JP2013211102A - Organic electroluminescent display panel and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transparent organic EL display panel that does not impair transparency even during non-emission.SOLUTION: A transparent substrate 100 has on the upper surface thereof a multilayer wiring structure obtained by repetitively forming a transparent electrode, a transmittance adjustment layer and an interlayer insulating layer. The multilayer wiring structure has on the upper surface thereof a transparent pixel electrode 101 electrically contacted with either one of the transparent electrodes, and a pixel electrode transmittance adjustment layer 102 spaced away from the transparent pixel electrode 101, both of which are partitioned by a partition wall 103. A luminescent medium layer 120 including an organic light-emitting layer 123 is disposed on the upper surface of the transparent pixel electrode 101, and a transparent counter electrode 104 is disposed on the upper surface of the luminescent medium layer 120.

Description

  The present invention relates to an organic electroluminescent display panel and a method for manufacturing the same.

  In an organic electroluminescence element (hereinafter referred to as an organic EL element), an organic light emitting layer made of an organic light emitting material is formed between two opposing electrodes, and when voltage is applied between both electrodes, holes are transferred from the anode and electrons are transferred from the cathode. When injected, a current flows through the organic light emitting layer, and the holes and electrons recombine in the organic light emitting layer to emit light.

  Generally, as a substrate for a display panel, a substrate in which a patterned photosensitive polyimide is formed in a partition shape so as to partition a light emitting pixel is used. At that time, the partition pattern is formed so as to cover the edge portion of the transparent electrode formed as an anode.

  In addition to the organic light emitting layer, a carrier injection layer (also referred to as a carrier transport layer) is formed between the electrodes. The carrier injection layer controls the amount of injected electrons when electrons are injected from the electrode into the organic light emitting layer, or the amount of injected holes when holes are injected from the other electrode into the organic light emitting layer. A layer used to control and refers to a layer inserted between an electrode and an organic light emitting layer. As the electron injection layer, an electron transporting organic substance such as a metal complex of a quinolinol derivative or a relatively small work function such as Ca or Ba such as an alkali metal is used, or a plurality of layers having these functions are stacked. In some cases. As the hole injection layer, TPD (triphenyleneamine derivative: see Patent Document 1), PEDOT: PSS (mixture of polythiophene and polystyrenesulfonic acid: see Patent Document 2), or an inorganic hole transport material (Patent Document 3) See). In any case, it is necessary to obtain a high-performance organic EL display panel by inserting it between the electrode and the light-emitting layer in order to increase the luminous efficiency by controlling the injection amount of electrons and holes. It is.

  Next, as a method for forming a hole injection layer for injecting hole carriers, there are two types of methods, dry film formation and wet film formation. When the wet film forming method is used, a polythiophene derivative dispersed in water is generally used. However, water-based inks are easily affected by the base and are extremely difficult to coat uniformly. In contrast, dry film formation enables simple and uniform coating of the entire surface.

  Similarly, there are two methods for forming the organic light emitting layer: dry film formation and wet film formation. In the case of using a vacuum deposition method, which is a dry film formation that facilitates uniform film formation, it is necessary to perform patterning using a fine pattern mask, which makes it very difficult to use a large substrate or fine patterning.

  Therefore, recently, a method of forming a thin film using a wet film forming method by dissolving a polymer material in a solvent to form a coating liquid has been tried. When a light emitting medium layer including an organic light emitting layer is formed by a wet film forming method using a coating material of a polymer material, the layer structure is a hole injection layer, an interlayer or a hole transport layer, an organic light emitting layer from the anode side. A three-layer structure is generally laminated. At this time, organic light emitting materials having respective emission colors of red (R), green (G), and blue (B) are dissolved or stably dispersed in a solvent to form an organic light emitting layer as a color panel. It can be applied separately using organic light emitting ink (see Patent Documents 4 and 5). By using wet film formation, a mask with a fine pattern is not necessary, and a large substrate or a fine pattern can be easily formed.

  Ideally, it is possible to draw out performance by using different carrier injection layers for each of the RGB light emitting layers, but because the number of steps in the mass production process and high-definition patterning are difficult, The carrier injection layer is generally formed of a solid film common to RGB.

  By the way, the above-mentioned organic EL element has a feature that the thickness of the element is very thin. Taking advantage of this feature, a so-called double-sided light emitting type transparent organic EL element has been studied. A display that uses this is transparent when it is not emitting light, and emits light when an electric current is passed. It is a display panel featuring in-car monitors, transparency such as advertisements, watches, lighting, and televisions. It is attracting attention as. For example, Patent Document 6 introduces a color display device in which transparent EL elements of three RGB colors are superimposed.

JP 2001-93668 A JP 2001-155858 A Japanese Patent No. 2916098 Japanese Patent No. 2851185 JP-A-9-63771 JP2007-157487A Japanese Patent Laid-Open No. 7-240277 JP 2004-79421 A

  As described above, in the transparent organic EL element, the light emission performance is also important, but the non-light-emitting transparency, that is, the transmittance is large, the pattern and the character are not visually recognized, that is, the transmittance is constant. b Required on the entire surface. In particular, metal composite oxidation such as ITO (indium tin composite oxide), indium zinc composite oxide, and zinc aluminum composite oxide, which are TFTs that are switching elements, anodes used in organic EL elements, and lead-out wirings for anodes Objects and the like have a large refractive index and are reflected at the glass or organic layer interface, causing interference and causing a difference in transmittance between the wiring part and the non-wiring part, thereby greatly affecting the transparency.

  In Patent Document 7, the effect of modulating light of a specific wavelength by interference of reflected light at the glass / transparent electrode interface is used. Conversely speaking, this is a region having no transparent electrode, and a transparent electrode. This means that there is a difference in the wavelength dispersion of the transmittance in the region having, and the wiring at the time of non-light emission becomes conspicuous, which means that the transparency is poor.

  Patent Document 8 discloses a method for effectively extracting white light by adjusting the film thickness and refractive index of the anode and the refractive index and film thickness of the organic layer. The difference in the chromatic dispersion of the rate becomes large.

  As described above, any of the conventional techniques has a problem that the anode wiring is conspicuous at the time of non-light emission and the transparency is poor.

  In general, a multilayer wiring structure is used in order to improve the degree of freedom of substrate wiring layout such as anode and anode lead-out wiring, or when another pattern emits light within a closed pattern such as a double circle. However, in this case as well, the conventional technique alone has a problem of poor transparency.

  The present invention has been made in view of the above-described problems of the prior art, and an object thereof is to provide a transparent organic EL display panel that does not impair the transparency even when light is not emitted.

