JP2013217876A - Sensor module, stress detector and robot - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor module having a structure by which a sensor module formed by installing a sensor element on a board with high positional accuracy can be manufactured with high productivity.SOLUTION: The sensor module includes: a wiring board 8 having multiple protrusions 20 on an internal surface of a first element positioning hole 8c; and a first sensor element 5 which is installed at the first element positioning hole 8c and detects stress. The multiple protrusions 20 being in contact with the first sensor element 5 support the first sensor element 5, and each of the protrusions has a pair of support ends 29 being in contact with the first sensor element 5 in a cross-sectional view of the wiring board 8. A side face where the first sensor element 5 is in contact with the wiring board 8 is parallel to a line segment connecting the pair of the support ends 29.

Description

  The present invention relates to a sensor module, a stress detection device, and a robot.

  Robots that perform work by installing a robot hand or tool at one end of the robot arm are widely used. Research has been conducted on robots that change the operation by installing a sensor module on the arm and detecting the stress applied to the arm. A sensor module for detecting stress is disclosed in Patent Document 1. According to this, a plurality of measuring elements sensitive to pressing force and shearing force are fixed to the thin disk by welding.

  Each measuring element detects the applied force by dividing it into component forces in the X, Y, and Z directions. Next, the pressing force, shearing force and torque applied to the sensor module were calculated using the component force detected by each measuring element. When calculating the torque applied to the sensor module, information on the force detected by the measurement element and position information of each measurement element are used. Therefore, in order to accurately calculate the torque applied to the sensor module, it is necessary to acquire highly accurate position information of each measuring element. For this purpose, it is effective to accurately arrange the relative positions of the measurement elements at predetermined positions.

Japanese Unexamined Patent Publication No. Hei 4-231827

  When the measuring element is fixed to the substrate, a method such as welding, soldering, brazing, or bonding after the measuring element is aligned with the substrate is used. At this time, since the measuring element moves from the time of alignment until it is fixed, it is difficult to fix with high positional accuracy.

  In view of this, it is conceivable to form a hole in the substrate in accordance with the shape of the measuring element using a blade tool and install the measuring element in the hole. For example, when the measuring element is a square, a square hole is made in the substrate. Next, since the measurement element is positioned along the hole of the substrate by inserting the measurement element into the hole and installing it, the measurement element can be installed on the substrate with high positional accuracy.

  At this time, the hole and the measurement element are in contact with the side surface of the hole and the side surface of the measurement element. Each surface has irregularities, and the place where the surfaces come into contact with each other is not determined. Therefore, since it is necessary to manage the surface accuracy of all locations on each surface, the process has a large number of work steps. Therefore, a sensor module having a structure capable of manufacturing a sensor module in which a measuring element is installed on a substrate with high positional accuracy with high productivity has been desired.

  The present invention has been made to solve the above-described problems, and can be realized as the following forms or application examples.

[Application Example 1]
A sensor module according to this application example, comprising a through-hole, a substrate having a plurality of convex portions on an inner wall surface of the through-hole, and a sensor element that is installed in the through-hole and detects stress. The plurality of convex portions are in contact with the sensor element, and have a plurality of contact portions that are in contact with the sensor element in a cross-sectional view at a position including the convex portion of the substrate, and the sensor element is in contact with the substrate. Is parallel to a line segment connecting a plurality of the contact portions.

  According to this application example, the sensor module includes a substrate and a sensor element. And the through-hole is installed in the board | substrate and the some convex part is installed in the inner wall face of the through-hole. One convex portion is in contact with the sensor element at at least two points to fix and support the sensor element. Thereby, the position of the sensor element with respect to the substrate is determined by the location where the convex portion and the sensor element are in contact with the convex portion. And, by accurately forming the shape of only the convex portion in contact with the sensor element in the inner wall surface of the hole portion into which the sensor element is fitted, the relative position between the substrate and the sensor element can be combined with high accuracy while simplifying the processing step. .

  There is a method of making a hole in the shape of a sensor element in a substrate and installing the sensor element in this hole. At this time, the place where the hole and the sensor element come into contact is unspecified. Therefore, it is necessary to accurately form all the shapes of the hole and the sensor element where there is a possibility of contact. On the other hand, in this application example, a plurality of convex portions are provided in the through hole, and one convex portion is in contact with the surface of the substrate at two or more points. And the contact surface where a sensor element contacts a convex part is parallel to the contact part. Therefore, when the sensor element comes into contact with the convex portion, gravity acts on the sensor element and the substrate, and the sensor element is pressed against the convex portion. Therefore, contact can be made between the sensor element and the convex portion without leaving a gap. As a result, the sensor element can be arranged on the substrate with high positional accuracy. Furthermore, since the convex portion has a plurality of contact portions, the sensor elements can be arranged on the substrate with high accuracy by manufacturing the plurality of contact portions with high accuracy. As a result, the sensor module can be manufactured with high productivity as compared with the case where all the convex portions are manufactured with high accuracy.

[Application Example 2]
In the sensor module according to the application example, the convex portion includes a first convex portion and a second convex portion that protrude so as to sandwich the sensor element, and a line connecting the contact portions of the first convex portion. The angle formed between the line and the line connecting the contact portions of the second convex portion and the surface of the substrate is the same angle.

  According to this application example, the first convex portion and the second convex portion are provided on the substrate, and the protruding directions of the first convex portion and the second convex portion face each other so as to sandwich the sensor element. And the 1st convex part and the 2nd convex part have a plurality of contact parts, respectively, and the line segment which connected the contact part has the same angle. When the sensor element is installed between the first convex part and the second convex part, gravity acts on the sensor element and the substrate. And the contact part of a 1st convex part and the contact surface of a sensor element slide, and the contact part of a 2nd convex part and the contact surface of a sensor element slide. Therefore, the sensor element can be installed at the middle position between the first convex portion and the second convex portion.

[Application Example 3]
In the sensor module according to the application example, the convex portion includes a first convex portion and a second convex portion that protrude so as to sandwich the sensor element, and the first convex portion in the cross-sectional view of the substrate is the first convex portion. Line segments connecting the vertices of the plurality of contact portions are oblique with respect to the surface of the substrate, and the second convex portion is a plurality of the contact portions with respect to the surface of the substrate in a sectional view of the substrate. The first contact surface where the line segments connecting the vertices are orthogonal, and the sensor element contacts the first convex portion is parallel to the line segments connecting the plurality of contact portions of the first convex portion, The second contact surface where the sensor element contacts the second convex portion is parallel to a line segment connecting the plurality of contact portions of the second convex portion.

  According to this application example, the first convex portion and the second convex portion are provided on the substrate, and the protruding directions of the first convex portion and the second convex portion face each other so as to sandwich the sensor element. The first convex portion has an oblique contact portion with respect to the surface of the substrate, and the second convex portion has an orthogonal surface orthogonal to the surface of the substrate. The first contact surface of the sensor element is in contact with the first convex portion, and the second contact surface is in contact with the second convex portion. The first contact surface is parallel to the contact portion, and the second contact surface is parallel to the orthogonal surface.

  When the sensor element is installed between the first convex part and the second convex part, gravity acts on the sensor element and the substrate. And the contact part of a 1st convex part and the 1st contact surface of a sensor element slide, and a sensor element moves to the 2nd convex part side. Thereby, the orthogonal surface of a sensor element contacts with the 2nd convex part. Since the orthogonal plane is orthogonal to the surface of the substrate, the plane position can be formed with high accuracy. Therefore, it is possible to easily install the sensor element with respect to the substrate with high positional accuracy.

[Application Example 4]
In the sensor module according to the application example, the sensor element is in contact with the convex portion at the four contact surfaces intersecting, and the three contact surfaces out of the four contact surfaces are in contact with the one convex portion, The remaining one contact surface is in contact with the two convex portions.

  According to this application example, the sensor element has four intersecting contact surfaces. The four contact surfaces are in contact with the convex portions of the substrate. One contact surface is in contact with two convex portions. Thereby, the direction of the sensor element on the substrate is determined. Each of the three contact surfaces is in contact with one convex portion. Thereby, the position of the sensor element on the substrate is determined. Therefore, the orientation and position of the sensor element can be determined and fixed by the five convex portions. Further, since the convex portion is in point contact, fine adjustment of the position of the sensor element can be facilitated even when a manufacturing error occurs.

[Application Example 5]
In the sensor module according to the application example described above, when the length of the contact surface in the direction passing through the two convex portions in the remaining one contact surface is a surface length, the convex portions in the two convex portions. The interval is longer than half of the surface length.

  According to this application example, the interval between the two convex portions is set to be longer than half of the surface length. When an error occurs between the positions of the two convex portions for manufacturing reasons, the surface angle error can be made smaller than when the distance between the two convex portions is closer. Therefore, the angle of the surface of the sensor element can be accurately set on the substrate when the interval between the convex portions is longer than when the interval between the convex portions is shorter than half the surface length.

[Application Example 6]
In the sensor module according to the application example, the substrate includes a reference portion serving as a reference for the position of the convex portion.

  According to this application example, the substrate includes the reference portion. The positions of the plurality of convex portions are set based on the reference portion. Since the sensor element is installed in contact with the convex portion, the position of the sensor element is determined with reference to the reference portion. Accordingly, when the sensor module is installed, the sensor element can be installed with high positional accuracy by installing the reference portion with high positional accuracy.

