JP2013219029A - Electronic component and electronic component manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component provided with static-free means having a discharge terminal in the electronic component to be able to solve a problem due to overvoltage or overcurrent, and an electronic component manufacturing method.SOLUTION: The electronic component manufacturing method of this invention includes the steps for: forming a first pattern layer by using a first photoresist pattern for exposing an area where a first coil pattern part and a first discharge pattern part are formed; forming a first insulation layer by applying an insulator or a dielectric body to the top surface of the first pattern layer; forming a second pattern layer on the top surface of the first insulation layer by using a second photoresist pattern for exposing an area where a second coil pattern part and a second discharge pattern part are formed; and forming an external electrode layer on the top surface of the second pattern layer by using a third photoresist pattern for exposing an area where a coil electrode part and a discharge electrode part are formed.

Description

The present invention relates to an electronic component and an electronic component manufacturing method, and more particularly to an electronic component and an electronic component manufacturing method provided with means capable of discharging the electronic component when an overvoltage or overcurrent is applied to the electronic component due to static electricity or the like. .

A common mode filter (Common Mode Filter: CMF) is an electronic component widely used for removing common mode noise in various electronic devices.

Recently, with the miniaturization, slimming down, and high functionality of electronic products, research on common mode filters that can improve noise removal performance and can be miniaturized and thinned has been continued.

In addition, various studies and attempts have been made to improve characteristics such as inductance and DC resistance of the common mode filter. As an example, as shown in Patent Document 1, there is a common mode filter that increases the cutoff frequency and improves the impedance characteristics.

Korean Patent Application No. 10-2011-0082641

On the other hand, in various electronic devices to which such electronic components are applied, an overvoltage or an overcurrent that is out of an allowable range is frequently applied due to instability of an input power source or static electricity.

In conventional general electronic components, in order to prevent problems such as deterioration of electronic components caused by such overvoltage or overcurrent, or malfunction of products, antistatic measures are provided outside the electronic components. It has. However, if a separate antistatic means is provided outside the electronic component, there is a problem that there is a limit to downsizing the electronic device.

The present invention has been made in view of the above-described problems, and includes an electronic component and an electronic component that include an antistatic means having a discharge terminal in the electronic component and can solve the problem due to overvoltage or overcurrent. The purpose is to provide a manufacturing method.

Another object of the present invention is to provide an electronic component and an electronic component manufacturing method capable of minimizing an increase in thickness and size by providing an antistatic means in the electronic component. .

In order to solve the above object, an electronic component according to an embodiment of the present invention is an electronic component including a primary coil pattern and a secondary coil pattern through at least one of a dielectric and an insulator. And at least one discharge terminal for discharging an overvoltage or an overcurrent applied to the primary coil pattern or the secondary coil pattern.

A first primary external electrode is electrically connected to one end of the primary coil pattern, and a second primary external electrode is electrically connected to the other end of the primary coil pattern. A first secondary external electrode is electrically connected to one end of the coil pattern, and a second secondary external electrode is electrically connected to the other end of the secondary coil pattern. A discharge electrode is electrically connected to the discharge terminal, and the first primary external electrode, the second primary external electrode, the first secondary external electrode, and the second secondary external electrode are connected to each other. It is electrically connected to at least one of them. It further includes a discharge pattern provided with a predetermined gap with the discharge terminal.

The gap is preferably determined within a range of 1 to 10 μm. An electronic component according to another embodiment of the present invention is an electronic component including a first pattern layer, a second pattern layer, and an external electrode layer, and the first pattern layer includes a first primary layer. A coil pattern, a first secondary coil pattern, a first primary pad electrically connected to one end of the first primary coil pattern, and an electrical connection to one end of the first secondary coil pattern The first secondary pad to be connected, the first primary internal terminal electrically connected to the other end of the first primary coil pattern, and the other end of the first secondary coil pattern A first coil pattern portion including a first secondary internal terminal to be connected, a first primary subpad provided adjacent to the first primary pad, one end of which is the first primary subpad A first discharge pattern electrically connected to the first discharge pattern and the first discharge pattern. Including a first discharge pattern portion comprising a first discharge terminals provided at a predetermined gap between the patterns. The second pattern layer includes: a second primary coil pattern; a second secondary coil pattern; a second primary pad electrically connected to one end of the second primary coil pattern; A second secondary pad electrically connected to one end of the second secondary coil pattern; a second primary internal terminal electrically connected to the other end of the second primary coil pattern; A second secondary internal terminal electrically connected to the other end of the second secondary coil pattern and a second primary dummy pad electrically connected to the first primary pad. A coil pattern portion, a first additional discharge terminal electrically connected to the first discharge terminal, and the first primary subpad adjacent to the second primary dummy pad are electrically connected. And a second discharge pattern portion including a second primary dummy subpad. The external electrode layer includes a first primary external electrode electrically connected to one end of a primary coil pattern formed by connecting the first primary coil pattern and a second primary coil pattern; A second primary external electrode electrically connected to the other end of the primary coil pattern, and a secondary coil pattern formed by connecting the first secondary coil pattern and the second secondary coil pattern. A coil electrode unit including a first secondary external electrode electrically connected to one end of the second secondary electrode, a second secondary external electrode electrically connected to the other end of the secondary coil pattern, and the first And a discharge electrode portion including a first discharge electrode electrically connected to the additional discharge terminal. The second primary dummy subpad is electrically connected to the first primary external electrode.

