JP2013214286A - Design support method, design support system, and design support server - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a design support method, a design support system, and a design support server which support the design of a thin type structure.SOLUTION: A design support method by a design support system including a design support server for supporting the design of a thin type structure having an electronic function and a design terminal device connected to the design support server, includes: a component presentation process for extracting a list of components to achieve a predetermined electronic function from a component information storage portion by the design support server and presenting the list to the design terminal device; a layout presentation process for acquiring connection information between the components selected from the list in the design terminal device from a connection information storage portion and presenting the layout of the components to the design terminal device; and a process for displaying in preview wiring patterns formed in the thin type structure on the basis of the layout by the design terminal device.

Description

  The present invention relates to a design support method, a design support system, and a design support server that support the design of a thin structure having an electronic function.

  Conventionally, sheet-like thin structures having electrical functions such as multimedia sheets, smart sheets, display displays, touch panels, trading cards, greeting cards, catalogs and books that emit light and sound are known. For example, Patent Document 1 describes a highly reliable circuit board that can be connected to a flexible board. Further, for example, Patent Document 2 describes a paper medium on which a voice message can be reproduced.

  This thin structure has a display element such as a liquid crystal display or electronic paper, a functional sensor sheet, a wireless power supply sheet, a sign graphic such as a sign, a poster that produces sound, an EL or LED light emitting sign. Also included are thin structures related to printed electronics, such as three-dimensional pictures and light signs with a light emitting part.

  Special knowledge is required to design thin structures for printed electronics, and many days are required to produce prototypes. For this reason, design simplification and efficiency improvement have been desired.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a design support method, a design support system, and a design support server that support the design of a thin structure.

  In order to achieve the above object, the present invention employs the following configuration.

  The present invention is a design support method by a design support system including a design support server that supports the design of a thin structure having an electronic function and a design terminal device connected to the design support server, the design support server The component presentation step of extracting a list of components that realize the predetermined electronic function from the component information storage unit and presenting it to the design terminal device, and selecting from the list in the design terminal device from the connection information storage unit A layout presentation step of acquiring connection information between the designated components and presenting the layout of the components to the design terminal device, and a preview display of a wiring pattern formed on the thin structure based on the layout by the design terminal device And a step of causing.

  The present invention is a design support system including a design support server that supports the design of a thin structure having an electronic function, and a design terminal device connected to the design support server. A component presentation unit that extracts a list of components for realizing the electronics function from the component information storage unit and presents the list to the design terminal device, and a connection information storage unit based on the components selected in the design terminal device A layout presentation unit that acquires connection information between the components and presents the layout of the components to the design terminal device, and the design terminal device is a wiring formed in the thin structure based on the layout Display a preview of the pattern.

  The present invention is a design support server that is connected to a design terminal device and supports the design of a thin structure having an electronics function, and a component information storage unit that displays a list of components for realizing the predetermined electronics function Based on the component presentation unit extracted from the design terminal device and presented to the design terminal device, the connection information between the components is acquired from the connection information storage unit based on the component selected in the design terminal device, and the design terminal device A layout presentation unit that presents a layout of the component.

  According to the present invention, it is possible to provide a design support method, a design support system, and a design support server that support the design of a thin structure.

It is a figure explaining the design support system of 1st embodiment. It is a figure which shows an example of the hardware constitutions of the design support server of 1st embodiment. It is a flowchart explaining operation | movement of the design support system of 1st embodiment. It is a figure which shows an example of the image design of the thin device of 1st embodiment. It is a figure which shows the example by which the function of the thin device of 1st embodiment was designed. It is an example of the list of the selected components of 1st embodiment. It is a figure which shows an example of the wiring pattern of the thin device of 1st embodiment. It is a figure explaining the design support system of 2nd embodiment. It is a flowchart explaining operation | movement of the design support system of 2nd embodiment. It is a figure which shows the example which showed the state of connection of components. It is a figure which shows the example which showed the sealing material application part and the overcoat material application part. It is a figure which shows the example of the display by a process preview display part.

(First embodiment)
A first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram illustrating a design support system according to the first embodiment.

  In the design support system 100 of this embodiment, the design terminal device 200 and the design support server 300 are connected via a network N.