[Application Example 7]
A stress detection apparatus according to this application example, wherein a plurality of sensor elements for detecting stress are installed in a through hole of a substrate, and the stress applied to the sensor module using outputs of the plurality of sensor elements The substrate has a plurality of convex portions on the inner wall surface of the through hole, the plurality of convex portions are in contact with and supported by the sensor element, It has a plurality of contact parts which contact the sensor element, and a contact surface where the sensor element contacts the substrate is parallel to a line segment which connected the plurality of contact parts.

  According to this application example, the stress detection apparatus includes a sensor module and a calculation unit that calculates stress. In the sensor module, a plurality of sensor elements are installed with high positional accuracy. The sensor element detects stress. The calculation unit can accurately calculate and output the stress detected by each sensor element and the torque applied to the stress detection device from the position of each sensor element. Further, the sensor element is placed in the through hole of the substrate in contact with the contact portion of the convex portion. Therefore, since there are few places for managing the accuracy of the substrate, the sensor module can be manufactured with high productivity.

[Application Example 8]
A robot according to this application example, comprising: a movable part; and a sensor module that is installed in the movable part and detects stress applied to the movable part, and the sensor module has a plurality of protrusions on an inner wall surface of the through hole. And a sensor element that detects the stress by contacting the plurality of convex portions, the plurality of convex portions are in contact with the sensor element, and the substrate is in a position including the convex portions. It has a plurality of contact portions that contact the sensor element in a cross-sectional view, and a contact surface where the sensor element contacts the substrate is parallel to a line segment that connects the plurality of contact portions.

  According to this application example, the robot includes the movable part and moves the movable part to perform work. The sensor module detects the stress applied to the movable part. The sensor module is installed with high positional accuracy with respect to the substrate. Therefore, the robot can recognize the location where the stress applied to the movable part is detected with high positional accuracy. Further, the sensor element is placed in the through hole of the substrate in contact with the contact portion of the convex portion. Since the board has few places to manage accuracy, the sensor module can be manufactured with high productivity. As a result, the robot can be a robot provided with a sensor module in which sensor elements are installed on a substrate with high positional accuracy and can be manufactured with high productivity.

1 is a schematic exploded perspective view showing a structure of a sensor module according to a first embodiment. (A) is a schematic plan view which shows the structure of a sensor module, (b) is a schematic sectional side view which shows the structure of a sensor module. (A) is a schematic plan view for demonstrating the support structure of a sensor element, (b) is a schematic sectional side view for demonstrating the support structure of a sensor element. (A) And (b) is a typical sectional side view for demonstrating the support structure of a sensor element in connection with a modification. FIG. 4A is a schematic side sectional view showing the structure of a sensor element, and FIG. 4B is a schematic plan view showing the structure of the sensor element, according to the first embodiment. In connection with the second embodiment, (a) is a schematic plan view for explaining the support structure of the sensor element, and (b) is a schematic side sectional view for explaining the support structure of the sensor element. In connection with the third embodiment, (a) is a schematic plan view showing a structure of a stress detection device, and (b) is a schematic perspective view for explaining a procedure for calculating stress. (A)-(d) is a principal part schematic top view for demonstrating the shape of a protrusion in connection with 4th Embodiment. (A)-(d) is a principal part schematic sectional drawing for demonstrating the shape of a protrusion in connection with 5th Embodiment. (A) And (b) is a schematic perspective view which shows the structure of a robot in connection with 6th Embodiment.

Hereinafter, examples will be described with reference to the drawings.
In addition, each member in each drawing is illustrated with a different scale for each member in order to make the size recognizable on each drawing.
(First embodiment)
In this embodiment, a characteristic example of a sensor module that detects vector components of stress and torque will be described with reference to FIGS. FIG. 1 is a schematic exploded perspective view showing the structure of the sensor module.

  As shown in FIG. 1, the sensor module 1 includes a first support substrate 2. The first support substrate 2 is a disc having a circular hole 2a in the center. A first lower receiving portion 2c, a second lower receiving portion 2d, and a third lower receiving portion that protrude in a square shape in plan view of the first supporting substrate 2 are formed on the upper surface 2b of the first supporting substrate 2 located on the upper side in the drawing. The part 2e is installed on a concentric circle. Near the four corners of the first lower receiving portion 2c, the second lower receiving portion 2d, and the third lower receiving portion 2e, lower fixing holes 2f are provided. Since the four lower fixing holes 2f are installed in each of the three lower receiving portions, the number of the lower fixing holes 2f is twelve.

  The first support substrate 2 has a first main body fixing hole 2g and a second main body fixing hole 2h. The first main body fixing hole 2g and the second main body fixing hole 2h are positioning holes for fixing the sensor module 1 to a device (not shown). The shape of the first main body fixing hole 2g is circular in a plan view of the first support substrate 2, and the shape of the second main body fixing hole 2h is a hole that is long in one direction. The sensor module 1 can be placed in a device (not shown) with high positional accuracy by inserting pins into the first main body fixing hole 2g and the second main body fixing hole 2h.

  A first positioning pin 3 and a second positioning pin 4 are installed on the upper surface 2b. The first positioning pin 3 and the second positioning pin 4 are installed with high positional accuracy with respect to the first main body fixing hole 2g and the second main body fixing hole 2h. The first positioning pin 3 and the second positioning pin 4 are rod-shaped, and the first support substrate 2 side and the tip side have different diameters. And the diameter of the 1st positioning pin 3 and the 2nd positioning pin 4 is a shape where the 1st support substrate 2 side is thicker than the front end side.

  A first sensor element 5 is installed as a sensor element so as to overlap with the first lower receiving part 2c, and a second sensor element 6 is installed as a sensor element so as to overlap with the second lower receiving part 2d. Further, a third sensor element 7 is installed as a sensor element so as to overlap the third lower receiving portion 2e. The first sensor element 5 includes a square plate-shaped receiving portion 5a on the first support substrate 2 side, and a substantially quadrangular prism-shaped exterior portion 5b is fixed on the receiving portion 5a. The second sensor element 6 and the third sensor element 7 have the same structure as the first sensor element 5. The second sensor element 6 has an exterior portion 6b fixed on the receiving portion 6a, and the third sensor element 7 has an exterior portion 7b fixed on the receiving portion 7a.

  A wiring substrate 8 as a substrate is placed on the receiving portion 5a, the receiving portion 6a, and the receiving portion 7a. The wiring board 8 is a disk having a hole 8 a at the center, like the first support board 2. The wiring board 8 is provided with a driving element 9 for driving the first sensor element 5, the second sensor element 6, and the third sensor element 7 on a mounting surface 8 b as a surface located on the side facing the first support substrate 2. Yes. The first sensor element 5, the second sensor element 6, and the third sensor element 7 are each connected to the drive element 9 by a wiring (not shown). The drive element 9 incorporates an electronic circuit formed of a semiconductor.

  The wiring board 8 has a first element positioning hole 8c as a through hole and a second element positioning at locations facing the first lower receiving part 2c, the second lower receiving part 2d, and the third lower receiving part 2e, respectively. A hole 8d and a third element positioning hole 8e are provided. The shape of the first element positioning hole 8c is such that the exterior portion 5b of the first sensor element 5 can be disposed through the first element positioning hole 8c. Similarly, the shapes of the second element positioning hole 8d and the third element positioning hole 8e are respectively formed through the second element positioning hole 8d and the third element positioning hole 8e so that the exterior part 6b and the exterior part 7b are arranged. It has a possible shape.

  The wiring board 8 is provided with a first substrate fixing hole 8g as a reference portion at a location facing the first positioning pin 3, and a second substrate fixing hole 8h as a reference portion at a location facing the second positioning pin 4. Has been. The shape of the first substrate fixing hole 8g is circular in a plan view of the wiring substrate 8, and the shape of the second substrate fixing hole 8h is a hole that is long in one direction. The longitudinal direction of the second substrate fixing hole 8h is a direction through which the first substrate fixing hole 8g passes.

  The tip of the first positioning pin 3 is inserted into the first substrate fixing hole 8g, and the tip of the second positioning pin 4 is inserted into the second substrate fixing hole 8h. At this time, the relative position between the first support substrate 2 and the wiring substrate 8 is determined by the first positioning pin 3 and the first substrate fixing hole 8g, and the first positioning pin 4 and the second substrate fixing hole 8h are used for the first. The relative angle between the support substrate 2 and the wiring substrate 8 is determined. Therefore, even when the distance between the first positioning pin 3 and the second positioning pin 4 varies, the first support substrate 2 and the wiring substrate 8 are arranged with high positional accuracy.

  The wiring board 8 includes a connection portion 8i protruding to the outer peripheral side. The connection portion 8i has a quadrangular plan view of the wiring board 8, and a plurality of output terminals (not shown) are provided on the mounting surface 8b. And the drive element 9 and the output terminal of the mounting surface 8b are connected by the wiring which is not illustrated. Electrical signals can be communicated with an external device (not shown) from this output terminal.

  A second support substrate 10 is installed so as to overlap the first sensor element 5, the second sensor element 6, and the third sensor element 7. The second support substrate 10 is a disk having the same shape as the first support substrate 2, and a hole 10 a is formed at the center. A first restraining pin 11 and a second restraining pin 12 are provided on the lower surface 10 b of the second support substrate 10 on the first support substrate 2 side. The first holding pin 11 is located at a location facing the first positioning pin 3, and the wiring board 8 is sandwiched between the first positioning pin 3 and the first holding pin 11. Similarly, the second holding pin 12 is located at a location facing the second positioning pin 4, and the wiring board 8 is sandwiched between the second positioning pin 4 and the second holding pin 12. Thereby, the wiring board 8 is prevented from moving up and down in the figure.