The first coil pattern portion further includes a first primary dummy pad electrically connected to the second primary pad, and the first discharge pattern portion is the first primary dummy. A first primary dummy subpad adjacent to the pad and electrically connected to the second primary external electrode; a first dummy discharge pattern electrically connected to the first primary dummy subpad; And a second discharge terminal provided with a predetermined gap with the first dummy discharge pattern, wherein the second discharge pattern portion is one end of the second primary coil pattern. A second primary pad electrically connected to the second primary pad, a second primary subpad adjacent to the second primary pad and electrically connected to the first primary dummy subpad, and Second electrically connected to the second discharge terminal An additional discharge terminal, wherein the second primary subpad is electrically connected to the second primary external electrode, and the external electrode layer is electrically connected to the second additional discharge terminal. A second discharge electrode is further included.

The first coil pattern portion further includes a first primary dummy pad electrically connected to the second primary pad, and the first discharge pattern portion includes the first first pattern pad. The second discharge pattern portion further includes a first primary dummy subpad adjacent to the second dummy pad and electrically connected to the second primary external electrode, and a second discharge terminal. A second primary pad electrically connected to one end of the second primary coil pattern, and an electrical connection adjacent to the second primary pad and to the first primary dummy subpad. A predetermined gap is provided between the second primary subpad, the first dummy discharge pattern electrically connected to the second primary subpad, and the first dummy discharge pattern. A second additional terminal electrically connected to the second discharge terminal; A discharge terminal, wherein the second primary subpad is electrically connected to the second primary external electrode, and the external electrode layer is electrically connected to the second additional discharge terminal. A second discharge electrode is further included.

In addition, in the electronic component according to another embodiment of the present invention, means for discharging may be provided on one side or both sides of the secondary coil pattern.

According to still another embodiment of the present invention, there is provided an electronic component manufacturing method, wherein a primary coil pattern and a secondary coil pattern are provided via at least one of a dielectric and an insulator, and the primary coil pattern is provided. Or a method of manufacturing an electronic component including at least one discharge terminal for discharging an overvoltage or an overcurrent applied to the secondary coil pattern by a photoresist method, wherein the primary coil pattern and the secondary coil pattern include: A photoresist pattern that exposes a region to be plated also exposes a region where the discharge terminal is formed.

One end is connected to at least one of the four external electrodes electrically connected to both ends of the primary coil pattern and the secondary coil pattern, and the other end is predetermined from the discharge terminal. It is desirable that a discharge pattern separated by a gap is further formed.

The gap is preferably determined within a range of 1 to 10 μm.

An electronic component manufacturing method according to still another embodiment of the present invention is a method for manufacturing the above-described electronic component by a photoresist method, wherein the first coil pattern portion and the first discharge pattern portion are Forming a first pattern layer using a first photoresist pattern that exposes a region to be formed; and applying an insulator or dielectric to the top surface of the first pattern layer to form a first insulation Forming a skin, and using a second photoresist pattern exposing a region where the second coil pattern portion and the second discharge pattern portion are formed, Forming a second pattern layer, and using a third photoresist pattern exposing a region where the coil electrode portion and the discharge electrode portion are to be formed. And forming the outer electrode layer on the upper surface of the over down layer.

According to one embodiment of the present invention configured as described above, an overvoltage or an overcurrent applied to an electronic component can be efficiently discharged, the life of the electronic component itself can be extended, and various types of electronic components can be used. There is an effect that the reliability of the electronic device can be improved.

In addition, since a structure that can discharge static electricity without increasing the area or thickness of the electronic component is mounted in the electronic component, there is an effect that it is advantageous for downsizing.