  The design support system 100 of this embodiment supports the design of a thin structure (thin device) having an electronic function. Specifically, the thin structure having an electronic function in the present embodiment is, for example, an LED (Light Emitting Diode) shining, a sound from a speaker, recording with a microphone, an RFID (Radio Frequency IDentification) radio wave with an antenna A sheet-like thin device or a flexible thin device having some electrical functions, such as skipping an image, feeding with an antenna, and obtaining and recording a signal with a sensor.

  In the design support system 100 of this embodiment, when the designer designs a thin structure in the design terminal device 200, access to the design support server 300 acquires various types of information.

  FIG. 2 is a diagram illustrating an example of a hardware configuration of the design support server according to the first embodiment.

  The design support server 300 includes an input device 31, a display device 32, a main storage device 33, an arithmetic processing device 34, an interface device 35, a driver device 36, and an auxiliary storage device 37 that are connected to each other via a bus B. .

  The input device 31 is realized by an input device such as a keyboard or a mouse. The display device 32 is, for example, a display. The arithmetic processing unit 34 controls the overall operation of the design support server 300. The interface device 35 includes a modem, a LAN (Local Area Network) card, and the like, and is used to connect to the network N.

  The design support program of the present invention is at least a part of various programs that control the design support server 300. The design support program is provided, for example, by distributing the recording medium 38 or downloading from the network. The recording medium 38 on which the design support program is recorded is a recording medium that records information optically, electrically, or magnetically, such as a CD-ROM (Compact Disc Read Only Memory), a flexible disk, a magneto-optical disk, or the like. Various types of recording media such as a read only memory and a semiconductor memory that electrically records information such as a flash memory can be used.

  When the recording medium 38 on which the design support program is recorded is set in the driver device 36, the design support program is installed from the recording medium 38 into the auxiliary storage device 37 via the driver device 36. The design support program downloaded from the network is installed in the auxiliary storage device 37 via the interface device 35.

  The auxiliary storage device 37 stores the installed design support program and also stores necessary files, data, and the like. The main storage device 33 reads and stores the design support program from the auxiliary storage device 37 when the design support server 300 is activated. The arithmetic processing unit 34 implements various processes as described later according to the design support program stored in the main storage device 33.

  Further, the design terminal device 200 of the present embodiment has the same hardware configuration as the design support server 300, and thus description thereof is omitted.

  Next, returning to FIG. 1, the functional configuration of each device constituting the design support system 100 of the present embodiment will be described.

  The design terminal device 200 of this embodiment includes an image design design unit 210, a function design unit 220, a component selection unit 230, a layout design unit 240, and a preview display unit 250.

  The image design design unit 210 according to the present embodiment designs an image design such as a picture, photo, or character of a thin device. Specifically, the image design design unit 210 may make an image acquisition request to the design support server 300 and acquire image data of a partial image forming a design from the design support server 300. When the image data acquired from the design support server 300 is combined by a designer or the like, the image design design unit 210 of the present embodiment may use the combined image data as image data of an image to be formed on a thin device.

  The image design design unit 210 according to the present embodiment may design an image design using, for example, image data stored in the design terminal device 200 or image data directly input to the design terminal device 200. Specifically, for example, image data drawn by the design terminal device 200, image data of a photograph taken into the design terminal device 200, or the like can be used.

  The image design of the present embodiment is preferably a conspicuous design for magazine advertisements or posters, for example, and it is preferable to consider an easy-to-understand layout and size and color of easy-to-read characters for road signs and information signs. In some cases, greeting cards are designed with images associated with seasonal events, children and family photos, and so on.

  The function design unit 220 designs a function provided for the thin device from various electronic functions. For example, the function design unit 220 sends a function list acquisition request to the design support server 300, and sets the function selected by the designer as the function of the thin device.

  The component selection unit 230 according to the present embodiment makes a request for acquiring a component candidate list to the design support server 300 based on the design result of the image design and the design result of the function. Then, for example, a part instructed by a designer's operation is selected from the part list acquired from the design support server 300, and a list of selected parts is created. The list may be provided by the design support server 300.

  The layout design unit 240 transmits a list of selected parts to the design support server 300 and acquires connection information of the selected parts from the design support server 300. Then, the layout design unit 240 lays out components according to the acquired wiring information. The connection information in the present embodiment may be a net list acquired by the design support server 300. For example, when the connection information is changed by the input device of the design terminal device 200 or the like, the layout design unit 240 performs component layout based on the changed connection information.