A first invention made to solve the above problems includes a transparent electrode provided on an upper surface of a transparent substrate, a transmittance adjusting layer provided on the upper surface of the transparent substrate and separated from the transparent electrode, and the transparent An interlayer insulating layer covering a part of the transparent electrode and the transmittance adjusting layer on an upper surface of the substrate; a multilayer wiring structure including a repetition of the transparent electrode, the transmittance adjusting layer, and the interlayer insulating layer; and the multilayer wiring structure. A transparent pixel electrode that is in electrical contact with any one of the transparent electrodes, a pixel electrode transmittance adjustment layer that is provided on the upper surface of the multilayer wiring structure and spaced from the transparent pixel electrode, and the multilayer wiring A partition partitioning the transparent pixel electrode on the upper surface of the structure, a light emitting medium layer including at least an organic light emitting layer provided on the upper surface of the transparent pixel electrode, and a transparent counter electrode provided on the upper surface of the light emitting medium layer. Have And wherein the door.
According to a second aspect of the present invention, the transparent electrode provided on the upper surface of the transparent substrate, the transmittance adjusting layer provided on the upper surface of the transparent substrate and separated from the transparent electrode, and the upper surface of the transparent substrate An interlayer insulating layer covering a part of the transparent electrode and the transmittance adjusting layer, a transparent pixel electrode provided on the upper surface of the interlayer insulating layer and in electrical contact with the transparent electrode, and the upper surface of the interlayer insulating layer A pixel electrode transmittance adjusting layer provided at a distance from the transparent pixel electrode; a partition partitioning the transparent pixel electrode on an upper surface of the interlayer insulating layer; and at least an organic light emitting layer provided on the upper surface of the transparent pixel electrode. And a transparent counter electrode provided on the upper surface of the light emitting medium layer.
Further, the third invention is characterized in that the transmittance adjusting layer and the transparent electrode are the same substance, or the refractive index is within ± 10% of the transparent electrode in a visible light region having a wavelength of 380 nm to 780 nm. .
The fourth invention is characterized in that an interval between the transparent electrode and the transmittance adjusting layer is 50 μm or less.
According to a fifth aspect of the present invention, there is provided a step of forming a transparent electrode and a transmittance adjusting layer separated from the transparent electrode on the upper surface of the transparent substrate, and a part of the transparent electrode on the upper surface of the transparent substrate. Forming an interlayer insulating layer that covers the transmittance adjusting layer, forming a multilayer wiring structure including the transparent electrode, the transmittance adjusting layer, and the interlayer insulating layer, and the multilayer wiring structure Forming a transparent pixel electrode in electrical contact with any one of the transparent electrodes and a pixel electrode transmittance adjusting layer separated from the transparent pixel electrode on the upper surface of the multilayer wiring structure; Forming a partition wall for partitioning the transparent pixel electrode, forming a light emitting medium layer including at least an organic light emitting layer on the upper surface of the transparent pixel electrode, and forming a transparent counter electrode on the upper surface of the light emitting medium layer And The features.
According to a sixth aspect of the invention, there is provided a step of forming a transparent electrode and a transmittance adjusting layer separated from the transparent electrode on the upper surface of the transparent substrate, and a part of the transparent electrode on the upper surface of the transparent substrate. Forming an interlayer insulating layer that covers the transmittance adjusting layer, a transparent pixel electrode in electrical contact with the transparent electrode on the upper surface of the interlayer insulating layer, and a pixel electrode separated from the transparent pixel electrode A step of forming a transmittance adjusting layer, a step of forming a partition partitioning the transparent pixel electrode on the upper surface of the interlayer insulating layer, and a light emitting medium layer including at least an organic light emitting layer on the upper surface of the transparent pixel electrode And a step of forming a transparent counter electrode on the upper surface of the light emitting medium layer.

  According to the present invention, it is possible to provide a transparent organic EL display panel that does not impair the transparency even when no light is emitted.

1 is a schematic plan view of a transparent organic EL display panel according to the present invention. It is an enlarged view of the pixel O in FIG. FIG. 3 is a schematic cross-sectional view taken along line A-A ′ in FIG. 2. FIG. 3 is a schematic cross-sectional view taken along line B-B ′ in FIG. 2. 1 is a schematic view of a relief printing apparatus 600 for forming a light emitting medium layer 120. FIG.

  FIG. 1 is a schematic plan view of a transparent organic EL display panel according to the present invention. 2 is an enlarged view of the pixel O in FIG. 1, FIG. 3 is a schematic cross-sectional view of A-A ′ in FIG. 2, and FIG. 4 is a schematic cross-sectional view of B-B ′ in FIG.

  As shown in FIGS. 1 to 4, the transparent organic electroluminescence (EL) display panel according to the present invention includes transparent electrodes (first transparent electrode 111 and second transparent electrode 114) provided on the upper surface of a transparent substrate 100. A transmittance adjusting layer (first transmittance adjusting layer 112, second transmittance adjusting layer 115) provided on the upper surface of the transparent substrate 100 to be separated from the transparent electrode, and a transparent electrode on the upper surface of the transparent substrate 100. An interlayer insulating layer (first interlayer insulating layer 113, second interlayer insulating layer 116) covering a part and the transmittance adjusting layer, a multilayer wiring structure formed by repeating a transparent electrode, a transmittance adjusting layer, and an interlayer insulating layer; A transparent pixel electrode 101 provided on the upper surface of the multilayer wiring structure and in electrical contact with any of the transparent electrodes; a pixel electrode transmittance adjustment layer 102 provided on the upper surface of the multilayer wiring structure and spaced apart from the transparent pixel electrode 101; Multi-layer arrangement A partition wall 103 for partitioning a transparent pixel electrode on the upper surface of the structure, a light emitting medium layer 120 including at least an organic light emitting layer 123 provided on the upper surface of the transparent pixel electrode 101, and a transparent counter electrode 104 provided on the upper surface of the light emitting medium layer 120. And. In addition, it is good also as a structure which provided one set of the transparent electrode, the transmittance | permeability adjustment layer, and the interlayer insulation layer, without providing the multilayer wiring structure which consists of a repetition of a transparent electrode, a transmittance | permeability adjustment layer, and an interlayer insulation layer.

  The organic EL display panel shown in FIGS. 1 to 4 is a passive matrix drive type transparent organic EL display panel. 1 to 4, the multilayer wiring structure 110 formed on the transparent substrate 100 and the transparent pixel electrode 101 as an anode and the transparent counter electrode 104 formed so as to face the same as a cathode are sandwiched between them. Although the layer is the light emitting medium layer 120, the transparent pixel electrode 101 may be a cathode and the transparent counter electrode 104 may be an anode.