1 is a perspective view schematically illustrating an electronic component according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of FIG. 1. It is sectional drawing which illustrated schematically the cross section which follows the II 'line | wire of FIG. FIG. 2 is a cross-sectional view schematically illustrating a cross section taken along line II-II ′ in FIG. 1. 1 is a plan view schematically illustrating a first pattern layer of an electronic component according to an embodiment of the present invention. FIG. 5 is a cross-sectional view schematically illustrating a cross section taken along line II ′ of FIG. 4. It is sectional drawing which illustrated schematically the cross section which follows the II-II 'line | wire of FIG. It is the top view which illustrated the 2nd pattern layer of the electronic component by one embodiment of the present invention roughly. FIG. 7 is a cross-sectional view schematically illustrating a cross section taken along line II ′ of FIG. 6. FIG. 7 is a cross-sectional view schematically illustrating a cross section taken along line II-II ′ in FIG. 6. 1 is a plan view schematically illustrating an external electrode layer of an electronic component according to an embodiment of the present invention. It is sectional drawing which illustrated schematically the cross section which follows the II 'line of FIG. It is sectional drawing which illustrated schematically the cross section which follows the II-II 'line | wire of FIG. It is a circuit diagram of the electronic component by one Embodiment of this invention. 1 is a flowchart schematically illustrating an electronic component manufacturing method according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. Each embodiment shown below is given as an example so that those skilled in the art can sufficiently communicate the idea of the present invention. Therefore, the present invention is not limited to the embodiments described below, but can be embodied in other forms. In the drawings, the size and thickness of the device can be exaggerated for convenience. Like reference numerals refer to like elements throughout the specification.

The terminology used herein is for the purpose of describing embodiments and is not intended to limit the invention. In this specification, the singular includes the plural unless specifically stated otherwise. As used herein, “includes” a stated component, step, action, and / or element does not exclude the presence or addition of one or more other components, steps, actions, and / or elements. Want to be understood.

Hereinafter, with reference to an accompanying drawing, composition and an operation effect of the present invention are explained in detail.

1 is a perspective view schematically illustrating an electronic component according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of FIG. 1, and FIG. 3a is a cross-sectional view taken along the line II ′ of FIG. FIG. 3B is a cross-sectional view schematically illustrating a cross section taken along line II-II ′ of FIG. 1.

Referring to FIGS. 1 to 3b, an electronic component according to an embodiment of the present invention is a discharge terminal connected to a general electronic component including a primary coil pattern and a secondary coil pattern through a dielectric 60 or an insulator. Are additionally provided.

In addition, a discharge electrode is electrically connected to the discharge terminal, and extends from any one of four external electrodes electrically connected to both ends of the primary coil pattern or both ends of the secondary coil pattern. The discharge pattern is provided at a predetermined interval from the discharge terminal.

For convenience of explanation, the gap between the discharge terminal and the discharge pattern is referred to as a gap G.

When the gap G is formed between the conductive material and another conductive material, the magnitude of the voltage at which discharge starts varies depending on the width of the gap G. For example, when the gap G is 1 μm, a discharge phenomenon occurs when the voltage difference between both ends of the gap G is about 100,000 volts.

On the other hand, the voltage applied excessively by static electricity in various electronic devices is in the range of approximately 100,000 to 1 million volts, and therefore, in the electronic component according to one embodiment of the present invention, the gap G between the discharge pattern and the discharge terminal. Can be determined in the range of 1 to 10 μm.

Specifically, as shown in FIGS. 1 to 3 b, the electronic component according to the embodiment of the present invention includes a substrate 40, a first pattern layer 10, a second pattern layer 20, and an external electrode layer 30.

The substrate 40 is made of a magnetic material such as ferrite. In this case, the first pattern layer 10 may be formed in a state where an oxide film (passive layer) 50 is formed on the surface in order to ensure insulation between the substrate 40 and the coil pattern.

The first pattern layer 10 includes a first coil pattern portion and a first discharge pattern portion. The second pattern layer 20 includes a second coil pattern portion and a second discharge pattern portion.

The first coil pattern portion and the second coil pattern portion may be formed in the same manner as an electronic component such as a coil component or a filter component provided with a plurality of coil patterns. Further, the first discharge pattern portion is provided in the same layer as the layer where the first coil pattern portion is formed. In order to minimize the flow of magnetic flux and the entire area of the electronic component, it is desirable to form the outer region of the first coil pattern portion.

The second discharge pattern portion is preferably provided in the same layer as the layer on which the second coil pattern portion is formed, and is similarly formed in the outer region of the second coil pattern portion.

For convenience of explanation, the electronic component is divided into the first pattern layer 10, the second pattern layer 20, and the external electrode layer 30, and these layers are illustrated in FIG. 2 as an exploded perspective view. It is not limited. That is, the present invention is not limited to the case where the electronic component according to the embodiment of the present invention is formed in a laminated type.

FIG. 4 is a plan view schematically illustrating a first pattern layer 10 of an electronic component according to an embodiment of the present invention, and FIG. 5a schematically illustrates a cross section taken along line II ′ of FIG. FIG. 5B is a cross-sectional view schematically illustrating a cross section taken along the line II-II ′ of FIG.

