JP2013214599A - Interconnector fitted thin film compound solar cell manufacturing method, thin film compound solar cell string manufacturing method, and thin film compound solar cell array manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture an interconnector-fitted thin film compound solar cell which has an interconnector stress relief function stably.SOLUTION: An interconnector-fitted thin film compound solar cell manufacturing method comprises: a step (S100) in which a first electrode located on the principal plane on one side of a thin film compound solar cell and having a first polarity and an interconnector are connected; a step (S110) in which part of the interconnector and a cover glass so as to cover the thin film compound solar cell are bonded by adhesive agents to the principal plane on one side of the thin film compound solar cell having the interconnector connected thereto; and a step (S130) in which, after the bonding step (S110), a stress relief portion is formed by folding the interconnector between one end on the cover glass side and the other end on the opposite side of the interconnector at its protruding portion located on a more outer side than an edge of the cover glass.

Description

  The present invention relates to a method for manufacturing a thin film compound solar cell with an interconnector, a method for manufacturing a thin film compound solar cell string, and a method for manufacturing a thin film compound solar cell array.

  Currently, a silicon crystal solar cell in which a pn junction is formed on a silicon substrate is the mainstream as a solar cell. As a solar cell that can obtain higher photoelectric conversion efficiency than a silicon crystal solar cell, there is a compound semiconductor solar cell using a compound semiconductor having a direct transition type and a large light absorption coefficient.

  Many of the compound semiconductor solar cells currently being developed have a multi-junction structure in which a plurality of photoelectric conversion layers composed of pn junctions having different forbidden band widths are stacked in the light incident direction. Since the compound semiconductor solar cell having a multi-junction structure can effectively absorb the sunlight spectrum, higher photoelectric conversion efficiency than that of the compound semiconductor solar cell having only one photoelectric conversion layer can be obtained.

  A solar cell array in which a plurality of compound semiconductor solar cells are connected in series or in parallel is mounted as a power source for an artificial satellite. As a solar cell generally used for an artificial satellite, for example, a group III-V group compound semiconductor such as InGaP and GaAs used as a photoelectric conversion layer is epitaxially grown on a Ge substrate or a GaAs substrate having a thickness of 100 μm to 500 μm. The produced one is used as it is.

  Therefore, these solar cells include a substrate for epitaxial growth as it is. In the epitaxially grown substrate, an n electrode is formed on the light receiving surface side, and a p electrode is formed on the back surface side opposite to the light receiving surface side. Furthermore, the solar battery cell is completed through processes such as a mesa etching process and an antireflection film forming process for preventing the occurrence of leakage current from the cross section.

  In order to connect a plurality of completed photovoltaic cells, an interconnector made of silver foil or the like is connected to the pad portion of the n electrode by, for example, parallel gap welding. A stress caused by a significant thermal change in the space environment is applied to the interconnector of the solar battery cell mounted on the artificial satellite. In order to prevent damage to the connecting portion between the interconnector and the solar battery cell, the interconnector itself, or the solar battery cell due to the stress, a stress relief portion is provided in the interconnector.

  As prior literatures that disclose a solar cell having an interconnector provided with a stress relief portion, there are JP 2002-517098 A (Patent Document 1) and JP 2002-343994 A (Patent Document 2).

  The solar cell interconnector described in Patent Literatures 1 and 2 is provided with a U-shaped bent stress relief portion and a step so that the heights of both ends are different in side view. A solar cell string is comprised by connecting photovoltaic cells with an interconnector.

  A cover glass having a thickness of about 50 μm to 500 μm is bonded to the light receiving surface side of the solar battery cell for the purpose of protection from cosmic rays. JP-A-2001-313404 (Patent Document 3) is a prior document disclosing a method for bonding a cover glass.

  In the method for manufacturing a solar cell module described in Patent Document 3, solar cells are overlaid on a cover glass coated with an adhesive so as to cover the adhesive, and the cover glass and the solar cells are corrected in parallel. Therefore, the flat plates are stacked, and the cover glass and the solar battery cells are pressed through the flat plates.

JP 2002-517098 A JP 2002-343994 A JP 2001-313404 A

  When a cover glass is bonded to a solar battery cell to which an interconnector having a three-dimensionally bent stress relief part is connected, if the cover glass and the solar battery cell are pressed through a flat plate, the stress relief part of the interconnector However, the stress relief part is crushed due to pressure. In this case, the function of the stress relief part is lost.