  The multilayer wiring structure 110 is basically composed of a transparent electrode on the transparent substrate 100, a transmittance adjusting layer separated from the transparent electrode, and a part of the transparent electrode and an interlayer insulating layer on the transmittance adjusting layer. It consists of a laminated structure. By adopting a multilayer wiring structure, there are other patterns within a certain pattern, which can be lit independently, and the degree of freedom of wiring layout can be increased and simplified even when there are many patterns.

  In the present embodiment, as one form of the multilayer wiring structure, a three-layer wiring structure including the first transparent electrode 111, the second transparent electrode 114, and the transparent pixel electrode 101 is used. It is preferable to select the number of wires.

  In the three-layer wiring structure, on the transparent substrate 100, the first transmittance adjustment layer 112 is separated from the first transparent electrode 111 and in the region other than the first transparent electrode 111 at least substantially on the entire surface of the display region b. And is not in electrical contact with the first transparent electrode 111 and the first interlayer insulating layer 113 formed on the first transparent electrode 111 except for a part thereof and on the first transmittance adjusting layer 112. The second transparent electrode 114 formed on a part of the first interlayer insulating layer 113 and the second transparent electrode 114 are separated from the second transparent electrode 114, and the second transparent electrode 114 is transmitted to a region other than the second transparent electrode 114 over at least substantially the entire display region b. A rate adjusting layer 115 is formed, and a second interlayer insulating layer 116 is formed on the second transmittance adjusting layer 115 on the first interlayer insulating layer 113 except for a part on the second transparent electrode 114. Yes.

  Further, the transparent pixel electrode 101 is formed on the second interlayer insulating layer 116, and the pixel electrode transmittance adjustment layer 102 is formed in a region other than the transparent pixel electrode 101 at least substantially on the entire surface of the display region b at a distance from the transparent pixel electrode 101. ing.

  The first transmittance adjusting layer 112, the second transmittance adjusting layer 115, and the pixel electrode transmittance adjusting layer 102 are formed on the substantially entire surface of the display region b. This means that a region separating each transmittance adjusting layer is excluded.

  The transparent pixel electrode 101 is partitioned for each pixel in order to control lighting, extinction independently for each pixel surrounding T, O, L, E, D, and the character light emission pattern, and further, T, O, L The transparent pixel electrode 101 of E, D is formed on the second transparent electrode 114 via the contact hole 107 and is in electrical contact, and the transparent pixel electrode 101 of the pixel surrounding the character is first contacted via another contact hole 107. It is formed on the transparent electrode 111 and is in electrical contact. The transparent pixel electrode 101 may be formed so as to straddle a plurality of pixels, for example, when a plurality of pixels are lighted simultaneously.

  The partition wall 103 is partitioned according to the light emission pattern of each pixel. The partition wall 103 is formed on the entire surface other than the light emission pattern in the display region b.

  The transparent counter electrode 104 is formed on the pixel region a as a common electrode for each pixel.

  The light emitting medium layer 120 includes an organic light emitting layer 123 contributing to light emission, a hole injection layer 121 as a carrier injection layer for injecting holes, a hole transport layer 122 as a carrier transport layer for transporting holes, and injecting electrons. At least an electron injection layer 124 is included as a carrier injection layer.

  The light emitting medium layer 120 requires a carrier injection layer such as an electron transport layer and a hole blocking layer (interlayer) between the cathode and the light emitting layer, and an electron blocking layer (interlayer) between the anode and the light emitting layer. Depending on the case, it can be appropriately laminated.

  In order to connect to the external drive circuit, the first transparent electrode 111 and the second transparent electrode 114 are also taken out outside the display area b, but a contact portion is provided outside the display area b, for example, a resistor You may relay by an external extraction electrode, such as a low metal.

  Transparent electrodes such as the first transparent electrode 111, the second transparent electrode 114, and the transparent pixel electrode 101, and transmittance adjustments such as the first transmittance adjusting layer 112, the second transmittance adjusting layer 115, and the pixel electrode transmittance adjusting layer 102 The distance between the layers is preferably small. However, in order to emit light independently between adjacent pixels, the anodes must be electrically insulated, and the thickness is preferably not less than the thickness of the anode and not more than 50 μm. More specifically, it is preferable that the distance between the transparent electrode and the transmittance adjusting layer is 3 μm, with almost no wiring interval being visually recognized. In the present invention, by providing the transmittance adjusting layer, the display area b has uniform transmittance over the entire surface, and good transparency can be obtained.

  1 to 4, the hole injection layer 121 is patterned in the pixel region a, but may cover the entire display region b. By covering the entire surface of the display region b, the difference in transmittance between the portion where the pattern is formed in the display region b and the portion where the pattern is not formed is reduced, and the pattern is not visually recognized and high transparency is obtained. 1 to 4, the hole transport layer 122 is patterned only in the pixel region a on the hole injection layer 121, but like the hole injection layer 121, the entire surface of the display region b is formed. You can cover it.

  The organic light emitting layer 123 can be formed without being mixed with the pixel region a due to the shape of the partition wall 103. Further, it may be formed between adjacent pixels to avoid pattern recognition and not to mix colors in order to obtain high transparency. In that case, it is preferable that a light emitting layer pattern space | interval is 50 micrometers or less.

  Furthermore, it can be set as an organic EL display panel by arranging an organic EL element as a pixel (sub pixel). That is, a full-color organic EL display panel can be produced by coating the organic light emitting layer 123 constituting each pixel, for example, with three colors of RGB without mixing colors.

  The electron injection layer 124 is formed in the pixel region a on the organic light emitting layer 123, but may cover the entire display region b, and may have the same pattern as the second transparent electrode 114.

It continues and the formation method and material of each structure part of the organic electroluminescent display panel of this invention are demonstrated.
<Transparent substrate>
Any material can be used as the transparent substrate 100 as long as it has transparency, mechanical strength, and insulating properties and is excellent in dimensional stability. For example, plastic films and sheets such as glass, quartz, polypropylene, polyethersulfone, polycarbonate, cycloolefin polymer, polyarylate, polyamide, polymethyl methacrylate, polyethylene terephthalate, polyethylene naphthalate, etc., or oxidation to these plastic films and sheets Metal oxides such as silicon and aluminum oxide, metal fluorides such as aluminum fluoride and magnesium fluoride, metal nitrides such as silicon nitride and aluminum nitride, metal oxynitrides such as silicon oxynitride, acrylic resins and epoxy resins In addition, a transparent base material in which a polymer resin film such as a silicone resin or a polyester resin is single-layered or laminated can be used.