Referring to FIG. 4, first pattern layer 10 is large and includes a first coil pattern portion and a first discharge pattern portion.

First, the first coil pattern portion includes a first primary coil pattern 1C-1, a first secondary coil pattern 2C-1, a first primary pad 1P-1, and a first secondary pad 2P-. 1 and a first primary internal terminal 1IT-1 and a first secondary internal terminal 2IT-1.

The first primary coil pattern 1C-1 and the first secondary coil pattern 2C-1 are electrically insulated and magnetically coupled.

The first primary pad 1P-1 is electrically connected to one end of the first primary coil pattern 1C-1, and the first primary internal terminal 1IT-1 is electrically connected to the other end. The

A first secondary pad 2P-1 is electrically connected to one end of the first secondary coil pattern 2C-1, and a first secondary internal terminal 2IT-1 is electrically connected to the other end. The

The first primary pad 1P-1 and the first secondary pad 2P-1 are electrically connected to the external electrode through the second pattern layer 20 described later. The first primary internal terminal 1IT-1 and the first secondary internal terminal 2IT-1 are a second primary internal terminal 1IT-2 and a second secondary internal terminal of the second pattern layer 20, which will be described later. 2IT-2 is connected through vias 1V and 2V, respectively.

For easy connection of the external electrodes, the first primary dummy pad 1DP-1 and the first secondary dummy pad 2DP-1 are connected to the first primary pad 1P-1 and the first secondary pad 2P-. 1 may be further provided on the opposite side so as to be symmetric.

Next, the first discharge pattern portion includes a first discharge terminal D1-1, a first discharge pattern DC1-1, and a first primary subpad 1SP-1.

The first primary subpad 1SP-1 is in contact with the first primary pad 1P-1, but is not in direct contact therewith.

The first discharge pattern DC1-1 is electrically connected to the first primary subpad 1SP-1, and extends toward the first discharge terminal D1-1.

The first discharge terminal D1-1 is provided with a predetermined gap G from the first discharge pattern DC1-1. The range of the gap G is preferably determined in the range of 1 to 10 μm.

On the other hand, instead of the first discharge terminal D1-1, the first discharge pattern DC1-1, and the first primary subpad 1SP-1, the second discharge terminal D2-1, the second discharge pattern DC2-1. Also, a first secondary subpad 2SP-1 may be provided.

However, such a configuration is effective when an overvoltage or an overcurrent applied to the electronic component flows into the second primary pad 1P-2 rather than the first primary pad 1P-1. It is.

In addition, when the first primary dummy pad 1DP-1 is provided in the first coil pattern portion, the first primary dummy subpad 1DSP-1, the first dummy discharge pattern DC1-2, and the second discharge The electrode ED2 may be provided, and when the first secondary dummy pad 2DP-1 is provided, the first secondary dummy subpad 2DSP-1, the second dummy discharge pattern DC2-2, and the first discharge An electrode ED1 may be provided.

FIG. 6 is a plan view schematically illustrating the second pattern layer 20 of the electronic component according to the embodiment of the present invention, and FIG. 7a schematically illustrates a cross section taken along line II ′ of FIG. FIG. 7B is a cross-sectional view schematically illustrating a cross section taken along line II-II ′ of FIG.

As shown in FIGS. 6 to 7b, the second pattern layer 20 is large and includes a second coil pattern portion and a second discharge pattern portion, and the first pattern layer 10 of FIG. It can be seen that the form is similar.

First, the second coil pattern portion includes a second primary coil pattern 1C-2, a second secondary coil pattern 2C-2, a second primary pad 1P-2, and a second secondary pad 2P-. 2, a second primary internal terminal 1IT-2 and a second secondary internal terminal 2IT-2 are provided.

The second primary coil pattern 1C-2 and the second secondary coil pattern 2C-2 are electrically insulated and magnetically coupled.

A second primary pad 1P-2 is electrically connected to one end of the second primary coil pattern 1C-2, and a second primary internal terminal 1IT-2 is electrically connected to the other end. The

A second secondary pad 2P-2 is electrically connected to one end of the second secondary coil pattern 2C-2, and a second secondary internal terminal 2IT-2 is electrically connected to the other end. The

The second primary pad 1P-2 and the second secondary pad 2P-2 are electrically connected to an external electrode of the external electrode layer 30 to be described later, and the second primary internal terminal 1IT-2 and the second primary pad 1P-2 The second secondary internal terminal 2IT-2 is connected to the first primary internal terminal 1IT-1 and the first secondary internal terminal 2IT-1 of the first pattern layer 10 through vias 1V and 2V, respectively. Is done.

According to one embodiment, the second primary dummy pad 1DP-2 and the second secondary dummy pad 2DP-2 are connected to the second primary pad 1P-2 and the second primary pad 1DP-2 for easy connection of external electrodes. It may be further provided on the opposite side so as to be symmetrical to the secondary pad 2P-2.