  A first upper receiving portion 10c is provided on the lower surface 10b so as to protrude at a location facing the first lower receiving portion 2c. The shape of the first upper receiving portion 10c is the same as that of the exterior portion 5b in the plan view of the second support substrate 10. Similarly, on the lower surface 10b, a second upper receiving portion 10d protrudes from a location facing the second lower receiving portion 2d, and a third upper receiving portion 10e is located at a location facing the third lower receiving portion 2e. Protrusively installed. In plan view of the second support substrate 10, the shape of the second upper receiving portion 10d is the same as that of the exterior portion 6b, and the shape of the third upper receiving portion 10e is the same shape as that of the exterior portion 7b.

  The second support substrate 10 is provided with an upper fixing hole 10 f at a location facing the lower fixing hole 2 f of the first support substrate 2. The upper fixing hole 10f and the lower fixing hole 2f have the same diameter and the same number. A fixing bolt 13 is inserted through the lower fixing hole 2f and the upper fixing hole 10f from the first support substrate 2 side, and is fixed by a nut 14 from the second support substrate 10 side.

  The material of the first support substrate 2, the second support substrate 10, the first positioning pins 3, the second positioning pins 4, the fixing bolts 13, and the nuts 14 may be any material that has mechanical strength and is difficult to deform, and is not particularly limited. . For example, the first support substrate 2, the second support substrate 10, the first positioning pins 3, the second positioning pins 4, the fixing bolts 13, and the nuts 14 can be made of various metals, ceramics, hard plastics, and the like. In the present embodiment, for example, stainless steel is used for the first support substrate 2, the second support substrate 10, the first positioning pin 3, the second positioning pin 4, the fixing bolt 13, and the nut 14.

  The material of the wiring board 8 is not particularly limited as long as it is mechanically strong and hardly deforms and has an insulating property. In the present embodiment, for example, ceramic is used as the material of the wiring board 8. The first restraining pin 11 and the second restraining pin 12 may be any elastic and durable member. In addition to silicone rubber, elastic rubber, and resin, a structurally elastic member such as a coil spring is used. Also good. In the present embodiment, for example, silicone rubber is used for the first holding pin 11 and the second holding pin 12.

  FIG. 2A is a schematic plan view showing the structure of the sensor module. As shown in FIG. 2A, fixing bolts 13 and nuts 14 are installed near the four corners of the first sensor element 5, the second sensor element 6, and the third sensor element 7. The wiring board 8 is disposed at a place that passes between the fixing bolts 13 and does not contact the fixing bolts 13.

  FIG. 2B is a schematic side cross-sectional view showing the structure of the sensor module, and shows a cross section taken along the line A-A ′ of FIG. As shown in FIG. 2B, the first sensor element 5 is sandwiched between the first lower receiving portion 2c and the first upper receiving portion 10c. Fixing bolts 13 and nuts 14 are installed near the four corners of the first sensor element 5, and the first support substrate 2 and the second support substrate 10 are fixed by the fixing bolts 13 and the nuts 14. By adjusting the tightening degree of the fixing bolt 13 and the nut 14, it is possible to adjust the force with which the first support substrate 2 and the second support substrate 10 press the first sensor element 5. The second sensor element 6 and the third sensor element 7 are also sandwiched between the first support substrate 2 and the second support substrate 10, and the force for pressing the second sensor element 6 and the third sensor element 7 is adjusted. ing. Thereby, pressure is applied to the first sensor element 5, the second sensor element 6, and the third sensor element 7.

  An exterior portion 5b is inserted into the first element positioning hole 8c. And the wiring 15 is installed in the mounting surface 8b of the wiring board 8, and the wiring 16 is installed also in the surface at the side of the exterior part 5b of the receiving part 5a. A conductive member 17 is disposed between the wiring 15 and the wiring 16, and the conductive member 17 energizes the wiring 15 and the wiring 16. The conductive member 17 is not particularly limited as long as it is a conductive member. A silver paste, a resin core bump, an FPC cable, a conductive film, or the like can be used. In this embodiment, for example, silver paste is used.

  A first positioning pin 3 erected on the first support substrate 2 is inserted into the first substrate fixing hole 8 g of the wiring substrate 8. Thereby, the wiring board 8 is set at the left and right positions in the figure. The first holding pins 11 and the first positioning pins 3 erected on the second support substrate 10 sandwich the wiring substrate 8. Thereby, the upper and lower positions of the wiring board 8 in the figure are determined. The second sensor element 6 and the third sensor element 7 have the same structure and will not be described.

  FIG. 3A is a schematic plan view for explaining the support structure of the sensor element, and shows a cross section taken along the line B-B ′ of FIG. FIG. 3B is a schematic side cross-sectional view for explaining the support structure of the sensor element, and is a cross section taken along line C-C ′ of FIG. 3A and 3B, the first protrusion 20a, the second protrusion 20b as the first protrusion, the third protrusion 20c, and the fourth protrusion are formed on the inner wall surface of the first element positioning hole 8c. The protrusions 20d and the protrusions 20 as the five protrusions of the fifth protrusion 20e as the second protrusion are provided. Further, a first support end 29a and a second support end 29b are provided on the second protrusion 20b, and a third support end 29c and a fourth support end 29d are provided on the fifth protrusion 20e. A straight line connecting the apexes formed by the support ends 29 as the plurality of contact portions of the fifth protrusion 20 e is inclined with respect to the mounting surface 8 b of the wiring board 8 in a cross-sectional view of the wiring board 8. Also in the first protrusion 20a, the third protrusion 20c, and the fourth protrusion 20d, the straight line connecting the apexes formed by the plurality of support ends 29 is oblique to the mounting surface 8b of the wiring board 8 in a cross-sectional view of the wiring board 8. It has become. A straight line connecting the apexes formed by the plurality of support ends 29 at each location is parallel to the exterior portion 5 b of the first sensor element 5.

  In the exterior portion 5 b of the first sensor element 5, a location facing the side surface of the first element positioning hole 8 c is an inclined surface with respect to the surface of the wiring board 8 in a cross-sectional view of the wiring board 8. This oblique surface is a contact surface that contacts the protrusion 20. Of the four contact surfaces, a contact surface facing the first protrusion 20a is a first side surface 5c, and a contact surface facing the second protrusion 20b is a second side surface 5d. Further, a contact surface that faces the third protrusion 20c and the fourth protrusion 20d is a third side surface 5e, and a contact surface that faces the fifth protrusion 20e is a fourth side surface 5f.

  The first sensor element 5 is in contact with the protrusions 20 at four intersecting surfaces of the first side surface 5c to the fourth side surface 5f. The third side surface 5e is in contact with the third protrusion 20c and the fourth protrusion 20d. Thereby, the direction of the first sensor element 5 in the wiring board 8 is determined. The three surfaces of the first side surface 5c, the second side surface 5d, and the fourth side surface 5f are in contact with one protrusion 20. Thereby, the position of the 1st sensor element 5 in the wiring board 8 is decided. Accordingly, the orientation and position of the first sensor element 5 can be determined and fixed by the five protrusions 20.

  A plurality of support ends 29 positioned at the tips of the five protrusions 20 serve as contact portions 21 that contact the first side surface 5c to the fourth side surface 5f. Among the contact portions 21, a contact portion where the first protrusion 20a contacts the first side surface 5c is referred to as a first contact portion 21a, and a contact portion where the second protrusion 20b contacts the second side surface 5d is referred to as a second contact portion 21b. . A contact portion where the third protrusion 20c contacts the third side surface 5e is referred to as a third contact portion 21c, and a contact portion where the fourth protrusion 20d contacts the third side surface 5e is referred to as a fourth contact portion 21d. Similarly, a contact portion where the fifth protrusion 20e contacts the fourth side surface 5f is referred to as a fifth contact portion 21e.

  In the second protrusion 20b, the first support end 29a and the second support end 29b serve as a second contact portion 21b that comes into contact with the second side surface 5d. A line segment connecting the first support end 29a and the second support end 29b and the second side surface 5d are parallel to each other. Similarly, in the 5th protrusion 20e, the 3rd support end 29c and the 4th support end 29d become the 5th contact part 21e which contacts the 4th side surface 5f. A line segment connecting the third support end 29c and the fourth support end 29d and the fourth side surface 5f are parallel to each other. Similarly, the first protrusion 20a and the first side surface 5c have the same structure. Further, the third protrusion 20c, the fourth protrusion 20d, and the third side surface 5e have the same structure.

  The first contact portion 21a is parallel to the first side surface 5c, and the second contact portion 21b is parallel to the second side surface 5d. Further, the third contact portion 21c and the fourth contact portion 21d are parallel to the third side surface 5e, and the fifth contact portion 21e is parallel to the fourth side surface 5f. And the angle of each surface with respect to the mounting surface 8b is the same angle.

  The first sensor element 5 is pressed against the protrusion 20 when gravity acts on the wiring board 8 and a force that causes the wiring board 8 to approach the first sensor element 5 acts. Thereby, the first sensor element 5 and the wiring board 8 are relatively moved in the plane direction of the wiring board 8. The first contact portion 21a is in contact with the first side surface 5c without a gap, and the second contact portion 21b is in contact with the second side surface 5d without a gap. The third contact portion 21c and the fourth contact portion 21d are in contact with the third side surface 5e without a gap, and the fifth contact portion 21e is in contact with the fourth side surface 5f without a gap. As a result, the first sensor element 5 can be arranged on the wiring board 8 with high positional accuracy.