  In addition, the transparent substrate 100 is subjected to moisture-proofing treatment or hydrophobic treatment by forming an inorganic film or applying a fluororesin in order to avoid the intrusion of moisture into the organic EL display panel. Is preferred. In particular, it is preferable to reduce the moisture content and gas permeability coefficient in the transparent substrate 100 in order to avoid moisture intrusion into the light emitting medium layer 120.

<Transparent electrode>
Transparent electrodes such as the first transparent electrode 111, the second transparent electrode 114, and the transparent pixel electrode 101 can be appropriately formed using common materials and manufacturing methods. That is, a transparent electrode is formed, and patterning is performed as necessary. The transparent pixel electrode 101 is formed after the formation of a multilayer wiring structure including the first transparent electrode 111, the second transparent electrode 114, and the like.

  Transparent electrode materials include metal composite oxides such as ITO (indium tin composite oxide), indium zinc composite oxide, and zinc aluminum composite oxide, as well as metal oxides such as gold and platinum, and fine particles of metal materials. Either a single layer or a laminate of fine particle dispersed films dispersed in a resin or an acrylic resin can be used.

  When the transparent electrode is used as an anode, it is preferable to select a material having a high work function such as ITO. Depending on the material, the transparent electrode can be formed by a resistance heating vapor deposition method, an electron beam vapor deposition method, a reactive vapor deposition method, an ion plating method, a dry film formation method such as a sputtering method, a gravure printing method, or a screen printing method. A wet film forming method such as can be used. As a patterning method of the pixel electrode, an existing patterning method such as a mask vapor deposition method, a photolithography method, a wet etching method, or a dry etching method can be used depending on a material and a film forming method.

<Transmittance adjustment layer>
The transmittance adjusting layers such as the first transmittance adjusting layer 112, the second transmittance adjusting layer 115, and the pixel electrode transmittance adjusting layer 102 are formed after the corresponding transparent electrodes are formed. After the formation of the transmittance adjusting layer, an interlayer insulating layer is formed. The material of the transmittance adjusting layer is preferably selected from the same material as the transparent electrode or a material satisfying a refractive index within ± 10% of the transparent electrode in the visible light region having a wavelength of 350 nm to 780 nm.

  For example, when the first transparent electrode 111 is ITO (indium tin composite oxide) having a refractive index of 2.0 and an extinction coefficient of 0, ITO (indium tin composite oxide), SiN, SiON, Among inorganic compounds such as metal composite oxides such as AlN, indium zinc composite oxide and zinc aluminum composite oxide, a material having a refractive index of 1.8 to 2.2 is preferable.

  As a method of forming the transmittance adjusting layer, depending on the material, dry film forming methods such as resistance heating evaporation method, electron beam evaporation method, reactive evaporation method, ion plating method, sputtering method, gravure printing method, screen A wet film forming method such as a printing method can be used. As a patterning method, an existing patterning method such as a mask vapor deposition method, a photolithography method, a wet etching method, or a dry etching method can be used depending on a material and a film forming method.

  When the first transparent electrode 111 and the anode lead-out substrate wiring are made of the same material as the transmittance adjusting layer, it is possible to easily obtain good transparency. That is, it is preferable to form simultaneously by using an existing patterning method such as a mask vapor deposition method, a photolithography method, a wet etching method, or a dry etching method depending on the material and the film forming method.

  In particular, when there are a plurality of pixel regions a, the first transparent electrode 111 and the transmittance adjustment layer need to be electrically insulated from each other, but in order to obtain a uniform transmittance, The interval between the transmittance adjusting layers is preferably small. In particular, when the distance is 50 μm or less, it can hardly be visually recognized, so that uniform and good transparency can be obtained over the entire surface. More preferably, when the interval is in the range of 3 μm to 10 μm, the gap cannot be visually confirmed.

  The mask vapor deposition method causes pattern blurring depending on the mask size, the film formation method such as sputtering, and the film formation conditions. Therefore, the photolithography method, the wet etching method, and the dry etching method are more suitable for the above high-definition patterning. preferable.

<Partition wall>
The partition wall 103 is formed so as to partition the pixel region a corresponding to the pixel. The partition wall 103 is preferably formed so as to cover the end of the transparent pixel electrode 101. The partition 103 is formed after the transparent pixel electrode 101 and the pixel electrode transmittance adjusting layer 102 are formed. In addition, after the partition wall 103 is formed, the light emitting medium layer 120 including at least the organic light emitting layer 123 is formed.

  The material component of the partition 103 and its composition will be described. The photosensitive composition used for the partition wall 103 of the present invention (hereinafter sometimes simply referred to as “photosensitive composition”) is at least component (A); an ethylenically unsaturated compound; component (B); a photopolymerization initiator. And (C) component; an alkali-soluble binder. Usually, it is preferable to further contain a surfactant or the like, and also contains a solvent.

  As in the conventional method, the partition wall 103 is formed by uniformly forming an inorganic film on a substrate, masking it with a resist, and performing dry etching, or laminating a photosensitive resin on the substrate, and photolithography. There is a method of making a predetermined pattern.

  A preferable height of the partition wall 103 is 0.1 μm to 10 μm, and more preferably about 0.5 μm to 2 μm. If it is too high, the formation and sealing of the second transparent electrode 114 will be hindered, and the transparency will be lowered. If it is too low, the end of the pixel electrode will not be covered, or the adjacent pixels will be mixed when the light emitting medium layer 120 is formed. Because.

<Hole injection layer>
The material of the hole injection layer 121 is arbitrary, but the resistivity is preferably 10 ⁴ Ω · cm or more in order to prevent a short circuit between pixels. Further, by providing a step in the shape of the partition wall 103, the film thickness of the hole injection layer 121 may be changed to suppress a short circuit between pixels. Examples of the material of the hole injection layer 121 include Cu ₂ O, Cr ₂ O ₃ , Mn ₂ O ₃ , FeOx, NiO, CoO, Pr ₂ O ₃ , Ag ₂ O, MoO ₂ , Bi ₂ O ₃ , and ZnO. , TiO ₂ , SnO ₂ , ThO ₂ , V ₂ O ₅ , Nb ₂ O ₅ , Ta ₂ O ₅ , MoO ₃ , WO ₃ , MnO _{2 and} other transition metal oxides and nitrides and sulfides thereof Inorganic compounds, polyaniline derivatives, oligoaniline derivatives, quinonediimine derivatives, polythiophene derivatives, polyvinylcarbazole (PVK) derivatives, poly (3,4-ethylenedioxythiophene) (PEDOT), pyrrole derivatives, aromatic amines, (tri Phenylamine) dimer derivative (TPD), (α-naphthyldiphenylamine) dimer (α-NPD), [ (Triphenylamine) dimer] Triarylamines such as spiro-dimer (Spiro-TAD), 4,4 ′, 4 ″ -tris [3-methylphenyl (phenyl) amino] triphenylamine (m-MTDATA), Starburst amines such as 4,4 ′, 4 ″ -tris [1-naphthyl (phenyl) amino] triphenylamine (1-TNATA) and 5,5′-α-bis- {4- [bis (4 -Methylphenyl) amino] phenyl} -2,2 ′: oligothiophenes such as 5 ′, 2′-α-terthiophene (BMA-3T), aromatic amine-containing polymers, aromatic diamine-containing polymers, fluorene Examples thereof include organic materials such as an aromatic amine polymer, triazole, oxazole, oxadiazole, silole, and boron. Inorganic materials are preferable because many materials are excellent in heat resistance and electrochemical stability. These can be formed as a single layer or a laminated structure of a plurality of layers, or a mixed layer.