  The present invention has been made in view of the above problems, and a method of manufacturing a thin film compound solar cell with an interconnector having a stable stress relief function of an interconnector, a method of manufacturing a thin film compound solar cell string, and It aims at providing the manufacturing method of a thin film compound solar cell array.

  The method of manufacturing a thin film compound solar cell with an interconnector according to the present invention includes a step of connecting a first electrode having a first polarity and an interconnector located on one main surface of a thin film compound solar cell, A step of adhering a cover glass with an adhesive so as to cover a part of the interconnector and the thin film compound solar cell on one main surface side of the thin film compound solar cell to which the interconnector is connected, and the step of adhering Then, in the outing part located outside the edge of the cover glass in the interconnector, a step of forming a stress relief part by bending between one end part on the cover glass side and the other end part on the opposite side of the one end part With.

  In one form of this invention, the manufacturing method of the thin film compound solar cell with an interconnector is further equipped with the process of pinching and fixing the said one end part. In the step of forming the stress relief portion, with the one end portion clamped and fixed, and the other end portion being movable, the stress relief portion is folded between the one end portion and the other end portion. Form.

  In one form of this invention, in the process of forming the said stress relief part, between the said one end part and the said other end part is bend | folded convexly at the cover glass side.

  In one form of this invention, the manufacturing method of the thin film compound solar cell with an interconnector is further equipped with the process of bending the said other end part after the process of forming the said stress relief part.

  In an embodiment of the present invention, in the step of connecting the first electrode and the interconnector, the interconnector having the wider end portion than the other portion is connected in the outing portion.

  A method for producing a thin film compound solar cell string according to the present invention is produced by any one of the above-described methods for producing a thin film compound solar cell with an interconnector, and has a second polarity that is opposite to the first polarity. The step of arranging a plurality of thin film compound solar cells with interconnectors each having a second electrode having the above, and the interconnector of the thin film compound solar cells with one interconnector among adjacent thin film compound solar cells with interconnectors Connecting the other end and a second electrode of the other interconnector-attached thin film compound solar cell.

  A method of manufacturing a thin film compound solar cell array according to the present invention includes a step of arranging a plurality of thin film compound solar cell strings manufactured by the method of manufacturing a thin film compound solar cell string, and a plurality of the thin film compound solar cell strings. Connecting to each other in series or in parallel.

  According to the present invention, the stress relief function of the interconnector can be stably provided.

It is a top view which shows the structure of the thin film compound solar cell with an interconnector manufactured by the manufacturing method of the thin film compound solar cell with an interconnector which concerns on Embodiment 1 of this invention. It is sectional drawing seen from the II-II line arrow direction of FIG. It is sectional drawing seen from the III-III line arrow direction of FIG. It is sectional drawing seen from the IV-IV line arrow direction of FIG. It is a flowchart which shows the manufacturing method of the thin film compound solar cell with an interconnector concerning the embodiment. It is sectional drawing which shows the state which mounted the photovoltaic cell with an interconnector on the surface plate. It is sectional drawing which shows the state which clamped and fixed the one end part by the side of a cover glass in the going-out part located outside from the edge of the cover glass among interconnectors. It is sectional drawing which shows the state which bent the interconnector, clamping and fixing the one end part of the going out part of an interconnector. A stress relief part was formed by bending between one end and the other end in a state where one end of the outside part of the interconnector was clamped and fixed, and the other end opposite to the one end was movable. It is sectional drawing which shows a state. It is sectional drawing which shows the state which bent the other end part of the going out part of an interconnector. It is a top view which shows the shape of the interconnector used for the manufacturing method of the thin film compound solar cell with an interconnector which concerns on Embodiment 2 of this invention. It is a top view which shows the structure of the thin film compound solar cell with an interconnector manufactured with the manufacturing method of the thin film compound solar cell with an interconnector concerning the embodiment.

  Hereinafter, the manufacturing method of the thin film compound solar cell with an interconnector which concerns on Embodiment 1 of this invention, the manufacturing method of a thin film compound solar cell string, and the manufacturing method of a thin film compound solar cell array are demonstrated. In the following description of the embodiments, the same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated.