  The second protrusion 20b and the fifth protrusion 20e are disposed so that the protruding directions face each other so as to sandwich the first sensor element 5. The second contact portion 21b and the fifth contact portion 21e have the same angle. When the first sensor element 5 is installed between the second protrusion 20b and the fifth protrusion 20e, gravity acts on the wiring board 8. Then, the second contact portion 21b and the second side surface 5d slide, and the fifth contact portion 21e and the fourth side surface 5f slide. Therefore, the 1st sensor element 5 can be installed in the middle position of the 2nd protrusion 20b and the 5th protrusion 20e.

  At this time, the protrusion 20 is in contact with the first sensor element 5 to fix and support the first sensor element 5. Thereby, the position of the first sensor element 5 with respect to the wiring board 8 is determined at the place where the protrusion 20 and the first sensor element 5 are in contact with each other. Then, the relative position between the wiring board 8 and the first sensor element 5 can be determined with high accuracy by accurately forming and managing the shape of the first sensor element 5 in contact with the protrusion 20.

  When the protrusions 20 are not installed, all the side surfaces of the first sensor element 5 are in contact with the first element positioning holes 8c. Therefore, it is necessary to form and manage all the side surfaces of the first sensor element 5 with high positional accuracy. Compared to this time, in the present embodiment, the sensor module 1 can be manufactured with high productivity because it is only necessary to manage the place where the first sensor element 5 contacts the protrusion 20.

  In the third side surface 5e, the length of the third side surface 5e in the direction in which the third contact portion 21c of the third protrusion 20c and the fourth contact portion 21d of the fourth protrusion 20d pass is defined as a surface length 22 as a surface length. The distance 23 between the third contact portion 21 c and the fourth contact portion 21 d is set to be longer than half of the surface length 22. When an error occurs between the positions of the third protrusion 20c and the fourth protrusion 20d due to manufacturing reasons, the angle of the third side surface 5e is larger than when the distance between the third protrusion 20c and the fourth protrusion 20d is closer. The error can be reduced. Therefore, the first sensor element 5 can be placed on the wiring board 8 with higher accuracy when the interval 23 is longer than when the distance 23 is shorter than half of the surface length 22.

  The first substrate fixing hole 8g and the second substrate fixing hole 8h serve as a reference portion of the wiring substrate 8 serving as a reference for the position of the protrusion 20. The first main body fixing hole 2g and the second main body fixing hole 2h serve as a reference portion of the sensor module 1 serving as a reference for the positions of the first substrate fixing hole 8g and the second substrate fixing hole 8h. Accordingly, the positions of the plurality of protrusions 20 are determined based on the reference portion of the sensor module 1. Since the first sensor element 5 is installed in contact with the protrusion 20, the position of the first sensor element 5 is determined with reference to the reference portion of the sensor module 1. Therefore, when the sensor module 1 is installed, the first sensor element 5 can be installed with high positional accuracy by installing the reference portion of the sensor module 1 with high positional accuracy.

  Heretofore, the alignment structure between the first sensor element 5 and the first element positioning hole 8c has been described. The same applies to the alignment structure of the second sensor element 6 and the second element positioning hole 8d. Similarly, the alignment structure of the third sensor element 7 and the third element positioning hole 8e is the same, and the description thereof is omitted.

  The cross-sectional shape of the support end 29 is not limited to this. For example, examples of other forms are shown in FIGS. 4 (a) and 4 (b). FIG. 4A is a schematic side sectional view for explaining the support structure of the sensor element, which is a cross section taken along the line C-C ′ of FIG. However, the cross-sectional shape of the support end 29 is different from FIG. In the present embodiment, a first support end 29e and a support end 29 of a second support end 29f are provided on the second protrusion 20b of the wiring board 8. A third support end 29g and a support end 29 of a fourth support end 29h are provided on the fifth protrusion 20e.

  The first support end 29e to the fourth support end 29h are pointed. Thereby, the wiring board 8 makes point contact with the first sensor element 5 at a plurality of locations. Further, even when the position of the first sensor element 5 needs to be finely adjusted, the micromachining time and the micromachining amount of the support end 29 can be reduced. The alignment structure shown in FIG. 4A is the same as that shown in FIG.

  FIG. 4B is a schematic side sectional view for explaining the support structure of the sensor element, and is a cross section taken along the line C-C ′ in FIG. However, the cross-sectional shape of the support end 29 is different from FIG. In the present embodiment, a first support end 29 i and a support end 29 of a second support end 29 j are provided on the second protrusion 20 b of the wiring board 8. The fifth protrusion 20e is provided with a support end 29, which is a third support end 29k and a fourth support end 29m.

  The tips of the first support end 29i to the fourth support end 29m are perpendicular to each other in cross-sectional view. The second side surface 5d, the fourth side surface 5f, and the support end 29 come into contact with each other at the corners, so that point contact occurs. Thereby, the wiring board 8 makes point contact with the first sensor element 5 at a plurality of locations. Further, the first support end 29 i to the fourth support end 29 m are perpendicular to the cross-sectional shape of the surface of the wiring board 8. Thereby, even when a minute adjustment of the position of the first sensor element 5 is required, the machining time and the minute machining amount required for fine adjustment of the support end 29 can be reduced. Further, it is possible to perform processing based on a vertical plane, and it is possible to easily perform processing using a milling cutter. The alignment structure shown in FIG. 4B is the same as that shown in FIG.

  FIG. 5A is a schematic side sectional view showing the structure of the sensor element, and FIG. 5B is a schematic plan view showing the structure of the sensor element. FIG. 5B is a view in which the exterior portion 5 b is removed from the first sensor element 5. The second sensor element 6 and the third sensor element 7 have the same structure as the first sensor element 5. The first sensor element 5 will be described, and the description of the second sensor element 6 and the third sensor element 7 will be omitted. As shown in FIG. 5A, in the first sensor element 5, a rectangular parallelepiped detection unit 24 is erected on the receiving unit 5 a, and an exterior unit 5 b is installed to cover the detection unit 24. Two directions orthogonal to each other in the plane in which the receiving portion 5a extends are defined as an X direction and a Y direction. A direction perpendicular to the X direction and the Y direction and from which the detection unit 24 protrudes is defined as a Z direction.

  A portion located in the Z direction in the exterior portion 5b is defined as a ceiling portion 5g. The surface on the Z direction side of the detection unit 24 is in contact with the ceiling 5g of the exterior 5b. And the force added to the 1st sensor element 5 from the receiving part 5a and the ceiling part 5g presses the detection part 24. FIG.

The detection unit 24 is configured using a piezoelectric member. For example, quartz, zirconate titanate (PZT: Pb (Zr, Ti) O ₃ ) lithium niobate, or lithium tantalate can be used for this member. In the present embodiment, for example, quartz is used as the material of the detection unit 24.

  The detection unit 24 includes a ground electrode layer 25, a Y component force detection unit 26, a ground electrode layer 25, a Z component force detection unit 27, a ground electrode layer 25, an X component force detection unit 28, and a ground electrode layer 25 on the receiving unit 5a. They are installed in this order. The ground electrode layer 25 between the receiving portion 5a and the first lower crystal plate 26a, the ground electrode layer 25 between the layers, and the ground electrode layer 25 between the third upper crystal plate 28c and the ceiling portion 5g are the detection unit 24. Are connected to the ground electrode layer 25 on the receiving part 5a.

  The Y component force detector 26 includes a first lower crystal plate 26a, a Y electrode layer 26b, and a first upper crystal plate 26c which are stacked in this order. The first lower crystal plate 26a and the first upper crystal plate 26c are formed of “Y-cut crystal plates”. The crystal direction that generates the piezoelectric effect is defined as the piezoelectric direction. At this time, the piezoelectric direction of the first lower crystal plate 26a faces the -Y direction in the figure, and the piezoelectric direction of the first upper crystal plate 26c faces the Y direction in the figure.

  The Z component force detector 27 includes a second lower crystal plate 27a, a Z electrode layer 27b, and a second upper crystal plate 27c that are stacked in this order. The second lower crystal plate 27a and the second upper crystal plate 27c are formed of an “X cut crystal plate”. The piezoelectric direction of the second lower crystal plate 27a faces the Z direction in the figure, and the piezoelectric direction of the second upper crystal plate 27c faces the -Z direction in the figure.

  The X component force detector 28 includes a third lower crystal plate 28a, an X electrode layer 28b, and a third upper crystal plate 28c that are stacked in this order. The third lower crystal plate 28a and the third upper crystal plate 28c are formed of “Y-cut crystal plates”. The piezoelectric direction of the third lower crystal plate 28a faces the X direction in the figure, and the piezoelectric direction of the third upper crystal plate 28c faces the -X direction in the figure.

  In the sensor module 1, the first sensor element 5 is sandwiched between the first support substrate 2 and the second support substrate 10, and is pressed by a fixing bolt 13. Thereby, the receiving part 5a and the ceiling part 5g press the detection part 24. Therefore, the Z component force detection unit 27 is applied with a pressure for compressing the Z component force detection unit 27. When a compressive force is further applied between the first support substrate 2 and the second support substrate 10, the compressive force applied to the Z component force detection unit 27 increases. When a tension acts between the first support substrate 2 and the second support substrate 10, the compressive force applied to the Z component force detection unit 27 is reduced. The Z component force detector 27 outputs an electrical signal obtained by differentiating the change in the compression force. The Z component force detector 27 outputs an electrical signal as a voltage signal between the ground electrode layer 25 and the Z electrode layer 27b.

