウジング３内部を通したケーブル１１２によって、カード基板９上に実装される液漏れ検出回路１１３と接続されており、圧力センサ１１１に加わる圧力値を監視する。また、ハウジング３の内壁には、吸水材５として、少なくとも、ハウジング３で密閉される空間と同体積の液体を吸収できるだけの水膨張性止水材を設置する。

図１２は、実施形態２の継手構造において、液漏れ時の挙動を示した断面図である。本例において、液漏れが生じた場合、ハウジング３及び４内壁に設けた吸水材５（水膨張性止水材）により、液体が吸収される。このとき、吸水材５（水膨張性止水材）が膨張し圧力センサ１１１に触れることで、圧力値が変化しハウジング３及び４内の液漏れを素早く検知する。このとき、実施形態１と同様に、ポンプ１０１の動作を停止するように設定しておくことで、継手接続部からのそれ以上の液漏れを防ぐことが可能である。なお、少量の液漏れでも圧力センサ１１１と吸水材５（水膨張性止水材）が確実に触れるように、体積膨張率の大きな水膨張性止水材を用いることが望ましい。さらに、圧力センサ１１１の設置位置は、冷媒液が溜まりやすい場所（例えば、継手接続部分の重力方向真下）とすることで、液漏れを素早く検知することが容易となる。 In FIG. 11, sectional drawing which showed the structure of the coupling which concerns on Embodiment 2 of this invention is shown.
By the way, as another means for detecting liquid leakage, there is the following method.
In FIG. 11, a depression is provided on the inner wall of the housing 3 of the male joint 1, and a pressure sensor 111 is provided in the depression. The pressure sensor 111 is connected to a liquid leakage detection circuit 113 mounted on the card substrate 9 by a cable 112 passing through the inside of the housing 3, and monitors the pressure value applied to the pressure sensor 111. Further, on the inner wall of the housing 3, a water-swellable water-stopping material that can absorb at least a liquid having the same volume as the space sealed by the housing 3 is installed as the water-absorbing material 5.

FIG. 12 is a cross-sectional view showing the behavior at the time of liquid leakage in the joint structure of the second embodiment. In this example, when liquid leakage occurs, the liquid is absorbed by the water absorbing material 5 (water-swellable water stop material) provided on the inner walls of the housings 3 and 4. At this time, when the water absorbing material 5 (water-swellable water-stopping material) expands and touches the pressure sensor 111, the pressure value changes and the liquid leakage in the housings 3 and 4 is quickly detected. At this time, similarly to the first embodiment, it is possible to prevent further liquid leakage from the joint connecting portion by setting the operation of the pump 101 to stop. In addition, it is desirable to use a water-swellable water-stopping material having a large volume expansion rate so that the pressure sensor 111 and the water-absorbing material 5 (water-swellable water-stopping material) can be surely touched even with a small amount of liquid leakage. Furthermore, the installation position of the pressure sensor 111 is a place where the refrigerant liquid is likely to accumulate (for example, directly below the joint connecting portion in the direction of gravity), so that it is easy to quickly detect the liquid leakage.

図１３に、本発明の実施形態２に係る継手の構造を示した断面図の変形例を示す。
また、この変形例のように、実施形態２において、圧力センサ１１１の代わりにボタンスイッチ等のスイッチ１３１を設置し、水膨張性止水材が膨張することでスイッチ１３１が押され、液漏れ検出回路１１３により、液漏れを検知する仕組みを用いても良い。

さらに、図１１及び図１３において、液漏れ検出回路１１３により、液漏れ検知時に、ポンプ１０１の動作を停止するように設定しておくことで、継手接続部からのそれ以上の液漏れを防ぐことが可能である。

なお、カード基板９側のオス継手１と、バックプレーン８側のメス継手２とを、逆に配置するようにしてもよい。また、カード基板９側のハウジング３とバックプレーン８側のハウジング４とを、逆に配置するようにしてよい。この場合、液漏れ検出回路１１３は、バックプレーン８側に設けるようにすることができる。
In FIG. 13, the modification of sectional drawing which showed the structure of the coupling which concerns on Embodiment 2 of this invention is shown.
Further, as in this modification, in the second embodiment, a switch 131 such as a button switch is installed instead of the pressure sensor 111, and the switch 131 is pushed by the expansion of the water-expandable water stop material, thereby detecting a liquid leak. A mechanism for detecting liquid leakage by the circuit 113 may be used.