(Embodiment 1)
FIG. 1 is a plan view showing the configuration of a thin film compound solar cell with an interconnector manufactured by the method for manufacturing a thin film compound solar cell with an interconnector according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view as seen from the direction of arrows II-II in FIG. FIG. 3 is a cross-sectional view as seen from the direction of arrows III-III in FIG. FIG. 4 is a cross-sectional view as seen from the direction of arrows IV-IV in FIG.

  As shown in FIG. 1, a thin film compound solar cell with an interconnector 100 manufactured by a method for manufacturing a thin film compound solar cell with an interconnector according to one embodiment of the present invention has a substantially rectangular outer shape in plan view. Yes.

  The thin film compound solar cell 100 with an interconnector includes a solar cell body having a thickness of 100 μm or less and two relay terminals 11 and 12. The two relay terminals 11 and 12 are spaced apart from each other at different corners of the interconnector-attached thin film compound solar cell 100. As will be described later, the solar cell body and the relay terminals 11 and 12 are connected to each other by a metal ribbon. The metal ribbon is a metal piece made of silver or the like.

  As shown in FIGS. 2 and 3, the solar cell body includes a resin film 110 as a base material, a metal thin film 120 positioned on the resin film 110, a photoelectric conversion layer 130 positioned on the metal thin film 120, and photoelectric conversion An n-type electrode located on layer 130 is included. The n-type electrode is located on one main surface of the solar cell body. The resin film 110 is not necessarily provided.

  The photoelectric conversion layer 130 is obtained by peeling a compound semiconductor formed by epitaxial growth on a semiconductor substrate (not shown) from the semiconductor substrate. The photoelectric conversion layer 130 has at least one pn junction.

  The n-type semiconductor layer having the first polarity is located on the light receiving surface side of the photoelectric conversion layer 130, and the p-type semiconductor layer having the second polarity is located on the back surface side opposite to the light receiving surface. Note that the n-type semiconductor layer and the p-type semiconductor layer may be positioned opposite to each other.

  Since the n-type electrode is in contact with the n-type semiconductor layer of the photoelectric conversion layer 130, the n-type electrode has n-type polarity. As shown in FIG. 1, the n-type electrode includes n-type pad electrodes 140 and 140 a and a comb-like n-type grid electrode 143. The n-type pad electrodes 140 and 140a and the n-type grid electrode 143 are connected to each other.

  Since the metal thin film 120 is in contact with the p-type semiconductor layer of the photoelectric conversion layer 130, the metal thin film 120 has p-type polarity. The metal thin film 120 has a function of a p-type electrode and a function of supporting the photoelectric conversion layer 130.

  In the present embodiment, p-type pad electrodes 150 a and 150 b are provided on the photoelectric conversion layer 130. The p-type pad electrodes 150a and 150b are provided on the metal thin film 120 so as not to contact the n-type electrode.

  As shown in FIG. 4, the relay terminal 11 is configured by a bypass diode. The relay terminal 11 has an n-type semiconductor substrate 111. An n + -type region 111 a and a p-type region 111 b formed by doping impurities are formed on the n-type semiconductor substrate 111. An n-type pad electrode 141 is formed on n + -type region 111a. A p-type pad electrode 151 is formed on the p-type region 111b. A back electrode 121 is formed on the lower surface of the n-type semiconductor substrate 111.

  The n-type pad electrode 141 is connected to the p-type pad electrode 150a by a metal ribbon 170. The p-type pad electrode 151 is connected to the n-type pad electrode 140a by a metal ribbon 171. As shown in FIG. 3, the back electrode 121 is connected to an interconnector 180 of another thin film compound solar cell 100 with an interconnector.

  Note that the back electrode 121 is not necessarily provided, but by providing the back electrode 121, the relay terminal 11 can function as a connection terminal on the p-type side.

  As shown in FIGS. 2 and 3, the relay terminal 12 has an n-type semiconductor substrate 112. An n-type pad electrode 142 is formed on the n-type semiconductor substrate 112. A back electrode 122 is formed on the lower surface of the n-type semiconductor substrate 112.

  The n-type pad electrode 142 is connected to the p-type pad electrode 150b by a metal ribbon 172. The back electrode 122 is connected to an interconnector 180 of another thin film compound solar cell 100 with an interconnector as shown in FIGS. The relay terminal 12 functions as a connection terminal on the p-type side. Note that the metal ribbon 172 and the n-type semiconductor substrate 112 may be directly connected without providing the n-type pad electrode 142.