  When an external force in a direction in which the first support substrate 2 and the second support substrate 10 are moved in parallel acts on the first support substrate 2 and the second support substrate 10, the first sensor element is received via the receiving portion 5a and the ceiling portion 5g. A shearing force acts on 5. Then, the component force in the X direction of the shear force acts on the X component force detector 28, and the component force of the Y direction component of the shear force acts on the Y component force detector 26. Then, the X component force detector 28 outputs an electric signal obtained by differentiating the change in the increase and decrease of the shearing force in the X direction. The Y component force detection unit 26 outputs an electric signal obtained by differentiating the change in increase / decrease in the shear force of the Y direction component. The Y component force detection unit 26 outputs an electrical signal as a voltage signal between the ground electrode layer 25 and the Y electrode layer 26b. The X component force detector 28 outputs an electrical signal as a voltage signal between the ground electrode layer 25 and the X electrode layer 28b.

  As shown in FIG. 5B, the ground electrode layer 25, the Y electrode layer 26b, the Z electrode layer 27b, and the X electrode layer 28b are provided on the receiving portion 5a. The ground electrode layer 25, the Y electrode layer 26 b, the Z electrode layer 27 b, and the X electrode layer 28 b are connected to the wiring 15 of the wiring substrate 8 through the conductive member 17. As a result, the electrical signal output by the detection unit 24 is transmitted to the drive element 9 on the wiring board 8.

  A signal output from the drive element 9 is connected to the electrode of the connection portion 8i through a wiring (not shown). Therefore, the electrical signal output from the detection unit 24 can be output to an external device (not shown) via the electrode of the connection unit 8i.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, the sensor module 1 includes the wiring board 8 and the first sensor element 5. A plurality of protrusions 20 are provided on the wiring board 8. The protrusion 20 is in contact with the first sensor element 5 and fixedly supported. Thereby, the position of the first sensor element 5 with respect to the wiring board 8 is determined at a place where the protrusion 20 and the first sensor element 5 are in contact with each other. And the relative position of the wiring board 8 and the 1st sensor element 5 can be combined with sufficient precision by forming the shape of the location which contacts the protrusion 20 among the protrusion 20 and the 1st sensor element 5 with sufficient precision. The second sensor element 6 and the third sensor element 7 have the same effect.

  (2) According to the present embodiment, the protrusion 20 is an oblique contact portion 21 with respect to the mounting surface 8 b of the wiring board 8. The first side surface 5 c to the fourth side surface 5 f where the first sensor element 5 contacts the protrusion 20 are parallel to the contact portion 21. Therefore, when the first sensor element 5 comes into contact with the protrusion 20, gravity acts on the wiring substrate 8 and the first sensor element 5 is pressed against the protrusion 20. Thereby, the contact part 21 of the protrusion 20 and the 1st side surface 5c-the 4th side surface 5f slide. Therefore, the first sensor element 5 and the protrusion 20 can be brought into contact with no gap. As a result, the first sensor element 5 can be arranged on the wiring board 8 with high positional accuracy. The second sensor element 6 and the third sensor element 7 have the same effect.

  (3) According to the present embodiment, the wiring board 8 is provided with the second protrusions 20b and the fifth protrusions 20e, and the protruding directions of the second protrusions 20b and the fifth protrusions 20e face each other. And the contact part of the 2nd protrusion 20b and the 5th protrusion 20e is the same angle. When the first sensor element 5 is installed between the second protrusion 20b and the fifth protrusion 20e, gravity acts on the wiring board 8. Then, the second contact portion 21b of the second protrusion 20b and the second side surface 5d of the first sensor element 5 slide, and the fifth contact portion 21e of the fifth protrusion 20e and the fourth side surface 5f of the first sensor element 5 slide. Slide. Therefore, the 1st sensor element 5 can be installed in the middle position of the 2nd protrusion 20b and the 5th protrusion 20e. The second sensor element 6 and the third sensor element 7 have the same effect.

  (4) According to this embodiment, the 1st sensor element 5 has four surfaces, the 1st side surface 5c-the 4th side surface 5f which cross | intersect. The four surfaces are in contact with the protrusion 20. The third side surface 5e is in contact with the two protrusions 20 of the third protrusion 20c and the fourth protrusion 20d. Thereby, the direction of the first sensor element 5 in the wiring board 8 is determined. The three surfaces of the first side surface 5c, the second side surface 5d, and the fourth side surface 5f are in contact with one protrusion 20, respectively. Thereby, the position of the 1st sensor element 5 in the wiring board 8 is decided. Accordingly, the orientation and position of the first sensor element 5 can be determined with high accuracy and fixed by the five protrusions 20. The second sensor element 6 and the third sensor element 7 have the same effect.

  (5) According to this embodiment, the distance 23 between the two protrusions 20 of the third protrusion 20c and the fourth protrusion 20d is set to be longer than half of the surface length 22. An error may occur in the positions of the third protrusion 20c and the fourth protrusion 20d due to manufacturing reasons. At this time, the error in the angle of the third side surface 5e contacting the third contact portion 21c and the fourth contact portion 21d is smaller than when the distance 23 between the third protrusion 20c and the fourth protrusion 20d is closer. can do. Accordingly, when the distance 23 between the third protrusion 20c and the fourth protrusion 20d is shorter than half of the surface length 22, the angle of the third side surface 5e is more accurately set on the wiring board 8 when the first sensor element 5 is placed on the wiring board 8. Can be installed. The second sensor element 6 and the third sensor element 7 have the same effect.

  (6) According to the present embodiment, the wiring board 8 includes the first board fixing hole 8g and the second board fixing hole 8h. The positions of the plurality of protrusions 20 are set with reference to the first substrate fixing hole 8g and the second substrate fixing hole 8h. Since the first sensor element 5 is disposed in contact with the protrusion 20, the position of the first sensor element 5 is determined with reference to the first substrate fixing hole 8g and the second substrate fixing hole 8h. The first support substrate 2 is installed with reference to the first main body fixing hole 2g and the second main body fixing hole 2h. Therefore, when the sensor module 1 is installed, the first sensor element 5 can be determined and installed with high positional accuracy by installing the first main body fixing hole 2g and the second main body fixing hole 2h with high positional accuracy. The second sensor element 6 and the third sensor element 7 have the same effect.

  (7) According to the present embodiment, the second protrusion 20b is in contact with the first sensor element 5 at two points of the first support end 29a and the second support end 29b to support the first sensor element 5. Then, only the first support end 29a and the second support end 29b that are in contact with the first sensor element 5 out of the inner wall surface of the first element positioning hole 8c into which the first sensor element 5 is fitted are accurately formed. The relative positions of the wiring board 8 and the first sensor element 5 can be combined with high accuracy while simplifying the process.

  (8) According to the present embodiment, the first element positioning hole 8 c is provided with the plurality of protrusions 20, and one protrusion 20 is in contact with the side surface of the first sensor element 5 at the two support ends 29. . The side surface of the first sensor element 5 that contacts the protrusion 20 is parallel to the support end 29. Therefore, when the first sensor element 5 comes into contact with the protrusion 20, gravity acts on the first sensor element 5 and the wiring substrate 8, and the first sensor element 5 is pressed against the protrusion 20. Therefore, the first sensor element 5 and the protrusion 20 can be brought into contact with no gap.

  As a result, the first sensor element 5 can be arranged on the wiring board 8 with high positional accuracy. Furthermore, since the projection 20 has two support ends 29, the first sensor element 5 can be arranged on the wiring substrate 8 with high accuracy by manufacturing the two support ends 29 with high accuracy. As a result, the sensor module 1 can be manufactured with high productivity as compared with the case where all the protrusions 20 are manufactured with high accuracy.

(Second Embodiment)
Next, an embodiment of the sensor module will be described with reference to FIG. FIG. 6A is a schematic plan view for explaining the support structure of the sensor element, and shows the periphery of the first sensor element. FIG. 6B is a schematic side cross-sectional view for explaining the support structure of the sensor element, and is a cross section taken along the line DD ′ of FIG. This embodiment is different from the first embodiment in that a part of the protrusion 20, the surfaces of the third side surface 5e and the fourth side surface 5f are not contact portions. Note that description of the same points as in the first embodiment is omitted.

  That is, in the present embodiment, the sensor module 31 includes the first sensor element 32 and the wiring board 33 as shown in FIG. The first sensor element 32 includes a receiving part 32a and an exterior part 32b erected on the receiving part 32a. And the exterior part 32b is inserted in the 1st element positioning hole 33c with which the wiring board 33 is provided. The wiring 15 is installed on a mounting surface 33b as a surface on the receiving portion 32a side of the wiring substrate 33.

  The first element positioning hole 33c has five protrusions: a first protrusion 34a, a second protrusion 34b as a first protrusion, a third protrusion 34c, a fourth protrusion 34d, and a fifth protrusion 34e as a second protrusion. 34 is installed. The side surfaces at the tips of the first protrusions 34 a and the second protrusions 34 b serve as contact portions 35 that are inclined with respect to the mounting surface 33 b of the wiring substrate 33. The contact portion at the tip of the first protrusion 34a is referred to as a first contact portion 35a, and the contact portion 35 at the tip of the second protrusion 34b is referred to as a second contact portion 35b as a contact portion.

  The side surfaces at the tips of the third protrusion 34 c, the fourth protrusion 34 d, and the fifth protrusion 34 e are orthogonal surfaces 36 that are surfaces orthogonal to the mounting surface 33 b of the wiring substrate 33. The orthogonal surface 36 of the third protrusion 34c is the first orthogonal surface 36a, and the orthogonal surface 36 of the fourth protrusion 34d is the second orthogonal surface 36b. The orthogonal surface 36 of the fifth protrusion 34e is a third orthogonal surface 36c as an orthogonal surface. The first orthogonal surface 36a and the second orthogonal surface 36b are in a positional relationship facing the first contact portion 35a, and the third orthogonal surface 36c is in a positional relationship facing the second contact portion 35b. The second protrusion 34b and the fifth protrusion 34e protrude to face each other so as to sandwich the first sensor element 32.