Further, in FIG. 11 and FIG. 13, by setting the liquid leakage detection circuit 113 to stop the operation of the pump 101 when liquid leakage is detected, further liquid leakage from the joint connecting portion is prevented. Is possible.

Note that the male joint 1 on the card substrate 9 side and the female joint 2 on the backplane 8 side may be arranged in reverse. Further, the housing 3 on the card substrate 9 side and the housing 4 on the backplane 8 side may be arranged in reverse. In this case, the liquid leakage detection circuit 113 can be provided on the backplane 8 side.

図１４に、本発明の実施形態３に係る継手の構造を示した断面図を示す。
さらに、液漏れを検知する別手段として、図示のような漏水センサ１４１を使用しても良い。図１４では、オス継手１のハウジング３内壁に吸水材５（吸水性ポリマー等）を備え、吸水材５（吸水性ポリマー等）の上に漏水センサ１４１を設置する構成としている。漏水センサ１４１には、いくつか種類があるが、最も一般的なものとして、例えば、導線２本をそれぞれ紙などで包み、さらにその２本の導線を束ねて、漏水を感知する場所にセットするものがある。漏水が起きた場合には、紙に浸透した水分が２本の導線間の電気抵抗を低下させるので、これを電気的に感知し、警報を出すようになっている。冷媒液として、非導電性の液体を使用する場合は、光学式の漏水センサ１４１等を用いてもよい。
このような漏水センサ１４１をハウジング３及び４内部に設置し、ケーブルによってカード基板９上に実装される液漏れ検出回路１４２と接続することで、液漏れを素早く検知することが可能である。
また、実施形態２と同様に、液漏れ検出回路１４２により、液漏れ検知時に、ポンプ１０１の動作を停止するように設定しておくことで、継手接続部からのそれ以上の液漏れを防ぐことが可能である。

なお、カード基板９側のオス継手１と、バックプレーン８側のメス継手２とを、逆に配置するようにしてもよい。また、カード基板９側のハウジング３と、バックプレーン８側のハウジング４とを、逆に配置するようにしてよい。この場合、液漏れ検出回路１４２は、バックプレーン８側に設けるようにすることができる。
In FIG. 14, sectional drawing which showed the structure of the coupling which concerns on Embodiment 3 of this invention is shown.
Furthermore, a water leakage sensor 141 as shown in the figure may be used as another means for detecting liquid leakage. In FIG. 14, the water absorbing material 5 (water absorbing polymer or the like) is provided on the inner wall of the housing 3 of the male joint 1, and the water leakage sensor 141 is installed on the water absorbing material 5 (water absorbing polymer or the like). There are several types of the water leakage sensor 141, but the most common one is, for example, wrapping two conductors with paper or the like, and bundling the two conductors and setting it at a place where water leakage is detected. There is something. When water leaks, the moisture that has penetrated the paper reduces the electrical resistance between the two conductors, so that this is electrically detected and an alarm is issued. When a non-conductive liquid is used as the refrigerant liquid, an optical water leakage sensor 141 or the like may be used.
By installing such a water leak sensor 141 inside the housings 3 and 4 and connecting it to the liquid leak detection circuit 142 mounted on the card substrate 9 by a cable, it is possible to quickly detect the liquid leak.
Further, as in the second embodiment, the liquid leakage detection circuit 142 is configured to stop the operation of the pump 101 when the liquid leakage is detected, thereby preventing further leakage from the joint connection portion. Is possible.

Note that the male joint 1 on the card substrate 9 side and the female joint 2 on the backplane 8 side may be arranged in reverse. Further, the housing 3 on the card substrate 9 side and the housing 4 on the backplane 8 side may be arranged in reverse. In this case, the liquid leakage detection circuit 142 can be provided on the backplane 8 side.