Next, the second discharge pattern unit includes a first additional discharge terminal D1-2 and a second primary dummy subpad 1DSP-2.

The second primary dummy subpad 1DSP-2 is in contact with the second primary dummy pad 1DP-2, but is not in direct contact therewith.

The first additional discharge terminal D1-2 is electrically connected to the first discharge terminal D1-1.

On the other hand, a second additional discharge terminal D2-2 may be provided in place of the first additional discharge terminal D1-2 by a modification of the first pattern layer 10 described above.

Further, instead of providing the first dummy discharge pattern DC1-2 in the first pattern layer 10, a configuration similar to the first dummy discharge pattern DC1-2 may be provided in the second pattern layer 20.

That is, although not shown, a dummy discharge pattern extending from the second primary subpad 1SP-2 in contact with the second primary pad 1P-2 toward the second additional discharge terminal D2-2 is further provided. And a gap G may be secured between the dummy discharge pattern and the second additional discharge terminal D2-2.

FIG. 8 is a plan view schematically illustrating an external electrode layer 30 of an electronic component according to an embodiment of the present invention, and FIG. 9a is a cross-sectional view schematically illustrating a cross section taken along line II ′ of FIG. FIG. 9B is a cross-sectional view schematically illustrating a cross section taken along the line II-II ′ of FIG.

As shown in FIGS. 8 to 9b, the external electrode layer 30 is large and is divided into a coil electrode portion and a discharge electrode portion.

First, the coil electrode portion includes a first primary external electrode 1E, a second primary external electrode 2E-2, a first secondary external electrode 2E, and a second secondary external electrode 2E-1, The electrode portion includes a first discharge electrode ED1.

Further, a second discharge electrode ED2 may be further provided in the discharge electrode portion.

The first primary external electrode 1E is electrically connected to the second primary dummy pad 1DP-2 and the second primary dummy subpad 1DSP-2. Therefore, the first primary pad 1P-1 electrically connected to the second primary dummy pad 1DP-2 and the first primary pad electrically connected to the first primary pad 1P-1. One end of the coil pattern 1C-1 can be connected to the first primary external electrode 1E. The first primary external electrode 1E is electrically connected to the first discharge pattern DC1-1 through the first primary subpad 1SP-1 electrically connected to the second primary dummy subpad 1DSP-2. Connected to.

The second primary external electrode 2E-2 is electrically connected to the second primary pad 1P-2 and the second primary subpad 1SP-2. Therefore, one end of the second primary coil pattern 1C-2 electrically connected to the second primary pad 1P-2 is connected to the second primary external electrode 2E-2. Further, the second primary external electrode 2E-2 extends from the first primary dummy subpad 1DSP-1 electrically connected to the second primary subpad 1SP-2 to the first dummy discharge pattern DC1-2. Is electrically connected.

The first secondary external electrode 2E is electrically connected to the second secondary dummy pad 2DP-2 and the second secondary dummy subpad 2DSP-2. Therefore, the first secondary pad 2P-1 electrically connected to the second secondary dummy pad 2DP-2 and the first secondary pad electrically connected to the first secondary pad 2P-1 One end of the coil pattern 2C-1 is connected to the first secondary external electrode 2E. Further, the first secondary external electrode 2E is electrically connected to the second discharge pattern DC2-1 through the first secondary subpad 2SP-1 electrically connected to the second secondary dummy subpad 2DSP-2. Connected to.

The second secondary external electrode 2E-1 is electrically connected to the second secondary pad 2P-2 and the second secondary subpad 2SP-2. Therefore, one end of the second secondary coil pattern 2C-2 electrically connected to the second secondary pad 2P-2 is connected to the second secondary external electrode 2E-1. In addition, the second secondary external electrode 2E-1 extends from the first secondary dummy subpad 2DSP-1 electrically connected to the second secondary subpad 2SP-2 to the second dummy discharge pattern DC2-2. Is electrically connected.

On the other hand, the first discharge electrode ED1 is electrically connected to the first discharge terminal D1-1 through the first additional discharge terminal D1-2, and the second discharge electrode ED2 is electrically connected to the second additional discharge terminal D2-. 2 is electrically connected to the second discharge terminal D2-1.

Accordingly, when a normal signal is applied to the first primary external electrode 1E, the normal signal flows to the first primary coil pattern 1C-1, and the electronic component operates normally. On the other hand, when an abnormal signal is applied to the first primary external electrode 1E, an overvoltage or an overcurrent is induced to the first primary subpad 1SP-1 and the first discharge pattern DC1-1, and the first discharge. Since the electric discharge is performed to the terminal D1-1, it is possible to prevent deterioration of other components of the electronic component including the first primary coil pattern 1C-1.