  As a method for forming the hole injection layer 121, a dry film forming method such as a resistance heating vapor deposition method, an electron beam vapor deposition method, a reactive vapor deposition method, an ion plating method, a sputtering method, a spin coating method, Existing film forming methods such as a sol-gel method, an ink jet method, a nozzle printing method, a relief printing method, a slit coating method, a wet coating method such as a bar coating method can be used. Various film forming methods can be used.

  The thickness of the hole injection layer 121 is preferably 20 nm or more and 100 nm or less. If the thickness is less than 20 nm, short defects are likely to occur, and if the thickness is more than 100 nm, the resistance is increased and the current is reduced.

<Interlayer>
In the case of forming an interlayer, it is formed after the hole injection layer 121 is formed. In this embodiment mode, the hole transport layer 122 is patterned in a line on the hole injection layer 121 formed on the entire surface, but an interlayer may be formed on the hole injection layer 121 on the entire surface.

  Materials used for the interlayer include polyaniline derivatives, oligoaniline derivatives, quinonediimine derivatives, polythiophene derivatives, polyvinylcarbazole (PVK) derivatives, poly (3,4-ethylenedioxythiophene) (PEDOT), pyrrole derivatives, aromatic amines Triarylamines such as (triphenylamine) dimer derivative (TPD), (α-naphthyldiphenylamine) dimer (α-NPD), [(triphenylamine) dimer] spirodimer (Spiro-TAD), 4,4 ', 4 ″ -tris [3-methylphenyl (phenyl) amino] triphenylamine (m-MTDATA), 4,4 ′, 4 ″ -tris [1-naphthyl (phenyl) amino] triphenylamine (1 -Starburst amino such as -TNATA) And 5,5′-α-bis- {4- [bis (4-methylphenyl) amino] phenyl} -2,2 ′: 5 ′, 2′-α-terthiophene (BMA-3T), etc. Examples include oligothiophenes, aromatic amine-containing polymers, aromatic diamine-containing polymers, fluorene-containing aromatic amine polymers, triazole-based, oxazole-based, oxadiazole-based, silole-based, and boron-based organic materials. .

  As a method for forming an interlayer, depending on the material, a resistance heating vapor deposition method, an electron beam vapor deposition method, a reactive vapor deposition method, an ion plating method, a dry film formation method such as a sputtering method, a spin coating method, a sol-gel method, Existing film forming methods such as an ink jet method, a nozzle printing method, a relief printing method, a slit coating method, and a wet film forming method such as a bar coating method can be used. Can be used.

<Organic light emitting layer>
The organic light emitting layer 123 is formed after the hole transport layer 122 is formed. The organic light emitting layer 123 emits light by recombining holes and electrons. When the display light emitted from the organic light emitting layer 123 is monochromatic, it is formed so as to cover the interlayer. The display light can be suitably used by performing patterning as necessary.

  Examples of the organic light emitting material for forming the organic light emitting layer 123 include, for example, coumarin-based, perylene-based, pyran-based, anthrone-based, porphyrin-based, quinacridone-based, N, N′-dialkyl-substituted quinacridone-based, naphthalimide-based, N, N ′. -Diaryl substituted pyrrolopyrrole, iridium complex and other luminescent dyes dispersed in polymers such as polystyrene, polymethyl methacrylate, polyvinyl carbazole, polyarylene, polyarylene vinylene and polyfluorene Examples thereof include molecular materials, but the present invention is not limited to these.

  These organic light emitting materials are dissolved or stably dispersed in a solvent to form an organic light emitting ink. Examples of the solvent for dissolving or dispersing the organic light emitting material include toluene, xylene, acetone, anisole, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, or a mixed solvent thereof. Among them, aromatic organic solvents such as toluene, xylene, and anisole are preferable from the viewpoint of the solubility of the organic light emitting material. Moreover, surfactant, antioxidant, a viscosity modifier, a ultraviolet absorber, etc. may be added to organic luminescent ink as needed.

  In addition to the polymer materials described above, 9,10-diarylanthracene derivatives, pyrene, coronene, perylene, rubrene, 1,1,4,4-tetraphenylbutadiene, tris (8-quinolato) aluminum complex, tris (4-methyl) -8-quinolate) aluminum complex, bis (8-quinolate) zinc complex, tris (4-methyl-5-trifluoromethyl-8-quinolate) aluminum complex, tris (4-methyl-5-cyano-8-quinolate) Aluminum complex, bis (2-methyl-5-trifluoromethyl-8-quinolinolato) [4- (4-cyanophenyl) phenolate] aluminum complex, bis (2-methyl-5-cyano-8-quinolinolato) [4- (4-Cyanophenyl) phenolate] aluminum complex, tris (8-quino) Norato) scandium complex, bis [8- (para-tosyl) aminoquinoline] zinc complex and cadmium complex, 1,2,3,4-tetraphenylcyclopentadiene, poly-2,5-diheptyloxy-para-phenylene vinylene A low molecular weight light emitting material such as can be used.

  As a method for forming the organic light emitting layer 123, an existing film forming method such as an ink jet printing method, a nozzle print printing method, a relief printing method, a gravure printing method, or a wet film forming method such as a screen printing method is used depending on the material. In the present invention, the present invention is not limited to these. In particular, when the light emitting layer is separately applied to each light emitting color using an organic light emitting ink in which an organic light emitting material is dissolved or stably dispersed in a solvent, a partition wall is used. An ink jet method, a nozzle printing method, and a relief printing method, which can transfer ink between 103 and perform patterning, are preferable.