  The preview display unit 250 displays a preview image of the thin device in which the parts are laid out by the layout design unit 240 on the display or the like of the design terminal device 200. In addition, the preview display unit 250 according to the present embodiment may preview the image after the image design is designed by the image design design unit 210 or after the function is designed by the function design unit 220.

  Next, the design support server 300 of this embodiment will be described. The design support server 300 of this embodiment includes an image library 310, a function library 311, a component library 312, a wiring library 313, a design data storage unit 314, an image presentation unit 320, a function presentation unit 330, a component presentation unit 340, and a layout presentation unit. 350, a design data storage unit 360, and a design data reading unit 370.

  The image library 310 of the present embodiment is a storage unit that stores image data groups of images used for image design. The function library 311 is a storage unit in which function groups used for function design are stored. The component library 312 is a storage unit that stores component information. The component information is, for example, the component type, model number, and the like. The wiring library 313 is a storage unit that stores connection information corresponding to the component information stored in the component library 312. The design data storage unit 314 stores data designed by the design support system 100.

  Upon receiving an image data acquisition request from the design terminal device 200, the image presentation unit 320 searches the image library 310 and presents the image data to the design terminal device 200. Specifically, the image presentation unit 320 may display image data candidates extracted from the image library 310 on the display or the like of the design terminal device 200. For example, when the image design design unit 210 of the design terminal device 200 requests acquisition of star mark image data, the image presentation unit 320 of the present embodiment acquires the corresponding image data from the image library 310 and the design terminal. You may make it display on the display of the apparatus 200. FIG.

  Upon receiving a function list acquisition request from the design terminal device 200, the function presentation unit 330 may create a function list with reference to the function library 311 and display the function list on the display of the design terminal device 200.

  Upon receiving a parts list acquisition request from the design terminal device 200, the part presentation unit 340 searches the part library 312 and creates a part list. Specifically, for example, in the component library 312 of the present embodiment, a function and component information of a component that realizes the function may be stored in association with each other. For example, the component presentation unit 340 may extract component information corresponding to the function selected in the design terminal device 200 and create a component list. In addition, the component presenting unit 340 according to the present embodiment may create a list of selected components when some components are selected from the component list by the component selecting unit 230.

  When the component information is selected, the layout presentation unit 350 performs wiring layout based on connection information between components corresponding to the selected component information with reference to the wiring library 313, and displays the layout on the design terminal device 200. .

  The design data storage unit 360 stores part information and connection information indicating the layout of the part in the design data storage unit 314 as design data. The design data reading unit 370 reads design data from the design data storage unit 314.

  The operation of the design support system 100 of this embodiment will be described below with reference to FIG. FIG. 3 is a flowchart for explaining the operation of the design support system of the first embodiment.

  In the design support system 100 of the present embodiment, when the design support server 300 receives an image data acquisition request from the image design design unit 210 of the design terminal device 200, the image presentation unit 320 searches the image library 310 (step S301). ). The image presentation unit 320 presents the search result image data to the design terminal device 200.

  The design terminal device 200 displays the presented image data on a display or the like, and designs an image design in the image design design unit 210 (step S302). The image design design unit 210 of the present embodiment may design an image design by combining image data displayed on a display, for example, according to a designer's instruction. When the image design is designed, the image data and the position information of the image data in the thin device may be transmitted to the design support server 300.

  FIG. 4 is a diagram illustrating an example of an image design of the thin device according to the first embodiment. In FIG. 4, a star mark is designed on the thin device 40.

  Subsequently, in the design support system 100, when the function design unit 220 of the design terminal device 200 receives a function list acquisition request, the design support server 300 searches the function library 311 using the function presentation unit 330, and searches for the searched function. A list is presented to the design terminal device 200 (step S303). The list of functions may be displayed on the display of the design terminal device 200. In the present embodiment, for example, the function library 311 may store image data and functions corresponding to the image data in association with each other. In addition, the function presentation unit 330 according to the present embodiment may search the function library 311 for a function corresponding to the image data used for the image design and present it to the design terminal device 200.

  The design terminal device 200 displays a list of presented functions on a display or the like, and the function design unit 220 designs the function of the thin device (step S304). The function design unit 220 of the present embodiment may be a function that provides a thin device with a function selected from a function list displayed on a display in accordance with an instruction from a designer, for example.

