JP2013211010A5 - - Google Patents
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- JP2013211010A5 JP2013211010A5 JP2013046622A JP2013046622A JP2013211010A5 JP 2013211010 A5 JP2013211010 A5 JP 2013211010A5 JP 2013046622 A JP2013046622 A JP 2013046622A JP 2013046622 A JP2013046622 A JP 2013046622A JP 2013211010 A5 JP2013211010 A5 JP 2013211010A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- surface image
- wafer surface
- site
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005259 measurement Methods 0.000 claims 47
- 238000007689 inspection Methods 0.000 claims 28
- 238000000034 method Methods 0.000 claims 28
- 238000000638 solvent extraction Methods 0.000 claims 28
- 238000001914 filtration Methods 0.000 claims 20
- 238000005192 partition Methods 0.000 claims 16
- 230000007717 exclusion Effects 0.000 claims 8
- 230000000737 periodic effect Effects 0.000 claims 8
- 238000005211 surface analysis Methods 0.000 claims 4
- 230000001131 transforming effect Effects 0.000 claims 4
- 238000004891 communication Methods 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 2
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical group ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 claims 1
- 238000006748 scratching Methods 0.000 claims 1
- 230000002393 scratching effect Effects 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261609487P | 2012-03-12 | 2012-03-12 | |
| US61/609,487 | 2012-03-12 | ||
| US13/779,947 | 2013-02-28 | ||
| US13/779,947 US9177370B2 (en) | 2012-03-12 | 2013-02-28 | Systems and methods of advanced site-based nanotopography for wafer surface metrology |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013211010A JP2013211010A (ja) | 2013-10-10 |
| JP2013211010A5 true JP2013211010A5 (cg-RX-API-DMAC7.html) | 2016-04-21 |
| JP6265608B2 JP6265608B2 (ja) | 2018-01-24 |
Family
ID=48190004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013046622A Active JP6265608B2 (ja) | 2012-03-12 | 2013-03-08 | ウェーハ表面計測のための高度化されたサイトベースのナノトポグラフィシステム及び方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9177370B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2639575B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6265608B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2011253779A1 (en) * | 2011-12-01 | 2013-06-20 | Canon Kabushiki Kaisha | Estimation of shift and small image distortion |
| US8917930B2 (en) * | 2012-05-08 | 2014-12-23 | Hewlett-Packard Development Company, L.P. | Selecting metrics for substrate classification |
| US9355440B1 (en) * | 2012-10-10 | 2016-05-31 | Kla-Tencor Corp. | Detection of selected defects in relatively noisy inspection data |
| DE102014106290A1 (de) * | 2014-05-06 | 2015-11-12 | Fries Research & Technology Gmbh | Verfahren zum Messen der Nanotopographie eines Objekts |
| US9377416B2 (en) | 2014-05-17 | 2016-06-28 | Kla-Tencor Corp. | Wafer edge detection and inspection |
| US10062158B2 (en) | 2015-07-10 | 2018-08-28 | Globalwafers Co., Ltd. | Wafer nanotopography metrology for lithography based on thickness maps |
| JP6489999B2 (ja) | 2015-11-19 | 2019-03-27 | 東芝メモリ株式会社 | 位置合わせ方法およびパターン形成システム |
| NL2017860B1 (en) | 2015-12-07 | 2017-07-27 | Ultratech Inc | Systems and methods of characterizing process-induced wafer shape for process control using cgs interferometry |
| US9767537B1 (en) * | 2016-04-20 | 2017-09-19 | Applied Materials Israel Ltd. | System and method for inspection using programmable filters |
| TWI743176B (zh) | 2016-08-26 | 2021-10-21 | 美商應用材料股份有限公司 | 獲得代表在基板上的層的厚度的測量的方法，及量測系統和電腦程式產品 |
| CN110622287B (zh) * | 2017-05-22 | 2023-11-03 | 科磊股份有限公司 | 用于配方优化及测量的区域分析 |
| TWI677233B (zh) * | 2018-08-02 | 2019-11-11 | 瑞昱半導體股份有限公司 | 決定濾波器係數的方法 |
| CN111832610A (zh) * | 2020-06-01 | 2020-10-27 | 成都飞机工业（集团）有限责任公司 | 一种3d打印组织预测的方法、系统、介质以及终端设备 |
| JP7694469B2 (ja) * | 2021-07-21 | 2025-06-18 | 信越化学工業株式会社 | マスクブランクス用基板及びその製造方法 |
| US20250111494A1 (en) * | 2023-09-28 | 2025-04-03 | Siemens Industry Software Inc. | Contour extraction of images with selection-based auto tuning |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06325181A (ja) * | 1993-05-17 | 1994-11-25 | Mitsubishi Electric Corp | パターン認識方法 |
| TW513772B (en) * | 2000-09-05 | 2002-12-11 | Komatsu Denshi Kinzoku Kk | Apparatus for inspecting wafer surface, method for inspecting wafer surface, apparatus for judging defective wafer, method for judging defective wafer and information treatment apparatus of wafer surface |
| WO2002040970A1 (en) * | 2000-11-15 | 2002-05-23 | Real Time Metrology, Inc. | Optical method and apparatus for inspecting large area planar objects |
| US6873938B1 (en) * | 2003-09-17 | 2005-03-29 | Asml Netherlands B.V. | Adaptive lithographic critical dimension enhancement |
| JP4400331B2 (ja) * | 2004-06-17 | 2010-01-20 | 信越半導体株式会社 | ウエーハの形状評価方法及び管理方法 |
| CN101095036A (zh) * | 2004-11-17 | 2007-12-26 | 数据色彩控股股份公司 | 有集成染料滤波器的三原色比色计 |
| EP2324495A4 (en) * | 2008-08-28 | 2013-06-05 | Kla Tencor Corp | LOCALIZED CHARACTERIZATION OF THE GEOMETRY OF A SUBSTRATE |
-
2013
- 2013-02-28 US US13/779,947 patent/US9177370B2/en active Active
- 2013-03-08 JP JP2013046622A patent/JP6265608B2/ja active Active
- 2013-03-12 EP EP13001240.4A patent/EP2639575B1/en active Active
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