<Method for Forming Light-Emitting Medium Layer 120>
A case where the light emitting medium layer 120 is formed by a relief printing method is shown below.
FIG. 5 is a schematic diagram of a relief printing apparatus 600 for forming the light emitting medium layer 120. The relief printing apparatus 600 performs pattern printing of an organic light emitting ink made of an organic light emitting material on a substrate to be printed 602 on which the transparent pixel electrode 101, the hole injection layer 121, and the hole transport layer 122 are formed. The relief printing apparatus 600 has an ink tank 603, an ink chamber 604, an anilox roll 605, and a plate cylinder 608 on which a plate 607 provided with a relief plate is mounted. The ink tank 603 contains organic light emitting ink diluted with a solvent, and the organic light emitting ink is fed into the ink chamber 604 from the ink tank. The anilox roll 605 is instructed to rotate in contact with the ink supply unit of the ink chamber 604.

  As the anilox roll 605 rotates, the ink layer 609 of the organic light-emitting ink supplied to the anilox roll surface is formed with a uniform film thickness. The ink in this ink layer is transferred to the convex portion of the plate 607 mounted on the plate cylinder 608 that is driven to rotate in the vicinity of the anilox roll. On the stage 601, a substrate to be printed 602 is installed, ink on the convex portion of the plate 607 is printed on the substrate to be printed 602, and if necessary, an organic light emitting layer 123 is formed on the substrate to be printed through a drying process. It is formed. The other light emitting medium layer 120 can also be formed using the above-mentioned forming method in the same manner when applied in ink.

<Electron injection layer>
The electron injection layer 124 is formed after the organic light emitting layer 123 is formed. Examples of the material used for the electron injection layer 124 include triazole-based, oxazole-based, oxadiazole-based, silole-based, and boron-based low-molecular-weight materials, alkali metal such as lithium fluoride, lithium oxide, and sodium fluoride, and alkaline earth. It is possible to form a film by vacuum deposition using a salt or oxide of a similar metal.

<Transparent counter electrode>
The transparent counter electrode 104 is formed after the electron injection layer 124 (the light emitting medium layer 120) is formed. The material and forming method of the transparent counter electrode 104 are the same as those of the transparent electrode. However, when the transparent counter electrode 104 is a cathode, a substance having a high electron injection efficiency into the organic light emitting layer 123 and a low work function is used in combination. To do. Specifically, a single metal such as Mg, Al, or Yb is used, or a compound such as Li, oxidized Li, or LiF is sandwiched by about 1 nm at the interface in contact with the light emitting medium layer 120, and Al or Cu having high stability and conductivity. May be used in a stacked manner. Alternatively, in order to achieve both electron injection efficiency and stability, one or more metals such as Li, Mg, Ca, Sr, La, Ce, Er, Eu, Sc, Y, and Yb having a low work function and stable Ag, Al An alloy system with a metal element such as Cu or Cu may be used. Specifically, an alloy such as MgAg, AlLi, or CuLi can be used, but any of them needs to be a very thin film of 10 nm or less in order to obtain transparency.

  As an organic EL display panel, it is possible to emit light by sandwiching a light emitting material between electrodes and passing an electric current. However, since an organic light emitting material is easily deteriorated by moisture and oxygen in the atmosphere, it is usually external. A protective layer 105 and a sealing body 106 for blocking are provided.

<Protective layer>
The protective layer 105 may be any material as long as it has a high barrier property such as low permeability to moisture and oxygen in the atmosphere, and has a high transmittance and high transparency, but carbon-containing silicon nitride (SiNxCy) is preferable. In particular, a film in which the carbon amount in the protective layer 105 continuously changes is used. By changing the amount of carbon, a film with a high carbon content is soft and becomes a film with excellent coverage and adhesion, and a film with a low carbon content is a film with high density and high barrier properties. The amount of carbon is preferably such that the ratio of the amount of carbon is less than 1.0 when Si is 1. This is because if the carbon content is 1.0 or more, the film may be colored or become brittle. It is preferable that the layer in which the composition changes is repeated a plurality of times. By repeating a plurality of times, it is possible to cover protrusions that could not be covered by only one layer, and to reduce the cracks generated in the first layer, so that the film has higher barrier properties.

  In a preferred embodiment of the present invention, the amounts of nitrogen and carbon contained in the carbon-containing silicon nitride (SiNxCy) constituting the protective layer 105 are 1.0 ≦ x ≦ 1.4, 0.2 ≦ y ≦ 0. 4 and a layer in a range of 0.4 ≦ x <1.0 and 0.4 <y <1.0 are preferably provided. With this configuration, it is possible to achieve both stress relaxation, adhesion to the substrate surface, and good gas barrier characteristics, and to improve the protection characteristics of the element.

  When the carbon-containing silicon nitride (SiNxCy) is formed, a plasma CVD method is used. In the plasma CVD method, all reactions that generate film forming species are carried out in the gas phase, so that it is not necessary to cause a reaction on the substrate surface, and is the most suitable film forming method for low temperature film forming.

  As an example of a method for continuously changing the amount of carbon in the protective layer 105, there is a method in which a plasma CVD method is performed using an organic silicon compound, one or both of ammonia and nitrogen, and hydrogen as source gases. It is done. For example, the amount of carbon in the film can be reduced by increasing the applied power.

  In addition, a method of performing plasma CVD using silane, one or both of ammonia and nitrogen, hydrogen, and a carbon-containing gas as source gases and changing the concentration of the carbon-containing gas can be used. In this case, the composition can be controlled by changing the flow rate of the carbon-containing gas during film formation. In addition, it is desirable to adjust appropriately according to parameters such as the film forming substrate temperature and gas pressure.

  Examples of the organic silicon compound include trisdimethylaminosilane (TDMAS), hexamethyldisilazane (HMDS), hexamethyldisiloxane (HMDSO), and tetramethyldisilazane (TMDS). Examples of the carbon-containing gas include methane, ethylene, propene and the like.

  The thickness of each layer of the protective layer 105 is not particularly limited, but is preferably about 100 to 500 nm, and the whole should be about 1000 nm. Within this range, defects such as pinholes in the film itself can be compensated and the barrier property against the ingress of oxygen and moisture is greatly improved. Furthermore, the film can be formed in a short time, and light extraction from the organic light emitting layer 123 is not hindered. Further, the carbon content is large on the cathode side, and if the carbon content is decreased as the distance from the cathode increases, further improvement in adhesion and coverage is expected.

<Sealing body>
Next, the sealing body 106 is attached to the protective layer 105 described above. By sticking the sealing body 106, not only the barrier property is further improved, but also resistance to mechanical damage that cannot be obtained only by the protective layer 105 described above can be obtained. For example, a resin layer can be provided over the sealing body 106.