  The function of the thin device of this embodiment, for example, the function of emitting LED or organic EL (electroluminescence), the function of emitting sound from a speaker, the function of inputting a signal from a sensor and logging, or the antenna like an RFID Function for performing wireless communication. The function design unit 220 extracts a desired function from these functions. FIG. 5 is a diagram illustrating an example in which the function of the thin device of the first embodiment is designed. In FIG. 5, in the thin device 40, the function of shining the area where the star mark image data is arranged is selected, and this function is realized by the LED.

  Subsequently, in the design support system 100, when the component selection unit 230 of the design terminal device 200 receives the acquisition request for the component list, the design support server 300 searches the component library 312 with the component presentation unit 340 (step S305). . Then, the component presentation unit 340 presents the list of retrieved components to the design terminal device 200 (step S306). In the present embodiment, the component library 312 stores functions and component information of components that realize the functions, and the component presenting unit 340 presents a list of components that realize the selected functions to the design terminal device 200. To do.

  There are a wide variety of components used in thin devices. For example, in LED, since there are many points which should consider the light emission color, power consumption, a tip shape, a terminal pitch space | interval, etc., it requires a big effort for a human to design from the beginning. Therefore, in the present embodiment, for example, the component presentation unit 340 may extract a candidate for a component that realizes a function from the component library 312 and present it to the design terminal device 200 as a list of components that realize the selected function.

  In the design terminal device 200, the component selection unit 230 selects a component to be used from the presented component list, and creates a list of the selected component (step S307). The component selection unit 230 according to the present embodiment may select a component selected by the designer from, for example, a list of presented components. FIG. 6 is an example of a list of selected parts in the first embodiment.

  Subsequently, in the design support system 100, when the design support server 300 acquires the list of selected parts, the layout presentation unit 350 searches the wiring library 313 (step S308). The layout presentation unit 350 presents the component connection information acquired from the wiring library 313 to the design terminal device 200 (step S309).

  The layout design unit 240 designs a wiring layout of components according to the presented connection information (step S310). Subsequently, the design terminal apparatus 200 causes the preview display unit 250 to display a wiring pattern formed based on the designed wiring layout on the display (step S311). FIG. 7 is a diagram illustrating an example of a wiring pattern of the thin device according to the first embodiment. FIG. 7 shows a wiring pattern for mounting the LED.

  As described above, in the present embodiment, for example, a component that realizes a function may be selected from the components presented from the design support server 300, and is also presented from the design support server 300 when designing a wiring layout. This may be done based on the connection information.

  In the present embodiment, the image of the thin device can be confirmed in the preview in the image design process, the function design process, and the like.

  Therefore, according to this embodiment, the design of a thin device can be facilitated and the design efficiency can be improved.

  In the present embodiment, the wiring layout designed by the layout design unit 240 may be stored in the design data storage unit 314 by the design data storage unit 360 of the design support server 300.

  Further, in the present embodiment, when designing a thin device, the design support server 300 can read design data similar in design from the design data storage unit 314 by the design data reading unit 370 and use the read design data. .

  By the way, since the thin device of this embodiment is thin, many thin devices can be loaded in one box, and the cost during transportation can be reduced. The thin device of this embodiment can be applied to educational materials, toys, sensor sheets, greeting cards, trading cards, medical examination sheets, multimedia sheets, display devices, touch input devices, and the like.

  In addition, in the formation of the wiring in the thin device of the present embodiment, in addition to a method using a conventional photolithography process, a method of printing using so-called printed electronics, for example, a plate such as screen printing or flexographic printing, inkjet, You may produce by the printing method which does not use plates, such as an electrostatic suction type inkjet and a dispenser. If an application technique such as ink jet, electrostatic suction ink jet, or dispenser is used, the immediacy of production becomes high and on-demand production becomes possible. Moreover, according to this embodiment, since the design efficiency of a thin device can be improved, delivery time can be shortened. In addition, by reusing design data, it becomes possible to handle variable-variety multi-product production.

  In addition, in the present embodiment, in addition to the method using a plate such as gravure printing or offset printing, the image is formed by a method that does not use a plate such as an ink jet, a dispenser, or an electrophotographic method. Form. On-demand production is possible using methods such as inkjet, dispenser, and electrophotographic methods.

  In addition, the thin device of the present embodiment may be obtained by bonding, for example, a sheet on which an image is formed and a sheet on which components are mounted and wiring is formed.