  Thus, by forming the relay terminal 12 spaced apart from the solar cell body, a load is applied to the solar cell body when the interconnector 180 connects the thin film compound solar cells 100 with interconnectors. Can be suppressed. As a result, the occurrence of damage such as cracks or cracks in the solar cell body can be suppressed.

  Moreover, by providing the relay terminal 12, the mechanical strength of the thin film compound solar cell 100 with an interconnector can be increased, and the reliability of the solar cell and the solar cell array can be improved. Therefore, it is preferable that a plurality of relay terminals are provided in one solar battery cell.

  An interconnector 180 is connected to the n-type pad electrode 140 of the solar cell body. The interconnector 180 is a metal piece made of silver having a purity of 99% or more and having a thickness of about 20 μm. As shown in FIG. 2, the interconnector 180 has a curved stress relief portion 183 in the middle portion.

  As shown in FIGS. 1 to 3, a rectangular cover glass 160 is bonded with an adhesive 190 so as to cover the solar cell body and the relay terminals 11 and 12. A part 181 of the interconnector 180 is also covered with the cover glass 160. As a result, the solar cell body, the relay terminals 11 and 12, and a part 181 of the interconnector 180 are sealed with the adhesive 190.

  As the adhesive, for example, a highly transparent silicone resin can be used. As the cover glass 160, a plate glass having a thickness of 50 μm or more and 500 μm or less can be used.

  By sealing with the adhesive 190, the connection strength at each connection portion of the metal ribbons 170, 171, and 172 and the connection strength at the part 181 of the interconnector 180 can be increased.

  A thin film compound solar cell string is configured by connecting a plurality of interconnector-attached thin film compound solar cells 100 having the above-described configuration. Specifically, as described above, the interconnector 180 of the other thin film compound solar cell 100 with an interconnector is connected to the back electrode 121 of the relay terminal 11 and the back electrode 122 of the relay terminal 12, thereby thin film compound. A solar cell string is constructed.

  A plurality of thin film compound solar cell strings are connected in series or in parallel to each other to form a thin film compound solar cell array.

  Hereinafter, the manufacturing method of the thin film compound solar cell with an interconnector which concerns on this embodiment is demonstrated.

  FIG. 5 is a flowchart showing a method of manufacturing a thin film compound solar cell with an interconnector according to this embodiment. As shown in FIG. 5, in the manufacturing method of the thin film compound solar cell with an interconnector 100 according to the present embodiment, first, an n-type pad electrode 140 located on one main surface of the solar battery cell and a strip-shaped interface. A part 181 of the connector 180 is connected (S100). Moreover, the solar cell main body and the relay terminals 11 and 12 are connected via metal ribbons 170 to 172. These connections can be made by parallel gap welding, but may be made by other welding methods.

  Next, an adhesive 190 such as a silicone resin is applied to one surface of the cover glass 160 by a screen printing method so as to have a thickness of 40 μm, for example. Thereafter, a cover glass 160 is adhered to one main surface side of the solar cell to which the interconnector 180 is connected so as to cover a part 181 of the interconnector 180 and the solar cell with an adhesive 190 (S110).

  Specifically, a laminate in which the solar cells connected to the interconnector 180 and the relay terminals 11 and 12 and the cover glass 160 are overlapped is placed in a vacuum chamber of a laminating apparatus provided with a balloon on the top. By opening the inside of the balloon to an atmospheric pressure atmosphere, the balloon expands into the vacuum chamber due to the differential pressure and presses the above laminate. In this state, the adhesive 190 is cured by raising the temperature in the vacuum chamber to a temperature of about 100 ° C., for example.

  FIG. 6 is a cross-sectional view showing a state in which the solar cell with an interconnector is placed on a surface plate. 6 to 10, the resin film 110 is not illustrated.

  As shown in FIG. 6, the solar cell with an interconnector is placed on the surface plate 200 so that the cover glass 160 and the upper surface of the surface plate 200 are in contact with each other. At this time, it arrange | positions so that the edge of the photovoltaic cell by which the interconnector 180 protrudes, and the edge of the surface plate 200 may correspond.

  Below the interconnector 180 of the solar cell with interconnector placed on the surface plate 200, a first mold 210 and a third mold 230 that can move up and down are installed. Above the interconnector 180, a second mold 220, a fourth mold 240, and a fifth mold 250 that are movable up and down are installed.