Further, according to the position of the terminal to which an external signal is applied or static electricity flows into the electronic component, as described in the various embodiments, the first discharge pattern portion, the second discharge pattern portion, The discharge electrode part may be appropriately modified as necessary.

FIG. 10 is a circuit diagram of an electronic component according to an embodiment of the present invention.

Referring to FIG. 10, when an overvoltage or overcurrent is applied to first primary external electrode 1E, discharge is possible through first discharge electrode ED1, and a normal signal is applied to first primary external electrode 1E. In such a case, the insulation between the first discharge electrode ED1 and the first primary external electrode 1E is ensured by the gap G, and a signal flows through a normal path and the electronic component Will be activated.

Since the second primary external electrode 2E-2, the first secondary external electrode 2E, and the second secondary external electrode 2E-1 are also as described above, redundant description will be omitted. .

FIG. 11 is a flowchart schematically illustrating an electronic component manufacturing method according to an embodiment of the present invention.

1 to 11, in an electronic component manufacturing method according to an embodiment of the present invention, a first photoresist exposing a region in which a first coil pattern portion and a first discharge pattern portion are formed. A step of forming the first pattern layer 10 using a pattern (S110), and a step of forming an insulating layer or dielectric 60 on the upper surface of the first pattern layer 10 to form a first insulating layer (see FIG. S120) and a second pattern layer on the upper surface of the first insulating layer by using a second photoresist pattern that exposes a region where the second coil pattern portion and the second discharge pattern portion are formed. The external electrode layer 30 is formed on the upper surface of the second pattern layer 20 by using the third photoresist pattern that exposes the region in which the coil electrode portion and the discharge electrode portion are formed (S130). And a step (S140) to be formed.

Accordingly, there is no need to add a separate process for forming the first discharge pattern portion, the second discharge pattern portion, the discharge electrode portion, and the like, and the first coil pattern portion and the second coil pattern portion respectively. And means for discharging can be provided in the same layer where the coil electrode portion is formed.

The gap G is preferably determined in the range of 1 to 10 μm. When a method of forming a conductive pattern by a printing method or the like is applied, it is difficult to form the gap G to 10 μm or less, and it is difficult to ensure the uniformity of the gap G.

On the other hand, in the present invention, since the discharge means including the gap G is provided by applying the photoresist method, the gap G can be formed with precision and uniformity within a required range.

The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

DESCRIPTION OF SYMBOLS 10 1st pattern layer 20 2nd pattern layer 30 External electrode layer 40 Substrate 50 Oxide film 60 Dielectric 70, 80, 90 Insulator 1C-1 1st primary coil pattern 2C-1 1st secondary coil Pattern 1P-1 First primary pad 2P-1 First secondary pad 1SP-1 First primary subpad 2SP-1 First secondary subpad 1DP-1 First primary dummy pad 2DP-1 1st secondary dummy pad 1DSP-1 1st primary dummy subpad 2DSP-1 1st secondary dummy subpad D1-1 1st discharge terminal D2-1 2nd discharge terminal DC1-1 1st discharge Pattern DC2-1 Second discharge pattern 1IT-1 First primary internal terminal 2IT-1 First secondary internal terminal 1V Primary via 2V Secondary via 1C-2 Second primary coil pattern 2C-2 Second secondary Pattern 1P-2 second primary pad 2P-2 second secondary pad 1SP-2 second primary subpad 2SP-2 second secondary subpad 1DP-2 second primary dummy pad 2DP- 2 2nd secondary dummy pad 1DSP-2 2nd primary dummy subpad 2DSP-2 2nd secondary dummy subpad D1-2 1st additional discharge terminal D2-2 2nd additional discharge terminal DC1-2 2nd 1st dummy discharge pattern DC2-2 2nd dummy discharge pattern 1IT-2 2nd primary internal terminal 2IT-2 2nd secondary internal terminal G Gap 1E 1st primary external electrode 1E-I 2nd Primary external electrode 2E First secondary external electrode 2E-I Second secondary external electrode ED1 First discharge electrode ED2 Second discharge electrode

Claims (15)