１ オス継手
２ メス継手
３ ハウジング
４ ハウジング
５ 吸水材
６ シール材
７ 配管
８ バックプレーン
９１ 検出回路
１０１ ポンプ
１０２ リザーブタンク
１０３ 受熱ジャケット
１０４ ラジエータ
１０５ 配管
１１１ 圧力センサ
１１２ ケーブル
１１３ 液漏れ検出回路
１３１ ボタンスイッチ
１４１ 漏水センサ
１４２ 液漏れ検出回路 DESCRIPTION OF SYMBOLS 1 Male joint 2 Female joint 3 Housing 4 Housing 5 Water absorbing material 6 Seal material 7 Piping 8 Backplane 91 Detection circuit 101 Pump 102 Reserve tank 103 Heat receiving jacket 104 Radiator 105 Piping 111 Pressure sensor 112 Cable 113 Liquid leak detection circuit 131 Button switch 141 Water leakage sensor 142 Liquid leakage detection circuit

Claims (10)

基板に搭載された電子部品を冷却するための受熱ジャケットに冷媒液を流すための管を接続する液コネクタの第１の継手と、
前記第１の継手に嵌合する、前記液コネクタの第２の継手と、
前記第１の継手を内部に固定する第１のハウジングと、
前記第１のハウジングに外側から嵌合し、前記第２の継手を内部に固定する第２のハウジングと、
前記第２のハウジングの内壁に設けられ、前記第１のハウジングと前記第２のハウジングが嵌合されたとき形成される空間内に、前記第１の継手と前記第２の継手との接続部分から漏れた冷媒液を閉じ込めるシール材と、
前記第１のハウジングの内壁に設けられ、前記空間内に閉じ込められた冷媒液を吸収する吸水材と
を備えた液冷システムにおける液漏れ防止装置。
A first joint of a liquid connector for connecting a pipe for flowing a refrigerant liquid to a heat receiving jacket for cooling an electronic component mounted on the substrate;
A second joint of the liquid connector that fits into the first joint;
A first housing for fixing the first joint therein;
A second housing that fits into the first housing from the outside and fixes the second joint inside;
A connecting portion between the first joint and the second joint in a space provided on the inner wall of the second housing and formed when the first housing and the second housing are fitted together A sealing material for confining the refrigerant liquid leaked from,
A liquid leakage prevention apparatus in a liquid cooling system, comprising: a water absorbing material that is provided on an inner wall of the first housing and absorbs a refrigerant liquid confined in the space.
請求項１に記載の液漏れ防止装置において、
前記吸水材を設ける位置は、前記第１のハウジングの内壁のうち、全ての面、冷媒液が溜まりやすい面、下面、側面のいずれかを含むことを特徴とする液漏れ防止装置。
In the liquid leakage preventing apparatus according to claim 1,
The position where the water absorbing material is provided includes any one of the inner wall of the first housing, the surface on which the refrigerant liquid easily collects, the lower surface, and the side surface.
請求項１又は２に記載の液漏れ防止装置において、
前記吸水材に突起を設け、前記第１のハウジングの内壁に前記突起を固定する溝を設けることを特徴とする液漏れ防止装置。
In the liquid leakage preventing apparatus according to claim 1 or 2,
A liquid leakage preventing apparatus, wherein a protrusion is provided on the water absorbing material, and a groove for fixing the protrusion is provided on an inner wall of the first housing.
基板に搭載された電子部品を冷却するための受熱ジャケットに冷媒液を流すための管を、液コネクタの第１の継手により接続し、
前記液コネクタの第２の継手により、前記第１の継手に嵌合し、
第１のハウジングにより、前記第１の継手を内部に固定し、
第２のハウジングにより、前記第１のハウジングに外側から嵌合し、前記第２の継手を内部に固定し、
前記第２のハウジングの内壁に設けられ、前記第１のハウジングと前記第２のハウジングが嵌合されたとき形成される空間内に、前記第１の継手と前記第２の継手との接続部分から漏れた冷媒液を、シール材により閉じ込め、
前記第１のハウジングの内壁に設けられ、前記空間内に閉じ込められた冷媒液を、吸水材により吸収する
液冷システムにおける液漏れ防止方法。
A pipe for flowing a refrigerant liquid to a heat receiving jacket for cooling an electronic component mounted on the substrate is connected by a first joint of the liquid connector;
The second joint of the liquid connector is fitted to the first joint,
The first housing fixes the first joint inside,
The second housing is fitted into the first housing from the outside, and the second joint is fixed inside,
A connecting portion between the first joint and the second joint in a space provided on the inner wall of the second housing and formed when the first housing and the second housing are fitted together The refrigerant liquid leaking from
A liquid leakage prevention method in a liquid cooling system, which is provided on an inner wall of the first housing and absorbs a refrigerant liquid confined in the space by a water absorbing material.
バックプレーンへ挿入される又は前記バックプレーンから抜きとられる、電子部品を搭載した基板と、
前記電子部品を覆い取り付けられ、前記バックプレーンへの前記基板の挿入時に、内部に冷媒液が循環されて前記電子部品を冷却する受熱ジャケットと、
冷媒液を循環するポンプと、冷媒液を溜めるリザーブタンクと、冷媒液を冷却する放熱部と、
冷媒液の液漏れ防止装置と
を備え、