The sealing body 106 needs to be a base material having low moisture and oxygen permeability. Examples of the material include ceramics such as alumina, silicon nitride, and boron nitride, glass such as alkali-free glass and alkali glass, quartz, and moisture resistant film. Examples of moisture-resistant films include films formed by CVD of SiOx on both sides of plastic substrates, films with low permeability and water-absorbing films, or polymer films coated with a water-absorbing agent. The water vapor transmission rate is preferably 10 ⁻⁶ g / m ² / day or less.

  When the sealing body 106 is bonded, the adhesive may be applied uniformly to the sealing body 106 side, or may be applied so as to surround the periphery. Alternatively, a method of thermally transferring the adhesive layer formed in a sheet shape may be used. Adhesive layer materials include photo-curing adhesive resins, thermosetting adhesive resins, two-component curable adhesive resins made of epoxy resins, acrylic resins, silicone resins, and acid-modified products such as polyethylene and polypropylene. A thermoplastic adhesive resin made of, for example, can be used as a single layer or laminated. In particular, it is desirable to use an epoxy thermosetting adhesive resin that is excellent in moisture resistance and water resistance and has little shrinkage upon curing. Also, in order to remove moisture contained in the adhesive layer to the extent that it does not interfere with the light transmission of the adhesive layer, a desiccant such as barium oxide or calcium oxide is mixed in, or a few percent to control the thickness of the adhesive layer. Inorganic fillers may be mixed.

  The thus-sealed sealing body 106 with an adhesive is bonded to each other and cured. Although this series of protective layer 105 formation processes is desirably performed in a nitrogen atmosphere, there is no significant effect even in the atmosphere for a short period of time after the protective layer 105 is formed.

  As an example of the material of the resin layer on the sealing body 106, a photo-curing adhesive resin, a thermosetting adhesive resin, a two-component curable adhesive resin made of an epoxy resin, an acrylic resin, a silicone resin, or the like, Acrylic resins such as ethylene ethyl acrylate (EEA) polymer, vinyl resins such as ethylene vinyl acetate (EVA), thermoplastic resins such as polyamide and synthetic rubber, and thermoplastic adhesive resins such as acid-modified products of polyethylene and polypropylene Can be mentioned.

  As an example of a method for forming a resin layer on the sealing body 106, a solvent solution method, an extrusion lamination method, a melting / hot melt method, a calendar method, a nozzle coating method, a screen printing method, a vacuum laminating method, a hot roll laminating method And so on. A material having a hygroscopic property or an oxygen absorbing property may be contained as necessary. Although the thickness of the resin layer formed on the sealing body 106 is arbitrarily determined by the size and shape of the organic EL display panel to be sealed, it is preferably about 5 to 500 μm. In addition, although formed as a resin layer on a sealing material here, it can also form directly in an organic EL display panel side.

[Example 1]
Examples of the present invention will be described below.
As the transparent substrate 100, non-alkali glass OA-10 manufactured by Nippon Electric Glass Co., Ltd. was prepared. The size of the substrate is 200 mm × 200 mm, in which 5 inches diagonal is arranged, and a display display unit is arranged in the center.

  This substrate is installed in a sputtering film forming apparatus in which ITO (indium tin oxide) is installed, and is formed over the entire surface so as to have a thickness of 50 nm.

  Next, after a TFR790PL positive resist made by Nippon Ohka Co., Ltd. is formed on the entire surface of the substrate with a spin coater to a thickness of 2 μm, the first transparent electrode 111 and the first transmittance adjusting layer 112 are left by photolithography, and a ferric chloride aqueous solution is formed. The first transparent electrode 111 and the first transmittance adjusting layer 112 were formed by wet etching.

  Next, a silicon nitride film was formed by plasma CVD using monosilane, nitrogen gas, and hydrogen gas as source gases. Specifically, after the device was transferred under nitrogen, it was transferred to a plasma CVD apparatus, the vacuum chamber was depressurized to 10 ^ -2 Pa or less, silane, nitrogen and hydrogen were introduced as source gases, and high frequency (13 Plasma was generated at .56 MHz). The film thickness was 300 nm and formed on the entire surface. The first interlayer insulating layer 113 was formed by patterning it using a photolithography method and a dry etching method.

  The film formation and patterning were repeated to form the second transparent electrode 114, the second transmittance adjusting layer 115, and the second interlayer insulating layer 116.

  Next, after forming 1 μm in thickness on the entire surface of the substrate with an acrylic transparent positive resist spin coater manufactured by Nippon Zeon Co., Ltd., a partition wall 103 was formed in which a light emission pattern was partitioned by photolithography.

  Thereafter, using an ink in which a polyfluorene derivative, which is a hole injection material, is dissolved in anisole so as to have a concentration of 1.0%, this substrate is set in a printing machine and directly above a pixel portion sandwiched between partition walls 103. In accordance with the line pattern, printing was performed by a relief printing method. At this time, an anilox roll of 300 lines / inch and a photosensitive resin plate were used. The film thickness of the hole injection layer 121 after printing and drying was 40 nm.

  After that, this substrate was set in a printing machine using an ink in which polyvinylcarbazole derivative as an interlayer material was dissolved in toluene so as to have a concentration of 0.5%, and the substrate was directly above the pixel electrode sandwiched between insulating layers. Printing was performed by letterpress printing according to the line pattern. At this time, an anilox roll of 300 lines / inch and a photosensitive resin plate were used. The film thickness of the interlayer after printing and drying was 20 nm.

  Next, using organic light-emitting ink in which polyphenylene vinylene derivative, which is an organic light-emitting material, is dissolved in toluene to a concentration of 1%, this substrate is set in a printing machine and directly above the pixel electrode sandwiched between insulating layers. The organic light emitting layer 123 was printed by a relief printing method in accordance with the line pattern. At this time, an anilox roll of 150 lines / inch and a photosensitive resin plate corresponding to the pixel pitch were used. The thickness of the organic light emitting layer 123 after printing and drying was 80 nm. This process was repeated three times in total to form an organic light emitting layer 123 corresponding to the emission colors of R (red), Y (yellow), G (green), B (blue), and W (white) in each pixel.

  Thereafter, a 4 nm thick Ba film was formed as an electron injection layer 124 using a vacuum deposition method and a shadow mask so as to cover the entire display portion.

  Thereafter, ITO was patterned to a thickness of 100 nm using a metal mask by facing target sputtering (FTS) as a cathode.