An electronic component provided with a primary coil pattern and a secondary coil pattern via at least one of a dielectric and an insulator,
An electronic component comprising at least one discharge terminal for discharging an overvoltage or an overcurrent applied to the primary coil pattern or the secondary coil pattern. A first primary external electrode is electrically connected to one end of the primary coil pattern,
A second primary external electrode is electrically connected to the other end of the primary coil pattern,
A first secondary external electrode is electrically connected to one end of the secondary coil pattern,
A second secondary external electrode is electrically connected to the other end of the secondary coil pattern,
A discharge electrode is electrically connected to the discharge terminal,
Electrically connected to at least one of the first primary external electrode, the second primary external electrode, the first secondary external electrode, and the second secondary external electrode; The electronic component according to claim 1, further comprising a discharge pattern provided with a predetermined gap between the discharge terminal and the discharge terminal. The electronic component according to claim 2, wherein the gap is determined within a range of 1 to 10 μm. An electronic component including a first pattern layer, a second pattern layer, and an external electrode layer,
The first pattern layer includes:
A first primary coil pattern; a first secondary coil pattern; a first primary pad electrically connected to one end of the first primary coil pattern; and one end of the first secondary coil pattern. In addition to the first secondary pad electrically connected to the first primary pad, the first primary internal terminal electrically connected to the other end of the first primary coil pattern, and the first secondary coil pattern A first coil pattern portion having a first secondary internal terminal electrically connected to an end;
A first primary subpad provided adjacent to the first primary pad, a first discharge pattern having one end electrically connected to the first primary subpad, and the first discharge pattern; Including a first discharge pattern portion having a first discharge terminal provided with a predetermined gap therebetween,
The second pattern layer includes
A second primary coil pattern; a second secondary coil pattern; a second primary pad electrically connected to one end of the second primary coil pattern; and one end of the second secondary coil pattern. A second secondary pad electrically connected to the second primary pad, a second primary internal terminal electrically connected to the other end of the second primary coil pattern, and the second secondary coil pattern A second coil pattern portion having a second secondary internal terminal electrically connected to an end and a second primary dummy pad electrically connected to the first primary pad;
A second primary connected to the first primary subpad adjacent to the first additional discharge terminal and the second primary dummy pad electrically connected to the first discharge terminal. A second discharge pattern portion having a dummy subpad,
The external electrode layer is
A first primary external electrode electrically connected to one end of a primary coil pattern formed by connecting the first primary coil pattern and the second primary coil pattern; and the primary coil pattern A second primary external electrode electrically connected to the other end of the second coil, and an electric terminal connected to one end of the secondary coil pattern formed by connecting the first secondary coil pattern and the second secondary coil pattern. A second secondary external electrode electrically connected to the other end of the secondary coil pattern, and a second secondary external electrode electrically connected to the other end of the secondary coil pattern;
A discharge electrode portion having a first discharge electrode electrically connected to the first additional discharge terminal;
The second primary dummy subpad is an electronic component electrically connected to the first primary external electrode. The first coil pattern unit further includes a first primary dummy pad electrically connected to the second primary pad,
The first discharge pattern portion is
A first primary dummy subpad adjacent to the first primary dummy pad and electrically connected to the second primary external electrode;
A first dummy discharge pattern electrically connected to the first primary dummy subpad;
A second discharge terminal provided with a predetermined gap between the first dummy discharge pattern and the first dummy discharge pattern;
The second discharge pattern portion is
A second primary pad electrically connected to one end of the second primary coil pattern, and an electrical connection adjacent to the second primary pad and to the first primary dummy subpad. A second primary subpad;
A second additional discharge terminal electrically connected to the second discharge terminal;
The second primary subpad is electrically connected to the second primary external electrode;
The electronic component according to claim 4, wherein the external electrode layer further includes a second discharge electrode that is electrically connected to the second additional discharge terminal. The first coil pattern unit further includes a first primary dummy pad electrically connected to the second primary pad,
The first discharge pattern portion is
A first primary dummy subpad adjacent to the first primary dummy pad and electrically connected to the second primary external electrode;
A second discharge terminal;
The second discharge pattern portion is
A second primary pad electrically connected to one end of the second primary coil pattern;
A second primary subpad adjacent to the second primary pad and electrically connected to the first primary dummy subpad;
A first dummy discharge pattern electrically connected to the second primary subpad;
A second additional discharge terminal electrically connected to the second discharge terminal with a predetermined gap between the first dummy discharge pattern and the second dummy discharge pattern;
The second primary subpad is electrically connected to the second primary external electrode;
The electronic component according to claim 4, wherein the external electrode layer further includes a second discharge electrode that is electrically connected to the second additional discharge terminal. An electronic component including a first pattern layer, a second pattern layer, and an external electrode layer,
The first pattern layer includes:
A first primary coil pattern; a first secondary coil pattern; a first primary pad electrically connected to one end of the first primary coil pattern; and one end of the first secondary coil pattern. In addition to the first secondary pad electrically connected to the first primary pad, the first primary internal terminal electrically connected to the other end of the first primary coil pattern, and the first secondary coil pattern A first coil pattern portion including a first secondary internal terminal electrically connected to an end;