前記液漏れ防止装置は、
基板に搭載された電子部品を冷却するための受熱ジャケットに冷媒液を流すための管を接続する液コネクタの第１の継手と、
前記第１の継手に嵌合する、前記液コネクタの第２の継手と、
前記第１の継手を内部に固定する第１のハウジングと、
前記第１のハウジングに外側から嵌合し、前記第２の継手を内部に固定する第２のハウジングと、
前記第２のハウジングの内壁に設けられ、前記第１のハウジングと前記第２のハウジングが嵌合されたとき形成される空間内に、前記第１の継手と前記第２の継手との接続部分から漏れた冷媒液を閉じ込めるシール材と、
前記第１のハウジングの内壁に設けられ、前記空間内に閉じ込められた冷媒液を吸収する吸水材と
を有し、

前記基板は、前記バックプレーンに電気コネクタで接続され、且つ、前記基板上の前記受熱ジャケットは、前記バックプレーンに、前記第１及び第２の継手を有する前記液コネクタで接続され、
前記ポンプは、前記リザーブタンク、前記第１及び第２の継手を有する前記液コネクタ、前記受熱ジャケット、及び、前記放熱部を含む経路に、冷媒液を循環させて冷媒液を冷却するようにした液冷システム。
A board with electronic components inserted into or removed from the backplane;
A heat receiving jacket that covers and attaches the electronic component, and cools the electronic component by circulating a coolant liquid therein when the substrate is inserted into the backplane.
A pump that circulates the refrigerant liquid, a reserve tank that stores the refrigerant liquid, a heat radiating unit that cools the refrigerant liquid,
A liquid leakage prevention device for refrigerant liquid,

The liquid leakage prevention device is
A first joint of a liquid connector for connecting a pipe for flowing a refrigerant liquid to a heat receiving jacket for cooling an electronic component mounted on the substrate;
A second joint of the liquid connector that fits into the first joint;
A first housing for fixing the first joint therein;
A second housing that fits into the first housing from the outside and fixes the second joint inside;
A connecting portion between the first joint and the second joint in a space provided on the inner wall of the second housing and formed when the first housing and the second housing are fitted together A sealing material for confining the refrigerant liquid leaked from,
A water absorbing material that is provided on the inner wall of the first housing and absorbs the refrigerant liquid confined in the space;