  Although the design support system 100 of the present embodiment has been described as designing a thin device having an image and a function corresponding to the image, the present invention is not limited to this. For example, the thin device may have only an image or a predetermined function.

  In the present embodiment, the design terminal apparatus 200 may have only the preview function, the part selection function, and the layout change function, and all other processing may be performed on the design support server 300 side. For example, when a part is selected by the design support server 300 and the design terminal apparatus 200, a list of the selected parts may be created, and the list may be displayed on the design terminal apparatus 200 as a preview. Further, for example, the design support server 300 may design a wiring layout based on the connection information, and display the designed wiring layout on the design terminal device 200 as a preview.

(Second embodiment)
A second embodiment of the present invention will be described below with reference to the drawings. The second embodiment of the present invention is different from the first embodiment in that the design support server has a library in which information related to component mounting is stored. Therefore, in the following description of the second embodiment of the present invention, the same reference numerals as those used in the description of the first embodiment are given to those having the same functional configuration as the first embodiment, Description is omitted.

  FIG. 8 is a diagram illustrating a design support system according to the second embodiment.

  In the design support system 100A of the present embodiment, the design support server 300A includes a wiring material library 381, a bonding conductive material library 382, and a sealing material library in addition to each library of the design support server 300 of the first embodiment. 383, an overcoat material library 384, and a device generation library 385.

  The wiring material library 381 of this embodiment is a library related to wiring materials such as solvent-based nano silver ink, water-based nano silver ink, nano copper ink, and sublimation type copper foil tape. The bonding conductive material library 382 is a library related to conductive materials such as a conductive adhesive, a conductive paste, a conductive tape, and a metal foil tape that electrically connect the printed wiring and the electrode portion of the component. The sealing material library 383 is a library relating to a sealing material used for preventing a short circuit between components, insulating between wirings when a wiring layer is formed in a multilayer, and preventing contact between components and oxygen in the atmosphere. The overcoat material library 384 is a library related to overcoat materials in order to prevent component destruction and short circuit due to physical contact of the surface layer portion, and contact with oxygen in the atmosphere.

  The device generation library 385 is a library related to device generation such as resistance material ink, dielectric material ink, transistor material ink, and insulating material for directly creating various devices such as resistors, capacitors, coils, transistors, and switches.

  In each library of the present embodiment described above, for example, the cost for each material, the time when a thin device is manufactured using a certain material, the manufacturing process of the thin device when a certain material is used, the durability time, etc. Is preferably stored for each material.

  In this embodiment, by having each library mentioned above, the information regarding mounting of components can be obtained, and a designer can support more accurately when designing an actual product.

  In the design support system 100A of this embodiment, the design terminal device 200A includes a connection material selection unit 260, a sealing material selection unit 270, and a process preview display unit in addition to the units included in the design terminal device 200 of the first embodiment. 280.

  The connection material selection unit 260 according to the present embodiment makes a request for obtaining a list of the wiring material library 381 and the conductive material for bonding library 382 with reference to the design support server 300A, for example, and electrically connects the electrode part of the wiring component. Present the connection location. Then, the connection material selection unit 260 allows the designer to select a material to be used for connection from the list of the wiring material library 381 and the bonding conductive material library 382.

  The sealing material selection unit 270 according to the present embodiment refers to the design support server 300A, for example, and requests acquisition of a list of the sealing material library 383 and the overcoat material library 384, and seals the location selected by the designer. And where to overcoat. Then, the sealing material selection unit 270 causes the designer to select a material related to sealing or overcoat from the list of the sealing material library 383 and the overcoat material library 384.

  The process preview display unit 280 displays a preview of information including the print time, cost, and durability time when designing a thin device.

  FIG. 9 is a flowchart for explaining the operation of the design support system of the second embodiment.

  The processing from step S901 to step S911 in FIG. 9 is the same as the processing from step S301 to step S311 in FIG.

  In the design support system 100A of this embodiment, when the wiring pattern is displayed on the display, the connection material selection unit 260 refers to the wiring material library 381 and the conductive material library 382 for bonding, for example, the printed lower wiring, A place where a conductive adhesive, a conductive paste, a tape, or the like for electrically connecting the electrodes of components such as LEDs and switches is applied is presented (step S912).