A first secondary subpad provided adjacent to the first secondary pad; a second discharge pattern having one end electrically connected to the first secondary subpad; and the second discharge pattern Including a first discharge pattern portion having a second discharge terminal provided with a predetermined gap therebetween,
The second pattern layer includes
A second primary coil pattern; a second secondary coil pattern; a second primary pad electrically connected to one end of the second primary coil pattern; and one end of the second secondary coil pattern. A second secondary pad electrically connected to the second primary pad, a second primary internal terminal electrically connected to the other end of the second primary coil pattern, and the second secondary coil pattern A second coil pattern portion having a second secondary internal terminal electrically connected to an end and a second secondary dummy pad electrically connected to the first secondary pad;
A second secondary discharge terminal electrically connected to the first secondary subpad adjacent to the second additional discharge terminal electrically connected to the second discharge terminal and the second secondary dummy pad. A second discharge pattern portion having a dummy subpad,
The external electrode layer is
A first primary external electrode electrically connected to one end of a primary coil pattern formed by connecting the first primary coil pattern and the second primary coil pattern; and the primary coil pattern A second primary external electrode electrically connected to the other end of the second coil, and an electric terminal connected to one end of the secondary coil pattern formed by connecting the first secondary coil pattern and the second secondary coil pattern. A second secondary external electrode electrically connected to the other end of the secondary coil pattern, and a second secondary external electrode electrically connected to the other end of the secondary coil pattern;
A discharge electrode portion having a second discharge electrode electrically connected to the second additional discharge terminal;
The second secondary dummy subpad is an electronic component electrically connected to the first secondary external electrode. The first coil pattern unit further includes a first secondary dummy pad electrically connected to the second secondary pad,
The first discharge pattern portion is
A first secondary dummy subpad adjacent to the first secondary dummy pad and electrically connected to the second secondary external electrode;
A second dummy discharge pattern electrically connected to the first secondary dummy subpad;
A first discharge terminal provided at a predetermined gap with the second dummy discharge pattern;
The second discharge pattern portion is
A second secondary pad electrically connected to one end of the second secondary coil pattern;
A second secondary subpad adjacent to the second secondary pad and electrically connected to the first secondary dummy subpad;
A first additional discharge terminal electrically connected to the first discharge terminal;
The second secondary subpad is electrically connected to the second secondary external electrode;
The electronic component according to claim 7, wherein the external electrode layer further includes a first discharge electrode that is electrically connected to the first additional discharge terminal. The first coil pattern unit further includes a first secondary dummy pad electrically connected to the second secondary pad,
The first discharge pattern portion is
A first secondary dummy subpad adjacent to the first secondary dummy pad and electrically connected to the second secondary external electrode;
A first discharge terminal;
The second discharge pattern portion is
A second secondary pad electrically connected to one end of the second secondary coil pattern;
A second secondary subpad adjacent to the second secondary pad and electrically connected to the first secondary dummy subpad;
A second dummy discharge pattern electrically connected to the second secondary subpad;
A first additional discharge terminal electrically connected to the first discharge terminal with a predetermined gap between the second dummy discharge pattern and the second dummy discharge pattern;
The second secondary subpad is electrically connected to the second secondary external electrode;
The electronic component according to claim 7, wherein the external electrode layer further includes a first discharge electrode that is electrically connected to the first additional discharge terminal. The electronic component according to claim 7, wherein the gap is determined within a range of 1 to 10 μm. A primary coil pattern and a secondary coil pattern are provided through at least one of a dielectric and an insulator, and discharge overvoltage or overcurrent applied to the primary coil pattern or the secondary coil pattern. A method of manufacturing an electronic component having at least one discharge terminal by a photoresist method,
A method of manufacturing an electronic component, wherein a photoresist pattern exposing a region where the primary coil pattern and the secondary coil pattern are to be plated also exposes a region where the discharge terminal is formed. One end is connected to at least one of the four external electrodes electrically connected to both ends of the primary coil pattern and the secondary coil pattern, and the other end is predetermined from the discharge terminal. The method of manufacturing an electronic component according to claim 11, further comprising forming a discharge pattern separated by a gap. The electronic component manufacturing method according to claim 12, wherein the gap is determined within a range of 1 to 10 μm. In the method of manufacturing the electronic component of claim 4 by a photoresist method,
Forming the first pattern layer using a first photoresist pattern that exposes a region where the first coil pattern portion and the first discharge pattern portion are formed;
Applying an insulator or dielectric on the top surface of the first pattern layer to form a first insulating layer;
The second pattern layer is formed on the upper surface of the first insulating layer using a second photoresist pattern that exposes a region where the second coil pattern portion and the second discharge pattern portion are to be formed. And steps to
Forming an external electrode layer on an upper surface of the second pattern layer using a third photoresist pattern exposing a region where the coil electrode portion and the discharge electrode portion are formed. Method. The electronic component manufacturing method according to claim 14, wherein the gap is determined within a range of 1 to 10 μm.

Images