  The surface of the exterior portion 32 b of the first sensor element 32 is a contact surface where the projection 34 is in contact with the projection 34. The contact surfaces are defined as a first side surface 32c, a second side surface 32d as a first contact surface, a third side surface 32e, and a fourth side surface 32f as a second contact surface in a clockwise direction from the right side in the drawing.

  The first side surface 32c is parallel to the first contact portion 35a and contacts the first protrusion 34a. The second side surface 32d is parallel to the second contact portion 35b and contacts the second protrusion 34b. The third side surface 32e is parallel to the first orthogonal surface 36a and the second orthogonal surface 36b and contacts the third protrusion 34c and the fourth protrusion 34d. The fourth side surface 32f is parallel to the third orthogonal surface 36c and contacts the fifth protrusion 34e.

  Two support ends 37, a first support end 37 a and a second support end 37 b, are installed on the second contact portion 35 b of the wiring board 33. A line segment connecting the first support end 37a and the second support end 37b is oblique to the mounting surface 33b of the wiring board 33 and is parallel to the second side surface 32d. The third orthogonal surface 36c is provided with two support ends 37, a third support end 37c and a fourth support end 37d. A line segment connecting the third support end 37c and the fourth support end 37d is orthogonal to the mounting surface 33b of the wiring board 33 and parallel to the fourth side surface 32f.

  The first support end 37a and the second support end 37b are pointed. Thereby, the second protrusion 34b of the wiring substrate 33 makes point contact with the first sensor element 32 at a plurality of locations. Similarly, the support end 37 of the fifth protrusion 34e is divided into a third support end 37c and a fourth support end 37d. Thereby, the 5th protrusion 34e of the wiring board 33 contacts the 1st sensor element 32 in multiple places. As a result, the area where the second protrusion 34 b contacts the first sensor element 32 becomes narrow, and the area where the fifth protrusion 34 e contacts the first sensor element 32 becomes narrow. Therefore, even when the position of the first sensor element 32 needs to be finely adjusted, the amount of processing for adjusting the support end 37 is small, and the processing time can also be small. This content also acts in the same manner on the first protrusion 34a, the third protrusion 34c, and the fourth protrusion 34d, and an effect is obtained.

  The conductive member 17 is installed between the mounting surface 33b and the receiving portion 32a. The wiring board 33 is placed on the receiving portion 32 a via the conductive member 17. When the gravity acts on the wiring board 33 and a force that the wiring board 33 approaches the first sensor element 32 acts, the first sensor element 32 is pressed against the protrusion 34. As a result, the first sensor element 32 and the wiring board 33 relatively move in the plane direction of the wiring board 33.

  The second contact portion 35b contacts the second side surface 32d without a gap, and the third orthogonal surface 36c contacts the fourth side surface 32f without a gap. The first contact portion 35a contacts the first side surface 32c without a gap, and the first orthogonal surface 36a and the second orthogonal surface 36b contact the third side surface 32e without a gap. As a result, the first sensor element 32 can be arranged on the wiring board 33 with high positional accuracy.

  The orthogonal plane 36 is easy to determine the orthogonal plane 36 because the planar view of the wiring board 33 is a straight line. Therefore, the position of the first sensor element 32 on the wiring board 33 can be easily determined.

As described above, this embodiment has the following effects.
(1) According to this embodiment, since the orthogonal surface 36 is orthogonal to the mounting surface 33b of the wiring board 33, the orthogonal surface 36 can be formed with high positional accuracy. Therefore, it is possible to easily install the first sensor element 32 with respect to the wiring board 33 with high positional accuracy.

  (2) According to the present embodiment, the area where the protrusion 34 contacts the first sensor element 32 is narrowed. Therefore, even when the position of the first sensor element 32 needs to be finely adjusted, the amount of processing for adjusting the support end 37 is small, and the processing time can also be small.

(Third embodiment)
Next, an embodiment of a stress detection apparatus using a sensor module will be described with reference to FIG. This embodiment is different from the first embodiment in that an arithmetic circuit element for calculating stress is mounted on the wiring board 8. Note that description of the same points as in the first embodiment is omitted. FIG. 7A is a schematic plan view showing the structure of the stress detection device.

  That is, as shown in FIG. 7A, in the present embodiment, in the stress detection device 39, an arithmetic circuit element 41 as an arithmetic unit is installed on the wiring board 40 of the sensor module 39a. Furthermore, the wiring board 40 is provided with a first sensor element 5, a second sensor element 6, a third sensor element 7, and a drive element 9 for driving each sensor element. The first sensor element 5, the second sensor element 6, the third sensor element 7 and the drive element 9 are connected by a wiring 15. Further, the drive element 9 and the arithmetic circuit element 41 are connected by a wiring 15.

  The arithmetic circuit element 41 inputs an electric signal output from the driving element 9 and calculates the stress applied to the stress detection device 39. And the connection part 40i is installed in the wiring board 40 so that it may protrude from the 1st support substrate 2 and the 2nd support substrate 10. FIG. An output terminal is installed in the connection part 40 i, and the output terminal and the arithmetic circuit element 41 are connected by the wiring 15. Then, the arithmetic circuit element 41 outputs the calculation result to the output terminal.

  FIG. 7B is a schematic perspective view for explaining the procedure for calculating the stress. As shown in FIG. 7B, the first sensor element 5, the second sensor element 6, and the third sensor element 7 are installed on the first support substrate 2. In order to make the drawing easy to understand, each part such as the second support substrate 10 is omitted.

  The stress and torque applied to the stress detection device 39 are decomposed into an X component, a Y component, and a Z component. The X component, Y component, and Z component of the stress are defined as a first stress 42x, a second stress 42y, and a third stress 42z, respectively. The X component, Y component, and Z component of the torque are defined as a first torque 43x, a second torque 43y, and a third torque 43z, respectively.

  The radial component, the circumferential component, and the Z component of the stress detected by the first sensor element 5 are defined as a first element first stress 44r, a first element second stress 44t, and a first element third stress 44z, respectively. The radial component, the circumferential component, and the Z component of the stress detected by the second sensor element 6 are defined as a second element first stress 45r, a second element second stress 45t, and a second element third stress 45z, respectively. The radial component, the circumferential component, and the Z component of the stress detected by the third sensor element 7 are a third element first stress 46r, a third element second stress 46t, and a third element third stress 46z, respectively.

  Forces corresponding to the first stress 42x, the second stress 42y, and the third stress 42z are Fx, Fy, and Fz, respectively, act on the stress detection device 39. Further, forces having torques Mx, My, and Mz corresponding to the first torque 43x, the second torque 43y, and the third torque 43z act on the stress detection device 39, respectively. At this time, stresses corresponding to the first element first stress 44r, the first element second stress 44t, and the first element third stress 44z are S1r, S1t, and S1z. The stresses corresponding to the second element first stress 45r, the second element second stress 45t, and the second element third stress 45z are S2r, S2t, and S2z. Further, stresses corresponding to the third element first stress 46r, the third element second stress 46t, and the third element third stress 46z are S3r, S3t, and S3z.

At this time, Fx, Fy, Fz, Mx, My, and Mz can be calculated by the following equations. However, A1-A6, B1-B6, C1-C3, D1-D3, E1-E3 are constants, and these constants are relative positions of the first sensor element 5, the second sensor element 6, and the third sensor element 7. Determined by.
(Formula 1)
Fx = A1 * S1r + A2 * S2r + A3 * S3r + A4 * S1t + A5 * S2t + A6 * S3t
Fy = B1 * S1r + B2 * S2r + B3 * S3r + B4 * S1t + B5 * S2t + B6 * S3t
Fz = S1z + S2z + S3z
Mx = C1 * S1z + C2 * S2z + C3 * S3z
My = D1 * S1z + D2 * S2z + D3 * S3z
Mz = E1 * S1t + E2 * S2t + E3 * S3t

  Thereby, the stress detection device 39 can detect stress and torque from all three-dimensional directions. And even if it is a small displacement amount, the force added to the stress detection apparatus 39 can be detected with high precision.

As described above, this embodiment has the following effects.
(1) According to this embodiment, three sensor elements are installed in the sensor module 39a. Each sensor element is installed with high positional accuracy. When stress is applied to the sensor module 39a, the stress applied to each sensor element can be detected. Therefore, it is possible to detect tension, pressing force, and shear force applied to the sensor element. Furthermore, the torque applied to the sensor module 39a can be detected using the stress applied to each sensor element and the position information of each sensor element.

  (2) According to the present embodiment, the stress detection device 39 includes the sensor module 39a and the arithmetic circuit element 41 that calculates the stress. In the sensor module 39a, sensor elements are installed with high positional accuracy. The sensor element detects stress. The arithmetic circuit element 41 can accurately calculate and output the stress detected by each sensor element and the torque applied to the stress detection device 39 from the position of each sensor element.

(Fourth embodiment)
Next, an embodiment of the protrusion 20 installed on the wiring board 8 will be described with reference to FIG. FIGS. 8A to 8D are schematic plan views of relevant parts for explaining the shape of the protrusions. This embodiment is different from the first embodiment in that the shape of the protrusion 20 is different. Note that description of the same points as in the first embodiment is omitted.

  That is, in this embodiment, as shown in FIG. 8A, the sensor module 49 includes a wiring board 50. The wiring board 50 is provided with a protrusion 50 a that contacts the first sensor element 5 and supports the first sensor element 5. The shape of the protrusion 50a is an arc shape. Since the arc can set the place where the first sensor element 5 comes into contact with the center and the radius of the circle, the place where the projection 50a comes into contact with the first sensor element 5 can be easily determined.