  Further, the connection material selection unit 260 may present the intersections with, for example, black circles to indicate that the wirings intersect with each other, for example, to indicate that they are electrically connected to each other. The connection material selection unit 260 may present the three-dimensional wiring by, for example, diagonal lines so that the wiring intersects depending on the wiring layout but is not electrically connected.

  FIG. 10 is a diagram illustrating an example in which a connection state of components is presented. In FIG. 10, a connection point 101 indicates a connection point between the LED and the wiring pattern, and a connection point 102 indicates a connection point between the wiring patterns. A region 103 indicates a three-dimensional tolerance wiring region where wirings intersect but are not electrically connected.

  In the present embodiment, the connection points 101 and 102 and the region 103 are presented in different displays, for example, the connection point 101 is a point to which a conductive adhesive, conductive paste, tape, or the like is added. You can clearly indicate that the connection method is different. Moreover, in the example of FIG. 10, the difference in the material used for connection with wiring of components can be specified.

  Returning to FIG. 9, the sealing material selection unit 270 of this embodiment requests acquisition of a list of the sealing material library 383 and the overcoat material library 384, and seals or overcoats the location selected by the designer. The place to perform is presented, and the designer is made to select the material related to sealing and overcoat (step S913).

  FIG. 11 is a diagram showing an example in which a sealing material application part and an overcoat material application part are presented. In FIG. 11, a region 104 indicates a portion that is sealed with a sealing material selected from the sealing material library 383. In the present embodiment, the component in the region 104 is an LED. In general, an LED is often covered with an insulating material. Thus, for example, when the component is an LED, the periphery of the LED other than the light emitting portion is covered with a sealing material. In addition, when a component is components other than LED, you may seal so that a component and its periphery may be covered. In this embodiment, by sealing the periphery of the component and the wiring in this way, it is possible to prevent oxidative deterioration and short-circuiting of the component and the wiring.

  In FIG. 11, a region 105 indicates an overcoat material application portion. In the example of FIG. 11, an overcoat material is applied to the entire thin sheet for protection. In the present embodiment, by applying overcoat in this way, the thin sheet can be protected from damage due to physical contact.

  Returning to FIG. 9, the process preview display unit 280 of the design terminal device 200A displays a preview of the manufacturing process of the thin device (step S914). The process preview display unit 280 of the present embodiment refers to the device generation library 385, for example, and displays information including the manufacturing process on the display.

  Specifically, for example, the process preview display unit 280 displays information including the manufacturing process, printing time, cost, and durability time of the thin device.

  FIG. 12 is a diagram illustrating an example of display by the process preview display unit. In the display shown in FIG. 12, an area 121 where the manufacturing process plan is displayed, an area 122 where the estimated print time is displayed, and an area 123 where the estimated cost is displayed are displayed.

  The process preview display unit 280 of the present embodiment refers to, for example, the device generation library 385 and presents a process necessary for creating a device to be used. Specifically, for example, it is proposed that the device A is generated by a dispenser and a baking apparatus in an ink jet method. Further, for example, it is suggested that the device B is generated by a baking apparatus in the ink jet method.

  In this embodiment, the actual manufacturing process can be previewed from the units used for each device and the parts and materials used for them.

  In addition, the process preview display unit 280 of the present embodiment predicts the time required for printing from, for example, the functions, processes, parts used, materials used, etc. of a thin device, and the durability of the device comes from the durability in the preview screen of the manufacturing process. The time may be displayed. Specifically, for example, the driving time predicted from the battery built in the device, or the durability time of the device predicted from the durability of the incorporated sensor, wiring, or electronic circuit itself may be previewed.

  Furthermore, the process preview display unit 280 of this embodiment may predict the cost of the device and display it on the preview screen. The cost in the present embodiment also varies depending on the number of devices and the length of delivery due to the selected process.

  As described above, according to the present embodiment, the design of a thin device can be supported.

  Note that the thin device of the present embodiment may be used as a network sheet in which, for example, a temperature sensor or a pressure sensor is incorporated in each of a plurality of thin devices, and the plurality of thin devices are connected by a network. The network sheet may be used, for example, as a pressure distribution on the floor of a building, a seat on a nursing / infant bed, a pressure distribution on a car seat, a temperature distribution in the apparatus, or an alarm in case of an abnormality.

  The network sheet may be used as a sheet device such as a security sheet, a paper-like keyboard, or a paper-like speaker.