The substrate is connected to the backplane with an electrical connector, and the heat receiving jacket on the substrate is connected to the backplane with the liquid connector having the first and second joints,
The pump cools the refrigerant liquid by circulating the refrigerant liquid through a path including the reserve tank, the liquid connector having the first and second joints, the heat receiving jacket, and the heat radiating portion. Liquid cooling system.
請求項５に記載の液冷システムにおいて、
前記吸水材は、水膨張性止水材であり、
さらに、
第１のハウジングの内壁に設けられた圧力センサと、
前記吸水材と前記圧力センサにより、液漏れを検知する検出部と
を備えたことを特徴とする液冷システム。
The liquid cooling system according to claim 5, wherein
The water absorbing material is a water-swelling water-stopping material,
further,
A pressure sensor provided on the inner wall of the first housing;
A liquid cooling system comprising: a detection unit that detects liquid leakage by the water absorbing material and the pressure sensor.
請求項５に記載の液冷システムにおいて、
前記吸水材は、水膨張性止水材であり、
さらに、
第１のハウジングの内壁に設けられたスイッチと、
前記吸水材と前記スイッチにより、液漏れを検知する検出部と
を備えたことを特徴とする液冷システム。
The liquid cooling system according to claim 5, wherein
The water absorbing material is a water-swelling water-stopping material,
further,
A switch provided on the inner wall of the first housing;
A liquid cooling system comprising: a detection unit that detects liquid leakage by the water absorbing material and the switch.
請求項５に記載の液冷システムにおいて、
さらに、
第１のハウジングの内壁に設けられた漏水センサと、
前記漏水センサにより、液漏れを検知する検出部と
を備えたことを特徴とする液冷システム。
The liquid cooling system according to claim 5, wherein
further,
A water leakage sensor provided on the inner wall of the first housing;
A liquid cooling system comprising: a detection unit that detects liquid leakage by the water leakage sensor.
バックプレーンへ挿入される又は前記バックプレーンから抜きとられる、電子部品を搭載した基板と、
前記電子部品を覆い取り付けられ、前記バックプレーンへの前記基板の挿入時に、内部に冷媒液が循環されて前記電子部品を冷却する受熱ジャケットと、
冷媒液を循環するポンプと、冷媒液を溜めるリザーブタンクと、冷媒液を冷却する放熱部と、
冷媒液の液漏れ防止装置と、
リザーブタンクの流入側と流出側に設けられた第１及び第２の流量センサと、
前記第１及び第２の流量センサの差分を監視することで、液漏れを検知する検出部と
を備え、

前記液漏れ防止装置は、
基板に搭載された電子部品を冷却するための受熱ジャケットに冷媒液を流すための管を接続する液コネクタの第１の継手と、
前記第１の継手に嵌合する、前記液コネクタの第２の継手と、
前記第１の継手を内部に固定する第１のハウジングと、
前記第１のハウジングに外側から嵌合し、前記第２の継手を内部に固定する第２のハウジングと、
前記第２のハウジングの内壁に設けられ、前記第１のハウジングと前記第２のハウジングが嵌合されたとき形成される空間内に、前記第１の継手と前記第２の継手との接続部分から漏れた冷媒液を閉じ込めるシール材と、
前記第１のハウジングの内壁に設けられ、前記空間内に閉じ込められた冷媒液を吸収する吸水材と、
を有し、

前記基板は、前記バックプレーンに電気コネクタで接続され、且つ、前記基板上の前記受熱ジャケットは、前記バックプレーンに、前記第１及び第２の継手を有する前記液コネクタで接続され、
前記ポンプは、前記リザーブタンク、前記第１及び第２の継手を有する前記液コネクタ、前記受熱ジャケット、及び、前記放熱部を含む経路に、冷媒液を循環させて冷媒液を冷却するようにした液冷システム。
A board with electronic components inserted into or removed from the backplane;
A heat receiving jacket that covers and attaches the electronic component, and cools the electronic component by circulating a coolant liquid therein when the substrate is inserted into the backplane.
A pump that circulates the refrigerant liquid, a reserve tank that stores the refrigerant liquid, a heat radiating unit that cools the refrigerant liquid,
A liquid leakage prevention device for refrigerant liquid;
First and second flow rate sensors provided on the inflow side and the outflow side of the reserve tank;
A detector that detects a liquid leak by monitoring a difference between the first and second flow rate sensors;

The liquid leakage prevention device is
A first joint of a liquid connector for connecting a pipe for flowing a refrigerant liquid to a heat receiving jacket for cooling an electronic component mounted on the substrate;
A second joint of the liquid connector that fits into the first joint;
A first housing for fixing the first joint therein;
A second housing that fits into the first housing from the outside and fixes the second joint inside;
A connecting portion between the first joint and the second joint in a space provided on the inner wall of the second housing and formed when the first housing and the second housing are fitted together A sealing material for confining the refrigerant liquid leaked from,
A water absorbing material that is provided on the inner wall of the first housing and absorbs the refrigerant liquid confined in the space;
Have