  In the present embodiment illustrated in FIG. 8B, the sensor module 51 includes a wiring board 52. The wiring board 52 is provided with a protrusion 52 a that contacts the first sensor element 5 and supports the first sensor element 5. The shape of the protrusion 52a is a pointed tip. Therefore, since the place where the protrusion 52a contacts the first sensor element 5 is limited to a narrow place, the place where the protrusion 52a contacts the first sensor element 5 can be easily managed.

  In the present embodiment illustrated in FIG. 8C, the sensor module 53 includes a wiring board 54. The wiring board 54 is provided with a protrusion 54 a that contacts the first sensor element 5 and supports the first sensor element 5. The shape of the protrusion 54a is a triangular shape with a flat tip. Therefore, since the place where the protrusion 54a contacts the first sensor element 5 is limited to a predetermined range, it is easy to manage the place where the protrusion 54a contacts the first sensor element 5. And since the area of the place where the protrusion 54a contacts the 1st sensor element 5 is adjusted, the protrusion 54a can support the 1st sensor element 5 reliably.

  In the present embodiment shown in FIG. 8D, the sensor module 55 includes a wiring board 54 and a first sensor element 56. A protrusion 54 a that contacts the first sensor element 56 and supports the first sensor element 56 is provided on the wiring board 54. The shape of the protrusion 54a is a triangular shape with a flat tip. A part of the outer periphery of the first sensor element 56 is a convex portion 56a, and the convex portion 56a contacts the protrusion 54a. Therefore, the place where the protrusion 54 a contacts the first sensor element 56 is limited to the convex portion 56 a, so that the place where the protrusion 54 a contacts the first sensor element 56 can be easily managed. And since the area of the place where the protrusion 54a contacts the 1st sensor element 56 is adjusted, the protrusion 54a can support the 1st sensor element 56 reliably.

(Fifth embodiment)
Next, an embodiment of the protrusion 20 installed on the wiring board 8 will be described with reference to FIG. FIGS. 9A to 9D are schematic cross-sectional views of relevant parts for explaining the shape of the protrusions. This embodiment is different from the first embodiment in that the shape of the protrusion 20 is different. Note that description of the same points as in the first embodiment is omitted.

  That is, in this embodiment, as shown in FIG. 9A, the sensor module 90 includes a wiring board 94. The wiring board 94 is provided with a support end 94 a that contacts the first sensor element 5 and supports the first sensor element 5. Since the shape of the support end 94a extends in parallel with the substrate surface and the support end can be finely adjusted, the place where the first sensor element 5 and the support end 94a come into contact can be easily determined. .

  In this embodiment shown in FIG. 9B, the sensor module 91 includes a wiring board 95. The wiring board 95 is provided with a pair of support ends 95 a that are in contact with the first sensor element 5 and support the first sensor element 5. In the shape of the support end 95a, the substrate surface is flat, and the surface between the support ends 95a is an inclined surface. As a result, the support end 95a has a sharp tip. Therefore, since the place where the support end 95a contacts the first sensor element 5 is limited to a narrow place, the place where the support end 95a contacts the first sensor element 5 can be easily managed.

  In the present embodiment shown in FIG. 9C, the sensor module 92 includes a wiring board 96. The wiring board 96 is provided with a support end 96 a that contacts the first sensor element 5 and supports the first sensor element 5. In the shape of the support end 96a, the corner of the contact surface of the substrate surface is processed obliquely, and the support end 96a has a sharp shape. Therefore, since the place where the support end 96a contacts the first sensor element 5 is limited to a narrow place, the place where the support end 96a contacts the first sensor element 5 can be easily managed.

  In the present embodiment shown in FIG. 9D, the sensor module 93 includes a wiring board 97 and the first sensor element 5. The wiring board 97 is provided with a support end 97 a and a support end 99 that are in contact with the first sensor element 5 and support the first sensor element 5. The support end 97a and the support end 99 that support the first sensor element 5 are only parallel and perpendicular to the substrate surface. Thereby, the place where the support end 97a and the support end 99 are in contact with the first sensor element 5 is limited to a narrow place. Therefore, it is easy to manage the place where the support end 97a and the support end 99 are in contact with the first sensor element 5, and it is not necessary to strictly manage the processing angle.

(Sixth embodiment)
Next, an embodiment of a robot provided with a stress detection device will be described with reference to FIG. 10A and 10B are schematic perspective views showing the configuration of the robot. In this embodiment, the stress detection device 39 described in the third embodiment is used. The description of the same points as in the third embodiment will be omitted.

  As shown in FIG. 10A, the robot 59 includes a base portion 60a. The base portion 60a can be installed on a floor, a wall, a ceiling, a mobile vehicle, or the like. A rotation part 60b is installed on the base part 60a, and a rotation mechanism for rotating the rotation part 60b is installed on the base part 60a. The rotating unit 60b rotates about the vertical direction as the center of rotation. The main body portion 60 is composed of the base portion 60a, the rotation portion 60b, and the like.

  The first arm portion 61, the second arm portion 62, the third arm portion 63, and the fourth arm portion 64 are connected in this order in connection with the rotating portion 60b. Each arm part is connected so that rotation or bending is possible. The rotation unit 60b includes a rotation mechanism that rotates the first arm unit 61 with respect to the rotation unit 60b. The second arm portion 62 incorporates a rotation mechanism that rotates the first arm portion 61 with respect to the second arm portion 62 and a rotation mechanism that rotates the third arm portion 63 with respect to the second arm portion 62. Yes.

  A hand part 65 as a movable part is connected to the fourth arm part 64. The fourth arm portion 64 includes a rotation mechanism that rotates the third arm portion 63 with respect to the fourth arm portion 64 and a rotation mechanism that rotates the hand portion 65 with respect to the fourth arm portion 64. Yes. That is, the robot 59 is a vertical articulated robot.

  The hand portion 65 includes a hand main body 65a and a pair of plate-like gripping portions 65b at the tip of the hand main body 65a. The hand main body 65a incorporates a linear motion mechanism that moves the gripping portion 65b to change the interval between the gripping portions 65b. The hand unit 65 can open and close the gripping part 65b to grip the object to be gripped.

  A stress detection device 39 is installed in the hand main body 65a, and the stress and torque applied to the hand unit 65 can be detected. One of the sensor modules described above is used for the stress detection device 39. The robot 59 includes a control unit 66, and the control unit 66 drives each rotation mechanism and linear motion mechanism to control the posture and operation of the robot 59. The controller 66 receives an electrical signal output from the stress detection device 39. Then, it is possible to cause the hand unit 65 to perform an operation in accordance with whether or not the hand unit 65 is holding the object to be gripped. The stress detection device 39 detects the stress applied to the hand unit 65 even when the hand unit 65 contacts the obstacle. Thereby, the control part 66 can make the robot 59 perform the operation | movement which avoids an obstruction.

  As shown in FIG. 10B, the robot 67 includes a vehicle body portion 68. The vehicle body 68 includes a vehicle body 68a, and four wheels 68b are installed on the ground side of the vehicle body 68a. The vehicle body 68a incorporates a rotation mechanism that drives the wheels 68b. Furthermore, the vehicle body 68a incorporates a controller 69 that controls the posture and operation of the robot 67.

  A main body rotating portion 70 and a main body portion 71 are stacked on the vehicle body 68a in this order. The main body rotation unit 70 is provided with a rotation mechanism that rotates the main body unit 71. And the main-body part 71 rotates centering | focusing on a perpendicular direction. A pair of imaging devices 72 is installed on the main body 71, and the imaging device 72 images the surroundings of the robot 67. Then, the distance between the photographed object and the imaging device 72 can be detected.

  A left arm portion 73 and a right arm portion 74 are installed on two opposing surfaces of the side surface of the main body portion 71. That is, the robot 67 is a double-arm robot. Each of the left arm portion 73 and the right arm portion 74 includes an upper arm portion 75, a lower arm portion 76, and a hand portion 77 as a movable portion. The upper arm portion 75, the lower arm portion 76, and the hand portion 77 are connected so as to be rotatable or bendable. The main body 71 incorporates a rotation mechanism that rotates the upper arm 75 with respect to the main body 71. The upper arm portion 75 incorporates a rotation mechanism that rotates the lower arm portion 76 relative to the upper arm portion 75. The lower arm portion 76 incorporates a rotation mechanism that rotates the hand portion 77 with respect to the lower arm portion 76. Further, the lower arm portion 76 incorporates a rotation mechanism that twists with the longitudinal direction of the lower arm portion 76 as the rotation axis.

  The hand portion 77 includes a hand main body 77a and a pair of plate-like gripping portions 77b positioned at the tip of the hand main body 77a. The hand main body 77a incorporates a linear motion mechanism that moves the gripping portion 77b to change the interval between the gripping portions 77b. The hand unit 77 can open and close the gripping part 77b to grip the object to be gripped.