  The 1st metal mold | die 210 has a flat surface at the front-end | tip, and the front-end | tip corner | angular part is chamfered. The second mold 220 is disposed so as to face the first mold 210. The second mold 220 has a flat surface with the same width as that of the first mold 210 at the tip, and the tip corner is chamfered. The third mold 230 is located at a predetermined distance from the first mold 210, has a flat surface at the tip, and has a chamfered tip corner.

  The fourth mold 240 is located above the first mold 210 and the third mold 230 and at a distance slightly larger than the thickness of the interconnector 180 between the second mold 220 and the fourth mold 240. ing. The fourth mold 240 has a curved surface at the tip.

  The fifth mold 250 is disposed adjacent to the fourth mold 240 so as to face the third mold 230. The fifth mold 250 has a flat surface with a width wider than that of the third mold 230 at the tip, and the tip corner is chamfered.

  FIG. 7 is a cross-sectional view showing a state where one end portion on the cover glass side is sandwiched and fixed in an outing portion located outside the edge of the cover glass in the interconnector. As shown in FIG. 7, the first mold 210 is raised and brought into contact with the lower surface of the interconnector 180. The second mold 220 is lowered and brought into contact with the upper surface of the interconnector 180. Thereby, the one end part 182 of the said going-out part is pressed with the 1st metal mold | die 210 and the 2nd metal mold | die 220, and the interconnector 180 is clamped and fixed (S120).

  FIG. 8 is a cross-sectional view showing a state where the interconnector is bent while holding and fixing one end portion of the outside portion of the interconnector. As shown in FIG. 8, in a state where the one end portion 182 of the going-out portion is sandwiched and fixed, the third mold 230 is raised to push up and bend the going-out portion.

  FIG. 9 shows stress relief by bending between one end and the other end in a state where one end of the outside portion of the interconnector is clamped and fixed, and the other end opposite to the one end is movable. It is sectional drawing which shows the state in which the part was formed.

  As shown in FIG. 9, by lowering the fourth mold 240, the stress relief portion 183 is formed by folding the space between the one end portion 182 and the other end portion 184 toward the cover glass 160 (S130). .

  At this time, since the other end portion 184 is movable, the other end portion 184 side of the going-out portion is deformed so as to be wound with the lowering of the fourth mold 240, and the outer shape of the fourth mold 240 A stress relief portion 183 is formed following the above. Therefore, the shape of the stress relief portion 183 can be adjusted by changing the outer shape of the fourth mold 240 and the descending distance of the fourth mold 240.

  On the other hand, since the one end portion 182 is sandwiched and fixed, it is possible to suppress a tensile load from being applied to the connection portion between the part 181 of the interconnector 180 and the solar cell and the solar cell itself. Further, since the other end 184 is movable, it is possible to suppress a tensile load from being applied to the interconnector 180 itself. As a result, when the stress relief part 183 is formed, the connection part between the interconnector 180 and the solar battery cell, the interconnector 180 itself, and the solar battery cell itself can be prevented from being destroyed.

  FIG. 10 is a cross-sectional view showing a state in which the other end portion of the outside portion of the interconnector is bent. As shown in FIG. 10, the fifth mold 250 is lowered and brought into contact with the upper surface of the interconnector 180, and a part of the other end 184 of the interconnector 180 is connected to the third mold 230 and the fifth mold 250. The other end 184 is bent by being sandwiched between them (S140). Accordingly, the other end 184 of the outing portion is bent so as to be horizontal.

  As a result, a step is provided between the part 181 and the other end 184 of the interconnector 180. This level | step difference is for making it not produce a load in the interconnector 180, when comprising a thin film compound solar cell string.

  As described above, by forming the stress relief portion 183 in the interconnector 180, the stress relief portion 183 is not crushed in the manufacturing process, and the thin film with an interconnector stably having the stress relief function of the interconnector 180. The compound solar cell 100 can be manufactured.

  Further, by forming a flat surface at the tips of the first mold 210, the second mold 220, the third mold 230, and the fifth mold 250, the contact area with the interconnector 180 is increased, The stress applied to the interconnector 180 can be reduced.

  Further, since the tip corners of the first mold 210, the second mold 220, the third mold 230, and the fifth mold 250 are chamfered, the interconnector 180 is scratched when the interconnector 180 is deformed. Scratching can be suppressed.