  In addition, the thin device of this embodiment includes a blood glucose level measuring instrument, a urine sugar meter, a breath checker, a pregnancy test medicine, a simple test kit, a wound patch, a transdermal absorption patch, a DNA (Deoxyribonucleic acid) / protein microarray, and a therapeutic electrode. It may be used as a medical device such as (terminal nerve stimulation electrode) or thin braille display. When a thin device is used for medical purposes, it is desirable to discard it after use from the viewpoint of preventing infection.

  Further, in the present embodiment, an optimal member may be selected according to a reagent or therapeutic drug suitable for an individual, and a thin device may be created for each individual. Furthermore, in the present embodiment, electrodes and sheet devices optimized according to shape differences due to individual differences between humans, such as limb myoelectric feedback, face masks, and hand covers, may be supplied as thin devices.

  Furthermore, if this embodiment is used, wiring can be made along the outer peripheral surface of the housing of the apparatus, or the volume of the structure can be reduced by wiring inside the three-dimensional object.

  Further, the thin device designed by the design support system 100A of the present embodiment includes, for example, a solar cell module, organic EL (Electro Luminescence) illumination, RFID (Radio Frequency IDentificatio), thin film battery, power transmission sheet table, flash memory, temperature sensor. It can also be used for pressure sensors, flexible printed circuit boards, membrane switches, three-dimensional wiring on the surface of a casing, internal wiring of three-dimensional solid objects, novelty goods, printing memory, smart maps, and the like.

  As mentioned above, although this invention has been demonstrated based on each embodiment, this invention is not limited to the requirements shown in the said embodiment. With respect to these points, the gist of the present invention can be changed without departing from the scope of the present invention, and can be appropriately determined according to the application form.

DESCRIPTION OF SYMBOLS 100 Design support system 200 Design terminal device 210 Image design design part 220 Function design part 240 Layout design part 250 Preview display part 300 Design support server 320 Image presentation part 330 Function presentation part 340 Component presentation part 350 Layout presentation part

JP 2011-108840 A JP 2007-74612 A

Claims (6)

A design support method by a design support system including a design support server that supports the design of a thin structure having an electronic function, and a design terminal device connected to the design support server,
By the design support server,
A component presentation step of extracting a list of components that realize the predetermined electronics function from the component information storage unit and presenting the list to the design terminal device;
A layout presentation step of acquiring connection information between components selected from the list in the design terminal device from a connection information storage unit, and presenting a layout of the components to the design terminal device;
And a step of displaying a preview of a wiring pattern formed on the thin structure based on the layout by the design terminal device. By the design support server,
An image presentation step of retrieving image data of an image formed on the thin structure from an image data storage unit and presenting the image data to the design terminal device;
The design support method according to claim 1, further comprising: displaying a preview of an image formed on the thin structure based on the image data presented by the design terminal device. By the design support server,
Based on the layout of the component, refer to a wiring information storage unit that stores information on the wiring material, and a conductive material storage unit that stores information on a material that connects the wiring pattern and the component, A first step of displaying a preview of the connection state between the component and the wiring pattern;
A sealing material information storage unit storing information of a sealing material related to the sealing of the thin structure; an overcoat material storage unit storing information of an overcoat material related to the overcoat of the thin structure; The design support method according to claim 1, further comprising: a second step of reviewing and displaying the sealing region and the overcoat region in the thin structure.   Based on the information referred to in the first step and the second step, information including the manufacturing process of the thin structure, the time related to the thin structure, the cost, and the durability time of the component is presented. The design support method of Claim 3 including a process. A design support system including a design support server that supports the design of a thin structure having an electronic function, and a design terminal device connected to the design support server,
The design support server includes:
A component presentation unit that extracts a list of components for realizing the predetermined electronics function from the component information storage unit and presents the list to the design terminal device;
A layout presentation unit that obtains connection information between the components from a connection information storage unit based on the components selected in the design terminal device, and presents a layout of the components to the design terminal device;
The design terminal device
A design support system for displaying a preview of a wiring pattern formed on the thin structure based on the layout. A design support server connected to a design terminal device and supporting the design of a thin structure having an electronic function,
A component presentation unit that extracts a list of components for realizing the predetermined electronics function from the component information storage unit and presents the list to the design terminal device;
A design support server comprising: a layout presentation unit that obtains connection information between the components from a connection information storage unit based on the components selected in the design terminal device and presents the layout of the components to the design terminal device .

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