  A stress detection device 39 is installed in the hand main body 77a, and the stress and torque applied to the hand portion 77 can be detected. One of the sensor modules described above is used for the stress detection device 39. The control unit 69 controls each posture and operation of the robot 67 by driving each rotation mechanism and linear motion mechanism. The control unit 69 receives an electrical signal output from the stress detection device 39. Then, it is possible to cause the hand unit 77 to perform an operation in accordance with whether or not the hand unit 77 is holding the object to be gripped. The stress detection device 39 detects the stress applied to the hand part 77 even when the hand part 77 contacts the obstacle. Thereby, the control part 69 can make the robot 67 perform the operation | movement which avoids an obstruction.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, the robot 59 includes the stress detection device 39 in the hand unit 65. The stress detection device 39 detects stress and torque applied to the hand unit 65. As a result, the control unit 66 can cause the robot 59 to perform an operation in accordance with the situation as to whether or not the hand unit 65 is gripping an object to be gripped. Further, the stress detection device 39 can detect whether or not the hand unit 65 is in contact with an obstacle. Then, when the hand unit 65 is in contact with an obstacle, the control unit 66 can cause the robot 59 to perform an operation of avoiding the obstacle.

  Similar to the robot 59, the robot 67 includes a stress detection device 39 that detects stress and torque applied to the hand unit 77. Therefore, the control unit 69 can cause the robot 67 to perform an operation according to the situation as to whether or not the hand unit 77 is holding the object to be grasped. Furthermore, when the hand unit 77 is in contact with an obstacle, the control unit 69 can cause the robot 67 to perform an operation of avoiding the obstacle.

  (2) According to the present embodiment, the robot 59 includes the hand unit 65 and moves the hand unit 65 to perform work. Then, the stress detection device 39 detects the stress applied to the hand portion 65. The first sensor element 5 installed in the stress detection device 39 is installed with high positional accuracy with respect to the wiring board 40. Therefore, the robot 59 can recognize the location where the stress applied to the hand portion 65 is detected with high positional accuracy. Furthermore, the stress detection device 39 is manufactured with high productivity. As a result, the robot 59 can be a robot including the stress detection device 39 in which the first sensor element 5 is installed on the wiring board 40 with high positional accuracy and manufactured with high productivity. Similarly, the robot 67 may be a robot including the stress detection device 39 in which the first sensor element 5 is installed on the wiring board 40 with high positional accuracy and manufactured with high productivity.

Note that the present embodiment is not limited to the above-described embodiment, and various changes and improvements can be added by those having ordinary knowledge in the art within the technical idea of the present invention. A modification will be described below.
(Modification 1)
In the first embodiment, three sensor elements of the first sensor element 5 to the third sensor element 7 are installed on the wiring board 8. The number of sensor elements is not limited to three and may be four or more. When the number of sensor elements is large, the distribution of stress applied to the sensor module 1 can be detected.

(Modification 2)
In the first embodiment, the wiring substrate 8 is installed on the receiving portion 5 a of the first sensor element 5. The receiving part 5 a of the first sensor element 5 may be installed on the wiring board 8 by changing the positions of the receiving part 5 a and the wiring board 8. And the exterior part 5b of the 1st sensor element 5 may be made to be located in the 1st support substrate 2 side. Even with this arrangement, the same effect can be obtained.

(Modification 3)
In the first embodiment, the hole 2 a is formed in the first support substrate 2, and the hole 10 a is formed in the second support substrate 10. Further, a hole 8a was formed in the wiring board 8. The hole 2a, the hole 10a, and the hole 8a are not necessarily formed. The strength of the first support substrate 2, the second support substrate 10, and the wiring substrate 8 can be increased.

(Modification 4)
In the first embodiment, the first support substrate 2, the second support substrate 10, and the wiring substrate 8 are disk-shaped, but they are not necessarily disk-shaped. It may be a triangle, a rectangle, a polygon, or an oval plate. Even if it is such a shape, the same effect can be acquired.

(Modification 5)
In the first embodiment, three drive elements 9 are installed on the wiring board 8. One driving element 9 may drive the first sensor element 5, the second sensor element 6, and the third sensor element 7. Since the number of elements can be reduced, the sensor module 1 can be manufactured with high productivity.

(Modification 6)
In the third embodiment, the piezoelectric directions of the first sensor element 5, the second sensor element 6, and the third sensor element 7 are arranged in the radial direction and the circumferential direction. The first sensor element 5, the second sensor element 6, and the third sensor element 7 may be installed on the wiring board 40 so that the piezoelectric direction is the X direction and the Y direction. By changing the calculation method of the arithmetic circuit element 41, the stress and torque applied to the stress detection device 39 can be detected.

(Modification 7)
In the third embodiment, the arithmetic circuit element 41 is installed on the wiring board 40. The arithmetic circuit element 41 may be installed on a wiring board different from the wiring board 40. And you may transmit / receive an electrical signal via the connection part 40i. The wiring board 40 can be easily arranged with circuit elements.

(Modification 8)
In the sixth embodiment, examples of the robot 59 and the robot 67 have been described. However, examples in which the sensor module 1 and the stress detection device 39 are applied are not limited thereto. The same effect can be obtained by using the stress detection device 39 in the same manner in a robot such as a scalar robot, an orthogonal robot, and a parallel link robot. Furthermore, it may be installed in a place where stress or torque is to be detected by a device such as a heavy machine other than a robot or an automobile.

(Modification 9)
In the first embodiment, two support ends 29 are installed on one protrusion 20. Three or more support ends 29 may be provided on one protrusion 20. By increasing the number of support ends 29, the load applied to the support ends 29 can be dispersed.

  DESCRIPTION OF SYMBOLS 5 ... 1st sensor element as a sensor element, 5c ... 1st side surface as a contact surface, 5d ... 2nd side surface as a contact surface, 5e ... 3rd side surface as a contact surface, 5f ... 4th side surface as a contact surface , 6 ... a second sensor element as a sensor element, 7 ... a third sensor element as a sensor element, 8b ... a mounting surface as a surface, 8c ... a first element positioning hole as a through hole, 8d ... as a through hole 2nd element positioning hole, 8e ... 3rd element positioning hole as a through-hole, 8g ... 1st board | substrate fixing hole as a reference | standard part, 8h ... 2nd board | substrate fixing hole as a reference | standard part, 8 ... Wiring as a board | substrate Substrate, 20b, 34b ... second projection as first projection, 20e, 34e ... fifth projection as second projection, 20 ... projection as projection, 21 ... contact portion, 22 ... as surface length Surface length, 29 ... support end as a contact portion, 29a 29e, 29i ... first support end as a contact portion, 29b, 29f, 29j ... second support end as a contact portion, 29c, 29g, 29k ... third support end as a contact portion, 29d, 29h, 29m ... contact A fourth support end as a part, 32d: a second side surface as a contact surface and a first contact surface, 32f: a fourth side surface as a contact surface and a second contact surface, 36c: a third orthogonal surface as an orthogonal surface, 41 An arithmetic circuit element as an arithmetic unit, 59, 67, a robot, 65, 77, a hand unit as a movable unit.

Claims (8)

A substrate having a through hole and having a plurality of convex portions on the inner wall surface of the through hole;
A sensor element installed in the through hole to detect stress,
The plurality of convex portions are in contact with the sensor element, and have a plurality of contact portions in contact with the sensor element in a cross-sectional view at a position including the convex portion of the substrate,
The sensor module according to claim 1, wherein a contact surface where the sensor element contacts the substrate is parallel to a line segment connecting the plurality of contact portions. The sensor module according to claim 1,
The convex portion has a first convex portion and a second convex portion that protrude to face each other so as to sandwich the sensor element,
An angle formed by a line segment connecting the contact portions of the first protrusion and a line segment connecting the contact portions of the second protrusion with the surface of the substrate is the same angle. The sensor module according to claim 1,
The convex portion has a first convex portion and a second convex portion that protrude to face each other so as to sandwich the sensor element,
In the cross-sectional view of the substrate, the first convex portion is oblique with respect to the surface of the substrate, the line segment connecting the apexes of the plurality of contact portions,
In the cross-sectional view of the substrate, the second convex portion is perpendicular to the surface of the substrate, the line segment connecting the apexes of the plurality of contact portions,
The first contact surface where the sensor element contacts the first convex portion is parallel to a line segment connecting the plurality of contact portions of the first convex portion,
The sensor module, wherein a second contact surface where the sensor element contacts the second convex portion is parallel to a line segment connecting the plurality of contact portions of the second convex portion. The sensor module according to any one of claims 1 to 3,
The sensor element is in contact with the convex portion at the four contact surfaces intersecting with each other, three of the four contact surfaces are in contact with one convex portion, and the remaining one of the contact surfaces is two A sensor module, wherein the sensor module is in contact with the convex portion. The sensor module according to claim 4,
When the length of the contact surface in the direction passing through the two convex portions in the remaining one contact surface is a surface length,
The sensor module according to claim 1, wherein an interval between the convex portions of the two convex portions is longer than half of the surface length. The sensor module according to any one of claims 1 to 5,
The substrate includes a reference portion that serves as a reference for the position of the convex portion. A sensor module in which a plurality of sensor elements for detecting stress are installed in a through hole of the substrate;
A calculation unit that calculates the stress applied to the sensor module using outputs of the plurality of sensor elements,
The substrate has a plurality of convex portions on the inner wall surface of the through hole, the plurality of convex portions are in contact with and supported by the sensor element, and a plurality of contact portions that are in contact with the sensor element in a sectional view of the substrate. The stress detecting device is characterized in that a contact surface where the sensor element contacts the substrate is parallel to a line segment connecting the plurality of contact portions. Moving parts;
A sensor module that is installed in the movable part and detects a stress applied to the movable part,
The sensor module includes a substrate having a plurality of protrusions on the inner wall surface of the through hole;
A sensor element that contacts the plurality of convex portions and detects the stress,
The plurality of convex portions are in contact with the sensor element, and the substrate has a plurality of contact portions in contact with the sensor element in a cross-sectional view at a position including the convex portion, and the sensor element is in contact with the substrate. Is parallel to a line segment connecting a plurality of the contact portions.

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