Thereafter, SiNxCy was formed as the protective layer 105. As the protective layer 105, a carbon-containing silicon nitride film having a composition gradient was formed by plasma CVD using methane, monosilane, nitrogen gas, and hydrogen gas as source gases. Specifically, after the device was transferred under nitrogen, it was transferred to a plasma CVD apparatus, the vacuum chamber was decompressed to 10 ⁻² Pa or less, silane, nitrogen, methane, hydrogen were introduced as source gases, and high frequency (13 Plasma was generated at .56 MHz). As the deposition time changed, the flow rate of methane gas was reduced and the composition was inclined. Once the flow rate of methane gas was reduced to zero, the initial amount was introduced again to form a layer structure. The film thickness was 300 nm per layer, and this was repeated three times, so that the thickness of the protective layer 105 was 900 nm.

  Thereafter, a sealing glass substrate in which a thermosetting resin was applied to the entire surface by a die coater as a sealing body 106 on the protective film was bonded to the element substrate using a hot roll laminator while applying a temperature of 100 ° C. . After pasting, it was further cured at 100 ° C. for 1 hour.

  The organic EL display panel thus obtained had good light emission characteristics and was driven normally.

  In addition, as a result of measuring each point in the non-light-emitting display area b with a microscopic transmittance measuring apparatus manufactured by Otsuka Electronics Co., Ltd. The transmittance on the layer was 78%, a uniform transmittance was obtained on the entire surface, and the transparency was good.

[Comparative Example 1]
In Example 1, an organic EL display panel was produced in the same manner as in Example 1 except that the transmittance adjusting layer was not formed.

  The organic EL display panel thus obtained had good light emission characteristics and was driven normally.

  However, as a result of measuring the transmittance when not emitting light in the same manner as in Example 1, the transmittance at 550 nm in the pixel region a is 78% and the transmittance outside the pixel is 85%, and the pattern of the anode can be recognized. It was uneven and the transparency was poor.

  The results are summarized in Table 1.

  As described above, according to the present invention, it is possible to obtain a transparent organic EL display panel that does not impair transparency even when light is not emitted.

100: Transparent substrate 101: Transparent pixel electrode (anode)
102: Pixel electrode transmittance adjustment layer 103: Partition 104: Transparent counter electrode (cathode)
105: protective layer 106: sealing body 107: contact hole 110: multilayer wiring structure 111: first transparent electrode 112: first transmittance adjusting layer 113: first interlayer insulating layer 114: second transparent electrode 115: second Transmittance adjusting layer 116: second interlayer insulating layer 120: light emitting medium layer 121: hole injection layer 122: hole transport layer 123: organic light emitting layer 124: electron injection layer 600: relief printing apparatus 601: stage 602: printing Substrate 603: Ink tank 604: Ink chamber 605: Anilox roll 606: Doctor 607: Letter plate 608: Plate cylinder 609: Ink layer a: Pixel area b: Display area o: Pixel

Claims (6)

A transparent electrode provided on the upper surface of the transparent substrate, a transmittance adjusting layer provided on the upper surface of the transparent substrate and separated from the transparent electrode, and a part of the transparent electrode and the transmittance adjustment on the upper surface of the transparent substrate. An interlayer insulating layer covering the layer, a multilayer wiring structure formed by repeating the transparent electrode, the transmittance adjusting layer, and the interlayer insulating layer;
A transparent pixel electrode provided on the upper surface of the multilayer wiring structure and in electrical contact with any of the transparent electrodes;
A pixel electrode transmittance adjustment layer provided on the upper surface of the multilayer wiring structure and separated from the transparent pixel electrode;
A partition partitioning the transparent pixel electrode on an upper surface of the multilayer wiring structure;
A light emitting medium layer provided on the upper surface of the transparent pixel electrode and including at least an organic light emitting layer;
A transparent counter electrode provided on the upper surface of the light emitting medium layer;
A transparent organic electroluminescence display panel comprising: A transparent electrode provided on the upper surface of the transparent substrate;
A transmittance adjusting layer provided on the upper surface of the transparent substrate and separated from the transparent electrode;
An interlayer insulating layer covering a part of the transparent electrode and the transmittance adjusting layer on the upper surface of the transparent substrate;
A transparent pixel electrode provided on an upper surface of the interlayer insulating layer and in electrical contact with the transparent electrode;
A pixel electrode transmittance adjusting layer provided on the upper surface of the interlayer insulating layer and spaced apart from the transparent pixel electrode;
A partition partitioning the transparent pixel electrode on an upper surface of the interlayer insulating layer;
A light emitting medium layer provided on the upper surface of the transparent pixel electrode and including at least an organic light emitting layer;
A transparent counter electrode provided on the upper surface of the light emitting medium layer;
A transparent organic electroluminescence display panel comprising: The transmittance adjusting layer and the transparent electrode are the same substance, or the refractive index is within ± 10% of the transparent electrode in a visible light region having a wavelength of 380 nm to 780 nm,
The organic electroluminescent display panel according to claim 1 or 2.   4. The organic electroluminescence display panel according to claim 1, wherein an interval between the transparent electrode and the transmittance adjusting layer is 50 μm or less. 5. Forming a transparent electrode and a transmittance adjusting layer separated from the transparent electrode on the upper surface of the transparent substrate;
Forming an interlayer insulating layer covering a part of the transparent electrode and the transmittance adjusting layer on the upper surface of the transparent substrate;
Forming a multilayer wiring structure composed of repetition of the transparent electrode, the transmittance adjusting layer and the interlayer insulating layer;
Forming a transparent pixel electrode in electrical contact with any of the transparent electrodes on the upper surface of the multilayer wiring structure, and a pixel electrode transmittance adjusting layer separated from the transparent pixel electrode;
Forming a partition partitioning the transparent pixel electrode on the upper surface of the multilayer wiring structure;
Forming a light emitting medium layer including at least an organic light emitting layer on an upper surface of the transparent pixel electrode;
Forming a transparent counter electrode on an upper surface of the light emitting medium layer;
The manufacturing method of the transparent organic electroluminescent display panel characterized by comprising. Forming a transparent electrode and a transmittance adjusting layer separated from the transparent electrode on the upper surface of the transparent substrate;
Forming an interlayer insulating layer covering a part of the transparent electrode and the transmittance adjusting layer on the upper surface of the transparent substrate;
Forming a transparent pixel electrode in electrical contact with the transparent electrode on the upper surface of the interlayer insulating layer, and a pixel electrode transmittance adjustment layer separated from the transparent pixel electrode;
Forming a partition partitioning the transparent pixel electrode on the upper surface of the interlayer insulating layer;
Forming a light emitting medium layer including at least an organic light emitting layer on an upper surface of the transparent pixel electrode;
Forming a transparent counter electrode on an upper surface of the light emitting medium layer;
The manufacturing method of the transparent organic electroluminescent display panel characterized by comprising.

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