  Similarly, by forming a curved surface at the tip of the fourth mold 240, it is possible to prevent the interconnector 180 from being scratched when the stress relief portion 183 is formed. In particular, it is preferable that the fourth mold 240 has a semicircular curved surface in a side view at the tip.

  The manufacturing method of the thin film compound solar cell string according to the present embodiment is adjacent to the step of disposing the plurality of thin film compound solar cells with interconnectors 100 manufactured by the above manufacturing method of the thin film compound solar cells with interconnectors. The other end portion 184 of the interconnector 180 of the thin film compound solar cell with interconnector 100 of the thin film compound solar cell with interconnector 100 and the back electrodes 121 and 122 of the other thin film compound solar cell with interconnector 100 are connected. Connecting.

  In this embodiment, the thin film compound solar cell string is formed by connecting the interconnector 180 of another thin film compound solar cell with an interconnector 100 to the relay terminals 11 and 12. Although this connection is performed by parallel gap welding, since welding can be performed by bringing the welding electrode into contact with the relay terminals 11 and 12 having mechanical strength, it is possible to prevent the solar cell body from coming into contact with the welding electrode and being damaged.

  The thin film compound solar cell array manufacturing method according to the present embodiment includes a step of arranging a plurality of thin film compound solar cell strings manufactured by the above thin film compound solar cell string manufacturing method, and the plurality of thin film compound solar cell strings. Connecting each other in series or in parallel.

  Thus, by manufacturing the thin film compound solar cell string and the thin film compound solar cell array, the stress relief function of the interconnector 180 is stabilized, and a highly reliable thin film compound solar cell string and thin film compound solar cell array are obtained. be able to.

  Moreover, by automatically controlling the operations of the first mold 210, the second mold 220, the third mold 230, the fourth mold 240, and the fifth mold 250, the thin film compound solar with an interconnector can be easily obtained. Since the battery 100 can be mass-produced, the production tact of the thin film compound solar cell string and the thin film compound solar cell array can be shortened.

  When the thin-film compound solar cell array is used on an artificial satellite, the reliability of the thin-film compound solar cell array can be changed by appropriately changing the outer shape of the fourth mold 240 and the descending distance of the fourth mold 240. Sex can be secured.

  The reason is as follows. In outer space, the plasma state is that electrons and ions are ionized. The surface of an artificial satellite moving at high speed in outer space is charged. The influx of electric charge from the surrounding plasma, the release of photoelectrons from sunlight, and magnetic storms have a complex effect. As a result, a potential difference of about 1 kV is generated on the surface of the satellite, and when the amount of charge increases, discharge occurs. It may happen.

  The portion where the discharge is most likely to occur on the surface of the artificial satellite is a portion where the insulator and the conductor are close to each other and exposed to the space, which is the periphery of the solar cell panel. Since the stress relief portion 183 of the interconnector 180 is close to the surface of the cover glass 160 that is an insulator, the stress relief portion 183 is a portion where electric discharge is likely to occur.

  In the present embodiment, since the stress relief portion 183 of the interconnector 180 can be stably formed in the same shape, a distance that does not cause the above discharge can be secured between the surface of the cover glass 160. As described above, by setting the outer shape of the fourth mold 240 and the descending distance of the fourth mold 240, it is possible to stably ensure reliability when the thin-film compound solar cell array is used in outer space.

  Hereinafter, the manufacturing method of the thin film compound solar cell with an interconnector which concerns on Embodiment 2 of this invention, the manufacturing method of a thin film compound solar cell string, and the manufacturing method of a thin film compound solar cell array are demonstrated. In the present embodiment, since only the shape of the interconnector is different from that in the first embodiment, description of other configurations will not be repeated.

  In this embodiment, the interconnector clamping and fixing step (S120) and the other end bending step (S140) are performed. However, these steps are not necessarily performed. Further, the relay terminals 11 and 12 are not necessarily provided.

(Embodiment 2)
FIG. 11: is a top view which shows the shape of the interconnector used for the manufacturing method of the thin film compound solar cell with an interconnector concerning Embodiment 2 of this invention. FIG. 12 is a plan view showing a configuration of a thin film compound solar cell with an interconnector manufactured by the method of manufacturing a thin film compound solar cell with an interconnector according to the present embodiment.

  As shown in FIGS. 11 and 12, the interconnector 280 used in the method for manufacturing the thin film compound solar cell with interconnector 100a according to the present embodiment has a substantially cross shape in plan view. One end portion 282 has a wider width than the other portion in the outward portion of the interconnector 280.