The substrate is connected to the backplane with an electrical connector, and the heat receiving jacket on the substrate is connected to the backplane with the liquid connector having the first and second joints,
The pump cools the refrigerant liquid by circulating the refrigerant liquid through a path including the reserve tank, the liquid connector having the first and second joints, the heat receiving jacket, and the heat radiating portion. Liquid cooling system.
請求項５乃至９のいずれかに記載の液冷システムにおいて、
前記検出部は、液漏れを検知した場合、前記ポンプの動作を停止することを特徴とする液冷システム。 The liquid cooling system according to any one of claims 5 to 9,
The liquid cooling system, wherein when the liquid leakage is detected, the detection unit stops the operation of the pump.
JP2012095291A 2012-04-19 2012-04-19 Liquid leakage prevention device and method, and liquid cooling system Pending JP2013222914A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012095291A JP2013222914A (en) 2012-04-19 2012-04-19 Liquid leakage prevention device and method, and liquid cooling system
US13/778,694 US20130277008A1 (en) 2012-04-19 2013-02-27 Liquid leakage prevention device, liquid leakage prevention method, and liquid cooling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012095291A JP2013222914A (en) 2012-04-19 2012-04-19 Liquid leakage prevention device and method, and liquid cooling system

Publications (1)

Publication Number Publication Date
JP2013222914A true JP2013222914A (en) 2013-10-28

Family

ID=49379027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012095291A Pending JP2013222914A (en) 2012-04-19 2012-04-19 Liquid leakage prevention device and method, and liquid cooling system

Country Status (2)

Country Link
US (1) US20130277008A1 (en)
JP (1) JP2013222914A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017514558A (en) * 2014-05-02 2017-06-08 イノ セラピューティクス エルエルシー System and method for delivering therapeutic gas using a facilitated therapeutic gas (NO) flow meter to a patient who needs the therapeutic gas and receives respiratory gas from a ventilator that changes pressure and / or flow at least
KR20200002523U (en) * 2019-05-09 2020-11-19 사이언테크 코포레이션 Treatment liquid container
US11960335B2 (en) 2021-03-26 2024-04-16 Baidu Usa Llc Leak detection and prevention system

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10365667B2 (en) * 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
WO2014141162A1 (en) 2013-03-15 2014-09-18 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
JP2014222745A (en) * 2013-05-14 2014-11-27 富士通株式会社 Cooling structure, substrate unit, system substrate, and electronic apparatus
JP6278053B2 (en) * 2016-03-28 2018-02-14 富士通株式会社 Immersion cooling device
US11209347B2 (en) 2016-07-20 2021-12-28 Hach Lange Gmbh Optical measurement apparatus
US10677680B1 (en) * 2017-05-05 2020-06-09 Amazon Technologies, Inc. Interior tubing monitoring devices
CN107577317B (en) * 2017-10-20 2023-10-10 北京百度网讯科技有限公司 Heat radiation joint and liquid cooling system
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) * 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
CN110430731A (en) * 2019-08-05 2019-11-08 唐春兴 A kind of novel mobile phone water cooling cold head
US11802807B2 (en) * 2019-09-25 2023-10-31 Dell Products L.P. Leak detection apparatus for an information handling system
JP7148203B2 (en) * 2019-11-13 2022-10-05 Ｎｅｃプラットフォームズ株式会社 Electronics
DE102020000907A1 (en) * 2020-02-13 2021-08-19 Daimler Ag Detection of a leak in a cooling circuit
TWI776127B (en) * 2020-02-24 2022-09-01 美商美國未來科技公司 Adjustment structure of water cooling head for computer water cooling and heat dissipation
FR3117177B1 (en) * 2020-12-08 2023-03-10 Bruno Questat Device for securing the rupture of the flexible pipes of a hydraulic circuit.
CN112860042A (en) * 2021-02-09 2021-05-28 华勤技术股份有限公司 Liquid cooling device and equipment
CN114623298B (en) * 2022-02-09 2024-01-26 华能济宁运河发电有限公司 Anti-leakage equipment between pipelines for ash conveying system

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11270772A (en) * 1998-03-18 1999-10-05 Yotsugi Kk Water leak detector for water pipe
JP2003209210A (en) * 2002-01-11 2003-07-25 Hitachi Ltd Electronic apparatus
JP2004087688A (en) * 2002-08-26 2004-03-18 Toshiba Corp Electronic apparatus
JP2007201225A (en) * 2006-01-27 2007-08-09 Mitsubishi Electric Corp Semiconductor device
JP2010244546A (en) * 2009-04-06 2010-10-28 Internatl Business Mach Corp <Ibm> Apparatus and method for forming mechanical fluid-tight connection, and assembly for facilitating cooling of electronic system connection, method, and electronic system
JP2011075088A (en) * 2009-10-02 2011-04-14 Fujitsu Ltd Structure for preventing liquid leakage of pipe joint and electronic equipment including the same
JP2011112707A (en) * 2009-11-24 2011-06-09 Ricoh Co Ltd Image forming apparatus

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11270772A (en) * 1998-03-18 1999-10-05 Yotsugi Kk Water leak detector for water pipe
JP2003209210A (en) * 2002-01-11 2003-07-25 Hitachi Ltd Electronic apparatus
JP2004087688A (en) * 2002-08-26 2004-03-18 Toshiba Corp Electronic apparatus
JP2007201225A (en) * 2006-01-27 2007-08-09 Mitsubishi Electric Corp Semiconductor device
JP2010244546A (en) * 2009-04-06 2010-10-28 Internatl Business Mach Corp <Ibm> Apparatus and method for forming mechanical fluid-tight connection, and assembly for facilitating cooling of electronic system connection, method, and electronic system
JP2011075088A (en) * 2009-10-02 2011-04-14 Fujitsu Ltd Structure for preventing liquid leakage of pipe joint and electronic equipment including the same
JP2011112707A (en) * 2009-11-24 2011-06-09 Ricoh Co Ltd Image forming apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017514558A (en) * 2014-05-02 2017-06-08 イノ セラピューティクス エルエルシー System and method for delivering therapeutic gas using a facilitated therapeutic gas (NO) flow meter to a patient who needs the therapeutic gas and receives respiratory gas from a ventilator that changes pressure and / or flow at least
JP2022091773A (en) * 2014-05-02 2022-06-21 マリンクロット ホスピタル プロダクツ アイピー リミテッド Method of operating systems for delivering therapeutic gas to breathing gas in inspiratory limb of patient breathing circuit
KR20200002523U (en) * 2019-05-09 2020-11-19 사이언테크 코포레이션 Treatment liquid container
KR200493208Y1 (en) * 2019-05-09 2021-02-18 사이언테크 코포레이션 Treatment liquid container
US11960335B2 (en) 2021-03-26 2024-04-16 Baidu Usa Llc Leak detection and prevention system

Also Published As

Publication number Publication date
US20130277008A1 (en) 2013-10-24

Similar Documents

Publication Publication Date Title
JP2013222914A (en) Liquid leakage prevention device and method, and liquid cooling system
US11725890B2 (en) Cooling module with leak detector and related systems
JP3641258B2 (en) Electronics
US9345170B2 (en) Heat exchange device, electronic system, and cooling method of electronic system
CN213579962U (en) Leak detection system
TWI791933B (en) System and method for detecting and analyzing fluid
JP2014107425A (en) Liquid-cooled apparatus
CN110568911A (en) Server
CN216594023U (en) Leak detection device and heat dissipation module with same
JP2024506076A (en) Liquid cooling equipment and equipment
TWI749813B (en) Liquid cooling system and apparatus
TWI750540B (en) Computer system and composite heat dissipation system
US20110303403A1 (en) Flexible Heat Exchanger
US10240997B2 (en) Sensor members
JP2015159159A (en) Semiconductor liquid-cooled module
US20070169374A1 (en) Cooling system leak detector
TWI724541B (en) Cantainer and adapter module thereof
CN115127745A (en) Leak detection and prevention system
US12000756B2 (en) Leakage detection system
JP6523158B2 (en) Electronic component module
US11994447B1 (en) Leak detection and management system for rack cooling systems
CN117130450B (en) Liquid cooling plate assembly, server and data center
JPS62204598A (en) Liquid leakage monitoring structure of liquid cooling electronic apparatus
TWI612879B (en) Test system having liquid containment chambers over connectors
US20230337395A1 (en) Isolation device for isolating leaked liquid coolant and electronic equipment including isolation device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140509

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150625

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150804

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20160105