  In the present embodiment, a part 281 of the interconnector 280 is connected to the n-type pad electrode 140 (S100). Thereafter, a cover glass 160 is adhered to one main surface side of the solar battery cell connected to the interconnector 280 with an adhesive 190 so as to cover a part 281 of the interconnector 280 and the solar battery cell (S110).

  Next, the one end portion 282 of the interconnector 280 is pressed by the first mold 210 and the second mold 220 to clamp and fix the interconnector 180 (S120). In a state where the one end 282 of the outing portion is sandwiched and fixed, the third mold 230 is raised to push up and bend the outing portion.

  By lowering the fourth mold 240, the stress relief portion 283 is formed by bending the space between the one end portion 282 and the other end portion 284 of the interconnector 280 to the cover glass 160 side (S130). A part of the other end 284 of the interconnector 280 is sandwiched between the third mold 230 and the fifth mold 250, and the other end 284 is bent (S140).

  In this way, by forming the stress relief portion 283 in the interconnector 280, the contact area between the first mold 210 and the second mold 220 and the one end 282 of the interconnector 280 is compared with that in the first embodiment. The stress applied to the interconnector 280 can be reduced by increasing the size. As a result, the possibility of damage to the interconnector 280 can be reduced, and the interconnected thin film compound solar cell 100a having the stress relief function of the interconnector 280 can be manufactured.

  It should be thought that embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  11, 12 relay terminal, 100, 100a thin film compound solar cell with interconnector, 110 resin film, 111, 112 n-type semiconductor substrate, 111a n-type region, 111b p-type region, 120 metal thin film, 121, 122 back electrode, 130 Photoelectric conversion layer, 140, 140a, 141, 142 n-type pad electrode, 143 n-type grid electrode, 150a, 150b, 151 p-type pad electrode, 160 cover glass, 170, 171, 172 metal ribbon, 180, 280 interconnector, 181, 281 Partially, 182, 282 One end, 183, 283 Stress relief, 184, 284 The other end, 190 Adhesive, 200 Surface plate, 210 First mold, 220 Second mold, 230 Third mold Mold, 240 fourth mold, 250 fifth mold.

Claims (7)

Connecting the first electrode having the first polarity and the interconnector located on one main surface of the thin-film compound solar cell;
Adhering a cover glass with an adhesive so as to cover a part of the interconnector and the thin film compound solar cell on the one main surface side of the thin film compound solar cell to which the interconnector is connected;
After the step of adhering, at the outing portion located outside the edge of the cover glass of the interconnector, bend between one end portion on the cover glass side and the other end portion on the opposite side of the one end portion. And a step of forming a stress relief part. A method of manufacturing a thin film compound solar cell with an interconnector. Further comprising the step of clamping and fixing the one end portion,
In the step of forming the stress relief portion, the stress relief portion is folded between the one end portion and the other end portion in a state where the one end portion is clamped and fixed and the other end portion is movable. The manufacturing method of the thin film compound solar cell with an interconnector of Claim 1 which forms.   The method of manufacturing a thin film compound solar cell with an interconnector according to claim 1 or 2, wherein, in the step of forming the stress relief portion, a portion between the one end portion and the other end portion is bent in a convex shape toward the cover glass. .   The manufacturing method of the thin film compound solar cell with an interconnector in any one of Claim 1 to 3 further equipped with the process of bending the said other end part after the process of forming the said stress relief part.   5. The interconnector according to claim 1, wherein in the step of connecting the first electrode and the interconnector, the interconnector having the wider end portion than the other portion is connected in the outing portion. Of manufacturing a thin film compound solar cell with an interconnector. 6. A thin film compound solar cell with an interconnector according to claim 1, wherein the second electrode has a second polarity that is a polarity opposite to the first polarity. Arranging a plurality of interconnected thin film compound solar cells;
Of the thin film compound solar cells with interconnector adjacent to each other, the other end of the interconnector of the thin film compound solar cell with interconnector and the second electrode of the other thin film compound solar cell with interconnector The manufacturing method of a thin film compound solar cell string provided with the process to connect. Arranging a plurality of thin film compound solar cell strings manufactured by the method of manufacturing a thin film compound solar cell string according to claim 6;
Connecting the plurality of thin film compound solar cell strings to each other in series or in parallel.

Images